JP6896598B2 - Pad temperature control mechanism and polishing device for adjusting the temperature of the polishing pad - Google Patents

Description

The present invention relates to a pad temperature control mechanism and a polishing device for adjusting the temperature of a polishing pad.

It is known that in a polishing apparatus, particularly a chemical mechanical polishing (CMP) apparatus, the level of uniformity of polishing processing can change depending on the temperature of the polished surface. Patent Document 1 (Japanese Unexamined Patent Publication No. 2011-136406) discloses a substrate polishing apparatus including a pad temperature control mechanism for adjusting the temperature of the polished surface of the polishing pad.

Japanese Unexamined Patent Publication No. 2011-136406

The polishing pad in the polishing device is a consumable item and is a member that needs to be replaced regularly. Further, when the temperature control of the polishing pad is unnecessary, it is preferable that the thermal contact between the polishing pad and the pad temperature control mechanism can be released. Therefore, it is an object of the present application to provide a pad temperature control mechanism that contributes to at least one of replacement of the polishing pad and release of thermal contact between the polishing pad and the pad temperature control means.

The present application is a pad temperature control mechanism for adjusting the temperature of the polishing pad of the polishing device, and the pad temperature control mechanism is composed of a heat conduction part for conducting heat with the polishing pad and a heat conduction part. An arm that extends and has a tapered tip, and an arm mount that mounts the arm and has a tapered groove-shaped arm guide that corresponds to the shape of the arm. A pad temperature control mechanism including a drop-out prevention member for preventing the arm from falling off from the arm guide is disclosed as an embodiment.

It is a front view of a polishing apparatus. It is a front sectional view of a pad temperature control mechanism. It is a front sectional view of the pad temperature control mechanism provided with an electric heating / cooling mechanism. It is a top view of the pad temperature control mechanism. It is a front sectional view of a pad temperature control mechanism. It is a right side view of a vertical movement mechanism and an arm mount. It is a front view of a heat conduction part and an arm. FIG. 5 is a cross-sectional view of the arm mount at the position of the cutting line labeled AA in FIG. It is a top view of the pad temperature control mechanism. It is a front partial cross-sectional view of a pad temperature control mechanism. It is a right side view of a vertical movement mechanism and an arm mount. It is a left side view of a heat conduction part and an arm. It is a front sectional view of an arm mount and a vertical movement mechanism.

<First Embodiment>
In the first embodiment, a configuration in which the pad temperature control mechanism 140 is detachably attached to the vertical movement mechanism 150 by a fixture such as a bolt will be described. FIG. 1 is a front view showing a polishing apparatus 100 according to the present embodiment. Here, FIG. 1 and other figures are schematic views. The size, position, shape, and the like of the parts shown in each figure may differ from the size, position, shape, and the like in an actual device. In the following, the left-right direction in FIG. 1 is the X direction (the right side of the paper surface is positive), the direction perpendicular to the paper surface is the Y direction (the front side of the paper surface is positive), and the vertical direction is the Z direction (the upper side of the paper surface is positive). The polishing apparatus 100 of FIG. 1 is a so-called "rotary type" CMP apparatus. However, as long as the polishing pad requires temperature control, the polishing apparatus 100 may be a CMP apparatus of a type other than the rotary type, or may be a polishing apparatus other than the CMP apparatus. The polishing device 100 of FIG. 1 includes a polishing table 110, a polishing head 120, a discharge mechanism 130, a pad temperature control mechanism 140, and a vertical movement mechanism 150. The polishing apparatus 100 further includes a control unit 160 for controlling each element.

The polishing device 100 includes a polishing table 110. A polishing pad 111 is detachably attached to the upper surface of the polishing table 110. The polishing table 110 can be rotated in at least one direction by a motor (not shown) or the like. The polishing table 110 of FIG. 1 can rotate counterclockwise when viewed from above.

The polishing device 100 further includes a polishing head 120. The polishing head 120 is provided on the upper part of the polishing table 110 so as to face the polishing table 110. A substrate 121 is detachably attached to the lower surface of the polishing head 120. The polishing head 120 can be rotated in at least one direction by a motor (not shown) or the like. The polishing head 120 of FIG. 1 can rotate counterclockwise (the same direction as the rotation direction of the polishing table 110) when viewed from above. Further, the polishing head 120 can be moved up and down by a head vertical movement mechanism (not shown).

The substrate 121 is polished by pressing the substrate 121 against the polishing pad 111 on the polishing table 110 and rotating at least one, preferably both, of the polishing table 110 and the polishing head 120.

