JP6918583B2 - Inspection equipment, mounting equipment, inspection method - Google Patents

Description

The present invention relates to an inspection device, a mounting device, and an inspection method for inspecting whether or not a component is mounted on a substrate.

As a mounting device, an image pickup device mounted on a mounting head is used to provide an inspection device for inspecting whether or not a component is mounted on a substrate (see, for example, Patent Document 1). In the inspection device described in Patent Document 1, the mounting surface on the board is imaged before and after mounting the component, and the difference image between the pre-mounting image and the post-mounting image is obtained, so that the component is mounted in the mounting area of the board. It is inspected whether or not it is present. In such an inspection using the difference image before and after mounting, the difference in the parts other than the parts may have an influence. For this reason, noise cut is usually applied to the difference image in order to remove the peripheral noise of the component.

Japanese Unexamined Patent Publication No. 2014-110335

By the way, when the pre-mounting image and the post-mounting image of the component are imaged, there is a considerable difference even in a place other than the component due to blurring at the time of imaging. When the size of the part is large, the influence is small, but in recent years, the size of the part tends to be miniaturized. If the size of the part is small, the effect is relatively large. For example, for fine chip parts such as 0608 and 0402 (horizontal size 0.4 mm, vertical size 0.2 mm), the ratio of the difference between the parts to the entire difference image is small, and the threshold value for the presence or absence of the difference is also small. It gets smaller. For this reason, the threshold value may be exceeded by the difference other than the components, and it may be erroneously determined that the components are mounted even though the components are not mounted on the mounting surface of the board.

The present invention has been made in view of the above points, and an object of the present invention is to provide an inspection device, a mounting device, and an inspection method capable of inspecting the presence or absence of mounting of a component on a substrate with high accuracy by a simple process. I will do it.

Inspection device according to one embodiment of the present invention, the inspection of the first, mounted absence of the component relative to the substrate from the second image (before mounting image and mounted after image) captured before and after mounting process of parts against the base plate A difference image generation unit that generates a difference image from the first and second images, a difference area extraction unit that extracts a difference area including a difference pixel from the difference image, and the difference area. a noise determination unit that determines the noise component from the area size and the component size, the noise removing unit for removing the noise component and the determined difference region from the difference image, mounting the presence or absence of the component based on the previous SL difference image The determination unit includes the difference region extraction unit, the noise determination unit, and the noise removal unit when the evaluation value of the difference image is equal to or higher than the upper limit threshold value in the first determination. Regardless of the processing result by the unit, it is determined that the component is mounted on the substrate, and in the first determination, when the evaluation value of the difference image is equal to or less than the lower limit threshold, the difference region extraction unit, Regardless of the processing result by the noise discriminating unit and the noise removing unit, it is determined that the component is not mounted on the substrate, and in the first determination, the evaluation value of the difference image is the upper limit threshold value. When it is smaller and larger than the lower limit threshold, the presence or absence of the component is based on the difference image from which the noise component is removed according to the processing result by the difference region extraction unit, the noise discrimination unit, and the noise removal unit. A second determination is made to re-determine .

Inspection method of one embodiment of the present invention, the inspection of the first, mounted absence of the component relative to the substrate from the second image (before mounting image and mounted after image) captured before and after mounting process of parts against the base plate In this inspection method, the difference image generation unit generates a difference image from the first and second images, and the difference area extraction unit extracts a difference region including a difference pixel from the difference image. A step, a step of discriminating the noise component from the area size and the component size of the difference region by the noise discriminating unit, and a step of removing the difference region determined to be the noise component from the difference image by the noise removing unit. before SL and a determining mounting presence of the component based on the difference image, and in the determining step, the first determination, the evaluation value of the difference image in the case of more than the upper threshold, the difference area Regardless of the processing results of the extraction unit, the noise determination unit, and the noise removal unit, it is determined that the component is mounted on the substrate, and in the first determination, the evaluation value of the difference image is determined. When it is equal to or less than the lower limit threshold, it is determined that the component is not mounted on the substrate regardless of the processing results by the difference region extraction unit, the noise determination unit, and the noise removal unit, and the first In the determination, when the evaluation value of the difference image is smaller than the upper limit threshold value and larger than the lower limit threshold value, the noise component is determined according to the processing results of the difference region extraction unit, the noise determination unit, and the noise removal unit. A second determination is made to redetermine the presence or absence of the component based on the difference image from which the above is removed .

