JP6916471B2 - Electronic components and manufacturing methods for electronic components - Google Patents

Description

The present invention relates to an electronic component and a method for manufacturing the electronic component.

A crystal oscillator made of artificial quartz, for example, is widely used as a signal source for a reference signal used in an oscillator, a band filter, or the like. In Patent Document 1, a frame-shaped low-temperature metal brazing material (Au / Sn alloy) is placed on a metallized layer of a ceramic substrate and melt-adhered to form a bonding layer, and a lid is placed on the ceramic substrate with the bonding layer sandwiched between them. A method for manufacturing a brazing crystal transducer is disclosed. Further, Patent Document 2 discloses a crystal oscillator in which an open end surface to be joined to a ceramic substrate via a sealing material (molten resin) of a metal cover is a flange having an inclined surface.

Japanese Unexamined Patent Publication No. 2004-186995 Japanese Unexamined Patent Publication No. 2011-142609

A crystal oscillator is mounted on a portable communication device or the like as a kind of electronic component. In recent years, crystal oscillators are required to be smaller, lighter, and more durable for the purpose of being used in portable communication devices and the like, which are becoming smaller and higher in performance. However, in the configuration in which the brazing material is provided on the metallized layer of the ceramic substrate, there arises a problem that the shape of the brazing material becomes unstable due to the influence of shape changes such as the warped shape of the ceramic substrate. Further, in the configuration in which the metal cover is joined to the ceramic substrate via the molten resin, the shape of the molten resin becomes unstable due to the influence of the shape change of the ceramic substrate and the metal cover, or the shape of the molten resin changes depending on the molten state. There was a problem of instability.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electronic component and a method for manufacturing the electronic component, which can stabilize the shape of the joint member.

The method for manufacturing an electronic component according to one aspect of the present invention comprises a first step of providing a base member on a first main surface of a first substrate, a first main surface of the first substrate, and a transfer main surface of a transfer substrate. The second step of sandwiching the base member and the joining member paste, the third step of forming the joining member joined to the base member while the joining member paste is sandwiched between the first substrate and the transfer substrate, and the base member. It is characterized by comprising a fourth step of peeling the transfer substrate from the joining member joined to the above.

The method for manufacturing an electronic component according to another aspect of the present invention includes a first step of providing a base member on a first main surface of a first substrate, a first main surface of the first substrate, and a transfer main surface of a transfer substrate. By heating and cooling the joining member paste while being sandwiched between the first substrate and the transfer substrate in the second step of sandwiching the base member and the joining member paste, the joining member paste is softened and solidified and joined. It is characterized by including a third step of forming the member and a fourth step of peeling the transfer substrate from the joining member joined to the base member.

The electronic component according to the other aspect of the present invention is provided on the first main surface side having the first main surface having a warped shape and the first main surface side of the first substrate, and is joined to the second substrate. A joining member having a top is provided, and the top of the joining member is provided in a plane.

An electronic component according to another aspect of the present invention includes a first substrate having a first main surface and a joining member provided on the first main surface side of the first substrate and having a top portion, and is a joining member. The top of the is exposed and has a planar shape.

Electronic components according to another aspect of the present invention include a first substrate having a first main surface, a plurality of joining members provided on the first main surface side of the first substrate and having at least three tops. The flatness of at least three tops is 40% or less of the flatness of the first main surface of the first substrate.

Electronic components according to another aspect of the present invention include a first substrate having a first main surface, a plurality of joining members provided on the first main surface side of the first substrate and having at least three tops. The flatness of at least three tops is 9.0 μm or less.

Electronic components according to another aspect of the present invention include a first substrate having a first main surface, a plurality of joining members provided on the first main surface side of the first substrate and having at least three tops. At least three tops are exposed and planar.

According to the present invention, it is possible to provide an electronic component and a method for manufacturing the electronic component, which can stabilize the shape of the joint member.

FIG. 1 is an exploded perspective view showing an example of a crystal oscillator corresponding to an electronic component according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II of the crystal unit shown in FIG. FIG. 3 is a flowchart showing a transfer process in the method for manufacturing an electronic component according to the first embodiment of the present invention. FIG. 4 is a flowchart showing an assembly process in the method for manufacturing an electronic component according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view schematically showing the structure of the adhesion layer paste provided on the first main surface of the first substrate. FIG. 6 is a cross-sectional view schematically showing a process of providing a base member. FIG. 7 is a perspective view schematically showing the configuration of the first substrate used in the transfer step. FIG. 8 is a perspective view schematically showing a process of providing the joining member. FIG. 9 is a perspective view schematically showing a joining member paste provided on the transfer main surface of the transfer substrate. FIG. 10 is a plan view schematically showing the structure of the joining member paste shown in FIG. FIG. 11 is a perspective view schematically showing a process of joining the joining member to the base member. FIG. 12 is a cross-sectional view schematically showing the configuration of the first substrate and the transfer substrate sandwiching the base member and the joining member. FIG. 13 is a cross-sectional view schematically showing the configuration of a joining member solidified while being sandwiched between the first substrate and the transfer substrate. FIG. 14 is a perspective view schematically showing a step of peeling the joining member from the transfer substrate. FIG. 15 is a cross-sectional view schematically showing a step of joining a second substrate to a first substrate via a joining member. FIG. 16 is a cross-sectional view schematically showing the configuration of the crystal oscillator according to the first modification. FIG. 17 is a perspective view schematically showing the configuration of the crystal vibrating element according to the second modification. FIG. 18 is a plan view schematically showing the configuration of the electronic component according to the second embodiment. Figure 19 is a cross-sectional view schematically showing a cross-sectional structure taken along line XIX-XIX of the electronic component shown in FIG. 18. FIG. 20 is a graph showing the occurrence rate of shape defects of the joining member due to the excess of the joining member paste. FIG. 21 is a graph showing the occurrence rate of shape defects of the joining member due to the shortage of the joining member paste. FIG. 22 is a diagram showing the surface shapes of the electronic components shown in FIG. 18 along the lines AB and A'-B'. FIG. 23 is a diagram showing the surface shapes at positions corresponding to the AB line and the A'-B'line in a configuration in which the joining member paste is applied and dried on the base member as a comparative example. FIG. 24 is an enlarged cross-sectional view of the joining member in the electronic component shown in FIG. FIG. 25 is a photograph of a cross section of a joining member in the electronic component according to the second embodiment. FIG. 26 is a photograph of a cross section of the joining member in a configuration in which the joining member paste is applied and dried on the base member as a comparative example. FIG. 27 is a graph showing the occurrence rate of leak defects when sealed by a joining member in the electronic component according to the second embodiment. FIG. 28 is a plan view schematically showing the configuration of the electronic component according to the third embodiment. FIG. 29 is a cross-sectional view schematically showing the configuration of a cross section along the XXIX-XXIX line shown in FIG. 28.

An embodiment of the present invention will be described below. In the description of the drawings below, the same or similar components are represented by the same or similar reference numerals. The drawings are examples, and the dimensions and shapes of the respective parts are schematic, and the technical scope of the present invention should not be limited to the embodiment.

Further, in the following description, as an example of the piezoelectric vibrator, a quartz crystal oscillator equipped with a quartz crystal oscillator will be described as an example. The crystal vibrating element uses a crystal piece (Quartz Crystal Blank) as a piezoelectric material that vibrates in response to an applied voltage. However, the piezoelectric vibrator according to the embodiment of the present invention is not limited to the crystal oscillator, and other piezoelectric materials such as ceramics may be used.

<First Embodiment>
An example of the crystal unit manufactured by the embodiment of the present invention will be described with reference to FIGS. 1 and 2. Here, FIG. 1 is an exploded perspective view showing an example of a crystal oscillator corresponding to an electronic component according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II of the crystal unit shown in FIG.

As shown in FIG. 1, the crystal oscillator 1 according to the first embodiment includes a crystal vibrating element 10, a second substrate 20, and a first substrate 30. The first substrate 30 and the second substrate 20 are cages for accommodating the crystal vibrating element 10. In the example shown here, the second substrate 20 has a concave shape, specifically, a box shape having an opening, and the first substrate 30 has a flat plate shape. The shapes of the second substrate 20 and the first substrate 30 are not limited to the above, and may be a concave first substrate and a flat plate-shaped second substrate, both of which are concave first substrate and second substrate. It may be. The crystal oscillator 1 corresponds to an electronic component, and the crystal vibrating element 10 corresponds to an electronic element. The electronic element is not limited to a piezoelectric element such as a crystal vibration element as long as an electric signal, electric power, or the like is input / output. The electronic element may be, for example, an active element, a passive element, an integrated circuit, an image pickup element, a display element, or the like.

The electronic component according to the embodiment of the present invention is not limited to a crystal oscillator as long as the first substrate and the second substrate are bonded via a bonding member. Here, an electronic component that causes the joining member to function as a sealing frame will be described, but the electronic component may be one that causes the joining member to function as a terminal electrode. The electronic component may be the first substrate on which the joining member is formed before being joined to the second substrate. In the following description, a component in which a first substrate and a second substrate are joined via a joining member is referred to as a first electronic component. Further, among the parts constituting the first electronic component, the component on the first substrate side provided with the joining member and to be joined to the second substrate is referred to as a second electronic component.

The crystal vibrating element 10 has a flaky crystal piece 11. The crystal piece 11 has a first main surface 12a and a second main surface 12b facing each other. The crystal piece 11 is, for example, an AT-cut type crystal piece (Quartz Crystal Blank). In the AT-cut type quartz piece, the artificial crystal is a plane parallel to the plane specified by the X-axis and the Z'axis (hereinafter, referred to as "XZ'plane". The same applies to the plane specified by other axes. .) Was cut out as the main surface. The X-axis, Y-axis, and Z-axis are crystal axes of the artificial crystal, and the Y'axis and Z'axis are the Y-axis and the Z-axis around the X-axis in the direction from the Y-axis to the Z-axis, respectively. It is an axis rotated at 35 degrees 15 minutes ± 1 minute 30 seconds. That is, in the AT-cut type crystal piece 11, the first main surface 12a and the second main surface 12b correspond to the XZ'plane, respectively. A different cut (for example, BT cut) other than the AT cut may be applied to the cut angle of the crystal piece.

