JP6909976B2 - Light emitting device - Google Patents

Description

The present disclosure relates to a light emitting device.

As a kind of light emitting device using a semiconductor element such as an LED element, a light emitting device using a package in which a lead is held by a resin member has been proposed. Usually, such a light emitting device is bonded to a wiring board using solder. In some cases, a recess is formed in the lower part of the side surface of the package of the light emitting device so that the shape (fillet) of the solder after joining can be confirmed (for example, Patent Documents 1 and 2).

Flux may be used at the time of solder bonding, and the flux may crawl above the recess on the side surface of the light emitting device. At that time, flux may enter the light emitting device from the interface between the lead on the side surface of the light emitting device and the resin member.

Japanese Unexamined Patent Publication No. 2011-228812 Japanese Unexamined Patent Publication No. 2014-6404

One embodiment of the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a light emitting device capable of suppressing the infiltration of flux.

The light emitting device according to the embodiment is a package having a pair of leads, a resin member that integrally holds the pair of leads, and a convex portion, and has a bottom surface on which the upper surface of the pair of leads is exposed. A package provided with an element mounting recess having a side wall, a recess opening on the outer surface and the lower surface, a light emitting element arranged on the bottom surface of the element mounting recess, and the element mounting recess. An arranged sealing member is provided, and at least one of the leads is formed by extending from the main body portion exposed on the lower surface of the package and the main body portion to form a part of the outer surface of the package, and forming a part of the outer surface of the lower surface. At least a part thereof has a hanging portion exposed above the lower surface of the main body portion in the concave portion, and the convex portion is arranged on the lower surface of the hanging portion and is separated from the main body portion. The lower surface of the convex portion is located above the lower surface of the main body portion.

According to the embodiment, it is possible to realize a light emitting device capable of suppressing the infiltration of flux.

It is a perspective view seen from the diagonally upper side which shows the light emitting device which concerns on 1st Embodiment. It is a perspective view seen from the diagonally lower side which shows the light emitting device which concerns on 1st Embodiment. It is an end view which shows the light emitting device which concerns on 1st Embodiment. It is a perspective view which shows the lead, the convex part, the light emitting element and the wire of the light emitting device which concerns on 1st Embodiment, and is the figure which omitted the resin member and the sealing member. It is an end view which shows the state which the light emitting device which concerns on 1st Embodiment is mounted on a wiring board. It is a partially enlarged end view which shows the light emitting device which concerns on 1st modification of 1st Embodiment. It is a partially enlarged end view which shows the light emitting device which concerns on the 2nd modification of 1st Embodiment. It is a partially enlarged end view which shows the light emitting device which concerns on the 3rd modification of 1st Embodiment. It is an end view which shows the light emitting device which concerns on 2nd Embodiment. It is a perspective view which shows the light emitting device which concerns on 3rd Embodiment. It is a side view which shows the light emitting device which concerns on 3rd Embodiment. It is a perspective view which shows the lead, the convex part, the light emitting element and the wire of the light emitting device which concerns on 3rd Embodiment, and is the figure which omitted the resin member and the sealing member. FIG. 13A is an end view showing a method of manufacturing a light emitting device according to a fourth embodiment. FIG. 13B is an end view showing a method of manufacturing the light emitting device according to the fourth embodiment. FIG. 13C is an end view showing a method of manufacturing a light emitting device according to a fourth embodiment. FIG. 13D is an end view showing a method of manufacturing the light emitting device according to the fourth embodiment. FIG. 13E is an end view showing a method of manufacturing the light emitting device according to the fourth embodiment. It is a top view which shows the manufacturing method of the light emitting device which concerns on 4th Embodiment.

In this specification, the XYZ Cartesian coordinate system is adopted for convenience of explanation. For example, as shown in FIG. 1, the direction from the first lead 11 to the second lead 12 is defined as the “+ X direction”, and the opposite direction is defined as the “−X direction”. The + X direction and the -X direction are collectively referred to as the "X direction". The directions orthogonal to the X direction are referred to as "+ Y direction" and "-Y direction", and the directions orthogonal to the X direction and Y direction are referred to as "+ Z direction" and "-Z direction". The + Z direction is also called "up" and the -Z direction is also called "down", but this notation is also for convenience and is irrelevant to the direction of gravity.