According to these configurations, by comparing the area size of the difference area with the component size, it is determined whether the difference area included in the difference image is the difference due to the component or the noise component other than the component. Then, by removing the noise component from the difference image, only the difference region due to the component is left in the difference image. Therefore, it is possible to inspect with high accuracy whether or not the component is mounted on the substrate without being affected by noise components other than the component.

In the inspection device of one aspect of the present invention, the noise discriminating unit discriminates as a noise component if the vertical dimension or the horizontal dimension of the difference region is larger than the vertical dimension or the horizontal dimension of the component. According to this configuration, it is possible to determine whether the difference region is a difference due to a component or a noise component other than the component by comparing the vertical dimensions and the horizontal dimensions of the component and the difference region.

In the inspection device of one aspect of the present invention, when the area of the difference region is out of the permissible range, the noise discrimination unit discriminates the difference region as a noise component without comparing the vertical dimension and the horizontal dimension. According to this configuration, when the difference region is extremely large or extremely small, the load of the discrimination processing can be reduced by regarding the difference region as a noise component.

In the inspection device of one aspect of the present invention, the difference image includes a plurality of difference regions, and the difference region extraction unit has the same difference region as long as the interval between the plurality of difference regions is within a predetermined number of pixels. If the interval between the plurality of difference regions is larger than the predetermined number of pixels, they are extracted as separate difference regions. According to this configuration, even if the same portion is originally divided into a plurality of difference regions and appears in the difference image, the plurality of difference regions can be extracted as one difference region. Therefore, by combining the difference regions divided into a plurality of parts into one, it is possible to accurately determine whether the difference region is a difference due to a component or a noise component other than the component.

In the inspection device of one aspect of the present invention, the difference region extraction unit performs expansion processing and contraction processing on the difference image, and if the interval between the plurality of difference regions is within a predetermined pixel, the plurality of differences The regions are combined and extracted as one difference region. According to this configuration, a plurality of difference images whose regions are close to each other can be combined into one difference image by a simple process.

One aspect mounting apparatus of the present invention, the above-described inspection apparatus, a mounting head for mounting the component to the mounting surface, the first relating to before and after the mounting process of the component by the mounting head, the second characterized by comprising an imaging device for capturing an image. According to this arrangement, the mounting surface before and after the mounting process of the component by the mounting head by imaging device imaging, first, second image mounting errors of the component by the mounting head from (the mounting image before mounting after image) Can be detected immediately.

According to the present invention, by determining whether the difference region included in the difference image is a difference due to a component or a noise component other than the component from the area size of the difference region, the noise component is removed from the difference image and the component is mounted on the substrate. The presence or absence can be inspected with high accuracy.

It is a schematic diagram which shows the whole mounting apparatus of this embodiment. It is a schematic diagram which shows the periphery of the mounting head of this embodiment. It is a figure which shows an example of the difference image of the component of the comparative example. It is a block diagram of the inspection apparatus of this embodiment. It is a flowchart which shows an example of the inspection process of this embodiment. It is a figure which shows an example of the image before mounting and the image after mounting of the component of this embodiment. It is a figure which shows an example of the difference image of this embodiment. It is a figure which shows an example of the determination process of this embodiment. It is a figure which shows an example of the extraction process of the difference area of this embodiment. It is a figure which shows an example of the discrimination process of the noise component of this embodiment. It is a figure which shows an example of the noise component removal processing of this embodiment.

Hereinafter, the mounting device of the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a schematic view showing the entire mounting device of the present embodiment. FIG. 2 is a schematic view showing the periphery of the mounting head of the present embodiment. FIG. 3 is a diagram showing an example of a difference image of the parts of the comparative example. The mounting device of this embodiment is only an example, and can be changed as appropriate.

As shown in FIG. 1, the mounting device 1 is configured to mount the component P (see FIG. 2) supplied from the feeder 20 on the mounting surface of the substrate W by a pair of mounting heads 40. A wiring pattern, an electrode pad, or the like is provided on the surface of the substrate W, and a solder paste for joining to the terminal of the component P is adhered to the wiring pattern, the electrode pad, or the like in a subsequent reflow process. The substrate W may be any as long as the component P can be mounted, and the shape and type are not particularly limited. Further, although an IC chip will be described as an example of the component P, the component P is not particularly limited to an electronic component as long as it is a component mounted on the substrate W.