The AT-cut type crystal piece 11 is parallel to the long side direction in which the long side parallel to the X-axis direction extends, the short side direction in which the short side parallel to the Z'axis direction extends, and the Y'axis direction. Has a thickness direction in which the thickness extends. The crystal piece 11 has a substantially rectangular shape when viewed in a plan view from the normal direction of the first main surface 12a, and has an excitation portion 17 located in the center and contributing to excitation, and an excitation portion on the negative direction side of the X axis. It has a peripheral edge portion 18 adjacent to the 17 and a peripheral edge portion 19 adjacent to the exciting portion 17 on the positive direction side of the X-axis. A step 13 is provided between the exciting portion 17 and the peripheral portion 19. The crystal piece 11 has a mesa-shaped structure in which the excitation portion 17 is thicker than the peripheral portions 18 and 19. However, the shape of the crystal piece 11 is not limited to this, and for example, when viewed in a plan view from the normal direction of the first main surface 12a, the pair of parallel arms and both arms are connected. It may be a comb-tooth type having a connecting portion. Further, the crystal piece 11 may have a flat plate structure having substantially uniform thicknesses in the X-axis direction and the Z'axis direction, and the excitation portion 17 may have an inverted mesa-type structure thinner than the peripheral portions 18 and 19. .. Further, it may be a convex shape or a base bell shape change in thickness between the excitation portion 17 and the peripheral portions 18 and 19 is continuously changed.

A crystal vibrating element using an AT-cut quartz piece has high frequency stability in a wide temperature range, is excellent in aging characteristics, and can be manufactured at low cost. Further, the AT-cut crystal vibrating element uses a thick sliding vibration mode (Sickness Shear Vibratoin Mode) as the main vibration.

The crystal vibration element 10 has a first excitation electrode 14a and a second excitation electrode 14b that form a pair of electrodes. The first excitation electrode 14a is provided on the first main surface 12a of the excitation portion 17. Further, the second excitation electrode 14b is provided on the second main surface 12b of the excitation portion 17. The first excitation electrode 14a and the second excitation electrode 14b are provided so as to face each other with the crystal piece 11 interposed therebetween. The first excitation electrode 14a and the second excitation electrode 14b are arranged so that substantially the entire surface overlaps on the XZ'plane.

The first excitation electrode 14a and the second excitation electrode 14b each have a long side parallel to the X-axis direction, a short side parallel to the Z'axis direction, and a thickness parallel to the Y'axis direction. .. In the example shown in FIG. 1, the long sides of the first excitation electrode 14a and the second excitation electrode 14b are parallel to the long side of the crystal piece 11 on the XZ'plane, and the first excitation electrode 14a and the second excitation electrode 14b The short side is parallel to the short side of the crystal piece 11. Further, the long sides of the first excitation electrode 14a and the second excitation electrode 14b are separated from the long side of the crystal piece 11, and the short sides of the first excitation electrode 14a and the second excitation electrode 14b are from the short side of the crystal piece 11. is seperated.

The crystal vibrating element 10 has a pair of extraction electrodes 15a and 15b and a pair of connection electrodes 16a and 16b. The connection electrode 16a is electrically connected to the first excitation electrode 14a via the extraction electrode 15a. Further, the connection electrode 16b is electrically connected to the second excitation electrode 14b via the extraction electrode 15b. The connection electrodes 16a and 16b are terminals for electrically connecting the first excitation electrode 14a and the second excitation electrode 14b to the first substrate 30, respectively. The crystal vibrating element 10 is held on the first substrate 30. The first main surface 12a is located on the side opposite to the side facing the first substrate 30, and the second main surface 12b is located on the side facing the first substrate 30.

The extraction electrode 15a is provided on the first main surface 12a, and the extraction electrode 15b is provided on the second main surface 12b. The connection electrode 16a is provided from the first main surface 12a to the second main surface 12b of the peripheral edge portion 18, and the connection electrode 16b is provided from the second main surface 12b to the first main surface 12a of the peripheral edge portion 18. Has been done. The first excitation electrode 14a, the extraction electrode 15a, and the connection electrode 16a are continuous, and the second excitation electrode 14b, the extraction electrode 15b, and the connection electrode 16b are continuous. In the configuration example shown in FIG. 1, the connection electrode 16a and the connection electrode 16b are arranged along the short side direction (Z'axis direction) of the crystal piece 11, and the crystal vibrating element 10 is held by one short side. , So-called cantilever structure. The crystal vibrating element 10 may have a so-called double-sided structure in which it is held by both short sides. At this time, one of the connection electrode 16a and the connection electrode 16b is provided on the peripheral edge portion 18, and the other is provided on the peripheral edge portion 19. Be done.

The materials of the first excitation electrode 14a and the second excitation electrode 14b are not particularly limited, but for example, the base layer has a chromium (Cr) layer on the side in contact with the crystal piece 11, and the surface layer is more than the base layer. Also has a gold (Au) layer on the side far from the crystal piece 11. By providing a metal layer with high reactivity with oxygen in the base layer, the adhesion between the crystal piece and the excitation electrode is improved, and by providing a metal layer with low reactivity with oxygen in the surface layer, deterioration of the excitation electrode is suppressed. And the electrical reliability is improved.

The second substrate 20 has a concave shape that opens toward the first main surface 32a of the first substrate 30. The second substrate 20 is joined to the first substrate 30, whereby the crystal vibrating element 10 is accommodated in the internal space 26. The shape of the second substrate 20 is not limited as long as it can accommodate the crystal vibrating element 10. For example, the second substrate 20 has a rectangular shape when viewed in a plan view from the normal direction of the main surface of the top surface portion 21. .. The second substrate 20 is, for example, parallel to the long side direction in which the long side parallel to the X-axis direction extends, the short side direction in which the short side parallel to the Z'axis direction extends, and the Y'axis direction. Has a height direction.

As shown in FIG. 2, the second substrate 20 has an inner surface 24 and an outer surface 25. The inner surface 24 is a surface on the inner space 26 side, and the outer surface 25 is a surface on the opposite side to the inner surface 24. The second substrate 20 is connected to the outer edge of the top surface portion 21 facing the first main surface 32a of the first substrate 30, and extends in a direction intersecting the main surface of the top surface portion 21. It has a side wall portion 22 and a side wall portion 22. Further, the second substrate 20 has a facing surface 23 facing the first main surface 32a of the first substrate 30 at the concave opening end portion (the end portion of the side wall portion 22 on the side closer to the first substrate 30). That is, the facing surface 23 is included in the open end. The facing surface 23 extends in a frame shape so as to surround the crystal vibrating element 10.

The material of the second substrate 20 is not particularly limited, but is composed of a conductive material such as metal. According to this, the shield function can be added by electrically connecting the second substrate 20 to the ground potential. For example, the second substrate 20 is made of an alloy containing iron (Fe) and nickel (Ni) (for example, 42 alloy). Further, a gold (Au) layer or the like for the purpose of preventing oxidation may be provided on the outermost surface of the second substrate 20. Alternatively, the second substrate 20 may be made of an insulating material, or may have a composite structure of a conductive material and an insulating material.

The first substrate 30 holds the crystal vibrating element 10 in an excitable manner. The first substrate 30 has a flat plate shape. The thickness of the first substrate 30 is parallel to the long side direction in which the long side parallel to the X-axis direction extends, the short side direction in which the short side parallel to the Z'axis direction extends, and the thickness parallel to the Y'axis direction. Has an extending thickness direction.

The first substrate 30 has a substrate 31 and has a first main surface 32a and a second main surface 32b facing each other. The substrate 31 is a sintered material such as an insulating ceramic (alumina). In this case, a plurality of insulating ceramic sheets may be laminated and sintered. Alternatively, the substrate 31 is an inorganic glass material (for example, silicate glass or a material containing a main component other than silicate and having a glass transition phenomenon due to temperature rise), a crystal material (for example, AT-cut crystal). , It may be formed of heat-resistant engineering plastic (for example, polyimide or liquid crystal polymer), or organic-inorganic hybrid material (for example, fiber-reinforced plastic such as glass epoxy resin). The substrate 31 is preferably made of a heat resistant material. The substrate 31 may be a single layer or a plurality of layers, and in the case of a plurality of layers, the substrate 31 includes an insulating layer formed on the outermost layer of the first main surface 32a.

The first substrate 30 has electrode pads 33a and 33b provided on the first main surface 32a and external electrodes 35a, 35b, 35c and 35d provided on the second main surface 32b. The electrode pads 33a and 33b are terminals for electrically connecting the first substrate 30 and the crystal vibrating element 10. Further, the external electrodes 35a, 35b, 35c, 35d are terminals for electrically connecting a circuit board (not shown) and the crystal oscillator 1. The electrode pad 33a is electrically connected to the external electrode 35a via a via electrode 34a extending in the Y'axis direction, and the electrode pad 33b is an external electrode via a via electrode 34b extending in the Y'axis direction. It is electrically connected to 35b. The via electrodes 34a and 34b are formed in the via holes penetrating the substrate 31 in the Y'axis direction.

The conductive holding members 36a and 36b electrically connect the pair of connection electrodes 16a and 16b of the crystal vibrating element 10 to the pair of electrode pads 33a and 33b of the first substrate 30, respectively. Further, the conductive holding members 36a and 36b hold the crystal vibrating element 10 on the first main surface 32a of the first substrate 30 so as to be excited. The conductive holding members 36a and 36b are formed of, for example, a conductive adhesive containing a thermosetting resin, an ultraviolet curable resin, or the like, and are a filler for maintaining a distance between the first substrate and the crystal vibrating element and conductive. It contains conductive particles, etc. for imparting conductivity to the holding member.

