JP6955919B2 - Removal device and removal method - Google Patents

Description

The present invention relates to a removal device and a removal method.

Conventionally, there is known an apparatus for removing an outer edge portion of a semiconductor wafer (hereinafter, also simply referred to as “wafer”) as needed (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2010-10392

However, in the conventional sheet peeling device (removing device) as described in Patent Document 1, an orientation mark (another device can be recognized) indicating the orientation of the wafer such as a V notch on the outer edge of the wafer W (wafer). When the mark) is formed, after the step of removing the residual edge portion W2 (unnecessary portion) is executed, the wafer itself has no orientation, so that the orientation of the wafer cannot be known after the next step. It causes the inconvenience of being lost.

An object of the present invention is to provide a removing device and a removing method capable of preventing the orientation of the wafer from being lost even if the outer edge portion of the wafer is removed.

The present invention has adopted the configuration described in the claims.

According to the present invention, since a mark recognizable by another device is given at a predetermined position of the necessary portion, it is possible to prevent the orientation of the wafer from being unclear even if the outer edge portion of the wafer is removed. ..
Further, if the sticking means is provided, the necessary portion and the frame member can be integrated, and in the subsequent steps, the necessary portion and the frame member can be integrated with each other, for example, through at least one of the frame member and the adhesive sheet without contacting the necessary portion. Predetermined handling such as fixing or transporting the necessary part can be performed.
Further, if the cutting line is formed without including the convex portion in the necessary portion, the necessary portion without the convex portion can be formed.
Further, if the configuration is such that a mark is given to a predetermined portion of the necessary portion having positional regularity with respect to the position where the orientation mark is located, the other device positions the necessary portion according to the regularity. It is possible to perform predetermined processing such as processing or processing the necessary portion.
Further, if the outer leading sheet removing means is provided, it is possible to prevent the outer leading sheet from becoming an obstacle when performing a predetermined process on the necessary portion.
Further, if the peeling means is provided, it is possible to prevent the inner leading sheet from becoming an obstacle when performing a predetermined treatment on the other surface of the necessary portion.
The cutting line in the present invention is not limited to a complete cutting line in a state where there is no connected portion by continuously continuing through holes penetrating an object to be cut such as a wafer or a preceding sheet, for example. By intermittently continuing through holes that penetrate the object to be cut, pseudo cutting lines that are partially connected, and pseudo-bottomed holes that do not penetrate the object to be cut continue continuously or intermittently. The characteristics, characteristics, properties, materials, composition, composition of the object to be cut, by irradiating the object to be cut with laser light, electromagnetic waves, heat, etc., or by administering chemicals, chemical substances, etc. Pseudo-cutting lines in which fragile parts weakened by changing dimensions, etc. continue continuously or intermittently, and pseudo-cut lines in which at least two through holes, bottomed holes, and fragile parts continue regularly or irregularly. It shall also include a typical cutting line. The pseudo cutting line can be made into a complete cutting line by applying an external force such as vibration, tension, light, or heat.

(A) is a side view of the removal device according to the embodiment of the present invention. (B) is a partial explanatory view of (A). (A) to (D) are operation explanatory views of the removal device of FIG. (A) to (D) are operation explanatory views of the removal device following FIG. 2 (D). (A) to (D) are explanatory views of a modified example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The X-axis, Y-axis, and Z-axis in the present embodiment are orthogonal to each other, the X-axis and the Y-axis are axes in a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. do. Further, in the present embodiment, when the direction is indicated, "up" is the direction of the arrow on the Z axis and "down" is the opposite direction, "left" is the direction of the arrow on the X axis and "right" is the opposite direction. "Front" is the direction of the arrow on the Y axis, and "rear" is the opposite direction.

