JP6942427B2 - Parts mounting machine and parts mounting method - Google Patents

Description

In the present invention, the component holding unit for holding the component and the head unit for mounting the component are moved to the supply position, and after the head unit receives the component from the component holding unit, the component is moved above the substrate to move the component to the substrate. It relates to the component mounting technology to be mounted.

Various component mounting machines have been proposed for mounting electronic components on a printed circuit board. For example, in Patent Document 1, a component supply device for supplying electronic components and a mounting device having a head portion for mounting the electronic components supplied from the component supply device on a printed circuit board are provided. This parts supply device has a pallet accommodating portion for accommodating a pallet holding electronic components, and pulls out the pallet from the pallet accommodating portion when supplying parts. On the other hand, the head portion attracts and receives the electronic component held on the pallet pulled out from the pallet accommodating portion, and then moves to the upper part of the printed circuit board to mount the electronic component on the printed circuit board.

Japanese Unexamined Patent Publication No. 2015-228453

In the above-mentioned component mounting machine, the pull-out position of the pallet is fixed. More specifically, the pallet is pulled out to a position close to the mounting device, and electronic components are supplied at this position. That is, the position corresponds to the supply position, and the head portion accesses this position to suck the parts and receive the parts. For this reason, the supply position where parts are supplied to the head portion can be made closest to the mounting position, and the time required for the head portion to reach the mounting position from the supply position is shortened to improve the efficiency of component mounting. Was there.

However, if the movement of the pallet to the supply position is not completed when the head portion moves to the supply position, the head portion needs to wait until the arrival of the pallet. In particular, when moving a pallet on which relatively large parts are mounted to a supply position, it is necessary to suppress the moving speed of the pallet. This promotes a long waiting time, delays the timing at which the head portion receives the parts from the pallet, and may reduce the processing efficiency of the parts mounting machine.

Further, such a problem is not only in the component mounting technology that uses the pallet as an example of the "component holding unit" of the present invention, but also in the component mounting machine that takes out a bare chip (component) from a wafer and mounts it on a substrate, for example. May occur. As an example of such a component mounting machine, a component mounting machine provided with a component holding unit such as a shuttle or a station that holds and moves a bare chip has been proposed. In this component mounting machine, the component holding unit is moved to a transfer position different from the supply position, the bare chip is transferred from the wafer to the component holding unit at the transfer position, and then the component holding unit is moved from the transfer position. Move to the supply position to supply parts. Therefore, depending on the timing between the moving operation of the component holding portion and the moving operation of the head portion, the standby at the supply position of the component holding portion or the head portion becomes long as shown in the column (a) of FIG. 4 to be described later. As a result, the timing at which the head unit receives the components from the component supply unit is delayed, which may reduce the processing efficiency of the component mounting machine.

The present invention has been made in view of the above problems, and the component holding portion for holding the component and the head portion for mounting the component are moved to the supply position, and after the head portion receives the component from the component holding portion, the substrate In the component mounting technology for moving upward and mounting the component on the board, the purpose is to optimize the timing of receiving the component from the component supply unit by the head unit and improve the processing efficiency.

The first aspect of the present invention is a component mounting machine, in which a supply device that moves a component holding unit that holds a component to a supply position and supplies the component at the supply position, and a head unit that moves to the supply position. A mounting device that executes a component mounting operation that moves above the board and mounts the component on the board after receiving the component from the component holding unit located at the supply position, and the supply device and mounting after adjusting the supply position. A control device for controlling the device to cause the head unit to receive parts from the component holding unit is provided , and a standard supply position is set as a supply position. The supply device includes a component supply unit having parts and a component supply unit. A component transfer unit that transfers parts from the component supply unit to the component holder at a transfer position different from the standard supply position, and a moving unit that reciprocates the component holder between the transfer position and the supply position. The control device has, for each of at least one or more supply positions different from the standard supply position and the standard supply position, the arrival time or the time required for arrival of the component holding unit at the supply position is used as the supply side arrival information. In addition to predicting, the arrival time of the head part to the supply position or the time required for arrival is predicted as the mounting side arrival information, and between the standard supply position and the transfer position based on the supply side arrival information and the mounting side arrival information. It is characterized by adjusting the supply position.
A second aspect of the present invention is a component mounting machine, in which a supply device that moves a component holding unit that holds a component to a supply position and supplies the component at the supply position, and a head unit that moves to the supply position. A mounting device that executes a component mounting operation that moves above the board and mounts the component on the board after receiving the component from the component holding unit located at the supply position, and the supply device and mounting after adjusting the supply position. It is equipped with a control device that controls the device to cause the head unit to receive parts from the component holding unit, a standard supply position is set as the supply position, and the mounting device repeats the component mounting operation to perform the component mounting operation. The holding unit is a pallet on which parts are mounted, and the supply device moves the pallet back and forth between the pallet accommodating unit that accommodates the pallet at a position different from the standard supply position and the pallet accommodating unit and the standard supply position. The control device has a unit, and for each of at least one or more supply positions different from the standard supply position and the standard supply position, the arrival time of the component holding unit to the supply position or the time required for arrival is set on the supply side. Predict as arrival information and predict the arrival time or time required for the head to the supply position as the mounting side arrival information, and move from the pallet housing to the standard supply position based on the supply side arrival information and the mounting side arrival information. In order to perform the first component mounting operation after starting the movement of the pallet, the pallet is stationary between the standard supply position and the pallet accommodating portion, and the component from the pallet by the head unit is set to the stationary position of the pallet as the supply position. It is characterized by executing the receipt of.

