JP6846771B2 - Molding method and molding equipment - Google Patents

Description

The present invention relates to a molding method and a molding apparatus.

An injection molding method has been proposed using a resin heating / melting device that heats a solid resin material using microwaves and sequentially discharges it, a mold, and a mold clamping device that clamps the mold (for example). See Patent Document 1). In the injection molding method described in Patent Document 1, the loss of using the resin injection molding machine is improved by sequentially discharging the molten resin directly to the mold. In this type of injection molding method, the molten resin discharged from the resin heating and melting device is filled into the cavity of the mold molded by the mold clamping device through a spool runner provided in the mold.

In addition, by partitioning the cavity with a plurality of molds and arranging a narrow portion having a short distance between mold surfaces and a wide portion having a longer distance between mold surfaces than the narrow portion in the cavity, injection molding is performed to spread the resin throughout the cavity. A method has been proposed (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2014-113699 Japanese Unexamined Patent Publication No. 2004-358884

However, in the injection molding method as in Patent Document 1, a molded product is produced by sequentially discharging the molten resin from the molten resin inlet portion of the mold into the cavity of the mold, so that the mold due to the flow resistance of the molten resin It is necessary to design the molded product in a dimensional shape that takes into consideration the lack of penetration into details. For example, the size of the molten resin inlet side is made larger than the required strength of the molded product, which is a problem of general injection molding methods. The problem of restrictions on the shape design of molded products, such as consideration of the flow resistance of molten resin materials, could not be solved. Further, the injection molding method as in Patent Document 2 has not completely solved the same problem.

The present invention has been made in view of the above reasons, and an object of the present invention is to provide a molding method and a molding apparatus that expand the degree of freedom in the shape of a molded product.

In order to achieve the above object, the molding method according to the present invention
The first step of inserting the resin material between the first mold and the second mold, and
The second step of heating and melting the resin material by irradiating the resin material with microwaves, and
A third step of pressurizing and solidifying the molten resin material by bringing the first mold and the second mold close to each other and abutting the first mold and the second mold.
The present invention includes a fourth step of taking out a molded product formed from the resin material by separating the first mold and the second mold.

The molding apparatus according to the present invention from another viewpoint is
1st mold and
The second mold and
A microwave irradiation unit that melts the resin material by irradiating the resin material inserted between the first mold and the second mold with microwaves.
It is provided with a mold clamping portion that pressurizes the resin material by bringing the first mold and the second mold close to each other and abutting the first mold and the second mold.

By the way, in the conventional resin injection molding method, the viscosity of the molten resin is high, and the flow resistance entering the cavity of the mold is high, so that it is difficult to reach the details. On the other hand, according to the present invention, a solid resin material is put between the first mold and the second mold, and then the resin material is heated and melted by irradiating the resin material with microwaves. After that, the first mold and the second mold are abutted against each other to pressurize and solidify the resin material. That is, after the solid resin material is put between the first mold and the second mold, the resin material is heated and melted between the first mold and the second mold. This makes it much easier to fill the details in the cavity with the resin material. Therefore, since the shape of the molded product is not limited to the shape in consideration of the flow resistance of the molten resin material, there is an advantage that the degree of freedom in shape design of the molded product is expanded. In addition, the resin material can be saved.

It is a schematic block diagram of the molding apparatus which concerns on Embodiment 1 of this invention. It is a flowchart which shows an example of the flow of the molding method using the molding apparatus which concerns on Embodiment 1. FIG. It is a figure for demonstrating the material addition process which concerns on Embodiment 1. FIG. It is a figure for demonstrating the heating process which concerns on Embodiment 1. FIG. It is a figure for demonstrating the pressurization / solidification process which concerns on Embodiment 1. FIG. It is a figure for demonstrating the mold release process which concerns on Embodiment 1. FIG. It is a schematic block diagram of the molding apparatus which concerns on Embodiment 2 of this invention. It is a figure for demonstrating the material addition process which concerns on Embodiment 2. FIG. It is a figure for demonstrating the heating process which concerns on Embodiment 2. It is a figure for demonstrating the pressurization / solidification process which concerns on Embodiment 2. It is a figure for demonstrating the mold release process which concerns on Embodiment 2. It is a schematic block diagram of the molding apparatus which concerns on Embodiment 3 of this invention. It is a figure for demonstrating the material input process which concerns on Embodiment 3. It is a figure for demonstrating the heating process which concerns on Embodiment 3. It is a figure for demonstrating the pressurization / solidification process which concerns on Embodiment 3. It is a figure for demonstrating the mold release process which concerns on Embodiment 3. It is a schematic block diagram of the molding apparatus which concerns on a modification. It is a figure for demonstrating the pressurization / solidification process which concerns on a modification. It is a figure for demonstrating the material addition process which concerns on a modification, (A) is a figure which shows the state which the base material is arranged in the recess of the movable mold, (B) is the resin material in the cavity of a mold assembly. It is a figure which shows the state of putting in. It is a figure for demonstrating the material charging process which concerns on a modification, (A) is a figure which shows the state of charging resin material into the recess of a movable mold, and (B) is the figure which is charged into the recess of a movable mold. It is a figure which shows the state which the base material is placed on the resin material. It is a figure for demonstrating the material addition process which concerns on a modification. It is a figure for demonstrating the material charging process which concerns on a modification, (A) is a figure which shows the state of charging resin material into the recess of a movable mold, and (B) is the figure which is charged into the recess of a movable mold. It is a figure which shows the state which the base material is placed on the resin material. It is a figure for demonstrating the material input process which concerns on a modification. It is a figure for demonstrating the material addition process which concerns on a modification. It is a figure for demonstrating the material addition process which concerns on a modification, (A) is a figure which shows the state which the base material is placed on the resin material, (B) is the figure which makes the base material two resin materials. It is a figure which shows the sandwiched state.

(Embodiment 1)
Hereinafter, the molding apparatus according to the embodiment of the present invention will be described with reference to the drawings.

In the molding apparatus according to the present embodiment, the cavity formed by the two molds arranged with a gap is filled with a solid resin material, and then the resin material filled in the cavity is heated by microwaves. And melt. Then, the molding apparatus produces a molded product by abutting the two molds while controlling the temperature and solidifying the molten resin material.

As shown in FIG. 1, the molding apparatus 1 according to the present embodiment includes a movable platen 10, a mold assembly 11, a microwave irradiation unit 15, a temperature control unit 17, a suction unit 19, a fixed platen 21, and a mold clamping unit 22. A mold elevating part (mold holding part) 25, a hopper 26, and a shield (shielding part) 27 are provided.

The hopper 26 stores a solid resin material to be supplied to the mold assembly 11. As the solid resin material, for example, a pellet material or a flake material can be adopted. In the case of pellets, the average particle size is, for example, about several μm to several mm. Further, as the type of resin material, for example, thermoplastic resins such as PP, PS, ABS, PE, PA, PBT, PET, POM, and PPS can be adopted.