The removing device 10 of the present invention forms a closed loop-shaped cutting line CU1 on the wafer WF along the outer edge of the wafer WF to which the preceding sheet PS is previously attached to the other surface, thereby forming a closed loop-shaped cutting line CU1 inside the cutting line CU1. A pretreatment means 20 that forms a necessary portion WFN and forms an unnecessary portion WFU outside the cutting line CU1, an unnecessary portion removing means 30 that removes the unnecessary portion WFU, and an outer edge of the necessary portion WFN as a predetermined position. Marking means 40 that gives a mark MK that can be recognized by other devices, and imaging means such as a camera or projector that can detect a V-notch VN as an orientation mark formed on the outer edge of the wafer WF. , Orientation mark detecting means 50 of various sensors such as optical sensors and ultrasonic sensors, and a closed loop-shaped cutting line CU2 on the preceding sheet PS along the outer edge of the necessary portion WFN after the unnecessary portion WFU is removed (FIG. 2). By forming (see (D)), a post-processing means 60 for forming an inner leading sheet PSI inside the cutting line CU2 and forming an outer leading sheet PSO outside the cutting line CU2, and an outer leading sheet An adhesive sheet AS is attached to the outer leading sheet removing means 70 for removing PSO, the frame arranging means 80 for arranging the ring frame RF as a frame member in the vicinity of the required portion WFN, and the required portion WFN and the ring frame RF. A sticking means 90 for forming an intermediate product WK2 by integrating a necessary portion WFN and a ring frame RF via an adhesive sheet AS, an inversion means 11 for inverting the intermediate product WK2, and an inner leading sheet PSI for a necessary portion WFN. A peeling means 12 for peeling from the wafer WF and a supporting means 13 for supporting the wafer WF and the ring frame RF are provided.
In the wafer WF of the present embodiment, a convex portion WFC rising from one surface is formed on the outer edge, and the wafer WF is integrated with the carry-in frame RF1 as a support member via the preceding sheet PS to form an integral WK1. There is. Further, the "one surface" is either the "upper surface" or the "lower surface", or the "front surface" or the "back surface" of the two surfaces paired in the thickness direction of the wafer WF. When "upper surface" or "front surface" is "one surface", "lower surface" or "back surface" is "the other surface", and conversely, "lower surface" or "back surface" is "one surface". In the case, the "top surface" or "surface" is the "other surface".

The pretreatment means 20 is composed of the first to sixth arms 21A to 21F, and can displace what is supported by the sixth arm 21F, which is a working portion, at any position and any angle within the working range. The so-called articulated robot 21 as a drive device, the chuck motor 22 as a drive device supported by the sixth arm 21F, and the chuck arm 22A of the chuck motor 22 are fitted and fixed to the sixth arm 21F. A wafer WF is provided with a bracket 23 on which a removable chuck hole 23A is formed, and a laser output means 24 as a pretreatment instrument that is supported by the bracket 23 and outputs laser light generated by a laser oscillator (not shown). CU1 (pseudo-cutting line) in which the fragile portion FL, which is weakened by irradiating the wafer with laser light and changing the characteristics, characteristics, properties, materials, composition, configuration, dimensions, etc. of the wafer WF, continues continuously. ) Can be formed.

The unnecessary portion removing means 30 is a chuck hole 31A that can be attached to and detached from the sixth arm 21F by fitting and fixing the articulated robot 21 and the chuck motor 22 shared with the pretreatment means 20 and the chuck arm 22A. The frame 31 is provided with a frame 31 formed of the above, and a suction pad 32 supported by the frame 31 and to which a suction force is applied by a pressure reducing means (not shown) such as a pressure reducing pump or a vacuum ejector.

The marking means 40 has a chuck hole 41A that can be attached to and detached from the sixth arm 21F by fitting and fixing the articulated robot 21 and the chuck motor 22 shared with the pretreatment means 20 and the chuck arm 22A. The formed print head bracket 41 and the print head 42 supported by the print head bracket 41 are provided.

The post-processing means 60 has a chuck hole 61A that can be attached to and detached from the sixth arm 21F by fitting and fixing the articulated robot 21 and the chuck motor 22 shared with the pre-processing means 20 and the chuck arm 22A. A cutter blade bracket 61 formed and a cutter blade 62 as a post-processing tool supported by the cutter blade bracket 61 are provided, and through holes TH (see FIG. 2D) penetrating the preceding sheet PS are continuously provided. The subsequent cutting line CU2 (complete cutting line) can be formed.

The outer leading sheet removing means 70 is a chuck hole that can be attached to and detached from the sixth arm 21F by fitting and fixing the articulated robot 21 and the chuck motor 22 shared with the pretreatment means 20 and the chuck arm 22A. A frame 71 on which the 71A is formed and a suction pad 72 supported by the frame 71 and to which a suction force is applied by a decompression means (not shown) such as a decompression pump or a vacuum ejector are provided.

The frame arranging means 80 has a chuck hole 81A that can be attached to and detached from the sixth arm 21F by fitting and fixing the articulated robot 21 and the chuck motor 22 shared with the pretreatment means 20 and the chuck arm 22A. It includes a formed frame 81 and a suction pad 82 supported by the frame 81 and to which a suction force is applied by a pressure reducing means (not shown) such as a pressure reducing pump or a vacuum ejector.

The sticking means 90 is bonded from the release sheet RL to the support roller 91 that supports the original fabric RS to which the adhesive sheet AS is temporarily adhered to one surface of the strip-shaped release sheet RL, the guide roller 92 that guides the original fabric RS, and the release sheet RL. Driven by a peeling plate 93 as a peeling means for peeling the sheet AS, a pressing roller 94 as a pressing means for pressing and attaching the adhesive sheet AS to the necessary portion WFN and the ring frame RF, and a rotary motor 95A as a driving device. It includes a pinch roller 96 that sandwiches the release sheet RL between the drive roller 95 and a recovery roller 97 that is driven by a drive device (not shown) and collects the release sheet RL.

