KR102299790B1 - Vacuum and preasure molding method for high voltage and high reliability power supply - Google Patents

Abstract

The present invention relates to a vacuum and pressure molding method for manufacturing an ultra-high voltage and high-reliability power supply device, capable of preventing damage to a component by suppressing the generation of pores inside an insulating material during insulation molding of the component. The vacuum and pressure molding method for manufacturing an ultra-high voltage and high-reliability power supply device according to the present invention comprises: a step of putting epoxy into an insulating material container installed inside a vacuum chamber and placing components inside a mold installed inside the vacuum chamber; a step of forming the inside of the vacuum chamber in a vacuum state by an initial vacuum pump connected to the vacuum chamber; a step of filling the inside of the mold from the insulating material container with the epoxy and sealing the mold with a cover; a step of forming the inside of the mold in a high-pressure state by a compressor connected to the cover; and a step of curing the epoxy by heating the inside of the chamber by a heating unit installed in the chamber.

Description

VACUUM AND PREASURE MOLDING METHOD FOR HIGH VOLTAGE AND HIGH RELIABILITY POWER SUPPLY

The present invention relates to a vacuum and pressure molding method for manufacturing an ultra-high voltage and high reliability power supply, and more specifically, to a vacuum and pressure molding method for manufacturing an ultra high voltage and high reliability power supply capable of reducing pores inside an insulating material during component molding will be.

In general, conventional X-ray equipment uses an X-ray beam to obtain a vertical superimposed image of the subject (or human body), whereas CT equipment uses a horizontal, vertical, or arbitrary angle cross section with respect to the scan path of the X-ray beam and the detector. get the video

Such CT equipment expresses the obtained image in voxel as a material and thickness with a linear attenuation coefficient that is affected by the density and effective atomic number of the material during the slicing process.

On the other hand, CT equipment includes medical CT equipment for examining the inside of the human body, and compared to medical CT equipment, there is industrial CT equipment for acquiring high-magnification images to observe minute parts such as semiconductor junctions with high resolution.

Since X-ray devices including such CT equipment are generally operated under high voltage conditions, various components such as circuit components of the high voltage power supply of the device may also be exposed thereto, and in this case, the components of the device may be damaged due to the high voltage. .

In addition, not only X-ray equipment but also various types of equipment operated with high voltage or ultra-high voltage may also be damaged when exposed to high voltage, and this phenomenon is likely to occur on the power supply side, which is easily exposed to high voltage, but is limited to this. Otherwise, other general parts may also be damaged.

Accordingly, components that are likely to be exposed to high voltage must be insulated, and such insulation is generally molded to surround the components requiring insulation with an insulating material.

Such insulating molding can be accomplished by placing parts for processing in a mold, and filling and curing the insulating material in the mold.

However, in this case, damage to the component occurs due to the presence of minute pores formed in the insulating material. That is, parts and insulating materials are exposed to high temperatures during operation of the device, and cracks occur in the parts due to thermal expansion of pores due to this, and there is a problem in that insulation breakdown is deepened by repeated expansion and contraction.

In particular, the destruction of parts is caused more seriously due to the micropores formed around the surface of the parts, and the more the device is operated at an ultra-high pressure, the more pronounced this phenomenon is.

In addition, the surface of the component 10 may be considered to be flat, but when it is enlarged at a high magnification, it is not actually flat, and there are curved and concave portions. Referring to Figure 1, there is a characteristic that a large number of micropores are gathered in such a concave portion (concave portion), and the micropores in this place are very difficult to separate from the component 10 and have a more adverse effect on the destruction of the component 10 .

Republic of Korea Patent Registration No. 10-1867318 (2018.06.07.)

An object of the present invention is to provide a vacuum and pressurized casting method for manufacturing an ultra-high voltage, high-reliability power supply capable of preventing the occurrence of pores in a component insulating material.

In the vacuum and pressurization molding method for manufacturing an ultra-high voltage and high reliability power supply device according to the present invention, epoxy is put into an insulating material container installed inside a vacuum chamber, and parts are placed inside a mold installed inside the vacuum chamber ; forming the inside of the vacuum chamber in a vacuum state by an initial vacuum pump connected to the vacuum chamber; , Filling the inside of the mold from the insulating material container with the epoxy and sealing the mold by a cover; forming the inside of the mold in a high pressure state by a compressor connected to the cover; and heating the inside of the chamber by a heating unit installed in the chamber to cure the epoxy.

