JP2019111591A - Pad temperature adjustment mechanism for adjusting temperature of polishing pad and polishing device - Google Patents

Abstract

To provide a pad temperature adjustment mechanism which contributes to at least one of replacement of a polishing pad and release of thermal contact between the polishing pad and pad temperature adjustment means.SOLUTION: A pad temperature adjustment mechanism 140 is used to adjust a temperature of a polishing pad of a polishing device and includes: a heat conduction part 141 for conducting heat to the polishing pad; an arm 142 extending from the heat conduction part and including a tip formed into a taper shape; an arm mount 400 used to install the arm and formed with an arm guide 410 having a taper groove shape corresponding with a shape of the arm; and a falling prevention member for preventing the arm from falling from the arm guide. The pad temperature adjustment mechanism is disclosed.SELECTED DRAWING: Figure 8B

Description

  The present invention relates to a pad temperature control mechanism and a polishing apparatus for adjusting the temperature of a polishing pad.

  It is known that in polishing apparatuses, in particular in Chemical Mechanical Polishing (CMP) apparatuses, the level of the uniformity of the polishing process can vary depending on the temperature of the polishing surface. Patent Document 1 (Japanese Patent Laid-Open No. 2011-136406) discloses a substrate polishing apparatus including a pad temperature control mechanism for adjusting the temperature of the polishing surface of a polishing pad.

JP 2011-136406 A

  The polishing pad in the polishing apparatus is a consumable item, and is a member that needs periodical replacement. Further, when temperature control of the polishing pad is unnecessary, it is preferable that thermal contact between the polishing pad and the pad temperature control mechanism can be released. Therefore, the present application has at least one object to provide a pad temperature control mechanism that contributes to at least one of replacement of a polishing pad and release of thermal contact between the polishing pad and the pad temperature control unit.

  The present application relates to a pad temperature control mechanism for controlling the temperature of a polishing pad of a polishing apparatus, the pad temperature control mechanism including a heat conducting portion for conducting heat with the polishing pad, and a heat conducting portion An extending arm having a tapered tip, and an arm mount for mounting the arm, the arm mount having a tapered groove shaped arm guide corresponding to the shape of the arm; A pad temperature control mechanism is disclosed as an embodiment that includes an anti-falling member for preventing the arm from falling off the arm guide.

It is a front view of a grinding device. It is a front sectional view of a pad temperature control mechanism. It is front sectional drawing of a pad temperature control mechanism provided with an electrical heating / cooling mechanism. It is a top view of a pad temperature control mechanism. It is a front sectional view of a pad temperature control mechanism. It is a right view of an up-and-down movement mechanism and an arm mount. It is a front view of a heat conduction part and an arm. FIG. 6 is a cross-sectional view of the arm mount at the location of the cutting line labeled A-A in FIG. 5; It is a top view of a pad temperature control mechanism. It is a front fragmentary sectional view of a pad temperature control mechanism. It is a right view of an up-and-down movement mechanism and an arm mount. It is a left side view of a heat conduction part and an arm. It is a front sectional view of an arm mount and an up-and-down movement mechanism.

First Embodiment
In the first embodiment, a configuration in which the pad temperature adjustment mechanism 140 is detachably attached to the vertical movement mechanism 150 by a fixing tool such as a bolt will be described. FIG. 1 is a front view showing a polishing apparatus 100 according to the present embodiment. Here, FIG. 1 and other figures are schematic views. The size, position and shape etc of the parts shown in the figures may differ from the size, position and shape etc of the actual device. In the following, the horizontal direction in FIG. 1 is taken as the X direction (the right side of the paper is positive), the direction perpendicular to the paper is the Y direction (the front side of the paper is positive), and the vertical direction is the Z direction (the upper side of the paper is positive). The polishing apparatus 100 of FIG. 1 is a so-called “rotary” CMP apparatus. However, the polishing apparatus 100 may be a CMP apparatus other than the rotary type, or may be a polishing apparatus other than the CMP apparatus, as long as the apparatus requires temperature control of the polishing pad. The polishing apparatus 100 of FIG. 1 includes a polishing table 110, a polishing head 120, a discharge mechanism 130, a pad temperature control mechanism 140, and a vertical movement mechanism 150. The polishing apparatus 100 further includes a control unit 160 for controlling each element.

  The polishing apparatus 100 comprises a polishing table 110. The polishing pad 111 is detachably attached to the upper surface of the polishing table 110. The polishing table 110 can be rotated in at least one direction by a motor (not shown) or the like. The polishing table 110 of FIG. 1 is rotatable counterclockwise as viewed from the top.

  The polishing apparatus 100 further includes a polishing head 120. The polishing head 120 is provided on the top of the polishing table 110 so as to face the polishing table 110. The substrate 121 is detachably attached to the lower surface of the polishing head 120. The polishing head 120 can be rotated in at least one direction by a motor (not shown) or the like. The polishing head 120 of FIG. 1 can be rotated counterclockwise (in the same direction as the rotation direction of the polishing table 110) when viewed from above. Further, the polishing head 120 can be moved up and down by a head up-down moving mechanism (not shown).