<First Embodiment>
As shown in FIGS. 1 to 4, the light emitting device 1 according to the present embodiment includes a package 10, a light emitting element 17, and a sealing member 19.

The package 10 is a base on which an electronic component such as a light emitting element is placed, and includes, for example, a first lead 11 and a second lead 12 as leads 111 that function as a pair of electrodes. The first lead 11 and the second lead 12 are separated from each other and are integrally held by the insulating resin member 13. The resin member 13 is arranged in a part above the lead 111, between the leads 111 (between the first lead and the second lead), and a part below the lead 111.

The shape of the package 10 is a substantially rectangular parallelepiped, and the four outer surfaces S include a first side surface 10a, a second side surface 10b, a third side surface 10c, and a fourth side surface 10d. The second side surface 10b is arranged on the opposite side of the first side surface 10a, and the fourth side surface 10d is arranged on the opposite side of the third side surface 10c.

The package 10 includes an element mounting recess 10i that opens on the upper surface 10e. The package 10 includes a recess R that opens to the lower surface 10f and the outer surface S. The recess R includes, for example, a first recess 10g that opens in the first side surface 10a and the lower surface 10f, and a second recess 10h that opens in the second side surface 10b and the lower surface 10f. The recess R is a space for facilitating the formation of solder fillets, and at least a part of the inner surface of each recess is composed of leads.

The package 10 includes a convex portion 112 in the concave portion R. For example, the first convex portion 15a is provided in the first concave portion 10g, and the second convex portion 15b is provided in the second concave portion 10h. By providing the convex portion 112 in the concave portion R, it is possible to prevent the flux used at the time of solder joining from entering the inside from the interface between the lead (suspended portion) on the side surface of the package 10 and the resin member.

FIG. 5 is an end view showing a state in which the light emitting device according to the present embodiment is mounted on a wiring board, and the infiltration of flux will be described with reference to this figure. In the following, the first convex portion of the first concave portion will be described as an example. The second convex portion of the second concave portion 10h has the same shape and the like as the first convex portion of the first concave portion, and thus the description thereof will be omitted.

The wiring board 100 has an insulating plate 101 made of an insulating material such as a resin material or a ceramic material, and a wiring 102 made of a conductive material such as copper formed in a part of an upper layer portion thereof.

The light emitting device 1 is arranged on the flux-cored solder 103 arranged on the wiring 102. The solder 103 is arranged in the first recess 10g.

The solder 103 is heated to melt it once and then solidified to form a fillet. At this time, the solder 103 is joined to the exposed surfaces of the first main body portion 11a and the first hanging portion 11b of the first lead 11 in the first recess 10g.

As a result, the first lead 11 is joined to the wiring 102 via the solder 103, and the joined state of the solder 103 can be visually recognized.

The light emitting device 1 according to the present embodiment is the first along the surface of the light emitting device 1 from the exposed surface of the first hanging portion 11b to the interface between the first lead 11 and the resin member 13 in the first recess 10g. Since the first convex portion 15a is interposed in the path P1, the first path P1 is a path that bypasses the first convex portion 15a. Therefore, the first path P1 is longer than when the first convex portion 15a is not provided. Therefore, it becomes difficult for the flux contained in the solder 103 to reach the interface between the first lead 11 and the resin member 13 by following the first path P1, and it becomes difficult for the flux to enter the package 10 from this interface. be able to.

The first convex portion 15a is arranged on the region on the tip end side of the lower surface 11g of the first suspension portion 11b of the first lead 11, and constitutes a part of the first side surface 10a of the package 10. The first convex portion 15a is exposed in the first concave portion 10g. The first convex portion 15a is separated from the first main body portion 11a of the first lead 11, and the lower surface 15g of the first convex portion 15a is located above the lower surface 11f of the first main body portion 11a and is first suspended. It is located below the lower surface 11g of the portion 11b.

In other words, the upper bottom of the first recess 10g is the first hanging portion 11b, the two inner surfaces connected to the first side surface 10a are the resin member 13, and the inner surface g on the back side of the first recess 10g is separated from the first side surface 10a. Each of the first main body portions 11a is composed of the first main body portion 11a. The first hanging portion 11m is separated from the lower surface 10f of the package 10 on the first side surface, and the side view shape is substantially quadrangular.