Preferably, the method may further include forming the inside of the mold in a vacuum state by a post vacuum pump connected to the cover after the step of forming the inside of the mold in a high pressure state.

Preferably, the high-pressure state and the vacuum state inside the mold can be alternately repeated.

Preferably, the pressure inside the mold may be 100 atm or more at high pressure.

Preferably, the degree of vacuum inside the mold may be 5*10E-3 torr or less.

Preferably, the degree of vacuum inside the vacuum chamber may be 5*10E-3 torr or less.

Preferably, in a high-pressure state and a vacuum state inside the mold, ultrasonic waves may be provided to the epoxy by an ultrasonic wave generator installed in the mold.

Preferably, UV may be supplied to the epoxy by a UV generator installed under the cover before the step of curing the epoxy.

The vacuum and pressurization molding method for manufacturing an ultra-high-voltage and high-reliability power supply device of the present invention can prevent damage to parts due to cracks by suppressing the generation of pores in the insulating material, and has the effect of increasing durability even when operated at ultra-high voltage .

1 is a view showing pores inside the insulating material when molding parts for an X-ray device according to the prior art;
2 is a view showing a vacuum and pressurized mold apparatus for manufacturing an ultra-high voltage and high reliability power supply device according to an embodiment of the present invention;
3 is a view showing a process sequence of a vacuum and pressurized casting method for manufacturing an ultra-high voltage and high reliability power supply device according to an embodiment of the present invention;
4A to 4G are diagrams illustrating a vacuum and pressurization molding method for manufacturing an ultra-high voltage and high reliability power supply device according to an embodiment of the present invention;
5 is a view showing the movement of pores during the vacuum and pressurization molding method for manufacturing an ultra-high voltage and high reliability power supply device according to an embodiment of the present invention;
6 is a view showing a vacuum and pressurized mold apparatus for manufacturing an ultra-high voltage and high reliability power supply device according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms or words used in the present specification and claims should not be construed as being limited to conventional or dictionary meanings, and the inventor should properly understand the concept of the term in order to best describe his invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept consistent with the technical idea of the present invention. The present invention can make various changes and can have various embodiments, and the examples described below and shown in the drawings are not intended to limit the present invention to specific embodiments, but the spirit and technology of the present invention It is to be understood to include all modifications, equivalents and substitutions falling within the scope. It should also be understood that various equivalents and modifications may be substituted for them at the time of filing the present application.

2 is a view showing a vacuum and pressurized mold apparatus for manufacturing an ultra-high voltage and high reliability power supply device according to an embodiment of the present invention.

The component insulation molding apparatus for an X-ray generator according to an embodiment of the present invention includes a vacuum chamber, a pressure molding unit, an insulating material supply unit, and a heating unit 400 .

The vacuum chamber unit includes a vacuum chamber 110 and an initial vacuum pump 120 connected to the vacuum chamber 110 to form a vacuum atmosphere in the vacuum chamber 110 . In addition, the vacuum chamber vent 130 is connected to one side of the vacuum chamber 110, and a valve for blocking the air flow is installed on the vacuum chamber vent 130 and the initial vacuum pump 120 side, respectively.

The pressure molding part is rotatably coupled to the mold 210 for opening and closing the mold 210 and the mold 210 having an internal space, and to form a high-pressure atmosphere in the cover 220 and the mold 210 driven by a motor. To include a compressor 230 connected to the cover 220. In addition, a post vacuum pump 240 connected to the cover 220 to form a vacuum atmosphere in the mold 210 and a mold vent 250 connected to the cover 220 for ventilation of the mold 210 are included. do. In addition, a valve for blocking air flow is installed between the cover 220 and the compressor 230 , the post vacuum pump 240 , and the mold vent 250 , respectively.

According to an embodiment of the present invention, the mold 210 may be a metallic mold made of a metallic material, and the cover 220 may also be made of a metallic material.

An insulating material supply unit is disposed inside the vacuum chamber 110 above the mold 210 . The insulating material supply unit includes an insulating material container 310 having an inner space for containing the insulating material. According to an embodiment of the present invention, the insulating material supply unit 310 may be driven by a robot. Any material having excellent insulating properties may be used as the insulating material, and may be epoxy according to an embodiment of the present invention.

The heating unit is for heating the inside of the vacuum chamber 110 to a high temperature, and may be installed in the vacuum chamber 110 internal space or coupled to the vacuum chamber 110 to heat the vacuum chamber 110 itself.

