JP2020003083A - System for supplying heating fluid and cooling fluid with temperature adjusted to heat exchanger, and polishing device - Google Patents

Abstract

To provide a system capable of supplying heating fluid and cooling fluid with a desired temperature adjusted to a heat exchanger at a desired flow rate, while suppressing increase in cost and installation space.SOLUTION: A system 30 comprises: a heating fluid tank 32 storing heating fluid; a cooling fluid tank 52 storing cooling fluid; a heating fluid circulation line 31 circulating the heating fluid between a heat exchanger 11 and the heating fluid tank 32; a cooling fluid circulation line 51 circulating the cooling fluid between the heat exchanger 11 and the cooling fluid tank 52; at least one Peltier element 20 arranged so as to be heat-exchangeable with the heating fluid tank 32 and the cooling fluid tank 52; and a control unit 40 that controls the operation of the Peltier element 20 to adjust the temperature of the heating fluid and the temperature of the cooling fluid.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a system for supplying a temperature-regulated heating fluid and a cooling fluid to a heat exchanger, and more particularly, to a heat exchanger for regulating a surface temperature of a polishing pad of a polishing apparatus, which is regulated to a desired temperature. The present invention relates to a system for supplying a heating fluid and a cooling fluid. Furthermore, the present invention relates to a polishing apparatus provided with such a system.

  A CMP (Chemical Mechanical Polishing) apparatus is used in a process of polishing the surface of a wafer in the manufacture of semiconductor devices. The CMP apparatus holds the wafer with a polishing head, rotates the wafer, and presses the wafer against a polishing pad on a rotating polishing table to polish the surface of the wafer. During polishing, a polishing liquid (slurry) is supplied to the polishing pad, and the surface of the wafer is flattened by the chemical action of the polishing liquid and the mechanical action of abrasive grains contained in the polishing liquid.

  The polishing rate of the wafer depends not only on the polishing load of the wafer on the polishing pad, but also on the surface temperature of the polishing pad. This is because the chemical action of the polishing liquid on the wafer depends on the temperature. Therefore, in the manufacture of semiconductor devices, it is important to maintain the surface temperature of the polishing pad during wafer polishing at an optimum value in order to increase the polishing rate of the wafer and keep it more constant.

  Therefore, a pad temperature adjusting device has been conventionally used to adjust the surface temperature of the polishing pad (for example, see Patent Document 1). FIG. 6 is a schematic diagram showing a conventional pad temperature adjusting device. As shown in FIG. 6, the pad temperature adjusting device 105 includes a heat exchanger 111 in which a flow path through which a fluid for adjusting the surface temperature of the polishing pad 103 flows is formed. A fluid supply system 130 that supplies fluid to the heat exchanger 111.

  The fluid supply system 130 includes a heating fluid tank 132 that stores a heating fluid whose temperature has been adjusted, a heating fluid supply line 133 that connects the heating fluid tank 132 and the heat exchanger 111, and a heating fluid return line 134. . The heating fluid whose temperature has been adjusted is supplied from the heating fluid tank 132 to the heat exchanger 111 through the heating fluid supply line 133, flows through the heat exchanger 111, and flows from the heat exchanger 111 through the heating fluid return line 134. 132 is returned. A first opening / closing valve 141 and a first flow control valve 142 are attached to the heating fluid supply line 133, and the first flow control valve 142 allows the heating fluid supplied from the heating fluid tank 132 to the heat exchanger 111 to be supplied to the heat exchanger 111. The flow rate is adjusted.

  The fluid supply system 130 further includes a cooling fluid supply line 153 and a cooling fluid discharge line 154 connected to the heat exchanger 111. The cooling fluid supply line 153 is connected to a cooling fluid supply pipe 180 which is one of utility pipes of a factory where the CMP apparatus is installed, and the cooling fluid discharge line 154 is connected to one of utility pipes of a factory where the CMP apparatus is installed. Connected to the cooling fluid return pipe 181. The cooling fluid flowing through the cooling fluid supply pipe 180 is supplied to the heat exchanger 111 through the cooling fluid supply line 153, flows through the heat exchanger 111, and returns from the heat exchanger 111 through the cooling fluid discharge line 154. Is returned to. A second opening / closing valve 155 and a second flow control valve 156 are attached to the cooling fluid supply line 153, and the cooling fluid supplied from the cooling fluid supply pipe 180 to the heat exchanger 111 by the second flow control valve 156. Is adjusted.

  When the first flow control valve 142 and the second flow control valve 156 change the flow rate of the heating fluid and the flow rate of the cooling fluid, the temperature of the heat exchanger 111 changes. The heat exchanger 111 performs heat exchange with the polishing pad 103, and as a result, the surface temperature of the polishing pad 103 changes. Therefore, the surface temperature of the polishing pad 103 during wafer polishing can be maintained at a desired temperature by the pad temperature adjusting device 105.

JP 2017-148933 A

  The temperature of the cooling fluid flowing through the cooling fluid supply pipe 180 installed in the factory is kept constant. Therefore, in order to precisely adjust the temperature of the polishing pad 103 with the cooling fluid maintained at a constant temperature, it is necessary to supply the cooling fluid to the heat exchanger 111 at a desired flow rate. For example, a large amount of cooling fluid needs to be supplied to the heat exchanger 111 in order to rapidly lower the temperature of the polishing pad 103 with the cooling fluid maintained at a constant temperature.

  On the other hand, since other devices other than the CMP device are also connected to the cooling fluid return pipe 181 installed in the factory, cooling is performed according to the flow rate of the cooling fluid flowing into the cooling fluid return pipe 181 from another device. Back pressure may be applied to the fluid discharge line 154. In this case, the cooling fluid cannot be supplied to the heat exchanger 111 at a desired flow rate, and the surface temperature of the polishing pad 103 cannot be quickly and appropriately controlled.

  In order to supply the cooling fluid adjusted to a desired temperature to the heat exchanger 111 at a desired flow rate, a dedicated cooling fluid tank and a cooler (for example, a chiller) are provided in the CMP apparatus, and the cooler is used. What is necessary is just to supply the cooling fluid whose temperature has been adjusted to the heat exchanger 111 from the cooling fluid tank.

  However, providing a dedicated cooling fluid tank and cooler in the CMP apparatus increases the size (ie, installation space) and cost of the CMP apparatus. For this reason, in spite of the fact that the surface temperature of the polishing pad is an important parameter for maintaining an appropriate polishing rate, the conventional polishing apparatus has been hindered from providing a dedicated cooling fluid tank and a cooler. .

  The problem caused by providing such a dedicated cooling fluid tank and a cooler is not limited to a polishing apparatus having a heat exchanger for adjusting the surface temperature of a polishing pad, but includes a temperature-controlled heating fluid and cooling. It can occur in any device with a heat exchanger to which fluid is supplied.