  The substrate 121 is pressed by pressing the substrate 121 against the polishing pad 111 on the polishing table 110 and rotating at least one, preferably both of the polishing table 110 and the polishing head 120, to polish the substrate 121.

  The polishing apparatus 100 further includes a discharge mechanism 130 for discharging a liquid such as a polishing liquid, a chemical solution, and / or a cleaning liquid toward the polishing surface. The discharge mechanism 130 of FIG. 1 includes a discharge pipe 132 extending from a liquid supply source 131 provided on the side of the polishing table 110. The liquid supply source 131 may be a component that constitutes a part of the polishing apparatus 100. In addition or as an alternative, a liquid source 131 independent of the polishing apparatus 100 can also be used. The discharge pipe 132 of FIG. 1 extends to the approximate center of the polishing table 110 through the upper portion of the polishing table 110. Preferably, the polishing liquid is discharged from the discharge pipe 132 while the substrate 121 is being polished. Preferably, the cleaning liquid is discharged from the discharge pipe 132 during cleaning of the polishing pad 111 and / or the substrate 121. The number of liquid supply sources 131 and discharge pipes 132 is not limited to one.

The polishing apparatus 100 further includes a pad temperature control mechanism 140 for adjusting the temperature of the polishing pad 111. The pad temperature control mechanism 140 of FIG. 1 includes a heat conducting unit 141, an arm 142, and a heating and cooling mechanism 143. The heat conducting portion 141 is provided on the top of the polishing table 110 and is provided to conduct heat (to exchange heat) with the polishing pad 111. The arm 142 extends from the heat conducting portion 141 toward the vertical movement mechanism 150. Further, the arm 142 is detachably fixed to the vertical movement mechanism 150. The heating and cooling mechanism 143 is a mechanism for heating and / or cooling the heat conducting part 141. The heating and cooling mechanism 143 of FIG. 1 includes a heat medium channel 145 for the heat medium supplied from the heat medium source 144. The heat medium source 144 may be a component that constitutes a part of the polishing apparatus 100. Additionally or alternatively, a heat medium source 144 independent of the polishing apparatus 100 can be used. The heat medium supplied from the heat medium source 144 may be a heat medium for heating or may be a heat medium for cooling. It is possible to use, for example, water as a heat carrier. The heat medium source 144 may include a heater and / or a cooler (not shown) for heating and / or cooling the heat medium. Additionally or alternatively, the heating medium source 144 may be configured to hold the heating medium that has already been heated and / or cooled. The heat medium source 144 may include a pump (not shown) for flowing the heat medium toward the heat medium channel.

  The heat medium channel 145 is provided inside the heat conducting unit 141. Therefore, the heat conduction portion 141 is heated and / or cooled by flowing the heat medium from the heat medium source 144 to the heat medium channel 145. The number of heat transfer medium sources 144 and heat transfer medium channels 145 is not limited to one. For example, as the heat medium source 144, a first heat medium source 144 for supplying hot water and a second heat medium source 144 for supplying cold water can be provided. When a plurality of heat medium sources 144 are provided, one heat medium channel 145 may be connected to each of the heat medium sources 144. It is also possible that a plurality of heat medium sources 144 share one heat medium channel 145. It is also possible to connect a plurality of heat medium channels 145 to one heat medium source 144.

  When a "bounce mechanism (see Patent Document 1)" for retracting the pad temperature adjustment mechanism 140 is added to the configuration of FIG. 1, the pad temperature adjustment mechanism 140 and the ejection mechanism 130 are combined with the pad temperature adjustment mechanism 140 during retraction. Will clash. Therefore, it is difficult to replace the polishing pad 111 and / or release the thermal contact between the polishing pad 111 and the pad temperature control mechanism 140 using the "bounce mechanism" in the configuration of FIG. . Note that depending on the configuration of the polishing apparatus 100, components other than the discharge mechanism 130 may collide with or interfere with the pad temperature control mechanism 140.

  Therefore, the polishing apparatus 100 of FIG. 1 includes a vertical movement mechanism 150 for moving at least a part of the pad temperature adjustment mechanism 140 up and down. More specifically, the vertically moving mechanism 150 is configured to vertically move at least the arm 142 and the heat conducting portion 141. The vertical movement mechanism 150 is detachably fixed to the arm 142. In the example of FIG. 1, the arm 142 is fixed to the vertical movement mechanism 150 by the fixing tool 151. In addition, for convenience of illustration, in FIG. 1, the fixing tool 151 is illustrated in a state of being removed. An example of the fastener 151 is a bolt. The vertical movement mechanism 150 may be configured to move the heat medium source 144 up and down. In addition or as an alternative, the heat transfer medium channel 145 is formed of a flexible member (for example, a bellows or a tube at least a portion of which is an elastic body or a flexible member (a tube made of rubber or resin)) It is also possible to configure the raising and lowering mechanism 150 so as not to move the source 144 up and down.