A third aspect of the present invention is a component mounting method, in which a first step of moving a component holding portion for holding a component to a supply position by a supply device and a second step of moving a head portion to a supply position. The third step of receiving the parts from the parts holding part by the head part while the parts holding part and the head part are located at the supply position, and moving the head part receiving the parts from the parts holding part from the supply position to the upper part of the board. A fourth step of mounting the parts on the board by the head part is provided, and the supply device transfers the parts from the parts supply part to the parts holding part at a transfer position different from the standard supply position and the parts supply part having the parts. It has a component transfer unit to be transferred and a moving unit that reciprocates the component holding unit between the transfer position and the supply position, and a standard supply position is set as the supply position, and the standard supply position is set. For each of at least one or more supply positions and standard supply positions different from After predicting the time or the time required for arrival as the mounting side arrival information and adjusting the supply position between the standard supply position and the transfer position based on the supply side arrival information and the mounting side arrival information, the first step or It is characterized by executing the fourth step.
Further, a fourth aspect of the present invention is a component mounting method, in which a first step of moving a component holding portion for holding a component to a supply position by a supply device and a first step of moving the head portion of the mounting device to a supply position. The second step, the third step of receiving the parts from the parts holding part by the head part with the parts holding part and the head part located at the supply position, and the head part receiving the parts from the parts holding part of the board from the supply position. It is provided with a fourth step of moving upwards and mounting components on a substrate by a head portion, and a standard supply position is set as a supply position, and the mounting device performs the second step, the third step, and the fourth step. The component mounting operation including is repeated, and the component holding unit is a pallet on which the components are mounted, and the supply device is a pallet accommodating unit that accommodates the pallet at a position different from the standard supply position, and a pallet accommodating unit and the standard supply position. It has a moving unit that reciprocates the pallet from and to, and the control device has a component holding unit to the supply position for at least one or more supply positions different from the standard supply position and each of the standard supply positions. The arrival time or the time required for arrival is predicted as the supply side arrival information, and the arrival time or time required for the head portion to the supply position is predicted as the mounting side arrival information, based on the supply side arrival information and the mounting side arrival information. To perform the first component mounting operation after starting the movement of the pallet from the pallet housing to the standard supply position, the pallet is stopped between the standard supply position and the pallet housing, and the stationary position of the pallet is set. As a supply position, the head unit receives parts from the pallet.

In the invention configured in this way, the supply position is adjusted, and the head unit receives the component from the component holding unit at the adjusted supply position. Therefore, as compared with the conventional device in which the component mounting operation is executed with the supply position fixed, the timing at which the head unit receives the component from the component supply unit, that is, the receiving timing is optimized.

Here, a standard supply position is set as the supply position . This "standard supply position" may be, for example, a position that is the shortest with respect to the so-called mounting position in which the component is mounted on the board. In this case, the moving distance of the head portion is shortened and the time required for the component mounting operation is reduced. Can be shortened. Then, the supply position may be adjusted to a position different from the standard supply position according to the configuration of the supply device. In this case, although the moving distance of the head portion is long, on the contrary, the moving distance of the component holding portion is short, and it is possible to accelerate the receiving timing and improve the processing efficiency as will be described in detail later.

For example, the supply device has a parts supply unit having parts, a parts transfer unit that transfers parts from the parts supply unit to a parts holding unit at a transfer position different from the standard supply position, and a transfer position and a supply position. When the control device has a moving unit that reciprocates the component holding unit between the parts, the receiving timing can be optimized by adjusting the supply position between the standard supply position and the transfer position.

Further, the mounting device repeatedly performs the component mounting operation, the component holding unit is a pallet on which the component is mounted, and the supply device includes a pallet accommodating unit for accommodating the pallet at a position different from the standard supply position, and a pallet accommodating unit. If it has a moving unit that reciprocates the pallet to and from the standard supply position, it performs the first component mounting operation after the control device has started moving the pallet from the pallet housing to the standard supply position. Therefore, the receiving timing can be optimized by stopping the pallet between the standard supply position and the accommodating position and receiving the parts from the pallet by the head portion with the stationary position of the pallet as the supply position. ..

When the pallet is temporarily stopped in this way, the control device moves the head portion that receives the component from the pallet to the upper part of the substrate in the first component mounting operation, and the head portion moves the component to the substrate. The movement of the pallet to the standard supply position may be resumed while performing at least one of the operations implemented in. As a result, the pallet movement and the component mounting operation are performed in parallel, and the pallet can be moved to the standard supply position at an early stage, and as a result, the processing efficiency can be further improved.

Further, the control device predicts the arrival time or the time required for the component holding unit to the supply position as the supply side arrival information for each of at least one supply position different from the standard supply position and the standard supply position. At the same time, the arrival time of the head unit to the supply position or the time required for arrival may be predicted as the mounting side arrival information, and the supply position may be adjusted based on the supply side arrival information and the mounting side arrival information. As a result, the supply position can be surely adjusted, and the receiving timing can be optimized with high accuracy.

In the present invention, the timing of receiving parts from the parts supply unit by the head unit can be optimized, and as a result, the processing efficiency of the component mounting machine can be improved.

It is a top view which shows typically the 1st Embodiment of the component mounting machine which concerns on this invention. It is a perspective view which shows typically the schematic structure of a flip head and a relay head. It is a figure which shows typically the operation of the component mounting machine shown in FIG. It is a figure which shows typically the operation of the component mounting machine with the change of the supply position in the component mounting machine shown in FIG. 1. It is a flowchart which shows the adjustment method of the supply position which supplies a part to a head part in 1st Embodiment. It is a figure which shows the correspondence relationship of the supply position and the receiving timing with respect to each count value in 1st Embodiment. It is a top view which shows typically the 2nd Embodiment of the component mounting machine which concerns on this invention. It is a figure which shows typically the operation of the component mounting machine with the change of the supply position in the component mounting machine shown in FIG. 7. It is a flowchart which shows the adjustment method of the supply position which supplies a part to a head part in 2nd Embodiment.

