JP6879172B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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JP6879172B2
JP6879172B2 JP2017217244A JP2017217244A JP6879172B2 JP 6879172 B2 JP6879172 B2 JP 6879172B2 JP 2017217244 A JP2017217244 A JP 2017217244A JP 2017217244 A JP2017217244 A JP 2017217244A JP 6879172 B2 JP6879172 B2 JP 6879172B2
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light emitting
emitting device
recess
soft resin
lead
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JP2019087703A (en
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若木　亮輔
亮輔 若木
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Lead Frames For Integrated Circuits (AREA)
  • Led Device Packages (AREA)

Description

本開示は、発光装置に関する。 The present disclosure relates to a light emitting device.

ＬＥＤ素子などの半導体素子を用いた発光装置の一種として、リードを樹脂部材で保持したパッケージを用いた発光装置が提案されている。通常、このような発光装置は半田を用いて配線基板に接合される。接合後の半田の形状（フィレット）を確認できるように、発光装置のパッケージの側面の下部に凹部が形成されているものがある（例えば、特許文献１、２）。 As a kind of light emitting device using a semiconductor element such as an LED element, a light emitting device using a package in which a lead is held by a resin member has been proposed. Usually, such a light emitting device is bonded to a wiring board by using solder. In some cases, a recess is formed in the lower part of the side surface of the package of the light emitting device so that the shape (fillet) of the solder after joining can be confirmed (for example, Patent Documents 1 and 2).

このような凹部を備える発光装置は、樹脂部材及びリードの集合体を切断することで個片化される。詳細には、切断前のリードの下面の凹んだ部分を含む切断ラインを、ブレード等の回転刃で切断することで、発光装置の及び側面に開口する凹部が形成される。 A light emitting device provided with such a recess is made into individual pieces by cutting an aggregate of a resin member and a lead. Specifically, by cutting the cutting line including the recessed portion on the lower surface of the lead before cutting with a rotary blade such as a blade, recesses that open to the light emitting device and the side surface are formed.

特開２０１１−２２８４１２号公報Japanese Unexamined Patent Publication No. 2011-228812 特開２０１４−６４００４号公報Japanese Unexamined Patent Publication No. 2014-6404

リードの凹んだ部分を切断する際に、リードに起因するバリが発生する場合がある。
本発明の一実施形態は、上述の問題点に鑑みてなされたものであって、バリの発生を抑制可能な発光装置を提供することを目的とする。 When cutting the recessed portion of the reed, burrs due to the reed may occur.
One embodiment of the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a light emitting device capable of suppressing the generation of burrs.

実施形態に係る発光装置は、パッケージと、発光素子と、封止部材と、を備える。前記パッケージは、一対のリードと、前記一対のリードを一体的に保持する樹脂部材と、を有する。前記パッケージには、前記一対のリードの上面が露出される底面と側壁とを備える素子載置凹部と、外側面及び下面に開口する凹部と、が設けられている。前記発光素子は、前記素子載置凹部の底面上に配置されている。前記封止部材は、前記素子載置凹部内に配置されている。前記リードの少なくとも一方は、本体部と、吊部と、を有する。前記本体部は、前記パッケージの下面において露出する。前記吊部は、前記本体部から延伸し、前記パッケージの外側面の一部を構成する。前記吊部の下面の少なくとも一部は、前記凹部内で前記本体部の下面よりも上側において露出する。前記パッケージは、前記吊部の下面に、前記樹脂部材よりも軟質な軟質樹脂部を備える。 The light emitting device according to the embodiment includes a package, a light emitting element, and a sealing member. The package has a pair of reeds and a resin member that integrally holds the pair of reeds. The package is provided with an element mounting recess having a bottom surface and a side wall from which the upper surfaces of the pair of leads are exposed, and a recess that opens to the outer surface and the lower surface. The light emitting element is arranged on the bottom surface of the element mounting recess. The sealing member is arranged in the element mounting recess. At least one of the leads has a main body portion and a suspension portion. The main body is exposed on the lower surface of the package. The hanging portion extends from the main body portion and forms a part of the outer surface of the package. At least a part of the lower surface of the hanging portion is exposed in the recess above the lower surface of the main body portion. The package includes a soft resin portion softer than the resin member on the lower surface of the hanging portion.

実施形態によれば、バリの発生を抑制可能な発光装置を実現できる。 According to the embodiment, it is possible to realize a light emitting device capable of suppressing the generation of burrs.

第１の実施形態に係る発光装置を示す斜め上側から見た斜視図である。It is a perspective view seen from the diagonally upper side which shows the light emitting device which concerns on 1st Embodiment. 第１の実施形態に係る発光装置を示す斜め下側から見た斜視図である。It is a perspective view seen from the diagonally lower side which shows the light emitting device which concerns on 1st Embodiment. 第１の実施形態に係る発光装置を示す端面図である。It is an end view which shows the light emitting device which concerns on 1st Embodiment. 第１の実施形態に係る発光装置のリード、軟質樹脂部、発光素子及びワイヤを示す斜視図であり、樹脂部材及び封止部材を省略した図である。It is a perspective view which shows the lead, the soft resin part, the light emitting element and the wire of the light emitting device which concerns on 1st Embodiment, and is the figure which omitted the resin member and the sealing member. 第１の実施形態に係る発光装置の製造方法を示す端面図である。It is an end view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. 第１の実施形態に係る発光装置の製造方法を示す端面図である。It is an end view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. 第１の実施形態に係る発光装置の製造方法を示す端面図である。It is an end view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. 第１の実施形態に係る発光装置の製造方法を示す端面図である。It is an end view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. 第１の実施形態に係る発光装置の製造方法を示す端面図である。It is an end view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. 第１の実施形態に係る発光装置の製造方法を示す平面図である。It is a top view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. 第２の実施形態に係る発光装置を示す側面図である。It is a side view which shows the light emitting device which concerns on 2nd Embodiment. 第２の実施形態に係る発光装置を示す一部拡大端面図である。It is a partially enlarged end view which shows the light emitting device which concerns on 2nd Embodiment. 第３の実施形態に係る発光装置を示す一部拡大端面図である。It is a partially enlarged end view which shows the light emitting device which concerns on 3rd Embodiment. 第４の実施形態に係る発光装置を示す一部拡大端面図である。It is a partially enlarged end view which shows the light emitting device which concerns on 4th Embodiment. 第５の実施形態に係る発光装置を示す側面図である。It is a side view which shows the light emitting device which concerns on 5th Embodiment.