  When the temperature control of the polishing pad 111 is required, the control unit 160 controls the vertical movement mechanism 150 so that the heat conducting unit 141 and the polishing pad 111 are in thermal contact. In other words, the vertical movement mechanism 150 lowers the heat conducting unit 141 until the heat conducting unit 141 and the polishing pad 111 come in contact with each other. The temperature of the polishing pad 111 is adjusted by the control unit 160 controlling the flow rate and / or the temperature of the heat medium while the heat conducting unit 141 and the polishing pad 111 are in contact with each other.

  When the temperature control of the polishing pad 111 is unnecessary, the control unit 160 controls the vertical movement mechanism 150 so that the heat conducting unit 141 and the polishing pad 111 do not thermally contact. In other words, the vertical movement mechanism 150 raises the heat conducting unit 141 until the heat conducting unit 141 and the polishing pad 111 are not in contact with each other. In addition or as an alternative, when the temperature control of the polishing pad 111 is unnecessary, the control of the heat medium by the control unit 160 may be stopped.

When the polishing pad 111 needs to be replaced, the control unit 160 controls the vertical movement mechanism 150 so that a sufficient gap is generated between the heat conducting unit 141 and the polishing pad 111. In other words, the vertical movement mechanism 150 raises the heat conducting unit 141 until a sufficient gap is generated between the heat conducting unit 141 and the polishing pad 111. When the polishing pad 111 needs to be replaced, the user may release the fixing by the fixing tool 151 and remove the pad temperature adjusting mechanism 140. The removed pad temperature control mechanism 140 may be stored outside the polishing apparatus 100. A mechanism for storing the removed pad temperature control mechanism 140 may be provided inside the polishing apparatus 100. By raising the heat conducting part 141 or removing the heat conducting part 141, it is possible to secure a space necessary for replacing the polishing pad 111. In order to facilitate peeling of the polishing pad 111 from the polishing table 110, the upper surface of the polishing table 110 is preferably coated with a material having a low coefficient of friction (for example, Teflon (registered trademark)).

  In addition, since the pad temperature control mechanism 140 is detachable, there is an advantage that the cleaning of the pad temperature control mechanism 140, in particular, the heat conducting part 141 becomes easy. The ease of cleaning is important because the polishing liquid may adhere to or stick to the pad temperature control mechanism 140, particularly the heat conducting part 141.

  Details of the pad temperature adjustment mechanism 140 will be described with reference to FIG. FIG. 2 is a front sectional view of the pad temperature control mechanism 140. As shown in FIG. Further, FIG. 2 also illustrates a vertical movement mechanism 150 connected to the pad temperature adjustment mechanism 140.

  The heat medium channel 145 of FIG. 2 is configured to supply the heat medium from the heat medium source 144 and to recover the supplied heat medium. By forming the heat medium flow channel 145 as shown in FIG. 2 and circulating the heat medium in the heat conduction portion 141, the heat conduction portion 141 can be stably heated and / or cooled. The heat medium collected by the heat medium channel 145 may be heated and / or cooled and reused, or may be discarded. The heat medium channel 145 preferably occupies 30% or more of the volume of the heat conducting portion 141, more preferably 40% or more, and most preferably 50% or more.

  Preferably, the concavo-convex structure 200 is provided on the lower surface of the heat conducting portion 141, that is, the portion in contact with the polishing pad 111. When the lower surface of the heat conducting part 141 is completely flat, the heat conducting part 141 adheres to the polishing pad 111 due to the surface tension of the liquid (the polishing liquid or the cleaning liquid) between the heat conducting part 141 and the polishing pad 111. There is a possibility of On the other hand, when the lower surface of the heat conducting part 141 is completely flat, heat can be efficiently conducted. Furthermore, when the lower surface of the heat conducting part 141 is completely flat, since there is no recess, the by-product generated by polishing does not accumulate in the recess. Furthermore, in the case of using the heat conducting portion 141 without the concave portion, the flow of the polishing liquid is not disturbed by the polishing liquid passing through the concave portion.

  By providing the concavo-convex structure 200 on the lower surface of the heat conductive portion 141 instead of forming the lower surface of the heat conductive portion 141 flat, sticking of the heat conductive portion 141 to the polishing pad 111 can be prevented. Further, by providing the concavo-convex structure 200, chattering between the heat conducting part 141 and the polishing pad 111 can be prevented. Whether the lower surface of the heat conducting portion 141 is flat or the uneven structure 200 is provided on the lower surface of the heat conducting portion 141 depends on the adhesion of the heat conducting portion 141, the heat conduction efficiency from the heat conducting portion 141, etc. It is preferable to determine it. When the concavo-convex structure 200 is provided, the region where the concavo-convex structure 200 is provided and the specific structure of the concavo-convex structure 200 may be appropriately determined from the required heat conduction efficiency and the like.

Preferably, the polishing apparatus 100 includes a sensor 210 for detecting that the arm 142 and the vertical movement mechanism 150 are correctly fixed. The sensor 210 may be controlled by the controller 160 (not shown in FIG. 2). In FIG. 2, a proximity sensor is provided between the arm 142 and the vertical movement mechanism 150 as the sensor 210. As another example, it is also possible to employ a micro switch, an optical sensor, a camera and the like. The sensor 210 can prevent the substrate 121 from being polished in a state in which the pad temperature control mechanism 140 is removed or in a state in which the pad temperature control mechanism 140 is not properly attached.