The mounting device 1 is provided with a substrate transport unit 10 that transports the substrate W in the X-axis direction. The substrate transport unit 10 forms a transport path with a pair of conveyor belts 11 for transporting the substrate W and a pair of guide rails 12 for guiding the transport of the substrate W along each conveyor belt 11. The conveyor belt 11 carries the board W before mounting the component from one end side in the X-axis direction below the mounting head 40 for positioning, and carries out the board W after mounting the component to the other end side in the X-axis direction. .. The upper part of the pair of guide rails 12 is bent inward (see FIG. 2). The elevating mechanism (not shown) raises the substrate W and the pair of conveyor belts 11 toward the bent portion, and positions the substrate W.

A tape reel 21 is detachably attached to the feeder 20, and a carrier tape in which a large number of parts P are packaged is wound around the tape reel 21. The feeder 20 pays out the parts P in order toward the delivery position picked up by the mounting head 40 by the rotation of the sprocket wheel in the apparatus. At the delivery position of the mounting head 40, the cover tape on the surface is peeled off from the carrier tape, and the component P in the pocket of the carrier tape is exposed to the outside. In the present embodiment, the tape feeder is illustrated as the feeder, but it may be composed of another feeder such as a ball feeder.

A moving mechanism 30 for horizontally moving the pair of mounting heads 40 in the X-axis direction and the Y-axis direction is provided on the base. The moving mechanism 30 has a pair of Y-axis drive units 31 extending in the Y-axis direction and a pair of X-axis drive units 32 extending in the X-axis direction. The pair of Y-axis drive units 31 are supported by support units (not shown) erected at the four corners of the base, and the pair of X-axis drive units 32 can move to the pair of Y-axis drive units 31 in the Y-axis direction. It is installed in. Further, a mounting head 40 is movably installed on each X-axis drive unit 32 in the X-axis direction, and the mounting head 40 is horizontally moved by the X-axis drive unit 32 and the Y-axis drive unit 31 to be picked up from the feeder 20. The resulting component is mounted at a desired position on the substrate W.

As shown in FIG. 2, the mounting head 40 is configured by providing a plurality of nozzles 42 (only one is shown in the present embodiment) on the head main body 41 supported by the X-axis drive unit 32 (see FIG. 1). ing. Each nozzle 42 is supported by the head body 41 via the nozzle drive unit 43, and is moved up and down in the Z-axis direction by the nozzle drive unit 43 and rotates the nozzle 42 around the Z-axis. Each nozzle 42 is connected to a suction source (not shown), and the component P is sucked and held by the suction force from the suction source. A coil spring is provided on the nozzle 42, and a component P attracted to the nozzle 42 is mounted on the substrate W while contracting the coil spring.

The head body 41 is provided with a height sensor (not shown) for detecting the height from the substrate W and a recognition unit 45 for recognizing the shape of the component P attracted by the nozzle 42. The height sensor detects the distance from the substrate W to the nozzle 42, and controls the amount of movement of the nozzle 42 in the vertical direction based on the detection result. In the recognition unit 45, the light emitting units 46 arranged in a horizontal row and the light receiving unit 47 are opposed to each other in the horizontal direction, and the component shape is recognized from the change in the light shielding width in which the light from the light emitting unit 46 is blocked by the component. The recognition unit 45 may recognize the shape of the component from the light-shielding width of the LED light emitted from the light-emitting unit toward the light-receiving unit, or the light-shielding width of the laser light emitted from the light-emitting unit toward the light-receiving unit. The part shape may be recognized from.

The head body 41 includes a substrate imaging unit (not shown) that images the BOC mark on the substrate W from directly above, and a component imaging unit (imaging device) 48 that images the mounting operation of the component P by the nozzle 42 from diagonally above. Is provided. The substrate imaging unit recognizes the position, warpage, etc. of the substrate W based on the captured image of the BOC mark, and corrects the mounting position of the component P with respect to the substrate W based on these recognition results. In the component imaging unit 48, in addition to imaging before and after the component P is attracted to the feeder 20, the component P is imaged before and after mounting the component P on the mounting surface of the substrate W. These captured images are inspected for the presence or absence of adsorption of the component P by the nozzle 42 and the presence or absence of the component P mounted on the substrate W.