The polishing apparatus 100 further includes a discharge mechanism 130 for discharging a liquid such as a polishing liquid, a chemical liquid, and / or a cleaning liquid toward the polishing surface. The discharge mechanism 130 of FIG. 1 includes a discharge pipe 132 extending from a liquid supply source 131 provided on the side of the polishing table 110. The liquid supply source 131 may be a component that constitutes a part of the polishing apparatus 100. As an addition or alternative, a liquid source 131 separate from the polishing apparatus 100 can also be used. The discharge pipe 132 of FIG. 1 passes through the upper part of the polishing table 110 and extends to an approximately central portion of the polishing table 110. Preferably, the polishing liquid is discharged from the discharge pipe 132 during the polishing of the substrate 121. Preferably, the cleaning liquid is discharged from the discharge pipe 132 during cleaning of the polishing pad 111 and / or the substrate 121. The number of the liquid supply source 131 and the discharge pipe 132 is not limited to one.

The polishing device 100 further includes a pad temperature control mechanism 140 for adjusting the temperature of the polishing pad 111. The pad temperature control mechanism 140 of FIG. 1 includes a heat conduction portion 141, an arm 142, and a heating / cooling mechanism 143. The heat conductive portion 141 is provided on the upper part of the polishing table 110, and is provided for conducting heat with the polishing pad 111 (for exchanging heat). The arm 142 extends from the heat conductive portion 141 toward the vertical movement mechanism 150. Further, the arm 142 is detachably fixed to the vertical movement mechanism 150. The heating / cooling mechanism 143 is a mechanism for heating and / or cooling the heat conductive portion 141. The heating / cooling mechanism 143 of FIG. 1 includes a heat medium flow path 145 for the heat medium supplied from the heat medium source 144. The heat medium source 144 may be a component that constitutes a part of the polishing apparatus 100. As an addition or alternative, a heat medium source 144 separate from the polishing apparatus 100 can also be used. The heat medium supplied from the heat medium source 144 may be a heat medium for heating or a heat medium for cooling. For example, water can be used as the heat medium. The heat medium source 144 may include a heater and / or a cooler (not shown) for heating and / or cooling the heat medium. As an addition or alternative, the heat transfer source 144 may be configured to retain a heat medium that has already been heated and / or cooled. The heat medium source 144 may include a pump (not shown) for flowing the heat medium toward the heat medium flow path.

The heat medium flow path 145 is provided inside the heat conductive portion 141. Therefore, the heat conductive portion 141 is heated and / or cooled by flowing the heat medium from the heat medium source 144 to the heat medium flow path 145. The number of the heat medium source 144 and the heat medium flow path 145 is not limited to one. For example, as the heat medium source 144, a first heat medium source 144 for supplying hot water and a second heat medium source 144 for supplying cold water can be provided. When a plurality of heat medium sources 144 are provided, one heat medium flow path 145 may be connected to each heat medium source 144. It is also possible for a plurality of heat medium sources 144 to share one heat medium flow path 145. It is also possible to connect a plurality of heat medium flow paths 145 to one heat medium source 144.

When a "jump-up mechanism (see Patent Document 1)" for retracting the pad temperature control mechanism 140 is added to the configuration of FIG. 1, the pad temperature control mechanism 140 and the discharge mechanism 130 are used while the pad temperature control mechanism 140 is retracted. Will collide. Therefore, it is difficult to replace the polishing pad 111 using the "jump-up mechanism" in the configuration of FIG. 1 and / or to release the thermal contact between the polishing pad 111 and the pad temperature control mechanism 140. .. Depending on the configuration of the polishing device 100, parts other than the discharge mechanism 130 may collide with or interfere with the pad temperature control mechanism 140.

Therefore, the polishing device 100 of FIG. 1 includes a vertical movement mechanism 150 for moving at least a part of the pad temperature control mechanism 140 up and down. More specifically, the vertical movement mechanism 150 is configured to move at least the arm 142 and the heat conductive portion 141 up and down. The vertical movement mechanism 150 is detachably fixed to the arm 142. In the example of FIG. 1, the arm 142 is fixed to the vertical movement mechanism 150 by the fixture 151. For convenience of illustration, FIG. 1 shows the fixture 151 in a removed state. An example of the fixture 151 is a bolt. The vertical movement mechanism 150 may be configured to move the heat medium source 144 up and down. As an addition or alternative, the heat carrier flow path 145 is formed from a flexible member (eg, a bellows or at least a tube made of an elastic or flexible member (a tube made of rubber, resin, etc.)) and a heat medium. It is also possible to configure the vertical movement mechanism 150 so that the source 144 is not moved up and down.

When the temperature control of the polishing pad 111 is required, the control unit 160 controls the vertical movement mechanism 150 so that the heat conductive portion 141 and the polishing pad 111 are in thermal contact with each other. In other words, the vertical movement mechanism 150 lowers the heat conductive portion 141 until the heat conductive portion 141 and the polishing pad 111 come into contact with each other. The temperature of the polishing pad 111 is adjusted by controlling the flow rate and / or temperature of the heat medium by the control unit 160 in a state where the heat conductive portion 141 and the polishing pad 111 are in contact with each other.