  Accordingly, an object of the present invention is to provide a system for supplying a heating fluid and a cooling fluid adjusted to a desired temperature at a desired flow rate to a heat exchanger while suppressing increases in cost and installation space. Further, the present invention provides a polishing apparatus comprising: a heat exchanger for adjusting the temperature of a polishing pad; and a system for supplying a heating fluid and a cooling fluid adjusted to a desired temperature to the heat exchanger at a desired flow rate. The purpose is to provide.

  In one aspect, a system for supplying a temperature-controlled heating fluid and a cooling fluid to a heat exchanger, the heating fluid tank storing the heating fluid, the cooling fluid tank storing the cooling fluid, and the heat exchange tank A heating fluid circulation line for circulating the heating fluid between the vessel and the heating fluid tank; a cooling fluid circulation line for circulating the cooling fluid between the heat exchanger and the cooling fluid tank; At least one Peltier element, which is heat-exchangeable with the heating fluid tank and the cooling fluid tank, and controls the operation of the at least one Peltier element to adjust the temperature of the heating fluid and the temperature of the cooling fluid. And a control unit that performs the control.

In one aspect, the apparatus further includes a first temperature sensor that measures the temperature of the heating fluid, and a second temperature sensor that measures the temperature of the cooling fluid, wherein the control unit is configured to determine a measurement value of the first temperature sensor, The operation of the at least one Peltier element is controlled based on a difference between a heating fluid target temperature and a difference between a value measured by the second temperature sensor and a cooling fluid target temperature.
In one aspect, the control unit controls a magnitude and / or a polarity of a direct current supplied to the at least one Peltier element.
In one aspect, the at least one Peltier element is a plurality of Peltier elements, and the control unit determines a difference between a measured value of the first temperature sensor and a target temperature of the heated fluid, and a measured value of the second temperature sensor. And supplying a DC current to only some of the Peltier elements of the plurality of Peltier elements based on a difference between the DC current and the cooling fluid target temperature, and controlling the magnitude and / or polarity of the DC current.

In one aspect, the at least one Peltier element is a plurality of Peltier elements, and the control unit determines a difference between a measured value of the first temperature sensor and a target temperature of the heated fluid, and a measured value of the second temperature sensor. And supplying a DC current to all the Peltier elements based on the difference between the DC current and the cooling fluid target temperature, and controlling the magnitude and / or polarity of the DC current.
In one aspect, a first supply pipe and a first drain pipe connected to the heating fluid tank, a first supply valve disposed in the first supply pipe, and a first drain disposed in the first drain pipe A control valve that further controls opening and closing operations of the first supply valve and the first drain valve based on a difference between the measurement value of the first temperature sensor and the heating fluid target temperature. .
In one aspect, a second supply pipe and a second drain pipe connected to the cooling fluid tank, a second supply valve disposed on the second supply pipe, and a second drain disposed on the second drain pipe A control valve for controlling the opening and closing operation of the second supply valve and the second drain valve based on a difference between the measurement value of the second temperature sensor and the cooling fluid target temperature. .

In one aspect, the heating fluid tank includes a first stirring mechanism for stirring the heating fluid stored in the heating fluid tank.
In one aspect, the cooling fluid tank includes a second stirring mechanism that stirs the cooling fluid stored in the cooling fluid tank.
In one embodiment, the apparatus includes a tank unit in which the heating fluid tank, the cooling fluid tank, and the at least one Peltier element are integrated.

  In one aspect, a polishing table that supports a polishing pad, a polishing head that presses a substrate against the surface of the polishing pad to polish the substrate, a heat exchanger disposed on the polishing pad, and the heat exchanger A system for supplying a temperature-controlled heating fluid and a cooling fluid, the system comprising a heating fluid tank for storing the heating fluid, a cooling fluid tank for storing the cooling fluid, and the heat exchanger. A heating fluid circulation line for circulating the heating fluid between the heating fluid tank, a cooling fluid circulation line for circulating the cooling fluid between the heat exchanger and the cooling fluid tank, At least one Peltier element that is heat-exchangeable with a tank and the cooling fluid tank; and controlling operation of the at least one Peltier element to perform the heating. Body temperature, and the control unit for adjusting the temperature of the cooling fluid, the polishing apparatus comprising: a is provided.

  According to the present invention, the heating fluid and the cooling fluid are supplied to the heat exchanger via the heating fluid circulation line and the cooling fluid circulation line, respectively. Therefore, the heating fluid and the cooling fluid adjusted to the desired flow rates can be supplied to the heat exchanger. Further, the control unit controls the operation of the Peltier element having the heat radiation surface and the heat absorption surface, thereby controlling the temperature of the heating fluid stored in the heating fluid tank and the temperature of the cooling fluid stored in the cooling fluid tank. Control at the same time. Therefore, the temperature of the heating fluid and the temperature of the cooling fluid can be adjusted to desired temperatures without providing separate heaters and coolers. As a result, an increase in the size and cost of the device having the heat exchanger can be suppressed.

FIG. 1 is a schematic diagram showing one embodiment of a polishing apparatus. FIG. 2 is a horizontal sectional view showing one embodiment of the heat exchanger. FIG. 3 is a plan view showing an example of the positional relationship between the heat exchanger on the polishing pad and the polishing head. FIG. 4 is an enlarged schematic view showing the tank unit shown in FIG. FIG. 5 is a sectional view schematically showing a modified example of the tank unit. FIG. 6 is a schematic diagram showing a conventional pad temperature adjusting device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic diagram showing one embodiment of a polishing apparatus. As shown in FIG. 1, the polishing apparatus includes a polishing head 1 that holds and rotates a wafer W, which is an example of a substrate, a polishing table 2 that supports a polishing pad 3, and a polishing liquid (for example, And a pad temperature adjusting system 5 for adjusting the surface temperature of the polishing pad 3. The surface (upper surface) 3a of the polishing pad 3 constitutes a polishing surface for polishing the wafer W.

  The polishing head 1 is movable in the vertical direction, and is rotatable about its axis in the direction indicated by the arrow. The wafer W is held on the lower surface of the polishing head 1 by vacuum suction or the like. A motor (not shown) is connected to the polishing table 2 and is rotatable in a direction indicated by an arrow. As shown in FIG. 1, the polishing head 1 and the polishing table 2 rotate in the same direction. The polishing pad 3 is stuck on the upper surface of the polishing table 2.

  Polishing of the wafer W is performed as follows. The wafer W to be polished is held by the polishing head 1 and further rotated by the polishing head 1. The polishing pad 3 is rotated together with the polishing table 2. The polishing liquid is supplied from the polishing liquid supply nozzle 4 to the surface 3a of the polishing pad 3, and the surface of the wafer W is pressed against the surface 3a of the polishing pad 3, that is, the polishing surface by the polishing head 1. The surface of the wafer W is polished by sliding contact with the polishing pad 3 in the presence of the polishing liquid. The surface of the wafer W is flattened by the chemical action of the polishing liquid and the mechanical action of abrasive grains contained in the polishing liquid.