FIG. 1 is a plan view schematically showing a first embodiment of the component mounting machine according to the present invention. As shown in FIG. 1, in the present specification, the XYZ orthogonal coordinate axes composed of the transport direction X, the width direction Y, and the vertical direction Z are appropriately used. The transport direction X and the width direction Y are parallel to each other in the horizontal direction and orthogonal to each other, and the vertical direction Z is orthogonal to the transport direction X and the width direction Y. This point is the same in the second embodiment described later.

The component mounting machine 1 mounts components on the substrate B carried in from the upstream side (left-hand side in FIG. 1) in the transport direction X, and mounts the components on the downstream side (right-hand side in FIG. 1) of the transport direction X. Carry out. The board B is provided with L mounting target points Bp, and one component Wp is mounted on each mounting target point Bp. Each component Wp is a bare chip of the diced wafer W and has the same configuration as each other. As described above, in the present embodiment, the wafer W corresponds to an example of the "parts supply unit" of the present invention.

The component mounting machine 1 is roughly divided into a mounting device 2 that receives a component Wp at a supply position and mounts it on a substrate B, a wafer accommodating device 3 that accommodates a wafer W that is a supply source of the component Wp, and a wafer accommodating device 3. A supply device 4 for drawing out the wafer W from the wafer W and taking out the component Wp from the wafer W and supplying the component Wp to the supply position, and a control device 5 for controlling each device are provided.

Among these devices, the mounting device 2 is provided with a transport unit 21 that transports the substrate B in the transport direction X. The transport unit 21 has a standby conveyor 211, a mounting conveyor 212, a standby conveyor 213, a mounting conveyor 214, and a unloading conveyor 215, which are arranged in this order in the transport direction X. Then, the conveyor drive unit 216 independently drives the conveyors 211 to 215 in response to a control command from the control device 5, so that the substrate B is conveyed in the transfer direction X.

The standby conveyor 211 is provided with respect to the standby position P1, and the substrate B carried in from the outside of the component mounting machine 1 is made to stand by at the standby position P1 or delivered to the mounting conveyor 212. The mounting conveyor 212 is provided for the mounting position P2 located on the downstream side of the transport direction X of the standby position P1, and the substrate B received from the standby conveyor 211 is fixed at the mounting position P2 or delivered to the standby conveyor 213. The standby conveyor 213 is provided with respect to the standby position P3 located on the downstream side of the transport direction X of the mounting position P2, and the substrate B received from the mounting conveyor 212 is made to stand by at the standby position P3 or delivered to the mounting conveyor 214. The mounting conveyor 214 is provided for the mounting position P4 located on the downstream side of the transport direction X of the standby position P3, and the substrate B received from the standby position 213 is fixed at the mounting position P4 or delivered to the unloading conveyor 215. The carry-out conveyor 215 is provided at a position on the downstream side of the transport direction X of the mounting position P4, and carries out the substrate B received from the mounting conveyor 214 to the outside of the component mounting machine 1. Further, the mounting device 2 has a head portion 22 for mounting the component Wp on the substrate B positioned at the mounting positions P2 and P4, and the component Wp and the suction nozzle that are suction-held by the suction nozzle (not shown) of the head portion 22. It has a camera 23 for taking an image. Reference numeral 24 in FIG. 1 is an image processing unit that processes a signal output from the camera 23, and reference numeral 25 is a mounting head driving unit that drives the head unit 22.

The wafer accommodating device 3 is provided with a rack (not shown). Wafer holders Wh that hold the wafer W are housed in the rack side by side in the vertical direction Z. Further, the rack is connected to a rack elevating drive unit (not shown). The rack elevating drive unit elevates and elevates the rack in the vertical direction Z in response to an elevating command from the control device 5, thereby positioning one wafer holder Wh at a height position suitable for delivery to and from the supply device 4. It is possible.

The supply device 4 has a wafer withdrawal function for pulling out the wafer W from the wafer accommodating device 3 to the wafer take-out position Pw, and moves the component (bare chip) Wp from the drawn wafer W to the supply position to the mounting device 2 at the supply position. It has a supply function to supply. In order to execute the wafer withdrawal function, the supply device 4 has a wafer support table 41 capable of supporting the wafer holder Wh and a wafer transfer drive unit 42 for moving the wafer support table 41 in the transfer direction X and the width direction Y. And have. The wafer support table 41 is movably supported in the transfer direction X and the width direction Y by a moving mechanism (not shown) of the wafer transfer drive unit 42. Then, when the wafer transfer drive unit 42 operates in response to the take-out command from the control device 5, the wafer support table 41 moves to the receiving position adjacent to the wafer accommodating device 3 and receives the wafer holder Wh from the wafer accommodating device 3. Further, the wafer is moved from the receiving position to the wafer taking-out position Pw away from the wafer accommodating device 3 in the width direction Y. Further, the wafer transfer drive unit 42 moves the wafer holder Wh drawn out from the wafer accommodating device 3 in the transfer direction X. As a result, the wafer W can be pulled out to the wafer take-out position Pw, the wafer W can be positioned at a desired position in the horizontal plane (XY plane), and the relative position of the component Wp with respect to the supply device 4 can be controlled with high accuracy. It has become.

The supply device 4 is provided with stages 49A and 49B for supplying one or more components Wp from the wafer W thus drawn out for component mounting at the mounting positions P2 and P4. That is, the stage 49A supplies the component Wp to the head portion 22 for mounting at the mounting position P2, and the stage 49B supplies the component Wp to the head portion 22 for mounting at the mounting position P4. These stages 49A and 49B basically have the same configuration, and are provided symmetrically with respect to a drawing path of the wafer W (a path extending from the wafer accommodating device 3 in the width direction Y). Therefore, in the following description, the stage 49B on the right-hand side of FIG. 1 will be described in detail with reference to FIGS. 1 and 2, while the stage 49A on the left-hand side of FIG. 1 will be described with the same or corresponding reference numerals. Is omitted. Further, in the present embodiment, four shuttles 43a to 43d are used for moving parts as described below, but when any one of these shuttles 43a to 43d is referred to, simply "shuttle 43" is used. It is called.