In the configuration example shown in FIG. 1, the electrode pads 33a and 33b of the first substrate 30 are provided on the first main surface 32a near the short side of the first substrate 30 on the negative direction side of the X axis, and the short side direction thereof. It is arranged along. The electrode pad 33a is connected to the connection electrode 16a of the crystal vibrating element 10 via the conductive holding member 36a, while the electrode pad 33b is connected to the connecting electrode 16b of the crystal vibrating element 10 via the conductive holding member 36b. Will be done.

The plurality of external electrodes 35a, 35b, 35c, 35d are provided near the respective corners of the second main surface 32b. In the example shown in FIG. 1, the external electrodes 35a and 35b are arranged directly below the electrode pads 33a and 33b, respectively. As a result, the external electrodes 35a and 35b can be electrically connected to the electrode pads 33a and 33b by the via electrodes 34a and 34b extending in the Y'axis direction. In the example shown in FIG. 1, of the four external electrodes 35a to 35d, the external electrodes 35a and 35b arranged near the short side of the first substrate 30 on the negative direction side of the X axis are input / output signals of the crystal vibration element 10. Is the input / output electrode to which is supplied. Further, the external electrodes 35c and 35d arranged near the short side of the first substrate 30 on the positive direction side of the X axis are dummy electrodes to which the input / output signals of the crystal vibration element 10 are not supplied. Input / output signals of other electronic elements on a circuit board (not shown) on which the crystal oscillator 1 is mounted are not supplied to such a dummy electrode. Alternatively, the external electrodes 35c and 35d may be grounding electrodes to which a grounding potential is supplied. When the second substrate 20 is made of a conductive material, the second substrate 20 can add an electromagnetic shielding function having high shielding performance by connecting the second substrate 20 to the external electrodes 35c and 35d which are grounding electrodes. ..

A base member 37 is provided on the first main surface 32a of the first substrate 30. In the example shown in FIG. 1, the base member 37 has a rectangular frame shape when viewed in a plan view from the normal direction of the first main surface 32a. When viewed in a plan view from the normal direction of the first main surface 32a, the electrode pads 33a and 33b are arranged inside the base member 37, and the base member 37 is provided so as to surround the crystal vibration element 10. .. The base member 37 is made of a conductive material. For example, by forming the base member 37 with the same material as the electrode pads 33a and 33b, the base member 37 can be provided at the same time in the step of providing the electrode pads 33a and 33b. A joining member 40, which will be described later, is provided on the base member 37, whereby the second substrate 20 is joined to the first substrate 30 with the joining member 40 and the base member 37 interposed therebetween.

In this configuration example, the electrode pads 33a and 33b of the first substrate 30, the external electrodes 35a to d, and the base member 37 are all made of a metal film. For example, the electrode pads 33a and 33b, the external electrodes 35a to d, and the base member 37 are formed of a molybdenum (Mo) layer, a nickel (Ni) layer, and gold from the side (lower layer) closer to the base 31 to the side (upper layer) away from the base member 31. (Au) layers are laminated in this order. In the base member 37, the Mo layer corresponds to the adhesion layer described later, and the Ni layer and the Au layer correspond to the base layer described later. Further, the via electrodes 34a and 34b may be formed by filling the via holes of the substrate 31 with a conductive paste which is a paste-like composite material composed of a refractory metal powder such as molybdenum (Mo) and an additive material such as flux. can.

The arrangement of the electrode pads 33a and 33b and the external electrodes 35a to 35d is not limited to the above example. For example, the electrode pad 33a may be arranged near one short side of the first substrate 30, and the electrode pad 33b may be arranged near the other short side of the first substrate 30. In such a configuration, the crystal vibrating element 10 is held by the first substrate 30 at both ends in the longitudinal direction of the crystal piece 11.

Further, the arrangement of the external electrodes is not limited to the above example, and for example, two input / output electrodes may be provided diagonally on the second main surface 32b. Alternatively, the four external electrodes may be arranged near the center of each side instead of the corner of the second main surface 32b. Further, the number of external electrodes is not limited to four, and may be, for example, only two which are input / output electrodes. Further, the mode of electrical connection between the connection electrode and the external electrode is not limited to the via electrode, and the electrical conduction thereof is made by pulling out the extraction electrode on the first main surface 32a or the second main surface 32b. May be achieved. Alternatively, the substrate 31 of the first substrate 30 is formed of a plurality of layers, the via electrode is extended to the intermediate layer, and the extraction electrode is pulled out in the intermediate layer to electrically connect the connection electrode and the external electrode. You may.

When both the second substrate 20 and the first substrate 30 are joined with the base member 37 and the joining member 40 sandwiched between them, the crystal vibrating element 10 is surrounded by the second substrate 20 and the first substrate 30. It is sealed in (cavity) 26. In this case, the pressure in the internal space 26 is preferably in a vacuum state lower than the atmospheric pressure, whereby the frequency characteristics of the crystal oscillator 1 due to oxidation of the first excitation electrode 14a and the second excitation electrode 14b change with time. Is preferable because it can reduce.

The joining member 40 is provided over the entire circumference of each of the second substrate 20 and the first substrate 30. Specifically, the joining member 40 is provided on the base member 37 and is formed in a closed frame shape. The base member 37 and the joining member 40 are interposed between the facing surface 23 of the side wall portion 22 of the second substrate 20 and the first main surface 32a of the first substrate 30, so that the crystal vibrating element 10 is second. It is sealed by the substrate 20 and the first substrate 30.

The joining member 40 is a brazing member in which the metal material in the joining member paste, which is a paste-like composite material composed of metal powder and an additive material such as flux, is aggregated. Specifically, the joining member 40 is made of a gold (Au) -tin (Sn) eutectic alloy. In this way, the second substrate 20 and the first substrate 30 are metal-bonded. The metal bonding can improve the sealing property. The joining member 40 is not limited to the conductive material, and may be an insulating material such as a glass adhesive material such as low melting point glass (for example, lead boric acid type, tin phosphoric acid type, etc.). According to this, the cost is lower than that of metal joining, the heating temperature can be suppressed, and the manufacturing process can be simplified.

In the crystal vibrating element 10 according to the present embodiment, one end (the end on the side where the conductive holding members 36a and 36b are arranged) in the long side direction of the crystal piece 11 is a fixed end, and the other end is a free end. It has become. Further, the crystal vibrating element 10, the second substrate 20, and the first substrate 30 each have a rectangular shape on the XZ'plane, and the long side direction and the short side direction are the same as each other.

However, the position of the fixed end of the crystal vibrating element 10 is not particularly limited, and the crystal vibrating element 10 may be fixed to the first substrate 30 at both ends in the long side direction of the crystal piece 11. In this case, the electrodes of the crystal vibrating element 10 and the first substrate 30 may be formed by fixing the crystal vibrating element 10 at both ends of the crystal piece 11 in the long side direction.

In the crystal oscillator 1 according to the present embodiment, an alternating electric field is applied between the first excitation electrode 14a and the second excitation electrode 14b constituting the crystal vibrating element 10 via the external electrodes 35a and 35b of the first substrate 30. Apply. As a result, the crystal piece 11 vibrates in a predetermined vibration mode such as the thickness slip vibration mode, and the resonance characteristic associated with the vibration is obtained.

Next, a method of manufacturing an electronic component according to the present embodiment will be described with reference to FIGS. 3 to 15. In the following description, the description of matters common to the above will be omitted. In particular, the same effects of the same configuration will not be mentioned sequentially. A ceramic substrate made of alumina will be described as an example of the substrate 131 and the transfer substrate 151. By grinding the transfer main surface of the transfer substrate, which is a ceramic substrate, a transfer substrate having a transfer main surface having a small surface roughness and a small flatness value with reduced warpage due to ceramic firing or the like is prepared. .. The substrate 131 and the transfer substrate 151 may be made of other materials.

FIG. 3 is a flowchart showing a transfer process in the method for manufacturing an electronic component according to the first embodiment of the present invention. FIG. 4 is a flowchart showing an assembly process in the method for manufacturing an electronic component according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view schematically showing the structure of the adhesion layer paste provided on the first main surface of the first substrate. FIG. 6 is a cross-sectional view schematically showing a process of providing a base member. FIG. 7 is a perspective view schematically showing the configuration of the first substrate used in the transfer step. FIG. 8 is a perspective view schematically showing a process of providing the joining member. FIG. 9 is a perspective view schematically showing a joining member paste provided on the transfer main surface of the transfer substrate. FIG. 10 is a plan view schematically showing the structure of the joining member paste shown in FIG. FIG. 11 is a perspective view schematically showing a process of joining the joining member to the base member. FIG. 12 is a cross-sectional view schematically showing the configuration of the first substrate and the transfer substrate sandwiching the base member and the joining member. FIG. 13 is a cross-sectional view schematically showing the configuration of a joining member solidified while being sandwiched between the first substrate and the transfer substrate. FIG. 14 is a perspective view schematically showing a step of peeling the joining member from the transfer substrate. FIG. 15 is a cross-sectional view schematically showing a step of joining a second substrate to a first substrate via a joining member.

First, the transfer process will be described. After starting the transfer step, as shown in FIG. 7, the base member 137 is provided on the first main surface 132a of the first substrate 130 (S11).

In this step, first, as shown in FIG. 5, a green sheet 131P is molded using a ceramic powder containing alumina as a main raw material. Next, the substrate 131 is provided with via holes and via electrodes (not shown). Next, the adhesion layer paste 137AP is provided on the first main surface 132a of the green sheet 131P. The adhesive layer paste 137AP is a liquid containing a metal component (Mo) and a binder component, and is provided by a printing method. Then, a green sheet 131P and the adhesion layer paste 137AP baking together at about 1600 ° C. under a hydrogen atmosphere. As a result, the substrate 131, which is a ceramic substrate composed of the sintered body, can be obtained from the green sheet 131P. At this time, the substrate 131 shrinks by, for example, about 20% by firing. This shrinkage during firing causes warpage in the ceramic substrate which is a sintered body. Further, from the adhesion layer paste 137AP, an adhesion layer 137A which is a sintered metal (Mo) obtained by firing and is bonded to the ceramic substrate can be obtained. According to this, as compared with the case where the adhesion layer 137A is provided on the substrate 131 of the sintered body by physical vapor deposition (PVD) or chemical vapor deposition (CVD), the adhesion layer paste 137AP is provided inside the pores of the ceramic sintered body. The substrate 131 and the adhesion layer 137A can be firmly adhered to each other due to the factor that the metal component inside is inserted and sintered. Therefore, the bonding strength between the adhesion layer 137A and the forming surface of the substrate 131 can be increased.

