JP2018122473A - Molding method and molding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding method and a molding apparatus which can increase the degree of freedom in shapes of the molded articles.SOLUTION: A molding method of this invention comprises: a raw material charging step, in which a resin material is charged into the space between a movable mold 12 and a fixed mold 13; a heating step, in which the resin material is heated and melted by irradiating the resin material with microwaves; a pressing and solidifying step, in which the melted resin is pressed and solidified by bringing the movable mold 12 close to the fixed mold 13 to make the movable mold 12 butt against the fixed mold 13; and a releasing step, in which a molded product formed from the resin material is taken out by separating the movable mold 12 and the fixed mold 13.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a molding method and a molding apparatus.

  There has been proposed an injection molding method using a resin heating and melting apparatus that heats a solid resin material using a microwave and sequentially discharges it, a mold, and a mold clamping apparatus that clamps the mold (for example, Patent Document 1). In the injection molding method described in Patent Document 1, the loss using the resin injection molding machine is improved by sequentially discharging the molten resin directly into the mold. In this type of injection molding method, molten resin discharged from a resin heating and melting apparatus is filled into a mold cavity clamped by a mold clamping apparatus through a spool runner provided in the mold.

  Also, injection molding that distributes resin throughout the cavity by partitioning the cavity with multiple molds and disposing a narrow part with a shorter distance between mold faces and a wider part with a longer mold face distance than the narrow part in the cavity. A method has been proposed (see, for example, Patent Document 2).

JP 2014-113699 A JP 2004-35884 A

  However, in the injection molding method as disclosed in Patent Document 1, a molded product is generated by sequentially discharging the molten resin from the molten resin inlet portion of the mold into the cavity of the mold. It is necessary to design the molded product in a dimensional shape that takes into account the lack of entry into details, for example, due to problems with general injection molding methods such as increasing the size of the molten resin inlet side beyond the required strength of the molded product A problem with respect to restrictions on the shape design of a molded product such as consideration of flow resistance of a molten resin material has not been solved. Further, the injection molding method as in Patent Document 2 has not yet completely solved the same problem.

  This invention is made | formed in view of the said reason, and it aims at providing the shaping | molding method and shaping | molding apparatus which expand a freedom degree about the shape of a molded article.

In order to achieve the above object, the molding method according to the present invention comprises:
A first step of introducing a resin material between the first mold and the second mold;
A second step of heating and melting the resin material by irradiating the resin material with microwaves;
A third step of pressing and solidifying the molten resin material by bringing the first mold and the second mold close to each other and bringing the first mold and the second mold into contact with each other;
And a fourth step of taking out a molded product formed from the resin material by separating the first mold and the second mold.

The molding apparatus according to the present invention viewed from another viewpoint is
A first mold;
A second mold,
A microwave irradiation unit for melting the resin material by irradiating the resin material placed between the first mold and the second mold with microwaves;
A mold clamping unit that pressurizes the resin material by bringing the first mold and the second mold close to each other and bringing the first mold and the second mold into contact with each other.

  By the way, in the conventional resin injection molding method, the viscosity of the molten resin is high, and the flow resistance entering the cavity of the mold is high, so it is difficult to reach the details. On the other hand, according to the present invention, the resin material is heated and melted by irradiating the resin material with microwaves after putting the solid resin material between the first mold and the second mold. Thereafter, the first mold and the second mold are brought into contact with each other to pressurize and solidify the resin material. That is, after a solid resin material is introduced between the first mold and the second mold, the resin material is heated and melted between the first mold and the second mold. This makes it much easier to fill the resin material into the details in the cavity. Therefore, since the shape of the molded product is not limited to the shape considering the flow resistance of the molten resin material, there is an advantage that the degree of freedom in designing the shape of the molded product can be expanded. In addition, the resin material can be saved.