本明細書においては、説明の便宜上、ＸＹＺ直交座標系を採用する。例えば図１に示すように、第１リード１１から第２リード１２に向かう方向を「＋Ｘ方向」とし、その逆の方向を「−Ｘ方向」とする。＋Ｘ方向と−Ｘ方向を総称して「Ｘ方向」ともいう。Ｘ方向に対して直交する方向を「＋Ｙ方向」及び「−Ｙ方向」とし、Ｘ方向及びＹ方向に対して直交する方向を「＋Ｚ方向」及び「−Ｚ方向」という。＋Ｚ方向は「上」ともいい、−Ｚ方向は「下」ともいうが、この表記も便宜上のものであり、重力の方向とは無関係である。また、リード、樹脂部材等は、切断の前後において同じ名称を用いて説明する。 In this specification, the XYZ Cartesian coordinate system is adopted for convenience of explanation. For example, as shown in FIG. 1, the direction from the first lead 11 to the second lead 12 is defined as the “+ X direction”, and the opposite direction is defined as the “−X direction”. The + X direction and the -X direction are collectively referred to as the "X direction". The directions orthogonal to the X direction are referred to as "+ Y direction" and "-Y direction", and the directions orthogonal to the X direction and Y direction are referred to as "+ Z direction" and "-Z direction". The + Z direction is also called "up" and the -Z direction is also called "down", but this notation is also for convenience and is irrelevant to the direction of gravity. Further, the reed, the resin member and the like will be described using the same names before and after cutting.

＜第１の実施形態＞
図１〜図４に示すように、本実施形態に係る発光装置１は、パッケージ１０と、発光素子１７と、封止部材１９と、を備える。 <First Embodiment>
As shown in FIGS. 1 to 4, the light emitting device 1 according to the present embodiment includes a package 10, a light emitting element 17, and a sealing member 19.

パッケージ１０は、発光素子等の電子部品を載置するための基台であり、一対の電極として機能するリード１１１として、例えば、第１リード１１及び第２リード１２を備える。第１リード１１と第２リード１２は互いに離間しており、絶縁性の樹脂部材１３によって一体的に保持されている。樹脂部材１３は、リード１１１の上方の一部、リード１１１の間（第１リードと第２リードの間）、並びに、リード１１１の下方の一部に配置されている。 The package 10 is a base on which an electronic component such as a light emitting element is placed, and includes, for example, a first lead 11 and a second lead 12 as leads 111 that function as a pair of electrodes. The first lead 11 and the second lead 12 are separated from each other and are integrally held by the insulating resin member 13. The resin member 13 is arranged in a part above the lead 111, between the leads 111 (between the first lead and the second lead), and a part below the lead 111.

パッケージ１０の形状は、略直方体であり、４つの外側面Ｓとして、第１側面１０ａ、第２側面１０ｂ、第３側面１０ｃ、第４側面１０ｄを備える。第１側面１０ａの反対側に第２側面１０ｂが配置され、第３側面１０ｃの反対側に第４側面１０ｄが配置される。 The shape of the package 10 is a substantially rectangular parallelepiped, and the four outer surfaces S include a first side surface 10a, a second side surface 10b, a third side surface 10c, and a fourth side surface 10d. The second side surface 10b is arranged on the opposite side of the first side surface 10a, and the fourth side surface 10d is arranged on the opposite side of the third side surface 10c.

パッケージ１０は、上面１０ｅに開口する素子載置凹部１０ｉを備える。パッケージ１０は、下面１０ｆ及び外側面Ｓに開口する凹部Ｒを備える。凹部Ｒとして、例えば、第１側面１０ａ及び下面１０ｆに開口する第１凹部１０ｇと、第２側面１０ｂと下面１０ｆとに開口する第２凹部１０ｈと、を備える。凹部Ｒは、半田のフィレットを形成し易くするための空間であり、各凹部の内側面の少なくとも一部は、リードで構成される。 The package 10 includes an element mounting recess 10i that opens on the upper surface 10e. The package 10 includes a recess R that opens to the lower surface 10f and the outer surface S. The recess R includes, for example, a first recess 10g that opens in the first side surface 10a and the lower surface 10f, and a second recess 10h that opens in the second side surface 10b and the lower surface 10f. The recess R is a space for facilitating the formation of solder fillets, and at least a part of the inner surface of each recess is composed of leads.

パッケージ１０は、凹部Ｒ内に、軟質樹脂部１１２を備える。例えば、第１凹部１０ｇ内に第１軟質樹脂部１５ａを備え、第２凹部１０ｈ内に第２軟質樹脂部１５ｂを備える。軟質樹脂部１１２の形状は、例えば、直方体である。軟質樹脂部１１２の幅（Ｙ方向の幅）は、凹部Ｒの幅と同じであることが好ましい。また、軟質樹脂部１１２の奥行の幅（Ｘ方向の幅）は、凹部Ｒの奥行の幅に対して、例えば５０％〜８０％とすることができる。また、軟質樹脂部１１２の内側面と、凹部Ｒの奥側面との間の長さは、パッケージの外側面から凹部Ｒの奥側面との間の長さに対して、例えば２０％〜５０％とすることができる。軟質樹脂部１１２の厚み（Ｚ方向の厚み）は、凹部Ｒの高さ（パッケージの下面から凹部の上底までの高さ）に対して、例えば３３％〜６７％とすることができる。 The package 10 includes a soft resin portion 112 in the recess R. For example, the first soft resin portion 15a is provided in the first recess 10g, and the second soft resin portion 15b is provided in the second recess 10h. The shape of the soft resin portion 112 is, for example, a rectangular parallelepiped. The width of the soft resin portion 112 (width in the Y direction) is preferably the same as the width of the recess R. Further, the depth width (width in the X direction) of the soft resin portion 112 can be, for example, 50% to 80% with respect to the depth width of the recess R. The length between the inner surface of the soft resin portion 112 and the inner side surface of the recess R is, for example, 20% to 50% of the length between the outer surface of the package and the inner surface of the recess R. Can be. The thickness of the soft resin portion 112 (thickness in the Z direction) can be, for example, 33% to 67% with respect to the height of the recess R (the height from the lower surface of the package to the upper bottom of the recess).

軟質樹脂部１１２は、樹脂部材１３を形成する樹脂材料よりも軟質な樹脂材料によって形成されている。また、軟質樹脂部１１２の材料は、樹脂部材１３の材料に比して、リードとの密着性が良好な材料が好ましい。 The soft resin portion 112 is formed of a resin material that is softer than the resin material that forms the resin member 13. Further, the material of the soft resin portion 112 is preferably a material having better adhesion to the reed than the material of the resin member 13.