The mold set 11 is composed of a metal movable mold (first mold) 12 and a fixed mold (second mold) 13. The movable mold 12 and the fixed mold 13 are formed with an uneven structure corresponding to the shape of the molded product to be manufactured. In the example shown in FIG. 1, a convex portion 121 is formed in the movable mold 12, and a concave portion 131 is formed in the fixed mold 13. Then, in a state where the movable mold 12 and the fixed mold 13 are butted against each other, one cavity 111 is formed between the movable mold 12 and the fixed mold 13. The cavity 111 corresponds to a space filled with a resin material between the movable mold 12 and the fixed mold 13 arranged so as to face each other. The movable mold 12 is provided with a suction port 122 for communicating with the cavity 111 and sucking the gas existing in the cavity 111, and an exhaust passage 123 communicating with the suction port 122. The fixed mold 13 is provided with a plurality of through holes 132 that penetrate from the upper wall surface of the fixed mold 13 to the cavity 111. The diameter of the minimum diameter portion of the through hole 132 is set to a size that allows the resin material (for example, pellet material or flake material) to pass through. The diameter of the minimum diameter portion of the through hole 132 is set to, for example, about several mm. In this embodiment, an example in which the fixed mold 13 is provided with a plurality of through holes 132 is described, but the fixed mold 13 is provided with only one through hole 132. You may. Further, the fixing mold 13 has a metal lid 134 provided at the lower end of the through hole 132, and a drive mechanism (not shown) for driving the lid 134. The lid 134 is immersed in the fixing mold 13 from the inner wall of the through hole 132 by the drive mechanism to open the through hole 132. On the other hand, the lid body 134 closes the through hole 132 by protruding from the inner wall of the through hole 132 by the drive mechanism. Further, a flange portion 133 overhanging to the side is provided at an end portion of the fixed mold 13 on the side opposite to the side facing the movable mold 12.

The microwave irradiation unit 15 has a high frequency generator 151 and a waveguide 152. The high frequency generator 151 is a so-called magnetron and generates microwaves. The high frequency frequency generated by the high frequency generator 151 is set to, for example, 0.902 to 24.25 GHz band. The high frequency is appropriately selected according to the type of resin used. The waveguide 152 is formed of a metal that is a conductor, and guides microwaves generated by the high frequency generator 151. The microwave irradiation unit 15 is arranged at a position where microwaves can be irradiated from above the mold assembly 11. The microwave irradiation unit 15 irradiates the cavity 111 with microwaves through the through hole 132 provided in the fixed mold 13. The shape of the through hole 132 is determined by comprehensively considering the ease of removal from the fixed mold 13 at the time of mold release, the shape of the molded product, the resin material used, the microwave used, and the like.

The temperature control unit 17 has a temperature control unit main body 171 and a heat medium tube 172. The temperature control unit main body 171 has a compressor (not shown) and a heat exchanger (not shown), and is via a heat medium flowing through a heat medium tube 172 to cool the resin material after pressure molding. The temperature of the mold assembly 11 is adjusted. Here, the temperature control unit 17 adjusts the temperature of the mold assembly 11 so as to have a specified temperature (for example, 80 ° C.) lower than the melting point of the resin material and higher than the normal temperature. The temperature control unit 17 may be configured to control the temperature at a temperature below room temperature. Further, in order to control the temperature of the mold set 11, a heater such as a cartridge heater may be installed in the mold set 11 instead of the heat medium.

The suction unit 19 has a vacuum pump 191 and an exhaust pipe 192. The suction unit 19 sucks the gas in the cavity 111 of the mold assembly 11 by driving the vacuum pump 191 in a state where the exhaust pipe 192 is connected to the exhaust passage 123 formed in the movable mold 12. Further, the suction port 122 is provided with a member (not shown) formed of, for example, a porous metal inside, and is located between the exhaust passage 123 and the cavity 111. This prevents the resin material from entering the exhaust passage 123.

The fixed platen 21 comes into contact with the fixed mold 13 of the mold assembly 11. A movable mold 12 is attached to the movable platen 10.

The mold clamping portion 22 includes a mold clamping portion main body 221 and a pressing mechanism 222 for pressing the mold clamping portion main body 221 and the mold assembly 11 toward the fixed platen 21, and a tie bar 223. The mold clamping portion main body 221 incorporates an electric or hydraulic drive mechanism that drives the pressing mechanism 222. The pressing mechanism 222 is movable in a direction of projecting and a direction of immersion with respect to the mold clamping portion main body 221 (see arrow AR10 in FIG. 1). The tie bar 223 is erected on the side where the pressing mechanism 222 of the mold clamping portion main body 221 collides. A fixed platen 21 is fixed to the tie bar 223 at a distance from the mold clamping portion main body 221.

The mold elevating part 25 holds the flange portion 133 of the fixed mold 13 and raises and lowers the fixed mold 13. Further, the mold elevating portion 25 can hold the movable mold 12 in a state where the movable mold 12 is separated from the fixed mold 13 by a preset distance.

The shield 27 is composed of, for example, a metal box, and shields microwaves emitted from the microwave irradiation unit 15. The shield 27 covers the movable mold 12, the fixed mold 13, and the microwave irradiation unit 15.

The movable platen 10, the mold assembly 11, and the mold elevating part 25 constitute a movable unit U1 that is movable between a charging position, a heating position, and a pressurizing position (see arrow AR0 in FIG. 1). There is. Here, the charging position is a position where the solid resin material is charged from the hopper 26 into the cavity 111 of the mold assembly 11. The heating position is a position where the microwave irradiation unit 15 heats the resin material filled in the cavity 111 of the mold assembly 11. The pressurizing position is determined by pressing the movable platen 10 to which the movable mold 12 is attached to the fixed platen 21 which is brought into contact with the fixed mold 13 by the mold clamping portion 22 in a direction in which the movable platen 10 is brought closer to the cavity of the mold assembly 11. This is the position where the resin material filled in 111 is pressed.

Next, a molding method using the molding apparatus 1 according to the present embodiment will be described with reference to FIGS. 2 to 6. In this molding method, as shown in FIG. 2, a material charging step, a heating step, a pressurizing / solidifying step, and a mold release step are executed in order. First, a material charging step (first step) of charging a solid resin material between the movable mold 12 and the fixed mold 13 is executed (step S101). Specifically, the movable mold 12 and the fixed mold 13 are arranged so as to be separated by a gap G1. Here, the mold elevating portion 25 is a fixed mold in a state where a gap G1 is formed in the contact surfaces 12a and 13a of the movable mold 12 and the fixed mold 13 which are in contact with each other in the pressurizing / solidifying step. Holds 13. The distance W1 of the gap G1 is appropriately set according to the type of the molded product to be manufactured. Then, in this state, the movable unit U1 is moved to the charging position, and as shown in FIG. 3, the solid resin material M1 is charged into the cavity 111 from the hopper 26 through the through hole 132 provided in the fixed mold 13. (See arrow AR1 in FIG. 3). At this time, the molding apparatus 1 sucks the resin material M1 charged into the cavity 111 through the suction port 122 and the exhaust passage 123 by the suction unit 19 (see arrow AR2 in FIG. 3). As a result, the solid resin material M1 can be evenly distributed to every corner of the cavity 111.