It is a schematic block diagram of the shaping | molding apparatus which concerns on Embodiment 1 of this invention. 3 is a flowchart showing an example of a flow of a molding method using the molding apparatus according to Embodiment 1. 5 is a diagram for explaining a material charging process according to Embodiment 1. FIG. 5 is a diagram for explaining a heating process according to Embodiment 1. FIG. 5 is a diagram for explaining a pressurizing / solidifying step according to Embodiment 1. FIG. It is a figure for demonstrating the mold release process which concerns on Embodiment 1. FIG. It is a schematic block diagram of the shaping | molding apparatus which concerns on Embodiment 2 of this invention. FIG. 10 is a diagram for explaining a material charging process according to the second embodiment. 6 is a diagram for explaining a heating process according to Embodiment 2. FIG. 6 is a diagram for explaining a pressurizing / solidifying step according to Embodiment 2. FIG. It is a figure for demonstrating the mold release process which concerns on Embodiment 2. FIG. It is a schematic block diagram of the shaping | molding apparatus which concerns on Embodiment 3 of this invention. FIG. 10 is a diagram for explaining a material charging process according to Embodiment 3. 6 is a diagram for explaining a heating process according to Embodiment 3. FIG. 10 is a diagram for explaining a pressurizing / solidifying step according to Embodiment 3. FIG. It is a figure for demonstrating the mold release process which concerns on Embodiment 3. FIG. It is a schematic block diagram of the shaping | molding apparatus which concerns on a modification. It is a figure for demonstrating the pressurization and solidification process which concerns on a modification. It is a figure for demonstrating the material injection | throwing-in process which concerns on a modification, (A) is a figure which shows the state which has arrange | positioned the base material to the recessed part of a movable metal mold | die, (B) is a resin material in the cavity of a metal mold | die group. FIG. It is a figure for demonstrating the material injection | throwing-in process which concerns on a modification, (A) is a figure which shows a mode that resin material is injected into the recessed part of a movable metal mold | die, (B) is thrown into the recessed part of a movable metal mold | die. It is a figure which shows the state which mounted the base material on the other resin material. It is a figure for demonstrating the material injection | throwing-in process which concerns on a modification. It is a figure for demonstrating the material injection | throwing-in process which concerns on a modification, (A) is a figure which shows a mode that resin material is injected into the recessed part of a movable metal mold | die, (B) is thrown into the recessed part of a movable metal mold | die. It is a figure which shows the state which mounted the base material on the other resin material. It is a figure for demonstrating the material input process which concerns on a modification. It is a figure for demonstrating the material injection | throwing-in process which concerns on a modification. It is a figure for demonstrating the material injection | throwing-in process which concerns on a modification, (A) is a figure which shows the state in which the base material was mounted on the resin material, (B) is a base material by two resin materials. It is a figure which shows the state pinched | interposed.

(Embodiment 1)
Hereinafter, a forming apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  The molding apparatus according to the present embodiment fills a cavity formed by two molds arranged with a gap between them with a solid resin material, and then heats the resin material filled in the cavity with microwaves. Melt. And a shaping | molding apparatus produces | generates a molded article by butting two metal mold | dies, adjusting temperature, and solidifying the molten resin material.

  As shown in FIG. 1, the molding apparatus 1 according to the present embodiment includes a movable platen 10, a mold set 11, a microwave irradiation unit 15, a temperature adjustment unit 17, a suction unit 19, a fixed platen 21, and a mold clamping unit 22. And a mold lifting / lowering part (mold holding part) 25, a hopper 26 and a shield (shielding part) 27.

  The hopper 26 stores a solid resin material to be supplied to the mold set 11. As the solid resin material, for example, a pellet material or a flake material can be employed. In the case of a pellet material, the average particle diameter is, for example, about several μm to several mm. Further, as the type of the resin material, for example, PP, PS, ABS, PE, PA, PBT, PET, POM, PPS and the like which are thermoplastic resins can be adopted.