Further, the mounting device 1 is provided with a control device 50 that controls each part of the device in an integrated manner, and an inspection device 60 that inspects whether or not the component P is attracted by the nozzle 42 and whether or not the component P is mounted on the substrate W. Each part of these devices is composed of a processor, a memory, and the like that execute various processes. The memory is composed of one or a plurality of storage media such as ROM (Read Only Memory) and RAM (Random Access Memory) depending on the application, and the control program of the mounting device 1 and the inspection device 60 are provided with an inspection method. Various parameters such as an inspection program for execution and a determination threshold for whether or not the component P is mounted are stored.

In the mounting device 1 configured in this way, the mounting head 40 is moved to the feeder 20 (see FIG. 1), the component P supplied from the feeder 20 is picked up by the nozzle 42, and the desired mounting surface of the substrate W is mounted. The component P is mounted on the. In the mounting operation of the component P by the nozzle 42, the mounting of the component P on the substrate W may fail, and the component P may not be mounted on the substrate W. Therefore, before and after mounting the component P on the mounting surface of the board W is imaged as a monochrome image, and the board W is captured by the inspection device 60 from the pre-mounting image (first image) and the post-mounting image (second image) of the component P. Whether or not the above component P is mounted is inspected.

When inspecting the presence or absence of the component P, a difference image is generated from the pre-mounting image and the post-mounting image, and the presence or absence of the component P is inspected based on the evaluation value (sum of squares) of the brightness in the difference image. .. However, since the component imaging unit 48 captures the pre-mounting image and the post-mounting image to raise the tact while moving the mounting head 40 and the nozzle 42, a slight blur occurs in the component imaging unit 48 during imaging. Further, since the mounting device 1 vibrates slightly, the substrate W on the substrate transport unit 10 also slightly shakes at the time of imaging. Therefore, even if the component P is not mounted, the image before mounting and the image after mounting may be misaligned.

If there is a deviation in the portion where the contrast of brightness is clear in the images before and after mounting, the influence of the portion other than the component P in the difference image becomes large. Therefore, even though the component P is not mounted in the image after mounting, the difference (change in brightness) becomes large and there is a possibility that it is erroneously determined that the component P is mounted. In particular, in the case of a small component P, the area of the terminal that causes the luminance difference is small, and the influence of noise components other than the component such as silk is larger than the difference due to the component P. Therefore, even though the component P is not mounted in the image after mounting, the difference may become large and it may be erroneously determined that the component P is mounted.

For example, as shown in FIG. 3, the component P is not displayed not only in the pre-mounting image captured before the mounting operation but also in the post-mounting image captured after the mounting operation, and the component P is mounted on the substrate W. There is a mistake. However, even if a mounting error of the component P occurs, the silk 71 on the substrate W remains as a noise component in the difference image due to the blurring of the component imaging unit 48 and the substrate W. Since the presence or absence of mounting of the component P is inspected based on the difference image including this noise component, the component P is mounted on the image after mounting due to the noise component even though the mounting error of the component P actually occurs. There is a risk of misjudgment.

Therefore, in the inspection device 60 of the present embodiment, attention is paid to the fact that noise components other than the component P remain in the difference image with a size clearly different from the component size, and the area size and the component size of the difference region remaining in the difference image are set. Whether or not it is a noise component is determined by comparison. As a result, even if a noise component other than the component P remains in the difference image as the difference region 75, the noise component is removed from the difference image to eliminate the influence of the noise component on the difference image, and the component on the substrate W. It is possible to inspect the presence or absence of P with high accuracy.

Hereinafter, the inspection process for the presence or absence of mounting of parts will be described. FIG. 4 is a block diagram of the inspection device of the present embodiment. FIG. 5 is a flowchart showing an example of the inspection process of the present embodiment. FIG. 6 is a diagram showing an example of a pre-mounting image and a post-mounting image of the components of the present embodiment. FIG. 7 is a diagram showing an example of a difference image of the present embodiment. FIG. 8 is a diagram showing an example of the determination process of the present embodiment. FIG. 9 is a diagram showing an example of the extraction process of the difference region of the present embodiment. FIG. 10 is a diagram showing an example of the noise component discrimination process of the present embodiment. FIG. 11 is a diagram showing an example of the noise component removing process of the present embodiment.