3 is a view showing a process sequence of a vacuum and pressurized molding method for manufacturing an ultra-high voltage high reliability power supply device according to an embodiment of the present invention, and FIGS. 4A to 4G are an ultra-high voltage high reliability power supply device according to an embodiment of the present invention. 5 is a view showing a vacuum and pressure molding method for manufacturing, and FIG. 5 is a diagram showing pore movement during a vacuum and pressure molding method for manufacturing an ultra-high voltage and high-reliability power supply according to an embodiment of the present invention.

Referring to FIG. 4A , the epoxy is put into the insulation container 310, and at this time, there are many fine pores inside the injected epoxy. In addition, in this process, the part 10 for the molding process is placed inside the mold 210 .

Referring to FIG. 4B , the atmospheric pressure inside the vacuum chamber 110 is lowered by the operation of the initial vacuum pump 120 after the epoxy is injected, and thus the pores inside the epoxy are released to the outside of the epoxy.

That is, by exposing the epoxy to a vacuum atmosphere, a significant number of pores present in the epoxy can be removed from the epoxy. At this time, the degree of vacuum inside the vacuum chamber 110 may be 5*10-2 torr or less, but is preferably 5*10E-3 torr or less for effective pore removal.

In this initial vacuum defoaming process step, about 80% of the pores inside the epoxy can be removed.

Referring to FIG. 4C , after the vacuum defoaming process, the robot is driven and the epoxy is filled to surround the part 10 in the mold.

Referring to FIG. 4D , after the epoxy is filled, the mold 210 is closed and sealed by the cover 220 , and the vacuum chamber vent 130 connected to the vacuum chamber 110 is opened to open the vacuum chamber 110 . The interior is exposed to atmospheric pressure. Although it is not necessary to release the vacuum inside the vacuum chamber 110 in this step, it is preferable to expose the inside of the vacuum chamber 110 to atmospheric pressure for a smooth and safe operation later.

Referring to FIG. 4E , after the mold 210 is closed, the pressure inside the mold 210 is increased by driving the compressor 230 . When the pressure inside the mold 210 rises, the epoxy inside the mold 210 is pressurized. As the epoxy is pressurized, the pressure inside the epoxy increases and pressure is also applied to the pores existing inside the epoxy.

In this pressurized defoaming process, as the pores are pressurized, they are pushed out of the epoxy and released. Also, referring to FIG. 5 , pores existing in contact with the surface of the component 10 , particularly pores located in concave portions of the surface of the component, may be pushed and moved along the surface of the component. These moving pores can separate from the part surface and drain from the epoxy.

At this time, the pressure inside the mold 210 may be greater than 1 atm, but is preferably 100 atm or more for effective pore removal.

Referring to FIG. 4F , when the late vacuum pump 240 is operated in a state where the compressor 230 is stopped, the pressure inside the mold 210 is lowered to become a vacuum state. As the epoxy is exposed to a vacuum atmosphere, some of the pores present inside the epoxy may be removed from the epoxy.

In this post-vacuum degassing process, the degree of vacuum inside the mold 210 may be 5*10-2 torr or less, but is preferably 5*10E-3 torr or less for effective pore removal.

Referring to FIG. 4G, after the vacuum defoaming process, the mold ventilation part 250 connected to the cover 220 is opened and exposed to atmospheric pressure, and the internal temperature of the mold 210 is increased by the operation of the heating part, whereby the epoxy is cured processed

On the other hand, in the present invention, it is possible to remove about 80% of the pores inside the epoxy through the initial vacuum defoaming process, and it is possible to remove up to about 95% of the pores through the pressure defoaming process and the late vacuum defoaming process. However, it is possible to increase the pore removal rate through the cross-repetition of the pressure degassing process and the post-vacuum degassing process.

Table 1 below is a table showing the pore removal rate inside the epoxy through the defoaming process. Referring to this, the removal rate of pores including micropores can be achieved up to about 99.5% by repeating the defoaming process.

number process Pore Removal Rate (%) One Initial vacuum defoaming 80 One Pressure defoaming and late vacuum defoaming 95 2 Pressure defoaming and late vacuum defoaming 98 3 Pressure defoaming and late vacuum defoaming 99.5

6 is a view showing a vacuum and pressurized mold apparatus for manufacturing an ultra-high voltage and high reliability power supply device according to another embodiment of the present invention, and further includes an ultrasonic wave generator 500 and an ultraviolet light generator 600 .