Next, the first layer 137C and the second layer 137D of the base layer 137B are sequentially formed on the adhesion layer 137A by the plating method. The first layer 137C is a Ni layer, and the second layer 137D is an Au layer. In this way, as shown in FIG. 6, the base member 137 including the adhesion layer 137A and the base layer 137B is provided on the first main surface 132a of the base 131. As shown in FIG. 7, the base member 137 is provided in a closed frame shape so as to surround the electrode pads 133a and 133b when viewed in a plan view from the normal direction of the first main surface 132a. That is, the base member 137 is formed so as to be continuous in a rectangular annular shape. When the effect of airtight sealing is not required, for example, when the circuit board and the first board are electrically connected and mounted via a joining member, the shape of the base member 137 is an open frame, that is, discontinuous. It may be formed in.

Next, the bonding member paste 140P is applied to the transfer main surface 152a of the transfer substrate 151 (S12). As shown in FIG. 8, a plate-shaped transfer substrate 151 made of ceramic (alumina) is prepared, and a metal mask 160 is superposed on the transfer main surface 152a. Then, the joining member paste 140P, which is a brazing member for soldering, is applied from above the metal mask 160 using a squeegee (spatula) 165. The joining member paste 140P is a liquid containing a gold (Au) -tin (Sn) eutectic alloy and a flux. The metal mask 160 has an opening 161 shaped so as to overlap the base member 137. The joining member paste 140P is applied onto the transfer main surface 152a of the transfer substrate 151 through the opening 161. The transfer substrate 151 is transferred principal surface 152a is given as an example a plate-like transfer plate is a plane, without being limited thereto, the transfer main surface 152a may have a bending tracks or curved surfaces.

When the joining member 140 contains a metal material, particularly when the joining member 140 is only a metal material, it is desirable that the transfer main surface 152a of the transfer substrate 151 is made of a non-metal material. According to this, since metal bonding does not occur, the adhesion between the bonding member 140 and the transfer main surface 152a can be suppressed. Upon the release of the transfer substrate 151 from the junction member 140 in the peeling step after, the effect of reducing the bonding strength, it is possible to prevent the bonding member 140 remaining on the transfer substrate 151 side. That is, damage to the joining member 140 can be suppressed. The transfer substrate 151 may be made of transparent glass. According to this, the state such as the shape of the bonding member paste 140P can be easily confirmed through the transfer substrate 151 by taking a picture with a camera. Therefore, by using the glass transfer substrate 151, it is possible to easily confirm the difference between the actual state of the top 140a of the joining member 140 and the desired shape and size, and the joining member 140 can be easily formed. .. Further, in order to reduce deformation such as bending of the transfer substrate, the thickness of the transfer substrate is preferably 10 times or more, more preferably 100 times or more, as compared with the thickness of the first substrate.

The opening 161 has a first slit 161a and a third slit 161c corresponding to a pair of long sides of the base member 137, and a second slit 161b and a fourth slit 161d corresponding to a pair of short sides of the base member 137, respectively. Has. The opening 161 has an open frame shape unlike the base member 137, and has bridge portions 163a, 163b, 163c, and 163d so that the metal mask in the region surrounded by the opening 161 does not fall off. The bridge portions 163a to 163d connect the inside and the outside of the opening 161 when viewed in a plan view from the normal direction of the main surface of the metal mask 160. The bridge portions 163a to 163d are respectively located at the corners of the opening 161. The first slit 161a and the second slit 161b are separated by a bridge portion 163a, the second slit 161b and the third slit 161c are separated by a bridge portion 163b, and the third slit 161c and the fourth slit 161d are separated by a bridge portion 163c. , The fourth slit 161d and the first slit 161a are separated by a bridge portion 163d. The position of the bridge portion is not limited to the above, and is arranged so as to be separated from the corner of the opening 161 and each of the first slit 161a and the third slit 161c becomes a plurality of discontinuous slits. You may.

As shown in FIG. 9, the joining member paste 140P is provided on the transfer main surface 152a in a shape corresponding to the opening 161. That is, the joining member paste 140P is shaped so as to be stacked on the base member 137, but is formed with a rectangular annular corner open when viewed in a plan view from the normal direction of the transfer main surface 152a of the transfer substrate 151. Specifically, the joining member paste 140P includes the first portion 141a and the third portion 141c corresponding to the pair of long sides of the base member 137, and the second portion 141b and the second portion 141b corresponding to the pair of short sides of the base member 137. It has a fourth portion 141d. Further, the joining member paste 140P is provided with the corner portions 143a, 143b, 143c, and 143d open, and the first portion 141a to the fourth portion 141d are separated from each other. The first portion 141a to the fourth portion 141d correspond to the first slit 161a to the fourth slit 161d, respectively, and the corner portions 143a to 143d correspond to the bridge portions 163a to 163d, respectively. By applying the joining member paste 140P while avoiding the corners where the joining member paste 140P tends to collect, the metal components in the joining member paste 140P that have become a liquid phase are wetted and spread and gather at the corners of the base member 137. As a result, it is possible to suppress the generation of liquid pools. That is, it is possible to suppress the occurrence of external defects of the joining member.

The above-described step S12 is so-called screen printing, but the method for forming the joining member 140 is not limited to this, and may be provided by a known forming step such as a needle ejection method.

An example of the dimensions of the joining member paste 140P formed in step S12 will be described with reference to FIG. It is assumed that the width of the joining member paste 140P in the lateral direction is uniformly A, and the thickness of the transfer main surface 152a along the normal direction is uniformly T. The length of the first portion 141a and the third portion 141c in the longitudinal direction is L1, and the length including the corner portion is L2. The length of the second portion 141b and the fourth portion 141d in the longitudinal direction is W1, and the length including the corner portion is W2. At this time, the volume V1 of the joining member paste 140P can be expressed by the following formula (1).
V1 = 2 × T × A × (L1 + W1)… (1)
Further, the volume when the joining member is also formed at the corners 143a to 143d, that is, the volume V2 of the joining member paste 140P when formed in a closed frame shape is expressed by the following formula (2). Can be done.
V2 = 2 x T x A x (W2-2 x A) + 2 x T x A x L2
= 2 × T × A × (W2 + L2-2 × A)… (2)
In order for the joining member paste 140P to soften and change into a closed frame shape in a later step, it is desirable that the volume V1 is, for example, 80% or more of the volume V2. Further, in order to prevent liquid pools from being formed at the corners 143a to 143d when the joining member paste 140P is softened in a later step, it is desirable that the volume V1 is 95% or less of the volume V2. in short,
0.80 ≤ V1 / V2 ≤ 0.95
It is desirable to meet. The above inequality can be expressed by the following inequality by substituting equations (1) and (2) and rearranging them.
0.80 ≦ (L1 + W1) / (W 2 + L 2 -2 × A) ≦ 0.95
Further, in order to secure the bonding force and reduce the liquid accumulation, it is more preferable to be in the following range. 0.86 ≦ (L1 + W1) / (W 2 + L 2 -2 × A) ≦ 0.92

Next, the base member 137 and the joining member 140 are sandwiched between the first substrate 130 and the transfer substrate 151 (S13). As shown in FIGS. 11 and 12, the base member 137 and the joining member paste 140P are sandwiched between the first main surface 132a of the first substrate 130 and the transfer main surface 152a of the transfer substrate 151. In a state where the first substrate 130 and the transfer substrate 151 are overlapped with each other, the first main surface 132a of the first substrate 130 is viewed in a plan view, and the joining member paste 140P is placed on the first main surface 132a of the first substrate 130 as a base member. It is provided so as to overlap the arrangement pattern of 137. The base member 137 and the joining member paste 140P are overlapped. Since the joining member paste 140P has an appropriate viscosity, the transfer substrate 151 and the first substrate 130 are bonded together by the joining member paste 140P. Then, with the first substrate 130 resting on the transfer substrate 151, the bonding member paste 140P is softened by heating in a heated furnace. When joining the base member 137 and the joining member 140, the viscosity of the joining member paste 140P does not cause the first substrate 130 to fall off from the transfer substrate 151 due to disturbances such as the wind pressure of the hot air 170 in the furnace or the vibration of the manufacturing equipment. It is preferable that it is determined as follows.

The wettability β of the joining member paste 140P with respect to the base member 137 is larger than the wetting property α of the joining member paste 140P with respect to the first main surface 132a of the first substrate 130. According to this, the joining member paste 140P wets and spreads along the base member 137 on the first substrate 130 side, and changes into a closed frame shape (rectangular annular shape). Further, the joining member paste 140P can suppress the spread of wetting on the first main surface 132a, and can suppress the occurrence of shape defects of the joining member 140. The wettability β of the joining member paste 140P with respect to the base member 137 is larger than the wetting property γ of the joining member paste 140P with respect to the transfer main surface 152a of the transfer substrate 151. According to this, the joining member paste 140P can suppress the wet spread on the transfer substrate 151 side, and can suppress the occurrence of the shape defect of the joining member 140.

Next, the joining member 140 is joined to the base member 137 (S14). The joining member paste 140P is solidified while being sandwiched between the first substrate 130 and the transfer substrate 151 to form the joining member 140 bonded to the base member 137. The joining member paste 140P is heated to soften, and then cooled to solidify. At this time, as shown in FIG. 13, the flux 140F covers the joining member 140. In the process of softening and solidifying the bonding member paste 140P sandwiched between the first substrate 130 and the transfer substrate 151, the flux 140F is located outside the molten metal in the bonding member paste 140P, so that the flux 140F is prevented from flowing. It plays a role in suppressing unnecessary wetting and spreading of the joining member paste 140P to the transfer substrate 151, and can stabilize the shape of the joining member 140. Further, the flux 140F assists the joining between the first substrate 130 and the transfer substrate 151 by solidifying so as to connect the first substrate 130 side and the transfer substrate 151 side.