The reversing means 11 is supported by a rotating motor 112 as a driving device supported by a slider 111A of the linear motor 111 as a driving device and its output shaft 112A (see FIG. 3C), and grips the intermediate product WK2. It is provided with a check motor 113 as a drive device having a chuck arm 113A.

The peeling means 12 is rotatably supported by a support roller 121 that supports the strip-shaped peeling adhesive sheet ASR, a guide roller 122 that guides the peeling adhesive sheet ASR, and an output shaft 123A of a linear motion motor 123 as a drive device. A pinch roller 126 that sandwiches the peeling adhesive sheet ASR between the peeling roller 124 and the drive roller 125 driven by the rotating motor 125A as a driving device, and a peeling adhesive sheet ASR driven by a driving device (not shown). It is provided with a collection roller 127 for collecting the waste.

The supporting means 13 is supported by a slider 131A of the linear motor 131 as a driving device, and is supported in an outer table 132 whose upper surface is formed as a holding surface 132A and a recess 132B formed in the outer table 132. The linear motor 133, the inner table 134 supported by the output shaft 133A and whose upper surface is formed as the holding surface 134A, and the decompression means (not shown) such as a decompression pump or a vacuum ejector that applies an attractive force to the holding surfaces 132A and 134A. And have. A notch 132C (see FIG. 3C) into which the chuck arm 113A enters is formed on the rear edge of the outer table 132, and the tip of the cutter blade 62 is formed on the holding surface 134A of the inner table 134. A concave groove 134B (see FIG. 2D) having a closed loop shape in a plan view is formed in which the portion enters.

The operation of the removal device 10 described above will be described.
First, with respect to the removal device 10 in which each member is waiting at the initial position shown by the solid line in FIG. 1, the user of the removal device 10 (hereinafter, simply referred to as “user”) uses the original fabric RS and the adhesive sheet for peeling. After setting the ASR as shown in the figure, a signal for starting automatic operation is input via an operation means (not shown) such as an operation panel or a personal computer. Then, the sticking means 90 drives the rotary motor 95A and a drive device (not shown) to feed the original fabric RS, and when the tip portion of the adhesive sheet AS in the feed direction is peeled by a predetermined amount by the release plate 93, the rotary motor 95A and The drive of a drive device (not shown) is stopped, and the system goes into a standby state.

Next, as shown in FIGS. 1 (A) and 1 (B), the user or a transport means (not shown) such as a drive device or a conveyor holds the integrated WK1 on the holding surfaces 132A and 134A with the leading sheet PS on the lower side. When placed on, the support means 13 drives a decompression means (not shown) to start adsorbing and holding the integrated object WK1 on the holding surfaces 132A and 134A. After that, the pretreatment means 20 drives the articulated robot 21 and the chuck motor 22, the chuck arm 22A is inserted into the chuck hole 23A, and the chuck arms 22A are separated from each other to hold the laser output means 24. Next, the orientation mark detecting means 50 drives a camera or the like to detect and store the position, shape, orientation, etc. of the V notch VN formed on the outer edge of the wafer WF, and then the preprocessing means 20 detects and stores the position, shape, orientation, etc., and then the preprocessing means 20 is an articulated robot 21. And a laser oscillator (not shown) is driven to form a fragile portion FL on the wafer WF as shown in FIG. 2 (A). Next, the pretreatment means 20 drives the articulated robot 21 to make the laser output means 24 make one round along the outer edge of the wafer WF, so that the wafer WF has a closed loop in a plan view as shown in FIG. 1 (B). The shape of the cutting line CU1 is formed, and the necessary portion WFN and the unnecessary portion WFU are formed. At this time, the pretreatment means 20 forms the cutting line CU1 without including the convex portion WFC in the required portion WFN.

Then, after the pretreatment means 20 drives the articulated robot 21 and the chuck motor 22 to return the laser output means 24 to the initial position, the chuck arm 22A is inserted into the chuck hole 31A, and the suction pad is formed in the same manner as described above. Holds 32. Next, the unnecessary portion removing means 30 drives the articulated robot 21 and the decompression means (not shown), and as shown by the alternate long and short dash line in FIG. As shown by the solid line, the suction pad 32 is raised. As a result, the wafer WF cracks at the fragile portion FL as a boundary, the unnecessary portion WFU and the necessary portion WFN are separated, and subsequently, the unnecessary portion removing means 30 drives the articulated robot 21, and the unnecessary portion WFU is not shown. It is transported to a predetermined disposal unit, the drive of a decompression means (not shown) is stopped, and the decompression means is disconnected.