The shape of the convex portion 112 as described above is, for example, a rectangular parallelepiped. The width of the convex portion 112 (width in the Y direction) is preferably the same as the width of the concave portion R. Further, the depth width (width in the X direction) of the convex portion 112 can be, for example, 50% to 80% with respect to the depth width of the concave portion R. Further, the length between the inner surface of the convex portion 112 and the inner side surface of the concave portion R is, for example, 20% to 50% with respect to the length between the outer side surface of the package and the inner side surface of the concave portion R. can do. The thickness of the convex portion 112 (thickness in the Z direction) can be, for example, 33% to 67% with respect to the height of the concave portion R (height from the lower surface of the package to the upper bottom of the concave portion).

The convex portion 112 is made of a resin material, and is made of, for example, the same resin material as the resin member 13. Further, the convex portion 112 may be formed of a resin material that is softer than the resin material that forms the resin member 13. Further, the convex portion 112 is preferably made of a material having better adhesion to the lead as compared with the resin material.

When the convex portion 112 and the resin member 13 are made of the same material, a similar gap is formed between the interface between the convex portion and the lead and the interface between the lead and the resin member. there is a possibility. However, between the interface located on the outer surface side and the interface in the recess, the interface located on the outer surface tends to have a larger gap. This is due to the fact that the outer surface is a surface formed by cutting, as will be described later. Due to the stress applied when cutting the resin member, the lead, and the convex portion at the same time, a gap is likely to be formed at the interface of the outer surface. On the other hand, the interface between the convex portion located inside the concave portion (upper bottom) and the lead is less likely to be stressed at the time of cutting. Therefore, it is difficult for a gap to be formed. Therefore, the flux does not easily penetrate into the interface between the resin member and the convex portion inside the concave portion, and travels on the surface of the convex portion. As a result, the path through which the flux is transmitted can be lengthened.

The leads (first lead 11 and second lead 12) each include a main body portion and a hanging portion. The main body is a portion that is mainly exposed on the bottom surface of the element mounting recess. Further, the hanging portion is a portion connected to a lead portion, a support column, or a frame portion adjacent to each other at the time of manufacturing, and is a portion forming a part of an outer surface of the light emitting device by being cut. The hanging portion may or may not be exposed on the bottom surface of the element mounting recess. In FIG. 3 and the like, the hanging portion is arranged at the lower part of the side wall of the recess.

For example, the first lead 11 includes a first main body portion 11a, a first suspension portion 11b, and a first side suspension portion 11c and 11d. The first main body portion 11a includes an upper surface having an area on which a light emitting element can be mounted on the bottom surface of the element mounting recess.

The first hanging portion 11b extends from the first main body portion 11a to the first side surface 10a of the package 10. The tip surface of the first hanging portion 11b is exposed on the first side surface 10a and forms a part of the first side surface 10a. The first side suspension portion 11c extends from the first main body portion 11a to the third side surface 10c. The tip surface of the first side hanging portion 11c is exposed on the third side surface 10c and forms a part of the third side surface 10c. The first side suspension portion 11d extends from the first main body portion 11a to the fourth side surface 10d. The tip surface of the first side suspension portion 11d is exposed on the fourth side surface 10d and forms a part of the fourth side surface 10d.

The upper surfaces of the first main body portion 11a, the first hanging portion 11b, the first side hanging portions 11c and 11d form a continuous first upper surface 11e. On the other hand, the lower surface 11f of the first main body 11a is located below the lower surfaces of the first suspension 11b, the first suspension 11c and 11d, is exposed on the lower surface 10f of the package 10, and a part of the lower surface 10f is exposed. It is configured. The lower surface 11g of the first hanging portion 11b is not covered with the resin member 13. That is, in the first recess 10g, a part of the side surface of the first main body portion 11a and a part of the lower surface 11g of the first suspension portion 11b are exposed.