When the temperature control of the polishing pad 111 is unnecessary, the control unit 160 controls the vertical movement mechanism 150 so that the heat conductive portion 141 and the polishing pad 111 do not come into thermal contact with each other. In other words, the vertical movement mechanism 150 raises the heat conductive portion 141 until the heat conductive portion 141 and the polishing pad 111 do not come into contact with each other. As an addition or alternative, if the temperature control of the polishing pad 111 is not required, the control of the heat medium by the control unit 160 may be stopped.

When the polishing pad 111 needs to be replaced, the control unit 160 controls the vertical movement mechanism 150 so that a sufficient gap is formed between the heat conductive portion 141 and the polishing pad 111. In other words, the vertical movement mechanism 150 raises the heat conductive portion 141 until a sufficient gap is formed between the heat conductive portion 141 and the polishing pad 111. When it is necessary to replace the polishing pad 111, the user may release the fixing by the fixture 151 and remove the pad temperature control mechanism 140. The removed pad temperature control mechanism 140 may be stored outside the polishing apparatus 100. A mechanism for storing the removed pad temperature control mechanism 140 may be provided inside the polishing device 100. By raising the heat conductive portion 141 or removing the heat conductive portion 141, it is possible to secure the space required for replacing the polishing pad 111. In order to facilitate the peeling of the polishing pad 111 from the polishing table 110, it is preferable that the upper surface of the polishing table 110 is coated with a material having a low coefficient of friction (for example, Teflon (registered trademark)).

Further, since the pad temperature control mechanism 140 is removable, there is an advantage that the pad temperature control mechanism 140, particularly the heat conductive portion 141, can be easily cleaned. Ease of cleaning is important because the polishing liquid can adhere to or adhere to the pad temperature control mechanism 140, particularly the heat conductive portion 141.

The details of the pad temperature control mechanism 140 will be described with reference to FIG. FIG. 2 is a front sectional view of the pad temperature control mechanism 140. Further, FIG. 2 also shows a vertical movement mechanism 150 connected to the pad temperature control mechanism 140.

The heat medium flow path 145 of FIG. 2 is configured to supply a heat medium from the heat medium source 144 and recover the supplied heat medium. By configuring the heat medium flow path 145 as shown in FIG. 2 and circulating the heat medium in the heat conductive portion 141, the heat conductive portion 141 can be stably heated and / or cooled. The heat medium recovered by the heat medium flow path 145 may be heated and / or cooled and reused, or may be discarded. The heat medium flow path 145 preferably occupies 30% or more, more preferably 40% or more, and most preferably 50% or more of the volume of the heat conductive portion 141.

Preferably, the uneven structure 200 is provided on the lower surface of the heat conductive portion 141, that is, the portion in contact with the polishing pad 111. When the lower surface of the heat conductive portion 141 is completely flat, the heat conductive portion 141 sticks to the polishing pad 111 due to the surface tension of the liquid (polishing liquid, cleaning liquid, etc.) between the heat conductive portion 141 and the polishing pad 111. There is a possibility that it will end up. On the other hand, when the lower surface of the heat conductive portion 141 is completely flat, heat can be efficiently conducted. Further, when the lower surface of the heat conductive portion 141 is completely flat, there are no recesses, so that by-products generated by polishing do not accumulate in the recesses. Further, when the heat conductive portion 141 having no recess is used, the flow of the polishing liquid is not disturbed by the polishing liquid passing through the recess.

Instead of forming the lower surface of the heat conductive portion 141 flat, by providing the concave-convex structure 200 on the lower surface of the heat conductive portion 141, it is possible to prevent the heat conductive portion 141 from sticking to the polishing pad 111. Further, by providing the uneven structure 200, chattering between the heat conductive portion 141 and the polishing pad 111 can be prevented. Whether to flatten the lower surface of the heat conductive portion 141 or to provide the uneven structure 200 on the lower surface of the heat conductive portion 141 takes into consideration the degree of sticking of the heat conductive portion 141, the heat conduction efficiency from the heat conductive portion 141, and the like. It is preferable to determine. When the concavo-convex structure 200 is provided, the region where the concavo-convex structure 200 is provided and the specific structure of the concavo-convex structure 200 may be appropriately determined from the required heat conduction efficiency and the like.

Preferably, the polishing device 100 includes a sensor 210 for detecting that the arm 142 and the vertical movement mechanism 150 are correctly fixed. The sensor 210 may be controlled by the control unit 160 (not shown in FIG. 2). In FIG. 2, as the sensor 210, a proximity sensor is provided between the arm 142 and the vertical movement mechanism 150. As another example, it is also possible to employ a microswitch, an optical sensor, a camera and the like. The sensor 210 can prevent the substrate 121 from being polished when the pad temperature control mechanism 140 is removed or when the pad temperature control mechanism 140 is not properly attached.

