JP4715726B2 - Electronic component mounting method - Google Patents

Description

The present invention relates to electronic component mounting method electrodeposition using a pallet accommodating the electronic components of plural varieties.

In the field of mounting electronic components on a substrate, it is required to continuously supply the electronic components without cutting them for the purpose of improving production efficiency. For this reason, various parts feeders containing a plurality of electronic components are used in the electronic component mounting apparatus. Among them, a tray feeder in which electronic components are stored in a flat form in a tray is used for handling relatively large electronic components. There is something called. The tray feeder stacks a plurality of trays placed on one pallet and stores them in a magazine, and alternately pulls out the pallets on which the trays containing the electronic components to be mounted are placed from the magazine to the component supply table (Refer patent document 1).
JP 2004-335951 A

  The tray feeder configured as described above performs an operation of exchanging with a pallet containing electronic components of the same type when a component is cut off in the pallet drawn to the component supply table. Since the supply of electronic components is stopped while the pallet is being replaced, the mounting operation is temporarily suspended, leading to a reduction in production efficiency. In recent years, a pallet often stores different types of electronic components in a plurality of trays. As a result, the number of electronic components per product has been reduced. It is easy for parts to run out during mounting. Therefore, the pallet replacement work is frequently performed, and the production operation is further reduced by temporarily stopping the mounting operation each time.

Accordingly, the present invention aims at providing a Ru electronic component mounting method can reduce the frequency of pallet change.

The electronic component mounting method of the present invention includes a substrate transfer means for transferring a substrate and holding it at a predetermined position, a pallet supply means for storing a plurality of pallets containing a plurality of types of electronic components, the substrate transfer means and the pallet. The pallet holding means that is provided between the supply means and holds the pallet taken out from the pallet supply means, and a horizontal movement mechanism that is a set of a first movement mechanism and a second movement mechanism that are orthogonal to each other. A mounting head having a nozzle that moves between a pallet holding unit and the substrate transport unit, picks up electronic components for each product type from the pallet held by the pallet holding unit, and mounts them on a substrate; and the pallet supply unit; Electronic component mounting using an electronic component mounting apparatus comprising: pallet replacement means for replacing the pallet with the pallet holding means And when all of the electronic components of the product type are used up during mounting of the electronic product of a certain product type among the plurality of electronic components stored in the pallet held by the pallet holding means, the electronic product of the product type When the mounting of the other kinds of electronic components in all parts of the board is finished, the pallet holding means is temporarily suspended. The pallet held in the pallet is replaced with a pallet that stores the electronic component of the same type as the electronic component of the suspended type, and the mounting of the electronic component of the temporarily suspended type is resumed, When the mounting of the electronic component at the location is finished, the board is taken out.

  According to the present invention, when all the electronic components of the product type are used up during the mounting of the electronic product of a certain product type among the plurality of electronic components stored in the pallet held by the pallet holding means, the electronic product of the product type is used. Since the mounting operation is temporarily suspended and the mounting operation is shifted to mounting other types of electronic components stored in the pallet, it is possible to reduce the number and time of mounting operation interruptions associated with pallet replacement work. The production efficiency can be improved.

  Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of the electronic component mounting apparatus of the present embodiment, FIG. 2 is a plan view of the electronic component mounting apparatus of the present embodiment, and FIGS. 3 and 4 are mounting operations in the electronic component mounting apparatus of the present embodiment. It is explanatory drawing which shows.

First, the configuration and operation of the electronic component mounting apparatus will be described. 1 and 2, an electronic component mounting apparatus 1 includes a base 2, a board transfer device 3, an electronic component supply device 4, a horizontal movement device 5, imaging devices 6, 7, and 8, and a mounting head 9. And the control unit 10. The substrate transport device 3 as a substrate transport means has a function of transporting the substrate W and a function of holding it at a predetermined position. The substrate W before mounting is carried into the electronic component mounting apparatus 1 and is predetermined during mounting. The state held at the position is maintained, and after mounting, the holding of the substrate W is released and the electronic component mounting apparatus 1 is carried out. The electronic component supply device 4 has a function of supplying electronic components of a type to be mounted to a component supply stage, that is, a pickup position by the mounting head 9, and includes a pallet supply device 11 as pallet supply means and a pallet as pallet replacement means. The exchanging device 12 includes a pallet holding device 13 as a pallet holding means provided between the substrate transfer device 3 and the pallet exchanging device 12 . The pallet supply device 11 includes a pallet lifter 15 that stores and stores a plurality of flat pallets 14, and positions an arbitrary pallet 14 at a predetermined height by an elevating function of the pallet lifter 15. On each pallet 14, a plurality of trays 16 storing electronic components for each type are placed.