In order to take out the component Wp from the wafer W, transfer it to the shuttle 43c (or 43d), and then supply it to the supply position (reference numerals PA to PC in FIG. 4 described later) by the shuttle 43c (or 43d). The supply device 4 includes shuttles 43c and 43d, a flip head 44, a flip head drive unit 45, a relay head 46, a relay head drive unit 47, and a shuttle drive unit 48. In the present embodiment, the two shuttles 43c and 43d move independently of each other, and when one moves toward the supply position for parts supply, the other returns from the supply position to the transfer position Pt. The two units may be configured to move to the supply position together and return to the transfer position Pt after supplying the parts.

FIG. 2 is a perspective view schematically showing a schematic configuration of a flip head and a relay head. As shown in the figure, the flip head 44 has an arm member 441 and a fixed suction pad 442 fixed to the tip of each arm member 441. Further, the arm member 441 is rotatable around a rotation shaft AX1 parallel to the width direction Y.

A flip head drive unit 45 is connected to the base end portion of the arm member 441, and the arm member 441 rotates in the rotation direction R by operating in response to a rotation command from the control device 5. The fixed suction pad 442 reciprocates between the contact position where the fixed suction pad 442 comes into contact with the wafer W and the position directly below the relay head 46. Therefore, while the wafer W is positioned at a desired position in the horizontal plane (XY plane) by the wafer transfer drive unit 42, the fixed suction pad 442 is reciprocated by the flip head drive unit 45 to move one component Wp from the wafer W. Can be taken out.

Although not shown, the fixed suction pad 442 is connected to a pressure adjusting unit that supplies pressure while switching between positive pressure and negative pressure, and pressure switching is executed according to the rotation position of the arm member 441. That is, when the fixed suction pad 442 in the non-suction state abuts on one component Wp in the wafer W, a negative pressure is applied to the fixed suction pad 442 to selectively suck and hold the one component Wp. Then, while the arm member 441 rotates toward the relay head 46, the negative pressure supply is continued, and the component Wp is reliably and stably conveyed to the position directly below the relay head 46. Then, when the transfer of the component Wp to the shuttle 43c (or 43d) by the relay head 46 described below is started, a positive pressure is supplied to the fixed suction pad 442 at the same time as the transfer is started, and the component to the relay head 46 is started. The transfer of Wp is executed. After this, the arm member 441 is rotated toward the wafer W side in a state where the positive pressure supply to the fixed suction pad 442 is continued or the pressure supply is stopped.

In the relay head 46, as shown in FIG. 2, the movable suction pad 461 is movable in the width direction Y with respect to the head main body 462 at a position near the flip head 44. A pressure adjusting unit is also connected to the movable suction pad 461, and the movable suction pad 461 can switch between suction holding and suction holding release of the component Wp. Further, the movable suction pad 461 is movable in the width direction Y on the vertically lower side of the head main body 462, and is connected to the relay head drive unit 47. The relay head drive unit 47 moves the movable suction pad 461 in the X direction and positions it in response to a movement command from the control device 5. For example, as shown in FIG. 2, the movable suction pad 461 is moved to the arrangement position of the arm member 441, and the movable suction pad 461 is switched to the suction holding state to obtain the component Wp taken out from the wafer W by the fixed suction pad 442. Adsorb and hold. After that, the movable suction pad 461 is moved to the shuttle side by the relay head drive unit 47, and a positive pressure is supplied to the movable suction pad 431 to complete the transfer of the component Wp to the shuttle 43c (or 43d).

As shown in FIG. 1, the control device 5 is composed of a computer having an arithmetic processing unit 51 and a storage unit 52 in order to control each unit of the device configured as described above. As the arithmetic processing unit 51, a well-known CPU (Central Processing Unit) that performs various arithmetic processes can be used. Further, the storage unit 52 stores a ROM (Read Only Memory) which is a read-only memory for storing a basic program, a RAM (Random Access Memory) which is a read / write memory for storing various information, control software, data, and the like. It has a magnetic disk to store. The magnetic disk stores the board processing conditions according to the board B in advance as a mounting program (also called an optimization program, mounting data, board data, etc.), and the CPU reads the contents into the RAM and reads them into the RAM. The CPU controls each part of the device according to the contents of the issued mounting program to execute the component mounting operation described below.

FIG. 3 is a diagram schematically showing the operation of the component mounting machine shown in FIG. Further, FIG. 4 is a diagram schematically showing the operation of the component mounting machine due to the change of the supply position in the component mounting machine shown in FIG. In this component mounting machine, the supply device 4 repeats the component supply operation and the mounting device 2 repeats the component mounting operation. Here, the component supply operation means an operation in which the following steps Ss1 to Ss4 are executed in this order.

-Ss1: Transfer side movement step ... The empty shuttle 43 moves to the transfer position Pt.
Ss2: Extraction / transfer step: After the flip head 44 takes out the component Wp from the wafer W, the relay head 46 transfers the component Wp taken out by the flip head 44 to the shuttle 43, depending on the number of repetitions of this step Ss2. The number of parts to be transferred to the shuttle 43 is determined.
Ss3: Supply side movement step: When a desired number of parts Wp are held by the shuttle 43, the shuttle 43 moves to the supply position.
Ss4: Parts delivery step: While the head portion 22 sucks and holds the parts Wp held by the shuttle 43, the shuttle 43 stands still and waits for the parts delivery by the head portion 22 to be completed.

By executing steps Ss1 to Ss4, one or more parts Wp are supplied from the wafer W to the supply position. On the other hand, the component Wp supplied to the supply position is mounted on the substrate B by performing the component mounting operation in the following steps Sm1 to Sm4.

