JPH0590776A - Printed board unit - Google Patents

Abstract

PURPOSE:To prevent temperature rise of entire components of a printed board. CONSTITUTION:Printed boards 1A, 1B, 1C are formed of high heat generation units 11A, 11B, 11C, low heat generation units 12A, 12B, 12C and heat insulators 13A, 13B, 13C, and disposed in parallel with a case 21 of a printed board unit 20. Four plates 31, 32, 33 and 34 of a partition wall 30 are fixed to the bottom wall 24 of the case 21, and mounted in a state that the insulators of the boards 1A, 1B, 1C are fixedly interposed between the plates. Heat transfers from the units 11A, 11B, 11C to the units 12A, 12B, 12C are interrupted by the insulators 13A, 13B, 13C and the partition wall 30, and the interrupted heats are discharged directly from the units 11A, 11B, 11C.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed board unit mounted with a printed board on which a large number of electronic parts are mounted, and more particularly to a printed board unit for effectively cooling the heat generated by the high heat-generating parts of the printed board. Regarding

[0002]

2. Description of the Related Art In a control device such as a numerical control device or a robot control device, a printed board on which components are mounted at high density is used. The components that make up this printed board, like resistors and power transistors that consume a lot of power,
Some have high heat generation when used. On the other hand, the printed board is usually mounted on the printed board unit and tested by the control device. The printed board unit is generally used in a state where it is opened to the outside air, but it may be used in a sealed state as a measure against dust and oil.

[0003]

When a printed circuit board having such a high heat generating component is mounted on a printed circuit board unit and used, the heat generated by the high heat generating component is transferred to the components of the entire printed circuit board. This may cause the temperature of the entire component to rise, causing an electrical malfunction or a decrease in reliability.

In particular, in the case of the above-mentioned hermetically sealed printed circuit board unit, the heat generated from the high heat generating component is not released to the outside and is stored inside the unit, so that the component temperature further rises. Therefore, the heat radiation inside the unit is dissipated to the outside by cooling the unit by radiating fins or a fan and by air cooling, or by providing a cooling water passage or the like by water cooling. However, when a heat radiating fin or a fan is used in the unit to cool the printed board by air cooling, the heat of the high heat generating component is transferred to the low heat generating component as the air moves. As a result, the temperature of the low heat-generating component may be further increased.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a printed board unit capable of preventing an increase in temperature of components mounted on the printed board.

[0006]

According to the present invention, in order to solve the above problems, in a printed circuit board unit having one or a plurality of printed circuit boards mounted thereon, a high heat generating part and a low heat generating part which are constituted by high heat generating components are provided. A printed board having a low heat generating part formed of parts and a heat insulating part provided between the high heat generating part and the low heat generating part, and a case in which a plurality of the printed boards are fixed and stored in parallel. And a partition wall that is provided in the case and that connects the heat insulating parts of the printed boards that are accommodated in parallel in the case and that separates the low heat generating part and the high heat generating part of the printed board from each other. A printed board unit is provided.

[0007]

The components of the printed board are divided into a high heat generating component and a low heat generating component, the high heat generating component is mounted in the high heat generating part, and the low heat generating component is mounted in the low heat generating part. A heat insulating part made of a heat insulating material such as a rubber material is provided between the high heat generating part and the low heat generating part. The printed board is fixed and stored in parallel with the case. The case is provided with a partition wall that separates the high heat generation portion and the low heat generation portion of the printed board. For this reason, even if the high heat generating component generates heat in the high heat generating portion, the heat is only slightly transmitted to the low heat generating portion, and it is possible to prevent the temperature rise of the entire components constituting the printed board. Further, the heat generated in the high heat generating portion can be efficiently cooled.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 2 is a diagram showing a configuration of a printed board mounted on the printed board unit of the present invention. The printed board 1
It is composed of a high heat generating part 11, a low heat generating part 12 and a heat insulating part 13. The high heat generating part 11 is composed of a high heat generating component such as a resistor or a power transistor which consumes a large amount of power, and the low heat generating part 12 is composed of a low heat generating component. The heat insulating portion 13 is made of a heat insulating material such as a rubber material, and is provided between the high heat generating portion 11 and the low heat generating portion 12 by covering the printed board 1. Therefore, the heat insulating portion 13 blocks heat flowing from the high heat generating portion 11 to the low heat generating portion 12 on the surface of the printed board 1. In addition, this heat insulation part 1
Since 3 is provided on the surface of the printed board 1, it is not necessary to change the wiring of the printed board 1.

FIG. 1 is a diagram showing a structural example of a printed board unit of the present invention. Printed board unit 20 is case 2
It is composed of one or three printed boards 1A, 1B and 1C and a partition wall 30. Printed board 1A, 1B, 1C is case 2
1 arranged in parallel with each side end 14A, 14B, 14
C is fixed to the groove 23 of the side wall 22 of the case 21. The partition wall 30 includes four plates 31, 32, 33 and 3
4 and is provided between the side walls 25 and 26 of the case 21. Each plate is fixed to the bottom wall 24 of the case 21, and the printed boards 1A, 1B, 1C are interposed between the plates.
The heat insulating parts 13A, 13B and 13C are mounted in a sandwiched state.