The pallet holding device 13 has a function of holding one pallet 14 horizontally, and forms a component supply stage in which pickup is performed by the mounting head 9. The pallet exchanging device 12 has a function of exchanging the pallet 14 between the pallet supplying device 11 and the pallet holding device 13, and a function of pushing the pallet 14 positioned at a predetermined height from the pallet lifter 15 in the horizontal direction. And a clamp 12b having a function of gripping the pallet 14. The pallet 14 is exchanged by holding the pallet 14 held by the pallet holding device 13 with the clamp 12b, returning it to the pallet lifter 15, and pushing out another pallet 14 by the pusher 12a and delivering it to the pallet holding device 13. . By repeatedly performing this replacement operation, a desired type of electronic component is supplied to the component supply stage.

  The horizontal moving device 5 has three first moving mechanisms 5a, 5b, and 5c whose moving direction is the transport direction of the substrate W, and three that are orthogonal to the first moving mechanisms 5a, 5b, and 5c. Each of the two moving mechanisms 5d, 5e, and 5f is composed of three sets of horizontal moving mechanisms. As these moving mechanisms 5a, 5b, 5c, 5d, 5e, and 5f, a linear motion mechanism such as a linear motor mechanism can be used in addition to the illustrated feed screw mechanism. The clamp 12b of the pallet exchanging device 12 is provided in the first moving mechanism 5c, moves between the pallet supply device 11 and the pallet holding device 13 by driving the second moving mechanism 5f, and is held by the pallet holding device 13. Return the pallet 14 to the pallet lifter 15. The first imaging device 6 is provided in the first moving mechanism 5 c, moves above the pallet 14 by driving the first moving mechanism 5 c and the second moving mechanism 5 f, and is stored in the tray 16. An arbitrary electronic component is imaged.

  The mounting head 9 is provided on the first moving mechanism 5b so as to be horizontally movable, and is moved between the pallet holding device 13 and the substrate transfer device 3 by driving the first moving mechanism 5b and the second moving mechanism 5e. An optional electronic component is picked up and picked up from the pallet 14 by the nozzle 17 provided on the pallet 14 and mounted on the mounting position of the substrate W. A second imaging device 7 is disposed in the movement path of the mounting head 9 and images the picked-up electronic component from below. Therefore, the mounting head 9 picks up based on the position of the electronic component imaged by the first imaging device 6, and implements the mounting position and the angle based on the position and angle of the electronic component imaged by the second imaging device 7. Mounting is performed after correcting the mounting angle. Various nozzles 17 corresponding to the sizes of the electronic components are stored in the nozzle stocker 18 disposed in the movement path of the mounting head 9, and are exchanged for the types of nozzles 17 corresponding to the sizes of the electronic components to be mounted. While mounted on the mounting head 9.

  The control unit 10 controls the mounting operation in the electronic component mounting apparatus 1 by the electronic component mounting method described below. In FIG. 1, four trays 16 are placed on a pallet 14 held by a pallet holding device 13, and a plurality of electronic components A, B, and C of different varieties are stored in each tray 16a, 16b, and 16c. ing. In FIG. 2, trays 16a, 16b, and 16c are similarly placed on each pallet 14 stored in the pallet lifter 15. In FIG. 1, the substrate W carried into the electronic component mounting apparatus 1 and held at a predetermined position by the substrate transport apparatus 3 is formed in 12 sections of 2 rows × 6 columns as shown in FIG. Each compartment is provided with a space (mounting location) for mounting one electronic component A, B, C one by one. In FIG. 3B, the electronic component A is first mounted. When all of the electronic components A stored in the tray 16a are used up when the mounting at the six locations is completed, the mounting at the remaining six mounting locations is temporarily suspended, and the processing shifts to the mounting of the electronic component B. Since the electronic component B is larger than the electronic component A, the nozzle 17 mounted on the mounting head 9 is replaced with a nozzle corresponding to the electronic component B. In FIG. 3C, the electronic component B is mounted. When all of the electronic components B stored in the tray 16b are used up when the mounting is completed at nine locations, the mounting at the remaining three mounting locations is temporarily suspended, and the processing shifts to mounting of the electronic component C. Since the electronic component C is smaller in size than the electronic component B, the nozzle mounted on the mounting head 9 is replaced with a nozzle corresponding to the electronic component C.