リード１１１（第１リード１１及び第２リード１２）は、それぞれ、本体部と、吊部とを備える。本体部は、主として素子載置凹部の底面において露出される部分である。また、吊部は、製造時に隣接するリード部や支柱、あるいは、フレーム部と連結される部分であり、切断されることで発光装置の外側面の一部を構成する部分である。吊部は、素子載置凹部の底面において露出されていてもよく、また、露出されていなくてもよい。図３等では、吊部は、凹部の側壁の下部に配置されている。 The leads 111 (first lead 11 and second lead 12) each include a main body portion and a hanging portion. The main body is a portion that is mainly exposed on the bottom surface of the element mounting recess. Further, the hanging portion is a portion connected to a lead portion, a support column, or a frame portion adjacent to each other at the time of manufacturing, and is a portion forming a part of an outer surface of the light emitting device by being cut. The hanging portion may or may not be exposed on the bottom surface of the element mounting recess. In FIG. 3 and the like, the hanging portion is arranged at the lower part of the side wall of the recess.

例えば、第１リード１１は、第１本体部１１ａ、第１吊部１１ｂ、第１側吊部１１ｃ及び１１ｄを備えている。第１本体部１１ａは、素子載置凹部の底面において、発光素子が載置可能な面積の上面を備える。 For example, the first lead 11 includes a first main body portion 11a, a first suspension portion 11b, and a first side suspension portion 11c and 11d. The first main body portion 11a includes an upper surface having an area on which a light emitting element can be mounted on the bottom surface of the element mounting recess.

第１吊部１１ｂは、第１本体部１１ａからパッケージ１０の第１側面１０ａに延伸している。第１吊部１１ｂの先端面は、第１側面１０ａにおいて露出し、第１側面１０ａの一部を構成している。第１側吊部１１ｃは、第１本体部１１ａから第３側面１０ｃに延伸している。第１側吊部１１ｃの先端面は、第３側面１０ｃにおいて露出し、第３側面１０ｃの一部を構成している。第１側吊部１１ｄは、第１本体部１１ａから第４側面１０ｄに延伸している。第１側吊部１１ｄの先端面は、第４側面１０ｄにおいて露出し、第４側面１０ｄの一部を構成している。 The first hanging portion 11b extends from the first main body portion 11a to the first side surface 10a of the package 10. The tip surface of the first hanging portion 11b is exposed on the first side surface 10a and forms a part of the first side surface 10a. The first side suspension portion 11c extends from the first main body portion 11a to the third side surface 10c. The tip surface of the first side hanging portion 11c is exposed on the third side surface 10c and forms a part of the third side surface 10c. The first side suspension portion 11d extends from the first main body portion 11a to the fourth side surface 10d. The tip surface of the first side suspension portion 11d is exposed on the fourth side surface 10d and forms a part of the fourth side surface 10d.

第１本体部１１ａ、第１吊部１１ｂ、第１側吊部１１ｃ及び１１ｄの上面は、連続した第１上面１１ｅを構成している。一方、第１本体部１１ａの下面１１ｆは、第１吊部１１ｂ、第１側吊部１１ｃ及び１１ｄの下面よりも下方に位置し、パッケージ１０の下面１０ｆにおいて露出し、下面１０ｆの一部を構成している。第１吊部１１ｂの下面１１ｇは樹脂部材１３によって覆われていない。つまり、第１凹部１０ｇ内においては、第１本体部１１ａの側面の一部、及び、第１吊部１１ｂの下面１１ｇの一部が露出している。 The upper surfaces of the first main body portion 11a, the first hanging portion 11b, the first side hanging portions 11c and 11d form a continuous first upper surface 11e. On the other hand, the lower surface 11f of the first main body 11a is located below the lower surfaces of the first suspension 11b, the first suspension 11c and 11d, is exposed on the lower surface 10f of the package 10, and a part of the lower surface 10f is exposed. It is configured. The lower surface 11g of the first hanging portion 11b is not covered with the resin member 13. That is, in the first recess 10g, a part of the side surface of the first main body portion 11a and a part of the lower surface 11g of the first suspension portion 11b are exposed.

第２リード１２は、基本的には第１リード１１と同様の構成である。図１等に示す例では、第２リード１２の第２本体部１２ａは、素子載置凹部の底面において、ワイヤを接続可能な面積の上面を備える。また、第２本体部１２ａのＹ方向における長さ及びＺ方向における長さは、それぞれ、第１リード１１の第１本体部１１ａのＹ方向における長さ及びＺ方向における長さと等しい。一方、第２本体部１２ａのＸ方向における長さは、第１本体部１１ａのＸ方向における長さよりも短い。尚、第２リード１２上に発光素子を載置してもよく、また、Ｘ方向の長さ等が第１リード１１と同じであってもよい。 The second lead 12 basically has the same configuration as the first lead 11. In the example shown in FIG. 1 and the like, the second main body portion 12a of the second lead 12 includes an upper surface having an area to which a wire can be connected on the lower surface of the element mounting recess. Further, the length of the second main body portion 12a in the Y direction and the length in the Z direction are equal to the length of the first main body portion 11a of the first lead 11 in the Y direction and the length in the Z direction, respectively. On the other hand, the length of the second main body portion 12a in the X direction is shorter than the length of the first main body portion 11a in the X direction. The light emitting element may be placed on the second lead 12, and the length in the X direction may be the same as that of the first lead 11.

リード１１１は、基材と、その表面に設けられるめっきなどの金属層を備える。基材は、例えば、銅、アルミニウム、金、銀、鉄、ニッケル、又はこれらの合金、燐青銅、鉄入り銅などの金属を含む。これらは単層であってもよいし、積層構造（例えば、クラッド材）であってもよい。基材の表面には、金属層としては、例えば、銀、アルミニウム、ニッケル、パラジウム、ロジウム、金、銅、又はこれらの合金などを含む。また、リードの上面に形成される金属層と、下面に形成される金属層とが異なっていてもよい。また、吊部の端面は、切断によって露出される面であるため、リードの基材が露出されている。例えば、基材が銅である場合は、半田の濡れ性が低いため、基材の端面に半田は接合されにくい。しかしながら、凹部の内側面の一部を構成する吊部の下面や本体部の側面は、例えば、銀などの金属層が最表面にあるため、半田の濡れ性がよい。このように半田の濡れ性のよい金属層が凹部の内側面に露出されていることで、半田のフィレットが形成され易い。 The lead 111 includes a base material and a metal layer such as plating provided on the surface thereof. Substrates include, for example, copper, aluminum, gold, silver, iron, nickel, or metals such as alloys thereof, phosphor bronze, iron-containing copper. These may be a single layer or a laminated structure (for example, a clad material). The surface of the base material contains, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper, or an alloy thereof as the metal layer. Further, the metal layer formed on the upper surface of the reed and the metal layer formed on the lower surface may be different. Further, since the end surface of the hanging portion is a surface exposed by cutting, the base material of the reed is exposed. For example, when the base material is copper, the wettability of the solder is low, so that it is difficult for the solder to be bonded to the end face of the base material. However, since the lower surface of the hanging portion and the side surface of the main body portion that form a part of the inner surface of the recess have a metal layer such as silver on the outermost surface, the solder has good wettability. Since the metal layer having good wettability of the solder is exposed on the inner side surface of the recess, the fillet of the solder is easily formed.