Returning to FIG. 2, next, the resin material inserted between the movable mold 12 and the fixed mold 13, that is, the resin material filled in the cavity 111 is heated by irradiating the resin material with microwaves. The melting heating step (second step) is executed (step S102). In this step, after the movable unit U1 is moved to the heating position, the molding apparatus 1 is made of a resin material through the through hole 132 provided in the fixed mold 13 by the microwave irradiation unit 15 as shown in FIG. Irradiate M2 with microwaves (see arrow AR3 in FIG. 4). As a result, the resin material M2 in the cavity 111 is heated and melted by the interaction between the molecules constituting the resin material M2 and the microwave. In this step, for example, based on the type of the resin material M2 charged into the cavity 111, the size of the cavity 111, the entire resin material M2 charged into the cavity 111 (weight), and the like, a microwave is used for a predetermined time. Irradiate the waves. At this time, the gas generated when the resin material is melted is discharged from the through hole 132 of the fixed mold 13 to the outside of the mold assembly 11 (see arrow AR4 in FIG. 4). Further, the molding apparatus 1 sucks the gas generated from the resin material M2 melted in the cavity 111 through the suction port 122 and the exhaust passage 123 by the suction unit 19 (see arrow AR5 in FIG. 4). As a result, the generation of voids in the molded product is suppressed.

Returning to FIG. 2, subsequently, the movable mold 12 is brought close to the fixed mold 13 and the movable mold 12 and the fixed mold 13 are abutted against each other to control the temperature while pressurizing the molten resin material. -The solidification step (third step) is executed (step S103). In this step, as shown in FIG. 5, the molding apparatus 1 closes the through hole 132 of the fixed mold 13 with the lid 134, and then moves the movable unit U1 to the pressurizing position. Then, as shown in FIG. 5, the molding apparatus 1 presses the mold assembly 11 against the fixed platen 21 with a preset pressure by the pressing mechanism 222 of the mold clamping portion 22 (see arrow AR6 in FIG. 5). Here, the molding apparatus 1 abuts the contact surfaces 12a and 13a of the movable mold 12 and the fixed mold 13 while pressurizing the resin material M3 in the cavity 111. Further, the molding apparatus 1 adjusts the temperature of the mold assembly 11 to a preset temperature lower than the solidification temperature of the resin material by the temperature adjusting unit 17. As a result, the resin material M3 in the cavity 111 is pressurized and solidified. Further, the molding apparatus 1 sucks the gas generated when the resin material M3 is pressed through the through hole 132 of the fixed mold 13 by the suction unit 19 (see the arrow AR7 in FIG. 5). As a result, molding defects in the molded product and generation of voids in the molded product due to shrinkage due to solidification of the resin material M3 are suppressed.

Returning to FIG. 2, after the resin material M3 is solidified, the mold release step (fourth step) of taking out the molded product formed from the resin material is executed by separating the movable mold 12 and the fixed mold 13. (Step S104). In this step, the molding apparatus 1 moves the movable unit U1 out of the pressurizing position, and then separates the fixed mold 13 and the movable mold 12 by the mold elevating portion 25 as shown in FIG. (See arrow AR8 in FIG. 6). Then, the molded product P1 placed on the movable mold 12 is taken out (see the arrow AR9 in FIG. 6).

By the way, in the conventional resin injection molding method, the viscosity of the molten resin is high, and the flow resistance entering the cavity of the mold is high, so that it is difficult to reach the details. On the other hand, according to the molding method according to the present embodiment, after the solid resin material is put between the movable mold 12 and the fixed mold 13, the movable mold 12 and the fixed mold 13 are combined. The resin material is heated and melted between them. This makes it much easier to fill the details inside the cavity 111 with the resin material. Therefore, since the shape of the molded product is not limited to the shape in consideration of the flow resistance of the molten resin material, there is an advantage that the degree of freedom in shape design of the molded product is expanded. In addition, the resin material can be saved.

Further, in the conventional resin injection molding, if there is a fine-shaped portion having a fine shape in a portion away from the injection portion of the cavity, there is a concern that the resin material does not sufficiently spread to the fine-shaped portion and molding defects occur. was there. On the other hand, according to the molding method according to the present embodiment, since the resin material is put into the cavity 111 in advance and then heated and melted, the details of the cavity 111 due to the flow resistance of the resin material are reduced as compared with the conventional resin injection molding. There is little concern about insufficient entry of resin, and the occurrence of molding defects is suppressed.

Further, in the conventional resin injection molding, when a resin material containing particularly long fibers such as glass fiber and carbon fiber is used, breakage of these fibers occurs when the resin enters the cavity details of the mold. There was an effect on the strength or rigidity of the part. On the other hand, according to the molding method according to the present embodiment, breakage of these fibers can be prevented, so that at least one of the strength and rigidity of the molded product can be improved.

Further, according to the molding apparatus 1 according to the present embodiment, the resin material filled in the cavity 111 is melted by dielectric heating using microwaves. As a result, the molding apparatus 1 has a reduced heat energy loss and good heating efficiency as compared with a configuration in which the resin material is melted by indirect heating such as heat conduction, heat transfer, and heat radiation. Therefore, when the same amount of resin material is heated and melted, the molding apparatus 1 has an advantage that it can be miniaturized as compared with the above-mentioned configuration in which the resin material is melted by indirect heating such as heat conduction, heat transfer, and heat radiation. ..

Further, the molding method according to the present embodiment is a molding method that does not require an expensive injection molding machine, and has an advantage that equipment cost and space saving can be remarkably achieved.

Further, in the heating step according to the present embodiment, the movable mold 12 and the fixed mold 13 are opposed to each other, so that the cavity is a space for filling the resin material between the movable mold 12 and the fixed mold 13. With the 111 formed, the resin material M2 is irradiated with microwaves through the through holes 132 provided in the fixed mold 13. Further, in the material charging step, the resin material is charged into the cavity 111 through the through hole 132 provided in the fixed mold 13. That is, the through hole 132 is used for both the injection of the resin material M1 and the irradiation of the resin material M2 with microwaves. As a result, the number of through holes 132 provided in the fixed mold 13 can be reduced, so that the strength of the fixed mold 13 can be increased.

Further, the molding apparatus 1 according to the present embodiment is a suction unit that sucks gas in the cavity 111 of the mold assembly 11 in a state where the exhaust pipe 192 is connected to the exhaust passage 123 formed in the movable mold 12. 19 is provided. Then, in the material charging step, the suction unit 19 sucks the solid resin material M1 charged into the cavity 111 through the suction port 122 and the exhaust passage 123. As a result, the solid resin material M1 can be easily distributed throughout the cavity 111, and the occurrence of molding defects can be reduced accordingly. Further, in the heating step, the suction unit 19 sucks the gas generated from the resin material M2 melted in the cavity 111 through the suction port 122 and the exhaust passage 123. As a result, the amount of gas entrained in the resin material M2 filled in the cavity 111 is reduced, so that the generation of voids in the molded product can be suppressed, and the quality of the molded product can be improved.