-Sm1: Supply side movement step: The head portion 22 moves to the supply position of the component Wp.
-Sm2: Parts receiving step: The head portion 22 sucks and holds the parts Wp held by the shuttle 43 at the supply position, and completes the receiving of the parts Wp.
Sm3: Substrate-side movement step: The head portion 22 passes above the camera 23 and moves above the substrate B while sucking and holding the component Wp.
Sm4: Component mounting step: The head portion 22 is lowered to mount the component Wp at the mounting position of the board B.

In this way, the parts Wp are delivered from the shuttle 43 to the head portion 22 with the shuttle 43 and the head portion 22 both located at the supply positions. In the component mounting machine 1 having such characteristics, in order to shorten the time required for the component mounting operation, for example, as shown in column (a) of FIG. 4, the supply position is closest to the mounting position. It has been proposed to set the PA as the supply position. That is, the time required for the supply-side moving step Sm1 and the substrate-side moving step Sm3, that is, the moving time of the head portion 22, can be shortened, and the time required for the component mounting operation can be shortened.

However, the distance between the transfer position Pt and the supply position PA becomes relatively long due to the setting of the supply position PA. Therefore, the time required for the component supply operation, particularly the time required to move the empty shuttle 43 from the supply position PA to the transfer position Pt and the shuttle 43 holding the component Wp during the component supply operation are from the transfer position Pt to the supply position. It takes a long time to move to PA. As a result, even if the head portion 22 moves to the supply position PA relatively early, the movement of the shuttle 43 to the supply position PA cannot catch up, and the shuttle 43 needs to wait until the shuttle 43 to the supply position PA arrives. There is.

In this way, the shuttle 43 and the head portion 22 are moved to the supply position, and after the head portion 22 receives the component Wp from the shuttle 43, the shuttle 43 and the head portion 22 are moved above the substrate B, and the component Wp is mounted on the substrate B. In No. 1, it is necessary to improve the processing efficiency in consideration of not only the time required for the component mounting operation but also the time required for the component supply operation. More specifically, it is important to optimize the timing of receiving the component Wp from the shuttle 43 by the head unit 22 by adjusting the supply position.

For example, as shown in (b) of the figure, when the supply position is changed from the supply position PA to the supply position PB on the transfer position Pt side, the distance that the head portion 22 must move for the component mounting operation becomes long. There is a demerit that it becomes. However, the distance between the supply position and the transfer position Pt, in other words, the movement distance of the shuttle 43 (hereinafter referred to as "shuttle movement distance") is shortened, and the time required for the transfer side movement step Ss1 and the supply side movement step Ss3, that is, the shuttle There is an advantage that the moving time of the 43 is shortened, and the timing of receiving the component Wp from the shuttle 43 by the head portion 22 is optimized and the processing efficiency can be improved by surpassing the above-mentioned disadvantages.

However, as shown in FIG. 6C, if the supply position is changed from the supply position PB to the supply position PC on the transfer position Pt side, the movement time of the shuttle 43 is shortened rather than the merit of the head portion 22. The disadvantage of lengthening the travel time prevails. By changing the supply position in this way, the processing efficiency changes significantly.

Therefore, in the present embodiment, as shown in FIG. 5, the times when the head portion 22 and the shuttle 43 arrive at the supply position P (n) are predicted while changing the supply position P (n), and the predicted times thereof are predicted. The supply position where the processing efficiency is high is determined as the optimum supply position based on the above, and the supply position is adjusted. Hereinafter, the method of adjusting the supply position will be described in detail with reference to FIGS. 3 to 5.

FIG. 5 is a flowchart showing a method of adjusting a supply position for supplying parts to the head portion. In the component mounting machine 1, the arithmetic processing unit 51 performs the processes (steps S1 to S11) described below before performing the nth component supply operation and the component mounting operation in the supply position determination program stored in the storage unit 52. To determine the optimum value of the supply position. That is, in the component mounting machine 1, a series of operations including taking out / transferring the component Wp from the wafer W, receiving the component Wp by the head portion 22 at the supply position, and mounting the component Wp on the substrate B is a “mounting turn”. However, in this embodiment, the supply position is optimized before each mounting turn is performed.

First, the initial value "1" is set as the count value k (step S1), and the standard supply position P0 is set as the supply position P (n) (step S2). In this embodiment, the standard supply position P0 is set to the supply position PA closest to the mounting position (see FIG. 4A). The supply position PA may be obtained from the mounting program or may be incorporated into the mounting program in advance. Further, the standard supply position P0 is not limited to the above supply position PA, and is arbitrary.

Next, the arithmetic processing unit 51 predicts Ts when the shuttle 43 arrives at the supply position P (n) in the nth component supply operation (hereinafter referred to as “shuttle arrival time”) (step S3), and the nth. In the second component mounting operation, the time (hereinafter referred to as “head arrival time”) Th when the head unit 22 arrives at the supply position P (n) is predicted (step S4). For example, when the supply position P (n) is set to the supply position PA, the shuttle arrival time Ts is later than the head arrival time Th, and the shuttle 43 is the supply position, as shown in the column (a) of FIG. The head unit 22 waits until it arrives at P (n), and then executes the reception of the component Wp. On the contrary, as shown in the column (c) of the figure, when the supply position P (n) approaches the transfer position Pt and the head arrival time Th is later than the shuttle arrival time Ts, the shuttle 43 moves to the supply position P ( The head unit 22 moves to the supply position P (n) in the state of waiting at n), and can receive the component Wp only after arriving there.

Therefore, the arithmetic processing unit 51 compares the shuttle arrival time Ts with the head arrival time Th (step S5). Then, when the head unit 22 is on standby (“YES” in step S5), the arithmetic processing unit 51 sets the receiving timing Tn of the component Wp at the supply position P (n) to the shuttle arrival time Ts, and stores the storage unit 51. On the other hand, when the shuttle 43 is on standby (“NO” in step S5), the receipt timing Tn of the component Wp at the supply position P (n) is set to the head arrival time Th. Then, it is temporarily stored in the storage unit 52 (step S7). In this way, the supply position P (n) and the reception timing Tn are associated with the count value k and stored in the storage unit 52 (FIG. 6).