The ultrasonic generator 500 is installed in the lower portion of the mold 210 to supply ultrasonic waves to the mold 210 . According to another embodiment of the present invention, the micropores are more effectively separated from the parts by the ultrasonic waves provided to the epoxy from the ultrasonic generator 500 during the pressure degassing process and the post vacuum degassing process of the mold 210 and discharged to the outside of the epoxy can be That is, by applying vibration to the epoxy and the pores to promote the movement of the pores, the defoaming effect can be significantly improved.

The UV generator 600 is installed inside the lower portion of the cover 220 to provide UV light to the epoxy inside the mold 210 . After the degassing process of the epoxy, the UV generator 600 is operated to provide UV light to the epoxy so that the upper surface of the epoxy can be cured preferentially, and thus, the penetration of pores from the atmosphere into the inside of the epoxy before the epoxy curing is completed is prevented in advance. can This is to ensure the quality of the product by preventing the penetration of pores into the epoxy, which may occur even though it is small.

Insulation molding for a component of a conventional X-ray generating device can be achieved by placing the components for processing in a mold, and filling and curing an insulating material in the mold. In this case, due to the presence of fine pores formed in the insulating material, the damage occurs. That is, since parts and insulating materials are exposed to high temperatures during operation of the device, cracks occur in parts due to thermal expansion of pores, and there is a problem in that insulation breakdown is deepened by repeated expansion and contraction.

In particular, the destruction of parts is caused more seriously due to the micropores formed around the surface of the parts, and the more the device is operated at an ultra-high pressure, the more pronounced this phenomenon is.

In addition, the surface of the part may be considered to be flat, but when it is enlarged at a high magnification, it is not actually flat, and there are curved and concave portions. Referring to FIG. 1 , there is a characteristic that a large number of micropores are gathered in such a concave portion (concave portion), and the micropores in such a place are very difficult to separate from the component and have a further adverse effect on the destruction of the component.

However, according to the present invention, it is possible to prevent damage to parts due to pores by removing pores in the insulating material during the component insulation molding process, and to remarkably improve durability even when operated at ultra-high voltage.

As described above, although the present invention has been described with reference to limited embodiments and drawings, the present invention is not limited thereto, and the technical idea of the present invention and the following by those of ordinary skill in the art to which the present invention pertains. Various modifications and variations are possible within the scope of equivalents of the claims to be described.

Claims (8)

Putting the epoxy into an insulating material container installed inside the vacuum chamber, and placing the parts inside the mold installed inside the vacuum chamber;
forming the inside of the vacuum chamber in a vacuum state by an initial vacuum pump connected to the vacuum chamber;
filling the inside of the mold from the insulating material container with the epoxy and sealing the mold with a cover;
forming the inside of the mold in a high pressure state by a compressor connected to the cover;
forming the inside of the mold in a vacuum state by a post vacuum pump connected to the cover; and
Step of heating the inside of the chamber by the heating unit installed in the chamber to cure the epoxy
including,
The high-pressure state and the vacuum state inside the mold can be alternately repeated,
In a high-pressure state and a vacuum state inside the mold, ultrasonic waves may be provided to the epoxy by an ultrasonic wave generator installed in the mold, and vibrations are applied to the epoxy and pores by the ultrasonic waves to promote movement of pores, thereby promoting micropores can be smoothly separated from this part,
Before the step of curing the epoxy, ultraviolet rays are supplied to the epoxy by the ultraviolet generator installed under the cover, so that the upper surface of the epoxy can be preferentially cured. A vacuum and pressurized molding method for manufacturing an ultra-high voltage, high-reliability power supply, characterized in that penetration can be prevented in advance.
delete According to claim 1,
A vacuum and pressurized molding method for manufacturing an ultra-high voltage and high-reliability power supply, characterized in that the high-pressure state and the vacuum state inside the mold can be alternately repeated.
According to claim 1,
A vacuum and pressurized molding method for manufacturing an ultra-high-pressure and high-reliability power supply, characterized in that the pressure inside the mold may be 100 atm or more at high pressure.
According to claim 1,
A vacuum and pressurized molding method for manufacturing an ultra-high voltage and reliable power supply, characterized in that the vacuum degree inside the mold may be 5 * 10E-3 torr or less.
According to claim 1,
Vacuum and pressurization molding method for manufacturing an ultra-high voltage and high reliability power supply, characterized in that the vacuum degree inside the vacuum chamber may be 5 * 10E-3 torr or less.
delete delete

Images