Further, in the material charging step according to the present embodiment, the mold elevating portion 25 is between the contact surfaces 12a and 13a that are brought into contact with each other in the pressurizing / solidifying step of the movable mold 12 and the fixed mold 13. The fixed mold 13 is held in a state where the gap G1 is generated. In this state, the solid resin material M1 is charged into the cavity 111. On the other hand, in the pressurizing / solidifying step, the mold clamping portion 22 brings the contact surfaces 12a and 13a of the movable mold 12 and the fixed mold 13 into contact with each other to pressurize the resin material M3 in the cavity 111. As a result, by appropriately setting the distance of the gap G1 according to the type and size of the molded product to be manufactured, it is possible to suppress the occurrence of molding defects due to shrinkage of the resin material in the pressurization / solidification step.

Further, the molding apparatus 1 according to the present embodiment includes a movable mold 12, a fixed mold 13, and a shield 27 that covers the microwave irradiation unit 15. As a result, the influence of the microwave emitted from the microwave irradiation unit 15 on the external device arranged around the molding apparatus 1 is reduced.

(Embodiment 2)
In the first embodiment, an example in which the solid resin material M1 is supplied through the through hole 132 of the fixed mold 13 has been described. On the other hand, in the molding method according to the present embodiment, the fixed mold is arranged vertically below the movable mold, and the solid resin material is placed on the fixed mold. Then, the resin material is heated by microwaves in a state where the fixed mold and the movable mold are separated from each other to be melted, and then the fixed mold and the movable mold are abutted against each other and solidified to generate a molded product. ..

As shown in FIG. 7, the molding apparatus 2 according to the present embodiment includes a movable platen 10, a mold assembly 2011, a microwave irradiation unit 15, a temperature control unit 17, a fixed platen 21, a mold clamping unit 22, and a shield 27. , Equipped with. In FIG. 7, the same reference numerals as those in FIG. 1 are attached to the same configurations as those in the first embodiment.

The mold assembly 2011 is composed of a metal movable mold (second mold) 2012 and a fixed mold (first mold) 2013. The fixed mold 2013 is arranged vertically below the movable mold 2012. The movable mold 2012 is formed with a concave portion 2121, and the fixed mold 2013 is formed with a convex portion 2131. Then, in a state where the movable mold 2012 and the fixed mold 2013 are butted against each other, one cavity 2111 is formed between the movable mold 2012 and the fixed mold 2013. The movable mold 2012 is fixed to the movable platen 10, and the fixed mold 2013 is fixed to the fixed platen 21. The microwave irradiation unit 15 is arranged at a position where microwaves can be irradiated from the side of the mold assembly 2011.

Next, a molding method using the molding apparatus 2 according to the present embodiment will be described with reference to FIGS. 8 to 11. The molding method according to the present embodiment is executed in the order of the material charging step, the heating step, the pressurizing / solidifying step, and the mold release step, similarly to the molding method described with reference to FIG. 2 in the first embodiment.

First, in the material charging step, as shown in FIG. 8, the molding apparatus 2 immerses the pressing mechanism 222 of the mold clamping portion 22 into the mold clamping portion main body 221 (see the arrow AR201 in FIG. 8), whereby the movable mold is formed. Separate the 2012 and the fixed mold 2013. Then, the solid resin material M201 is placed at a predetermined position of the fixed mold 2013 with the movable mold 2012 and the fixed mold 2013 separated from each other (see arrow AR202 in FIG. 8). Further, the solid resin material M201 may be placed on the fixed mold 2013 by, for example, a transport device (not shown) for transporting the solid resin material.

Next, in the heating step, as shown in FIG. 9, in the state where the movable mold 2012 and the fixed mold 2013 are separated from each other, the microwave irradiation unit 15 causes the movable mold 2012 and the fixed mold 2013 to be separated from each other. The resin material M202 is irradiated with microwaves from the lateral gaps of 2013 (see arrow AR203 in FIG. 9). As a result, the resin material M202 placed on the fixed mold 2013 is heated and melted. At this time, the gas generated when the resin material melts is released to the sides of the movable mold 2012 and the fixed mold 2013.

Subsequently, in the pressurizing / solidifying step, as shown in FIG. 10, the molding apparatus 2 causes the pressing mechanism 222 of the mold clamping portion 22 to protrude from the mold clamping portion main body 221 to move the movable platen 10 to the fixed platen 21. Get closer. Then, the molding apparatus 2 pressurizes and crushes the resin material M203 by the movable mold 2012 and the fixed mold 2013 (see arrow AR204 in FIG. 10). At this time, the resin material M203 is crushed and spreads to every corner in the cavity 2111 of the mold assembly 2011. Further, the molding apparatus 2 adjusts the temperature of the mold assembly 2011 to a preset temperature by the temperature adjusting unit 17. As a result, the resin material M203 in the cavity 2111 solidifies. As a result, molding defects of the molded product due to shrinkage of the resin material M203 due to solidification are suppressed.

After that, in the mold release step, as shown in FIG. 11, the molding apparatus 2 immerses the pressing mechanism 222 of the mold clamping portion 22 into the mold clamping portion main body 221 (see the arrow AR205 in FIG. 11), whereby the movable mold is formed. Separate the 2012 and the fixed mold 2013. Then, the molded product P2 placed on the fixed mold 2013 is taken out (see arrow AR206 in FIG. 11).

As described above, according to the molding apparatus 2 according to the present embodiment, in the material charging step, the solid resin material is pressed into the fixed mold 2013 with the movable mold 2012 and the fixed mold 2013 separated from each other. Place in place. Then, in the heating step, the microwave irradiation unit 15 irradiates the resin material with microwaves from the separated gaps in a state where the movable mold 2012 and the fixed mold 2013 are separated from each other. As a result, it is not necessary to move the mold assembly 2011 according to each of the material charging step, the heating step, and the pressurizing / solidifying step. As a result, the structure of the molding apparatus 2 can be simplified as compared with the molding apparatus 1 according to the first embodiment, so that the entire apparatus can be miniaturized.

By the way, in the case of the conventional molding method, for example, Japanese Patent Publication No. 3-33492 provides a press molding method for a thermoplastic resin in which a sheet or film similar to the molten thermoplastic resin is installed in advance on the mold surface. Has been done. However, in this type of molding method, since the material cannot be melted on the mold, it is necessary to place the previously melted material on the mold. However, the molding accuracy was not good because the position accuracy when placing it on the mold was not obtained. On the other hand, in the case of the molding method according to the present embodiment, since the solid resin material can be placed in a predetermined position on the fixed mold 2013 and then melted, a molded product with good molding accuracy can be obtained. Can be manufactured.

(Embodiment 3)
In the first embodiment, an example of the molding apparatus 1 having the movable unit U1 movable between the charging position, the heating position, and the pressurizing position has been described. On the other hand, in the molding apparatus according to the present embodiment, the movable platen and the mold clamping portion are arranged vertically above the fixed platen. Then, in the molding method according to the present embodiment, the resin material is charged and the resin material is irradiated with microwaves in a state where the mold assembly is arranged between the fixed platen and the movable platen.