  The pad temperature adjustment system 5 includes a heat exchanger 11 in which flow paths through which a heating fluid and a cooling fluid for adjusting the surface temperature of the polishing pad 3 flow are respectively formed, and a heating fluid and a cooling fluid whose temperatures are adjusted. And a fluid supply system 30 for supplying the heat exchanger 11. The heat exchanger 11 has a pad contact surface 63 that can contact the surface 3a of the polishing pad 3. The heat exchanger 11 is located above the polishing table 2 and is disposed on the surface 3 a of the polishing pad 3.

  The fluid supply system 30 includes a heating fluid tank 32 that stores a heating fluid whose temperature has been adjusted, and a heating fluid circulation line 31 that circulates the heating fluid between the heating fluid tank 32 and the heat exchanger 11. . The heating fluid circulation line 31 includes a heating fluid supply line 33 and a heating fluid return line 34 that connect the heating fluid tank 32 and the heat exchanger 11. One end of the heating fluid supply line 33 and the heating fluid return line 34 is connected to the heating fluid tank 32, and the other end is connected to the heat exchanger 11.

  A first opening / closing valve 41 and a first flow control valve 42 are arranged in the heating fluid supply line 33. The first flow control valve 42 is arranged between the heat exchanger 11 and the first on-off valve 41. The first opening / closing valve 41 is a valve having no flow control function, whereas the first flow control valve 42 is a valve having a flow control function. An example of the first flow control valve 42 is an actuator-driven valve such as a mass flow controller.

  Further, a first pump 35 is disposed in the heating fluid supply line 33. The first pump 35 is disposed between the heating fluid tank 32 and the first on-off valve 41. In the present embodiment, the first pump 35 is disposed adjacent to the heating fluid tank 32. When the first pump 35 is driven, the heating fluid is supplied from the heating fluid tank 32 to the heat exchanger 11 through the heating fluid supply line 33, flows in the heat exchanger 11, and returns from the heat exchanger 11 to the heating fluid return line 34. Through the heating fluid tank 32. Thus, the heating fluid circulates between the heating fluid tank 32 and the heat exchanger 11.

  The fluid supply system 30 further includes a cooling fluid tank 52 that stores a cooling fluid whose temperature has been adjusted, and a cooling fluid circulation line 51 that circulates the cooling fluid between the cooling fluid tank 52 and the heat exchanger 11. I have. The cooling fluid circulation line 51 includes a cooling fluid supply line 53 and a cooling fluid return line 54 connected to the heat exchanger 11. One end of the cooling fluid supply line 53 and the cooling fluid return line 54 is connected to the cooling fluid tank 52, and the other end is connected to the heat exchanger 11.

  A second opening / closing valve 55 and a second flow control valve 56 are attached to the cooling fluid supply line 53. The second flow control valve 56 is arranged between the heat exchanger 11 and the second on-off valve 55. The second on-off valve 55 is a valve having no flow control function, whereas the second flow control valve 56 is a valve having a flow control function. An example of the second flow control valve 56 is an actuator-driven valve such as a mass flow controller.

  Further, a second pump 58 is disposed in the cooling fluid supply line 53. The second pump 58 is disposed between the cooling fluid tank 52 and the second on-off valve 55. In the present embodiment, the second pump 58 is disposed adjacent to the cooling fluid tank 52. When the second pump 58 is driven, the cooling fluid is supplied from the cooling fluid tank 52 to the heat exchanger 11 through the cooling fluid supply line 53, flows through the heat exchanger 11, and returns from the heat exchanger 11 to the cooling fluid return line 54. Through the cooling fluid tank 52. Thus, the cooling fluid circulates between the cooling fluid tank 52 and the heat exchanger 11.

  The heating fluid circulation line 31 and the cooling fluid circulation line 51 are completely independent pipes. Therefore, the heating fluid and the cooling fluid are supplied to the heat exchanger 11 without being mixed, and are returned to the heating fluid tank 32 and the cooling fluid tank 52 through the heat exchanger 11.

  The fluid supply system 30 has a tank unit 38 in which a heating fluid tank 32 and a cooling fluid tank 52 are integrated. The tank unit 38 further includes a plurality (five in FIG. 1) of Peltier elements 20a, 20b, 20c, 20d, and 20e disposed between the heating fluid tank 32 and the cooling fluid tank 52. The Peltier elements 20a, 20b, 20c, 20d, and 20e will be described later. Thus, by providing the tank unit 38 in which the heating fluid tank 32, the cooling fluid tank 52, and the Peltier elements 20a, 20b, 20c, 20d, and 20e are integrated, an increase in the size of the polishing apparatus is minimized. As much as possible.

  As shown in FIG. 1, the fluid supply system 30 may include a cover 43 that covers the entire tank unit 38. This cover 43 is made of a heat insulating material. The cover 43 prevents the heating fluid from exchanging heat with the outside air via the wall surface of the heating fluid tank 32 and prevents the cooling fluid from exchanging heat with the outside air via the wall surface of the cooling fluid tank 52.

  Next, an example of the heat exchanger 11 will be described. FIG. 2 is a horizontal sectional view showing one embodiment of the heat exchanger 11. The heat exchanger 11 is a pad contact member having a heating channel 61 and a cooling channel 62 formed therein. In the present embodiment, the pad contact surface 63 is circular. In one embodiment, the pad contact surface 63 may have a polygonal shape, such as a square, a pentagon, or the like. As a material for forming the heating channel 61, the cooling channel 62, and the pad contact surface 63, a material having excellent thermal conductivity, abrasion resistance, and corrosion resistance such as SiC or alumina can be used.

  The heating channel 61 and the cooling channel 62 extend adjacent to each other and extend spirally. Further, the heating channel 61 and the cooling channel 62 have a point-symmetrical shape, and have the same length as each other. The heating channel 61 and the cooling channel 62 are completely separated, and the heating fluid and the cooling fluid are not mixed in the heat exchanger 11.

  As shown in FIG. 2, each of the heating channel 61 and the cooling channel 62 basically includes a plurality of arc channels 64 having a constant curvature and a plurality of inclined channels 65 connecting the arc channels 64. It is configured. The two adjacent arc channels 64 are connected by each inclined channel 65. According to such a configuration, the outermost peripheral portions of the heating channel 61 and the cooling channel 62 can be arranged at the outermost peripheral portions of the heat exchanger 11. That is, almost the entire pad contact surface 63 constituted by the lower surface of the heat exchanger 11 is located below the heating flow channel 61 and the cooling flow channel 62, and the heating liquid and the cooling liquid quickly move on the surface 3 a of the polishing pad 3. Can be heated and cooled.