  The heating and cooling mechanism 143 having another configuration can also be adopted. FIG. 3 is a front cross-sectional view of the pad temperature control mechanism 140 including the electrical heating and cooling mechanism 143. The heating and cooling mechanism 143 of FIG. 3 includes a heater 300 and a cooler 310. The heater 300 and the cooler 310 are provided inside the heat conducting unit 141. Further, the heater 300 and the cooler 310 are connected to the power supply 320. The power source 320 may be a component that constitutes a part of the polishing apparatus 100. Additionally or alternatively, a power supply 320 independent of the polishing apparatus 100 can be used. The heating and cooling mechanism 143 may include only one of the heater 300 and the cooler 310.

  A heating and cooling mechanism 143 combining the configuration of FIG. 2 and the configuration of FIG. 3 can also be employed. For example, a heating and cooling mechanism 143 including a heat medium flow path 145 and a heater 300 connected to a heat medium source 144 for supplying cold water may be used.

Second Embodiment
In the second embodiment, a configuration in which the heat conducting unit 141 can be easily attached and detached will be described. The present embodiment will be described with reference to FIGS. 4, 5 and 6. FIG. 4 is a view showing a pad temperature control mechanism 140 according to the present embodiment. FIG. 4A is a top view of the pad temperature control mechanism 140. FIG. FIG. 4B is a front cross-sectional view of the pad temperature control mechanism 140. As shown in FIG. The vertical movement mechanism 150 is also illustrated in FIG. 4B. FIG. 5 is a right side view showing the vertical movement mechanism 150 and the arm mount 400 according to the present embodiment. FIG. 6 is a front view showing the heat conducting part 141 and the arm 142 according to the present embodiment. The arrangement pattern of the heating and cooling mechanism 143 inside the heat conducting part 141 in FIG. 4 is an example, and any other arrangement pattern can be used.

  The pad temperature control mechanism 140 according to the present embodiment includes an arm mount 400 in addition to the heat conducting unit 141 and the two arms 142. The arm mount 400 is fixed to the vertical movement mechanism 150. Arm mount 400 is provided to mount arm 142. The arm mount 400 is provided with a number (here, two) of arm guides 410 corresponding to the number of the arms 142. A user can insert the arm 142 into the arm mount 400 along the arm guide 410 and remove the arm 142 from the arm mount 400. The arm guide 410 according to the present embodiment is a grooved structure. The number of arms 142 is not limited to two, and may be one or three or more. Preferably, the number of arm guides 410 is the same as the number of arms 142. However, the number of arm guides 410 may not be the same as the number of arms 142.

  Arm 142 is mounted to arm mount 400 by plunger 420. When the arm 142 is inserted into the arm mount 400, the pin of the plunger 420 engages with the plunger hole 430 provided in the arm 142. The number, size, position, etc. of the plunger 420 and the plunger hole 430 may be designed as appropriate. Preferably, the arm 142 is provided with a plunger guide 440 for guiding the pin of the plunger 420 into the plunger hole 430. The plunger guide 440 in the present embodiment is a groove whose depth decreases as it approaches the plunger hole 430.

The heat conducting part 141 is attached to the vertical movement mechanism 150 by the user inserting the arm 142 along the arm guide 410 until the pin of the plunger 420 engages with the plunger hole 430. The arm 142 may be inserted automatically by any transport mechanism. In the present embodiment, the heat conducting portion 141 can be easily attached to the vertical movement mechanism 150 without the need for screwing or the like.

  The plunger 420 is configured to be able to release the engagement between the pin of the plunger 420 and the plunger hole 430, for example, by pulling the head. The thermally conductive portion 141 is removed from the vertical movement mechanism 150 by removing the arm 142 from the arm mount 400 in a state where the pin of the plunger 420 and the plunger hole 430 are released. Preferably, the plunger 420 is provided with a locking mechanism to keep the engagement between the pin of the plunger 420 and the plunger hole 430 released. In the present embodiment, the heat conducting portion 141 can be easily removed from the vertical movement mechanism 150 without the need for screwing off and the like.

  Preferably, the arm 142 is provided with a handle 450 to facilitate insertion and removal of the arm 142. The handle 450 may be provided on the heat conducting portion 141 as long as it does not hinder the polishing of the substrate 121 and the temperature control of the polishing pad 111. Preferably, the arm mount 400 is provided with a spring 460 to assist in the removal of the arm 142. The spring 460 may be provided on the arm 142. The spring 460 is provided to push the arm 142 in the direction in which the arm 142 is pulled out (the positive direction of X in FIG. 4). The pressure of the spring 460 facilitates the user to withdraw the arm 142. For convenience of illustration, the spring 460 is illustrated in a contracted state.