  The mold set 11 includes a metal movable mold (first mold) 12 and a fixed mold (second mold) 13. The movable mold 12 and the fixed mold 13 are formed with an uneven structure corresponding to the shape of the molded product to be manufactured. In the example shown in FIG. 1, a convex portion 121 is formed on the movable mold 12, and a concave portion 131 is formed on the fixed mold 13. In the state where the movable mold 12 and the fixed mold 13 are abutted, one cavity 111 is formed between the movable mold 12 and the fixed mold 13. The cavity 111 corresponds to a space filled with a resin material between the movable mold 12 and the fixed mold 13 arranged to face each other. The movable mold 12 is provided with a suction port 122 that communicates with the cavity 111 and sucks the gas present in the cavity 111, and an exhaust passage 123 that communicates with the suction port 122. The fixed mold 13 is provided with a plurality of through holes 132 penetrating from the upper wall surface of the fixed mold 13 to the cavity 111. And the diameter of the minimum diameter part of the through-hole 132 is set to the magnitude | size which a resin material (for example, pellet material and flake material) can pass. The diameter of the minimum diameter portion of the through hole 132 is set to, for example, about several mm. In this embodiment, an example in which a plurality of through holes 132 are provided in the fixed mold 13 is described. However, the fixed mold 13 has a configuration in which only one through hole 132 is provided. May be. The fixed mold 13 includes a metal lid 134 provided at the lower end of the through hole 132 and a drive mechanism (not shown) that drives the lid 134. The lid body 134 is immersed in the fixed mold 13 from the inner wall of the through hole 132 by the driving mechanism, thereby opening the through hole 132. On the other hand, the lid 134 closes the through hole 132 by protruding from the inner wall of the through hole 132 by the drive mechanism. Furthermore, a flange portion 133 that protrudes laterally is provided at the end of the fixed die 13 opposite to the side facing the movable die 12.

  The microwave irradiation unit 15 includes a high frequency generator 151 and a waveguide 152. The high frequency generator 151 is a so-called magnetron and generates a microwave. The frequency of the high frequency generated by the high frequency generator 151 is set to, for example, 0.902 to 24.25 GHz band. The frequency of the high frequency is appropriately selected according to the type of resin used. The waveguide 152 is made of a metal that is a conductor, and guides the microwave generated by the high-frequency generator 151. The microwave irradiation unit 15 is disposed at a position where microwaves can be irradiated from above the mold set 11. The microwave irradiation unit 15 irradiates microwaves into the cavity 111 through a through hole 132 provided in the fixed mold 13. The shape of the through-hole 132 is determined in consideration of the ease of removal from the fixed mold 13 at the time of release, the shape of the molded product, the resin material used, the microwave used, and the like.

  The temperature adjustment unit 17 includes a temperature adjustment unit main body 171 and a heat medium pipe 172. The temperature control unit main body 171 includes a compressor (not shown) and a heat exchanger (not shown), and via a heat medium flowing through the heat medium pipe 172 to cool the resin material after pressure molding. The temperature of the mold set 11 is adjusted. Here, the temperature adjusting unit 17 adjusts the temperature of the mold set 11 so as to be a specified temperature (for example, 80 ° C.) that is lower than the melting point of the resin material and higher than normal temperature. The temperature adjusting unit 17 may be configured to adjust the temperature at a temperature equal to or lower than normal temperature. In order to adjust the temperature of the mold set 11, a heater such as a cartridge heater may be installed in the mold set 11 instead of the heat medium.

  The suction unit 19 includes a vacuum pump 191 and an exhaust pipe 192. The suction part 19 sucks the gas in the cavity 111 of the mold set 11 by driving the vacuum pump 191 in a state where the exhaust pipe 192 is connected to the exhaust path 123 formed in the movable mold 12. The suction port 122 is provided with a member (not shown) made of, for example, a porous metal on the inner side, and is located between the exhaust path 123 and the cavity 111. This prevents the resin material from entering the exhaust passage 123.

  The fixed platen 21 is in contact with the fixed mold 13 of the mold set 11. A movable mold 12 is attached to the movable platen 10.

  The mold clamping unit 22 includes a mold clamping unit main body 221, a pressing mechanism 222 that presses the mold clamping unit main body 221 and the mold set 11 toward the fixed platen 21, and a tie bar 223. The mold clamping unit main body 221 incorporates an electric or hydraulic drive mechanism that drives the pressing mechanism 222. The pressing mechanism 222 is movable in a direction that protrudes with respect to the mold clamping unit main body 221 and a direction in which it is immersed (see arrow AR10 in FIG. 1). The tie bar 223 is erected on the side where the pressing mechanism 222 of the mold clamping unit main body 221 sinks. A fixed platen 21 is fixed to the tie bar 223 at a distance from the mold clamping unit main body 221.