A heating / cooling mechanism 143 having another configuration can also be adopted. FIG. 3 is a front sectional view of a pad temperature control mechanism 140 including an electric heating / cooling mechanism 143. The heating / cooling mechanism 143 of FIG. 3 includes a heater 300 and a cooler 310. The heater 300 and the cooler 310 are provided inside the heat conductive portion 141. Further, the heater 300 and the cooler 310 are connected to the power supply 320. The power supply 320 may be a component that constitutes a part of the polishing apparatus 100. As an addition or alternative, a power supply 320 separate from the polishing apparatus 100 can also be used. The heating / cooling mechanism 143 may include only one of the heater 300 and the cooler 310.

It is also possible to adopt a heating / cooling mechanism 143 in which the configuration of FIG. 2 and the configuration of FIG. 3 are combined. For example, a heating / cooling mechanism 143 including a heat medium flow path 145 and a heater 300 connected to a heat medium source 144 for supplying cold water may be used.

<Second Embodiment>
In the second embodiment, a configuration in which the heat conductive portion 141 can be easily attached and detached will be described. This embodiment will be described with reference to FIGS. 4, 5 and 6. FIG. 4 is a diagram showing a pad temperature control mechanism 140 according to the present embodiment. FIG. 4A is a top view of the pad temperature control mechanism 140. FIG. 4B is a front sectional view of the pad temperature control mechanism 140. The vertical movement mechanism 150 is also shown in FIG. 4B. FIG. 5 is a right side view showing the vertical movement mechanism 150 and the arm mount 400 according to the present embodiment. FIG. 6 is a front view showing the heat conductive portion 141 and the arm 142 according to the present embodiment. The arrangement pattern of the heating / cooling mechanism 143 inside the heat conductive portion 141 in FIG. 4 is an example, and any other arrangement pattern can be used.

The pad temperature control mechanism 140 according to the present embodiment includes a heat conductive portion 141, two arms 142, and an arm mount 400. The arm mount 400 is fixed to the vertical movement mechanism 150. The arm mount 400 is provided for mounting the arm 142. The arm mount 400 is provided with a number (here, two) of arm guides 410 corresponding to the number of arms 142. The user can insert the arm 142 into the arm mount 400 along the arm guide 410 and remove the arm 142 from the arm mount 400. The arm guide 410 according to this embodiment has a groove-like structure. The number of arms 142 is not limited to two, and may be one or three or more. Preferably, the number of arm guides 410 is the same as the number of arms 142. However, the number of arm guides 410 does not have to be the same as the number of arms 142.

The arm 142 is mounted on the arm mount 400 by the plunger 420. When the arm 142 is inserted into the arm mount 400, the pin of the plunger 420 engages with the plunger hole 430 provided in the arm 142. The number, size, position, etc. of the plunger 420 and the plunger hole 430 may be appropriately designed. Preferably, the arm 142 is provided with a plunger guide 440 for guiding the pin of the plunger 420 to the plunger hole 430. The plunger guide 440 in the present embodiment is a groove whose depth becomes shallower as it approaches the plunger hole 430.

The heat transfer section 141 is attached to the vertical movement mechanism 150 by the user inserting the arm 142 along the arm guide 410 until the pin of the plunger 420 engages the plunger hole 430. The arm 142 may be automatically inserted by some transport mechanism. In the present embodiment, the heat conductive portion 141 can be easily attached to the vertical movement mechanism 150 without the trouble of screwing or the like.

The plunger 420 is configured so that the pin of the plunger 420 and the plunger hole 430 can be disengaged by, for example, pulling the head. By pulling out the arm 142 from the arm mount 400 in a state where the pin of the plunger 420 and the plunger hole 430 are disengaged, the heat conductive portion 141 is removed from the vertical movement mechanism 150. It is preferable that the plunger 420 is provided with a locking mechanism in order to keep the plunger 420 between the pin and the plunger hole 430 in a disengaged state. In the present embodiment, the heat conductive portion 141 can be easily removed from the vertical movement mechanism 150 without the trouble of removing the screws.

Preferably, the arm 142 is provided with a handle 450 to facilitate insertion and removal of the arm 142. The handle 450 may be provided on the heat conductive portion 141 as long as it does not interfere with the polishing of the substrate 121 and the temperature control of the polishing pad 111. Preferably, the arm mount 400 is provided with a spring 460 to assist in pulling out the arm 142. The spring 460 may be provided on the arm 142. The spring 460 is provided so as to push the arm 142 in the direction in which the arm 142 is pulled out (the positive direction of X in FIG. 4). The pressing force of the spring 460 makes it easier for the user to pull out the arm 142. For convenience of illustration, the spring 460 is shown in a contracted state.