After that, the unnecessary portion removing means 30 drives the articulated robot 21 and the chuck motor 22 to return the suction pad 32 to the initial position, and then the chuck arm 22A is inserted into the chuck hole 41A, and the print head is formed in the same manner as described above. Holds 42. Next, the marking means 40 drives the articulated robot 21 and the print head 42, and as shown in FIG. 2C, at the position where the V notch VN was, based on the detection result of the direction mark detecting means 50. On the other hand, the ink IK is sprayed on a predetermined portion of the necessary portion WFN having regularity in position to give (print or print) the mark MK.
In the case of this actual mode, the predetermined portion of the necessary portion WFN having positional regularity with respect to the position where the V-notch VN was located is the V-notch VN, as shown in FIG. 1 (B). The position of the outer edge of the required portion WFN closest to the position.

Then, after the marking means 40 drives the articulated robot 21 and the chuck motor 22 to return the print head 42 to the initial position, the chuck arm 22A is inserted into the chuck hole 61A, and the cutter blade 62 is in the same manner as described above. To hold. Next, the post-processing means 60 drives the articulated robot 21, and as shown in FIG. 2D, the cutter blade 62 is pierced into the preceding sheet PS, and the tip portion thereof is inserted into the concave groove 134B to enter the through hole TH. To form. Next, the post-processing means 60 drives the articulated robot 21 and makes the cutter blade 62 make one round along the outer edge of the required portion WFN to form a cut line CU2 having a closed loop shape in a plan view on the preceding sheet PS. The inner leading sheet PSI and the outer leading sheet PSO are formed. At this time, the post-processing means 60 may form the cutting line CU2 while contacting the cutter blade 62 with the outer edge of the required portion WFN, or the cutting line CU2 without contacting the cutter blade 62 with the outer edge of the required portion WFN. May be formed.

After that, the post-processing means 60 drives the articulated robot 21 and the chuck motor 22, returns the cutter blade 62 to the initial position, inserts the chuck arm 22A into the chuck hole 71A, and inserts the chuck arm 22A into the chuck hole 71A in the same manner as described above. To hold. Next, the outer leading sheet removing means 70 drives the articulated robot 21 and the decompression means (not shown), and after sucking and holding the carry-in frame RF1 with the suction pad 72 as shown by the alternate long and short dash line in FIG. 3 (A). , The support means 13 stops driving the decompression means (not shown), and releases the suction holding of the outer leading sheet PSO on the holding surface 132A. Then, the outer leading sheet removing means 70 drives the articulated robot 21, and after raising the suction pad 72 as shown by the solid line in FIG. 3A, the carry-in frame RF1 with the outer leading sheet PSO is shown. Do not transport to a predetermined recovery unit, stop driving the decompression means (not shown), and disconnect it.

Next, the outer leading sheet removing means 70 drives the articulated robot 21 and the chuck motor 22 to return the suction pad 72 to the initial position, and then the chuck arm 22A is inserted into the chuck hole 81A and sucked in the same manner as described above. Holds the pad 82. After that, the frame arranging means 80 drives the articulated robot 21 and the decompression means (not shown), and the ring frame RF stocked at a predetermined stock position (not shown) is sucked and held by the suction pad 82, as shown in FIG. 3 (B). The ring frame RF is placed on the holding surface 132A so that the necessary portion WFN is arranged in the opening of the ring frame RF. Next, the support means 13 drives a decompression means (not shown) to start suction holding of the ring frame RF on the holding surface 132A, and the frame arranging means 80 stops driving the decompression means (not shown), and then the articulated robot. 21 and the chuck motor 22 are driven to return the suction pad 82 and the first to sixth arms 21A to 21F to the initial positions.

Then, the support means 13 drives the linear motor 133, and as shown in FIG. 3B, raises the inner table 134 to a height at which the upper surface of the required portion WFN is located in the same plane as the upper surface of the ring frame RF. After that, the linear motor 131 is driven to move the slider 131A to the left. Next, when the ring frame RF reaches a predetermined position with respect to the sticking means 90, the sticking means 90 drives the rotary motor 95A and a drive device (not shown), and feeds the original fabric RS according to the moving speed of the slider 131A. As a result, the adhesive sheet AS is peeled off from the release sheet RL, and the adhesive sheet AS peeled off from the release sheet RL is the upper surface of the ring frame RF by the pressing roller 94 as shown by the alternate long and short dash line in FIG. 1 (A). The necessary part WFN to which the inner leading sheet PSI is attached and the necessary part WFN to which the inner leading sheet PSI is attached are integrated with each other via the adhesive sheet AS, and the intermediate product WK2 is formed. After that, when the tip of the next adhesive sheet AS in the feeding direction is peeled off by a predetermined amount by the peeling plate 93, the sticking means 90 stops driving the rotary motor 95A and a drive device (not shown), and is in the standby state again.

