JP2016027583A - Lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device provided with proper heat radiation means appropriate to temperature rise.SOLUTION: A lighting device includes: a body base having a device attachment part; a heat sink having a shade attachment tool and fixed to the body base; a lighting circuit board stored in a space enclosed by the body base and the heat sink; a light emitting element mounting substrate on which light emitting elements supplied with power from the lighting circuit board are disposed, the light emitting mounting substrate attached to the heat sink; and a shade held by the shade attachment tool.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an illumination device using a semiconductor light emitting element as a light source.

  As a conventional lighting device, for example, in Patent Document 1 (Japanese Patent Laid-Open No. 2007-27072), a metal plate and a metal side plate are integrally formed to form a reflecting plate, and the reflecting plate is fixed to a second metal plate. The LED unit is fixed to the metal plate and the metal side plate, a glove support is provided in the vicinity of the outer periphery of the second metal plate, and it is described that the glove is removably supported with respect to the glove support. Yes.

JP 2007-27072 A

  The light emitting element emits light during operation and generates heat to increase its own temperature. However, as the temperature increases, the light emission efficiency decreases.

  The objective of this invention is providing the illuminating device which provided the suitable thermal radiation means corresponding to the temperature rise.

  In order to achieve the above object, the present invention provides a main body base having an instrument mounting portion, a shade mounting tool, a heat radiating plate fixed to the main body base, and a space surrounded by the main body base and the heat radiating plate. A lighting circuit board housed in the lighting circuit board, a light emitting element fed from the lighting circuit board is disposed, a light emitting element mounting board attached to the heat sink, and a shade held by the shade fitting .

  Alternatively, a main body base having a fixture mounting portion, a light emitting element mounting substrate on which a light emitting element is disposed, a surface fixed to the main body base, on which the light emitting element mounting substrate is mounted, and a shade mounting tool on the outer side A heat sink having a convex shape by a surface having the surface and a surface connecting these surfaces, a lighting circuit board that is housed in a space surrounded by the main body base and the heat sink, and supplies power to the light emitting element, and the light emission A shade held by the shade mounting tool so as to cover the element mounting substrate and the shade mounting tool.

  ADVANTAGE OF THE INVENTION According to this invention, the illuminating device provided with the appropriate heat radiating means commensurate with the temperature rise can be provided.

It is an external view of the illuminating device which concerns on the Example of this invention. It is a figure of the state which removed the shade of the illuminating device which concerns on the same as the above. It is a figure of the state which removed the translucent cover of the illuminating device which concerns on the same as the above. It is an enlarged view of the light emitting element mounting substrate shown in FIG. It is a figure of the state which removed the light emitting element mounting substrate of the illuminating device which concerns on the Example of this invention. It is a figure of the state which removed the heat sink of the illuminating device which concerns on the same as the above. It is a disassembled perspective view of the illuminating device which concerns on the same as the above. It is an enlarged view of the translucent cover shown in FIG. It is a fragmentary sectional view of the illuminating device which concerns on the Example of this invention. It is a fragmentary sectional view of the illuminating device concerning the same as the above. It is a fragmentary sectional view of the illuminating device concerning the same as the above. It is an enlarged view of the hemispherical shape part of the illuminating device which concerns on the same as the above. It is an enlarged view of the hemispherical shape part of the illuminating device which concerns on the same as the above. It is an enlarged view of the hemispherical shape part of the illuminating device which concerns on the same as the above. It is an enlarged view of the hemispherical shape part of the illuminating device which concerns on the same as the above. It is another Example of the illuminating device which concerns on the same as the above. It is sectional drawing of the hemispherical part of the illuminating device which concerns on the same as the above. It is sectional drawing of the hemispherical part of the illuminating device which concerns on the same as the above. It is the elements on larger scale of the state which removed the heat sink of the illuminating device which concerns on the same as the above. It is the figure explaining the method to position in the state which mounted the light emitting element mounting board | substrate of the illuminating device which concerns on the same as the heat sink. It is sectional drawing of the substantially hemispherical shape part of the illuminating device which concerns on the same as the above. It is sectional drawing of the remote control light-receiving part of the illuminating device concerning the same as the above.