The arm mount 400 is provided with a coupling 470. In the illustrated example, the heat medium source 144 and the heat medium flow path 145 are detachably connected by a fluid coupling 470. When the heat conductive portion 141 is attached, the tip of the heat medium flow path 145 is inserted into the coupling 470. When the heat medium is a fluid, it is preferable that the heat medium flow path 145 and the coupling 470 are sealed by a one-touch joint, an O-ring, a metal seal, or the like. When the heat medium is a fluid, the coupling 470 may be provided with a check valve (not shown). As an addition or alternative, a check valve may be provided at the tip of a component other than the coupling 470, for example, the heat carrier flow path 145. By providing the check valve, it is possible to prevent the fluid remaining in each component from flowing out to the outside when the connection between the heat medium source 144 and the heat medium flow path 145 is released. When an electrical component is used as the heating / cooling mechanism 143, that is, when the heating / cooling mechanism 143 includes a heater 300 and / or a cooler 310, a coupling 470 for electrical wiring may be used. The coupling 470 makes it easy to separate the heat medium source 144 from the heat medium flow path 145, and thus makes it easy to remove the heat conductive portion 141. As an addition or alternative, the heat carrier source 144 and the heat carrier flow path 145 may be connected by stretchable and / or flexible piping or wiring.

Depending on the shape of the arm guide 410, the arm 142 may be inserted into the arm guide 410 in an inclined state and / or in a state of being displaced in the vertical and horizontal directions (Y direction and / or Z direction) in FIG. is there. Therefore, the heat medium flow path 145 may be inserted into the coupling 470 in an inclined state and / or in a state of being displaced in the vertical and horizontal directions. If the amount of inclination and / or the amount of deviation is large, the heat medium source 144 and the heat medium flow path 145 may not be properly connected.

Therefore, in the present embodiment, a gap is provided between the coupling 470 and the arm mount 400. FIG. 7 is a cross-sectional view of the arm mount 400 at the position of the cutting line labeled AA in FIG. The coupling 470 shown in FIG. 7 will be described as a fluid coupling. The coupling 470 has a T-shaped cross section, and a first through hole 700 for passing a fluid is provided in the center of the coupling 470. Further, the arm mount 400 is provided with a second through hole 710 for inserting a small diameter portion (a portion corresponding to a T-shaped vertical bar) of the coupling 470. After the small diameter portion of the coupling 470 is inserted into the second through hole 710, a stopper 720 (retaining ring, clamp, etc.) is attached to the small diameter portion of the coupling 470. The diameter of the second through hole 710 is determined so that there is a gap between the coupling 470 and the small diameter portion. Specifically, the diameter of the second through hole 710 ( _{indicated as "D hole} " in FIG. 7) is indicated as the diameter of the small diameter portion of the coupling 470 (indicated as _{"D cpl" in FIG. 7).} ) Can be 0.1 mm or more, 1 mm or more, 5 mm or more, 10 mm or more, or 20 mm or more. The diameter of the second through hole 710 is preferably smaller than the diameter of the large diameter portion of the coupling 470 so that the coupling 470 does not fall out of the second through hole 710.

Further, the distance between the large-diameter portion of the coupling 470 that can come into contact with the arm guide 410 and the stopper 720 (indicated as “l” in FIG. 7) is the number of the arm guide 410. It is determined so as to be larger than the wall thickness (indicated as "t" in FIG. 7) of the portion where the through hole 710 of 2 is provided. Specifically, the distance between the large-diameter portion of the coupling 470 that can come into contact with the arm guide 410 and the stopper 720 is set to the portion of the arm guide 410 where the second through hole 710 is provided. It can be 0.1 mm or more, 1 mm or more, 5 mm or more, 10 mm or more, or 20 mm or more longer than the wall thickness.

According to the configuration of FIG. 7, the gap provided between the coupling 470 and the arm mount 400 absorbs the inclination and / or the vertical and horizontal displacement of the heat medium flow path 145. Therefore, even if the heat medium flow path 145 is inserted into the coupling 470 in an inclined state and / or in a state of being displaced in the vertical and horizontal directions, the heat medium source 144 and the heat medium flow path 145 are properly connected. can do. The gap provided between the coupling 470 and the arm mount 400 also serves as play for thermal expansion of the coupling 470 and / or the arm mount 400.

Especially when the heat medium is a liquid and the connection between the coupling 470 and the heat medium flow path 145 is improper, liquid leakage may occur. If the coupling 470 is provided with a check valve and the connection between the coupling 470 and the heat medium flow path 145 is improper, the check valve causes the heat medium to flow. May interfere. A sensor (not shown) may be provided around the coupling 470 to ensure that the coupling 470 and the heat carrier flow path 145 are properly connected.

In the configuration of the second embodiment, the vertical movement mechanism 150 is not necessarily a necessary mechanism. However, in order to facilitate the removal of the heat conductive portion 141, to facilitate the replacement of the polishing pad 111, and to separate the heat conductive portion 141 from the polishing pad 111 when temperature control is not required, the vertical movement mechanism 150 Is preferably provided.

Also in the configuration of the second embodiment, the replacement of the polishing pad 111 and / or the thermal contact between the heat conductive portion 141 and the polishing pad 111 is performed without using the “jumping mechanism (see Patent Document 1)”. It can be canceled.