Next, when the notch 132C reaches the front of the chuck arm 113A by moving the slider 131A to the left, the support means 13 stops driving the linear motor 131. Then, the reversing means 11 drives the check motor 113, and as shown by the alternate long and short dash line in FIG. 3C, the chuck arm 113A holds the intermediate product WK2, and then the supporting means 13 drives the decompression means (not shown). Stop and release the suction holding of the intermediate product WK2 on the holding surfaces 132A and 134A. Next, the reversing means 11 drives the linear motor 111 and the rotating motor 112, and as shown by the alternate long and short dash line in FIG. 3C, the intermediate product WK2 held by the chuck arm 113A is lifted to a predetermined height. , The intermediate product WK2 is turned upside down. After that, the support means 13 drives the linear motor 133 to return the inner table 134 to the initial position, and then the reversing means 11 drives the linear motor 111 and the check motor 113, and the adhesive sheet AS is on the lower side in the middle. The product WK2 is placed on the holding surfaces 132A and 134A, and the chuck arm 113A is returned to the initial position.

Next, the support means 13 drives a decompression means (not shown) to start suction holding of the intermediate product WK2 on the holding surfaces 132A and 134A, and then drives the linear motor 131 to move the slider 131A to the left. Then, as shown by the alternate long and short dash line in FIG. 1A, when the left end portion of the inner leading sheet PSI in the intermediate product WK2 reaches directly below the lowermost end portion of the peeling roller 124, the support means 13 drives the linear motor 131. After stopping, the peeling means 12 drives the linear motor 123 to lower the peeling roller 124 to attach the peeling adhesive sheet ASR to the left end portion of the inner leading sheet PSI. Next, the support means 13 and the peeling means 12 drive the linear motor 131, the rotary motor 125A, and a drive device (not shown), and as shown in FIG. 3D, the slider 131A is moved to the left in accordance with the moving speed. The peeling adhesive sheet ASR is wound up by the collection roller 127. As a result, when the inner leading sheet PSI is peeled from the required portion WFN and the inner leading sheet PSI is completely peeled from the required portion WFN, the required portion WFN and the ring frame RF are integrated via the adhesive sheet AS. The finished product WK3 is formed. After that, the peeling means 12 drives the linear motion motor 123 to return the peeling roller 124 to the initial position, and then stops driving the rotary motor 125A and a drive device (not shown). Next, when the finished product WK3 reaches a predetermined position on the left side of the peeling means 12, the supporting means 13 stops driving the linear motor 131 and the decompression means (not shown), and the finished product WK3 is attracted and held on the holding surfaces 132A and 134A. After the user or the transport means (not shown) transports the finished product WK3 to the next process, each means drives each drive device to return each member to the initial position, and thereafter, the same operation as described above is performed. Is repeated.
In the next step and subsequent steps, the position of the mark MK given to the outer edge of the required portion WFN can be recognized by another device, so that a predetermined process can be applied to the predetermined position of the required portion WFN.

According to the removal device 10 as described above, since the mark MK recognizable by other devices is given to the predetermined position of the required portion WFN, even if the outer edge portion of the wafer WF is removed, the orientation of the wafer WF remains. It is possible to prevent it from becoming unclear.

The means and processes in the present invention are not limited as long as they can perform the operations, functions or processes described for the means and processes, much less the components of the mere embodiment shown in the above-described embodiment. It is not limited to the process at all. For example, the unnecessary part removing means is not limited as long as it can remove the unnecessary part in light of the common general technical knowledge at the time of filing, and if it is within the technical range (other means and processes). Is the same).

The pretreatment means 20 may form the above-mentioned complete cutting line as the cutting line CU1 on the wafer WF, may form various pseudo cutting lines described above, or may use the cutter blade as the pretreatment instrument. , Laser cutter, ion beam, thermal power, heat, water pressure, heating wire, spraying of gas or liquid, etc. may be adopted, or the wafer WF is moved while the pretreatment instrument is stopped or moved to move the wafer WF. A cutting line CU1 may be formed on the wafer, or a cutting line CU1 other than a circular shape such as an ellipse or a polygon may be formed. CU1 may be formed.

The unnecessary portion removing means 30 may be configured to hold the unnecessary portion WFU by a gripping means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, Bernoulli suction, a driving device, or the like.