The second lead 12 basically has the same configuration as the first lead 11. In the example shown in FIG. 1 and the like, the second main body portion 12a of the second lead 12 includes an upper surface having an area to which a wire can be connected on the lower surface of the element mounting recess. Further, the length of the second main body portion 12a in the Y direction and the length in the Z direction are equal to the length of the first main body portion 11a of the first lead 11 in the Y direction and the length in the Z direction, respectively. On the other hand, the length of the second main body portion 12a in the X direction is shorter than the length of the first main body portion 11a in the X direction. The light emitting element may be placed on the second lead 12, and the length in the X direction may be the same as that of the first lead 11.

The lead 111 includes a base material and a metal layer such as plating provided on the surface thereof. Substrates include, for example, copper, aluminum, gold, silver, iron, nickel, or metals such as alloys thereof, phosphor bronze, iron-containing copper. These may be a single layer or a laminated structure (for example, a clad material). The surface of the base material contains, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper, or an alloy thereof as the metal layer. Further, the metal layer formed on the upper surface of the reed and the metal layer formed on the lower surface may be different. Further, since the end surface of the hanging portion is a surface exposed by cutting, the base material of the lead is exposed. For example, when the base material is copper, the wettability of the solder is low, so that it is difficult for the solder to be bonded to the end face of the base material. However, since the lower surface of the hanging portion and the side surface of the main body portion that form a part of the inner surface of the recess have a metal layer such as silver on the outermost surface, the solder has good wettability. Since the metal layer having good wettability of the solder is exposed on the inner side surface of the recess, the fillet of the solder is easily formed.

When a silver or silver alloy plating layer is formed on the outermost surface of the lead, it is preferable that a protective layer such as silicon oxide is provided on the surface of the silver or silver alloy plating layer. As a result, it is possible to suppress discoloration of the silver or silver alloy plating layer due to sulfur components in the atmosphere or the like. The protective layer can be formed by a vacuum process such as sputtering, but other known methods may be used.

The package includes an element mounting recess 10i in addition to the recess described above. The bottom surface of the element mounting recess 10i may have an area on which the light emitting element can be mounted. It is preferable that the height of the element mounting recess 10i, in other words, the height of the inner surface of the recess is higher than that of the light emitting element. Further, when the light emitting element and the lead are joined by using a wire, it is preferable that the height of the wire is higher than the total height of the light emitting element and the wire. The shape of the opening of the element mounting recess is, for example, a circular shape, an elliptical shape, a quadrangle, a polygonal shape, a shape obtained by combining these, a shape obtained by cutting out a part of these shapes, a rounded shape, or the like in a top view. Can be. The inner surface of the element mounting recess may be a surface perpendicular to or inclined with respect to the bottom surface of the recess. The upper surface of the lead, specifically, the first upper surface 11e of the first lead 11 and the second upper surface 12e of the second lead 12 form a part of the lower surface of the element mounting recess 10i. The upper surface 10e of the package 10 is also the upper surface of the side wall of the recess, and is composed of the resin member 13. The inner surface of the element mounting recess 10i is made of a resin member 13.

As the resin member, a thermoplastic resin, a thermosetting resin, or the like can be used as the resin material to be the base material. Specifically, an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition such as a silicone-modified epoxy resin, a modified silicone resin composition such as an epoxy-modified silicone resin, an unsaturated polyester resin, a saturated polyester resin, and a polyimide resin. Cured products such as compositions and modified polyimide resin compositions, resins such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, and PBT resin. Can be used. In particular, it is preferable to use a thermosetting resin of an epoxy resin composition or a modified silicone resin composition. The resin member preferably has a viscosity of 10 pa · s to 40 pa · s in an uncured state, and more preferably 15 pa · s to 25 pa · s.

Further, the resin member is a reflective member (for example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, nitride) which is difficult to absorb light from a light emitting element and has a large difference in refractive index with respect to the resin as a base material. By dispersing light-scattering particles such as aluminum), light can be reflected efficiently. Alternatively, in order to improve the contrast of the light emitting device, one having a low light reflectance with respect to the external light (in many cases, sunlight) of the light emitting device may be used. In this case, it is usually preferable that the color is black or a color similar thereto. As the filler at this time, carbon such as acetylene black, activated carbon and graphite, transition metal oxides such as iron oxide, manganese dioxide, cobalt oxide and molybdenum oxide, or colored organic pigments can be used depending on the purpose. can.

