JP6851116B2 - Lighting device - Google Patents

Lighting device Download PDF

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JP6851116B2
JP6851116B2 JP2019153370A JP2019153370A JP6851116B2 JP 6851116 B2 JP6851116 B2 JP 6851116B2 JP 2019153370 A JP2019153370 A JP 2019153370A JP 2019153370 A JP2019153370 A JP 2019153370A JP 6851116 B2 JP6851116 B2 JP 6851116B2
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light emitting
emitting element
translucent cover
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shape
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JP2019216114A (en
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博志 小田原
博志 小田原
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Hitachi Global Life Solutions Inc
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本発明は、半導体発光素子を光源とする照明装置に関する。 The present invention relates to a lighting device using a semiconductor light emitting element as a light source.

従来の照明装置は、充電部や半導体発光素子(以下、発光素子と称する)の保護のために、発光素子を実装した基板を透光性のカバー部材で覆っている。このカバー部材は、複数並設した発光素子を並設方向に沿って溝状に覆う形状としているものがある。 In a conventional lighting device, a substrate on which a light emitting element is mounted is covered with a translucent cover member in order to protect a charging unit and a semiconductor light emitting element (hereinafter, referred to as a light emitting element). Some of the cover members have a shape in which a plurality of light emitting elements arranged side by side are covered in a groove shape along the parallel arrangement direction.

例えば特許文献1(特開2010−278266号公報)には、基板上に複数並設して実装された発光素子と、基板と複数の発光素子を含めて覆うカバー部材において、並設方向に沿って形成された溝を一体に有する形状が提案されている。これは主に、基板の反りや変形を軽減できるように構成したものである。 For example, in Patent Document 1 (Japanese Unexamined Patent Publication No. 2010-278266), in a light emitting element mounted side by side on a substrate and a cover member including the substrate and the plurality of light emitting elements, the light emitting elements are arranged along the parallel arrangement direction. A shape having a groove formed in an integral manner has been proposed. This is mainly configured to reduce warpage and deformation of the substrate.

特開2010−278266号公報Japanese Unexamined Patent Publication No. 2010-278266

特許文献1における、透光性のカバー部材を基板上に複数並設した発光素子を並設方向に沿って溝状に覆う形状においては、発光素子から放射された光束のうち溝の長手方向に向かう光束の一部が全反射することで、光束の取り出し効率が悪くなる懸念があった。 In Patent Document 1, in the shape of covering the light emitting elements in which a plurality of translucent cover members are arranged side by side on the substrate in a groove shape along the parallel arrangement direction, the light flux emitted from the light emitting elements is directed in the longitudinal direction of the groove. There was a concern that the efficiency of extracting the luminous flux would deteriorate due to the total reflection of a part of the luminous flux to be directed.

本発明の目的は、発光素子から放射された光束の取り出し効率の高い照明装置を提供することにある。 An object of the present invention is to provide a lighting device having high extraction efficiency of a light flux emitted from a light emitting element.

上記目的を達成するために本発明の特徴とするところは、複数の半導体発光素子を光源とし、基板と基板表面に実装された前記複数の半導体発光素子と電源コネクタとを一体に覆う透光性カバー部材と、セード取付具を有し、前記基板が取り付けられた放熱板と、天井面に対し固定された状態の前記セード取付具によって係合保持されている、前記透光性カバー部材を覆うセードと、を有し、前記透光性カバー部材における前記半導体発光素子を覆う部分の形状を、前記半導体発光素子を略中心として断面が半円形状とし、前記透光性カバー部材において、隣接する前記半円形状間は、平坦な形状であることにある。
In order to achieve the above object, a feature of the present invention is a translucency that uses a plurality of semiconductor light emitting elements as light sources and integrally covers the substrate, the plurality of semiconductor light emitting elements mounted on the surface of the substrate, and a power supply connector. Covers the translucent cover member having a cover member, a shade attachment, and being engaged and held by the shade attachment in a state of being fixed to the ceiling surface and the heat radiating plate to which the substrate is attached. The shape of the portion of the translucent cover member that has a shade and covers the semiconductor light emitting element has a semicircular cross section centered on the semiconductor light emitting element, and is adjacent to the translucent cover member. The space between the semicircular shapes is a flat shape.

または、本発明の特徴とするところは、複数の半導体発光素子を光源とし、基板と基板表面に実装された複数の発光素子を一体に覆う透光性カバー部材を有し、透光性カバー部材における複数の半導体発光素子の各々の発光素子を覆う部分の形状を、各々の発光素子を略中心とする半球形状とした照明装置としたことにある。 Alternatively, a feature of the present invention is to have a translucent cover member that uses a plurality of semiconductor light emitting elements as a light source and integrally covers the substrate and the plurality of light emitting elements mounted on the surface of the substrate. The present invention is to make the shape of the portion of the plurality of semiconductor light emitting elements covering each light emitting element into a hemispherical shape centered on each light emitting element.

または、本発明の特徴とするところは、複数の半導体発光素子を光源とし、基板と基板表面に実装された複数の発光素子を一体に覆う透光性カバー部材を有し、透光性カバー部材における複数の発光素子のうちいくつかの発光素子を一組として覆う部分の形状を、複数の発光素子の発光部中心を略中心とする半球形状とした照明装置としたことにある。 Alternatively, a feature of the present invention is to have a translucent cover member that uses a plurality of semiconductor light emitting elements as a light source and integrally covers the substrate and the plurality of light emitting elements mounted on the surface of the substrate. The shape of the portion that covers some of the light emitting elements as a set is a hemispherical shape centered on the center of the light emitting part of the plurality of light emitting elements.

好ましくは、本発明は、透光性カバー部材における前記半球形状部の肉厚が、前記半球形状部の頂点部付近で薄く、赤道部付近で厚くなるように滑らかに変化しているように構成したことにある。 Preferably, the present invention is configured such that the wall thickness of the hemispherical portion of the translucent cover member changes smoothly so as to be thin in the vicinity of the apex of the hemispherical portion and thick in the vicinity of the equatorial region. I have done it.

好ましくは、本発明は、透光性カバー部材における隣接する2つ以上の半球形状どうしがぶつかり合って干渉する場合、干渉部分の外縁が前記半球形状の略中心にある発光素子の放射角の外側に位置する構造とする。 Preferably, in the present invention, when two or more adjacent hemispherical shapes in the translucent cover member collide with each other and interfere with each other, the outer edge of the interfering portion is outside the radiation angle of the light emitting element at the substantially center of the hemispherical shape. The structure is located at.

好ましくは、本発明は、発光素子を覆う個々の前記半球形状を含む透光性カバー部材の全体形状が、前記透光性カバー部材の中心点に対して点対称である構造とする。 Preferably, the present invention has a structure in which the overall shape of the translucent cover member including the individual hemispherical shapes covering the light emitting element is point-symmetrical with respect to the center point of the translucent cover member.

好ましくは、本発明は、前記透光性カバーの一部をリモコン信号の受光部とした構造とする。 Preferably, the present invention has a structure in which a part of the translucent cover is a light receiving portion of a remote control signal.