また、リードの表面に銀または銀合金のめっき層が形成される場合は、銀または銀合金のめっき層の表面に酸化ケイ素等の保護層が設けられることが好ましい。これにより、大気中の硫黄成分等により銀または銀合金のめっき層が変色することを抑制できる。保護層の成膜方法は、例えばスパッタ等の真空プロセスによって成膜することができるが、その他の既知の方法を用いてもよい。 When a silver or silver alloy plating layer is formed on the surface of the reed, it is preferable that a protective layer such as silicon oxide is provided on the surface of the silver or silver alloy plating layer. As a result, it is possible to suppress discoloration of the silver or silver alloy plating layer due to sulfur components in the atmosphere or the like. The protective layer can be formed by a vacuum process such as sputtering, but other known methods may be used.

パッケージは、上述の凹部に加え、素子載置凹部１０ｉを備える。素子載置凹部１０ｉの底面は、発光素子が載置可能な面積であればよい。素子載置凹部１０ｉの高さ、換言すると凹部の内側面の高さは、発光素子よりも高いことが好ましい。更に、発光素子とリードとをワイヤを用いて接合させる場合は、発光素子とワイヤとを足した高さよりもワイヤの高さが高いことが好ましい。素子載置凹部の開口部形状は、例えば、上面視において、円形、楕円形、四角形、多角形、又は、これらを組み合わせた形状や、これらの形状の一部を切欠いた形状、丸めた形状等とすることができる。素子載置凹部の内側面は、凹部の底面に対して垂直又は傾斜した面とすることができる。リードの上面、詳細には、第１リード１１の第１上面１１ｅ及び第２リード１２の第２上面１２ｅは、素子載置凹部１０ｉの底面の一部を構成している。パッケージ１０の上面１０ｅは凹部の側壁の上面でもあり、樹脂部材１３によって構成されている。素子載置凹部１０ｉの内側面は樹脂部材１３で構成されている。 The package includes an element mounting recess 10i in addition to the recess described above. The bottom surface of the element mounting recess 10i may have an area on which the light emitting element can be mounted. It is preferable that the height of the element mounting recess 10i, in other words, the height of the inner surface of the recess is higher than that of the light emitting element. Further, when the light emitting element and the lead are joined by using a wire, it is preferable that the height of the wire is higher than the total height of the light emitting element and the wire. The shape of the opening of the element mounting recess is, for example, a circular shape, an elliptical shape, a quadrangle, a polygonal shape, a shape obtained by combining these, a shape obtained by cutting out a part of these shapes, a rounded shape, etc. Can be. The inner surface of the element mounting recess may be a surface perpendicular to or inclined with respect to the bottom surface of the recess. The upper surface of the reed, specifically, the first upper surface 11e of the first lead 11 and the second upper surface 12e of the second lead 12 form a part of the lower surface of the element mounting recess 10i. The upper surface 10e of the package 10 is also the upper surface of the side wall of the recess, and is composed of the resin member 13. The inner surface of the element mounting recess 10i is made of a resin member 13.

樹脂部材１３を形成する材料には、母材となる樹脂材料として、熱可塑性樹脂、熱硬化性樹脂などを用いることができる。具体的には、エポキシ樹脂組成物、シリコーン樹脂組成物、シリコーン変性エポキシ樹脂などの変性エポキシ樹脂組成物、エポキシ変性シリコーン樹脂などの変性シリコーン樹脂組成物、不飽和ポリエステル樹脂、飽和ポリエステル樹脂、ポリイミド樹脂組成物、変性ポリイミド樹脂組成物等の硬化体、ポリフタルアミド（ＰＰＡ）、ポリカーボネート樹脂、ポリフェニレンサルファイド（ＰＰＳ）、液晶ポリマー（ＬＣＰ）、ＡＢＳ樹脂、フェノール樹脂、アクリル樹脂、ＰＢＴ樹脂等の樹脂を用いることができる。特に、エポキシ樹脂組成物や変性シリコーン樹脂組成物の熱硬化性樹脂を用いることが好ましい。樹脂部材は、未硬化の状態で粘度が１０ｐa・ｓ〜４０ｐa・ｓであることが好ましく、１５ｐa・ｓ〜２５ｐa・ｓであることがより好ましい。 As the material for forming the resin member 13, a thermoplastic resin, a thermosetting resin, or the like can be used as the resin material to be the base material. Specifically, an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition such as a silicone-modified epoxy resin, a modified silicone resin composition such as an epoxy-modified silicone resin, an unsaturated polyester resin, a saturated polyester resin, and a polyimide resin. Cured products such as compositions and modified polyimide resin compositions, resins such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, and PBT resin. Can be used. In particular, it is preferable to use a thermosetting resin of an epoxy resin composition or a modified silicone resin composition. The resin member preferably has a viscosity of 10 pa · s to 40 pa · s in an uncured state, and more preferably 15 pa · s to 25 pa · s.

また、樹脂部材１３は、発光素子からの光を吸収しにくくかつ母材となる樹脂に対して屈折率差の大きい反射部材（例えば、酸化チタン、酸化亜鉛、酸化ケイ素、酸化ジルコニウム、酸化アルミニウム、窒化アルミニウム）などの光散乱粒子を分散することで、効率よく光を反射させることができる。あるいは、発光装置のコントラストを向上させるために、発光装置の外光（多くの場合、太陽光）に対して光反射率が低いものを用いてもよい。この場合、通常は黒色ないしそれに近似した色であることが好ましい。この時の充填剤としてはアセチレンブラック、活性炭、黒鉛などのカーボンや、酸化鉄、二酸化マンガン、酸化コバルト、酸化モリブデンなどの遷移金属酸化物、もしくは有色有機顔料などを目的に応じて利用することができる。 Further, the resin member 13 is a reflective member (for example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, etc., which is difficult to absorb light from the light emitting element and has a large difference in refractive index with respect to the resin as the base material. By dispersing light-scattering particles such as aluminum nitride), light can be reflected efficiently. Alternatively, in order to improve the contrast of the light emitting device, one having a low light reflectance with respect to the external light (in many cases, sunlight) of the light emitting device may be used. In this case, it is usually preferable that the color is black or a color similar thereto. As the filler at this time, carbon such as acetylene black, activated charcoal, and graphite, transition metal oxides such as iron oxide, manganese dioxide, cobalt oxide, and molybdenum oxide, or colored organic pigments can be used depending on the purpose. it can.