The control configuration of the inspection device 60 will be briefly described with reference to FIG. The inspection device 60 is connected to the component imaging unit 48, obtains a pre-mounting image and a post-mounting image of the component P on the mounting surface of the substrate W from the component imaging unit 48, and inspects whether or not the component P is mounted. There is. In this case, first, the initial inspection is performed without removing the noise component from the difference image between the pre-mounting image and the post-mounting image. Next, when the presence or absence of the component P cannot be determined by the initial inspection, the noise component is removed from the difference image and the re-inspection is performed. The inspection device 60 is provided with a matching unit 61, a difference image generation unit 62, a difference region extraction unit 63, a noise discrimination unit 64, a noise removal unit 65, a calculation unit 66, and a determination unit 67.

The matching unit 61 performs matching processing for aligning the pre-mounting image and the post-mounting image. The difference image generation unit 62 performs a difference image generation process from the pre-mounting image and the post-mounting image. The difference area extraction unit 63 executes an extraction process of a difference area including a difference pixel from the difference image. In the noise discrimination unit 64, the noise component discrimination processing is performed from the area size of the difference region and the component size. The noise removing unit 65 performs a removing process of removing the difference region determined to be a noise component from the difference image. The calculation unit 66 performs a calculation process of the sum of the difference squares of each pixel of the difference image.

The determination unit 67 performs a determination process of whether or not a component is mounted by comparing the calculation result of the sum of squared differences and the determination threshold value at the time of initial inspection and re-inspection. An upper limit threshold value and a lower limit threshold value are set as judgment threshold values. If the calculation result is equal to or higher than the upper limit threshold value, it is determined that the component P is mounted on the substrate W. It is determined that the component P is not mounted on the. As the upper limit threshold value and the lower limit threshold value, values obtained experimentally, empirically, or theoretically from statistical data or the like are used. Further, although the inspection device 60 is described in a simplified manner in the block diagram of FIG. 4, it is assumed that the inspection device 60 is provided with a configuration normally provided.

Subsequently, the flow of the inspection process of the inspection apparatus will be described with reference to FIGS. 5 to 10. In the description of the flowchart of FIG. 5, the reference numerals attached to the blocks of FIG. 4 will be appropriately used for description. As shown in FIG. 5, the pre-mounting image and the post-mounting image are input to the inspection device 60 from the component imaging unit 48 (step S01). The pre-mounting image is a monochrome image obtained by capturing the substrate W from diagonally above by the component imaging unit 48 before mounting the component P (see FIG. 6A). The pre-mounting image shows the silk 71 printed on the substrate W and the mounting surface on which the electrode pads 72 are arranged inside the silk 71.

The mounted image is a black-and-white image obtained by capturing the substrate W from diagonally above by the component imaging unit 48 after mounting the component P (see FIG. 6B). The mounted image shows the component P mounted on the mounting surface 73 of the substrate W. Further, when a mounting error occurs in the component P, since the component P is not mounted on the board W, the image after mounting looks the same as the image before mounting, but after mounting due to the component imaging unit 48 or the blurring of the subject. There is a slight deviation in the image (see FIG. 6C). The monochrome image is an image represented by a single shade of achromatic color or chromatic color, and includes a gray scale or the like.

Next, the matching unit 61 performs the matching process (step S02). In the matching process, the pre-mounting image and the post-mounting image are aligned in consideration of the warp and bending of the substrate W that occur when the component P is mounted. Next, the difference image generation unit 62 executes the difference image generation process (step S03). In the difference image generation process, the difference image is generated by taking the absolute value of the luminance difference between the pre-mounting image and the post-mounting image specific area 69 (see FIGS. 6A and 6C) after matching (see FIG. 7). Even when the component P is not mounted on the mounted image, the blur of the silk 71 appears as the difference region 75 in the difference image.

Next, the calculation unit 66 performs a calculation process on the difference image (step S04). In the calculation process, the calculation unit 66 calculates the total value of the squares of the brightness of each pixel of the captured image as the evaluation value V at the time of the initial inspection. Next, the determination unit 67 performs a determination process for determining the presence or absence of the component P based on the difference image as an initial inspection. In the determination process, is compared with the rated value V and the upper limit threshold value T _H of the difference image, evaluation value V whether or upper threshold T _H is determined (step S05). If the evaluation value V is greater than or equal to the upper limit threshold _{T H} in (Yes in step S05), it is determined that "there is component" (see FIG. 8).