The partition walls 30 allow the printed boards 1A, 1
Since the high heat generating parts 11A, 11B, 11C of B and 1C and the low heat generating parts 12A, 12B, 12C are isolated from each other, the high heat generating parts 11A, 11B, 11C to the low heat generating parts 12A, 12C.
Heat transfer due to radiation to B and 12C is cut off. Also,
The surface of the printed board 1A, 1B, 1C is covered with the high heat generating portion 11A,
The heat transferred from 11B, 11C to the low heat generating parts 12A, 12B, 12C is blocked by the heat insulating parts 13A, 13B, 13C. In this example, the high heat generating parts 11A, 11B, 11C
Is provided along the open surface of the case 21, but a cover with a large slit may be attached, and in either case, the heat generated in the high heat generating portions 11A, 11B, 11C is efficient. It is released into the atmosphere. That is, the high heat generating parts 11A, 11B, 11C to the low heat generating parts 12A, 12 due to the heat insulating parts 13A, 13B, 13C and the partition wall 30.
The heat transfer to B and 12C is cut off, and the cut off heat is directly emitted to the outside air from the high heat generating parts 11A, 11B and 11C. Therefore, even if the high heat generating parts 11A, 11B, and 11C generate heat, the heat is cut off, and the temperature rise of the entire components that form the printed board 1 can be prevented.
Therefore, it is possible to prevent the occurrence of an electrical malfunction due to the temperature rise, the deterioration of reliability, and the like. In addition, from the high heat generating parts 11A, 11B, 11C to the printed boards 1A, 1B, 1
Although it is not possible to block only the heat that flows through the inside of C to the low heat generating portions 12A, 12B, and 12C, the amount of heat is not enough to cause a problem.

In the above description, the high heat generating parts 11A, 11
Although B and 11C are configured to be in direct contact with the outside air, if the high heat generating parts 11A, 11B and 11C are molded with, for example, an epoxy resin, it is possible to prevent dust and oil, and the molding material and molding shape. Can be optimized to improve the cooling efficiency. Also, the high heat generating parts 11A, 11
You can also attach a radiating fin to B and 11C,
You can also blow with a fan.

FIG. 3 is a view showing another example of the printed board unit. The printed board unit 40 is of a hermetically sealed type, and is shown with the lid 44 on the upper surface opened in the figure. In the case 41 of the printed board unit 40, three printed boards 10A, 10B and 10C are arranged in parallel.

FIG. 4 is a view showing the arrangement of a printed board mounted on the printed board unit 40. Printed board 10
Is composed of a high heat generating portion 101, a low heat generating portion 102, and a heat insulating portion 103, as in the printed board 1 of FIG. The difference from the printed board 1 is that the high heat generating portion 101 is provided with ventilation air vents 106A, 106B, and 106C for cooling air. The ventilation holes 106A and the like are used for the high heat-generating components 107A,
It is provided in the vicinity of 107B and 107C (in the figure, the back side of the high heat-generating component 107A and the like), and the air passing through the ventilation port 106A and the like takes heat from the high heat-generating component 107A and the like when passing through the high heat-generating component 107A and the like. , Cool efficiently.

Now, returning to FIG. 3, the description will be continued. This printed board 10 mounted on the printed board unit 40
Low heat generating parts 102A, 102B, 1 of A, 10B, 10C
The side ends 104A, 104B, 104C on the 02C side are fixed to the respective groove portions 43 of the outer wall 42 of the case 41, and the side ends 104A on the other high heat generating portions 101A, 101B, 101C,
104B and 104C are high heat generating parts 101A and 101
It is fixed to each groove portion 48 of the side wall 47 of the case 41 provided on the B, 101C side. The side wall 47 and the printed board 10A,
10B, 10C heat insulating parts 103A, 103B, 103
High heat generating parts 101A, 101B, 101C between C and
Partition walls 70 are respectively provided so as to surround the. Further, on the side wall 47, the printed board 10A, 1
Like 0B and 10C, a ventilation air vent 49 is provided for cooling air. The printed boards 10A, 10B, 10C are provided between the side wall 47 and the side wall 50 provided in parallel with the side wall 47.
Is provided with a wall 51 corresponding to the position of
Rooms 52 to 55 are formed between them. Further, an inlet 56 for cooling air is provided at one end of the side wall 50.
Fans 57 for moving the cooling air are provided at the other ends, respectively. A plurality of stages of heat radiation fins 59 are provided on the other outer wall 58 of the case 41. The radiating fins 59 also extend inside the room 60 formed between the side wall 50 and the side wall 58, and absorb heat from the air passing through the room 60 to radiate the heat.