When the receiving timing Tn is obtained in this way, the arithmetic processing unit 51 determines whether or not the supply position P exceeds the transfer position Pt (step S8). Then, while it is determined in step S8 that “NO”, that is, the supply position P (n) does not exceed the transfer position Pt, the arithmetic processing unit 51 increments the count value k by “1” (step S9). And the following equation P (n) = P0 + α (k-1)
However, α is a minute distance from the supply position P0 to the transfer position Pt.
The supply position P (n) is updated according to the above, the supply position P (n) is brought closer to the transfer position Pt (step S10), and then the process returns to step S3. Obtain the receiving timing Tn.

On the other hand, if "YES" is determined in step S8, the arithmetic processing unit is based on the supply position P (n) and the reception timing Tn (see FIG. 6) for each count value k stored in the storage unit 52 at this time. 51 obtains the count value k that is the earliest reception timing Tn among the reception timings stored in the storage unit 52, and determines the supply position P (n) corresponding to the count value k as the optimum supply position (step S11). ).

As described above, in the present embodiment, the supply position for supplying the component Wp from the supply device 4 to the mounting device 2 is adjusted, and the head unit 22 supplies the component Wp from the shuttle 43 of the supply device 4 at the adjusted supply position. receive. By optimizing the receiving timing in this way, the component Wp supplied from the wafer W can be efficiently mounted on the substrate B.

Further, in the present embodiment, since the supply position is optimized between the standard supply position P0 (position PA in FIG. 4) and the transfer position Pt, the standby time is reasonably shortened and the processing efficiency is improved. be able to. For example, as is clear from columns (a) and (b) of FIG. 4, the supply position is set to the standard supply position P0 (= PA) even when the head unit 22 is inevitably on standby when operating according to the mounting program. ) To the supply position PB on the shuttle side, the standby time of the head portion 22 can be shortened. Further, even if the shuttle 43 is inevitably on standby when operating according to the mounting program (for example, column (c) in the figure), the shuttle 43 is on standby by adjusting the supply position as in the case of the head standby described above. You can save time. Further, although not shown in FIG. 4, it is possible to maximize the processing efficiency by reducing the standby time to zero by adjusting the supply position so that the head portion 22 and the shuttle 43 arrive at substantially the same time.

Further, the control device 5 predicts the shuttle arrival time Ts and the head arrival time Th for each of the plurality of supply positions P (n) including the standard supply position P0, and adjusts the supply position based on them. Therefore, the supply position can be surely adjusted, and the receiving timing can be optimized with high accuracy.

Further, in the above embodiment, since the mounting turn is repeated, the number and arrangement status of the component Wp on the wafer W and the substrate B change as the mounting turn progresses. Regarding this point, according to the present embodiment, since the supply position is optimized for each mounting turn, the mounting turn can always be executed at the optimum supply position, and the efficiency of processing can be improved. ..

As described above, in the present embodiment, the shuttle 43 corresponds to an example of the "parts holding unit" of the present invention, and the wafer W corresponds to an example of the "parts supply unit" of the present invention. Further, the combination of the flip head 44 and the relay head 46 functions as the "part transfer unit" of the present invention, and the shuttle drive unit 48 functions as the "moving unit" of the present invention. Further, the supply position other than the standard supply position PA in the supply position P (n) corresponds to the "transfer position different from the standard supply position" of the present invention. Further, the shuttle arrival time Ts and the head arrival time Th correspond to an example of the "supply side arrival information" and the "mounting side arrival information" of the present invention, respectively. Further, the supply side movement step Ss3, the supply side movement step Sm1, and the component receiving step Sm2 correspond to examples of the "first step", "second step", and "third step" of the present invention, respectively, and the substrate side movement step. Sm3 and the component mounting step Sm4 correspond to an example of the "fourth step" of the present invention.

The present invention is not limited to the above embodiment, and various modifications can be made to the above as long as it does not deviate from the gist thereof. For example, in the above embodiment, the supply position is adjusted for each mounting turn, but the adjustment timing of the supply position is not limited to this. For example, every time the mounting turn is performed a plurality of times, the component mounting machine 1 is adjusted. The supply position may be adjusted for each operating time, each substrate B, and each wafer W.

Further, the supply position is adjusted by predicting the shuttle arrival time Ts and the head arrival time Th, but the shuttle side estimated time required for the shuttle 43 to arrive at the supply position and the head portion 22 arrive at the supply position. The estimated time on the head side required for the above may be used for adjusting the supply position. In this case, the shuttle side predicted time and the head side predicted time correspond to an example of the "supply side arrival information" and the "mounting side arrival information" of the present invention, respectively.

Further, in the above embodiment, the present invention is applied to the component mounting machine 1 having the supply device 4 that holds the component Wp supplied from the wafer W on the shuttle 43 and supplies the component Wp to the supply position. The application target of the present invention is not limited to this, and for example, as shown in FIG. 7, a component mounting machine 1 having a supply device 6 that holds a component PP on a pallet and supplies the component PP to a supply position is also an application target of the present invention. .. Hereinafter, the second embodiment of the present invention will be described with reference to FIGS. 7 to 9.

FIG. 7 is a plan view schematically showing a second embodiment of the component mounting machine according to the present invention. The major difference between the second embodiment and the first embodiment is that the pallet 61 holding the component PP is moved to the supply position, and the wafer accommodating device 3 and the supply device 4 in the first embodiment Instead, a supply device 6 for moving the pallet 61 holding the component PP to the supply position to supply the component is provided. The other configurations are basically the same as those in the first embodiment. Therefore, in the following description, the differences in the configuration will be mainly described, and the same configuration will be designated by the same reference numerals and the configuration description will be omitted.