The joining member 140 is composed of the metal component of the joining member paste 140P. In the process of forming the joining member 140, the base member 137 and the joining member 140 form a metal joint. That is, an alloy is formed at the boundary between the base member 137 and the joining member 140. According to this, the joining strength between the base member 137 and the joining member 140 can be improved.

The bonding strength F6 of the transfer substrate 151 with respect to the bonding member 140 is the smallest among the bonding strengths between the first substrate 130 and the transfer substrate 151. That is, the bonding strength F6 is smaller than the bonding strength F1 between the adhesion layer 137A and the first substrate 130, and smaller than the bonding strength F2 between the first layer 137C of the base layer 137B and the adhesion layer 137A, and the first layer 137B of the base layer 137B. The bonding strength between the first layer 137C and the second layer 137D is smaller than the bonding strength F3, the bonding strength between the second layer 137D of the base layer 137B and the bonding member 140 is smaller than the bonding strength F4, and the bonding strength between the bonding member 140 and the first substrate 130. It is smaller than F5. According to this, in the step of peeling the transfer substrate 151 from the joining member 140 later, it is possible to suppress the occurrence of damage to the joining member 140.

Next, the transfer substrate 151 is peeled off from the joining member 140 (S15). As shown in FIG. 14, the joining member 140 joined to the base member 137 is peeled off from the transfer substrate 151, and the transfer substrate 151 is separated from the first substrate 130. As a result, the second electronic component 102 including the first substrate 130 and the joining member 140 is completed. At this time, the shape of the transfer main surface 152a of the transfer substrate 151 is transferred to the top 140a of the joining member 140. As shown in FIG. 15, the top 140a has a planar shape. Next, the flux 140F is removed by cleaning the first substrate 130 on which the bonding member 140 is formed with a solvent capable of removing the solidified flux 140F. By removing the flux 140F, it is possible to suppress contamination, damage, and alteration of other members due to the volatilized flux 140F due to a chemical reaction. The transfer substrate may be peeled from the joining member 140 after or while removing the flux 140F. According to this, there is an effect that the bonding force or the adhesive force of the flux 140F is lost and the peeling step is facilitated.

It is desirable that the transfer main surface 152a of the transfer substrate 151 has a smaller surface roughness than the first main surface 132a of the first substrate 130. According to this, since the bonding strength between the bonding member 140 and the transfer substrate 151 can be reduced, it is possible to suppress the generation of the residue of the bonding member 140 on the transfer substrate 151 side in step S15.

The transfer substrate 151 is thicker and more rigid than the first substrate 130. That is, the transfer substrate 151 has less deformation such as warpage than the first substrate 130. The flatness of the first main surface 132a of the first substrate 130 has a small effect on the shape of the top 140a of the joining member 140, and the flatness of the transfer main surface 152a of the transfer board 151 has a large effect. Therefore, the transfer main surface 152a of the transfer substrate 151 has a smaller flatness than the first main surface 132a of the first substrate 130. At least, in step S12, the region of the transfer main surface 152a of the transfer substrate 151 facing the first main surface 132a of the first substrate 130 via the joining member paste 140P is larger than the first main surface 132a of the first substrate 130. It is desirable that the flatness is small. According to this, the top portion 140a of the joining member 140 can be formed in a flat shape. Therefore, when the joining member 140 is joined to the planar portion of the second substrate 120 in a later step, the top portion 140a of the joining member 140 can improve the joining strength. In particular, even if the first substrate 130 is greatly deformed such as warped due to the influence of thinning or multi-layering, it is possible to form a top 140a having a high flatness. Therefore, the joining member 140 can suppress a decrease in the joining strength between the first substrate 130 and the second substrate 120. In the prior art, if an attempt is made to form a thick brazing material in order to improve the adhesion between the ceramic substrate and the lid, there is a possibility that the brazing member softened by heating will wet and spread under its own weight to an unnecessary region. At this time, for example, in a miniaturized crystal oscillator, since the wiring layer and the bonding layer of the ceramic substrate are close to each other, there arises a problem that the wiring layer and the bonding layer are short-circuited and become a defective product. Further, even when the first substrate 130 is reduced, the strength of the first substrate 130 with the thin, the bonding member 140 follows the shape of the transfer main surface 152a in the liquid phase in the molten state, the bonding member 140 is its shape Since it is cooled while being maintained and solidified in a solid phase state, the machining stress acting on the first substrate 130 can be reduced. The flatness of the present invention is based on the definition of flatness tolerance of JIS B 0021 (1984).

Next, the crystal vibrating element 110 is mounted on the first substrate 130 (S17). The crystal vibrating element 110 is a crystal vibrating element having a substantially rectangular shape when the first main surface 132a of the first substrate 130 is viewed in a plan view. The crystal vibrating element 110 is mounted in a region surrounded by the joining member 140 when the first main surface 132a of the first substrate 130 is viewed in a plan view. The crystal vibrating element 110 is electrically connected to the electrode pad 133a through the conductive holding member 136a. Although the conductive holding member 136a is provided by the conductive adhesive, it may be provided by the same material as the joining member 140. At this time, the electrode pad 133a is provided together with the base member 137, and the conductive holding member 136a is provided together with the joining member 140. That is, the sealing frame and the connection terminal separated from the sealing frame may be provided at the same time by the joining member 140.

Next, the frequency is adjusted (S18). The thickness of the crystal vibrating element 110 is reduced by etching the crystal vibrating element 110 so that the excitation frequency of the crystal vibrating element 110 becomes a desired value. As a result, it is possible to reduce the characteristic variation between individuals of the crystal vibrating element 110 and improve the yield.

Next, the second substrate 120 is joined to the first substrate 130 (S19). As a result, the first electronic component 101 including the second electronic component 102 and the second substrate 120 is completed. As shown in FIG. 15, the first substrate 130 is joined to the second substrate 120 via the base member 137 and the joining member 140. First, the second substrate 120 is allowed to stand on the stage. Next, the first substrate 130 is heated while being pressed toward the second substrate 120 with a pressing pin so that the top portion 140a of the joining member 140 comes into contact with the facing surface 123 of the second substrate 120. At this time, an internal space 126 surrounded by the base member 137 and the joining member 140 is formed between the first substrate 130 and the second substrate 120. The internal space 126 is surrounded by the first main surface 132a of the first substrate 130 and the inner surface 124 of the second substrate 120, and the crystal vibrating element 110 is hermetically sealed. The airtight sealing space preferably has a reduced pressure atmosphere with respect to the atmosphere, and more preferably a vacuum atmosphere.

Next, a modified example of the first embodiment will be described. In the following description, the description of matters common to the above will be omitted. Further, in the following first and second modifications, the same effect as described above can be obtained.

<First modification>
The configuration of the crystal oscillator 301 according to the first modification of the first embodiment will be described with reference to FIG. At this time, FIG. 16 is a cross-sectional view schematically showing the configuration of the crystal oscillator according to the first modification. The first modification is different from the configuration example shown in FIG. 2 in that the second substrate 320 has a flat plate shape and the first substrate 330 has a concave shape. Further, the configuration example shown in FIG. 2 is that the first substrate 330 and the second substrate 320 are joined via the base member 337 and the joining member 340 to form an internal space 326 for accommodating the crystal vibrating element 310. Is similar to.

In the first modification, the substrate 331 has a step 339 on the first main surface 332a. The central portion of the substrate 331 is concave when viewed in a plan view from the normal direction of the first main surface 332a, and the outer peripheral edge portion of the central portion projects to the second substrate 320. The crystal vibrating element 310 is surrounded by a step 339 when viewed in a plan view from the normal direction of the first main surface 332a. The second substrate 320 has a flat plate shape, the side wall portion is omitted, and the facing surface 323 is provided on the side of the top surface portion 321 facing the first substrate 330.

<Second modification>
The configuration of the crystal vibration element 910 according to the second modification of the present embodiment will be described with reference to FIG. At this time, FIG. 17 is a perspective view schematically showing the configuration of the crystal vibrating element according to the second modification.

The crystal vibrating element 910 in the second modification is different from the crystal vibrating element 10 shown in FIG. 1 in that the crystal piece 911 has a tuning fork shape. That is, the crystal unit according to the second modification is a tuning fork type crystal unit. Specifically, the crystal piece 911 has two vibrating arms 919a and 919b arranged in parallel. The vibrating arm portions 919a and 919b extend in the X-axis direction, are aligned in the Z'axis direction, and are connected to each other by the base portion 919c on the end surface 912c side. In other words, a plurality of vibrating arm portions 919a and 919b extend from the base portion 919c. In the vibrating arm portion 919a, excitation electrodes 914 b are provided on a pair of main surfaces parallel to the XZ'plane and facing each other, and excitation electrodes 914 are provided on a pair of side end surfaces intersecting the pair of main surfaces and facing each other. a is provided. The vibrating arms 919b, respectively excitation electrodes 914 a are provided on the pair of main surfaces, are respectively provided excitation electrode 914 b to the pair of side end surfaces.

As described above, according to the second modification, the piezoelectric vibrating element 910 is a tuning fork type crystal vibrating element having a plurality of vibrating arm portions 919a and 919b. The configuration of the piezoelectric vibrating element 910 is not particularly limited, and the shape and number of vibrating arms, the arrangement of the exciting electrodes, and the like may be different.

<Second Embodiment>
The configuration of the electronic component 502 according to the second embodiment will be described with reference to FIGS. 18 and 19. FIG. 18 is a plan view schematically showing the configuration of the electronic component according to the second embodiment. Figure 19 is a cross-sectional view schematically showing a cross-sectional structure taken along line XIX-XIX of the electronic component shown in FIG. 18. The electronic component 502 corresponds to a component on the first substrate 130 side before joining in step S19 of the first embodiment. The electronic component 502 is formed by the manufacturing method described in the first embodiment. Therefore, the same components as those described above are designated by the same reference numerals, and the description of the components common to those described above is omitted. The description of the same effect as described above will be omitted.