<Third Embodiment>
In the configuration described in the second embodiment, in order to insert the arm 142 into the arm guide 410, it is necessary to provide a play between the arm 142 and the arm guide 410. Further, it is necessary to provide a play between the pin of the plunger 420 and the plunger hole 430. The play between these parts causes the arm 142 to rattle. The rattling of the arm 142 causes a shift in the position where the heat conductive portion 141 and the polishing pad 111 come into contact with each other, which may make precise temperature control of the polishing pad 111 difficult. In particular, when the heat conductive portion 141 is displaced in the radial direction (X direction) of the polishing table 110, the portion of the polishing pad 111 that should be in contact with the heat conductive portion 141 may not come into contact with the heat conductive portion 141.

Further, when the arm 142 is inserted and removed, the arm 142 and the arm guide 410 rub against each other, so that abrasion powder may be generated. Abrasion debris can travel on the stream of gas and / or liquid in the polishing apparatus 100 to reach the polishing pad 111. Abrasion debris on the polishing pad 111 can cause abnormal polishing of the substrate 121. Further, the abrasion powder adhering to the substrate 121 may cause an abnormality in a process after the substrate polishing. Further, rubbing between the arm 142 and / or the arm guide 410 may worsen the slipperiness between the arm 142 and the arm guide 410, making it difficult to insert and remove the arm 142.

If the play between the parts is reduced in order to reduce the rattling of the arm 142, it is considered that the arm 142 and the arm guide 410 strongly rub against each other. On the contrary, when the play between the parts is increased in order to reduce the rubbing between the arm 142 and the arm guide 410, it is considered that the rattling of the arm 142 becomes large.

Therefore, in the third embodiment, a configuration for reducing at least one of the rattling of the arm 142 and the rubbing between the arm 142 and the arm guide 410 will be described with reference to FIGS. 8, 9 and 10. FIG. 8 is a diagram showing a pad temperature control mechanism 140 according to the present embodiment. FIG. 8A is a top view of the pad temperature control mechanism 140. FIG. 8B is a front partial cross-sectional view of the pad temperature control mechanism 140 (heat medium source 144, vertical movement mechanism 150 and arm mount 400 are shown in cross section, and heat conductive portion 141 and arm 142 are shown in non-cross section. ). The vertical movement mechanism 150 is also shown in FIG. 8B. FIG. 9 is a right side view showing the vertical movement mechanism 150 and the arm mount 400 according to the present embodiment. FIG. 10 is a left side view showing the heat conductive portion 141 and the arm 142 according to the present embodiment.

The third embodiment has the same characteristics as the second embodiment in that the arm 142 is configured to be inserted into the arm guide 410. On the other hand, the shapes of the arm 142 and the arm guide 410 in the third embodiment are different from those shapes in the second embodiment.

As best shown in FIG. 8B, the tips of at least one of the arms 142 (both of the two arms 142 in the drawing) in this embodiment are tapered. More specifically, in the arm 142, the upper part of the tip away from the heat conductive portion 141 is formed in a tapered shape. Here, the "tip of the arm 142" can be rephrased as "a portion of the arm 142 that is inserted into the arm guide 410". As an addition or alternative, the lower portion of the arm 142 may be tapered. However, preferably, the lower portion of the arm 142 has a non-tapered shape in order to prevent the arm 142 from falling off unintentionally. The shape of the arm guide 410 corresponds to the shape of the arm 142. That is, the arm guide 410 is formed in a tapered groove shape. The taper angle of the arm 142 and the arm guide 410 may be any angle, and can be, for example, an angle of 10 degrees or more and 45 degrees or less. The taper angle may be less than 10 degrees or greater than 45 degrees. It is preferable to determine the taper angle so that the length of the tapered portion of the arm 142 is longer than the length of the portion of the arm 142 that is inserted into the arm guide 410.

In the present embodiment, a dropout prevention member 810 is provided in order to install the arm 142 on the arm guide 410 of the arm mount 400, in other words, to prevent the arm 142 from falling off from the arm guide 410. Specifically, as the fall-out prevention member 810, the arm 142 is provided with the hook 811 and the arm mount 400 is provided with the fastener 812. In the illustrated example, one set of hooks 811 and fasteners 812 is provided, but two or more sets of hooks 811 and fasteners 812 may be used. When the hook 811 and the fastener 812 are engaged, the arm 142 is pressed against the arm mount 400 and
The arm 142 is prevented from falling off. As an addition or alternative, the arm 142 may be provided with fasteners 812 and the arm mount 400 may be provided with fasteners 812. As a further addition or alternative, other elements such as springs, plungers, pins, bolts, nuts, wires and / or strings can be used in place of the hooks 811 and fasteners 812. The fall-off prevention member 810 may be a member that prevents the arm 142 from falling off by an electromagnetic force generated from a permanent magnet, an electromagnet, or the like. Further, the dropout prevention member 810 may be provided at an arbitrary place, and for example, the fastener 812 may be provided in the vertical movement mechanism 150.