The light emitting device 1 includes an adhesive 16, a light emitting element 17, a wire 18, and a sealing member 19 in addition to the above-mentioned package. The light emitting element 17 is adhered to the upper surface of the first main body portion 11a of the first lead 11 via the adhesive 16. The light emitting element 17 is arranged on the bottom surface of the element mounting recess 10i of the package 10. The wire 18 connects the electrode provided on the upper surface of the light emitting element 17 with the upper surface of the first main body 11a and the second main body 12a. The sealing member 19 is arranged in the element mounting recess 10i of the package 10 and seals the adhesive 16, the light emitting element 17, and the wire 18. The sealing member 19 is composed of, for example, a phosphor dispersed in a base material made of a translucent resin.

<First modification of the first embodiment>
FIG. 6 is a partially enlarged end view showing a light emitting device according to this modified example.

In the light emitting device 1a according to this modification, the first outer surface of the first convex portion 15a is located inside the first side surface 10a of the package 10. For example, it can be located inside by about 50 μm to 500 μm. Similarly, the outer surface of the second convex portion 15b (see FIG. 3) is located inside the second side surface 10b (see FIG. 3) of the package 10.

This also lengthens the first path P1 and the second path P2, so that the effect of suppressing the infiltration of flux can be obtained.
The configuration, operation, and effect other than the above in this modification are the same as those in the first embodiment. Further, in this modification, the convex portion can be obtained without cutting. Therefore, it is possible to make it difficult to form a gap between the lead and the convex portion.

<Second variant of the first embodiment>
FIG. 7 is a partially enlarged end view showing a light emitting device according to this modified example.

The light emitting device 1b according to this modification includes a first hanging portion 11b of the first lead 11 provided with a first through hole 11j penetrating from the upper surface to the lower surface of the first hanging portion 11b. The resin member 13 is arranged in the upper part of the first through hole 11j, and the first convex portion 15a is arranged in the lower part of the first through hole 11j. The resin member 13 and the first convex portion 15a are continuously arranged in the first through hole 11j.

According to this modification, since the first convex portion 15a and the second convex portion 15b are continuous with the resin member 13, the first convex portion 15a and the second convex portion 15b are less likely to fall off from the light emitting device 1b. ..
The configuration, operation, and effect other than the above in this modification are the same as those in the first embodiment.

<Third variant of the first embodiment>
FIG. 8 is a partially enlarged end view showing the light emitting device according to the present modification.

In the light emitting device 1c according to the present modification, the resin member 13, the first convex portion 15a and the second convex portion 15b (see FIG. 3) are the first of the first suspension portions 11b as compared with the second modification. The difference is that they are integrally formed through the through hole 11j and the second through hole (not shown) of the second suspension portion 12b (see FIG. 3).

According to this modification, the first convex portion 15a and the second convex portion 15b are integrally formed with the resin member 13 via the first through hole 11j and the second through hole, so that the first convex portion is formed. The 15a and the second convex portion 15b are more difficult to fall off.
The configuration, operation, and effect other than the above in this modification are the same as those in the second modification.

<Second embodiment>
FIG. 9 is an end view showing a light emitting device according to the present embodiment.

In the light emitting device 2 according to the present embodiment, the first convex portion 11k is a part of the first hanging portion 11b as compared with the light emitting device 1 (see FIG. 3) according to the first embodiment. The difference is that the second convex portion 12k is a part of the second hanging portion 12b.

Also in this embodiment, as in the first embodiment, the path from the inside of the first recess 10g to the interface between the first lead 11 and the resin member 13 can be lengthened to suppress the infiltration of flux. .. Similarly, the infiltration of flux can be suppressed by lengthening the path from the inside of the second recess 10h to the interface between the second lead 12 and the resin member 13.
Further, according to the present embodiment, as compared with the first embodiment, since the convex portion is formed as a part of the first hanging portion 11b and the second hanging portion 12b, there is less possibility that the convex portion will fall off.
The configurations, operations, and effects other than the above in the present embodiment are the same as those in the first embodiment.