軟質樹脂部１１２を形成する樹脂材料は、樹脂部材１３を形成する樹脂材料よりも軟質である。樹脂部材１３と軟質樹脂部１１２の硬度は、異なる材料を用いることによって異ならせる。例えば、樹脂部材１３はシリコーンを母材とし、軟質樹脂部はエポキシを母材とする。又は、母材となる樹脂の種類は同じにして、フィラーの含有率、種類若しくはサイズを変えることによって、硬度を異ならせる。例えば、樹脂部材１３のフィラーの含有率を、軟質樹脂部のフィラーの含有率よりも高くする。又は、樹脂部材１３に含まれるフィラーの組成をチタン酸化物（ＴｉＯ２）とし、軟質樹脂部に含まれるフィラーの組成を亜鉛酸化物（ＺｎＯ）とする。又は、樹脂部材１３に含まれるフィラーのサイズを、軟質樹脂部に含まれるフィラーのサイズよりも大きくする。 The resin material forming the soft resin portion 112 is softer than the resin material forming the resin member 13. The hardness of the resin member 13 and the soft resin portion 112 is made different by using different materials. For example, the resin member 13 uses silicone as a base material, and the soft resin portion uses epoxy as a base material. Alternatively, the type of resin used as the base material is the same, and the hardness is made different by changing the content rate, type or size of the filler. For example, the content of the filler in the resin member 13 is made higher than the content of the filler in the soft resin portion. Alternatively, the composition of the filler contained in the resin member 13 is titanium oxide (TiO 2 ), and the composition of the filler contained in the soft resin portion is zinc oxide (ZnO). Alternatively, the size of the filler contained in the resin member 13 is made larger than the size of the filler contained in the soft resin portion.

発光装置１は、上述のパッケージに加え、接着剤層１６、発光素子１７、ワイヤ１８ａ及び１８ｂ、並びに、封止部材１９を備える。発光素子１７は、接着剤層１６を介して、第１リード１１の第１本体部１１ａの上面上に接着されている。発光素子１７は、パッケージ１０の素子載置凹部１０ｉの底面上に配置されている。ワイヤ１８ａ及び１８ｂは、発光素子１７の上面に設けられた電極と、第１本体部１１ａの上面及び第２本体部１２ａとの間を接続している。封止部材１９は、パッケージ１０の素子載置凹部１０ｉ内に配置されており、接着剤層１６、発光素子１７、ワイヤ１８ａ及び１８ｂを封止している。封止部材１９は、例えば、透光性樹脂からなる母材中に、蛍光体が分散されて構成されている。 The light emitting device 1 includes an adhesive layer 16, a light emitting element 17, wires 18a and 18b, and a sealing member 19 in addition to the above-mentioned package. The light emitting element 17 is adhered to the upper surface of the first main body portion 11a of the first lead 11 via the adhesive layer 16. The light emitting element 17 is arranged on the bottom surface of the element mounting recess 10i of the package 10. The wires 18a and 18b connect the electrodes provided on the upper surface of the light emitting element 17 to the upper surfaces of the first main body 11a and the second main body 12a. The sealing member 19 is arranged in the element mounting recess 10i of the package 10 and seals the adhesive layer 16, the light emitting element 17, and the wires 18a and 18b. The sealing member 19 is composed of, for example, a phosphor dispersed in a base material made of a translucent resin.

次に、本実施形態に係る発光装置の製造方法について説明する。
図５Ａ〜図５Ｅは、本実施形態に係る発光装置の製造方法を示す端面図である。
図６は、本実施形態に係る発光装置の製造方法を示す平面図である。
図６が示す工程は、図５Ａが示す工程と同じである。 Next, a method of manufacturing the light emitting device according to the present embodiment will be described.
5A to 5E are end views showing a method of manufacturing the light emitting device according to the present embodiment.
FIG. 6 is a plan view showing a method of manufacturing a light emitting device according to the present embodiment.
The process shown in FIG. 6 is the same as the process shown in FIG. 5A.

図５Ａ及び図６に示すように、リードフレーム５０を用意する。リードフレーム５０は、後で切断することで第１リード１１及び第２リード１２となるリード１１１が、Ｘ方向及びＹ方向に沿ってマトリクス状に配列されている。各リード１１１に属する第１リード１１と第２リード１２との間には、Ｙ方向に延在する貫通部５２が形成されている。Ｙ方向に隣り合うリード１１１間には、Ｘ方向に延在するフレーム５３が設けられている。フレーム５３の厚さは、第１側吊部１１ｃ等の厚さと同じとすることができる。 As shown in FIGS. 5A and 6, the lead frame 50 is prepared. In the lead frame 50, the leads 111, which become the first lead 11 and the second lead 12 when cut later, are arranged in a matrix along the X direction and the Y direction. A penetrating portion 52 extending in the Y direction is formed between the first lead 11 and the second lead 12 belonging to each lead 111. A frame 53 extending in the X direction is provided between the leads 111 adjacent to each other in the Y direction. The thickness of the frame 53 can be the same as the thickness of the first side hanging portion 11c or the like.

第１リード１１の第１吊部１１ｂは、その−Ｘ方向側に配置された第２リード１２の第２吊部１２ｂと繋がっている。これにより、第１吊部１１ｂ及び第２吊部１２ｂの直下域は、凹部５４となっている。また、第１リード１１の第１側吊部１１ｃ及び第１側吊部１１ｄ、第２リード１２の第２側吊部１２ｃ及び第２側吊部１２ｄは、フレーム５３と繋がっている。 The first hanging portion 11b of the first lead 11 is connected to the second hanging portion 12b of the second lead 12 arranged on the −X direction side thereof. As a result, the area directly below the first hanging portion 11b and the second hanging portion 12b is a recess 54. Further, the first side hanging portion 11c and the first side hanging portion 11d of the first lead 11, the second side hanging portion 12c and the second side hanging portion 12d of the second lead 12 are connected to the frame 53.

次に、図５Ｂ及び図６に示すように、第１リード１１上、第２リード１２上、及び、第１リード１１と第２リード１２の間に、例えば白色の樹脂材料からなる樹脂部材１３を形成する。樹脂部材１３は、フレーム５３、並びに、第１側吊部１１ｃ及び１１ｄ、第２側吊部１２ｃ及び１２ｄの下方にも配置する。但し、樹脂部材１３は凹部５４内には配置しない。 Next, as shown in FIGS. 5B and 6, a resin member 13 made of, for example, a white resin material is formed on the first lead 11, the second lead 12, and between the first lead 11 and the second lead 12. To form. The resin member 13 is also arranged below the frame 53 and the first side hanging portions 11c and 11d, and the second side hanging portions 12c and 12d. However, the resin member 13 is not arranged in the recess 54.