  The heating fluid supply line 33 is connected to an inlet 61 a of the heating channel 61, and the heating fluid return line 34 is connected to an outlet 61 b of the heating channel 61. The cooling fluid supply line 53 is connected to an inlet 62 a of the cooling channel 62, and the cooling fluid return line 54 is connected to an outlet 62 b of the cooling channel 62. The inlets 61a, 62a of the heating flow channel 61 and the cooling flow channel 62 are located at the peripheral edge of the heat exchanger 11, and the outlets 61b, 62b of the heating flow channel 61 and the cooling flow channel 62 are connected to the heat exchanger 11. Centrally located.

  FIG. 3 is a plan view showing an example of the positional relationship between the heat exchanger 11 on the polishing pad 3 and the polishing head 1. In the present embodiment, the heat exchanger 11 has a circular shape when viewed from above. The distance from the center CL of the polishing pad 3 to the center of the heat exchanger 11 is the same as the distance from the center CL of the polishing pad 3 to the center of the polishing head 1. Since the heating channel 61 and the cooling channel 62 are adjacent to each other, the heating channel 61 and the cooling channel 62 are arranged along the circumferential direction of the polishing pad 3. While the polishing table 2 and the polishing pad 3 are rotating, the polishing pad 3 in contact with the heat exchanger 11 exchanges heat with the heating fluid and the cooling fluid.

  Both the heating channel 61 and the cooling channel 62 are disposed above the entire pad contact surface 63. According to such an arrangement, the heat exchanger 11 can control the surface temperature of the polishing pad 3 with both the heating fluid and the cooling fluid over the entire pad contact surface 63. By controlling the surface temperature of the polishing pad 3 using the heat exchanger 11, when polishing a substrate such as the wafer W, polishing performance such as a polishing rate can be improved.

  During polishing of the wafer W, the heat exchanger 11 contacts the surface of the polishing pad 3 (that is, the polishing surface 3a) in order to maintain the pad surface temperature at a predetermined target temperature. In the present specification, the form in which the heat exchanger 11 contacts the surface of the polishing pad 3 includes not only the form in which the heat exchanger 11 directly contacts the surface of the polishing pad 3 but also the form in which the heat exchanger 11 and the polishing pad 3 are in contact with each other. A mode in which the heat exchanger 11 contacts the surface of the polishing pad 3 in a state where the polishing liquid (slurry) exists between the polishing pad 3 and the surface is also included. In any of the embodiments, heat exchange is performed between the heating fluid and the cooling fluid flowing through the heat exchanger 11 and the polishing pad 3, whereby the pad surface temperature is controlled.

  Returning to FIG. 1, the pad temperature adjustment system 5 includes a pad temperature measuring device 39 for measuring the surface temperature of the polishing pad 3 (hereinafter, may be referred to as a pad surface temperature), and a pad surface measured by the pad temperature measuring device 39. The control unit 40 further operates the first flow control valve 42 and the second flow control valve 56 based on the temperature. The pad temperature measuring device 39 is arranged above the surface 3a of the polishing pad 3, and is configured to measure the surface temperature of the polishing pad 3 in a non-contact manner. The pad temperature measuring device 39 is connected to the control unit 40. As the pad temperature measuring device 39, a radiation thermometer that can measure the surface temperature of the polishing pad 3 in a non-contact manner can be used.

  Further, the control unit 40 is also connected to the first on-off valve 41 and the second on-off valve 55, and the control unit 40 controls the operations of the first on-off valve 41 and the second on-off valve 55. The first on-off valve 41 and the second on-off valve 55 are normally open. The first pump 35 and the second pump 58 are also connected to the control unit 40, and the control unit 40 is configured to control the operations of the first pump 35 and the second pump 58.

  The pad temperature measuring device 39 measures the surface temperature of the polishing pad 3 in a non-contact manner, and sends the measured value to the control unit 40. The control unit 40 operates the first flow control valve 42 and the second flow control valve 56 based on the measured pad surface temperature so that the pad surface temperature is maintained at a preset target temperature. Controls the flow rates of the heating fluid and the cooling fluid. The first flow control valve 42 and the second flow control valve 56 operate according to a control signal from the control unit 40 to adjust the flow rate of the heating fluid and the flow rate of the cooling fluid supplied to the heat exchanger 11. Heat exchange is performed between the heating fluid and the cooling fluid flowing through the heat exchanger 11 and the polishing pad 3, thereby changing the pad surface temperature. Therefore, the surface temperature of the polishing pad 3 during wafer polishing can be maintained at a desired temperature by the pad temperature adjusting device 5.

  By such feedback control, the surface temperature of the polishing pad 3 (pad surface temperature) is maintained at a predetermined target temperature. As the control unit 40, a PID (proportional-integral-derivative) controller can be used. The target temperature of the polishing pad 3 is determined according to the type of the wafer W or the polishing process, and the determined target temperature is input to the control unit 40 in advance.

  FIG. 4 is a schematic diagram showing the tank unit 38 shown in FIG. 1 in an enlarged manner. As shown in FIG. 4, the tank unit 38 of the fluid supply system 30 includes five Peltier elements 20a, 20b, 20c, 20d, and 20e disposed between the heating fluid tank 32 and the cooling fluid tank 52. Each Peltier element 20 is arranged so as to be able to exchange heat with the heating fluid tank 32 and the cooling fluid tank 52.

  The number of Peltier elements is arbitrary. For example, the tank unit 38 of the fluid supply system 30 may have one Peltier element 20. That is, the fluid supply system 30 may have at least one Peltier element. In the following description, the Peltier elements 20a, 20b, 20c, 20d, and 20e may be simply referred to as "Peltier elements 20" unless otherwise required.

  Each Peltier element 20 is a thermoelectric conversion element that is connected to a power supply (not shown) and transfers heat from one surface to the other surface by passing a DC current from the power supply. That is, one surface of the Peltier device 20 functions as a heat absorbing surface, and the other surface functions as a heat radiating surface (heat generating surface). The control section 40 is configured to be able to control the operation of each Peltier device 20. More specifically, the control unit 40 is configured to be able to change the magnitude and polarity of the DC current supplied to each Peltier element 20 (that is, the flow direction of the DC current to the Peltier element 20). The control unit 40 can adjust the amount of heat absorbed and the amount of heat generated by the Peltier device by changing the magnitude of the DC current supplied to the Peltier device 20. Further, the control unit 40 can switch between the heat absorbing surface and the heat generating surface of the Peltier device 20 by changing the polarity of the DC current supplied to the Peltier device 20. In one embodiment, the control unit 40 may be configured to be able to change one of the magnitude and the polarity of the DC current supplied to each Peltier element 20.