The electronic component 502 includes a first substrate 530, a crystal vibrating element 510, a base member 537, and a joining member 540.

The first substrate 530 includes a substrate 531 having a first main surface 532a and a second main surface 532b facing each other. The first substrate 530 is a ceramic substrate composed of a sintered body. The substrate 531 has a warped shape in which the cross section is convex on the side opposite to the first main surface so that the central portion of the first main surface 532a is concave.

The crystal vibrating element 510 is provided on the first main surface 532a side of the first substrate 530. The crystal vibrating element 510 is mounted on the first substrate 530 by the electrode pad 533a and the conductive holding member 536a, and is electrically connected to the first substrate 530.

The base member 537 is provided between the first main surface 532a of the first substrate 530 and the joining member 540. The base member 537 includes an adhesion layer 537A and a base layer 537B. The adhesion layer 537A is joined to the first main surface 532a of the first substrate 530. The adhesion layer 537A is in contact with the substrate 531 which is a ceramic substrate. The adhesion layer 537A is a sintered metal and is fired together with the sintered substrate 531. The base layer 537B includes a first layer 537C bonded to the adhesion layer 537A and a second layer 537D bonded to the first layer 537C.

The joining member 540 covers the base member 537. The material of the joining member 540 is only metal, and the joining member 540 forms an alloy with the base member 537. The bonding strength of the bonding member 540 to the base member 537 is greater than the bonding strength of the bonding member 540 to the first substrate 530. The joining member 540 is provided in a frame shape surrounding the crystal vibrating element 510 when the first main surface 532a of the first substrate 530 is viewed in a plan view.

The joining member 540 has a top portion 540a to be joined to the second substrate. The top portion 540a of the joining member 540 is provided in a plane. According to this, even when the shape of the joint surface of the second substrate is a plane shape different from the shape of the first main surface 532a of the first substrate 530, the bonding member 540 uses the first substrate 530 as the second substrate. On the other hand, it can be firmly joined. The top portion 540a of the joining member 540 is exposed and has a planar shape. According to this, the joining member 540 can firmly join the first substrate 530 to the second substrate.

Next, the performance evaluation of the joining member 540 will be described. An embodiment is a configuration using the method for manufacturing an electronic component of the first embodiment. In the comparative example, the joining member paste is applied on the base member, and the joining member paste is solidified as it is. Other manufacturing conditions of Examples and Comparative Examples are the same.

(Plane shape evaluation)
The evaluation result regarding the planar shape of the joining member 540 as the sealing frame will be described with reference to FIGS. 20 and 21. FIG. 20 is a graph showing the occurrence rate of shape defects of the joining member due to the excess of the joining member paste. FIG. 21 is a graph showing the occurrence rate of shape defects of the joining member due to the shortage of the joining member paste. In FIGS. 20 and 21, the horizontal axis of each graph indicates the mass of 2400 joining members 540 (hereinafter, referred to as “formation amount”). This was calculated by the mass change when 2400 joining members 540 were provided on the assembly substrate. In FIGS. 20 and 21, the vertical axis of each graph shows the occurrence rate of 2400 joining members 540 that are determined to be poorly shaped. The vertical axis of FIG. 20 shows the occurrence rate of shape defects in which the joining member 540 gathers at the corners, and is referred to as the shape defect rate (solder accumulation mode). The vertical axis of FIG. 21 indicates the occurrence rate of shape defects in which the joining member 540 becomes thin or interrupted at the side portion, and is referred to as a shape defect rate (frame cut mode). The black circle plot shows the data of the comparative example, and the black triangle plot shows the data of the example.

On the collective substrate of the first substrate 530 before being separated into pieces, 2400 annular base members 537 having a substantially rectangular shape having a width of 100 μm in a plan view were provided. Each base member 537 has a length of 1.5 mm in the long side direction, a length of 1.1 mm in the short side direction, and an area of 0.5 mm ² . As shown in FIG. 18, the electronic component 502 was viewed in a plane, and the image data captured by the camera was binarized to obtain a captured contour image of the 540 portion of the joining member. Next, the photographed outline image of the 540 parts of the joining member was divided into eight sections of four corners and four sides for comparison. In any one of the sections, when the area of the reference contour image that matches the reference contour image of the geometric joint member 540 is 60% or less of the area of the original reference contour image, it is determined to be defective and the shape is defective. The rate was calculated.

As shown in FIG. 20, when the amount of the joining member 540 formed was 280 mg, the shape defect rate (solder accumulation mode) of the example was about 0.1%, whereas that of the comparative example was about 4.0%. Met. Further, when the amount of the joining member 540 formed was 300 mg, the shape defect rate (solder accumulation mode) in the example was about 1.0%, whereas in the comparative example, the occurrence rate was about 15%. Even under the conditions, the defective rate of the comparative example was 10 times or more the defective rate of the example. As shown in FIG. 21, when the amount of the joining member 540 formed was 260 mg, the shape defect rate (frame cutting mode) of the example was about 1.0%, whereas that of the comparative example was about 9.0%. Met.

From this result, it was confirmed that by applying the embodiment of the present invention, the influence of softening at the time of solidification can be reduced and the joint member 540 with a small shape change can be obtained. In the embodiment, in order to manufacture the joining member 540 so that the shape defect rate (solder accumulation mode) is 10% or less and the shape defect rate (frame cutting mode) is 1.0% or less, the joining member 540 is formed. The amount needs to be adjusted to be greater than 260 mg and less than 360 mg. On the other hand, in the comparative example, in order to manufacture the joining member 540 so that the shape defect rate (solder accumulation mode) is 10% or less and the shape defect rate (frame cutting mode) is 1.0% or less, the joining member 540 is used. It is necessary to adjust the formation amount to be approximately 290 mg. As described above, according to the embodiment of the present invention, since the shape of the joint member is stable, it is possible to widen the permissible range of fluctuations in the manufacturing conditions regarding the amount of the joint member formed.

(Surface shape evaluation)
The evaluation result regarding the planar shape of the joining member 540 as the sealing frame will be described with reference to FIGS. 22 and 23. FIG. 22 is a diagram showing the surface shapes of the electronic components shown in FIG. 18 along the lines AB and A'-B'. 23, in the configuration coating dried bonding member paste on the lower ground member is a diagram showing a surface shape at a position corresponding to line A-B and A'-B'line. In FIGS. 20 and 21, the horizontal axis of each graph indicates the measurement position. 2 2 and 2 3, the vertical axis of each graph shows the relative value of the height. The broken line shows the data of the comparative example, and the solid line shows the data of the example.

As shown in FIG. 22, in the embodiment, the surface shape of the first main surface 532a of the first substrate 530 was a downwardly convex shape that was low at the central portion and high at both ends. As for the shape of the top portion 540a of the joining member 540, the shape of the shape change of the first main surface 532a of the first substrate 530 which is the base was small, and the flatness was small. Table 1 below shows the flatness of the substrate (flatness of the surface along the A'-B'line) and the flatness of the joining member (flatness of the surface along the line AB) in Samples 1 to 5. , And the ratio. The ratio is the ratio of the flatness of the top portion 540a of the joining member 540 to the flatness of the first main surface 532a of the first substrate 530 (flatness of the joining member / flatness of the substrate).

As shown in FIG. 22, in the embodiment, the shape of the surface along the A'-B'line corresponding to the first main surface 532a of the first substrate 530 is low at the center and high at both ends, and is convex downward. It was the shape of. The shape of the top portion 540a of the joining member 540 was also a downwardly convex shape in order to follow the shape change of the first main surface 532a of the first substrate 530 which is the base. Table 2 below shows the data for the comparative example.

In an embodiment, the ratio of the flat Mending the average value: 26.4%, the minimum value: 13.4%, was the maximum 37.2%. In the comparative example, the ratio of flatness was an average value of 62.9%, a minimum value of 49.5%, and a maximum value of 75.4%. In the examples, the flatness of the substrate was 12.5 μm, and the average flatness of the joining members was 3.3 μm. In the comparative example, the flatness of the substrate was 18.7 μm, and the average flatness of the joining members was 11.7 μm. As described above, it is desirable that the flatness of the top portion 540a is 40% or less of the flatness of the first main surface 532a of the first substrate 530. The flatness of the top 540a is preferably 9.0 μm or less, and more preferably 5.0 μm or less. At this time, the flatness of the first main surface 532a of the first substrate 530 is 10 μm or more. That is, even when the flatness of the first main surface 532a is 10 μm or more, according to the embodiment, the shape of the joining member 540 can be stabilized and the joining strength can be improved.

(Cross-sectional shape evaluation)
The evaluation results regarding the cross-sectional shape of the joining member 540 will be described with reference to FIGS. 24 to 26. FIG. 24 is an enlarged cross-sectional view of the joining member in the electronic component shown in FIG. FIG. 25 is a photograph of a cross section of a joining member in the electronic component according to the second embodiment. FIG. 26 is a photograph of a cross section of the joining member in a configuration in which the joining member paste is applied and dried on the base member as a comparative example. 25 and 26 are photographs of a cross section corresponding to FIG. 24.

Table 3 below shows the width W51 of the bottom surface of the joining member 540 on the first substrate 530 side, the width W52 of the top 540a, and the ratio of the width W52 to the width W51 (W52 / W51). In the comparative example, as shown in FIG. 26, the width of the top portion is substantially zero, so the description thereof will be omitted.

The width ratios W52 / W51 had an average value of 34%, a minimum value of 42%, and a maximum value of 35%. As described above, it is desirable that the width W52 of the top portion 540a is 30% or more of the width W51 of the bottom surface of the joining member 540 on the first substrate 530 side.