On the other hand, when the evaluation value V is smaller than the upper threshold _{T H} (No in step S05), the evaluation value V whether more than the lower limit threshold value _{T L} is determined (step S06). When the evaluation value V is _{equal to or less than the lower limit threshold value TL} (Yes in step S06), it is determined that there is no component (see FIG. 8). Next, when the evaluation value V is _{larger than the lower limit threshold value TL} (No in step S06), the presence / absence of the component P is determined _{assuming that the evaluation value V is an intermediate region between the upper limit threshold value TH} and the lower limit threshold value _TL. Cannot (see FIG. 8). Therefore, the noise component removal process is performed on the difference image so that the brightness of the noise component other than the component P does not affect the evaluation value V.

In this case, it is determined whether or not the noise component has already been removed (step S07). If the noise component is removed (Yes in step S07), an error is determined. If the noise component is not removed (No in step S07), the difference region extraction unit 63 extracts the difference region 75 from the difference image (step S08). In the extraction process of the difference region 75, the binarization process is performed on the difference image, and further, the labeling process is performed on the binarized image. As a result, the difference pixels are obtained in the difference image, and the area in which the difference pixels are connected is extracted as the difference area 75 (see FIG. 9A).

At this time, when a plurality of difference areas 75 are included in the difference image, if the intervals between the plurality of difference areas 75 are within a predetermined number of pixels (within 2 pixels), they are extracted as the same difference area 75 (FIG. 9B). (See), if the interval between the plurality of difference regions 75 is larger than the predetermined number of pixels, they are extracted as separate difference regions 75 (see FIG. 9B). For example, expansion processing and contraction processing are performed on the difference image, and if the interval between the plurality of difference areas 75 is within a predetermined number of pixels, the plurality of difference areas 75 are combined and extracted as one difference area 75. .. In this way, the difference region 75 is extracted from the difference image for each block containing a plurality of difference pixels.

Next, the noise discrimination unit 64 performs a noise component discrimination process (step S09). In the noise component discrimination process, the difference area 75 by the component P does not become larger than the component size. Therefore, the area size of the difference area 75 and the component size are compared, and the difference area 75 larger than the component size is the noise component. Is determined. For example, the vertical dimension and the horizontal dimension of the difference region 75 are obtained, and the vertical dimension and the horizontal dimension of the difference region 75 and the component P are compared with each other. Then, if the vertical dimension W2 of the difference region 75 is larger than the vertical dimension W1 of the component P, or the horizontal dimension L2 of the difference region 75 is larger than the horizontal dimension L1 of the component P, it is determined to be a noise component (see FIG. 10A). ..

At this time, if the difference region 75 is divided into a plurality of parts, the region size of the difference region 75 other than the component P may be smaller than the component size (see the two-dot chain line in FIG. 10B). However, when the regions are close to each other, they are extracted as one difference region 75, so it is possible to accurately determine whether the difference region 75 is a difference due to the component P or a noise component other than the component P (FIG. 10B). See solid line). The component size may be the size of the entire component P in a plan view, or the size of a portion of the component P that causes a difference in brightness. The portion that causes the difference in brightness may be a terminal of the component P, a mark printed on the body, or the like.

If it is clear from the size of the difference region 75 that it is a noise component, the above-mentioned discrimination process may be omitted. In this case, before comparing the area size of the difference area 75 with the component size, it is determined whether or not the area of the difference area 75 is within the allowable range. Then, when the area of the difference region 75 is out of the permissible range, the difference region 75 is determined as a noise component without comparing the vertical dimension and the horizontal dimension. As a result, when the difference region 75 is extremely large or extremely small with respect to the component size, the difference region 75 can be regarded as a noise component and the load of the discrimination processing can be reduced.

Next, the noise removing unit 65 performs a noise component removing process (step S10). In the noise component removing process, the difference region 75 determined to be the noise component is removed from the difference image (see FIG. 11). Then, the process returns to step S04 to start re-inspection of the presence or absence of the component P, and the calculation process and the determination process are performed on the difference image from which the noise component has been removed in the same manner as described above (steps S04 to S07). That is, the evaluation value V is calculated by the sum of squares of the brightness of each pixel of the difference image from which the noise component is removed, and the evaluation value V _{is compared with the upper limit threshold value TH} and the lower limit threshold value T _L to determine the presence or absence of the component P. NS.