  The fluid supply system 30 further includes a first temperature sensor 46 that measures the temperature of the heating fluid, and a second temperature sensor 59 that measures the temperature of the cooling fluid. In the present embodiment, the first temperature sensor 46 is attached to the tip of a support rod projecting from the bottom wall of the heating fluid tank 32, and the second temperature sensor 59 is attached to the support rod projecting from the bottom wall of the cooling fluid tank 52. It is attached to the tip of the rod. The first temperature sensor 46 may be attached to the tip of a support rod projecting from the upper wall of the heating fluid tank 32, and the second temperature sensor 59 may be attached to the tip of the support rod projecting from the upper wall of the cooling fluid tank 52. It may be attached to.

  In one embodiment, the first temperature sensor 46 may be fixed to the inner wall of the heating fluid tank 32, and the second temperature sensor 59 may be fixed to the inner wall of the cooling fluid tank 52. Alternatively, the first temperature sensor 46 may be disposed on the heating fluid circulation line 31 (for example, the heating fluid supply line 33), and the second temperature sensor 59 may be disposed on the cooling fluid circulation line 51 (for example, the cooling fluid supply line). It may be arranged on the line 53).

  The first temperature sensor 46 and the second temperature sensor 59 are connected to the control unit 40, respectively, and are the measured values of the temperature of the heating fluid acquired by the first temperature sensor 46 and acquired by the second temperature sensor 59. The measured value of the temperature of the cooling fluid is sent to the control unit 40. The control unit 40 monitors the temperature of the heating fluid sent from the first temperature sensor 46 and the temperature of the cooling fluid sent from the second temperature sensor 59.

  The control unit 40 maintains the temperature of the heating fluid measured by the first temperature sensor 46 at the heating fluid target temperature, and maintains the temperature of the cooling fluid measured by the second temperature sensor 59 at the cooling fluid target temperature. Thus, the operation of the Peltier device 20 is controlled. That is, the control unit 40 eliminates the difference between the measured value of the temperature of the heating fluid and the preset heating fluid target temperature, and calculates the difference between the measured value of the cooling fluid temperature and the preset cooling fluid target temperature. The operation of each Peltier element 20 is controlled so as to eliminate the difference. The heating fluid target temperature and the cooling fluid target temperature are input to the control unit 40 in advance.

  Next, an example of operation control of each Peltier element 20 executed by the control unit 40 will be described. When increasing the temperature of the heating fluid in the heating fluid tank 32 and decreasing the temperature of the cooling fluid in the cooling fluid tank 52, the control unit 40 controls the polarity of the DC current supplied to each Peltier element 20. Thus, the surfaces of all the Peltier elements 20a, 20b, 20c, 20d, and 20e that are in contact with the heating fluid tank 32 function as heat radiation surfaces. In this case, the surfaces of all the Peltier elements 20a, 20b, 20c, 20d, and 20e that contact the cooling fluid tank 32 function as heat absorbing surfaces. Further, the control unit 40 adjusts the magnitude of the direct current of all the Peltier elements 20a, 20b, 20c, 20d, and 20e. In one embodiment, the control unit 40 may supply a direct current to only some of the Peltier devices (for example, the Peltier devices 20b and 20c).

  When decreasing the temperature of the heating fluid in the heating fluid tank 32 and increasing the temperature of the cooling fluid in the cooling fluid tank 52, the control unit 40 controls the polarity of the DC current supplied to each Peltier element 20. Thus, the surfaces of all the Peltier elements 20a, 20b, 20c, 20d, and 20e that come into contact with the heating fluid tank 32 function as heat absorbing surfaces. In this case, the surfaces of all the Peltier elements 20a, 20b, 20c, 20d, and 20e that contact the cooling fluid tank 32 function as heat radiation surfaces. Further, the control unit 40 adjusts the magnitude of the DC current supplied to each Peltier device 20. In one embodiment, the control unit 40 may supply the direct current to only some of the Peltier devices (for example, the Peltier devices 20c and 20d).

  When the difference between the temperature of the heating fluid and the target temperature of the heating fluid is large and the difference between the temperature of the cooling fluid and the target temperature of the cooling fluid is large, the control unit 40 controls all of the Peltier devices 20a, 20b, 20c, 20d, Supply maximum DC current to 20e. Thereafter, when the difference between the temperature of the heating fluid and the target temperature of the heating fluid is small and the difference between the temperature of the cooling fluid and the target temperature of the cooling fluid is small, the control unit 40 determines whether the DC current supplied to each Peltier device 20 Decrease the size. In this case, the magnitude of the direct current supplied to each Peltier element 20 may be the same as each other, or may be different. Alternatively, the control unit 40 may supply a DC current to only some of the Peltier devices 20a, 20b, 20c, 20d, and 20e (for example, only the Peltier devices 20c and 20d).

  When the difference between the temperature of the heating fluid and the target temperature of the heating fluid is small and the difference between the temperature of the cooling fluid and the target temperature of the cooling fluid is small, the control unit 40 controls the heating fluid tank 32 of some Peltier elements 20. And the surface of the remaining Peltier element 20 that contacts the cooling fluid tank 52 may function as a heat dissipation surface (or heat absorption surface). In this case, the surface of some of the Peltier devices 20 that contacts the cooling fluid tank 52 and the surface of the remaining Peltier devices 20 that contacts the heating fluid tank 32 function as a heat absorbing surface (or heat releasing surface).

  When increasing (or decreasing) both the temperature of the heating fluid and the temperature of the cooling fluid, the control unit 40 first determines the difference between the temperature of the heating fluid and the target temperature of the heating fluid by using the temperature of the cooling fluid and the target of the cooling fluid. Compare with the difference from the temperature. When the difference between the temperature of the heating fluid and the target temperature of the heating fluid is larger than the difference between the temperature of the cooling fluid and the target temperature of the cooling fluid, the control unit 40 controls the Peltier device 20 for heating the heating fluid in the heating fluid tank 32. The polarity of the DC current flowing through each Peltier element 20 is controlled so that the number of Peltier elements 20 is larger than the number of Peltier elements 20 that heat (or cool) the cooling fluid in the cooling fluid tank 52. For example, the control unit 40 sets the surfaces of the three Peltier elements 20a, 20b, and 20d that contact the heating fluid tank 32 and the surfaces of the two Peltier elements 20c and 20e that contact the cooling fluid tank 52 as heat radiation surfaces (or heat absorbing surfaces). Surface).

  Further, the control unit 40 controls the direct current supplied to the three Peltier elements 20a, 20b, and 20d such that the difference between the measured value of the temperature of the heating fluid sent from the first temperature sensor 46 and the target temperature of the heating fluid disappears. Control the magnitude of the current. Similarly, the control unit 40 controls the DC current supplied to the two Peltier elements 20c and 20e so that the difference between the measured value of the cooling fluid temperature sent from the second temperature sensor 59 and the cooling fluid target temperature is eliminated. Control the size of.