  Hereinafter, the structure of the illuminating device which concerns on the Example of this invention is demonstrated using an accompanying figure. This lighting device is installed on the ceiling of a building, mainly a living room of a general household, and is connected to an external power source via an attachment adapter that engages with an indoor wiring device such as a hooking rosette or hooking ceiling attached to the building. And fixed at a predetermined position. FIG. 1 is an external view of the present lighting device installed on a ceiling surface (not shown) as viewed from below. The seed 2 is a part made of a resin material such as acrylic or polystyrene, which is transparent, translucent, or milky white. This is mainly to diffuse the luminous flux emitted from the light source to reduce glare when the user looks directly at the lighting device, or to equalize the brightness in the room where the lighting device is installed. have.

  Next, while showing the exploded perspective view of the illuminating device 1 in FIG. 7, a structure is demonstrated using FIGS. 2-6 according to a decomposition | disassembly level. FIG. 2 shows a state where the shade 2 is removed. The shade 2 is engaged and held by a shade attachment 5 fixed to the heat radiating plate 3. For example, when the shade 2 is rotated counterclockwise in the circumferential direction, an engagement portion (not shown) protruding from the shade 2 is provided. It comes to come off. When the shade 2 is removed, an instrument mounting portion 14 provided at the center of the main body base 9 formed of, for example, a metal plate, which will be described later, can be seen. A claw-shaped hook portion of the mounting adapter is provided on this portion. By engaging, for example, it is fixed at a predetermined position on the ceiling surface of the living room. Further, a power supply connector 41 connected to the lighting circuit board 11 to be described later is disposed in the vicinity of the fixture mounting portion 14, and the power supply connector 41 and the connector disposed on the mounting adapter are fitted. By connecting them together, power can be supplied from the indoor wiring of the building.

  The translucent cover 4 is a part formed of a transparent resin material such as polycarbonate, acrylic, polystyrene, and the like, and is the light emitting element 8, the light emitting element mounting substrate 6, the connector 7, and the power connector a16 shown in FIGS. The power connector b17 and the remote control light receiving hole 13 are integrally covered and fixed with screws. In the present embodiment, the light emitting element mounting substrate 6 is divided into four pieces, and each light emitting element mounting substrate 6 is electrically connected by the connector 7. By considering the productivity such as the arrangement of the light emitting elements 8 set in consideration of the shape of the light emitting surface that can be seen through the shade 2 and the number of light emitting element mounting substrates 6 taken from the original plate, The number of sheets used and the number of sheets used can be arbitrarily set, and are not limited to the present embodiment.

  A light emitting element 8 is soldered to the light emitting element mounting substrate 6. The light emitting element 8 emits light during operation and generates heat to increase its own temperature. However, as the temperature increases, the light emission efficiency decreases. Therefore, it is necessary to provide an appropriate heat dissipation means corresponding to the temperature increase. . For this reason, the light-emitting element mounting substrate 6 is made of an aluminum plate having an insulating layer or a resin plate having a high thermal conductivity formed with a copper foil pattern and a solder resist. The heat generated by the light emitting element 8 is transferred to and dissipated from the light emitting element mounting substrate 6 by heat conduction through a heat dissipating pad (not shown) provided so as to be in close contact with the light emitting element mounting substrate 6 on the back surface of the element 8. It has become. Further, when it is difficult to obtain a sufficient heat dissipation effect only with the heat dissipation area and heat capacity determined by the dimensions of the light emitting element mounting substrate 6, the light emitting element mounting substrate 6 is in close contact with the heat dissipation plate 3 formed of, for example, a metal plate. It is necessary to secure heat dissipation by fixing. In this embodiment, it is desirable that the heat radiating plate 3 has as large an area as possible and is integrally formed from the viewpoint of thermal conductivity. Therefore, as shown in FIG. It is a large metal part integrally formed by a press, including a decorative frame mounting portion 38 (not shown) disposed so as to surround the outer periphery. 5-7, the heat sink 3 covers the lighting circuit board 11 screwed to the main body base 9 together with the insulating plate 10, and the lighting circuit board 11 includes the main body base 9 and the heat sink 3. It is stored in a space surrounded by. Therefore, the light emitting element mounting substrate 6 placed on the heat radiating plate 3 can be provided with the light emitting element 8 with the area expanded to the vicinity of the central portion of the lighting device 1, and the brightness at the central portion of the light emitting surface of the lighting device 1. The thickness can be made uniform.