The marking means 40 had a V-notch VN as a predetermined portion of the necessary portion WFN having positional regularity with respect to the position where the V-notch VN was, as shown in, for example, FIG. 4 (A). The mark MK may be added to the position of the outer edge of the required portion WFN farthest from the position, or as shown in FIG. 4 (B), a V notch straight line from the position where the V notch VN was located toward the center WC of the wafer WF. Starting from the intersection CP between the VL and the outer edge of the required portion WFN, a mark MK is added to the position of the outer edge of the required portion WFN at a position tilted by a predetermined angle such as 30 ° or 45 ° with respect to the V notch straight line VL. May be good.
As shown in FIG. 4C, the marking means 40 may assign a plurality of markings MK to the required portion WFN, or as shown in FIG. 4D, a plurality of markings MKs having different shapes from each other. A mark MK composed of characters or characters may be added, or as shown in each figure of FIG. 4, a mark MK such as a circle, an ellipse, a polygon such as a triangle or a quadrangle is formed as the shape of the mark MK. Alternatively, as shown in FIG. 4C, a mark MK that looks like an orientation flat shape may be formed on the wafer WF on which the V-notch VN is formed by contrasting the shade of color, light and shade, and the like. Then, as shown in FIG. 4D, a mark MK that looks like a V-notch shape may be formed on the wafer WF on which the orientation flat OF is formed depending on the contrast, or the detection result of the orientation mark detecting means 50. The mark MK may be formed without being based on.
The marking means 40 may give a mark recognizable by other devices by printing, painting, labeling, marking, engraving, etc. at a predetermined position of the required portion WFN. In this case, the marking means 40 may give a mark. Instead of the print head 42, a printing means capable of printing a predetermined symbol or a predetermined character at a predetermined position of the required portion WFN, or a predetermined symbol or a predetermined character can be painted at a predetermined position of the required portion WFN. It suffices to provide a various coating means, a label sticking means capable of sticking a label having a predetermined shape, an adhesive sheet having a predetermined shape, or the like at a predetermined position on the required portion WFN, and other marking devices and engraving devices.
The marking means 40 changes the characteristics, characteristics, properties, materials, composition, composition, etc. of the required portion WFN by, for example, magnetizing, modifying, heating, or cooling a predetermined position of the required portion WFN. The mark MK may be given with, or a hole (hole) or notch with or without a bottom is formed at a predetermined position of the required part WFN, and the mark is made by changing the shape, size, etc. of the required part WFN. MK may be imparted, or the wafer WF may be moved while the movement of the print head 42 or the like is stopped or performed to impart the mark MK to the wafer WF.

The directional mark detecting means 50 may be capable of detecting at least one of the presence / absence of the directional mark, the position of the directional mark, and the shape of the directional mark.

The post-treatment means 60 may form various pseudo cutting lines described above as the cutting line CU2, or the post-treatment instrument may include a laser cutter, an ion beam, thermal power, heat, hydraulic pressure, heating wire, gas, liquid, or the like. The cutting line CU2 may be formed on the preceding sheet PS by moving the preceding sheet PS while stopping or moving the post-processing instrument, for example, other than the circular shape in a plan view. A cutting line CU2 such as an ellipse or a polygon may be formed.

The outer leading sheet removing means 70 may be configured to hold at least one of the outer leading sheet PSO and the carry-in frame RF1, a gripping means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, and the like. The outer leading sheet PSO and the carry-in frame RF1 may be held by Bernoulli suction, a drive device, or the like, or the outer leading sheet PSO may be conveyed to the same position without peeling from the carry-in frame RF1. The outer leading sheet PSO may be peeled off from the carry-in frame RF1 and transported to different positions, or the recovery unit for collecting the carry-in frame RF1 and the outer leading sheet PSO may be inside the removal device 10. It may be outside the removal device 10.

The frame arranging means 80 may be configured to hold the ring frame RF by a gripping means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, Bernoulli suction, a drive device, or the like, or an annular member or an annular member. A frame member made of a member other than the above, for example, a member having a polygonal shape such as a circular shape, an elliptical shape, a triangular shape or a quadrangular shape, or a member having another shape may be placed in the vicinity of the necessary portion WFN.

The sticking means 90 pays out the original fabric RS whose inside is formed as the adhesive sheet AS by forming a plurality of closed loop-shaped cuts in the strip-shaped adhesive sheet base material temporarily attached to the release sheet RL. Alternatively, when the original fabric RS in which the strip-shaped adhesive sheet base material is temporarily attached to the release sheet RL is adopted, the adhesive sheet base material has a predetermined shape by a cutting means equivalent to that of a pretreatment tool or a post-treatment tool. A cutting line may be formed and the inside thereof may be used as an adhesive sheet AS, or when the adhesive sheet AS is peeled from the release sheet RL, the torque of the rotary motor 95A is controlled so that a predetermined tension is applied to the original fabric RS. Instead of each roller such as the support roller 91 and the guide roller 92, a plate-shaped member, a shaft member, or the like may support or guide the original fabric RS or the release sheet RL, or the drive roller. The 95 and the pinch roller 96 may be configured to give a carry output to the original fabric RS without sandwiching the release sheet RL, or may be supported by, for example, fanfold folding without winding the original fabric RS. The release sheet RL may be collected by folding it into a fan fold without winding it, or by chopping it with a shredder or the like, or by itself (attaching) the necessary part WFN and the ring frame RF without moving or moving them. The means 90) may be moved to attach the adhesive sheet AS to the required portion WFN and the ring frame RF.
The pressing means is provided with a drive device as a pressing means contacting / detaching means for separating and approaching the pressing roller 94 to the required portion WFN and the ring frame RF to prevent stress or damage to the required portion WFN and the ring frame RF. As such a pressing means contacting / detaching means, the pressing roller 94 may be manually moved in addition to the driving device.