  If the difference between the temperature of the heating fluid and the target temperature of the heating fluid is smaller than the difference between the temperature of the cooling fluid and the target temperature of the cooling fluid, the control unit 40 controls the Peltier device 20 for heating the heating fluid in the heating fluid tank 32 The polarity of the DC current flowing through each Peltier element 20 is controlled such that the number of Peltier elements 20 is smaller than the number of Peltier elements 20 for heating the cooling fluid in the cooling fluid tank 52. For example, the control unit 40 sets the surfaces of the two Peltier devices 20c and 20d that contact the heating fluid tank 32 and the surfaces of the three Peltier devices 20a, 20b and 20e that contact the cooling fluid tank 52 as heat radiation surfaces (or heat absorbing surfaces). Surface).

  Further, the control unit 40 controls the DC current supplied to the two Peltier elements 20c and 20d so that the difference between the measured value of the temperature of the heating fluid sent from the first temperature sensor 46 and the target temperature of the heating fluid disappears. Control the size. Similarly, the control unit 40 is supplied to the three Peltier devices 20a, 20b, and 20e so that the difference between the measured value of the cooling fluid temperature sent from the second temperature sensor 59 and the cooling fluid target temperature is eliminated. Controls the magnitude of DC current.

  As described above, the control unit 40 determines the difference between the measured value of the temperature of the heating fluid sent from the first temperature sensor 46 and the target temperature of the heating fluid, and the measured value of the temperature of the cooling fluid sent from the second temperature sensor 59. Based on the difference from the cooling fluid target temperature, the magnitude and polarity of the direct current supplied to each Peltier element 20 are feedback-controlled. An example of such feedback control is PID (proportional-integral-derivative) control.

  According to the present embodiment, the heating fluid and the cooling fluid are independently supplied to the heat exchanger 11 via the heating fluid circulation line 31 and the cooling fluid circulation line 51, respectively. Therefore, the heating fluid and the cooling fluid adjusted to the desired flow rates can be supplied to the heat exchanger 11. Further, the control unit 40 controls the operation of each Peltier device 20 having a heat-dissipating surface and a cooling surface (that is, the magnitude and polarity of the DC current supplied to the Peltier device 20), thereby storing the Peltier device 20 in the heated fluid tank. The temperature of the heated fluid and the temperature of the cooling fluid stored in the cooling fluid tank are simultaneously controlled. Therefore, the temperature of the heating fluid and the temperature of the cooling fluid can be adjusted to desired temperatures without providing separate heaters and coolers. As a result, the heating fluid and the cooling fluid adjusted to the desired temperatures can be respectively supplied to the heat exchanger 11 at the desired flow rates while minimizing the cost and the installation space of the polishing apparatus.

  FIG. 5 is a cross-sectional view schematically illustrating a modified example of the tank unit 38. The configuration of this embodiment, which is not particularly described, is the same as the configuration of the tank unit 38 shown in FIG. In FIG. 5, illustration of the heating fluid circulation line 31 and the cooling fluid circulation line 51 is omitted.

  As shown in FIG. 5, the tank unit 38 of the fluid supply system 30 is connected to the heating fluid tank 32 and supplies a first supply pipe 70 for supplying a fluid to the heating fluid tank 32. A first supply valve 71 disposed therein, a first drain pipe 72 connected to the heating fluid tank 32 for discharging the heating fluid from the heating fluid tank 32, and a first drain valve 73 disposed on the first drain pipe 72. And The first supply pipe 70 is connected to a fluid supply source (not shown) provided outside the polishing apparatus. The fluid supplied to the heating fluid tank 32 through the first supply pipe 70 is the same fluid as the heating fluid stored in the heating fluid tank 32, but has a different temperature. The temperature of the fluid supplied to the heating fluid tank 32 through the first supply pipe 70 is lower than the temperature of the heating fluid stored in the heating fluid tank 32, and is, for example, normal temperature. The first supply valve 71 and the first drain valve 73 are connected to the control unit 40, respectively, and the control unit 40 is configured to control the opening and closing operations of the first supply valve 71 and the first drain valve 73, respectively. ing.

  The heating fluid tank 32 is provided with four liquid level sensors 75a, 75b, 75c, 75d for detecting the liquid level of the heating fluid stored therein, and these liquid level sensors 75a, 75b, 75c, 75d. Liquid level detection pipe 74. One end of the liquid level detection pipe 74 is connected to the upper part of the heating fluid tank 32, and the other end is connected to the lower part of the heating fluid tank 32. Since the heating fluid stored in the heating fluid tank 32 flows into the liquid level detection pipe 74, the liquid level of the heating fluid stored in the heating fluid tank 32 is changed by the four liquid level sensors 75a, 75b, 75c, and 75d. Can be detected.

  When the control unit 40 opens the first supply valve 71, the fluid flows into the heating fluid tank 32 via the first supply pipe 70. When the control unit 40 opens the first drain valve 73, the heating fluid is discharged from the heating fluid tank 32 via the first drain pipe 72. As described above, the temperature of the fluid supplied to the heating fluid tank 32 via the first supply pipe 70 is lower than the temperature of the heating fluid stored in the heating fluid tank 32. Therefore, by supplying the fluid to the heating fluid tank 32 through the first supply pipe 70 while discharging the heating fluid in the heating fluid tank 32 through the first drain pipe 72, the heating fluid in the heating fluid tank 32 is removed. The temperature of the heating fluid can be rapidly reduced.

  The controller 40 maintains the liquid level of the heating fluid in the heating fluid tank 32 between the liquid level sensor 75a disposed at the highest position and the liquid level sensor 75b disposed below the liquid level sensor 75a. So that the operations of the first supply valve 71 and the first drain valve 73 are controlled. For example, when the liquid level sensor 75b detects the liquid level of the heating fluid, the control unit 40 opens the first supply valve 71 and supplies the fluid to the heating fluid tank 32.

  The liquid level sensors 75c and 75d disposed below the liquid level sensor 75b function as liquid level sensors for generating a liquid level lowering alarm. Specifically, when the liquid level sensor 75c detects the liquid level of the heating fluid, the control unit 40 generates a first liquid level lowering alarm. The first liquid level lowering alarm is an alarm for notifying the operator of the polishing apparatus that the liquid level in the heated fluid tank 32 is lowering. As described above, when the liquid level sensor 75b disposed above the liquid level sensor 75c detects the liquid level of the heating fluid, the control unit 40 opens the first supply valve 71 and sends the fluid to the heating fluid tank 32. Supply. Nevertheless, when the liquid level sensor 75c detects the liquid level of the heating fluid, the control unit 40 generates a first liquid level lowering alarm, maintains the first supply valve 71 open, and performs the first The drain valve 73 is closed. The worker who has received the first liquid level lowering warning can confirm the open / closed state of the first supply valve 71 and the first drain valve 73, and problems such as leakage of the heating fluid from the heating fluid tank 32.