  Further, since the lighting circuit board 11 generates heat during operation, the ambient temperature of the space surrounded by the main body base 9 and the heat radiating plate 3 rises. At this time, if the volume of the space is small, the heat dissipation effect from the light emitting element mounting substrate 6 attached to the heat sink 3 is reduced, and therefore the heat sink 3 is more than the screw fixing portion 39 with the main body base 9. In the direction away from the main body base 9, that is, when mounted on the ceiling surface of the illuminating device, the volume of the housing space for the lighting circuit board 11 is ensured as a convex shape downward. Further, since the heat radiating plate 3 is manufactured by press-molding a metal plate, the convex shape has a mounting surface of the light emitting element mounting substrate 6, a screw fixing portion 39, a shade mounting tool 5, and a decorative frame mounting portion 38. The surface to be included is connected to the tapered surface 40. By providing the taper surface 40, the volume of the storage space of the lighting circuit board 11 and the area of the heat sink 3 can be increased, so that the light emission efficiency of the light emitting element 8 is high and the drawability of the heat sink 3 is good. A highly productive lighting device can be realized.

  The light emitting element mounting substrate 6 is fixed to the heat radiating plate 3 with a plurality of screws together with the translucent cover 4. Each light emitting element mounting substrate 6 is fixed to the heat radiating plate before the translucent cover 4 is attached by at least one screw. 3 is screwed directly. The screwing operation will be described with reference to FIGS. 19A to 19D and FIGS. 20A and 20B, which are partial enlarged views of a portion X in FIGS. First, the light emitting element mounting substrate 6 is placed in alignment with the substrate guide protrusions 27 provided on the heat dissipation plate 3. The guide protrusions 27 are linear portions adjacent to each other, that is, fan-shaped radii. The cross section is formed by extruding or cutting up the trapezoidal shape 30 or the semicircular shape 31 so as to fit in the gap of the straight line portion 35 corresponding to the direction. The height h of the extruded or cut-and-raised shape is smaller than the thickness of the light emitting element mounting substrate 6 so as not to interfere with the translucent cover 4 to be attached later. This is not necessarily the case if a relief shape is provided in the case. By these processing methods, the straight edge 33 of the shearing part can be formed in the case of extrusion, and the straight linear part 34 of the cut and raised surface can be formed in the case of cutting and raising. Therefore, as illustrated in FIG. 19D, the light emitting element mounting substrate on the R portion as shown in the “a” portion as compared with the case where the positioning portion 36 is formed by drawing processing that requires an R shape in manufacturing. There is no climbing of 6, and more accurate positioning is possible. The guide protrusions 27 are disposed on the heat sink 3 because the light guides 6 are disposed so as to fit between the straight portions adjacent to each other, that is, the fan-shaped straight portions 35 in the radial direction. The positioning operation is completed by moving the placed light emitting element mounting substrate 6 toward the center of the heat sink 3, and the subsequent screwing operation can be performed smoothly. In addition, after the work of directly screwing each light-emitting element mounting substrate 6 to the heat sink 3 with at least one screw, the connector 7 that connects the light-emitting element mounting substrates 6, the power connector a 16, and the power connector After connecting b <b> 17, the translucent cover 4 is screwed and fixed. However, since there is no displacement of the light emitting element mounting substrate 6 due to the rigidity of the wiring material of the plurality of connectors, the translucent cover 4 The screwing operation can be performed smoothly, and the productivity can be improved.