As shown in FIG. 12, the molding apparatus 3 according to the present embodiment includes a movable platen 3010, a mold set 3011, a microwave irradiation unit 15, a temperature control unit 17, a fixed platen 21, a mold clamping unit 3022, and a hopper 26. It is provided with a shield 27. In FIG. 12, the same reference numerals as those in FIG. 1 are attached to the same configurations as those in the first embodiment.

The mold set 3011 is composed of a metal movable mold (second mold) 3012 and a fixed mold (first mold) 3013. The fixed mold 3013 is arranged vertically below the movable mold 3012. The movable mold 3012 is formed with a concave portion 3121, and the fixed mold 3013 is formed with a convex portion 3131. Then, in a state where the movable mold 3012 and the fixed mold 3013 are butted against each other, the cavity 3111 is formed between the movable mold 3012 and the fixed mold 3013. The movable mold 3012 is provided with a plurality of through holes 3122 that penetrate the cavity 3111 from the upper wall surface of the movable mold 3012. A metal lid 3124 is provided at the lower end of the through hole 3122. The fixed mold 3013 is formed with a suction port 122 and an exhaust passage 123 as in the movable mold 12 according to the first embodiment. The movable mold 3012 is fixed to the movable platen 3010, and the fixed mold 3013 is fixed to the fixed platen 21.

The movable platen 3010 is provided with a through hole 3101 that communicates with the through hole 3122 of the movable mold 3012 fixed to the movable platen 3010.

The mold clamping portion 3022 includes a mold clamping portion main body 3221, a pressing mechanism 3222 that presses the movable platen 3010 toward the fixed platen 21, and a tie bar 223. The pressing mechanism 3222 is movable in the direction of projecting and the direction of immersion with respect to the mold clamping portion main body 3221 (see arrow AR30 in FIG. 12). The mold clamping portion main body 3221 and the pressing mechanism 3222 are provided with a penetration path 3224 communicating with the through hole 3101 of the movable platen 3010 fixed to the tip end portion of the pressing mechanism 3222 from vertically above the mold clamping portion 3221.

The hopper 26 is movable between the loading position where the resin material vertically above the mold clamping portion 3022 is loaded and the retracting position (see arrow AR311 in FIG. 12). Further, the microwave irradiation unit 15 is also movable between the irradiation position for irradiating the resin material with the microwave vertically above the mold clamping unit 3022 and the retracted position (see arrow AR312 in FIG. 12).

Next, a molding method using the molding apparatus 3 according to the present embodiment will be described with reference to FIGS. 13 to 16. In addition, in FIGS. 13 to 16, the same reference numerals as those in FIGS. 3 to 6 are attached to the same configurations as those in the first embodiment. The molding method according to the present embodiment is executed in the order of the material charging step, the heating step, the pressurizing / solidifying step, and the mold release step, similarly to the molding method described with reference to FIG. 2 in the first embodiment.

First, in the material charging step, the molding apparatus 3 holds a gap G1 between the movable mold 3012 and the fixed mold 3013 in a state where a gap G1 is formed between the contact surfaces 12a and 13a of the movable mold 3012 and the fixed mold 3013. Place them apart. Further, the molding apparatus 3 moves the hopper 26 vertically upward of the mold clamping portion 3022. Then, as shown in FIG. 13, the solid resin material M1 is charged into the cavity 3111 from the hopper 26 through the through paths 3224 and the through holes 3101, 3122 that communicate with each other (see arrow AR301 in FIG. 13).

Next, in the heating step, the molding apparatus 3 moves the microwave irradiation unit 15 vertically upward of the mold clamping unit 3022. Then, as shown in FIG. 14, the molding apparatus 3 irradiates the resin material M2 with microwaves through the through holes 3224, 3101, and 3012 by the microwave irradiation unit 15 (see arrow AR303 in FIG. 14), and the resin material. Melt M2. Here, the gas generated when the resin material is melted is discharged to the outside of the mold assembly 3011 through the through paths 3224 and the through holes 3101 and 3012 communicating with each other (see arrow AR304 in FIG. 14).

Subsequently, in the pressurizing / solidifying step, as shown in FIG. 15, the molding apparatus 3 closes the through hole 3122 of the movable mold 3012 with the lid 3124. Then, the molding apparatus 3 presses the movable mold 3012 fixed to the movable platen 3010 against the fixed mold 3013 with a preset pressure by the pressing mechanism 3222 of the mold clamping portion 3022 (see arrow AR306 in FIG. 15). Here, the molding apparatus 3 brings the contact surfaces 12a and 13a of the movable mold 3012 and the fixed mold 3013 into contact with each other while pressurizing the resin material M3 in the cavity 3111.

After that, in the mold release step, as shown in FIG. 16, the molding apparatus 3 raises the movable mold 3012 (arrow AR307 in FIG. 16) to separate the fixed mold 13 and the movable mold 12. Then, the molded product P1 placed on the fixed mold 3013 is taken out.

As described above, according to the molding apparatus 3 according to the present embodiment, the movable platen 3010 is provided with a through hole 3101, and the mold clamping portion main body 3221 and the pressing mechanism 3222 are provided with a through path 3224. Further, the movable mold 3012 fixed to the movable platen 3010 is also provided with a through hole 3122, and the through path 3224 and the through hole 3101, 3122 communicate with each other. Then, in the molding method according to the present embodiment, the injection of the resin material into the cavity 3111 of the mold assembly 3011 and the irradiation of the resin material introduced into the cavity 3111 with microwaves penetrate through the penetration path 3224 communicating with each other. This is done through holes 3101, 3122. This eliminates the need for a mechanism for moving the mold elevating portion 25 and the movable unit U1 as in the molding apparatus 1 according to the first embodiment, and thus has a simpler configuration than the molding apparatus 1 according to the first embodiment. Can be.

(Modification example)
Although each embodiment of the present invention has been described above, the present invention is not limited to the configuration of the above-described embodiment. For example, in the pressurizing / solidifying step of the molding method according to the first embodiment, a molding method for producing a molded product having a partially different thickness by moving a mold partially independent of other parts. May be good.

As shown in FIG. 17, the molding apparatus 4 used in the molding method according to the present modification includes a movable platen 4010, a mold assembly 4011, a microwave irradiation unit 15, a temperature control unit 17, a suction unit 19, and a fixed platen 21. A mold clamping portion 4022, a mold elevating portion 25, a hopper 26, and a shield 27 are provided. In FIG. 17, the same reference numerals as those in FIG. 1 are attached to the same configurations as those in the first embodiment.

The mold set 4011 is composed of a first sub-movable mold 4012, a second sub-movable mold 4014, and a fixed mold 13 made of metal. The first sub-movable mold 4012 has a convex portion 4121 according to the shape of the molded product, and a through hole 4012a through which the first sub-movable mold 4012 is vertically penetrated and the second sub-movable mold 4014 is inserted. , Are formed. Then, in a state where the first sub-movable mold 4012, the second sub-movable mold 4014, and the fixed mold 13 are opposed to each other, the first sub-movable mold 4012, the second sub-movable mold 4014, and the fixed mold are opposed to each other. Cavity 4111 is formed between the mold 13 and the mold 13. The first sub-movable mold 4012 is formed with a suction port 122 and an exhaust passage 123, similarly to the movable mold 12 according to the first embodiment. The second sub-movable mold 4014 is inserted into the through hole 4012a of the first sub-movable mold 4012 and can move in the vertical direction (see arrow AR401 in FIG. 17) with respect to the first sub-movable mold 4012.