本発明によれば、発光素子を、各々の発光素子を略中心とする半球形状の透光性カバー部材で覆うことにより、発光素子から出た光束が前記透光性カバー部材の面に対して略法線方向に入射することになり、前記透光性カバー部材を通った光束が外部に出る際の全反射を避けることができるため、光束の取り出し効率を向上させた照明装置を実現することができる。 According to the present invention, by covering the light emitting element with a hemispherical translucent cover member centered on each light emitting element, the light flux emitted from the light emitting element is directed to the surface of the translucent cover member. Since the light is incident in the substantially normal direction and the total reflection of the light flux passing through the translucent cover member can be avoided when it goes out, it is possible to realize a lighting device having improved light flux extraction efficiency. Can be done.

また、本発明によれば、半球形状を複数形成することにより、透光性カバー部材の剛性が向上するため、基板の反りや変形を軽減し、前記発光素子を前記透光性カバー部材に対して適正な位置に矯正すると共に、放熱板への発光素子実装基板の密着性が向上し、発光素子の発光効率が高い照明装置を実現することができる。 Further, according to the present invention, by forming a plurality of hemispherical shapes, the rigidity of the translucent cover member is improved, so that warpage and deformation of the substrate are reduced, and the light emitting element is attached to the translucent cover member. In addition to correcting the position to an appropriate position, the adhesion of the light emitting element mounting substrate to the heat radiating plate is improved, and a lighting device having high luminous efficiency of the light emitting element can be realized.

さらに、本発明によれば、透光性カバー部材の全体形状を、前記透光性カバー部材の中心点に対して点対称としたことで、成形時のゆがみが少なく生産性の良いカバーを実現することができる。 Further, according to the present invention, the overall shape of the translucent cover member is point-symmetrical with respect to the center point of the translucent cover member, so that a cover with less distortion during molding and good productivity is realized. can do.

また、本発明によれば、前記半球形状部の肉厚が、前記半球形状部の天頂部付近で薄く、赤道部付近で厚くなるように滑らかに変化しているように構成したことにより、配光角が広い照明装置を実現することができる。 Further, according to the present invention, the wall thickness of the hemispherical portion is configured to be thin in the vicinity of the zenith portion of the hemispherical portion and to be thick in the vicinity of the equatorial region so as to be smoothly changed. It is possible to realize a lighting device having a wide light angle.

本発明の実施例に係る照明装置の外観図である。It is an external view of the lighting apparatus which concerns on embodiment of this invention. 同上に係る照明装置のセードを外した状態の図である。It is the figure of the state which removed the shade of the lighting device which concerns on the same above. 同上に係る照明装置の透光性カバーを外した状態の図である。It is the figure of the state which removed the translucent cover of the lighting device which concerns on the same above. 図3に示す、発光素子実装基板の拡大図である。It is an enlarged view of the light emitting element mounting substrate shown in FIG. 本発明の実施例に係る照明装置の発光素子実装基板を外した状態の図である。It is a figure of the state in which the light emitting element mounting substrate of the lighting apparatus which concerns on embodiment of this invention is removed. 同上に係る照明装置の放熱板を外した状態の図である。It is the figure of the state which removed the heat radiating plate of the lighting device which concerns on the same above. 同上に係る照明装置の分解斜視図である。It is an exploded perspective view of the lighting device which concerns on the same above. 図7に示す、透光性カバーの拡大図である。It is an enlarged view of the translucent cover shown in FIG. 7. 本発明の実施例に係る照明装置の部分断面図である。It is a partial cross-sectional view of the lighting apparatus which concerns on embodiment of this invention. 同上に係る照明装置の部分断面図である。It is a partial cross-sectional view of the lighting device which concerns on the same above. 同上に係る照明装置の部分断面図である。It is a partial cross-sectional view of the lighting device which concerns on the same above. 同上に係る照明装置の半球形状部の拡大図である。It is an enlarged view of the hemispherical shape part of the lighting apparatus which concerns on the same above. 同上に係る照明装置の半球形状部の拡大図である。It is an enlarged view of the hemispherical shape part of the lighting apparatus which concerns on the same above. 同上に係る照明装置の半球形状部の拡大図である。It is an enlarged view of the hemispherical shape part of the lighting apparatus which concerns on the same above. 同上に係る照明装置の半球形状部の拡大図である。It is an enlarged view of the hemispherical shape part of the lighting apparatus which concerns on the same above. 同上に係る照明装置の他の実施例である。This is another embodiment of the lighting device according to the same as above. 同上に係る照明装置の半球形状部の断面図である。It is sectional drawing of the hemispherical part of the lighting apparatus which concerns on the same above. 同上に係る照明装置の半球形状部の断面図である。It is sectional drawing of the hemispherical part of the lighting apparatus which concerns on the same above. 同上に係る照明装置の放熱板を外した状態の部分拡大図である。It is a partially enlarged view of the state in which the heat radiating plate of the lighting device which concerns on the same is removed. 同上に係る照明装置の発光素子実装基板を放熱板に載置した状態で位置決めする方法を説明した図である。It is a figure explaining the method of positioning with the light emitting element mounting substrate of the illuminating device which concerns on the same | mounted on the heat radiating plate. 同上に係る照明装置の略半球形状部の断面図である。It is sectional drawing of the substantially hemispherical part of the lighting apparatus which concerns on the same above. 同上に係る照明装置のリモコン受光部の断面図である。It is sectional drawing of the remote control light receiving part of the lighting apparatus which concerns on the same above.

以下、本発明の実施例に係る照明装置の構成を添付の図を用いて説明する。本照明装置は建築物、主に一般家庭の居室の天井面に設置され、建築物に付帯する引掛ローゼットや引掛シーリングなどの屋内配線器具に係合する取付アダプタを介することで外部電源と接続されると共に所定の位置に固定されて使用されるものである。図1は、図示しない天井面に設置された本照明装置を下方から見た外観図である。セード2は、透明または半透明または乳白色の透光性を有する、例えばアクリルやポリスチレンなどの樹脂材料で作られた部品である。これは、主に光源から放射された光束を拡散させて、使用者が照明装置を直視したときの眩しさを軽減したり、照明装置が設置された部屋の中の明るさを均一化する役割を持っている。 Hereinafter, the configuration of the lighting device according to the embodiment of the present invention will be described with reference to the attached figures. This lighting device is installed on the ceiling surface of a building, mainly a living room of a general household, and is connected to an external power source via a mounting adapter that engages with indoor wiring equipment such as a hook rosette or a hook ceiling attached to the building. It is also used by being fixed in a predetermined position. FIG. 1 is an external view of the lighting device installed on a ceiling surface (not shown) as viewed from below. The shade 2 is a transparent, translucent, or milky white translucent component made of a resin material such as acrylic or polystyrene. This mainly diffuses the luminous flux radiated from the light source to reduce the glare when the user directly looks at the luminaire, and to equalize the brightness in the room where the luminaire is installed. have.