  The arm mount 400 is provided with a coupling 470. In the illustrated example, the heat medium source 144 and the heat medium channel 145 are detachably connected by a coupling 470 for fluid. When the heat conducting part 141 is attached, the tip of the heat medium channel 145 is inserted into the coupling 470. When the heat medium is a fluid, the heat medium channel 145 and the coupling 470 are preferably sealed by a one-touch joint, an O-ring, a metal seal or the like. When the heat transfer medium is a fluid, the coupling 470 may be provided with a check valve (not shown). In addition or as an alternative, a check valve may be provided at parts other than the coupling 470, for example, at the tip of the heat medium channel 145. By providing the check valve, it is possible to prevent the fluid remaining in each component from flowing out when the heat medium source 144 and the heat medium channel 145 are disconnected. When an electrical component is used as the heating and cooling mechanism 143, that is, when the heating and cooling mechanism 143 includes the heater 300 and / or the cooler 310, a coupling 470 for electrical wiring may be used. The coupling 470 facilitates separation of the heat medium source 144 and the heat medium channel 145, and thus facilitates removal of the heat conducting part 141. In addition or as an alternative, the heat medium source 144 and the heat medium flow path 145 may be connected by piping and wiring having elasticity and / or flexibility.

  Depending on the shape of the arm guide 410, there is a possibility that the arm 142 may be inserted into the arm guide 410 with the arm 142 inclined and / or shifted in the vertical and horizontal directions (Y direction and / or Z direction) in FIG. is there. Therefore, the heat medium flow path 145 may be inserted into the coupling 470 in an inclined state and / or in a state of being shifted in the vertical and horizontal directions. If the amount of inclination and / or the amount of deviation is large, the heat medium source 144 and the heat medium channel 145 may not be properly connected.

Therefore, in the present embodiment, a gap is provided between the coupling 470 and the arm mount 400. FIG. 7 is a cross-sectional view of the arm mount 400 at the location of the cutting line labeled A-A in FIG. Coupling 470 shown in FIG. 7 is described as being a coupling for fluid. The coupling 470 has a T-shaped cross section, and the center of the coupling 470 is provided with a first through hole 700 for passing a fluid. Further, the arm mount 400 is provided with a second through hole 710 for inserting a small diameter portion (a portion corresponding to a T-shaped vertical rod) of the coupling 470. After the small diameter portion of the coupling 470 is inserted into the second through hole 710, a stopper 720 (such as a snap ring or clamp) is attached to the small diameter portion of the coupling 470. The diameter of the second through hole 710 is determined such that a gap exists with the small diameter portion of the coupling 470. Specifically, the diameter of the second through hole 710 (shown as "D _hole " in FIG. 7) is shown as the diameter of the small diameter portion of the coupling 470 ("D _cpl " in FIG. 7) 0.1 mm or more, 1 mm or more, 5 mm or more, 10 mm or more, or 20 mm or more. The diameter of the second through hole 710 is preferably smaller than the diameter of the large diameter portion of the coupling 470 so that the coupling 470 does not fall off the second through hole 710.

  Furthermore, the distance between the portion of the large diameter portion of the coupling 470 which can come into contact with the arm guide 410 and the stop 720 (shown as “l” in FIG. 7) It is determined to be larger than the thickness of the portion where the two through holes 710 are provided (indicated as “t” in FIG. 7). Specifically, the distance between the portion of the large diameter portion of the coupling 470 which can come into contact with the arm guide 410 and the stop 720 is set to the portion of the arm guide 410 where the second through hole 710 is provided. The thickness can be longer by 0.1 mm or more, 1 mm or more, 5 mm or more, 10 mm or more, or 20 mm or more.

  According to the configuration of FIG. 7, the air gap provided between the coupling 470 and the arm mount 400 absorbs the inclination of the heat medium channel 145 and / or the shift in the vertical and horizontal directions. Therefore, even if the heat medium flow path 145 is inserted into the coupling 470 with the heat medium flow path 145 inclined and / or shifted in the vertical and horizontal directions, the heat medium flow path 145 is properly connected with the heat medium source 144 can do. Also, the air gap provided between the coupling 470 and the arm mount 400 also acts as a play for the thermal expansion of the coupling 470 and / or the arm mount 400.

  In particular, if the heat transfer medium is a liquid and the connection between the coupling 470 and the heat transfer medium channel 145 is inadequate, a liquid leak may occur. When the coupling 470 is provided with a check valve, and the connection between the coupling 470 and the heat medium channel 145 is inappropriate, the check valve will flow the heat medium. May inhibit. A sensor (not shown) may be provided around the coupling 470 in order to confirm that the coupling 470 and the heat medium channel 145 are properly connected.

  In the configuration of the second embodiment, the vertical movement mechanism 150 is not necessarily a necessary mechanism. However, in order to facilitate removal of the heat conducting part 141, to facilitate replacement of the polishing pad 111, and to separate the heat conducting part 141 from the polishing pad 111 when temperature control is unnecessary, the vertical movement mechanism 150. Is preferably provided.

  Also in the configuration of the second embodiment, the replacement of the polishing pad 111 and / or the thermal contact between the heat conducting portion 141 and the polishing pad 111 without using the “bounce mechanism (see Patent Document 1)”. It is possible to cancel.