The movable platen 4010 is formed with a through hole 4010a that penetrates the movable platen 4010 in the vertical direction and through which the second sub-movable mold 4014 is inserted.

The mold clamping portion 4022 includes a first pressing mechanism 4222 and a second pressing mechanism 4224 that press the mold clamping portion main body 4221, the mold clamping portion main body 4221 and the mold assembly 4011 toward the fixed platen 21, a tie bar 223, and the like. Have. The first pressing mechanism 4222 and the second pressing mechanism 4224 can be independently moved in the direction of projecting and the direction of immersion with respect to the mold clamping portion main body 4221 (see arrows AR4010 and AR4011 in FIG. 17). ..

The movable platen 4010, the mold assembly 4011, and the mold elevating part 25 are movable units U4 that can be moved between the above-mentioned charging position, heating position, and pressurizing position (see arrow AR400 in FIG. 17). It is configured.

Next, a molding method using the molding apparatus 3 according to this modification will be described with reference to FIGS. 17 and 18. The molding method according to this modification is executed in the order of the material charging step, the heating step, the pressurization / solidification step, and the mold release step in the same manner as the molding method described with reference to FIG. 2 in the first embodiment. First, in the material charging step, the molding apparatus 4 moves the movable unit U4 to the charging position, and then charges the solid resin material from the hopper 26 into the cavity 4111 through the through hole 132 of the fixed mold 13. Next, in the heating step, after moving the movable unit U3 to the heating position, the molding apparatus 3 uses the microwave irradiation unit 15 to reach the resin material in the cavity 4111 through a part of the through hole 132 of the fixed mold 13. The resin material M403 is melted by irradiating with microwaves.

Subsequently, in the pressurizing / solidifying step, as shown in FIG. 18, the molding apparatus 3 closes the through hole 132 of the fixed mold 13 with the lid 134, and then moves the movable unit U4 to the pressurizing position. Then, the molding apparatus 4 presses the mold assembly 4011 against the fixed platen 21 with a preset pressure by the first pressing mechanism 4222 and the second pressing mechanism 4224 of the mold clamping portion 4022 (see arrows AR402 and AR403 in FIG. 18). ). Here, the first pressing mechanism 4222 and the second pressing mechanism 4224 operate independently of each other, and the second sub movable mold 4014 is brought closer to the fixed mold 13 than the first sub movable mold 4012. As a result, the portion of the resin material M403 pressed by the second sub-movable mold 4014 becomes thinner than the portion pressed by the first sub-movable mold 4012.

After that, in the mold release step, the molding apparatus 4 moves the movable unit U4 out of the pressurizing position, and then uses the mold elevating portion 25 to move the movable unit U4 to the fixed mold 13, the first sub movable mold 4012, and the second sub. Separate from the movable mold 4014.

By the way, in the mold of a molded product having a thin-walled portion, if the mold assembly 11 does not have a structure for partially pressurizing as shown in FIG. 1, the size of the cavity corresponding to the thin-walled portion is generally the thickness of the thin-walled portion. It is getting narrower accordingly. Then, the resin does not easily penetrate into the cavity corresponding to the thin-walled portion, and as a result, molding defects of the thin-walled portion may occur. On the other hand, according to this configuration, first, the shape of the cavity 4111 of the mold assembly 4011 is made into a shape in which the resin material can be easily distributed over the entire cavity, and the resin material is distributed over the entire cavity 4111. After that, the second sub-movable mold 4014 is moved independently of the first sub-movable mold 4012 to form a thin portion of the molded product. As a result, molding defects in the thin-walled portion of the molded product are suppressed, so that it is possible to manufacture high-quality molded products having partially different thicknesses.

In the molding method according to the first embodiment, an example in which only the solid resin material M1 is charged into the cavity 111 of the mold assembly 11 and filled in the material charging step has been described. However, the present invention is not limited to this, and a molding method may be used in which a base material formed of a material other than the resin material is molded with a resin. As the base material, for example, a base material formed of a glass fiber material, a carbon fiber material, or the like is adopted. The base material may be a solid sheet such as a film in addition to the above-mentioned materials. Further, the base material may be a cut glass fiber or carbon fiber fiber material. Further, the base material may be a member that adds an assembly function to the molded product, such as a bolt insert nut for inserting a bolt. Alternatively, the substrate may be a member that adds the ability of the part to electrically connect to other electrical circuits, such as metal terminals or metal busbars. Further, the base material may be a member such as a display panel that adds a display function for displaying information to a viewer on the molded product. Further, the base material may be a member for improving the design and decorativeness of a molded product such as an emblem.

Next, a molding method for molding the base material according to this modification with a resin will be described with reference to FIGS. 19A and 19B. In addition, in FIGS. 19A and 19B, the same reference numerals as those in FIG. 3 are attached to the same configurations as those in the first embodiment. Further, in FIGS. 19A and 19B, the temperature control unit, the suction unit, the suction port, and the exhaust passage are not shown. Here, as shown in FIG. 19A, a metal mold set 5011 composed of a movable mold 5012 and a fixed mold 5013 is used, and the movable mold 5012 is vertical to the fixed mold 5013. The case where it is arranged below will be described. First, in the material charging step, the base material F1 which is a member for reinforcing the molded product is placed in the recess 5121 of the movable mold 5012 in a state where the movable mold 5012 and the fixed mold 5013 are separated from each other.

Next, as shown in FIG. 19B, the convex portion 5131 of the fixed mold 5013 is fitted into the concave portion 5121 of the movable mold 5012 so that the movable mold 5012 and the fixed mold 5013 face each other. In this way, the cavity 5111 in which the base material F1 is arranged inside is formed between the movable mold 5012 and the fixed mold 5013. Then, in this state, the solid resin material M501 is put into the cavity 5111 through the through hole 5132 of the fixed mold 5013 (see the arrow AR501 in FIG. 19B) to fill the cavity 5111 with the resin material M501. To do. Then, in the heating step, the resin material filled in the cavity 5111 is irradiated with microwaves. Then, the pressurizing / solidifying step and the mold release step are performed in the same manner as in the molding method according to the first embodiment.

The molding method for molding the base material according to this modification with resin is not limited to the above-mentioned molding method described with reference to FIGS. 19A and 19B. Other molding methods according to this modification will be described with reference to FIGS. 20 (A) and 20 (B) and FIG. 21. In FIGS. 20 (A) and 20 (B) and FIG. 21, the same reference numerals as those in FIG. 3 are attached to the same configurations as those in the first embodiment. Further, in FIGS. 20 (A) and 20 (B) and FIG. 21, the temperature control unit, the suction unit, the suction port, and the exhaust passage are not shown. First, in the material charging step, as shown in FIG. 20 (A), the resin material M601 is charged into the cavity 5111 with the movable mold 5012 and the fixed mold 5013 facing each other (in FIG. 20 (A)). The cavity 5111 is filled with the resin material M601.