  In the present embodiment, the light emitting element mounting substrate 6 includes one having a power connector a16 and a power connector b17 connected to the lighting circuit substrate 11, and three having no two power connectors. The power connector a16 is used to supply power to the light emitting element 8 that operates normally, and the power connector b17 is used to supply power to the light emitting element 43 that operates only as a safety light. However, the configuration is limited to these configurations. It is not something. From the two power connectors, wiring (not shown) is connected to the lighting circuit board 11 through wiring holes 15 provided in the heat sink 3. FIG. 6 is a perspective view showing the installed state of the lighting circuit board 11 with the heat sink 3 removed. The lighting circuit board 11 is mounted on an insulating plate 10 formed of a resin material such as a flame retardant polypropylene, and is screwed and fixed to a main body base 9 formed of, for example, a metal plate. The outer edges of the board 10 are held by the board locking portions a28 and the board locking portions b42 protruding from the outer edge of the plate 10. A remote control light receiving element 45 covered with a remote control light receiving element cover 12 is disposed on the lighting circuit board 11, and receives an infrared signal from a remote control unit (not shown) operated by the user, and according to the signal. It is designed to control lighting. Further, a cylindrical tip opening 29 of the remote control light receiving element cover 12 faces a remote control light receiving hole 13 provided in the heat radiating plate 3, and an infrared remote control signal that has passed through the shade 2 and the translucent cover 4. Reaches the remote control light receiving element. Further, as shown in FIGS. 3 and 4, the remote control light receiving hole 13 is sandwiched between the C surface portions 44 of the outer shape of the adjacent light emitting element mounting substrate 6 when the light emitting element mounting substrate 6 is placed on the heat sink 3. It is arranged in the part. As for the arrangement of the remote control light receiving hole 13, for example, a hole may be formed at an arbitrary position of the light emitting element mounting substrate 6. However, since the arrangement of the light emitting element 8 on the substrate is restricted, the light emission is performed as in this embodiment. It is desirable to provide it outside the element mounting substrate 6. Further, even outside the light emitting element mounting substrate 6, for example, a light receiving hole can be provided in the tapered surface 40 of the heat radiating plate 3, but in that case, a cover member that covers the light receiving hole is separately required. It becomes. The remote control light receiving hole 13 is opened to a surface that is lower than the upper surface of the light emitting element 8, that is, the light emitting surface, by a sum of the height of the light emitting element 8 and the thickness of the light emitting element mounting substrate 6. Since it is located outside, it is hardly affected by the light flux from the light emitting element 8, and the reception performance of the remote control signal can be improved.

  Next, the external view of the translucent cover 4 is shown in FIG. In this part, a hemispherical portion 18, a power connector cover portion 19, a connector cover portion 20, and a remote control light receiving portion 21 are formed. In the present embodiment, the remote control light receiving portion 21 is formed with a cylindrical projection that fits into the remote control light receiving hole 13 formed in the heat radiating plate 3 so that the translucent cover 4 can be positioned during the screwing operation. Although it serves as well, it is not limited to this shape, For example, a simple plane may be sufficient. Furthermore, the remote control light-receiving unit 21 can be condensed in a hemispherical shape, or the surface of the part is subjected to, for example, a graining process to suppress signal reflection on the surface to further improve the reception performance. Is also possible.

  In this embodiment, the entire shape of the translucent cover 4 is a circle, and the entire part is configured to be point-symmetric with respect to the center point 22. It can be configured. In the present embodiment, the four light-transmitting covers 4 can be placed without worrying about the mounting direction of the light-transmitting cover 4 during the mounting operation, so that the working time can be shortened and the cause of failure such as an incorrect mounting direction of the components can be eliminated. In addition, by using a point-symmetric shape, distortion during molding can be reduced, and productivity can be improved.