According to the configuration of the third embodiment, when the arm 142 is not completely inserted into the arm guide 410, the arm 142 and the arm guide 410 do not rub against each other so much. Therefore, according to the configuration of the third embodiment, it is possible to reduce the generation of abrasion powder. Further, by reducing the rubbing, it is possible to prevent the slipperiness from deteriorating. Further, since the arm 142 and the arm guide 410 are formed in a tapered shape, the arm 142 can be easily inserted and removed.

When the arm 142 is completely inserted into the arm guide 410, the tapered surface of the arm 142 and the tapered surface of the arm guide 410 come into contact with each other. In other words, when the arm 142 is fully inserted into the arm guide 410, the play in the X direction between the arms 142 and 410 is virtually zero (manufacturing error, assembly error, component deflection, aging and heat). Play that occurs due to the influence of the difference in expansion coefficient, etc. is excluded). Therefore, the rattling of the arm 142 in the X direction is reduced. Therefore, according to the configuration of the third embodiment, the heat conductive portion 141 can be positioned with high accuracy.

More preferably, at least one of the arms 142 is formed in a dovetail tenon, as best shown in FIG. However, the term "ant mortise" here includes "single ant mortise". Further, as best shown in FIG. 9, the arm guide 410 for the tenon-shaped arm is preferably formed in a dovetail groove shape. However, the term "anticle groove" here includes "single groove". The dovetail tenon structure and dovetail groove structure reduce rattling of the arm 142 in the Y direction. Unlike the illustrated example, the plurality of arms 142 and arm guides 410 may be configured in a dovetail tenon or dovetail groove shape. The angle of the dovetail tenon and dovetail groove can be any angle, for example 45 degrees or 60 degrees.

A modified example of this embodiment is shown in FIG. FIG. 11 is a front sectional view of the arm mount 400 and the vertical movement mechanism 150. However, for convenience of illustration, the coupling 470 is not shown. In the example of FIG. 11, a groove 1100 having a rectangular shape when viewed from the front and a block 1110 having a trapezoidal shape when viewed from the front constitute an arm guide 410 having a tapered groove shape as a whole. At least a portion of block 1110 is located inside the rectangular groove 1100. In the example of FIG. 11, all the blocks 1110 are located inside the rectangular groove 1100. The block 1110 is fixed by a fixture 1120 such as a bolt. Further, at least one of the fixed position and the fixed angle of the block 1110 is adjustable. By moving the fixed position of the block 1110 in the X direction, it is possible to adjust the insertion length of the arm 142 and, by extension, the position of the heat conductive portion 141. By changing the fixing angle of the block 1110, it is possible to adjust the taper angle of the arm guide 410 according to the angle of the tapered portion of the heat conductive portion 141. The rectangular groove 1100 and the block 1110 may form a tapered groove-shaped and dovetail groove-shaped arm guide 410.

Although some embodiments of the present invention have been described above, the above-described embodiments of the present invention are for facilitating the understanding of the present invention and do not limit the present invention. Also, as long as they are not inconsistent with each other, the matters described in one embodiment can be applied to other embodiments. For example, the concave-convex structure 200 and / or the sensor 210 described in the first embodiment can be applied to the second embodiment or the third embodiment. Similarly, the plunger 420 and / or spring 460 described in the second embodiment can be applied to the third embodiment.

The present invention can be modified and improved without departing from the spirit thereof, and it goes without saying that the present invention includes an equivalent thereof. In addition, any combination or omission of the claims and the components described in the specification is possible within the range in which at least a part of the above-mentioned problems can be solved, or in the range in which at least a part of the effect is exhibited. Is.

The present application is, as one embodiment, a pad temperature control mechanism for adjusting the temperature of the polishing pad of the polishing device, and the pad temperature control mechanism includes a heat conductive portion for conducting heat with the polishing pad. An arm extending from the heat conductive portion and having a tapered tip, and an arm mount for mounting the arm, a tapered groove-shaped arm guide corresponding to the shape of the arm was formed. Discloses a pad temperature control mechanism comprising an arm mount and a dropout prevention member for preventing the arm from falling off the arm guide.

As an example, this pad temperature control mechanism has the effect of reducing at least one of rattling of the arm and rubbing between the arm and the arm guide. Further, this pad temperature control mechanism has an effect that the rattling of the arm in the X direction can be reduced as an example.

Further, the present application is, as an embodiment, a pad temperature control mechanism, in which at least one of the arms is formed in a dovetail tenon shape, and among the arm guides, the arm guide for the dovetail tenon-shaped arm is a dovetail groove. The pad temperature control mechanism formed in a shape is disclosed.

This pad temperature control mechanism has an effect that the rattling of the arm in the Y direction can be reduced as an example.

Further, the present application discloses, as an embodiment, a pad temperature control mechanism, which is a pad temperature control mechanism in which a heating / cooling mechanism is provided inside a heat conductive portion. Further, the present application is, as an embodiment, a pad temperature control mechanism, wherein the heating / cooling mechanism is provided with a heat medium flow path for flowing a heat medium, and heat is generated when the arm is mounted on the arm mount. Disclosed is a pad temperature control mechanism provided with a coupling connected to a medium flow path.