Third Embodiment
In the configuration described in the second embodiment, in order to insert the arm 142 into the arm guide 410, it is necessary to provide a play between the arm 142 and the arm guide 410. Also, it is necessary to provide play between the pin of the plunger 420 and the plunger hole 430. The play between these components causes the arm 142 to rattle. The rattling of the arm 142 may cause a shift in the contact position between the heat conducting part 141 and the polishing pad 111, which may make precise temperature control of the polishing pad 111 difficult. In particular, when the heat conducting part 141 is shifted in the radial direction (X direction) of the polishing table 110, there is a possibility that the part of the polishing pad 111 to be in contact with the heat conducting part 141 will not contact the heat conducting part 141.

  In addition, when the arm 142 and the arm guide 410 rub against each other during insertion and removal of the arm 142, wear powder may be generated. Abrasive powder may reach the polishing pad 111 along the flow of gas and / or liquid in the polishing apparatus 100. The abrasive powder on the polishing pad 111 can cause abnormal polishing of the substrate 121. In addition, the wear powder attached to the substrate 121 can also cause an abnormality in a process after the substrate polishing. Furthermore, rubbing between the arm 142 and / or the arm guide 410 can degrade the slippage between the arm 142 and the arm guide 410, making it difficult to insert and remove the arm 142.

  It is believed that if the play between the parts is reduced to reduce rattling of the arm 142, the arm 142 and the arm guide 410 will strongly rub against each other. Conversely, when the play between the parts is increased to reduce the friction between the arm 142 and the arm guide 410, it is considered that the rattle of the arm 142 is increased.

  Therefore, in the third embodiment, a configuration for reducing at least one of the rattling of the arm 142 and the friction between the arm 142 and the arm guide 410 will be described with reference to FIGS. 8, 9 and 10. FIG. 8 is a view showing a pad temperature control mechanism 140 according to the present embodiment. FIG. 8A is a top view of the pad temperature control mechanism 140. FIG. FIG. 8B is a front partial cross-sectional view of the pad temperature control mechanism 140 (The heat medium source 144, the vertical movement mechanism 150, and the arm mount 400 are illustrated in cross section, and the heat conducting portion 141 and the arm 142 are illustrated in non cross section. ). The vertical movement mechanism 150 is also illustrated in FIG. 8B. FIG. 9 is a right side view showing the vertical movement mechanism 150 and the arm mount 400 according to the present embodiment. FIG. 10 is a left side view showing the heat conducting part 141 and the arm 142 according to the present embodiment.

  The third embodiment has features in common with the second embodiment in that the arm 142 is configured to be insertable into the arm guide 410. On the other hand, the shapes of the arm 142 and the arm guide 410 in the third embodiment are different from those in the second embodiment.

  As best shown in FIG. 8B, the tips of at least one of the arms 142 (both of the two arms 142 in the figure) in the present embodiment are tapered. More specifically, the upper portion of the tip of the arm 142 away from the heat conducting portion 141 is tapered. Here, “the tip of the arm 142” can be reworded as “a portion of the arm 142 to be inserted into the arm guide 410”. Additionally or alternatively, the lower portion of the arm 142 may be tapered. However, preferably, the lower portion of the arm 142 has a non-tapered shape in order to prevent the arm 142 from falling off unintentionally. The shape of the arm guide 410 corresponds to the shape of the arm 142. That is, the arm guide 410 is formed in a tapered groove shape. The taper angle of the arm 142 and the arm guide 410 may be any angle, for example, an angle of 10 degrees or more and 45 degrees or less. The taper angle may be an angle less than 10 degrees, or an angle greater than 45 degrees. It is preferable to determine the taper angle so that the length of the tapered portion of the arm 142 is longer than the length of the portion of the arm 142 inserted into the arm guide 410.

In the present embodiment, in order to mount the arm 142 on the arm guide 410 of the arm mount 400, in other words, in order to prevent the arm 142 from coming off the arm guide 410, a detachment preventing member 810 is provided. Specifically, a hook 811 is provided on the arm 142 as the drop prevention member 810, and a fastener 812 is provided on the arm mount 400. In the illustrated example, one set of hooks 811 and fasteners 812 are provided, but two or more sets of hooks 811 and fasteners 812 may be used. When the hook 811 and the fastener 812 are engaged, the arm 142 is pressed against the arm mount 400,
Falling of the arm 142 is prevented. Additionally or alternatively, arm 142 may be provided with fasteners 812 and arm mount 400 may be provided with fasteners 812. As a further addition or alternative, other elements such as springs, plungers, pins, bolts, nuts, wires and / or strings may be used instead of the hooks 811 and the fasteners 812. The detachment prevention member 810 may be a member that prevents detachment of the arm 142 by an electromagnetic force generated from a permanent magnet or an electromagnet or the like. Further, the anti-falling member 810 may be provided at any place, and for example, the fastener 812 may be provided to the vertical movement mechanism 150.