  The hemispherical portion 18 covers one or a plurality of light emitting elements 8 as a set. FIG. 10 is a cross-sectional view of a single light emitting element 8, and FIG. 13 is an enlarged view of the hemispherical portion 18 in that case. The figure is shown. In the present embodiment, the central axis 24 of the hemispherical portion 18 is disposed so as to coincide with the center 23b of the light emitting portion. In this case, the center 23 b of the light emitting unit coincides with the center of the light emitting element 8. Since the refractive index of the translucent cover 4 has a constant refractive index that is larger than the refractive index of air (about 1.00), the luminous flux emitted from the light emitting element 8 is relative to the normal line of the hemispherical portion 18. When the light beam is incident at an angle θi, the angle θo when the light beam is emitted from the hemispherical portion 18 has a critical angle θc. The critical angle θc varies depending on the material of the translucent cover 4. For example, as a typical value, since the refractive index is about 1.59 for polycarbonate and about 1.49 for acrylic, the critical angle θc is about 39 ° to 42 °. The light beam emitted from the light emitting element 8 positioned substantially at the center of the hemispherical portion 18 enters the hemispherical portion 18 from a substantially normal direction, and θo is a value sufficiently smaller than the critical angle θc. Therefore, it is possible to avoid a reduction in luminous flux extraction efficiency due to total reflection at the outer interface between the translucent cover 4 and air.

  Next, FIG. 9 shows a cross-sectional view when two light emitting elements 8 are provided, and FIG. 12 shows an enlarged view of the hemispherical portion 18 in that case. The central axis 24 of the hemispherical portion 18 is arranged so as to coincide with the center 23a of the light emitting portion. The center 23 a of the light emitting part in this embodiment is a bisector of a straight line connecting the center points of the two light emitting elements 8. When covering two or more light emitting elements 8 as a set with the hemispherical shape 18, it is desirable that the distance between the centers of the respective light emitting elements 8 is sufficiently small with respect to the diameter of the hemispherical shape portion 18. There are dimensional restrictions when the hemispherical portion 18 is enlarged and restrictions such that heat dissipation is reduced when the distance between the centers of the pair of light emitting elements 8 is reduced. However, between the centers of the two light emitting elements 8, the θo that changes with the incident angle θi of the light beam emitted from each light emitting element 8 covered by the hemispherical portion 18 does not exceed the critical angle θc. By appropriately setting the distance and the diameter of the hemispherical portion 18, it is possible to obtain the same effect as in the case where the number of the light emitting elements 8 is one.

  FIG. 14 shows a case where three light emitting elements 8 are arranged on a straight line. The center 23c of the light emitting part in the present embodiment is the same as the above-described two light emitting elements 8 except that the center of the light emitting elements 8 arranged at equal intervals coincides with the center of the light emitting element 8 located at the center. This is the same as the case of one set. Further, FIG. 15 shows a case where three light emitting elements 8 are arranged so as to be the vertices of an equilateral triangle. In this case, the center 23d of the light emitting portion is the center of gravity of the equilateral triangle. According to the present embodiment, the diameter of the hemispherical portion 18 can be made smaller than when the light emitting elements 8 are arranged on a straight line.

  As described above, the case where 1 to 3 light emitting elements 8 are arranged in one hemispherical portion 18 is illustrated, but the same applies to the case where the number is further increased. That is, a plurality of light emitting elements 8 are arranged at the apex of the regular polygon and inside thereof, and the center of gravity of the polygon and the central axis 24 of the hemispherical portion 18 are configured to coincide with each other. The centers of the plurality of light emitting elements 8 are set so that θo that varies with the incident angle θi of the light emitted from each of the covered light emitting elements 8 does not exceed a critical angle θc that differs depending on the material of the translucent cover 4. A similar effect can be obtained by appropriately setting the distance and the diameter of the hemispherical portion 18.

  Further, FIG. 16 illustrates a case where the portion 18a covering the plurality of light emitting elements 8 has a semi-cylindrical shape having a ¼ spherical shape at both ends. In the present embodiment, a plurality of light emitting elements 8 arranged at equal intervals on a straight line are covered as a set, but as in the case of a hemispherical shape, a portion 18a covering the center 23c of the light emitting part and the light emitting element 8 is used. The symmetry axes 25 are configured to coincide with each other. However, as the cylindrical portion 37 becomes longer, the angle θi at which the light beam emitted from the light emitting element 8 disposed at both ends away from the center 23c of the light emitting portion enters the cylindrical portion 37 increases. Therefore, θo exceeds the critical angle θc and is totally reflected, and the light beam extraction efficiency is lowered. Therefore, in the present embodiment, the distance between the centers of the plurality of light emitting elements 8 is shortened and the diameters of the ¼ spherical portions at both ends are increased so that the semicylindrical portion 37 is as short as possible. Etc. need to be set.