The details of the pad temperature control mechanism and the heating / cooling mechanism will be described by these disclosure contents.

Further, the present application discloses, as an embodiment, a pad temperature control mechanism in which a coupling is provided so as to form a gap between the pad and the arm mount.

As an example, this pad temperature control mechanism has the effect of facilitating the proper connection between the heat medium source and the heat medium flow path.

Further, the present application discloses, as an embodiment, a pad temperature control mechanism, wherein the heating / cooling mechanism includes a heater and / or a cooler.

This disclosure describes another example of a heating and cooling mechanism.

Further, the present application is, as an embodiment, a pad temperature control mechanism, which is a rectangular groove and a block located at least partially inside the rectangular groove, and adjusts a fixed position and / or a fixed angle. Disclosed is a pad temperature control mechanism in which a tapered groove-shaped arm guide is formed by a block, which is possible.

As an example, this pad temperature control mechanism has the effect that the insertion length of the arm and / or the taper angle of the arm guide can be adjusted.

Further, in the present application, as one embodiment, a polishing table to which a polishing pad is attached, a polishing head provided on the upper part of the polishing table so as to face the polishing table, and a pad temperature control mechanism described in the present specification are provided. Disclose the polishing apparatus provided. Further, the present application discloses, as an embodiment, a polishing device further including a vertical movement mechanism for moving the pad temperature control mechanism up and down.

These disclosures describe the details of the polishing apparatus with the pad temperature control mechanism described herein.

Further, the present application discloses, as an embodiment, a polishing apparatus in which a surface to which a polishing pad of a polishing table is attached is coated with a material having a low friction coefficient.

As an example, this polishing device has an effect that the polishing pad can be easily peeled off from the polishing table.

100 ... Polishing device 110 ... Polishing table 111 ... Polishing pad 120 ... Polishing head 121 ... Substrate 130 ... Discharge mechanism 131 ... Liquid supply source 132 ... Discharge piping 140 ... Pad temperature control mechanism 141 ... Heat conduction part 142 ... Arm 143 ... Heating Cooling mechanism 144 ... Heat medium source 145 ... Heat medium flow path 150 ... Vertical movement mechanism 151 ... Fixture 160 ... Control unit 200 ... Concavo-convex structure 210 ... Sensor 300 ... Heater 310 ... Cooler 320 ... Power supply 400 ... Arm mount 410 ... Arm guide 420 ... Plumber 430 ... Plumber hole 440 ... Plumber guide 450 ... Handle 460 ... Spring 470 ... Coupling 700 ... First through hole 710 ... Second through hole 720 ... Stopper 810 ... Fall prevention member 811 ... Hook 812 ... Fastener 1100 ... Rectangular groove 1110 ... Block 1120 ... Fixture

Claims (10)

It is a pad temperature control mechanism for adjusting the temperature of the polishing pad of the polishing device, and the pad temperature control mechanism is
A heat conductive portion for conducting heat between the polishing pad and the polishing pad,
An arm extending from the heat conductive portion and having a tapered tip,
An arm mount for mounting the arm, and an arm mount having a tapered groove-shaped arm guide corresponding to the shape of the arm.
A dropout prevention member for preventing the arm from falling off from the arm guide,
A pad temperature control mechanism. The pad temperature control mechanism according to claim 1.
At least one of the arms is formed in a mortise and tenon shape.
Of the arm guides, the arm guide for the dovetail-shaped arm is formed in a dovetail groove shape.
Pad temperature control mechanism. The pad temperature control mechanism according to claim 1 or 2, wherein a heating / cooling mechanism is provided inside the heat conductive portion. The pad temperature control mechanism according to claim 3.
The heating / cooling mechanism includes a heat medium flow path for flowing a heat medium supplied from the heat medium source.
The arm mount is provided with a coupling that is connected to the heat medium flow path when the arm is mounted on the arm mount.
Pad temperature control mechanism. The pad temperature control mechanism according to claim 4, wherein the coupling is provided so as to form a gap between the pad temperature control mechanism and the arm mount. The pad temperature control mechanism according to any one of claims 3 to 5, wherein the heating / cooling mechanism includes a heater and / or a cooler. The pad temperature control mechanism according to any one of claims 1 to 6.
With a rectangular groove,
A block that is at least partially located inside the rectangular groove and has an adjustable fixed position and / or fixed angle.
A pad temperature control mechanism in which the tapered groove-shaped arm guide is formed. A polishing table to which a polishing pad can be attached, and
A polishing head provided on the upper part of the polishing table so as to face the polishing table,
The pad temperature control mechanism according to any one of claims 1 to 7.
A polishing device. The polishing apparatus according to claim 8, further comprising a vertical movement mechanism for moving the pad temperature control mechanism up and down. The polishing apparatus according to claim 8 or 9, wherein the surface of the polishing table to which the polishing pad is attached is coated with a material having a low friction coefficient.

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