<Third embodiment>
As shown in FIGS. 10 to 12, the light emitting device 3 according to the present embodiment has a first suspension portion and a second light emitting device 3 as compared with the light emitting device 1 according to the first embodiment (see FIGS. 1 to 4). The shape of the hanging part is different. Specifically, in the side view, the first hanging portion 11m and the second hanging portion 12m are C-shaped with an opening at the bottom.

The first hanging portion 11m includes a first horizontal portion 11n extending along the XY plane and a first vertical portion 11o extending downward from both ends of the first horizontal portion 11n. The two first vertical portions 11o are continuous with the first main body portion 11a. In the Z direction, the second lower surface 11p of the first vertical portion 11o is flush with the lower surface 11f of the first main body portion 11a. In other words, the first hanging portion 11m includes a first lower surface 11g exposed above the lower surface 11f of the first main body 11a and a second lower surface 11p located on the same surface as the lower surface 11f of the first main body 11a. Have.

Similarly, the second hanging portion 12m also includes a second horizontal portion 12n extending along the XY plane, and a second vertical portion 12o extending downward from both ends of the second horizontal portion 12n. The second vertical portion 12o is continuous with the second main body portion 12a. In the Z direction, the second lower surface 12p of the second vertical portion 12o is flush with the lower surface 12f (see FIG. 2) of the second main body portion 12a.

The first convex portion 15a is arranged above the first concave portion 10g surrounded by the first hanging portion 11m, and is in contact with the first horizontal portion 11n and the two first vertical portions 11o. The first convex portion 15a constitutes a part of the first side surface 10a of the package 10. Similarly, the second convex portion 15b is arranged above the second concave portion 10h surrounded by the second hanging portion 12m, and is in contact with the second horizontal portion 12n and the two second vertical portions 12o. The second convex portion 15b constitutes a part of the second side surface 10b of the package 10.

According to the present embodiment, since the inner surfaces of the first recess and the second recess are all composed of the first suspension portion 11 m and the second suspension portion 12 m, the solder is more likely to crawl up, but the first convex portion and the first convex portion and the first suspension portion are formed. By providing the two convex portions, it is possible to prevent the flux from entering the light emitting device. The joint area between the lead and the solder increases. Therefore, the electrical resistance of the joint is reduced and the mechanical strength of the joint is increased.
The configurations, operations, and effects other than the above in the present embodiment are the same as those in the first embodiment.

<Fourth Embodiment>
This embodiment is an embodiment of the method for manufacturing a light emitting device according to the first embodiment.

As shown in FIGS. 13A and 14, the lead frame 50 is prepared. In the lead frame 50, a pair of lead portions 51 including a first lead 11 and a second lead 12 are arranged in a matrix in the X direction and the Y direction. A groove 52 extending in the Y direction is formed between the first lead 11 and the second lead 12 constituting each lead portion 51. A linear frame portion 53 extending in the X direction is provided between the lead portions 51 adjacent to each other in the Y direction. The thickness of the frame portion 53 is the same as the thickness of the first side hanging portion 11c and the like.

The first hanging portion 11b of the first lead 11 is connected to the second hanging portion 12b of the second lead 12 arranged adjacent to each other in the −X direction. As a result, the area directly below the first hanging portion 11b and the second hanging portion 12b is a recess 54. Further, the first side hanging portions 11c and 11d of the first lead 11 and the second side hanging portions 12c and 12d of the second lead 12 are connected to the frame portion 53.

Next, as shown in FIGS. 13B and 14, a resin member 13 made of, for example, a white resin material is formed on the first lead 11, the second lead 12, and between the first lead 11 and the second lead 12. To form. The resin member 13 is also arranged below the frame portion 53, the first side hanging portions 11c and 11d, and the second side hanging portions 12c and 12d. However, the resin member 13 is not arranged in the recess 54, that is, below the first hanging portion 11b and the second hanging portion 12b. Further, a convex portion 15 made of a resin material is formed on the central portion in the X direction on the lower surface of the concave portion 54. The resin member 13 and the convex portion 15 may be molded at the same time, or the convex portion may be formed first, and then the resin member may be formed. Examples of the method for forming the resin member include methods such as transfer molding using a mold, injection molding, and compression molding. Further, as a method for forming the convex portion, for example, it can be formed by a method such as transfer molding, injection molding or compression molding using a mold, or by a 3D printer, printing, spraying or the like without using a mold. .. The convex portion 15 is separated from the first main body portion 11a of the first lead 11 and the second main body portion 12a of the second lead 12. As a result, a structure in which a plurality of packages 10 are continuously arranged in a plane is formed. An element mounting recess 10i is formed on the upper surface of the portion corresponding to each package 10 in this structure. It should be noted that such a structure having a resin member and a convex portion on the lead frame may be purchased and prepared.