  In addition, when the plurality of light emitting elements 8 are combined and covered with a hemispherical portion 18 or a semicylindrical portion 18a having a quarter sphere shape at both ends, the light emitting elements 8 having different emission colors can be configured. It is.

  Next, FIG. 17 shows a cross-sectional view when a plurality of adjacent hemispherical portions 18 interfere with each other. A light beam emitted from the light emitting element 8 with a radiation angle α related to the characteristics of the light emitting element 8 enters the hemispherical portion 18. When adjacent hemispherical portions 18 interfere with each other as in the present embodiment, the outer edges 26 of the portions where the hemispherical portions interfere with each other are the central axis 24 of each hemispherical portion 18 and the center 23a of the light emitting portion. Is preferably located outside the emission angle α of each light emitting element 8 arranged so as to substantially coincide with each other. FIG. 18 illustrates a case where the outer edge 26 of a portion where adjacent hemispherical portions interfere with each other is located inside the radiation angle α of each light emitting element 8. In this case, since the light beam emitted from the light emitting element 8 passes through the interference shape portion between the hemispherical portions 18 and enters the adjacent hemispherical portions 18 at a large angle, θo exceeds the critical angle θc. It is conceivable that the extraction efficiency of the light beam decreases due to total reflection.

  FIG. 21B shows another embodiment of the cross section of the hemispherical portion 18. In the present embodiment, the center of the radius of curvature Ri inside the hemispherical portion 18 and the center of the radius of curvature Ro of the outer side are shifted, so that the thickness tE near the equator rather than the thickness tV near the apex of the hemispherical shape. Is an example. Compared with the case of FIG. 21A in which the wall thickness is uniform, the incident angle θo of the light beam emitted from the light emitting element 8 to the outer interface of the hemispherical portion 18 becomes larger, so that the light beam can be spread over a wider range. In this case, however, it is necessary to make θo smaller than the critical angle θc. FIG. 21C shows an example in which the wall thickness tE near the equator is smaller than the wall thickness tV near the hemispherical apex. In this case, contrary to the above, θo becomes small and the light flux can be collected in a narrower range. Further, FIG. 21 (d) shows an example in which the inside is a hemisphere and the outside is a cubic curved surface such as a part of a surface made of a paraboloid or an elliptic rotating body. In this case as well, the center of the radius of curvature Ri inside the hemispherical portion 18 described above can be controlled in terms of concentration and diffusion by the relationship between the thickness tV near the apex and the thickness tE near the equator. Is the same as shifting the center of the outer curvature radius Ro. The same applies to a case where the inside is a cubic surface such as a paraboloid or a part of a surface made of an elliptical rotating body and the outside is a hemisphere. As described above, by changing the thickness of the hemispherical portion 18 and controlling the incident angle θo to the outer interface of the hemispherical portion 18, it is possible to obtain a light distribution characteristic according to the purpose of the lighting device. .

  Next, the dimensions of the translucent cover 4 in the present embodiment are exemplified by an outer diameter of 395 mm, a resin thickness of 1.5 mm, and a hemispherical portion height of 12 mm. Further, as shown in FIG. 8, a total of about 100 power connector cover portions 19, connector cover portions 20, hemispherical portions 18, etc. are formed over the entire surface of the translucent cover 4. Therefore, the translucent cover 4 has higher rigidity than that of a simple flat shape, and the translucent cover 4 is screwed and fixed to the heat radiating plate 3 from above the light emitting element mounting substrate 6. Thus, warpage and deformation of the light emitting element mounting substrate 6 can be reduced. In addition, the light emitting element 8 is corrected to an appropriate position with respect to the translucent cover 8, and the adhesion of the light emitting element mounting substrate 6 to the heat radiating plate 3 is increased and the heat dissipation is improved, so that the light emitting surface is uniform. A lighting device with high luminous efficiency of the light emitting element 8 can be realized.