(Adhesion evaluation)
The evaluation result regarding the adhesion between the first substrate 530 and the second substrate by the joining member 540 will be described with reference to FIG. 27. FIG. 27 is a graph showing the occurrence rate of leak defects when sealed by a joining member in the electronic component according to the second embodiment. The leak defect was determined by measuring the fluctuation value of the frequency characteristic of the crystal unit using a known leak defect measuring method. The horizontal axis of the graph shown in FIG. 27 indicates the amount of the joining member 540 formed. The vertical axis of the graph shown in FIG. 27 shows the leak defect rate that occurred when the joining member 540 was used as a sealing frame. The black circle plot shows the data of the comparative example, and the black triangle plot shows the data of the example.

As shown in FIG. 27, the leak defect rate of the example is lower than the leak defect rate of the comparative example. In particular, in the vicinity of 265 mg, which is a condition where the molding amount of the joining member 540 is small, the leak defect rate of the comparative example is about 1.0%, whereas the leak defect rate of the example is reduced to about 0.2%. You can see that it is doing. That is, it is considered that in the examples, the occurrence of leak defects could be reduced as compared with the comparative examples.

From the above evaluation results, the following can be said. That is, when the amount of the joining member 540 formed in the comparative example is larger than 300 mg, there arises a problem that the shape defect rate (solder accumulation mode) of the comparative example becomes 10% or more. Further, as the amount of the joining member 540 formed increases, the height of the joining member 540 also increases, which is a limiting factor for lowering the height of the electronic component 502. According to the approximate curve of the shape defect rate (solder accumulation mode) of the embodiment, the shape defect rate (solder accumulation mode) is 10% or more when the formation amount of the joining member 540 is larger than 360 mg. Therefore, in order to reduce leak defects, the amount of the joint member 540 formed can be increased as compared with the comparative example within a range in which shape defects do not occur. From another point of view, in the embodiment, leakage defects can be reduced even when the amount of the joining member 540 formed is small. Therefore, in the examples, the height can be made lower than that in the comparative examples, and the consumption of the material can be reduced. In the comparative example, under the condition that the molding amount of the joining member 540 is 280 mg or more, the shape defect rate (solder accumulation mode) may be larger than 10%. Since the leak test is carried out by selecting electronic components 502 whose shape evaluation result is non-defective, it is a condition that an appropriate non-defective rate cannot be secured. Not tested.

<Third Embodiment>
A method of manufacturing an electronic component according to a third embodiment will be described with reference to FIGS. 28 and 29. FIG. 28 is a plan view schematically showing the configuration of the electronic component according to the third embodiment. FIG. 29 is a cross-sectional view schematically showing the configuration of a cross section along the XXIX-XXIX line shown in FIG. 28.

The electronic component 601 is manufactured by joining the second substrate 620 to the electronic component 602 including the first substrate 630, the plurality of first joining members 645, and the plurality of second joining members 646. The first substrate 630 includes a rewiring layer 681, an integrated circuit 682, and a mold layer 683. The rewiring layer 681 is provided on the first main surface 632a side of the first substrate 630. The integrated circuit 682 corresponds to an electric element. The integrated circuit 682 is provided on the second main surface 632b side of the rewiring layer 681. The mold layer 683 covers the integrated circuit 682.

Each of the plurality of first joining members 645 includes a first top portion 645a. Each of the plurality of second joining members 646 includes a second top portion 646a. When the first main surface 632a of the first substrate 630 is viewed in a plan view, the first joining member 645 and the second joining member 646 are different in shape or size from each other. The first top 645a and the second top 645c are different in shape or size from each other. The plurality of first joining members 645 and the plurality of second joining members 646 are provided so as to overlap the plurality of base members 637, respectively. Specifically, three or more base members 637 that function as part of the electrode pads of electronic components pass through the rewiring layer 681 to the integrated circuit 682, a plurality of first joining members 645, and a plurality of second joining members. 646 and is electrically connected.

It is desirable that the plurality of tops 645a and the plurality of tops 646a have the same configuration as the tops 530a of the joining member 540 according to the second embodiment. That is, the plurality of tops 645a and the plurality of tops 646a are exposed and have a planar shape. At this time, it is desirable that the widths of the plurality of tops 645a and the plurality of tops 646a are 30% or more with respect to the widths of the bottom surfaces of the plurality of joining members 645 and 646 on the first substrate 630 side. Further, the plurality of tops 645a and the plurality of tops 646a are provided in a virtual plane. The flatness of the plurality of tops 645a and the plurality of tops 646a is 40% or less of the flatness of the first main surface 632a of the first substrate 630. Further, the flatness of the plurality of tops 645a and the plurality of tops 646a is 9.0 μm or less, and preferably 5.0 μm or less.

<Additional notes>
Hereinafter, a part or all of the embodiments of the present invention will be described as appendices. The present invention is not limited to the following appendices.

The first step of providing the base member on the first main surface of the first substrate, and
A second step of sandwiching the base member and the joining member paste between the first main surface of the first substrate and the transfer main surface of the transfer substrate.
A third step of forming a joining member joined to the base member while the joining member paste is sandwiched between the first substrate and the transfer substrate.
A fourth step of peeling the transfer substrate from the joining member joined to the base member, and
A method for manufacturing an electronic component, which comprises.

The third step is
The step of heating the joining member paste and
After the heating step, a step of cooling the joining member and
A method of manufacturing electronic components.

The first step of providing the base member on the first main surface of the first substrate, and
A second step of sandwiching the base member and the joining member paste provided on the base member between the first main surface of the first substrate and the transfer main surface of the transfer substrate.
A third step of forming a joining member by softening and solidifying the joining member paste by heating and cooling the joining member paste while being sandwiched between the first substrate and the transfer substrate.
A fourth step of peeling the transfer substrate from the joining member joined to the base member, and
A method for manufacturing an electronic component, which comprises.

The second step is a method for manufacturing an electronic component, comprising a step of providing the joining member paste on the transfer main surface of the transfer substrate.

A method for manufacturing an electronic component, wherein in the fourth step, the bonding strength of the transfer substrate to the bonding member is smaller than the bonding strength of the base member to the bonding member.

A method for manufacturing an electronic component, wherein in the fourth step, the bonding strength of the transfer substrate to the bonding member is smaller than the bonding strength of the first substrate to the base member.

A method for manufacturing an electronic component, wherein in the fourth step, the bonding strength of the transfer substrate to the bonding member is the smallest among the bonding strengths between the first substrate and the transfer substrate.

The joining member paste is a method for manufacturing an electronic component, which comprises a metal and a flux.

A method for manufacturing an electronic component, wherein the joining member is made of metal.

A method for manufacturing an electronic component, wherein in the third step, the base member and the joining member form a metal joint.

A method for manufacturing an electronic component, in which the flux contained in the joining member paste covers the joining member in the third step.

A method for manufacturing an electronic component, further comprising a step of removing the flux.

A method for manufacturing an electronic component, wherein the transfer main surface of the transfer substrate is made of a non-metal material.

The transfer substrate is a method for manufacturing an electronic component, which is made of ceramic.

The transfer substrate is a method for manufacturing an electronic component, which is made of glass.

A method for manufacturing an electronic component, wherein the transfer main surface of the transfer substrate has a surface roughness smaller than that of the first main surface of the first substrate.

A method for manufacturing an electronic component, wherein the transfer main surface of the transfer substrate has a flatness smaller than that of the first main surface of the first substrate.

In the second step, the region of the transfer main surface of the transfer substrate facing the first main surface of the first substrate via the joining member paste is larger than that of the first main surface of the first substrate. A method for manufacturing electronic components with low flatness.

In the first step, a plurality of the base members are provided,
A method for manufacturing an electronic component, in which a plurality of the joining members are formed so as to come into contact with each of the plurality of base members in the third step.

The plurality of joining members include a first joining member and a second joining member whose shape or size is different from that of the first joining member when the first main surface of the first substrate is viewed in a plan view. , Manufacturing method of electronic parts.

A method for manufacturing an electronic component, wherein in the second step, when the first main surface of the first substrate is viewed in a plan view, the joining member paste is provided so as to overlap the shape of the base member.

A method for manufacturing an electronic component, wherein the wettability of the joining member paste to the base member is greater than the wetting property of the joining member paste to the transfer main surface of the transfer substrate.

A method for manufacturing an electronic component, wherein the wettability of the joining member paste to the base member is greater than the wetting property of the joining member paste to the first main surface of the first substrate.

A method for manufacturing an electronic component, wherein in the fourth step, the shape of the transfer main surface of the transfer substrate is transferred to the top of the joining member.

A method for manufacturing an electronic component, wherein in the first step, the base member is provided in an annular shape when the first main surface of the first substrate is viewed in a plan view.

In the first step, the base member is provided in a rectangular ring shape when the first main surface of the first substrate is viewed in a plan view.
In the second step, the joining member paste is provided so as to avoid the rectangular annular corner portion of the base member when the first main surface of the first substrate is viewed in a plan view. ..

A method for manufacturing an electronic component, further comprising a fifth step of joining the first substrate to a second substrate via the base member and the joining member.

A method for manufacturing an electronic component, wherein in the fifth step, an internal space surrounded by the base member and the joining member is formed between the first substrate and the second substrate.

A method for manufacturing an electronic component, further comprising a step of providing an electronic element on the first substrate.

A method for manufacturing an electronic component, wherein the electronic element is arranged in the sealed internal space.

A method for manufacturing an electronic component, wherein the electronic element is a piezoelectric vibration element having a substantially rectangular shape when the first main surface of the first substrate is viewed in a plan view.

A method for manufacturing an electronic component, wherein the electronic element is a tuning fork type crystal vibrating element having a plurality of vibrating arms.

A method for manufacturing an electronic component, wherein the base member includes an adhesion layer in contact with the first substrate and a base layer located between the adhesion layer and the bonding member.

The first step is
The process of installing a ceramic green sheet and
The step of providing the adhesion layer paste on the first main surface of the green sheet and
A step of firing the green sheet and the adhesion layer paste to form the first substrate from the green sheet and forming the adhesion layer from the adhesion layer paste.
The step of plating and forming the base layer on the adhesion layer,
Manufacturing methods for electronic components, including.