As described above, in the inspection device 60 of the present embodiment, the area size of the difference area 75 is compared with the component size, so that the difference area 75 included in the difference image is the difference due to the component P or the noise other than the component P. The component is determined. Then, by removing the noise component from the difference image, only the difference region due to the component P is left in the difference image. Therefore, it is possible to inspect with high accuracy whether or not the component P is mounted on the substrate W without being affected by noise components other than the component P.

In the present embodiment, the component imaging unit as the imaging device is configured to image the substrate from diagonally above, but the configuration is not limited to this. The image pickup device may capture the image before mounting and the image after mounting in a comparable manner, and may image the substrate from directly above, for example. Further, the above-described substrate imaging unit that captures the BOC mark on the substrate W provided on the head body from directly above may be used for imaging.

Further, in the present embodiment, the difference image generation unit is configured to generate a difference image from a specific area of the pre-mounting image and a specific area of the post-mounting image, but the configuration is not limited to this. The difference image generation unit may be configured to generate a difference image from the pre-mounting image and the post-mounting image. For example, the difference image may be generated from the entire pre-mounting image and the entire post-mounting image.

Further, in the present embodiment, the determination unit has a configuration in which the presence / absence of a component is determined based on the sum of squares of the luminance with the sum of the squares of the brightness of each pixel of the difference image as an evaluation value, but the present invention is not limited to this configuration. .. The determination unit may have a configuration for determining the presence or absence of parts based on the difference image. For example, the determination unit may use the total of each pixel of the difference image as an evaluation value in the determination process, or may use the sum of the cubes of the brightness of each pixel of the difference image as an evaluation value in the determination process.

Further, in the present embodiment, the substrate is not limited to the printed circuit board, and may be a flexible substrate mounted on the jig substrate.

Further, in the present embodiment, the inspection device is configured to determine whether or not a component is mounted based on a difference image from which noise components have been removed as a re-inspection after the initial inspection, but the present invention is not limited to this configuration. The inspection device may determine whether or not the component is mounted based on the difference image from which the noise component is removed at the time of the initial inspection. That is, the inspection device does not have to perform the retry processing of the inspection program.

Further, in the present embodiment, the control program and the inspection program may be stored in the recording medium. The recording medium is not particularly limited, but may be a non-transient recording medium such as an optical disk, a magneto-optical disk, or a flash memory.

Further, in the present embodiment, the configuration in which the mounting device is provided with the inspection device has been described, but the present invention is not limited to this configuration. The inspection device may be a device dedicated to inspection, which is separate from the mounting device.

Moreover, although the embodiment and modification of the present invention have been described, as another embodiment of the present invention, the above-described embodiment and modification may be combined in whole or in part.

Further, the embodiment of the present invention is not limited to the above-described embodiment and modification, and may be variously modified, replaced, or modified without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by the advancement of technology or another technology derived from it, it may be carried out by using that method. Therefore, the scope of claims covers all embodiments that may be included within the scope of the technical idea of the present invention.

Further, in the embodiment of the present invention, the configuration in which the present invention is applied to the mounting device has been described, but it can be applied to other devices that need to be inspected for the presence or absence of mounting of parts.

Further, in the above embodiment, the inspection device inspects the presence or absence of mounting of the component from the pre-mounting image and the post-mounting image of the component, which are images taken before and after mounting the component on the mounting surface of the substrate, from the pre-mounting image and the post-mounting image. A difference image generation unit that generates a difference image, a difference area extraction unit that extracts a difference area containing a difference pixel from the difference image, a noise discrimination unit that discriminates noise components from the area size and component size of the difference area, and noise. It is characterized by including a noise removing unit that removes a difference region determined to be a component from the difference image, and a determination unit that determines the presence or absence of a component based on the difference image from which the noise component is removed. According to this configuration, by comparing the area size of the difference area with the component size, it is determined whether the difference area included in the difference image is the difference due to the component or the noise component other than the component. Then, by removing the noise component from the difference image, only the difference region due to the component is left in the difference image. Therefore, it is possible to inspect with high accuracy whether or not the component is mounted on the substrate without being affected by noise components other than the component.