Next, as shown in FIG. 13C, an adhesive 16 (see FIG. 3) is arranged on the first main body portion 11a of the first lead 11 in the element mounting recess 10i, and the light emitting element 17 is mounted on the adhesive 16 (see FIG. 3). do. As a result, the light emitting element 17 is adhered to the first main body portion 11a via the adhesive 16. Next, the first wire 18a is connected between one electrode of the light emitting element 17 and the first main body portion 11a, and the second wire 18b is connected between the other electrode of the light emitting element 17 and the second main body portion 12a. Connecting.

Next, as shown in FIG. 13D, a sealing member 19 in which a phosphor is dispersed in, for example, a translucent resin is arranged in the element mounting recess 10i. The adhesive 16 (see FIG. 3), the light emitting element 17, the first wire 18a, and the second wire 18b are sealed in the sealing member 19.

Next, as shown in FIGS. 13E and 14, the structure including the lead frame 50 is diced along the X direction and the Y direction along the dicing line DL. At this time, the dicing line DL is set so as to pass through the central portion of the convex portion 15 in the X direction, pass through the frame portion 53, and not pass through the sealing member 19 and the light emitting element 17. As a result, the resin member 13 or the convex portion 15 is arranged above and below the lead frame 50 in the region through which the dicing blade passes.

By this dicing, the first hanging portion 11b and the second hanging portion 12b are separated, the concave portion 54 is separated into the first concave portion 10g and the second concave portion 10h, and the convex portion 15 is the first convex portion 15a and the second convex portion. It is separated into 15b, the first side suspension portions 11c and 11d, the second side suspension portions 12c and 12d are separated from the frame portion 53, and the light emitting device 1 is separated into individual pieces. In this way, the light emitting device 1 is manufactured.

According to the present embodiment, in the dicing step shown in FIGS. 13E and 14, resin members 13 or convex portions 15 are arranged above and below the lead frame 50 in a region through which the dicing blade passes. Therefore, burrs on the lead frame are less likely to occur on the cut surface of the lead frame 50. Therefore, it is possible to suppress the occurrence of burrs on the tip surfaces of each hanging portion and each side hanging portion. As a result, the light emitting device 1 having good shape stability can be manufactured. For example, it is possible to prevent burrs generated downward on the tip surface of the first hanging portion 11b from blocking the first recess 10g. If the convex portion 15 is formed of a resin material that is softer than the resin member 13, the generation of burrs can be suppressed more effectively.

Each embodiment and its modifications are examples that embody the present invention, and the present invention is not limited to these embodiments and modifications. For example, the present invention also includes additions, deletions, or changes of some components or steps in each embodiment and each modification. Moreover, each embodiment and each modification can be carried out in combination with each other.

The present invention can be used, for example, as a light source for a lighting device and a display device.

1, 1a, 1b, 1c, 2, 3: Light emitting device 10: Package S: Outer surface (10a: 1st side surface, 10b: 2nd side surface, 10c: 3rd side surface, 10d: 4th side surface)
10e: upper surface 10f: lower surface R: concave portion (10 g: first concave portion, 10h: second concave portion)
10i: Element mounting recess 111: Lead 11: First lead (11a: first main body, 11b: first suspension, 11c, 11d: first side suspension)
11e, 12e: upper surface 11f, 12f: lower surface 11g: first lower surface 11j: first through hole 112: convex portion (11k: first convex portion, 12k: second convex portion)
11m: 1st hanging part 11n: 1st horizontal part 11o: 1st vertical part 11p: 2nd lower surface 12: 2nd lead (12a: 2nd main body part, 12b: 2nd hanging part, 12c, 12d: 2nd side Hanging part)
12g: 1st lower surface 12m: 2nd hanging part 12n: 2nd horizontal part 12o: 2nd vertical part 12p: 2nd lower surface 13: Resin member 15: Convex part 15a: 1st convex part 15b: 2nd convex part 15g, 15h: Bottom surface 16: Adhesive 17: Light emitting element 18: Wire 19: Sealing member 50: Lead frame 51: Lead part 52: Groove 53: Frame part 54: Recessed part 100: Wiring board 101: Insulation plate 102: Wiring 103: Solder DL: Dicing line P1: 1st path P2: 2nd path