  According to the configuration of the third embodiment, when the arm 142 is not completely inserted into the arm guide 410, the arm 142 and the arm guide 410 do not rub too much. Therefore, according to the configuration of the third embodiment, it is possible to reduce the generation of wear powder. In addition, the reduction of the friction can prevent the deterioration of the slipperiness. Further, the tapered configuration of the arm 142 and the arm guide 410 facilitates the insertion and removal of the arm 142.

  When the arm 142 is completely inserted into the arm guide 410, the tapered surface of the arm 142 comes in contact with the tapered surface of the arm guide 410. In other words, when the arm 142 is completely inserted into the arm guide 410, the X direction play between the arms 142 and 410 is virtually zero (manufacturing error, assembly error, part deflection, aging and heat) The play generated by the influence of the difference in expansion coefficient etc. is excluded). Thus, rattling of the arm 142 in the X direction is reduced. Therefore, according to the configuration of the third embodiment, the heat conducting portion 141 can be positioned with high accuracy.

  More preferably, as best shown in FIG. 10, at least one of the arms 142 is formed into an ant mortise. However, the term "ant mortise" as used herein includes "one ant mortise". Also, as best seen in FIG. 9, it is preferred that the arm guide 410 for the ant mortise arm be formed in an ant groove shape. However, the term "ant groove" as used herein includes "an ant groove". The ant tenon structure and the dovetail groove structure reduce the rattle of the arm 142 in the Y direction. Unlike the illustrated example, the plurality of arms 142 and the arm guides 410 may be configured in an ant tenon shape or ant groove shape. The angle of the ant mortise and the ant groove may be any angle, for example 45 degrees or 60 degrees.

  A modification of the present embodiment is shown in FIG. FIG. 11 is a front sectional view of the arm mount 400 and the vertical movement mechanism 150. As shown in FIG. However, for convenience of illustration, the coupling 470 is not shown. In the example of FIG. 11, a tapered groove-shaped arm guide 410 as a whole is configured by a rectangular groove 1100 viewed from the front and a block 1110 having a trapezoidal shape when viewed from the front. At least a portion of the block 1110 is located inside the rectangular groove 1100. In the example of FIG. 11, all the blocks 1110 are located inside the rectangular groove 1100. The block 1110 is secured by fasteners 1120 such as bolts. Also, at least one of the fixed position and the fixed angle of the block 1110 is adjustable. By moving the fixed position of the block 1110 in the X direction, it is possible to adjust the insertion length of the arm 142 and thus to adjust the position of the heat conducting portion 141. By changing the fixing angle of the block 1110, it is possible to adjust the taper angle of the arm guide 410 in accordance with the angle of the tapered portion of the heat conducting portion 141. The rectangular groove 1100 and the block 1110 may form a tapered groove-shaped and dovetail-shaped arm guide 410.

Although some embodiments of the present invention have been described above, the embodiments of the present invention described above are for the purpose of facilitating the understanding of the present invention, and do not limit the present invention. Also, as long as no contradiction arises, the matters described in one embodiment can be applied to the other embodiments. For example, the concavo-convex structure 200 and / or the sensor 210 described in the first embodiment can be applied to the second embodiment or the third embodiment. Similarly, the plunger 420 and / or the spring 460 described in the second embodiment can be applied to the third embodiment.

  The present invention can be modified and improved without departing from the spirit of the present invention and, of course, includes the equivalents thereof. In addition, any combination or omission of each component described in the claims and the specification is possible within a range in which at least a part of the above-mentioned problems can be solved, or in a range that exerts at least a part of the effect. It is.

  The present invention is, as one embodiment, a pad temperature control mechanism for controlling the temperature of a polishing pad of a polishing apparatus, the pad temperature control mechanism including a heat conducting portion for conducting heat to and from the polishing pad An arm extending from the heat conducting portion, the arm having a tapered tip, and an arm mount for mounting the arm, wherein a tapered groove-shaped arm guide corresponding to the shape of the arm is formed A pad temperature control mechanism is disclosed, comprising: an arm mount; and an anti-falling member for preventing the arm from coming off the arm guide.

  The pad temperature control mechanism has an effect of reducing at least one of rattling of the arm and friction between the arm and the arm guide as an example. Furthermore, this pad temperature control mechanism exhibits an effect that rattling of the arm in the X direction can be reduced as an example.

  Furthermore, the present application relates to a pad temperature control mechanism according to one embodiment, wherein at least one of the arms is formed in an ant mortise shape, and an arm guide for the ant mortise arm among the arm guides is an ant groove SUMMARY A pad temperature control mechanism is disclosed.

  This pad temperature control mechanism has an effect of reducing rattling of the arm in the Y direction as an example.

  Furthermore, the present application discloses, as one embodiment, a pad temperature adjustment mechanism, in which a heating and cooling mechanism is provided inside a heat conducting part. Furthermore, the present application relates to a pad temperature control mechanism according to an embodiment, wherein the heating and cooling mechanism includes a heat medium flow path for flowing a heat medium, and the arm mount is mounted on the arm mount when the arm is mounted on the arm mount A pad temperature control mechanism is disclosed that is provided with a coupling connected to the media flow path.