次に、図7に照明装置1の分解斜視図を示すと共に、分解レベルに応じた図2〜図6を用いて構造を説明する。図2はセード2を外した状態である。セード2は放熱板3に固定されたセード取付具5によって係合保持されているが、例えばセード2を周方向反時計回りに回転させることによって、セード2に凸設した図示しない係合部が外れるようになっている。セード2を外すと、後述する例えば金属板などで成形された本体ベース9の中央に設けられた器具取付部14が見えるが、この部分には前述の取付アダプタが有する爪状の引掛け部が係合することで、例えば居室の天井面の所定の位置に固定されるようになっている。また、前記器具取付部14の近傍には、後述する点灯回路基板11につながっている給電コネクタ41が配設されており、前記給電コネクタ41と前述の取付アダプタに配設されたコネクタとを嵌合接続することにより、建築物の屋内配線からの給電ができるようになっている。 Next, FIG. 7 shows an exploded perspective view of the lighting device 1, and FIGS. 2 to 6 according to the decomposition level will be used to explain the structure. FIG. 2 shows a state in which the shade 2 is removed. The shade 2 is engaged and held by a shade attachment 5 fixed to the heat radiating plate 3. For example, by rotating the shade 2 counterclockwise in the circumferential direction, an engaging portion (not shown) projecting on the shade 2 is formed. It is designed to come off. When the shade 2 is removed, the fixture mounting portion 14 provided in the center of the main body base 9 formed of, for example, a metal plate, which will be described later, can be seen, and the claw-shaped hook portion of the mounting adapter described above is visible in this portion. By engaging, for example, it is fixed at a predetermined position on the ceiling surface of the living room. Further, a power feeding connector 41 connected to the lighting circuit board 11 described later is arranged in the vicinity of the appliance mounting portion 14, and the power feeding connector 41 and the connector arranged on the mounting adapter described above are fitted. By connecting them together, power can be supplied from the indoor wiring of the building.

透光性カバー4は、例えばポリカーボネートやアクリル、ポリスチレンなどの透明な樹脂材料で成形された部品で、図3、及び図4に示す発光素子8、発光素子実装基板6、コネクタ7、電源コネクタa16、電源コネクタb17、リモコン受光穴13を一体に覆っており、ねじ止め固定されている。本実施例においては、発光素子実装基板6は4枚に分割されていて、各々の発光素子実装基板6どうしはコネクタ7で電気的に接続されているが、例えば、本照明装置を作動・発光させたときにセード2を通して見える発光面の形状を考慮して設定される発光素子8の配列の仕方や、発光素子実装基板6の原板からの取り数といった生産性を考慮することによって、基板形状やその使用枚数などは任意に設定される得るものであり、本実施例に限定されるものではない。 The translucent cover 4 is a component molded of a transparent resin material such as polycarbonate, acrylic, or polystyrene, and is a light emitting element 8, a light emitting element mounting substrate 6, a connector 7, and a power connector a16 shown in FIGS. 3 and 4. , The power connector b17 and the remote control light receiving hole 13 are integrally covered, and are fixed by screws. In this embodiment, the light emitting element mounting substrate 6 is divided into four pieces, and the light emitting element mounting boards 6 are electrically connected to each other by the connector 7, but for example, the lighting device is operated and emits light. The substrate shape is determined by considering the arrangement of the light emitting elements 8 which are set in consideration of the shape of the light emitting surface which can be seen through the shade 2 when the light emitting element is mounted, and the productivity such as the number of light emitting element mounting substrates 6 taken from the original plate. And the number of sheets used can be arbitrarily set, and is not limited to this embodiment.

発光素子実装基板6には発光素子8が半田付けされている。発光素子8は作動時に光を放射すると共に発熱してそれ自体の温度が上昇するが、温度が高くなるにしたがって発光効率が低下するため、温度上昇に見合った適切な放熱手段を設ける必要がある。そのため発光素子実装基板6は、絶縁層を有したアルミ板や熱伝導性の高い樹脂板上に銅箔パターン及びソルダーレジストを形成したものが使われると共に、発光素子8の図示しない端子や、発光素子8の裏面に発光素子実装基板6に密着するように設けられた図示しない放熱パッド等を介した熱伝導によって、発光素子8が発する熱を発光素子実装基板6に伝熱及び放熱するようになっている。さらに、発光素子実装基板6の寸法で決まる放熱面積および熱容量だけでは十分な放熱効果を得ることが困難な場合には、発光素子実装基板6を例えば金属板などで成形された放熱板3に密着固定することで放熱性を確保する必要がある。本実施例では、放熱板3は可能な限り面積を大きく、かつ、熱伝導性の観点から一体で作ることが望ましいことから、図5に示すように、前述のセード取付具5やセード2の外周を取り囲むように配設する図示しない飾り枠の取り付け部38を含む、プレスで一体成形された金属製の大型部品としている。また、図5〜図7に示すように、放熱板3は本体ベース9に絶縁板10と共にねじ止め固定された点灯回路基板11を覆っており、点灯回路回路基板11は本体ベース9と放熱板3とで囲まれた空間内に収納されている。そのため、放熱板3に載置した発光素子実装基板6は、照明装置1の中央部付近まで面積を広げて発光素子8を配置することが可能であり、照明装置1の発光面中央部の明るさを均一にすることができる。 The light emitting element 8 is soldered to the light emitting element mounting substrate 6. The light emitting element 8 emits light and generates heat during operation, and the temperature of the light emitting element 8 itself rises. However, since the luminous efficiency decreases as the temperature rises, it is necessary to provide an appropriate heat radiating means corresponding to the temperature rise. .. Therefore, as the light emitting element mounting substrate 6, a copper foil pattern and a solder resist formed on an aluminum plate having an insulating layer or a resin plate having high thermal conductivity are used, and terminals (not shown) of the light emitting element 8 and light emitting are used. The heat generated by the light emitting element 8 is transferred and dissipated to the light emitting element mounting substrate 6 by heat conduction through a heat radiation pad (not shown) provided on the back surface of the element 8 so as to be in close contact with the light emitting element mounting substrate 6. It has become. Further, when it is difficult to obtain a sufficient heat dissipation effect only by the heat dissipation area and heat capacity determined by the dimensions of the light emitting element mounting substrate 6, the light emitting element mounting substrate 6 is brought into close contact with the heat radiating plate 3 formed of, for example, a metal plate. It is necessary to secure heat dissipation by fixing. In this embodiment, it is desirable that the heat radiating plate 3 has as large an area as possible and is integrally made from the viewpoint of thermal conductivity. Therefore, as shown in FIG. 5, the above-mentioned shade attachment 5 and shade 2 are used. It is a large metal part integrally molded by a press, including an attachment portion 38 of a decorative frame (not shown) arranged so as to surround the outer periphery. Further, as shown in FIGS. 5 to 7, the heat radiating plate 3 covers the lighting circuit board 11 screwed and fixed to the main body base 9 together with the insulating plate 10, and the lighting circuit circuit board 11 covers the main body base 9 and the heat radiating plate. It is stored in the space surrounded by 3. Therefore, the light emitting element mounting substrate 6 mounted on the heat radiating plate 3 can expand the area to the vicinity of the central portion of the lighting device 1 to arrange the light emitting element 8, and the brightness of the central portion of the light emitting surface of the lighting device 1 can be arranged. Can be made uniform.