  As described above, according to the present embodiment, in the lighting fixture having the heat sink 3 on which the light emitting element mounting substrate 6 is disposed and the main body base 9 on which the lighting circuit substrate 11 is disposed, the heat sink 3 Is a structure in which the lighting circuit board 11 is surrounded by the main body base 9 and the heat radiating plate 3 by having a structure which is convex in a direction away from the main body base 9 rather than the screw fixing portion 39 with the main body base 9. Since the light emitting element mounting substrate 6 can be disposed near the center of the lighting device 1, it is possible to provide a lighting device in which the brightness at the center of the light emitting surface is uniform.

  In addition, the heat sink 3 is formed in a projecting shape in a direction away from the main body base 9 rather than the screw fixing portion 39 with the main body base 9, so that the main body base 9 containing the lighting circuit board 11 is accommodated. The volume of the space surrounded by the heat radiating plate 3 can be increased, and the increase in the ambient temperature of the space can be reduced. As a result, the heat radiation efficiency from the light emitting element mounting substrate 6 attached to the heat radiating plate 3 is improved, and the light extraction efficiency from the light emitting element 8 can be improved.

  Further, the surface of the heat radiating plate 3 on which the light emitting element mounting substrate 6 is disposed and the surface including the screw fixing portion 39, the shade fixture 5, and the decorative frame attachment portion 38 with the main body base 9 are tapered surfaces 40. By making the shape connected, the volume of the storage space of the lighting circuit board 11 and the area of the heat sink can be increased, so that the light emission efficiency of the light emitting element 8 is high and the drawability of the heat sink 3 is good. A highly productive lighting device can be realized.

DESCRIPTION OF SYMBOLS 1 Illuminating device 2 Sed 3 Heat sink 4 Translucent cover 5 Sed fixture 6 Light emitting element mounting board 7 Connector 8 Semiconductor light emitting element (light emitting element)
9 Main body base 10 Insulating plate 11 Lighting circuit board 12 Remote control light receiving element cover 13 Remote control light receiving hole 14 Instrument mounting portion 15 Wiring hole 16 Power connector a (wiring material not shown)
17 Power connector b (wiring material not shown)
18 Hemispherical portion 18a Semicylindrical portion having a 1/4 spherical shape at both ends 19 Power connector cover portion 20 Connector cover portion 21 Remote control light receiving portion 22 Center points 23a, 23b, 23c, 23d Light emitting portion center 24 Hemispherical center Axis 25 Symmetrical axis 26 Outer edge 27 of portion where hemispherical portions interfere with each other Substrate guide protrusion 28 Substrate locking portion a
Reference numeral 29: tip opening 30: trapezoidal extrusion 31: semicircular extrusion 32: cut and raised 33: straight edge 34 of the sheared portion by extrusion 34: a straight linear portion 35 of the flat surface caused by the cut and raised: 36: linear portion 36 corresponding to the fan-shaped radial direction Positioning portion 37 by machining Cylindrical shape portion 38 Decorative frame attachment portion 39 Screw fixing portion 40 Tapered surface 41 Power supply connector 42 Board locking portion b
43 Light-emitting element (for security light)
44 C surface portion 45 Remote control light receiving element

Claims (2)

A main body base having an instrument mounting portion;
A heat dissipating plate fixed to the main body base,
A lighting circuit board housed in a space surrounded by the main body base and the heat sink;
A light emitting element fed from the lighting circuit board is disposed, and a light emitting element mounting board attached to the heat sink,
A shade held by the shade fixture;
A lighting device comprising: A main body base having an instrument mounting portion;
A light emitting element mounting substrate on which the light emitting element is disposed;
A heat sink that is fixed to the main body base, has a convex shape with a surface on which the light emitting element mounting substrate is attached on the inside, a surface that has a shade attachment on the outside, and a surface that connects these surfaces;
A lighting circuit board that is housed in a space surrounded by the main body base and the heat sink and feeds power to the light emitting element,
A shade held by the shade fixture so as to cover the light emitting element mounting substrate and the shade fixture;
A lighting device comprising:

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