In FIG. 4A, the electronic component C is mounted. When all of the electronic components C stored in the tray 16c are not used at the time when the mounting is completed in all 12 places, the remaining number of the electronic components C together with the ID of the pallet 14 on which the tray 16c is placed is obtained. It is stored in the storage area 10 a of the control unit 10. At this time, the electronic components A and B to be mounted on the unmounted portion of the substrate W are not present on the pallet 14 and the unmounted portion is not present on the substrate W for the electronic component C. It is impossible to continue the implementation operation. Therefore, in FIG. 4A , in order to resume the mounting of the electronic parts A and B that have been temporarily suspended, the pallet 14 that is held by the pallet holding device 13 and used up as described above is used. Return to pallet lifter 15 and replace with another pallet 14. The storage area 10a serving as the storage means stores the remaining number of electronic components A, B, and C for each pallet, and the unmounted portion of the substrate W (in the present embodiment, the electronic component A has 6 components). The electronic component B is replaced with a pallet 14 containing more electronic components A and B.

  When resuming the mounting of the electronic components A and B, the electronic component B is mounted after the electronic component A is first mounted in the same manner as the mounting before the temporary suspension, and the electronic components A, B, When the mounting of C is finished, the board is unloaded from the electronic component mounting apparatus 1 and the board W before mounting is loaded. At this time, since the mounting head 9 is mounted with the nozzle 17 corresponding to the electronic component B last mounted on the previous substrate W, it is mounted from the electronic component B on the newly loaded substrate W. To start. In this way, by changing the mounting order so that mounting is performed from a variety of electronic components that can be mounted with the same nozzle 17, the number of replacements of the nozzle 17 can be reduced, leading to an improvement in mounting efficiency. When a large number of nozzles 17 can be mounted on the mounting head 9, it is possible to eliminate the need for nozzle replacement by mounting the nozzles 17 corresponding to the electronic components A, B, and C. it can. In addition, depending on the types of electronic components A, B, and C, the sizes may be approximately the same. In this case, a plurality of types of electronic components can be mounted without replacing the nozzle.

  As described above, in the electronic component mounting apparatus 1 according to the present embodiment, all of the various types of electronic components are mounted during the mounting of a certain type of electronic components among a plurality of types of electronic components stored in the pallet 14 held by the pallet holding device 13. When all the electronic parts are used up, the mounting of the electronic parts of the corresponding type is temporarily interrupted, and the mounting operation can be performed without replacing the pallet as much as possible by shifting to mounting of the electronic parts of other types stored in the same pallet 14. It is controlled so that it can continue. As a result, it is possible to reduce the number of interruptions and the interruption time of the mounting operation associated with the pallet replacement work, and to improve the production efficiency.

  According to the present invention, when all the electronic components of the product type are used up during the mounting of the electronic product of a certain product type among the plurality of electronic components stored in the pallet held by the pallet holding means, the electronic product of the product type is used. Since the mounting operation is temporarily suspended and the mounting operation is shifted to mounting other types of electronic components stored in the pallet, it is possible to reduce the number and time of mounting operation interruptions associated with pallet replacement work. It has the advantage that production efficiency can be improved, and is particularly useful in the field of mounting a wide variety of electronic components on a substrate.

The top view of the electronic component mounting apparatus of this Embodiment The top view of the electronic component mounting apparatus of this Embodiment Explanatory drawing which shows the mounting operation in the electronic component mounting apparatus of this Embodiment Explanatory drawing which shows the mounting operation in the electronic component mounting apparatus of this Embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Board | substrate conveyance apparatus 9 Mounting head 10a Storage area 11 Pallet supply apparatus 12 Pallet exchange apparatus 13 Pallet holding apparatus 14 Pallet 17 Nozzle W board

Claims (1)

A substrate transfer means for transferring a substrate and holding it in a predetermined position; a pallet supply means for storing a plurality of pallets containing a plurality of types of electronic components; and the substrate transfer means provided between the substrate transfer means and the pallet supply means. A pallet holding means for holding the pallet taken out from the pallet supply means, and a horizontal moving mechanism in which a first moving mechanism and a second moving mechanism that are orthogonal to each other are set as one set, the pallet holding means and the substrate transfer means A mounting head having a nozzle for picking up electronic components for each product type from the pallet held by the pallet holding means and mounting them on a substrate; and between the pallet supply means and the pallet holding means An electronic component mounting method using an electronic component mounting apparatus comprising a pallet replacement means for replacing a pallet,
If all of the electronic components of the product type are used up while mounting the electronic product of a certain product type among the multiple types of electronic components stored in the pallet held by the pallet holding means, the mounting of the electronic product of the product type is temporarily suspended. Then, the process shifts to mounting of other types of electronic components housed in the pallet, and when mounting of the other types of electronic components to all locations on the board is completed, the pallet holding means holds the Replacing the pallet with a pallet that stores the electronic component of the same type and the electronic component of the same type, and restarting the mounting of the electronic component of the type temporarily suspended, An electronic component mounting method for unloading the board after mounting.

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