また、点灯回路基板11は作動時に発熱を伴うため、本体ベース9と放熱板3とで囲まれた空間の雰囲気温度が上昇する。このとき前記空間の体積が小さいと、放熱板3に取り付けられた発光素子実装基板6からの放熱効果が低下してしまうため、放熱板3は本体ベース9とのねじ止め固定部39よりも、本体ベース9から離反する方向、すなわち照明装置の天井面への取付状態では下方、に凸の形状として、点灯回路基板11の収納空間の体積を確保するようにしている。さらに、放熱板3は金属板をプレス成形して製作するため、前記凸形状は、発光素子実装基板6の取付け面と、ねじ止め固定部39、セード取付け具5、及び飾り枠取り付け部38を含む面とを、テーパ面40でつないだ形状としている。テーパ面40を設けることにより、前記点灯回路基板11の収納空間の体積及び、放熱板3の面積を大にできるため、発光素子8の発光効率が高く、かつ放熱板3の絞り成形性が良く生産性の良い照明装置を実現することができる。 Further, since the lighting circuit board 11 generates heat during operation, the atmospheric temperature of the space surrounded by the main body base 9 and the heat radiating plate 3 rises. At this time, if the volume of the space is small, the heat radiating effect from the light emitting element mounting substrate 6 attached to the heat radiating plate 3 is reduced, so that the heat radiating plate 3 is more than the screwed fixing portion 39 with the main body base 9. The volume of the storage space of the lighting circuit board 11 is secured by forming a convex shape in the direction away from the main body base 9, that is, downward when the lighting device is mounted on the ceiling surface. Further, since the heat radiating plate 3 is manufactured by press-molding a metal plate, the convex shape has a mounting surface of the light emitting element mounting substrate 6, a screw fixing portion 39, a shade mounting tool 5, and a decorative frame mounting portion 38. The surface including the surface is connected by a tapered surface 40. By providing the tapered surface 40, the volume of the storage space of the lighting circuit board 11 and the area of the heat radiating plate 3 can be increased, so that the luminous efficiency of the light emitting element 8 is high and the drawability of the heat radiating plate 3 is good. It is possible to realize a highly productive lighting device.

発光素子実装基板6は放熱板3に透光性カバー4と共に複数のねじで固定されるが、各々の発光素子実装基板6は、最低1つのねじによって透光性カバー4の取付前に放熱板3に直接ねじ止めされる。このねじ止め作業をするにあたっては、図4、図5、図5のX部の部分拡大図である図19(a)〜(d)、及び図20を用いて説明する。まず発光素子実装基板6を放熱板3に設けた基板案内突起27に合わせて載置するが、前記案内突起27は、発光素子実装基板6どうしが隣り合った直線部分、すなわち、扇形状の半径方向にあたる直線部分35のすき間に合うように、断面が台形状30や半円状31の押し出し、または切り起こし32で形成されている。前記押し出し、または切り起こし形状の高さhは、発光素子実装基板6の厚さよりも小として、後から取付ける透光性カバー4と干渉しないようにしているが、透光性カバー4の当該部分に逃げ形状を設ければこの限りではない。これらの加工方法により、押し出しの場合はせん断部の直線状エッジ33、切り起こしの場合は切り起こした平面の直線部34が形成できる。そのため、図19(d)に例示するように、製作上、R形状が必要な絞り加工によって位置決め部36を形成する場合と比較して、a部に示すようなR部分への発光素子実装基板6の乗り上がりがなく、より正確な位置決めが可能となる。また、前記案内突起27は、発光素子実装基板6どうしが隣り合った直線部分、すなわち、扇形状の半径方向にあたる直線部分35のすき間に合うように配設されているため、放熱板3上に載置した発光素子実装基板6を放熱板3の中心方向に寄せることで位置決め作業が完了し、その後のねじ止め作業を円滑に行うことができる。また、放熱板3に対して各々の発光素子実装基板6につき最低1つのねじで直接ねじ止めする作業を行った後には、発光素子実装基板6どうしをつなぐコネクタ7や電源コネクタa16、及び電源コネクタb17を接続してから、透光性カバー4をねじ止め固定するが、前記複数のコネクタの配線材の剛性等に起因する発光素子実装基板6の位置ずれがないため、透光性カバー4のねじ止め作業を円滑に行うことができ、生産性を向上させることができる。 The light emitting element mounting substrate 6 is fixed to the heat radiating plate 3 together with the translucent cover 4 with a plurality of screws, and each light emitting element mounting substrate 6 is fixed to the heat radiating plate 3 by at least one screw before mounting the translucent cover 4. It is screwed directly to 3. This screwing operation will be described with reference to FIGS. 19 (a) to 19 (d) and FIGS. 20 which are partially enlarged views of the X portion of FIGS. 4, 5, and 5. First, the light emitting element mounting substrate 6 is placed so as to be aligned with the substrate guide protrusion 27 provided on the heat radiation plate 3, and the guide protrusion 27 is a straight portion in which the light emitting element mounting substrates 6 are adjacent to each other, that is, a fan-shaped radius. The cross section is formed by extruding or cutting up 32 having a trapezoidal shape 30 or a semicircular shape 31 so as to meet the gap of the straight line portion 35 corresponding to the direction. The height h of the extruded or cut-out shape is set to be smaller than the thickness of the light emitting element mounting substrate 6 so as not to interfere with the translucent cover 4 to be attached later. This is not the case if a relief shape is provided in. By these processing methods, a linear edge 33 of a sheared portion can be formed in the case of extrusion, and a straight portion 34 of a flat surface cut out can be formed in the case of cutting up. Therefore, as illustrated in FIG. 19D, a light emitting element mounting substrate on the R portion as shown in the a portion is compared with the case where the positioning portion 36 is formed by drawing processing which requires an R shape in manufacturing. There is no ride on No. 6, and more accurate positioning is possible. Further, since the guide protrusions 27 are arranged so as to meet the gaps between the light emitting element mounting substrates 6 in a straight line portion adjacent to each other, that is, the straight line portion 35 corresponding to the radial direction of the fan shape, the guide protrusions 27 are placed on the heat radiating plate 3. By moving the placed light emitting element mounting substrate 6 toward the center of the heat radiating plate 3, the positioning work is completed, and the subsequent screwing work can be smoothly performed. Further, after the work of directly screwing each light emitting element mounting board 6 to the heat radiating plate 3 with at least one screw, the connector 7 connecting the light emitting element mounting boards 6 to each other, the power connector a16, and the power connector After connecting b17, the translucent cover 4 is screwed and fixed, but since there is no misalignment of the light emitting element mounting substrate 6 due to the rigidity of the wiring materials of the plurality of connectors, the translucent cover 4 is used. The screwing work can be performed smoothly, and the productivity can be improved.