As described above, the present invention has the effect of being able to inspect the presence or absence of mounting of components on the substrate with high accuracy by a simple process, and in particular, an inspection device for inspecting the presence or absence of mounting of components on the substrate. It is useful for mounting equipment and inspection methods.

1 Mounting device 40 Mounting head 48 Parts imaging unit (imaging device)
60 Inspection device 62 Difference image generation unit 63 Difference area extraction unit 64 Noise discrimination unit 65 Noise removal unit 67 Judgment unit 73 Mounting surface 75 Difference region P component W board

Claims (7)

A first inspection apparatus for inspecting the mounting presence of the component relative to the substrate from the second image captured before and after mounting process of parts against the base plate,
A difference image generation unit that generates a difference image from the first and second images, and
A difference area extraction unit that extracts a difference area including a difference pixel from the difference image, and a difference area extraction unit.
A noise discriminator that discriminates noise components from the area size and component size of the difference region,
A noise removing unit that removes a difference region determined to be a noise component from the difference image,
And a determination unit for mounting presence of the component based on the previous SL differential image,
The determination unit
In the first determination, when the evaluation value of the difference image is equal to or greater than the upper limit threshold value, the substrate is referred to regardless of the processing results of the difference region extraction unit, the noise determination unit, and the noise removal unit. Judging that the parts are installed,
In the first determination, when the evaluation value of the difference image is equal to or less than the lower limit threshold value, the substrate is referred to regardless of the processing results of the difference region extraction unit, the noise determination unit, and the noise removal unit. Judging that no parts are installed,
In the first determination, when the evaluation value of the difference image is smaller than the upper limit threshold value and larger than the lower limit threshold value, depending on the processing result by the difference region extraction unit, the noise discrimination unit, and the noise removal unit. A second determination is made to redetermine the presence or absence of the component based on the difference image from which the noise component has been removed.
An inspection device characterized by that. The inspection device according to claim 1, wherein the noise discrimination unit discriminates as a noise component if the vertical dimension or horizontal dimension of the difference region is larger than the vertical dimension or horizontal dimension of the component. The inspection device according to claim 2, wherein the noise discrimination unit discriminates the difference region as a noise component without comparing the vertical dimension and the horizontal dimension when the area of the difference region is out of the permissible range. .. The difference image contains a plurality of difference areas.
The difference area extraction unit extracts as the same difference area if the interval between the plurality of difference areas is within a predetermined number of pixels, and extracts as separate difference areas if the interval between the plurality of difference areas is larger than the predetermined number of pixels. The inspection device according to any one of claims 1 to 3, wherein the inspection apparatus is used. The difference region extraction unit performs expansion processing and contraction processing on the difference image, and if the interval between the plurality of difference regions is within a predetermined pixel, the plurality of difference regions are combined to form one difference region. The inspection apparatus according to claim 4, wherein the inspection apparatus is extracted. The inspection device according to any one of claims 1 to 5.
A mounting head for mounting the component on the mounting surface,
Mounting device, wherein the mounting the first relating to before and after the mounting process of the by the head part and an imaging device for imaging the second image. A first inspection method for inspecting a mounting presence of the component relative to the substrate from the second image captured before and after mounting process of parts against the base plate,
A step of generating a difference image from the first and second images by the difference image generation unit, and
A step of extracting a difference region containing a difference pixel from the difference image by the difference area extraction unit, and
A step of discriminating a noise component from the area size and component size of the difference region by the noise discriminating unit, and
A step of removing the difference region determined to be the noise component from the difference image by the noise removing unit, and
And a step of determining mounting presence of the component based on the previous SL differential image,
In the determination step,
In the first determination, when the evaluation value of the difference image is equal to or greater than the upper limit threshold value, the substrate is referred to regardless of the processing results of the difference region extraction unit, the noise determination unit, and the noise removal unit. Judging that the parts are installed,
In the first determination, when the evaluation value of the difference image is equal to or less than the lower limit threshold value, the substrate is referred to regardless of the processing results of the difference region extraction unit, the noise determination unit, and the noise removal unit. Judging that no parts are installed,
In the first determination, when the evaluation value of the difference image is smaller than the upper limit threshold value and larger than the lower limit threshold value, depending on the processing result by the difference region extraction unit, the noise discrimination unit, and the noise removal unit. A second determination is made to redetermine the presence or absence of the component based on the difference image from which the noise component has been removed.
An inspection method characterized by that.

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