Also in the component mounting machine 1 according to the second embodiment, as shown in FIG. 7, since two stages are provided, two supply devices 6 are arranged corresponding to each stage. That is, the supply devices 6 and 6 are arranged on the Y side in the width direction of the mounting positions P2 and P4. Since these two supply devices 6 are the same, only one of them will be described, and the other will be designated by the same reference numerals and the description thereof will be omitted.

The supply device 6 supplies a large package component PP such as a QFP (Quad Flat Package) or a BGA (Ball Grid Array) to the supply position. The pallet 61 used in the feeding device 6 is a flat thin dish-shaped member with an open upper portion, and is made of a magnetic metal material such as stainless steel. Then, as shown in FIG. 7, the tray 62 is arranged on the pallet 61 in a state where the component PP is placed. In this way, the component PP is held on the pallet 61 via the tray 62. As described above, in the present embodiment, the pallet 61 corresponds to an example of the "parts holding portion" of the present invention, and the pallet accommodating portion provided inside the supply device 6 while holding the parts PP (not shown). Is housed in.

The supply device 6 is provided with a pallet drive unit 63 for reciprocating the pallet 61 between the pallet accommodating unit and the supply position. The pallet drive unit 63 is electrically connected to the control device 5, and the pallet 61 is moved from the pallet accommodating unit to the mounting device 2 side, that is, in the (−Y) direction in FIG. 7, in response to a drive command from the control device 5. It is possible to move it to the side and position it at the standard supply position P0, and conversely move it to the (+ Y) direction side to return it from the supply position to the pallet accommodating portion.

Here, in the component mounting machine 1 in which the pallet 61 is pulled out from the pallet accommodating portion to supply the component PP, the pallet 61 is conventionally set to the preset standard supply position P0 as shown in the column (a) of FIG. The head unit 22 stands by at the standard supply position P0 until it moves. In particular, since the pallet 61 often holds a large package component PP, it is difficult to move the pallet 61 at a high speed, and the pallet 61 usually moves at a lower speed than the head portion 22. Therefore, it takes a relatively long time for the head unit 22 to receive the first component PP from the pallet 61 and execute the first component mounting operation.

However, as in the first embodiment, by adjusting the supply position according to the operation flow shown in FIG. 9, the standby time of the head unit 22 can be suppressed and the processing efficiency can be improved. The flow chart shown in FIG. 9 differs from the first embodiment in that the time when the pallet 61 arrives at the supply position P (n) instead of the shuttle arrival time Ts, that is, the pallet arrival time Tp is predicted. Only, and the others are basically the same as the operation flow shown in FIG.

When the optimum supply position PD (FIG. 7) is obtained based on such an operation flow, the head unit 22 may be configured to receive the component PP in a state where the pallet 61 is moved to the supply position PD and is stationary. .. As a result, for example, as shown in column (b) of FIG. 8, the waiting time of the head portion 22 that occurs in the first component mounting operation is significantly reduced. As a result, the time required for a series of operations including moving the pallet 61 to the supply position, receiving the component PP by the head portion 22 at the supply position, and mounting the component PP on the substrate B can be determined by the conventional technique (in the figure). Compared with (column (a)), it can be significantly reduced and the processing efficiency can be improved. The position where the pallet 61 is stationary and functions as the supply position between the pallet accommodating portion and the standard supply position P0 corresponds to an example of the "stationary position" of the present invention.

Further, after the component receiving step Sm2 in the first component mounting operation is completed, the second component supply operation can be started immediately. Therefore, in the present embodiment, the movement of the pallet 61 to the supply position P0 is restarted immediately after the component receiving step Sm2, and the pallet movement to the supply position P0 is performed in the board-side movement step Sm3 and the component mounting in the first component mounting operation. It is performed in parallel with step Sm4. Therefore, for example, as shown in column (b) of FIG. 8, the pallet 61 is supplied to the supply position at the same time as the movement of the head portion 22 to the supply position P0 (supply side movement step Sm1) in the second component mounting operation is completed. It can be positioned at P0. Further, even if the head portion 22 arrives at the supply position P0 by the time the movement of the pallet 61 to the supply position P0 is completed, the standby time is significantly reduced. As a result, the processing efficiency can be further improved. The pallet movement restart timing may be arbitrary during the board-side movement step Sm3 and the component mounting step Sm4 in the first component mounting operation, and is parallel to the board-side moving step Sm3 and the component mounting step Sm4. The pallet 61 can be moved.

Further, after the pallet 61 reaches the standard supply position P0, there is no standby of the head portion 22 at the supply position P0, and the distance between the supply position P0 and the mounting position is minimized, so that the processing efficiency is high. Parts can be mounted with.

In the column (b) of FIG. 8, the pallet 61 has reached the supply position P0 by the first and second component supply operations, but the pallet 61 is in the supply position by performing the component supply operation three or more times. When P0 is reached, the present invention can be applied in the same manner, and the same effect can be obtained.

Further, in the second embodiment, the supply position is adjusted by predicting the pallet arrival time Tp and the head arrival time Th, but the pallet side predicted time required for the pallet 61 to arrive at the supply position and the head portion 22 The head-side predicted time required for the to arrive at the supply position may be used for adjusting the supply position. In this case, the pallet side predicted time and the head side predicted time correspond to an example of the "supply side arrival information" and the "mounting side arrival information" of the present invention, respectively. Further, the first component mounting operation corresponds to an example of the "first component mounting operation after starting the movement of the pallet" of the present invention.

In the first embodiment, the shuttle 43 and the second embodiment supply the parts to the supply position by the pallet 61, but the configuration of the parts holding portion for holding the parts is not limited to these, for example, the parts. It may consist of a station that holds and moves.

In the present invention, the component holding unit for holding the component and the head unit for mounting the component are moved to the supply position, and after the head unit receives the component from the component holding unit, the component is moved above the substrate to move the component to the substrate. It can be applied to all component mounting technologies to be mounted.