Claims (6)

A package including a pair of leads, a resin member that integrally holds the pair of leads , and a convex portion made of a resin material , and includes a bottom surface and a side wall from which the upper surfaces of the pair of leads are exposed. A package provided with a recess for mounting an element and a recess that opens on the outer surface and the lower surface.
A light emitting element arranged on the bottom surface of the element mounting recess and
The sealing member arranged in the element mounting recess and
With
At least one of the leads
The exposed main body on the underside of the package and
A hanging portion extending from the main body portion to form a part of the outer surface of the package, and at least a part of the lower surface is exposed in the recess on the upper side of the lower surface of the main body portion.
Have,
The convex portion is arranged on the lower surface of the hanging portion and is separated from the main body portion.
The lower surface of the convex portion is a light emitting device located above the lower surface of the main body portion. A package having a pair of leads, a resin member that integrally holds the pair of leads, and a convex portion, and an element mounting recess having a bottom surface and a side wall on which the upper surface of the pair of leads is exposed. And a package provided with recesses that open on the outer and lower surfaces.
A light emitting element arranged on the bottom surface of the element mounting recess and
The sealing member arranged in the element mounting recess and
With
At least one of the leads
The exposed main body on the underside of the package and
A hanging portion extending from the main body portion to form a part of the outer surface of the package, and at least a part of the lower surface is exposed in the recess on the upper side of the lower surface of the main body portion.
Have,
The convex portion is arranged on the lower surface of the hanging portion and is separated from the main body portion.
The lower surface of the convex portion is located above the lower surface of the main body portion .
The resin member and the convex portion are light emitting devices made of the same material. A package having a pair of leads, a resin member that integrally holds the pair of leads, and a convex portion, and an element mounting recess having a bottom surface and a side wall on which the upper surface of the pair of leads is exposed. And a package provided with recesses that open on the outer and lower surfaces.
A light emitting element arranged on the bottom surface of the element mounting recess and
The sealing member arranged in the element mounting recess and
With
At least one of the leads
The exposed main body on the underside of the package and
A hanging portion extending from the main body portion to form a part of the outer surface of the package, and at least a part of the lower surface is exposed in the recess on the upper side of the lower surface of the main body portion.
Have,
The convex portion is arranged on the lower surface of the hanging portion and is separated from the main body portion.
The lower surface of the convex portion is located above the lower surface of the main body portion .
A light emitting device in which the resin member and the convex portion are integrally formed. A package having a pair of leads, a resin member that integrally holds the pair of leads, and a convex portion, and an element mounting recess having a bottom surface and a side wall on which the upper surface of the pair of leads is exposed. And a package provided with recesses that open on the outer and lower surfaces.
A light emitting element arranged on the bottom surface of the element mounting recess and
The sealing member arranged in the element mounting recess and
With
At least one of the leads
The exposed main body on the underside of the package and
A hanging portion extending from the main body portion to form a part of the outer surface of the package, and at least a part of the lower surface is exposed in the recess on the upper side of the lower surface of the main body portion.
Have,
The convex portion is arranged on the lower surface of the hanging portion and is separated from the main body portion.
The lower surface of the convex portion is located above the lower surface of the main body portion .
The hanging portion has a through hole penetrating from the upper surface to the lower surface, and the resin member and the convex portion are continuous light emitting devices in the through hole. The light emitting device according to claim 1, wherein the convex portion is a part of the hanging portion. The hanging portion is one of claims 1 to 5 , which has a first lower surface exposed above the lower surface of the main body portion and a second lower surface located on the same surface as the lower surface of the main body portion. The light emitting device described.

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