  The mold lifting / lowering unit 25 moves the fixed mold 13 up and down while holding the flange 133 of the fixed mold 13. The mold lifting / lowering unit 25 can also hold the movable mold 12 in a state where the movable mold 12 is separated from the fixed mold 13 by a preset distance.

  The shield 27 is made of, for example, a metal box, and shields the microwave irradiated from the microwave irradiation unit 15. The shield 27 covers the movable mold 12, the fixed mold 13, and the microwave irradiation unit 15.

  The movable platen 10, the mold set 11, and the mold lifting / lowering unit 25 constitute a movable unit U1 that can move between an input position, a heating position, and a pressurizing position (see arrow AR0 in FIG. 1). Yes. Here, the charging position is a position where a solid resin material is charged into the cavity 111 of the mold set 11 from the hopper 26. The heating position is a position where the microwave irradiation unit 15 heats the resin material filled in the cavity 111 of the mold set 11. The pressurizing position is determined by pressing the movable platen 10 with the movable mold 12 attached to the fixed platen 21 brought into contact with the fixed mold 13 by the mold clamping unit 22, thereby moving the cavity of the mold set 11. This is a position to pressurize the resin material filled in 111.

  Next, a molding method using the molding apparatus 1 according to the present embodiment will be described with reference to FIGS. In this molding method, as shown in FIG. 2, a material charging process, a heating process, a pressurizing / solidifying process, and a mold releasing process are sequentially performed. First, a material charging process (first process) in which a solid resin material is charged between the movable mold 12 and the fixed mold 13 is executed (step S101). Specifically, the movable mold 12 and the fixed mold 13 are arranged apart from each other by a gap G1. Here, the mold lifting / lowering unit 25 is a fixed mold in a state where a gap G1 is generated between the contact surfaces 12a and 13a of the movable mold 12 and the fixed mold 13 that are in contact with each other in the pressurizing and solidifying process. 13 is held. The distance W1 of the gap G1 is appropriately set according to the type of molded product to be manufactured. In this state, the movable unit U1 is moved to the charging position, and the solid resin material M1 is charged into the cavity 111 from the hopper 26 through the through-hole 132 provided in the fixed mold 13 as shown in FIG. (See arrow AR1 in FIG. 3). At this time, the molding apparatus 1 sucks the resin material M1 put into the cavity 111 through the suction port 122 and the exhaust path 123 by the suction unit 19 (see arrow AR2 in FIG. 3). Thereby, the solid resin material M1 can be spread evenly to every corner of the cavity 111.

  Returning to FIG. 2, next, the resin material charged between the movable mold 12 and the fixed mold 13, that is, the resin material filled in the cavity 111 is irradiated with microwaves to heat the resin material. A heating step (second step) for melting is performed (step S102). In this step, the molding apparatus 1 moves the movable unit U1 to the heating position, and then, as shown in FIG. 4, the microwave irradiation unit 15 passes the resin material through the through-hole 132 provided in the fixed mold 13. M2 is irradiated with microwaves (see arrow AR3 in FIG. 4). Thereby, the resin material M2 in the cavity 111 is heated and melted by the interaction between the molecules constituting the resin material M2 and the microwave. In this step, for example, based on the type of the resin material M2 put into the cavity 111, the size of the cavity 111, the entire resin material M2 put into the cavity 111 (weight), etc. Irradiate waves. At this time, the gas generated when the resin material melts is released from the through hole 132 of the fixed mold 13 to the outside of the mold set 11 (see arrow AR4 in FIG. 4). Further, the molding apparatus 1 sucks the gas generated from the resin material M2 melted in the cavity 111 through the suction port 122 and the exhaust path 123 by the suction unit 19 (see arrow AR5 in FIG. 4). Thereby, generation | occurrence | production of the void in a molded article is suppressed.