  When the liquid level of the heating fluid further decreases and the liquid level sensor 75d disposed below the liquid level sensor 75c detects the liquid level of the heating fluid, the control unit 40 generates a second liquid level reduction alarm. The second liquid level lowering alarm is an alarm that indicates that the liquid level in the heated fluid tank 32 has dropped below its allowable range. When the second liquid level lowering alarm is generated, the control unit 40 stops the operation of the fluid supply system 30.

  In one embodiment, the liquid level sensor 75a may function as a liquid level sensor for generating a first liquid level rise alarm. Specifically, when the liquid level sensor 75a detects the liquid level of the heating fluid, the control unit 40 closes the first supply valve 71 and opens the first drain valve 73. If the liquid level sensor 75a still detects the liquid level of the heating fluid after a lapse of a predetermined time in this state, the control unit 40 issues a first notification indicating that the liquid level in the heating fluid tank 32 does not decrease. Generates a level rise alarm. When the first liquid level rise alarm is generated, the control unit 40 stops the operation of the liquid supply system 30.

  Similarly, the tank unit 38 of the fluid supply system 30 is connected to the cooling fluid tank 52 and supplies a fluid to the cooling fluid tank 52, and a second supply pipe 77 disposed in the second supply pipe 77. The valve includes a valve 78, a second drain pipe 79 connected to the cooling fluid tank 52 for discharging the cooling fluid from the cooling fluid tank 52, and a second drain valve 80 disposed on the second drain pipe 79. . The second supply pipe 77 is connected to a fluid supply source (not shown) provided outside the polishing apparatus. The fluid supplied to the cooling fluid tank 52 through the second supply pipe 77 is the same fluid as the cooling fluid stored in the cooling fluid tank 52, but has a different temperature. The temperature of the fluid supplied to the cooling fluid tank 52 through the second supply pipe 77 is higher than the temperature of the cooling fluid stored in the cooling fluid tank 52, and is, for example, normal temperature. The second supply valve 78 and the first drain valve 80 are connected to the control unit 40, respectively, and the control unit 40 is configured to control opening and closing operations of the second supply valve 78 and the second drain valve 80, respectively. ing.

  The cooling fluid tank 52 has four liquid level sensors 83a, 83b, 83c, 83d for detecting the liquid level of the cooling fluid stored therein, and these liquid level sensors 83a, 83b, 83c, 83d. And a liquid level detection pipe 82. One end of the liquid level detection pipe 82 is connected to an upper part of the cooling fluid tank 52, and the other end is connected to a lower part of the cooling fluid tank 52. Since the cooling fluid stored in the cooling fluid tank 52 flows into the liquid level detection pipe 82, the liquid level of the cooling fluid stored in the cooling fluid tank 52 is changed by the four liquid level sensors 83a, 83b, 83c, and 83d. Can be detected.

  When the control unit 40 opens the second supply valve 78, the fluid flows into the cooling fluid tank 52 via the second supply pipe 77. When the control unit 40 opens the second drain valve 80, the cooling fluid in the cooling fluid tank 52 is discharged from the cooling fluid tank 52 via the second drain pipe 79. As described above, the temperature of the fluid supplied from the second supply pipe 77 to the cooling fluid tank 52 is higher than the temperature of the cooling fluid stored in the cooling fluid tank 52. Therefore, by discharging the cooling fluid in the cooling fluid tank 52 through the second drain pipe 79 and supplying the fluid to the cooling fluid tank 52 through the second supply pipe 77, the cooling fluid in the cooling fluid tank 52 is discharged. The temperature of the cooling fluid can be raised quickly.

  The control unit 40 maintains the liquid level of the cooling fluid in the cooling fluid tank 52 between the liquid level sensor 83a disposed at the highest position and the liquid level sensor 83b disposed below the liquid level sensor 83a. The opening and closing operation of the second supply valve 78 and the second drain valve 80 is controlled so as to be performed. For example, when the liquid level sensor 83b detects the liquid level of the cooling fluid, the control unit 40 opens the second supply valve 78 and supplies the fluid to the cooling fluid tank 52.

  The liquid level sensors 83c and 83d disposed below the liquid level sensor 83b function as liquid level sensors for generating a liquid level lowering alarm. Specifically, when the liquid level sensor 83c detects the liquid level of the cooling fluid, the control unit 40 generates a third liquid level lowering alarm. The third liquid level lowering alarm is an alarm for notifying the operator of the polishing apparatus that the liquid level in the cooling fluid tank 52 is lowering. As described above, when the liquid level sensor 83b disposed above the liquid level sensor 83c detects the liquid level of the cooling fluid, the control unit 40 opens the second supply valve 78 and sends the fluid to the cooling fluid tank 52. Supply. Nevertheless, when the liquid level sensor 83c detects the liquid level of the cooling fluid, the control unit 40 generates a third liquid level lowering alarm, maintains the second supply valve 78 open, and Close the drain valve 80. The worker who has received the third liquid level lowering warning can confirm the open / closed state of the second supply valve 78 and the second drain valve 80 and the trouble such as leakage of the cooling fluid from the cooling fluid tank 52.

  When the liquid level of the cooling fluid further decreases and the liquid level sensor 83d disposed below the liquid level sensor 83c detects the liquid level of the cooling fluid, the control unit 40 generates a fourth liquid level lowering alarm. The fourth liquid level lowering alarm is an alarm that indicates that the liquid level in the cooling fluid tank 52 has dropped below the allowable range. When the fourth liquid level lowering alarm is generated, the control unit 40 stops the operation of the fluid supply system 30.

  In one embodiment, the liquid level sensor 83a may function as a liquid level sensor for generating a second liquid level rise alarm. Specifically, when the liquid level sensor 83a detects the liquid level of the cooling fluid, the control unit 40 closes the second supply valve 78 and opens the second drain valve 80. If the liquid level sensor 83a still detects the liquid level of the cooling fluid after a lapse of a predetermined time in this state, the control unit 40 issues a second notification that the liquid level in the cooling fluid tank 52 does not drop. Generates a level rise alarm. When the second liquid level rise alarm is generated, the control unit 40 stops the operation of the liquid supply system 30.

  In the present embodiment, in addition to the operation of the Peltier device 20 described above, the control unit 40 operates the first supply valve 71 that supplies the fluid to the heating fluid tank 32 and the second operation that discharges the heating fluid from the heating fluid tank 32. By controlling the operation of the one-drain valve 73, the temperature of the heating fluid is controlled. Thus, the temperature of the heating fluid can be quickly and precisely adjusted.