本実施例において、発光素子実装基板6には、点灯回路基板11につながる電源コネクタa16、及び電源コネクタb17を有する1枚と、前記2つの電源コネクタを有しない3枚とがある。電源コネクタa16は、通常点灯時に作動する発光素子8への電源供給に用い、電源コネクタb17は、保安灯としてのみ作動する発光素子43への電源供給に用いているが、これらの構成に限定されるものではない。前記2つの電源コネクタからは図示しない配線が放熱板3に設けた配線穴15を通って点灯回路基板11に接続されている。図6は放熱板3を外して点灯回路基板11の設置状態を示した斜視図である。点灯回路基板11は、例えば難燃性を有するポリプロピレンなどの樹脂材料で成形された絶縁板10上に載置され、例えば金属板などで成形された本体ベース9にねじ止め固定されると共に、絶縁板10の外縁に突設された基板係止部a28及び基板係止部b42でその外縁を保持されている。点灯回路基板11上にはリモコン受光素子カバー12に覆われた、リモコン受光素子45を配設しており、使用者によって操作される図示しないリモコンユニットからの赤外線信号を受信して、信号に応じた点灯制御をするようになっている。また、前記リモコン受光素子カバー12の筒状になった先端開口部29は放熱板3に設けたリモコン受光穴13に臨んでおり、セード2及び、透光性カバー4を通過してきた赤外線リモコン信号が前記リモコン受光素子に到達するようになっている。また、図3、及び図4に示すように、リモコン受光穴13は、発光素子実装基板6を放熱板3に載置したときに、隣接する発光素子実装基板6の外形のC面部44で挟まれた部分に配置されている。 In this embodiment, the light emitting element mounting board 6 includes one having a power connector a16 and a power connector b17 connected to the lighting circuit board 11, and three without the two power connectors. The power connector a16 is used to supply power to the light emitting element 8 that normally operates during lighting, and the power connector b17 is used to supply power to the light emitting element 43 that operates only as a security light, but the configuration is limited to these. It's not something. Wiring (not shown) is connected to the lighting circuit board 11 from the two power connectors through a wiring hole 15 provided in the heat radiating plate 3. FIG. 6 is a perspective view showing an installed state of the lighting circuit board 11 with the heat radiating plate 3 removed. The lighting circuit board 11 is placed on an insulating plate 10 formed of a resin material such as polypropylene having flame retardancy, and is screwed and fixed to a main body base 9 formed of a metal plate or the like, and is also insulated. The outer edge is held by the substrate locking portion a28 and the substrate locking portion b42 projecting from the outer edge of the plate 10. A remote control light receiving element 45 covered with a remote control light receiving element cover 12 is arranged on the lighting circuit board 11, and receives an infrared signal from a remote control unit (not shown) operated by the user and responds to the signal. It is designed to control lighting. Further, the tubular tip opening 29 of the remote control light receiving element cover 12 faces the remote control light receiving hole 13 provided in the heat radiating plate 3, and the infrared remote control signal that has passed through the shade 2 and the translucent cover 4. Reach the remote control light receiving element. Further, as shown in FIGS. 3 and 4, the remote control light receiving hole 13 is sandwiched between the C surface portions 44 of the outer shape of the adjacent light emitting element mounting board 6 when the light emitting element mounting board 6 is placed on the heat radiating plate 3. It is placed in the part that has been removed.

リモコン受光穴13の配置については、例えば、発光素子実装基板6の任意の位置に穴を開けてもよいが、発光素子8の基板上の配置に制約が生ずるため、本実施例のように発光素子実装基板6の外に設けるほうが望ましい。また、発光素子実装基板6の外であっても、例えば、放熱板3のテーパ面40等に受光穴を設けることも可能であるが、その場合は、当該受光穴を覆うカバー部材が別途必要となる。このリモコン受光穴13は、発光素子8の上面すなわち発光面から、発光素子8の高さと発光素子実装基板6の厚さの和だけ下がった面に開口していて、発光素子8の放射角の外側に位置するため発光素子8からの光束の影響を受けにくく、リモコン信号の受信性能を向上させることができる。 Regarding the arrangement of the remote control light receiving hole 13, for example, a hole may be formed at an arbitrary position on the light emitting element mounting substrate 6, but since the arrangement of the light emitting element 8 on the substrate is restricted, light emission is performed as in this embodiment. It is desirable to provide it outside the element mounting substrate 6. Further, even outside the light emitting element mounting substrate 6, for example, it is possible to provide a light receiving hole on the tapered surface 40 of the heat radiating plate 3, but in that case, a cover member for covering the light receiving hole is separately required. It becomes. The remote light receiving hole 13 is opened from the upper surface of the light emitting element 8, that is, the light emitting surface, to a surface lowered by the sum of the height of the light emitting element 8 and the thickness of the light emitting element mounting substrate 6, and the radiation angle of the light emitting element 8 is increased. Since it is located on the outside, it is not easily affected by the light flux from the light emitting element 8, and the reception performance of the remote control signal can be improved.

次に、図8に透光性カバー4の外観図を示す。本部品には、半球形状部18、電源コネクタカバー部19、コネクタカバー部20、リモコン受光部21が形成されている。本実施例では、リモコン受光部21には、放熱板3に形成されたリモコン受光穴13に嵌合する筒状の突起を形成しており、透光性カバー4のねじ止め作業時の位置決めを兼ねているが本形状に限定されるものではなく、例えば単なる平面であってもよい。さらに、リモコン受光部21の形状を半球形状として集光させることができるようにしたり、当該部分の表面に、例えばシボ加工を施して表面での信号の反射を抑えて受信性能をさらに向上させることも可能である。 Next, FIG. 8 shows an external view of the translucent cover 4. A hemispherical shape portion 18, a power connector cover portion 19, a connector cover portion 20, and a remote control light receiving portion 21 are formed in this component. In this embodiment, the remote control light receiving unit 21 is formed with a tubular protrusion that fits into the remote control light receiving hole 13 formed in the heat radiating plate 3, and positions the translucent cover 4 during screwing work. Although it also serves as this shape, it is not limited to this shape, and may be, for example, a simple flat surface. Further, the shape of the remote control light receiving unit 21 can be focused as a hemispherical shape, or the surface of the portion can be textured, for example, to suppress signal reflection on the surface and further improve reception performance. Is also possible.

また、本実施例では、透光性カバー4の平面全体形状は円にしており、部品全体がその中心点22に対して点対称となるように構成されているが、正偶数角形でも同様の構成とすることができる。本実施例においては、取付作業時には4通りある透光性カバー4の取付方向を気にせずに載置できるため、作業時間を短縮でき、かつ部品の取付方向誤りといった不良要因をなくすことができるほか、点対称形状とすることで成形時のゆがみを少なくすることができ、生産性を向上させることができる。 Further, in the present embodiment, the entire plane shape of the translucent cover 4 is circular, and the entire component is configured to be point-symmetrical with respect to the center point 22, but the same applies to regular and even-numbered squares. It can be configured. In this embodiment, since the four translucent covers 4 can be mounted without worrying about the mounting directions during the mounting work, the working time can be shortened and defective factors such as incorrect mounting directions of parts can be eliminated. In addition, the point-symmetrical shape can reduce distortion during molding and improve productivity.

半球形状部18は、1つ、または複数の発光素子8を一組として覆っているが、図10に発光素子8が1つの場合の断面図、図13にその場合の半球形状部18の拡大図を示す。本実施例においては、半球形状部18の中心軸24は発光部の中心23bと一致するように配設されている。この場合の発光部の中心23bは、発光素子8の中心と一致する。
透光性カバー4の屈折率は空気の屈折率(約1.00)よりも大である一定の屈折率を有するため、発光素子8から放射された光束が半球形状部18の法線に対して角度θiで入射すると、半球形状部18から光束が出るときの角度θoは臨界角θcを持つことになるが、この臨界角θcは透光性カバー4の材質によって異なる。例えば代表値であるがポリカーボネートで1.59、アクリルで1.49程度の屈折率を持つため、臨界角θcは約39°〜42°となる。半球形状部18の略中心に位置する発光素子8から放射された光束は、半球形状部18に対して略法線方向から入射することになり、θoが前記臨界角θcよりも十分小さな値となるため、透光性カバー4と空気との外側界面での全反射による光束の取り出し効率の低下を避けることができる。
The hemispherical shape portion 18 covers one or a plurality of light emitting elements 8 as a set. FIG. 10 shows a cross-sectional view when there is one light emitting element 8, and FIG. 13 shows an enlarged view of the hemispherical shape portion 18 in that case. The figure is shown. In this embodiment, the central axis 24 of the hemispherical portion 18 is arranged so as to coincide with the center 23b of the light emitting portion. The center 23b of the light emitting portion in this case coincides with the center of the light emitting element 8.
Since the refractive index of the translucent cover 4 has a constant refractive index that is larger than the refractive index of air (about 1.00), the light beam emitted from the light emitting element 8 is relative to the normal of the hemispherical portion 18. When incident at an angle θi, the angle θo when the light beam is emitted from the hemispherical portion 18 has a critical angle θc, and this critical angle θc differs depending on the material of the translucent cover 4. For example, although it is a typical value, since polycarbonate has a refractive index of about 1.59 and acrylic has a refractive index of about 1.49, the critical angle θc is about 39 ° to 42 °. The luminous flux emitted from the light emitting element 8 located at the substantially center of the hemispherical shape portion 18 is incident on the hemispherical shape portion 18 from the substantially normal direction, and θo is a value sufficiently smaller than the critical angle θc. Therefore, it is possible to avoid a decrease in the extraction efficiency of the light flux due to total reflection at the outer interface between the translucent cover 4 and the air.

