JP6941103B2 - 半導体用途のための機械学習ベースのモデルの加速トレーニング - Google Patents
半導体用途のための機械学習ベースのモデルの加速トレーニング Download PDFInfo
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- JP6941103B2 JP6941103B2 JP2018534670A JP2018534670A JP6941103B2 JP 6941103 B2 JP6941103 B2 JP 6941103B2 JP 2018534670 A JP2018534670 A JP 2018534670A JP 2018534670 A JP2018534670 A JP 2018534670A JP 6941103 B2 JP6941103 B2 JP 6941103B2
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
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- G06N3/045—Combinations of networks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
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- G—PHYSICS
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- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/12—Circuits of general importance; Signal processing
- G01N2201/129—Using chemometrical methods
- G01N2201/1296—Using chemometrical methods using neural networks
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- G—PHYSICS
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
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- G—PHYSICS
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20084—Artificial neural networks [ANN]
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- G—PHYSICS
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- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/06—Recognition of objects for industrial automation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Data Mining & Analysis (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Computing Systems (AREA)
- Mathematical Physics (AREA)
- Molecular Biology (AREA)
- Computational Linguistics (AREA)
- Biophysics (AREA)
- Biomedical Technology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Probability & Statistics with Applications (AREA)
- Quality & Reliability (AREA)
- Evolutionary Biology (AREA)
- Bioinformatics & Computational Biology (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Medical Informatics (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562273985P | 2015-12-31 | 2015-12-31 | |
| US62/273,985 | 2015-12-31 | ||
| US15/394,792 | 2016-12-29 | ||
| US15/394,792 US9916965B2 (en) | 2015-12-31 | 2016-12-29 | Hybrid inspectors |
| PCT/US2016/069580 WO2017117568A1 (en) | 2015-12-31 | 2016-12-30 | Accelerated training of a machine learning based model for semiconductor applications |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019508789A JP2019508789A (ja) | 2019-03-28 |
| JP2019508789A5 JP2019508789A5 (https=) | 2020-02-13 |
| JP6941103B2 true JP6941103B2 (ja) | 2021-09-29 |
Family
ID=59225974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018534670A Active JP6941103B2 (ja) | 2015-12-31 | 2016-12-30 | 半導体用途のための機械学習ベースのモデルの加速トレーニング |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP3398123B1 (https=) |
| JP (1) | JP6941103B2 (https=) |
| KR (1) | KR102812577B1 (https=) |
| CN (1) | CN108475351B (https=) |
| IL (1) | IL259705B (https=) |
| WO (1) | WO2017117568A1 (https=) |
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| US10969773B2 (en) | 2018-03-13 | 2021-04-06 | Applied Materials, Inc. | Machine learning systems for monitoring of semiconductor processing |
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| DE102018207880A1 (de) | 2018-05-18 | 2019-11-21 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum Bewerten einer unbekannten Auswirkung von Defekten eines Elements eines Photolithographieprozesses |
| DE102018207882A1 (de) | 2018-05-18 | 2019-11-21 | Carl Zeiss Smt Gmbh | Vorrichtung und Verfahren zur Analyse eines Elements eines Photolithographieprozesses mit Hilfe eines Transformationsmodells |
| DE102018209562B3 (de) * | 2018-06-14 | 2019-12-12 | Carl Zeiss Smt Gmbh | Vorrichtungen und Verfahren zur Untersuchung und/oder Bearbeitung eines Elements für die Photolithographie |
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| DE102018211099B4 (de) | 2018-07-05 | 2020-06-18 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum Bewerten eines statistisch verteilten Messwertes beim Untersuchen eines Elements eines Photolithographieprozesses |
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| US11816411B2 (en) * | 2020-01-29 | 2023-11-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for semiconductor wafer defect review |
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2016
- 2016-12-30 EP EP16882778.0A patent/EP3398123B1/en active Active
- 2016-12-30 KR KR1020187021817A patent/KR102812577B1/ko active Active
- 2016-12-30 WO PCT/US2016/069580 patent/WO2017117568A1/en not_active Ceased
- 2016-12-30 JP JP2018534670A patent/JP6941103B2/ja active Active
- 2016-12-30 CN CN201680075625.1A patent/CN108475351B/zh active Active
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| Publication number | Publication date |
|---|---|
| KR102812577B1 (ko) | 2025-05-23 |
| WO2017117568A1 (en) | 2017-07-06 |
| EP3398123B1 (en) | 2025-03-12 |
| CN108475351B (zh) | 2022-10-04 |
| KR20180090385A (ko) | 2018-08-10 |
| CN108475351A (zh) | 2018-08-31 |
| IL259705B (en) | 2021-07-29 |
| EP3398123A4 (en) | 2019-08-28 |
| JP2019508789A (ja) | 2019-03-28 |
| IL259705A (en) | 2018-07-31 |
| EP3398123A1 (en) | 2018-11-07 |
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