Next, after separating the movable mold 5012 and the fixed mold 5013, as shown in FIG. 20 (B), the base material F2 is placed on the resin material M601 accumulated in the recess 5121 of the movable mold 5012. Place. Subsequently, as shown in FIG. 21, the movable mold 5012 and the fixed mold 5013 are brought close to each other again to bring the gap G1 between the contact surface 12a of the movable mold 5012 and the contact surface 13a of the fixed mold 5013. Is formed, the movable mold 5012 and the fixed mold 5013 are opposed to each other. Then, in the heating step, the resin material filled in the cavity 5111 is irradiated with microwaves. Then, the pressurizing / solidifying step and the mold release step are performed in the same manner as in the molding method according to the first embodiment.

In the case of these molding methods, it is possible to manufacture a molded product in which the base materials F1 and F2 are exposed on a part of the surface.

Further, another molding method according to this modification will be described with reference to FIGS. 22 (A) and 22 (B) and FIG. 23. In FIGS. 22 (A) and 22 (B) and FIG. 23, the same components as those in the first embodiment are designated by the same reference numerals as those in FIG. Further, in FIGS. 22 (A) and 22 (B) and FIG. 23, the temperature control unit, the suction unit, the suction port, and the exhaust passage are not shown. First, as shown in FIG. 22 (A), the resin material M601 is put into the cavity 5111 with the movable mold 5012 and the fixed mold 5013 facing each other (see arrow AR701 in FIG. 22 (A)). , The resin material M701 is accumulated in a part of the cavity 5111.

Next, after separating the movable mold 12 and the fixed mold 13, as shown in FIG. 22 (B), the base material F3 is placed on the resin material M701 accumulated in the recess 5121 of the movable mold 5012. Place. Subsequently, as shown in FIG. 23, the movable mold 5012 and the fixed mold 5013 are brought close to each other again to bring the gap G1 between the contact surface 12a of the movable mold 5012 and the contact surface 13a of the fixed mold 5013. Is formed, the movable mold 5012 and the fixed mold 5013 are opposed to each other. In this state, the movable mold 12 and the fixed mold 13 are abutted again, and then the solid resin material is put into the cavity 5111 (see the arrow AR702 in FIG. 23), and the region in the cavity 5111 where the resin material M701 is not accumulated. Is filled with the resin material M702. Then, in the heating step, the resin materials M701 and M702 filled in the cavity 5111 are irradiated with microwaves.

In the case of this molding method, a molded product in which the base material F3 is embedded can be manufactured.

Further, the molding method according to the second embodiment may also be a molding method in which a base material formed of a material other than the resin material is molded with a resin. In this case, in the material charging step, as shown in FIG. 24, with the movable mold 2012 and the fixed mold 2013 separated from each other, the base material F4, which is a member for reinforcing the molded product, is designated by the fixed mold 2013. Place it in the position of. Then, with the movable mold 2012 and the fixed mold 2013 separated from each other, the solid resin material M201 is placed on the base material F4 at a predetermined position of the movable mold 2012. Then, in a state where the movable mold 2012 and the fixed mold 2013 are separated from each other, microwaves are irradiated.

Further, in the material charging step according to this modification, for example, as shown in FIG. 25 (A), the solid resin material M201 is transferred to the movable mold 2012 with the movable mold 2012 and the fixed mold 2013 separated from each other. The base material F5 may be placed on the resin material M201 after being placed at a predetermined position of the above.

Alternatively, as shown in FIG. 25 (B), in the material charging step, first, in a state where the movable mold 2012 and the fixed mold 2013 are separated from each other, the solid resin material M801 is placed at a predetermined position of the movable mold 2012. Then, the base material F6 is placed on the resin material M801. After that, the resin material 802 may be placed on the base material F6 in a state where the movable mold 2012 and the fixed mold 2013 are separated from each other. That is, the base material F6 may be sandwiched between the two resin materials M801 and M802. In addition, in FIGS. 25A and 25B, the temperature control unit 17 is not shown.

By the way, when the above-mentioned so-called integrally molded product is manufactured by injection molding, the resin material and the fiber material are melt-kneaded in advance, and the melt-kneaded material is injected into the cavity of the mold to manufacture the integrally molded product. Is common. However, in the case of this molding method, the fiber material becomes finer due to a relatively large shear stress applied to the fiber material during melt kneading of the resin material and the fiber material or injection into the cavity of the mold. Then, the fiber material contained in the integrally molded product produced by this molding method may be excessively miniaturized, and it may be difficult to improve the strength of the integrally molded product. On the other hand, according to this configuration, a solid resin material obtained by kneading a fiber material such as a glass fiber material or a carbon fiber material and a resin material is charged into the cavity 111 in advance. Since the shear stress applied to the fiber material can be reduced, the strength or rigidity of the molded product can be improved. Further, since the shear stress applied to the base material can be reduced by putting the base material, which is formed from the glass fiber material or the carbon fiber material and is a member for reinforcing the molded product, into the cavity 111 in advance, the molded product can be used. At least one of the properties of strength and rigidity can be improved.

In the first embodiment, the configuration in which the through hole 132 is provided only in the fixed mold 13 has been described, but the present invention is not limited to this, and the through hole is provided only in the movable mold 12 or the through hole. May be provided in both the movable mold 12 and the fixed mold 13.

In the first embodiment, an example in which the suction port 122 and the exhaust passage 123 for sucking the gas existing in the cavity 111 of the mold assembly 11 are provided only in the movable mold 12 has been described. However, the present invention is not limited to this, and the suction port and the exhaust passage are provided only in the fixed mold 13, or the suction port and the exhaust passage are provided in both the movable mold 12 and the fixed mold 13. It may have a configuration that is present.

In the heating step according to the first embodiment, for example, a temperature measuring unit for measuring the temperature of the resin material M2 is provided, and microwaves are generated until the temperature of the resin material M2 measured by the temperature measuring unit reaches a preset reference temperature. It may be irradiated.

In the first embodiment, an example in which the through hole 132 of the fixed mold 13 is used for both the charging of the solid resin material M1 in the material charging step and the irradiation of the resin material M2 with microwaves in the heating step has been described. .. However, the irradiation of the resin material M2 with microwaves in the heating step is not necessarily limited to the configuration performed through the through holes 132, and for example, the movable mold 12 or the fixed mold 13 has a through hole dedicated to microwave irradiation (a through hole dedicated to microwave irradiation. (Not shown) may be provided, and the resin material M2 may be irradiated with microwaves through the through holes.

In the first embodiment, a fixed mold having a recess and a rod-shaped or wedge-shaped movable mold are provided, and the movable mold is added to the resin material M2 by adjusting the amount of the movable mold penetrating into the recess of the fixed mold. It may be configured to adjust the pressure.

In the first embodiment, for example, the entire mold assembly 11 may be vibrated in order to spread the solid resin material M1 over the entire cavity 111 of the mold assembly 11. Specifically, the structure may be such that ultrasonic waves are applied to the entire mold assembly 11.

The molding apparatus 1 according to the first embodiment may be configured to include a static electricity removing unit for removing static electricity generated in the solid resin material M1.