1 ... Parts mounting machine 2 ... Mounting device 4, 6 ... Supply device 5 ... Control device 43, 43a to 43d ... Shuttle (parts holding unit)
44 ... Flip head (part transfer part)
46 ... Relay head (part transfer part)
48 ... Shuttle drive unit (moving unit)
61 ... Pallet 63 ... Pallet drive unit (moving unit)
B ... Substrate P0 ... (Standard) Supply position PA, PB, PC, PD ... Supply position PP, Wp ... Parts W ... Wafer (Parts supply unit)

Claims (5)

A supply device that moves the component holding unit that holds the component to the supply position and supplies the component at the supply position.
A component mounting operation is executed in which the head unit moves to the supply position, receives the component from the component holding unit located at the supply position, and then moves above the board to mount the component on the board. Mounting device and
It is provided with a control device that controls the supply device and the mounting device after adjusting the supply position so that the head unit receives the parts from the parts holding unit .
A standard supply position is set as the supply position,
The supply device includes a component supply unit having the component, a component transfer unit that transfers the component from the component supply unit to the component holding unit at a transfer position different from the standard supply position, and the transfer unit. It has a moving unit that reciprocates the component holding unit between the position and the supply position.
The control device is
For each of at least one or more supply positions different from the standard supply position and each of the standard supply positions, the arrival time or the time required for the component holding unit to the supply position is predicted as the supply side arrival information. The arrival time of the head unit to the supply position or the time required for arrival is predicted as arrival information on the mounting side, and the arrival time is predicted.
A component mounting machine characterized in that the supply position is adjusted between the standard supply position and the transfer position based on the supply side arrival information and the mounting side arrival information. A supply device that moves the component holding unit that holds the component to the supply position and supplies the component at the supply position.
A component mounting operation is executed in which the head unit moves to the supply position, receives the component from the component holding unit located at the supply position, and then moves above the board to mount the component on the board. Mounting device and
It is provided with a control device that controls the supply device and the mounting device after adjusting the supply position so that the head unit receives the parts from the parts holding unit.
A standard supply position is set as the supply position,
The mounting device repeatedly performs the component mounting operation,
The component holding portion is a pallet on which the component is mounted.
The supply device has a pallet accommodating portion for accommodating the pallet at a position different from the standard supply position, and a moving unit for reciprocating the pallet between the pallet accommodating portion and the standard supply position. ,
The control device is
For each of at least one or more supply positions different from the standard supply position and each of the standard supply positions, the arrival time or the time required for the component holding unit to the supply position is predicted as the supply side arrival information. The arrival time of the head unit to the supply position or the time required for arrival is predicted as arrival information on the mounting side, and the arrival time is predicted.
The standard supply position to perform the first component mounting operation after starting the movement of the pallet from the pallet housing to the standard supply position based on the supply side arrival information and the mounting side arrival information. A component mounting machine characterized in that the pallet is stationary between the pallet and the pallet accommodating portion, and the head portion receives the component from the pallet with the stationary position of the pallet as the supply position. The component mounting machine according to claim 2.
Among the first component mounting operations, the control device includes an operation in which the head portion that receives the component from the pallet moves above the substrate and an operation in which the head portion mounts the component on the substrate. A component mounting machine that resumes the movement of the pallet to the standard supply position while one is being executed. The first step of moving the component holding part that holds the component to the supply position by the supply device, and
The second step of moving the head portion to the supply position and
A third step of receiving the component from the component holding portion by the head portion in a state where the component holding portion and the head portion are located at the supply position, and a third step.
The head portion that has received the component from the component holding portion is moved from the supply position to the upper side of the substrate, and the head portion is provided with a fourth step of mounting the component on the substrate.
The supply device includes a component supply unit having the component, a component transfer unit that transfers the component from the component supply unit to the component holding unit at a transfer position different from the standard supply position, and the transfer unit. It has a moving unit that reciprocates the component holding unit between the position and the supply position.
A standard supply position is set as the supply position,
For each of at least one or more supply positions different from the standard supply position and each of the standard supply positions, the arrival time or the time required for the component holding unit to the supply position is predicted as the supply side arrival information. The arrival time of the head unit to the supply position or the time required for arrival is predicted as arrival information on the mounting side, and the arrival time is predicted.
After adjusting the supply position between the standard supply position and the transfer position based on the supply side arrival information and the mounting side arrival information, the first step to the fourth step is executed. Characteristic component mounting method. The first step of moving the component holding part that holds the component to the supply position by the supply device, and
The second step of moving the head portion of the mounting device to the supply position, and
A third step of receiving the component from the component holding portion by the head portion in a state where the component holding portion and the head portion are located at the supply position, and a third step.
The head portion that has received the component from the component holding portion is moved from the supply position to the upper side of the substrate, and the head portion is provided with a fourth step of mounting the component on the substrate.
A standard supply position is set as the supply position,
The mounting device repeatedly performs a component mounting operation including the second step, the third step, and the fourth step.
The component holding portion is a pallet on which the component is mounted.
The supply device has a pallet accommodating portion for accommodating the pallet at a position different from the standard supply position, and a moving unit for reciprocating the pallet between the pallet accommodating portion and the standard supply position. ,
The control device is
For each of at least one or more supply positions different from the standard supply position and each of the standard supply positions, the arrival time or the time required for the component holding unit to the supply position is predicted as the supply side arrival information. The arrival time of the head unit to the supply position or the time required for arrival is predicted as arrival information on the mounting side, and the arrival time is predicted.
The standard supply position to perform the first component mounting operation after starting the movement of the pallet from the pallet housing to the standard supply position based on the supply side arrival information and the mounting side arrival information. A component characterized in that the pallet is stationary between the pallet and the pallet accommodating portion, and the head portion receives the component from the pallet with the stationary position of the pallet as the supply position. Implementation method.

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