The reversing means 11 may be configured to hold the intermediate product WK2 by suction force, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli attraction, drive device, etc., or the ring frame RF, adhesive sheet AS, inside of the intermediate product WK2. The configuration may be such that at least one of the preceding sheet PSI and the required portion WFN is held, or the outer table 132 and the inner table 134 are moved without raising the intermediate product WK2, and the intermediate product WK2 is turned upside down. It may be configured to be supported by the supporting means 13, or the peeling means 12 must be configured to be able to peel the inner leading sheet PSI from below the intermediate product WK2 supported by the supporting means 13. May be good.

The peeling means 12 may be configured such that the peeling roller 124 does not move up and down, or the inner leading sheet PSI is held and peeled by a gripping means such as a mechanical chuck or a chuck cylinder, a Coulomb force, a magnetic force, Bernoulli suction, a driving device or the like. Alternatively, the structure may be supported by the supporting means 13, or the sheet-fed peeling adhesive sheet ASR may be attached to the inner preceding sheet PSI, and tension may be applied to the sheet-fed peeling adhesive sheet ASR. The inner leading sheet PSI may be peeled off from the required portion WFN, or the inner leading sheet PSI may be peeled off from the required portion WFN by moving itself (peeling means 12) without moving or moving the required portion WFN. It may be configured to be used.

The support means 13 may be configured to hold the integrated WK1, the intermediate product WK2, the finished product WK3, etc. by a gripping means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, Bernoulli adsorption, a drive device, or the like. However, the inner table 134 may not move up and down, but the outer table 132 may move up and down so that the upper surface of the required portion WFN is located in the same plane as the upper surface of the ring frame RF, or the inner table 134 and the outer side may be configured. Both the table 132 and the table 132 may not move up and down, or the inner table 134 and the outer table 132 may not be separated.

The removing device 10 shares the articulated robot 21 and the chuck motor 22 in the pretreatment means 20, the unnecessary portion removing means 30, the marking means 40, the post-processing means 60, the outer leading sheet removing means 70, and the frame arranging means 80. However, all of these means may be driven by separate drive devices, or at least two of these means may be driven by a shared drive device, or the wafer WF and If a cutting line can be formed on both of the preceding sheet PS, the pretreatment means 20 and the posttreatment means 60 may be configured in common, or at least two of the unnecessary portion WFU, the outer leading sheet PSO, and the ring frame RF may be formed. As long as one can be held, at least two of the unnecessary portion removing means 30, the outer leading sheet removing means 70, and the frame arranging means 80 may be configured by a common one, or may be arranged upside down or arranged sideways. It may form a cutting line, remove the unnecessary part WFU, attach the adhesive sheet AS, or if the preceding sheet PS has its adhesive strength reduced by a predetermined energy, it is unnecessary. Before removing the portion WFU or peeling the inner preceding sheet PSI from the required portion WFN, the adhesive force of the preceding sheet PS may be reduced by an energy applying means capable of applying a predetermined energy. It should be noted that such an energy applying means may apply electromagnetic waves of all wavelengths (for example, ultraviolet rays, X-rays, infrared rays, etc.), a fluid such as a heated or cooled gas or liquid, or the like as energy to the preceding sheet PS. Anything can be used as long as it can impart energy that can reduce the adhesive force of the preceding sheet PS according to the configuration of the preceding sheet PS.
The removing device 10 includes at least one of the orientation mark detecting means 50, the post-processing means 60, the outer leading sheet removing means 70, the frame arranging means 80, the sticking means 90, the reversing means 11, the peeling means 12, and the supporting means 13. It does not have to be.

The wafer WF may have a preceding sheet PS attached to the other surface in advance without being integrated with the support member, or may not have the preceding sheet PS attached to the other surface in advance, or may have a closed loop shape. The convex portion may be formed, the convex portion may be formed intermittently, or the convex portion may not be formed.
The support member may be an annular member, a non-annular member, a polygonal member such as a circular shape, an elliptical shape, a triangular shape or a square shape, or a member having another shape. It may or may not be present.
The orientation mark formed in advance on the wafer WF may be an orientation flat OF, printing, painting, a label, a ruled line, an engraving, or the like.
The other devices referred to in the present application are, for example, those for transporting a wafer WF, those for grinding or cutting a wafer WF, those for laminating a coating film, an adhesive sheet, etc. on the wafer WF, and the like. Anything that handles