また、凹部５４の下面におけるＸ方向の中央部上に、樹脂部材１３よりも軟質な軟質樹脂部１５を形成する。樹脂部材１３及び軟質樹脂部１５は、例えば、金型成形又は３Ｄプリンターにより形成する。軟質樹脂部１５は、第１本体部１１ａ及び第２本体部１２ａからは離間させる。これにより、複数個のパッケージ１０が平面状に連続的に配列された構造体が形成される。この構造体における各パッケージ１０に相当する部分の上面には、素子載置凹部１０ｉを形成する。 Further, a soft resin portion 15 softer than the resin member 13 is formed on the central portion in the X direction on the lower surface of the recess 54. The resin member 13 and the soft resin portion 15 are formed by, for example, mold molding or a 3D printer. The soft resin portion 15 is separated from the first main body portion 11a and the second main body portion 12a. As a result, a structure in which a plurality of packages 10 are continuously arranged in a plane is formed. An element mounting recess 10i is formed on the upper surface of the portion corresponding to each package 10 in this structure.

次に、図５Ｃに示すように、素子載置凹部１０ｉ内における第１本体部１１ａ上に、接着剤層１６（図３参照）を形成し、その上に発光素子１７を載置する。これにより、発光素子１７は接着剤層１６を介して、第１本体部１１ａに接着される。次に、ワイヤ１８ａを発光素子１７の一方の電極と第１本体部１１ａとの間に接続し、ワイヤ１８ｂを発光素子１７の他方の電極と第２本体部１２ａとの間に接続する。 Next, as shown in FIG. 5C, an adhesive layer 16 (see FIG. 3) is formed on the first main body portion 11a in the element mounting recess 10i, and the light emitting element 17 is placed on the adhesive layer 16. As a result, the light emitting element 17 is adhered to the first main body portion 11a via the adhesive layer 16. Next, the wire 18a is connected between one electrode of the light emitting element 17 and the first main body 11a, and the wire 18b is connected between the other electrode of the light emitting element 17 and the second main body 12a.

次に、図５Ｄに示すように、素子載置凹部１０ｉ内に、例えば透明樹脂内に蛍光体が分散された封止部材１９を配置する。接着剤層１６（図３参照）、発光素子１７、ワイヤ１８ａ及びワイヤ１８ｂは、封止部材１９内に被覆される。 Next, as shown in FIG. 5D, a sealing member 19 in which a phosphor is dispersed in, for example, a transparent resin is arranged in the element mounting recess 10i. The adhesive layer 16 (see FIG. 3), the light emitting element 17, the wire 18a, and the wire 18b are coated in the sealing member 19.

次に、図５Ｅ及び図６に示すように、切断ラインＤＬに沿って、リードフレーム５０及び樹脂成形体をＸ方向及びＹ方向に沿って切断する。このとき、切断ラインＤＬは、軟質樹脂部１５を通過する位置とする。これにより、切断位置を挟んで形成された２つの凹部の両方に、軟質樹脂部１５が配置される。 Next, as shown in FIGS. 5E and 6, the lead frame 50 and the resin molded body are cut along the X and Y directions along the cutting line DL. At this time, the cutting line DL is set to a position where it passes through the soft resin portion 15. As a result, the soft resin portion 15 is arranged in both of the two recesses formed across the cutting position.

この切断によって、第１吊部１１ｂと第２吊部１２ｂとが分離され、凹部５４が第１凹部１０ｇ及び第２凹部１０ｈに分離され、軟質樹脂部１５が第１軟質樹脂部１５ａと第２軟質樹脂部１５ｂに分離され、第１側吊部１１ｃ及び１１ｄ、第２側吊部１２ｃ及び１２ｄがフレーム５３から切り離されて、発光装置１が個片化される。このようにして、発光装置１が製造される。 By this cutting, the first hanging portion 11b and the second hanging portion 12b are separated, the recess 54 is separated into the first recess 10g and the second recess 10h, and the soft resin portion 15 is the first soft resin portion 15a and the second. The light emitting device 1 is separated into the soft resin portion 15b, the first side hanging portions 11c and 11d, and the second side hanging portions 12c and 12d are separated from the frame 53, and the light emitting device 1 is separated. In this way, the light emitting device 1 is manufactured.

本実施形態によれば、切断工程において、ブレードが通過する凹部内に、軟質樹脂部１５が配置される。第１吊部１１ｂ及び第２吊部１２ｂは金属であるため、切断時に延びてバリが発生し易いが、軟質樹脂部１５が配置されることで、バリを発生しにくくすることができる。この結果、形状安定性が良好な発光装置１を製造することができる。例えば、第１吊部１１ｂの先端面において下方（−Ｚ方向）に向けて延出したバリが、第１凹部１０ｇを塞いでしまうことを防止できる。 According to the present embodiment, in the cutting step, the soft resin portion 15 is arranged in the recess through which the blade passes. Since the first hanging portion 11b and the second hanging portion 12b are made of metal, they are likely to extend during cutting and generate burrs, but by arranging the soft resin portion 15, burrs can be made less likely to occur. As a result, the light emitting device 1 having good shape stability can be manufactured. For example, it is possible to prevent a burr extending downward (in the −Z direction) on the tip surface of the first hanging portion 11b from blocking the first recess 10g.

また、本実施形態においては、第１凹部１０ｇ内に第１軟質樹脂部１５ａが設けられているため、第１凹部１０ｇ内における第１リード１１の露出面から、発光装置１の外面を通過して、第１リード１１と樹脂部材１３との界面に至る経路が、第１軟質樹脂部１５ａを迂回する分だけ長くなる。この結果、発光装置１を実装する際に、第１凹部１０ｇ内で第１リード１１に接合する半田に含まれるフラックスが、第１リード１１と樹脂部材１３との界面まで到達しにくくなる。これにより、フラックスが発光装置１内に侵入して、発光素子１７等に損傷を及ぼすことを抑制できる。第２凹部１０ｈについても同様である。 Further, in the present embodiment, since the first soft resin portion 15a is provided in the first recess 10g, the exposed surface of the first lead 11 in the first recess 10g passes through the outer surface of the light emitting device 1. Therefore, the path to the interface between the first lead 11 and the resin member 13 is lengthened by the amount of bypassing the first soft resin portion 15a. As a result, when the light emitting device 1 is mounted, the flux contained in the solder bonded to the first lead 11 in the first recess 10 g is less likely to reach the interface between the first lead 11 and the resin member 13. As a result, it is possible to prevent the flux from entering the light emitting device 1 and damaging the light emitting element 17 and the like. The same applies to the second recess 10h.

＜第２の実施形態＞
図７は、本実施形態に係る発光装置を示す側面図である。
図８は、本実施形態に係る発光装置を示す一部拡大端面図である。 <Second embodiment>
FIG. 7 is a side view showing a light emitting device according to the present embodiment.
FIG. 8 is a partially enlarged end view showing the light emitting device according to the present embodiment.