  Similarly, in addition to the operation of the Peltier device 20 described above, the control unit 40 operates the second supply valve 78 that supplies fluid to the cooling fluid tank 52 and the second drain that discharges cooling fluid from the cooling fluid tank 52. By controlling the operation of the valve 80, the temperature of the cooling fluid is controlled. Thereby, the temperature of the cooling fluid can be quickly and precisely adjusted.

  As shown in FIG. 5, the fluid supply system 30 includes a first stirring mechanism 85 for stirring the heating fluid in the heating fluid tank 32, a second stirring mechanism 90 for stirring the cooling fluid in the cooling fluid tank 62, May be provided. In the illustrated example, the first stirring mechanism 85 has a first stirring blade 86 arranged in the heating fluid tank 32 and a first electric motor 87 for rotating the first stirring blade 86. The second stirring mechanism 90 has a second stirring blade 93 disposed in the cooling fluid tank 52 and a second electric motor 94 for rotating the second stirring blade 93.

  Further, in the present embodiment, the first temperature sensor 46 is fixed to the inner wall of the heating fluid tank 32, and the second temperature sensor 59 is fixed to the inner wall of the cooling fluid tank 52.

  The first electric motor 87 and the second electric motor 94 are connected to the control unit 40. The control unit 40 rotates the first stirring blade 86 by driving the first electric motor 87. Thereby, the temperature of the entire heating fluid in the heating fluid tank 32 can be quickly made uniform. Therefore, the temperature of the heating fluid can be adjusted accurately. Similarly, the control unit 40 rotates the second stirring blade 93 by driving the second electric motor 94. Thereby, the temperature of the entire cooling fluid in the cooling fluid tank 52 can be quickly made uniform. Therefore, the temperature of the cooling fluid can be adjusted accurately.

  The above embodiments have been described for the purpose of enabling a person having ordinary knowledge in the technical field to which the present invention pertains to carry out the present invention. Naturally, those skilled in the art can make various modifications of the above embodiment, and the technical idea of the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the embodiments described, but is to be construed in its broadest scope in accordance with the spirit defined by the appended claims.

REFERENCE SIGNS LIST 1 polishing head 2 polishing table 3 polishing pad 4 polishing liquid supply nozzle 5 pad temperature control system 11 heat exchanger 30 fluid supply system 31 heating fluid circulation line 32 heating fluid tank 33 heating fluid supply line 34 heating fluid return line 35 first pump 38 Tank unit 41 First on-off valve 42 First flow control valve 43 Cover 46 First temperature sensor 51 Cooling fluid circulation line 52 Cooling fluid tank 53 Cooling fluid supply line 54 Cooling fluid return line 55 Second on-off valve 56 Second flow control Valve 58 Second pump 59 Second temperature sensor 70 First supply pipe 71 First supply valve 72 First drain pipe 73 First drain valve 74 Liquid level detection pipe 75 Liquid level sensor 77 Second supply pipe 78 Second supply valve 79 Second drain pipe 80 Second drain valve 82 Liquid level detection pipe 3 level sensor

Claims (11)

A system for supplying a temperature-controlled heating fluid and a cooling fluid to a heat exchanger,
A heating fluid tank that stores the heating fluid,
A cooling fluid tank that stores the cooling fluid,
A heating fluid circulation line that circulates the heating fluid between the heat exchanger and the heating fluid tank,
A cooling fluid circulation line that circulates the cooling fluid between the heat exchanger and the cooling fluid tank;
At least one Peltier element heat-exchangeable with the heating fluid tank and the cooling fluid tank;
A controller for controlling the operation of the at least one Peltier element to adjust the temperature of the heating fluid and the temperature of the cooling fluid. A first temperature sensor for measuring a temperature of the heating fluid,
A second temperature sensor that measures the temperature of the cooling fluid,
The control unit is configured to control the at least one Peltier element based on a difference between the measurement value of the first temperature sensor and the target temperature of the heating fluid, and a difference between the measurement value of the second temperature sensor and the target temperature of the cooling fluid. The system of claim 1, controlling operation.   The system according to claim 2, wherein the control unit controls a magnitude and / or a polarity of a DC current supplied to the at least one Peltier element. The at least one Peltier element is a plurality of Peltier elements;
The control unit is configured to determine, based on a difference between the measurement value of the first temperature sensor and the target temperature of the heating fluid, and a difference between the measurement value of the second temperature sensor and the target temperature of the cooling fluid, 4. The system according to claim 3, wherein a DC current is supplied to only some of the Peltier devices, and the magnitude and / or polarity of the DC current are controlled. The at least one Peltier element is a plurality of Peltier elements;
The controller controls the direct current to all Peltier elements based on a difference between the measurement value of the first temperature sensor and the target temperature of the heating fluid and a difference between the measurement value of the second temperature sensor and the target temperature of the cooling fluid. 4. The system according to claim 3, wherein the DC current is supplied and the magnitude and / or polarity of the DC current is controlled. A first supply pipe and a first drain pipe connected to the heating fluid tank,
A first supply valve arranged in the first supply pipe;
A first drain valve disposed on the first drain pipe,
The control unit further controls opening and closing operations of the first supply valve and the first drain valve based on a difference between a measurement value of the first temperature sensor and the heating fluid target temperature. The system according to any one of claims 2 to 5. A second supply pipe and a second drain pipe connected to the cooling fluid tank;
A second supply valve disposed on the second supply pipe;
A second drain valve disposed in the second drain pipe,
The control unit further controls opening and closing operations of the second supply valve and the second drain valve based on a difference between a measurement value of the second temperature sensor and the cooling fluid target temperature. The system according to any one of claims 2 to 6.   The system according to any one of claims 1 to 7, wherein the heating fluid tank includes a first stirring mechanism for stirring the heating fluid stored in the heating fluid tank.   The system according to claim 1, wherein the cooling fluid tank includes a second stirring mechanism that stirs the cooling fluid stored in the cooling fluid tank.   The system according to any one of claims 1 to 9, further comprising a tank unit in which the heating fluid tank, the cooling fluid tank, and the at least one Peltier element are integrated. A polishing table that supports the polishing pad,
A polishing head for pressing the substrate against the surface of the polishing pad to polish the substrate,
A heat exchanger disposed on the polishing pad,
A system for supplying a temperature-controlled heating fluid and a cooling fluid to the heat exchanger,
The system comprises:
A heating fluid tank that stores the heating fluid,
A cooling fluid tank that stores the cooling fluid,
A heating fluid circulation line that circulates the heating fluid between the heat exchanger and the heating fluid tank,
A cooling fluid circulation line that circulates the cooling fluid between the heat exchanger and the cooling fluid tank;
At least one Peltier element heat-exchangeable with the heating fluid tank and the cooling fluid tank;
A polishing apparatus, comprising: a controller configured to control an operation of the at least one Peltier element to adjust a temperature of the heating fluid and a temperature of the cooling fluid.

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