The materials, types, shapes, etc. of the adhesive sheet AS, the preceding sheet PS, the adhesive sheet ASR for peeling, and the wafer WF in the present invention are not particularly limited. For example, the adhesive sheet AS, the preceding sheet PS, the adhesive sheet ASR for peeling, and the wafer WF may have, for example, a circular shape, an elliptical shape, a polygonal shape such as a triangular shape or a quadrangular shape, or any other shape, or the adhesive sheet. The AS, the preceding sheet PS, and the adhesive sheet ASR for peeling may be in an adhesive form such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness, and when heat-sensitive adhesive ones are adopted, a coil heater or a heat pipe is used. It may be adhered by heating with a heating means such as the heating side of the above. Further, the adhesive sheet AS, the preceding sheet PS and the adhesive sheet ASR for peeling are, for example, a single layer having only an adhesive layer, a having an intermediate layer between the base material and the adhesive layer, and an upper surface of the base material. It may be a so-called double-sided adhesive sheet having three or more layers such as having a cover layer, and further capable of peeling the base material from the adhesive layer, and such a double-sided adhesive sheet is a single layer. Alternatively, it may have a multi-layered intermediate layer, or may have a single layer or a multi-layered structure without an intermediate layer. Further, the wafer WF may be, for example, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, or a semiconductor chip. The adhesive sheet AS and the preceding sheet PS can be read in a functional and versatile manner, for example, any sheet such as a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, or a film. It may be tape or the like.

As the drive device in the above embodiment, electric devices such as a rotary motor, a linear motor, a linear motor, a single-axis robot, and an articulated robot, and actuators such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder are adopted. In addition, a combination of them directly or indirectly can be adopted.
In the above embodiment, when a rotating member such as a roller is adopted, a driving device for rotationally driving the rotating member may be provided, or the surface of the rotating member or the rotating member itself can be deformed by rubber, resin, or the like. It may be composed of a member, the surface of the rotating member or the rotating member itself may not be deformed, or a pressing means such as a pressing roller or a pressing head or a pressing member such as a pressing member may be pressed. If it is used, instead of or in combination with the ones exemplified above, members such as rollers, round bars, blade materials, rubber, resin, sponge, etc. may be used, or pressed by spraying gas such as air or gas. The material to be pressed may be made of a deformable member such as rubber or resin, or may be made of a non-deformable member, such as a release plate or a release roller. When a material that peels off an object to be peeled off, such as a peeling means or a peeling member, is used, a member such as a plate-shaped member, a round bar, or a roller may be used in place of or in combination with the above-exemplified one. Alternatively, the material to be peeled off may be made of a deformable member such as rubber or resin, or may be made of a non-deformable member.

10 ... Removal device 20 ... Pretreatment means 30 ... Unnecessary part removal means 40 ... Marking means 50 ... Direction mark detection means 60 ... Post-processing means 70 ... Outer leading sheet removing means 80 ... Frame placement means 90 ... Pasting means 11 ... Inversion Means 12 ... Peeling means AS ... Adhesive sheet CU1 ... Cutting line CU2 ... Cutting line MK ... Mark PS ... Leading sheet PSI ... Inner leading sheet PSO ... Outer leading sheet RF ... Ring frame (frame member)
VN ... V notch (direction mark)
WF ... Semiconductor wafer WFC ... Convex part WFN ... Necessary part WFU ... Unnecessary part

Claims (3)

An orientation mark detecting means for detecting and storing an orientation mark formed on the outer edge of the semiconductor wafer to indicate the orientation, and an orientation mark detecting means.
A pretreatment means for forming a necessary portion inside the cutting line and forming an unnecessary portion outside the cutting line by forming a closed loop-shaped cutting line on the semiconductor wafer along the outer edge of the semiconductor wafer. When,
An unnecessary part removing means for removing the unnecessary part,
After the unnecessary portion is removed, it is provided with a marking means for imparting a mark recognizable by another device to a predetermined position of the required portion based on the memory of the orientation mark detecting means. Removal device. The first aspect of the present invention, wherein the mark-imparting means can add the mark to a plurality of parts of the necessary portion having regularity different in position with respect to the position where the direction mark is located. Removal device. A direction mark detection process that detects the direction mark formed on the outer edge of the semiconductor wafer and stores the result.
A pretreatment step of forming a closed loop-shaped cutting line on the semiconductor wafer along the outer edge of the semiconductor wafer to form a necessary portion inside the cutting line and an unnecessary portion outside the cutting line. When,
An unnecessary part removing step for removing the unnecessary part, and
After the unnecessary portion removing step, it is characterized by having a marking step of imparting a mark recognizable by another device to a predetermined position of the necessary portion based on the memory in the orientation mark detecting step. Removal method.

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