In the material charging step according to the second embodiment, the resin material to be placed on the fixed mold 2013 is not limited to a lump-shaped (block-shaped) resin, for example, a pellet-shaped, flake-shaped, or powder-shaped resin. It may be a material.

In the second embodiment, a configuration including a movable platen 10, a mold assembly 2011, a microwave irradiation unit 15, a fixed platen 21, and a shield 27 covering the entire mold clamping unit 22 has been described. However, the present invention is not limited to this, and for example, a cover that has an electromagnetic wave shielding function and can be moved between a position that covers the resin material M202 placed on the fixed mold 2013 and a position that does not cover the resin material M202. It may be configured to include (not shown). In this case, in the heating step, the cover is moved to the first position that covers the resin material M202, the microwave irradiation unit 15 is arranged inside the cover, and the movable mold 2012 and the fixed mold 2013 are separated from each other. The resin material M202 may be irradiated with microwaves from the gap. Then, after the heating step is completed, the cover may be moved to a position that does not cover the resin material M202.

In each embodiment, the movable molds 12 and 2012 and the fixed molds 13 and 2013 are used, and an example in which the movable molds 12 and 2012 are brought closer to the fixed molds 13 and 2013 in the pressurizing / solidifying step has been described. .. However, the present invention is not limited to this, and for example, two movable dies may be used, and the two movable dies may be brought close to each other in the pressurizing / solidifying step.

In each embodiment, the configuration in which the mold sets 11 and 2011 are forcibly cooled by the temperature control unit 17 has been described, but the present invention is not limited to this, and for example, the mold set 11 may be naturally cooled. ..

The molding method according to each embodiment may be carried out, for example, in a state where the mold sets 11 and 2011 are arranged in a vacuum chamber in a reduced pressure atmosphere. According to this configuration, it is possible to reduce the generation of voids in the molded product.

Regarding the resin material used in each embodiment, although the thermoplastic material has been described as an example in the first embodiment, it may be a thermosetting material such as EP.

In the material charging step according to the second embodiment, the solid resin material M201 may be preheated before being placed on the movable mold 2012. In this case, the heating time with microwaves can be reduced. The preheating step of the solid resin material M201 may be performed using, for example, an infrared heater.

In each embodiment and each modification, an example in which a metal mold set is used has been described, but the present invention is not limited to this, and a mold set formed of a material different from metal may be used. In this case, the lid attached to the mold assembly and for closing the through hole provided in the fixed mold or the movable mold is made of a material having a coefficient of thermal expansion close to the coefficient of thermal expansion of the material of the mold assembly. It may be formed. Further, instead of the porous metal, a porous material having a coefficient of thermal expansion close to the coefficient of thermal expansion of the material of the mold assembly may be arranged inside the suction port provided in the fixed mold or the movable mold. ..

Hereinafter, embodiments and modifications of the present invention (including those described in the description; the same shall apply hereinafter) have been described, but the present invention is not limited thereto. The present invention includes a combination of embodiments and modifications as appropriate, and modifications thereof as appropriate.

INDUSTRIAL APPLICABILITY The present invention can be widely used in the production of resin molded products such as interior and exterior parts of automobiles.

1,2,3,4: Molding equipment 10,3010,4010: Movable platen 11,2011,3011,4011: Mold assembly, 12,2012,301,5012: Movable mold, 12a, 13a: Contact Surface, 13,2013,301,5013: Fixed mold, 15: Microwave irradiation part, 17: Temperature control part, 19: Suction part, 21: Fixed platen, 22,3022,4022: Molding part, 25: Gold Mold elevating part, 26: Hopper, 27: Shield, 111,2111,121,3111,4111,5111: Cavity, 121,3131,4121,5131: Convex part, 122: Suction port, 123: Exhaust path, 131,231 , 3121, 5121: Concave, 132, 3101, 3122, 3224, 4010a, 4012a, 5132: Through hole, 133: Flange, 134, 3124: Lid, 151: High frequency generator, 152: Wave tube, 171: Temperature control part main body, 172: Heat medium tube, 191: Vacuum pump, 192: Exhaust pipe, 221, 3221, 4221: Mold clamping part main body, 222, 3222: Pressing mechanism, 223: Tie bar, 4012: First sub movable metal Mold, 4014: 2nd sub movable mold, 4222: 1st pressing mechanism, 4224: 2nd pressing mechanism, G1: Gap, U1, U3: Movable unit, F1, F2, F3, F4, F5, F6: Base material , M1, M2, M3, M201, M202, M203, M403, M501, M601, M701, M702, M801, M802: Resin material, P1, P2: Molded product

Claims (8)

The first step of inserting the resin material between the first mold and the second mold, and
The second step of heating and melting the resin material by irradiating the resin material with microwaves, and
A third step of pressurizing and solidifying the molten resin material by bringing the first mold and the second mold close to each other and abutting the first mold and the second mold.
See containing and a fourth step of taking out the molded article formed from the resin material by separating the said second mold and said first mold,
In the second step, by facing the first mold and the second mold, a cavity that is a space for filling the resin material between the first mold and the second mold is formed. In the formed state, the resin material is irradiated with microwaves through a through hole penetrating the cavity from at least one outer wall surface of the first mold and the second mold.
Molding method. In the first step, the resin material is put into the cavity through the through holes provided in at least one of the first mold and the second mold.
The molding method according to claim 1. In the first step, the gas is charged into the cavity through a suction port and an exhaust passage for sucking gas existing in the cavity provided in at least one of the first mold and the second mold. Aspirate the resin material,
The molding method according to claim 1 or 2. In the second step, the gas is melted in the cavity through a suction port and an exhaust passage for sucking the gas existing in the cavity provided in at least one of the first mold and the second mold. Aspirates the gas generated from the resin material.
The molding method according to any one of claims 1 to 3. In the first step,
The base material, which is a member for reinforcing the molded product, is provided with the first mold arranged vertically below the second mold and the first mold and the second mold separated from each other. After placing on the first mold
By facing the first mold and the second mold, the cavity in which the base material is arranged inside is formed between the first mold and the second mold. , The resin material is put into the cavity through the through hole.
The molding method according to any one of claims 1 to 4. 1st mold and
The second mold and
A microwave irradiation unit that melts the resin material by irradiating the resin material inserted between the first mold and the second mold with microwaves.
E Bei and a clamping portion for pressing the resin material by matching the second die and the first die close and said second mold and said first mold,
At least one of the first mold and the second mold is formed between the first mold and the second mold when the first mold and the second mold face each other. A through hole is provided in the cavity, which is a space for filling the resin material, to penetrate from the outer wall surface.
The microwave irradiation unit irradiates the resin material with microwaves through the through holes.
Molding equipment. Further equipped with a suction part that sucks gas,
At least one of the first mold and the second mold is formed with a suction port and an exhaust path for sucking the gas existing in the cavity.
The suction unit sucks the gas existing in the cavity through the suction port and the exhaust passage.
The molding apparatus according to claim 6. A shielding portion that covers at least the first mold, the second mold, and the microwave irradiation portion and shields the microwave emitted from the microwave irradiation portion is further provided.
The molding apparatus according to claim 6 or 7.

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