次に、図9に発光素子8が2つの場合の断面図、図12にその場合の半球形状部18の拡大図を示す。半球形状部18の中心軸24は発光部の中心23aと一致するように配設されている。本実施例における発光部の中心23aとは、2つの発光素子8の中心点を結ぶ直線の2等分点である。2つ以上の複数の発光素子8を一組として半球形状18で覆う場合は、各々の発光素子8の中心間距離は、半球形状部18の径に対して十分小であることが望ましいが、半球形状部18を大きくしていく場合の寸法的制約や一組の発光素子8どうしの中心間距離を小さくしていくと放熱性が低下するといった制約がある。しかしながら、半球形状部18に覆われた各々の発光素子8から放射された光束の入射角θiに伴って変化するθoが前記臨界角θcを超えないように、前記2つの発光素子8の中心間距離や半球形状部18の径を適切に設定することで、発光素子8が1つの場合と同様の効果を得ることができる。 Next, FIG. 9 shows a cross-sectional view when there are two light emitting elements 8, and FIG. 12 shows an enlarged view of the hemispherical portion 18 in that case. The central axis 24 of the hemispherical portion 18 is arranged so as to coincide with the center 23a of the light emitting portion. The center 23a of the light emitting portion in this embodiment is a bisector of a straight line connecting the center points of the two light emitting elements 8. When two or more light emitting elements 8 are covered with a hemispherical shape 18 as a set, it is desirable that the distance between the centers of each light emitting element 8 is sufficiently small with respect to the diameter of the hemispherical shape portion 18. There are dimensional restrictions when the hemispherical shape portion 18 is increased, and restrictions such as a decrease in heat dissipation when the distance between the centers of the set of light emitting elements 8 is decreased. However, between the centers of the two light emitting elements 8 so that θo, which changes with the incident angle θi of the light flux emitted from each light emitting element 8 covered by the hemispherical portion 18, does not exceed the critical angle θc. By appropriately setting the distance and the diameter of the hemispherical shape portion 18, the same effect as in the case of one light emitting element 8 can be obtained.

また、図14に3つの発光素子8を一直線上に配設した場合を示す。本実施例における発光部の中心23cは等間隔で配設した3つの発光素子8のうち、中央に位置する発光素子8の中心に一致するという条件の他は、前述の2つの発光素子8を一組とした場合と同様である。さらに、図15に3つの発光素子8を正三角形の頂点となるように配設した場合を示す。この場合の発光部の中心23dとは前記正三角形の重心である。本実施例によれば、発光素子8を一直線上に配設した場合に比べて、半球形状部18の径をより小さくすることができる。 Further, FIG. 14 shows a case where the three light emitting elements 8 are arranged in a straight line. Of the three light emitting elements 8 arranged at equal intervals, the center 23c of the light emitting portion in this embodiment coincides with the center of the light emitting element 8 located at the center. It is the same as the case of making one set. Further, FIG. 15 shows a case where the three light emitting elements 8 are arranged so as to be the vertices of an equilateral triangle. The center 23d of the light emitting portion in this case is the center of gravity of the equilateral triangle. According to this embodiment, the diameter of the hemispherical portion 18 can be made smaller than that in the case where the light emitting elements 8 are arranged in a straight line.

以上、1つの半球形状部18内に1〜3個の発光素子8を配設した場合を例示したが、さらに数を増やす場合でも同様である。すなわち、複数の発光素子8を正多角形の頂点及びその内部に配設し、かつ、その多角形の重心と半球形状部18の中心軸24を一致させるように構成すると共に、半球形状18に覆われた各々の発光素子8から放射された光の入射角θiに伴って変化するθoが透光性カバー4の材質によって異なる臨界角θcを超えないように、前記複数の発光素子8の中心間距離や半球形状部18の径を適切に設定することで同様の効果を得ることができる。 As described above, the case where 1 to 3 light emitting elements 8 are arranged in one hemispherical shape portion 18 has been illustrated, but the same applies to the case where the number is further increased. That is, a plurality of light emitting elements 8 are arranged at the apex of the regular polygon and inside the apex, and the center of gravity of the polygon is configured to coincide with the central axis 24 of the hemispherical shape portion 18, and the hemispherical shape 18 is formed. The centers of the plurality of light emitting elements 8 so that the θo that changes with the incident angle θi of the light emitted from each of the covered light emitting elements 8 does not exceed the critical angle θc that differs depending on the material of the translucent cover 4. The same effect can be obtained by appropriately setting the distance and the diameter of the hemispherical portion 18.

さらに、図16に、複数の発光素子8を覆う部分18aが、両端に1/4球形状を有する半円筒形状である場合を例示する。本実施例は、一直線上に等間隔で配設された複数の発光素子8を一組として覆う場合であるが、半球形状の場合と同様、発光部の中心23cと発光素子8を覆う部分18aの対称軸25が一致するように構成するものである。しかしながら、円筒形状部37が長くなるに従って、発光部の中心23cから離れた両端に配設された発光素子8から放射される光束の円筒形状部37へ入射する角度θiが大きくなる。そのため、θoが臨界角θcを超えて全反射するようになり、光束の取り出し効率が低下することになる。したがって、本実施例においては、半円筒形状部37が可能な限り短くなるように、複数の発光素子8の中心間距離を短く、かつ、両端の1/4球形状部分の径を大にする等の設定をする必要がある。 Further, FIG. 16 illustrates a case where the portion 18a covering the plurality of light emitting elements 8 has a semi-cylindrical shape having a 1/4 spherical shape at both ends. In this embodiment, a plurality of light emitting elements 8 arranged at equal intervals on a straight line are covered as a set, but as in the case of the hemispherical shape, the center 23c of the light emitting portion and the portion 18a covering the light emitting element 8 are covered. The axes of symmetry 25 of the above are configured to coincide with each other. However, as the cylindrical portion 37 becomes longer, the angle θi incident on the cylindrical portion 37 of the light beam emitted from the light emitting elements 8 arranged at both ends away from the center 23c of the light emitting portion increases. Therefore, θo is totally reflected beyond the critical angle θc, and the efficiency of extracting the luminous flux is lowered. Therefore, in this embodiment, the distance between the centers of the plurality of light emitting elements 8 is shortened and the diameters of the 1/4 spherical portions at both ends are increased so that the semi-cylindrical shaped portion 37 is as short as possible. Etc. need to be set.

