JP6873011B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP6873011B2
JP6873011B2 JP2017165379A JP2017165379A JP6873011B2 JP 6873011 B2 JP6873011 B2 JP 6873011B2 JP 2017165379 A JP2017165379 A JP 2017165379A JP 2017165379 A JP2017165379 A JP 2017165379A JP 6873011 B2 JP6873011 B2 JP 6873011B2
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JP
Japan
Prior art keywords
substrate
coating liquid
speed
period
rate
Prior art date
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Active
Application number
JP2017165379A
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English (en)
Japanese (ja)
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JP2019046850A (ja
JP2019046850A5 (https=
Inventor
雄大 和食
雄大 和食
栄寿 佐川
栄寿 佐川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2017165379A priority Critical patent/JP6873011B2/ja
Priority to KR1020197030074A priority patent/KR102296706B1/ko
Priority to CN201880025759.1A priority patent/CN110537245B/zh
Priority to PCT/JP2018/028337 priority patent/WO2019044314A1/ja
Priority to TW107126312A priority patent/TWI669751B/zh
Publication of JP2019046850A publication Critical patent/JP2019046850A/ja
Publication of JP2019046850A5 publication Critical patent/JP2019046850A5/ja
Application granted granted Critical
Publication of JP6873011B2 publication Critical patent/JP6873011B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
JP2017165379A 2017-08-30 2017-08-30 基板処理装置および基板処理方法 Active JP6873011B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017165379A JP6873011B2 (ja) 2017-08-30 2017-08-30 基板処理装置および基板処理方法
KR1020197030074A KR102296706B1 (ko) 2017-08-30 2018-07-27 기판 처리 장치 및 기판 처리 방법
CN201880025759.1A CN110537245B (zh) 2017-08-30 2018-07-27 衬底处理装置及衬底处理方法
PCT/JP2018/028337 WO2019044314A1 (ja) 2017-08-30 2018-07-27 基板処理装置および基板処理方法
TW107126312A TWI669751B (zh) 2017-08-30 2018-07-30 基板處理裝置及基板處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017165379A JP6873011B2 (ja) 2017-08-30 2017-08-30 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2019046850A JP2019046850A (ja) 2019-03-22
JP2019046850A5 JP2019046850A5 (https=) 2020-09-10
JP6873011B2 true JP6873011B2 (ja) 2021-05-19

Family

ID=65526446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017165379A Active JP6873011B2 (ja) 2017-08-30 2017-08-30 基板処理装置および基板処理方法

Country Status (5)

Country Link
JP (1) JP6873011B2 (https=)
KR (1) KR102296706B1 (https=)
CN (1) CN110537245B (https=)
TW (1) TWI669751B (https=)
WO (1) WO2019044314A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI884963B (zh) * 2019-07-04 2025-06-01 日商東京威力科創股份有限公司 塗布方法及塗布裝置
JP7339150B2 (ja) * 2019-12-20 2023-09-05 ラピスセミコンダクタ株式会社 基板処理装置、基板処理方法
KR102682854B1 (ko) 2020-06-02 2024-07-10 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
JP7520665B2 (ja) * 2020-09-25 2024-07-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7598821B2 (ja) * 2021-05-20 2024-12-12 株式会社Ｓｃｒｅｅｎホールディングス 塗布処理方法および塗布処理装置
JP2022178694A (ja) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス 塗布処理方法および塗布処理装置
KR102600411B1 (ko) * 2021-08-12 2023-11-09 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7797882B2 (ja) * 2022-01-11 2026-01-14 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置及びプログラム
KR102488391B1 (ko) 2022-01-11 2023-01-13 (주)예성글로벌 도어클로저 기능을 갖는 패닉바
JP2024120469A (ja) 2023-02-24 2024-09-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2024127644A (ja) 2023-03-09 2024-09-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0618504B1 (en) * 1993-03-25 2001-09-26 Tokyo Electron Limited Method of forming coating film and apparatus therefor
JP3471168B2 (ja) * 1996-04-25 2003-11-25 大日本スクリーン製造株式会社 基板処理方法およびその装置
JP3527459B2 (ja) 2000-04-12 2004-05-17 東京エレクトロン株式会社 塗布膜形成方法および塗布処理装置
JP5065071B2 (ja) * 2007-03-15 2012-10-31 東京エレクトロン株式会社 塗布処理方法、塗布処理装置及びコンピュータ読み取り可能な記憶媒体
JP4745358B2 (ja) * 2008-03-04 2011-08-10 株式会社東芝 回転塗布方法、および回転塗布装置
JP5091722B2 (ja) * 2008-03-04 2012-12-05 東京エレクトロン株式会社 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
KR101447759B1 (ko) * 2008-12-16 2014-10-06 도쿄엘렉트론가부시키가이샤 도포 처리 방법 및 도포 처리 장치
JP5485672B2 (ja) * 2009-12-07 2014-05-07 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5337180B2 (ja) * 2010-04-08 2013-11-06 東京エレクトロン株式会社 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
JP2014050803A (ja) * 2012-09-07 2014-03-20 Toshiba Corp 回転塗布装置および回転塗布方法
TWI666684B (zh) * 2015-11-16 2019-07-21 日商東京威力科創股份有限公司 塗佈膜形成方法、塗佈膜形成裝置及記憶媒體
JP6374373B2 (ja) * 2015-12-04 2018-08-15 東芝メモリ株式会社 回転塗布装置

Also Published As

Publication number Publication date
JP2019046850A (ja) 2019-03-22
CN110537245A (zh) 2019-12-03
KR102296706B1 (ko) 2021-09-01
WO2019044314A1 (ja) 2019-03-07
CN110537245B (zh) 2023-05-02
TWI669751B (zh) 2019-08-21
KR20190125469A (ko) 2019-11-06
TW201913728A (zh) 2019-04-01

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