図７及び図８に示すように、本実施形態に係る発光装置２においては、第１吊部１１ｂに貫通孔２１が形成されている。貫通孔２１は、第１吊部１１ｂを上面から下面に貫通する。軟質樹脂部１５は、第１吊部１１ｂの下のみでなく、第１吊部１１ｂの下から貫通孔２１内を介して第１吊部１１ｂの上において、一体的に設けられている。第１吊部１１ｂの上に設けられた軟質樹脂部１５は、パッケージ１０の第１側面１０ａの一部を構成してもよく、第１側面１０ａから離間してもよい。 As shown in FIGS. 7 and 8, in the light emitting device 2 according to the present embodiment, a through hole 21 is formed in the first suspension portion 11b. The through hole 21 penetrates the first hanging portion 11b from the upper surface to the lower surface. The soft resin portion 15 is integrally provided not only under the first hanging portion 11b but also above the first hanging portion 11b from under the first hanging portion 11b through the through hole 21. The soft resin portion 15 provided on the first suspension portion 11b may form a part of the first side surface 10a of the package 10, or may be separated from the first side surface 10a.

同様に、第２吊部１２ｂに貫通孔２２が形成されている。貫通孔２２は、第２吊部１２ｂを上面から下面に貫通する。軟質樹脂部１５は、第２吊部１２ｂの下、貫通孔２２内、第２吊部１２ｂの上に、一体的に設けられている。第２吊部１２ｂの上に設けられた軟質樹脂部１５は、パッケージ１０の第２側面１０ｂの一部を構成してもよく、第２側面１０ｂから離間していてもよい。 Similarly, a through hole 22 is formed in the second hanging portion 12b. The through hole 22 penetrates the second hanging portion 12b from the upper surface to the lower surface. The soft resin portion 15 is integrally provided under the second hanging portion 12b, in the through hole 22, and above the second hanging portion 12b. The soft resin portion 15 provided on the second hanging portion 12b may form a part of the second side surface 10b of the package 10, or may be separated from the second side surface 10b.

軟質樹脂部１５が、貫通孔２１内を介して吊部の上下で一体的に形成されているため、軟質樹脂部１５が脱落しにくい。軟質樹脂部１５は、吊部の上下において同じ幅でもよく、異なる幅でもよい。貫通孔の幅は、吊部の幅より狭い。また、貫通孔は１つの吊部において１つ又は２つ以上配置することができる。 Since the soft resin portion 15 is integrally formed above and below the suspension portion via the inside of the through hole 21, the soft resin portion 15 is unlikely to fall off. The soft resin portion 15 may have the same width or different widths above and below the hanging portion. The width of the through hole is narrower than the width of the hanging part. Further, one or two or more through holes can be arranged in one hanging portion.

＜第３の実施形態＞
図９は、本実施形態に係る発光装置を示す一部拡大端面図である。 <Third embodiment>
FIG. 9 is a partially enlarged end view showing the light emitting device according to the present embodiment.

図９に示すように、本実施形態に係る発光装置３は、第２の実施形態に係る発光装置２と比較して、第１吊部下面１２ｇの先端部に凹部１２ｎが形成されており、軟質樹脂部１５の下部が凹部１２ｎ内に配置されている点が異なっている。これにより、軟質樹脂部１５の下面１５ｈが、第２吊部下面１２ｇと同一面に位置する。同様に、第１軟質樹脂部１５ａの下面１５ｇは、第１吊部下面１１ｇと同一面に位置している。 As shown in FIG. 9, the light emitting device 3 according to the present embodiment has a recess 12n formed at the tip of the lower surface 12 g of the first hanging portion as compared with the light emitting device 2 according to the second embodiment. The difference is that the lower portion of the soft resin portion 15 is arranged in the recess 12n. As a result, the lower surface 15h of the soft resin portion 15 is located on the same surface as the lower surface 12g of the second hanging portion. Similarly, the lower surface 15 g of the first soft resin portion 15a is located on the same surface as the lower surface 11 g of the first suspension portion.

本実施形態によれば、軟質樹脂部１５の下面１５ｈが、第２吊部下面１２ｇと同一面に位置しているため、軟質樹脂部１５が第２凹部１０ｈを塞ぐことがない。この結果、発光装置３を実装する際に、第２凹部１０ｈ内において第２リード１２に接合した半田の状態を、第２凹部１０ｈを介して容易に視認することができる。第１リード１１についても同様である。本実施形態における上記以外の構成、製造方法及び効果は、第２の実施形態と同様である。 According to the present embodiment, since the lower surface 15h of the soft resin portion 15 is located on the same surface as the lower surface 12g of the second hanging portion, the soft resin portion 15 does not block the second recess 10h. As a result, when the light emitting device 3 is mounted, the state of the solder bonded to the second lead 12 in the second recess 10h can be easily visually recognized through the second recess 10h. The same applies to the first lead 11. The configuration, manufacturing method, and effect other than the above in the present embodiment are the same as those in the second embodiment.

＜第４の実施形態＞
図１０は、本実施形態に係る発光装置を示す一部拡大端面図である。 <Fourth Embodiment>
FIG. 10 is a partially enlarged end view showing a light emitting device according to the present embodiment.

図１０に示すように、本実施形態に係る発光装置４は、第３の実施形態に係る発光装置３と比較して、軟質樹脂部１５の下面１５ｈが、第２吊部下面１２ｇよりも上方に位置している点が異なっている。同様に、軟質樹脂部１５の下面１５ｇは、第１吊部下面１１ｇよりも上方に位置している。これによっても、第３の実施形態と同様な効果を得ることができる。本実施形態における上記以外の構成、製造方法及び効果は、第３の実施形態と同様である。 As shown in FIG. 10, in the light emitting device 4 according to the present embodiment, the lower surface 15h of the soft resin portion 15 is higher than the lower surface 12g of the second hanging portion as compared with the light emitting device 3 according to the third embodiment. The difference is that it is located in. Similarly, the lower surface 15 g of the soft resin portion 15 is located above the lower surface 11 g of the first suspension portion. Also, the same effect as that of the third embodiment can be obtained. The configuration, manufacturing method, and effect other than the above in the present embodiment are the same as those in the third embodiment.

＜第５の実施形態＞
図１１は、本実施形態に係る発光装置を示す側面図である。 <Fifth Embodiment>
FIG. 11 is a side view showing a light emitting device according to the present embodiment.