また、前記複数の発光素子8を一組として、半球形状部18や両端に1/4球形状を有する半円筒形状部18aで覆った場合、発光色が異なる発光素子8で構成することも可能である。 Further, when the plurality of light emitting elements 8 are grouped together and covered with a hemispherical shape portion 18 or a semi-cylindrical shape portion 18a having a 1/4 spherical shape at both ends, it is also possible to configure the light emitting elements 8 having different emission colors. Is.

次に、隣接する複数の半球形状部18どうしが干渉している場合の断面図を図17に示す。発光素子8から、発光素子8の特性に係る放射角αをもって放射された光束は、半球形状部18に入射する。本実施例のように隣接する半球形状部18どうしが干渉している場合は、半球形状部どうしが干渉する部分の外縁26が、各々の半球形状部18の中心軸24と発光部の中心23aとが略一致するように配設された、各々の発光素子8の放射角αの外側に位置するようにすることが望ましい。図18に、隣接する半球形状部どうしが干渉する部分の外縁26が、各々の発光素子8の放射角αの内側に位置する場合を例示する。この場合は、発光素子8から放射された光束が、半球形状部18どうしの干渉形状部分を通過して、隣接する半球形状部18に大きな角度で入射するため、θoが臨界角θcを越えて全反射することにより光束の取出し効率が低下することが考えられる。 Next, FIG. 17 shows a cross-sectional view when a plurality of adjacent hemispherical portions 18 interfere with each other. The luminous flux emitted from the light emitting element 8 at the radiation angle α according to the characteristics of the light emitting element 8 is incident on the hemispherical portion 18. When adjacent hemispherical portions 18 interfere with each other as in this embodiment, the outer edge 26 of the portion where the hemispherical portions interfere with each other is the central axis 24 of each hemispherical portion 18 and the center 23a of the light emitting portion. It is desirable that the light emitting elements 8 are located outside the radiation angle α of each light emitting element 8 arranged so as to substantially coincide with the above. FIG. 18 illustrates a case where the outer edge 26 of the portion where the adjacent hemispherical portions interfere with each other is located inside the radiation angle α of each light emitting element 8. In this case, the luminous flux radiated from the light emitting element 8 passes through the interference-shaped portion between the hemispherical-shaped portions 18 and is incident on the adjacent hemispherical-shaped portions 18 at a large angle, so that θo exceeds the critical angle θc. It is conceivable that the efficiency of extracting the luminous flux will decrease due to total reflection.

図21(b)に半球形状部18の断面の他の実施例を示す。本実施例は、半球形状部18の内側の曲率半径Riの中心と、外側の曲率半径Roの中心をずらすことで、半球形状の頂点部付近の肉厚tVよりも赤道部付近の肉厚tEを大とした例である。肉厚が均一である図21(a)の場合に比べて、発光素子8から放射された光束の半球形状部18の外側界面への入射角θoが大となるため光束をより広範囲に広げることができるが、この場合はθoが臨界角θcよりも小となるようにすることが必要である。図21(c)は逆に半球形状の頂点部付近の肉厚tVよりも赤道部付近の肉厚tEを小とした例である。ここで、赤道部とは半球形状部18における切断部付近のことを指すものとする。この場合は、前述とは逆にθoが小となり光束をより狭い範囲に集めることができる。さらに図21(d)は内側を半球、外側を放物面あるいは楕円の回転体で作られる面の一部などの3次曲面とした例である。この場合も、頂点付近の肉厚tVと赤道部付近の肉厚tEとの関係によって集光や拡散の制御ができる点において、先に述べた、半球形状部18の内側の曲率半径Riの中心と外側の曲率半径Roの中心をずらすことと同じである。また、内側を放物面あるいは楕円の回転体で作られる面の一部などの3次曲面、外側を半球とした場合も同様である。以上述べたように、半球形状部18の肉厚を変化させて、半球形状部18の外側界面への入射角θoを制御して、照明装置の目的に応じた配光特性を得ることもできる。 FIG. 21B shows another embodiment of the cross section of the hemispherical portion 18. In this embodiment, by shifting the center of the radius of curvature Ri inside the hemispherical portion 18 and the center of the radius of curvature Ro outside, the wall thickness tE near the equator is larger than the wall thickness tV near the apex of the hemisphere. Is a large example. Compared with the case of FIG. 21A having a uniform wall thickness, the incident angle θo of the light beam emitted from the light emitting element 8 to the outer interface of the hemispherical portion 18 is large, so that the light flux is spread over a wider range. However, in this case, it is necessary to make θo smaller than the critical angle θc. On the contrary, FIG. 21C shows an example in which the wall thickness tE near the equatorial region is smaller than the wall thickness tV near the apex of the hemispherical shape. Here, the equator portion refers to the vicinity of the cut portion in the hemispherical portion 18. In this case, contrary to the above, θo becomes small and the luminous flux can be collected in a narrower range. Further, FIG. 21D is an example in which the inside is a hemisphere and the outside is a cubic curved surface such as a part of a surface made of a paraboloid or an elliptical rotating body. In this case as well, the center of the radius of curvature Ri inside the hemispherical portion 18 is described above in that light collection and diffusion can be controlled by the relationship between the wall thickness tV near the apex and the wall thickness tE near the equator. It is the same as shifting the center of the outer radius of curvature Ro. The same applies when the inside is a quadric surface such as a part of a surface made of a paraboloid or an elliptical rotating body, and the outside is a hemisphere. As described above, it is also possible to change the wall thickness of the hemispherical portion 18 to control the angle of incidence θo of the hemispherical portion 18 on the outer interface to obtain light distribution characteristics according to the purpose of the lighting device. ..

次に、本実施例における透光性カバー4の寸法を例示すると、外径φ395mm、樹脂の肉厚1.5mm、半球形状部の高さ12mmである。また、図8に示すように、電源コネクタカバー部19、コネクタカバー部20、及び半球形状部18等が、透光性カバー4の全面に渡って合計100個あまり形成されている。そのため、透光性カバー4は単なる平坦な形状とした場合よりも高い剛性を持つようになり、発光素子実装基板6の上から透光性カバー4を放熱板3に対してねじ止め固定することにより、発光素子実装基板6の反りや変形を軽減できる。また、発光素子8を透光性カバー8に対して適正な位置に矯正すると共に、放熱板3への発光素子実装基板6の密着性が高くなり放熱性が向上するため、発光面が均一で発光素子8の発光効率が高い照明装置を実現することができる。 Next, exemplifying the dimensions of the translucent cover 4 in this embodiment, the outer diameter is φ395 mm, the resin wall thickness is 1.5 mm, and the height of the hemispherical portion is 12 mm. Further, as shown in FIG. 8, a total of about 100 power supply connector cover portions 19, connector cover portions 20, hemispherical shape portions 18, and the like are formed over the entire surface of the translucent cover 4. Therefore, the translucent cover 4 has higher rigidity than the case where it has a simple flat shape, and the translucent cover 4 is screwed and fixed to the heat radiating plate 3 from above the light emitting element mounting substrate 6. Therefore, the warp and deformation of the light emitting element mounting substrate 6 can be reduced. Further, since the light emitting element 8 is corrected to an appropriate position with respect to the translucent cover 8 and the adhesion of the light emitting element mounting substrate 6 to the heat radiating plate 3 is improved to improve the heat radiating property, the light emitting surface is uniform. It is possible to realize a lighting device having high luminous efficiency of the light emitting element 8.