These disclosures detail the pad temperature control mechanism and the heating and cooling mechanism.

  Furthermore, the present application discloses, as one embodiment, a pad temperature adjusting mechanism, wherein the coupling is provided such that a space is formed between the pad temperature adjusting mechanism and the arm mount.

  The pad temperature adjustment mechanism has an effect of facilitating appropriate connection between the heat medium source and the heat medium channel as an example.

  Furthermore, the present application discloses, as one embodiment, a pad temperature adjusting mechanism, wherein the heating and cooling mechanism includes a heater and / or a cooler.

  This disclosure describes another example of the heating and cooling mechanism.

  Furthermore, the present application relates to a pad temperature control mechanism, which is a block located inside a rectangular groove and at least a part of a rectangular groove, and adjusting a fixing position and / or a fixing angle, according to one embodiment Disclosed is a pad temperature control mechanism in which a tapered groove-like arm guide is formed by a block and a block.

  This pad temperature control mechanism has an effect that it is possible to adjust the insertion length of the arm and / or the taper angle of the arm guide as an example.

  Furthermore, the present application provides, as one embodiment, a polishing table to which a polishing pad is attached, a polishing head provided on an upper portion of the polishing table to face the polishing table, and a pad temperature control mechanism described in the present specification. Disclosed is a polishing apparatus. Furthermore, the present application discloses, as one embodiment, a polishing apparatus, further including a vertical movement mechanism for moving the pad temperature adjustment mechanism up and down.

  These disclosures detail the polishing apparatus with the pad temperature control mechanism described herein.

  Furthermore, the present application discloses, as one embodiment, a polishing apparatus in which a surface of a polishing table to which a polishing pad is attached is coated with a material having a low coefficient of friction.

  This polishing apparatus has an effect of facilitating peeling of the polishing pad from the polishing table as an example.

DESCRIPTION OF SYMBOLS 100 ... Polishing apparatus 110 ... Polishing table 111 ... Polishing pad 120 ... Polishing head 121 ... Substrate 130 ... Discharge mechanism 131 ... Liquid supply source 132 ... Piping piping 140 ... Pad temperature control mechanism 141 ... Thermal conduction part 142 ... Arm 143 ... Heating Cooling mechanism 144: Heat medium source 145: Heat medium flow path 150: Vertical movement mechanism 151: Fixing member 160: Control unit 200: Irregular structure 210: Sensor 300: Heater 300: Cooler 320: Power supply 400: Arm mount 410: Arm guide 420 ... plunger 430 ... plunger hole 440 ... plunger guide 450 ... handle 460 ... spring 470 ... coupling 700 ... first through hole 710 ... second through hole 720 ... stopper 810 ... detachment prevention member 811 ... hook 812 ... fastener 1100 ... rectangular groove 1 110: block 1120: fixing device

Claims (10)

A pad temperature adjustment mechanism for adjusting the temperature of a polishing pad of a polishing apparatus, wherein the pad temperature adjustment mechanism is
A heat conducting portion for conducting heat to and from the polishing pad;
An arm extending from the heat conducting portion, the arm having a tapered tip end;
An arm mount for mounting the arm, wherein an arm guide having a tapered groove shape corresponding to a shape of the arm is formed;
A fall-off preventing member for preventing the arm from falling off the arm guide;
, Pad temperature control mechanism. The pad temperature control mechanism according to claim 1, wherein
At least one of the arms is shaped like an ant mortise,
Among the arm guides, the arm guide for the ant mortise arm is formed in an ant groove shape,
Pad temperature control mechanism.   The pad temperature adjusting mechanism according to claim 1 or 2, wherein a heating and cooling mechanism is provided inside the heat conducting portion. The pad temperature control mechanism according to claim 3, wherein
The heating and cooling mechanism includes a heat medium channel for flowing the heat medium supplied from the heat medium source,
The arm mount is provided with a coupling that is connected to the heat medium flow path when the arm is mounted on the arm mount.
Pad temperature control mechanism.   The pad temperature control mechanism according to claim 4, wherein the coupling is provided such that a gap is formed between the coupling and the arm mount.   The pad temperature adjusting mechanism according to any one of claims 3 to 5, wherein the heating and cooling mechanism comprises a heater and / or a cooler. The pad temperature control mechanism according to any one of claims 1 to 6, wherein
With a rectangular groove,
A block at least a part of which is located inside the rectangular groove, the block being adjustable in fixed position and / or fixed angle;
The pad temperature control mechanism, wherein the tapered groove shaped arm guide is formed by the above. A polishing table to which a polishing pad is attached;
A polishing head provided on an upper portion of the polishing table so as to face the polishing table;
The pad temperature control mechanism according to any one of claims 1 to 7,
A polishing apparatus comprising:   The polishing apparatus according to claim 8, further comprising a vertical movement mechanism for moving the pad temperature adjustment mechanism up and down.   The polishing apparatus according to claim 8, wherein a surface of the polishing table to which the polishing pad is attached is coated with a material having a low coefficient of friction.

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