図１１に示すように、本実施形態に係る発光装置５においては、軟質樹脂部１５が、パッケージ１０の第１側面１０ａにおいて、第１吊部１１ｂの側面にも配置されている。同様に、第２軟質樹脂部１５ｂが、パッケージ１０の第２側面１０ｂにおいて、第２吊部１２ｂの側面にも配置されている。なお、軟質樹脂部１５の下面１５ｇは、第２吊部下面１１ｇよりも下方に位置していてもよく、同一面に位置していてもよく、上方に位置していてもよい。 As shown in FIG. 11, in the light emitting device 5 according to the present embodiment, the soft resin portion 15 is also arranged on the side surface of the first hanging portion 11b on the first side surface 10a of the package 10. Similarly, the second soft resin portion 15b is also arranged on the side surface of the second hanging portion 12b on the second side surface 10b of the package 10. The lower surface 15 g of the soft resin portion 15 may be located below the lower surface 11 g of the second suspension portion, may be located on the same surface, or may be located above.

本実施形態によれば、軟質樹脂部１５が第１吊部１１ｂを囲むように一体的に形成されているため、脱落しにくい。本実施形態における上記以外の構成、製造方法及び効果は、前述の第１の実施形態と同様である。 According to the present embodiment, since the soft resin portion 15 is integrally formed so as to surround the first hanging portion 11b, it is difficult to fall off. The configuration, manufacturing method, and effect other than the above in the present embodiment are the same as those in the first embodiment described above.

前述の各実施形態は、本発明を具現化した例であり、本発明はこれらの実施形態には限定されない。例えば、前述の各実施形態において、いくつかの構成要素又は工程を追加、削除又は変更したものも本発明に含まれる。また、前述の各実施形態は、相互に組み合わせて実施することができる。 Each of the above-described embodiments is an example embodying the present invention, and the present invention is not limited to these embodiments. For example, in each of the above-described embodiments, addition, deletion, or modification of some components or steps are also included in the present invention. Moreover, each of the above-described embodiments can be implemented in combination with each other.

本発明は、例えば、照明装置及び表示装置の光源等に利用することができる。 The present invention can be used, for example, as a light source for a lighting device and a display device.

１〜５：発光装置
１０：パッケージ
Ｓ：外側面（１０ａ：第１側面、１０ｂ：第２側面、１０ｃ：第３側面、１０ｄ：第４側面）
１０ｅ：上面
１０ｆ：下面
Ｒ：凹部（１０ｇ：第１凹部、１０ｈ：第２凹部）
１０ｉ：素子載置凹部
１１１：リード
１１：第１リード（１１ａ：第１本体部、１１ｂ：第１吊部、１１ｃ、１１ｄ：第１側吊部）
１１ｅ、１２ｅ：上面
１１ｆ、１２ｆ：下面
１２：第２リード（１２ａ：第２本体部、１２ｂ：第２吊部、１２ｃ、１２ｄ：第２側吊部）
１２ｎ：凹部
１３：樹脂部材
１１２：軟質樹脂部
１５ｇ、１５ｈ：下面
１６：接着剤層
１７：発光素子
１８ａ、１８ｂ：ワイヤ
１９：封止部材
２１、２２：貫通孔
５０：リードフレーム
５３：フレーム
５４：凹部
ＤＬ：切断ライン 1-5: Light emitting device 10: Package S: Outer surface (10a: 1st side surface, 10b: 2nd side surface, 10c: 3rd side surface, 10d: 4th side surface)
10e: upper surface 10f: lower surface R: concave portion (10 g: first concave portion, 10h: second concave portion)
10i: Element mounting recess 111: Lead 11: First lead (11a: first main body, 11b: first suspension, 11c, 11d: first side suspension)
11e, 12e: Upper surface 11f, 12f: Lower surface 12: Second lead (12a: second main body, 12b: second suspension, 12c, 12d: second side suspension)
12n: Recessed portion 13: Resin member 112: Soft resin portion 15 g, 15h: Lower surface 16: Adhesive layer 17: Light emitting element 18a, 18b: Wire 19: Sealing member 21, 22: Through hole 50: Lead frame 53: Frame 54 : Recessed DL: Cutting line

Claims (6)

一対のリードと、前記一対のリードを一体的に保持する樹脂部材と、を有するパッケージであって、前記一対のリードの上面が露出される底面と側壁とを備える素子載置凹部と、外側面及び下面に開口する凹部と、が設けられたパッケージと、
前記素子載置凹部の底面上に配置された発光素子と、
前記素子載置凹部内に配置された封止部材と、
を備え、
前記リードの少なくとも一方は、
前記パッケージの下面において露出した本体部と、
前記本体部から延伸し、前記パッケージの外側面の一部を構成し、下面の少なくとも一部が前記凹部内で前記本体部の下面よりも上側において露出した吊部と、
を有し、
前記吊部の下面に、前記樹脂部材よりも軟質な軟質樹脂部を備える、発光装置。 A package including a pair of reeds and a resin member that integrally holds the pair of reeds, and an element mounting recess having a bottom surface and a side wall on which the upper surface of the pair of reeds is exposed, and an outer surface. And a package provided with a recess that opens on the lower surface,
A light emitting element arranged on the bottom surface of the element mounting recess and
The sealing member arranged in the element mounting recess and
With
At least one of the leads
The body exposed on the underside of the package and
A hanging portion extending from the main body portion to form a part of the outer surface of the package, and at least a part of the lower surface is exposed in the recess on the upper side of the lower surface of the main body portion.
Have,
A light emitting device provided with a soft resin portion softer than the resin member on the lower surface of the hanging portion. 前記吊部は、上面から下面に貫通する貫通孔を有し、
前記軟質樹脂部は、前記貫通孔内、及び、前記貫通孔上にも配置されており、
前記軟質樹脂部における前記貫通孔上に配置された部分は、前記パッケージの外側面の一部を構成する請求項１記載の発光装置。 The hanging portion has a through hole penetrating from the upper surface to the lower surface.
The soft resin portion is also arranged in the through hole and on the through hole.
The light emitting device according to claim 1, wherein the portion of the soft resin portion arranged on the through hole constitutes a part of the outer surface of the package. 前記軟質樹脂部は、前記パッケージの外側面において、前記吊部の側面に配置される請求項１または２に記載の発光装置。 The light emitting device according to claim 1 or 2, wherein the soft resin portion is arranged on the outer surface of the package and on the side surface of the suspension portion. 前記軟質樹脂部の下面は、前記吊部の下面よりも下方に位置する請求項１〜３のいずれか１つに記載の発光装置。 The light emitting device according to any one of claims 1 to 3, wherein the lower surface of the soft resin portion is located below the lower surface of the hanging portion. 前記軟質樹脂部の下面は、前記吊部の下面と同一面に位置する請求項１〜３のいずれか１つに記載の発光装置。 The light emitting device according to any one of claims 1 to 3, wherein the lower surface of the soft resin portion is located on the same surface as the lower surface of the hanging portion. 前記軟質樹脂部の下面は、前記吊部の下面よりも上方に位置する請求項１〜３のいずれか１つに記載の発光装置。 The light emitting device according to any one of claims 1 to 3, wherein the lower surface of the soft resin portion is located above the lower surface of the hanging portion.
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