以上説明したように、本実施例によれば、発光素子8を、各々の発光素子を略中心とする半球形状の透光性カバー4で覆うことにより、発光素子8ら出た光束が前記透光性カバー4の面に対して略法線方向に入射することになり、透光性カバー4を通って光束が外部に出る際の全反射を避けることができるため、光束の取り出し効率を向上させた照明装置を実現することができる。 As described above, according to the present embodiment, by covering the light emitting element 8 with a hemispherical translucent cover 4 centered on each light emitting element, the light flux emitted from the light emitting element 8 is transmitted. Since the light is incident on the surface of the light cover 4 in a substantially normal direction, total reflection when the light flux goes out through the light transmissive cover 4 can be avoided, so that the efficiency of extracting the light flux is improved. It is possible to realize a lighting device that has been made.

また、本実施例によれば、半球形状部18を複数形成することにより、透光性カバー4の剛性が向上するため、発光素子実装基板6の反りや変形を軽減できる。また、発光素子8を透光性カバー4に対して適正な位置に矯正すると共に、放熱板3への発光素子実装基板6の密着性が高くなり放熱性が向上するため、発光面が均一で発光素子8の発光効率が高い照明装置を実現することができる。 Further, according to the present embodiment, by forming a plurality of hemispherical portions 18, the rigidity of the translucent cover 4 is improved, so that the warp and deformation of the light emitting element mounting substrate 6 can be reduced. Further, the light emitting element 8 is corrected to an appropriate position with respect to the translucent cover 4, and the light emitting element mounting substrate 6 is more closely adhered to the heat radiating plate 3 to improve the heat radiating property, so that the light emitting surface is uniform. It is possible to realize a lighting device having high luminous efficiency of the light emitting element 8.

さらに、本実施例によれば、透光性カバー4の全体形状を、前記透光性カバー4の中心点に対して点対称としたことで生産性の良いカバーを実現することができる。 Further, according to the present embodiment, the overall shape of the translucent cover 4 is point-symmetrical with respect to the center point of the translucent cover 4, so that a cover with good productivity can be realized.

さらに、本実施例によれば、半球形状部18の肉厚が、半球形状部18の天頂部付近で薄く、赤道部付近で厚くなるように滑らかに変化しているように構成したことにより、配光角が広い照明装置を実現することができる。 Further, according to the present embodiment, the wall thickness of the hemispherical portion 18 is configured to be thin in the vicinity of the zenith of the hemispherical portion 18 and to be thick in the vicinity of the equatorial region so as to be smoothly changed. It is possible to realize a lighting device having a wide light distribution angle.

1 照明装置
2 セード
3 放熱板
4 透光性カバー
5 セード取付具
6 発光素子実装基板
7 コネクタ
8 半導体発光素子(発光素子)
9 本体ベース
10 絶縁板
11 点灯回路基板
12 リモコン受光素子カバー
13 リモコン受光穴
14 器具取付部
15 配線穴
16 電源コネクタa(配線材図示せず)
17 電源コネクタb(配線材図示せず)
18 半球形状部
18a 両端に1/4球形状を有する半円筒形状部
19 電源コネクタカバー部
20 コネクタカバー部
21 リモコン受光部
22 中心点
23a、23b、23c、23d 発光部の中心
24 半球形状の中心軸
25 対称軸
26 半球形状部どうしが干渉する部分の外縁
27 基板案内突起
28 基板係止部a
29 先端開口部
30 台形状押し出し
31 半円状押し出し
32 切り起こし
33 押し出しによるせん断部の直線状エッジ
34 切り起こしによる平面の直線部
35 発光素子実装基板6の扇形状の半径方向にあたる直線部分
36 絞り加工による位置決め部
37 円筒形状部
38 飾り枠取付部
39 ねじ止め固定部
40 テーパ面
41 給電コネクタ
42 基板係止部b
43 発光素子(保安灯用)
44 C面部
45 リモコン受光素子
1 Lighting device 2 Sade 3 Heat dissipation plate 4 Translucent cover 5 Sade fixture 6 Light emitting element mounting board 7 Connector 8 Semiconductor light emitting element (light emitting element)
9 Main body base 10 Insulation plate 11 Lighting circuit board 12 Remote control light receiving element cover 13 Remote control light receiving hole 14 Instrument mounting part 15 Wiring hole 16 Power connector a (wiring material not shown)
17 Power connector b (wiring material not shown)
18 Hemispherical shape part 18a Semi-cylindrical shape part having 1/4 sphere shape at both ends 19 Power connector cover part 20 Connector cover part 21 Remote control light receiving part 22 Center points 23a, 23b, 23c, 23d Center of light emitting part 24 Center of hemispherical shape Axis 25 Symmetric axis 26 Outer edge of part where hemispherical shaped parts interfere with each other 27 Board guide protrusion 28 Board locking part a
29 Tip opening 30 Trapezoidal extrusion 31 Semi-circular extrusion 32 Cutting and raising 33 Straight edge of sheared part by pushing out 34 Straight line part of flat surface by cutting and raising 35 Straight line part 36 in the radial direction of the fan shape of the light emitting element mounting substrate 6 Positioning part by processing 37 Cylindrical shape part 38 Decorative frame mounting part 39 Screw fixing part 40 Tapered surface 41 Power supply connector 42 Board locking part b
43 Light emitting element (for security light)
44 C surface 45 Remote control light receiving element

Claims (2)

複数の半導体発光素子を光源とし、基板と基板表面に実装された前記複数の半導体発光素子と電源コネクタとを一体に覆う透光性カバー部材と、
セード取付具を有し、前記基板が取り付けられた放熱板と、
天井面に対し固定された状態の前記セード取付具によって係合保持されている、前記透光性カバー部材を覆うセードと、を有し、
前記透光性カバー部材における前記半導体発光素子を覆う部分の形状を、前記半導体発光素子を略中心として断面が半円形状とし、
前記透光性カバー部材において、隣接する前記半円形状間は、平坦な形状であることを特徴とする照明装置。
A translucent cover member that uses a plurality of semiconductor light emitting elements as a light source and integrally covers the substrate, the plurality of semiconductor light emitting elements mounted on the surface of the substrate, and a power connector.
A heat-dissipating plate that has a shade attachment and has the board attached to it,
It has a shade covering the translucent cover member , which is engaged and held by the shade attachment in a state of being fixed to the ceiling surface.
The shape of the portion of the translucent cover member that covers the semiconductor light emitting element is formed so that the cross section is semicircular with the semiconductor light emitting element as a substantially center.
A lighting device characterized in that, in the translucent cover member, the adjacent semicircular shapes have a flat shape.
前記透光性カバー部材における前記半導体発光素子と前記電源コネクタが実装された部分以外の基板を覆う部分の形状を、平坦な形状としたことを特徴とする請求項1に記載の照明装置。
The lighting device according to claim 1, wherein a portion of the translucent cover member that covers a substrate other than a portion on which the semiconductor light emitting element and the power connector are mounted has a flat shape.
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