A first substrate having a warped first main surface and
A joining member provided on the first main surface side of the first substrate and having a top portion to be joined to the second substrate.
With
An electronic component in which the top of the joining member is provided in a plane.

A first substrate having a first main surface and
A joining member provided on the first main surface side of the first substrate and having a top portion,
With
An electronic component in which the top of the joining member is exposed and has a planar shape.

An electronic component whose top flatness is 40% or less of the flatness of the first main surface of the first substrate.

An electronic component having a top flatness of 9.0 μm or less.

An electronic component having a top flatness of 5.0 μm or less.

An electronic component in which the width of the top portion is 30% or more with respect to the width of the bottom surface of the joining member on the first substrate side.

The first substrate is a ceramic substrate composed of a sintered body.
An electronic component in which a base member including an adhesion layer is provided between the first main surface of the first substrate and the joining member.

An electronic component in which the adhesion layer is a sintered metal and is in contact with the ceramic substrate.

The first main surface of the first substrate is an electronic component having a warped shape.

An electronic component having a flatness of 10 μm or more on the first main surface of the first substrate.

The joining member is an electronic component that is provided in an annular shape when the first main surface of the first substrate is viewed in a plan view.

The joining member is an electronic component provided in a rectangular ring shape when the first main surface of the first substrate is viewed in a plan view.

An electronic component comprising a plurality of the joining members having different shapes or sizes when the first main surface of the first substrate is viewed in a plan view.

A first substrate having a first main surface and
A plurality of joining members provided on the first main surface side of the first substrate and having at least three tops, and a plurality of joining members.
With
An electronic component in which the flatness of at least three tops is 40% or less of the flatness of the first main surface of the first substrate.

A first substrate having a first main surface and
A plurality of joining members provided on the first main surface side of the first substrate and having at least three tops, and a plurality of joining members.
With
An electronic component having a flatness of at least three tops of 9.0 μm or less.

An electronic component having a flatness of at least three tops of 5.0 μm or less.

A first substrate having a first main surface and
A plurality of joining members provided on the first main surface side of the first substrate and having at least three tops, and a plurality of joining members.
With
An electronic component whose at least three tops are exposed and planar.

An electronic component in which the width of at least three tops is 30% or more with respect to the width of the bottom surface of the plurality of joining members on the first substrate side.

A base member provided between the first substrate and the joining member is further provided.
An electronic component in which the joining strength of the joining member with respect to the base member is greater than the joining strength of the joining member with respect to the first substrate.

The joining member is an electronic component forming an alloy with the base member.

An electronic component in which the material of the joining member is only metal.

The first substrate includes an electrode pad provided on the first main surface.
The joining member is an electronic component arranged on the electrode pad.

An electronic component in which an electronic element is provided on the first substrate.

The electronic element is an electronic component that is a piezoelectric vibration element.

The electronic element is provided on the first main surface side of the first substrate.
At least one of the joining members is an electronic component provided in a frame shape surrounding the electronic element when the first main surface of the first substrate is viewed in a plan view.

As described above, according to the present invention, it is possible to provide a method for manufacturing an electronic component capable of stabilizing the shape of a joining member.

It should be noted that the embodiments described above are for facilitating the understanding of the present invention, and are not for limiting and interpreting the present invention. The present invention can be modified / improved without departing from the spirit of the present invention, and the present invention also includes an equivalent thereof. That is, those skilled in the art with appropriate design changes to each embodiment are also included in the scope of the present invention as long as they have the features of the present invention. For example, each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those exemplified, and can be changed as appropriate. In addition, the elements included in each embodiment can be combined as much as technically possible, and the combination thereof is also included in the scope of the present invention as long as the features of the present invention are included.

1 ... Crystal oscillator 10 ... Crystal vibrating element 20 ... Second substrate 21 ... Top surface 22 ... Side wall 23 ... Facing surfaces 30, 130 ... First substrate 31,131 ... Bases 32a, 132a ... First main surfaces 32b, 132b ... Second main surface 33a, 33b, 133a, 133b ... Electrode pad 37, 137 ... Base member 151 ... Transfer substrate 152a ... Transfer main surface 160 ... Metal mask 161 ... Opening 161a ... First slit 161b ... Second slit 161c ... 3rd slit 161d ... 4th slit 163a, 163b, 163c, 163d ... Bridge part 165 ... Squeegee 40, 140 ... Joining member 141a ... 1st part 141b ... 2nd part 141c ... 3rd part 141d ... 4th part 143a, 143b , 143c, 143d ... Corner

Claims (22)

The first step of providing the base member on the first main surface of the first substrate, and
A second step of sandwiching the base member and the joining member paste between the first main surface of the first substrate and the transfer main surface of the transfer substrate.
This is a third step of forming a joint member having a closed frame shape joined to the base member while the joining member paste is sandwiched between the first substrate and the transfer substrate. Is a third step consisting of a sealing metal material or an insulating material,
A fourth step of peeling the transfer substrate from the joining member joined to the base member, and
With
The third step is
A step of heating and melting the joining member paste to bring the metal component in the joining member paste into a liquid phase state,
The step of forming the joining member by changing the metal component in the joining member paste from the liquid phase state to the solid phase state.
A method for manufacturing an electronic component, which comprises. In the third step, the flux in the joining member paste is positioned outside the metal component.
The method for manufacturing an electronic component according to claim 1. The third step includes a step of cooling the joining member paste after heating and melting the joining member paste.
The method for manufacturing an electronic component according to claim 1 or 2. In the fourth step, the bonding strength of the transfer substrate to the bonding member is smaller than the bonding strength of the base member to the bonding member.
The method for manufacturing an electronic component according to any one of claims 1 to 3. In the fourth step, the bonding strength of the transfer substrate to the bonding member is smaller than the bonding strength of the first substrate to the base member.
The method for manufacturing an electronic component according to any one of claims 1 to 4. In the fourth step, the bonding strength of the transfer substrate to the bonding member is the smallest among the bonding strengths between the first substrate and the transfer substrate.
The method for manufacturing an electronic component according to any one of claims 1 to 5. The surface roughness of the transfer main surface of the transfer substrate is smaller than that of the first main surface of the first substrate.
The method for manufacturing an electronic component according to any one of claims 1 to 6. The transfer main surface of the transfer substrate has a smaller flatness than the first main surface of the first substrate.
The method for manufacturing an electronic component according to any one of claims 1 to 7. In the second step, the region of the transfer main surface of the transfer substrate facing the first main surface of the first substrate via the joining member paste is larger than that of the first main surface of the first substrate. Small flatness,
The method for manufacturing an electronic component according to any one of claims 1 to 8. In the first step, a plurality of the base members are provided,
In the third step, the plurality of joint members are formed so as to come into contact with each of the plurality of base members.
The method for manufacturing an electronic component according to any one of claims 1 to 9. The plurality of joining members include a first joining member and a second joining member whose shape or size is different from that of the first joining member when the first main surface of the first substrate is viewed in a plan view. ,
The method for manufacturing an electronic component according to claim 10. In the second step, when the first main surface of the first substrate is viewed in a plan view, the joining member paste is provided so as to overlap the shape of the base member.
The method for manufacturing an electronic component according to any one of claims 1 to 11. The wettability of the joining member paste to the base member is greater than the wetting property of the joining member paste to the transfer main surface of the transfer substrate.
The method for manufacturing an electronic component according to any one of claims 1 to 12. The wettability of the joining member paste to the base member is greater than the wetting property of the joining member paste to the first main surface of the first substrate.
The method for manufacturing an electronic component according to any one of claims 1 to 13. In the fourth step, the shape of the transfer main surface of the transfer substrate is transferred to the top of the joining member.
The method for manufacturing an electronic component according to any one of claims 1 to 14. In the first step, the base member is provided in an annular shape when the first main surface of the first substrate is viewed in a plan view.
The method for manufacturing an electronic component according to any one of claims 1 to 15. In the first step, the base member is provided in a rectangular ring shape when the first main surface of the first substrate is viewed in a plan view.
In the second step, the joining member paste is provided so as to avoid the rectangular annular corner portion of the base member when the first main surface of the first substrate is viewed in a plan view.
The method for manufacturing an electronic component according to any one of claims 1 to 16. When it is assumed that the volume of the joining member paste is V1 and the volume of the joining member paste is V2 when it is assumed that the joining member paste is also provided at the rectangular annular corner portion of the base member.
0.80 ≤ V1 / V2 ≤ 0.95
The method for manufacturing an electronic component according to claim 17, which satisfies the above conditions. In the second step, the joining member paste has a first portion, a second portion, a third portion and a fourth portion separated from each other.
The first portion and the third portion correspond to a pair of long sides of the base member.
The second part and the fourth part correspond to a pair of short sides of the base member, and correspond to the pair of short sides.
The thickness of the joining member paste is T, the width in the lateral direction is A, the length of the first portion and the third portion in the longitudinal direction is L1, the length including the corners is L2, and the second portion. And when the length of the fourth part in the longitudinal direction is W1 and the length including the corners is W2,
0.80 ≦ (L1 + W1) / (W2 + L2-2 × A) ≦ 0.95
The method for manufacturing an electronic component according to claim 17, which satisfies the above conditions. 0.86 ≦ (L1 + W1) / (W2 + L2-2 × A) ≦ 0.92
The method for manufacturing an electronic component according to claim 19. The base member includes an adhesion layer in contact with the first substrate and a base layer located between the adhesion layer and the bonding member.
The method for manufacturing an electronic component according to any one of claims 1 to 20. The first step is
The process of installing a ceramic green sheet and
The step of providing the adhesion layer paste on the first main surface of the green sheet and
A step of firing the green sheet and the adhesion layer paste to form the first substrate from the green sheet and forming the adhesion layer from the adhesion layer paste.
The step of plating and forming the base layer on the adhesion layer,
including,
The method for manufacturing an electronic component according to claim 21.

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