In the printed board unit 40 having the above structure, the cooling air is taken in by the fan 57.
Is introduced into the next room 53 through the room 52 and the ventilation openings 49 and 106A, is similarly introduced into the rooms 54 and 55, and is further returned to the intake opening 56 through the fan 57 and the room 60. .. The cooling air circulates in the above-mentioned path, so that the high heat generating portions 101A, 101
The heat generated in B and 101C is taken away, and the heat is radiated by the radiation fin 59. That is, the high heat generating parts 101A, 10
The heat of 1B and 101C is radiated to the outside through the radiation fin 59. Further, the high heat generating parts 101A, 101B, 101
Since C is surrounded by each partition wall 70, the high heat generating portion 1
The heat of 01A, 101B, and 101C is low heat generation part 102A,
It is not transmitted to the 102B and 102C sides. Therefore, even if the printed board unit 40 is of a hermetically sealed type for the purpose of preventing dust and oil, the printed board 10A,
It is possible to prevent the temperature rise of the entire components forming 10B and 10C.

In the above description, a hole-like ventilation hole is provided in the high heat generating portion of the printed board, but a part of the high heat generating portion is
For example, the upper end may be cut out to serve as a ventilation port. Further, although the above-mentioned example is given as the sealed type, in a place where the environment is not so bad, the intake port 56 may be introduced into the outside air, and the fan may discharge the cooling air to the outside air.

Although a fin type heat exchanger is used as the heat exchanger, another type may be used. Further, in the above description, the printed board is separated into the high heat generating portion and the low heat generating portion, but it is also possible to provide a ventilation port in the vicinity of each high heat generating component without separating them. In that case, for example, a ventilation port is provided on the outer wall of the case, and cooling air is sent by a fan. Even if the components are not separated in this way, it is possible to prevent the temperature rise of the entire components constituting the printed board.

[0018]

As described above, according to the present invention, the printed board is provided with the high heat generating portion, the low heat generating portion and the heat insulating portion, and the high heat generating portion and the low heat generating portion are separated from each other in the printed board unit on which the printed board is mounted. Since the partition wall is provided, the heat transmitted from the high heat generating portion to the low heat generating portion on the surface of the printed board can be shielded from the heat transmitted from the high heat generating portion to the low heat generating portion. Therefore, it is possible to prevent the temperature rise of the entire components that form the printed board. Further, only the high heat generating portion side can be efficiently naturally cooled. Further, even in the closed type printed board unit, the heat generated in the high heat generating portion can be efficiently forcibly cooled by the cooling air without raising the temperature of the entire printed board components. Further, even if the printed board is not separated into the high heat generating part and the low heat generating part and a ventilation port is provided in the vicinity of each high heat generating component, the temperature rise of the entire component can be prevented.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a printed board unit of the present invention.

FIG. 2 is a diagram showing a configuration of a printed board mounted on the printed board unit of the present invention.

FIG. 3 is a diagram showing another example of a printed board unit.

FIG. 4 is a diagram showing a configuration of a printed board mounted on the printed board unit of FIG.

[Explanation of symbols]

 1,10 Printed board 11,101 High heat generation part 12,102 Low heat generation part 13,103 Heat insulation part 20,40 Printed board unit 21,41 Case 30,70 Partition wall 47 High heat generation part side wall 49,106 Vent 57 Fan 59 Radiation fin

Claims (5)

[Claims] 1. A printed circuit board unit having one or a plurality of printed circuit boards mounted thereon, comprising: a high heat generating part composed of high heat generating components; a low heat generating part composed of low heat generating components; and the high heat generating part. A printed board having a heat insulating section provided between the low heat generating section, a case in which one or a plurality of the printed boards are fixed and stored in parallel, and a case provided in the case and arranged in parallel with the case A printed board unit, comprising: a partition wall that connects the heat insulating parts of the printed board housed in the housing and separates the low heat generation part and the high heat generation part of the printed board. 2. The printed board unit according to claim 1, wherein the high heat generating portion of the printed board is molded with resin or the like. 3. A printed circuit board unit in which one or a plurality of printed circuit boards are mounted, a high heat generating part constituted by high heat generating parts, a low heat generating part constituted by low heat generating parts, and the high heat generating part. A printed board having a heat insulating section provided between the low heat generating section, a sealed type case in which one or a plurality of the printed boards are fixed and stored in parallel, and the prints stored in parallel The high heat generating portion side wall of the case provided on the high heat generating portion side of the plate, the high heat generating portion side wall and the heat insulating portion of the printed board are connected to surround the high heat generating portion of the printed board, A partition wall separating the low heat generation part and the high heat generation part of the plate; a first cooling air vent provided on the side wall of the high heat generation part and through which cooling air of the high heat generation part passes; Provided in the high heat generation part, A second cooling vent through which the cooling air of the heat generating portion passes, a fan that sucks the cooling air of the high heat generating portion, and a radiation fin that takes heat from the cooling air that has passed the high heat generating portion A printed circuit board unit comprising: 4. A printed board unit in which one or a plurality of printed boards are mounted, a case in which the one or a plurality of printed boards are fixed and stored in parallel, and the case is provided on an outer wall of the case, A first cooling air passage through which cooling air passes, and a second cooling air passage provided near the high heat-generating component in the printed board and through which the cooling air passes. A printed circuit board unit. 5. The printed circuit board unit according to claim 4, wherein the case is provided with a fan, and the cooling air is sucked or discharged by the fan.