  Returning to FIG. 2, subsequently, the movable mold 12 is brought close to the fixed mold 13 and the movable mold 12 and the fixed mold 13 are brought into contact with each other, so that the temperature is adjusted while the molten resin material is pressurized. -A solidification process (3rd process) is performed (step S103). In this step, as shown in FIG. 5, the molding apparatus 1 closes the through hole 132 of the fixed mold 13 with the lid 134 and then moves the movable unit U <b> 1 to the pressurizing position. Then, as shown in FIG. 5, the molding apparatus 1 presses the mold set 11 against the fixed platen 21 with a pressure set in advance by the pressing mechanism 222 of the mold clamping unit 22 (see arrow AR <b> 6 in FIG. 5). Here, the molding apparatus 1 abuts the abutting surfaces 12a and 13a of the movable mold 12 and the fixed mold 13 while pressurizing the resin material M3 in the cavity 111. Moreover, the molding apparatus 1 adjusts the temperature of the mold set 11 to a preset temperature lower than the solidification temperature of the resin material by the temperature adjusting unit 17. As a result, the resin material M3 in the cavity 111 is pressurized and solidified. Further, the molding apparatus 1 sucks the gas generated when the resin material M3 is pressurized through the through hole 132 of the fixed mold 13 by the suction part 19 (see arrow AR7 in FIG. 5). Thereby, the molding defect of the molded product and the generation | occurrence | production of the void in a molded product resulting from the shrinkage | contraction accompanying solidification of the resin material M3 are suppressed.

  Returning to FIG. 2, after the resin material M <b> 3 is solidified, the movable mold 12 and the fixed mold 13 are separated from each other, thereby performing a mold release process (fourth process) for taking out a molded product formed from the resin material. (Step S104). In this step, the molding apparatus 1 moves the movable unit U1 out of the pressurizing position, and then separates the fixed mold 13 and the movable mold 12 by the mold lifting unit 25 as shown in FIG. (See arrow AR8 in FIG. 6). Then, the molded product P1 placed on the movable mold 12 is taken out (see arrow AR9 in FIG. 6).

  By the way, in the conventional resin injection molding method, the viscosity of the molten resin is high, and the flow resistance entering the cavity of the mold is high, so it is difficult to reach the details. On the other hand, according to the molding method according to the present embodiment, a solid resin material is introduced between the movable mold 12 and the fixed mold 13 and then the movable mold 12 and the fixed mold 13 are moved. The resin material is melted by heating. Thereby, filling of the resin material into the details in the cavity 111 is much easier. Therefore, since the shape of the molded product is not limited to the shape considering the flow resistance of the molten resin material, there is an advantage that the degree of freedom in designing the shape of the molded product can be expanded. In addition, the resin material can be saved.

  Furthermore, in the conventional resin injection molding, if there is a fine shape part having a fine shape in a part away from the injection part of the cavity, there is a concern that the resin material does not sufficiently reach the fine shape part and a molding defect occurs. was there. On the other hand, according to the molding method according to the present embodiment, the resin material is put in the cavity 111 in advance and then melted by heating. Therefore, the details of the cavity 111 due to the flow resistance of the resin material are compared with the conventional resin injection molding. There is little concern about insufficient penetration, and the occurrence of molding defects is suppressed.

  Moreover, in the conventional resin injection molding, when using a resin material containing particularly long fibers such as glass fiber and carbon fiber, breakage of these fibers occurs when the resin enters the cavity details of the mold, The strength or rigidity of the molded product was affected. On the other hand, according to the molding method according to the present embodiment, breakage of these fibers can be prevented, so that at least one property of strength and rigidity of the molded product can be improved.

  Furthermore, according to the molding apparatus 1 according to the present embodiment, the resin material filled in the cavity 111 is melted by dielectric heating using microwaves. Thereby, compared with the structure which fuse | melts the resin material by indirect heating, such as heat conduction, heat transfer, heat radiation, etc., the shaping | molding apparatus 1 reduces the loss of heat energy and has good heating efficiency. Therefore, the molding apparatus 1 has an advantage that when the same amount of resin material is heated and melted, the molding apparatus 1 can be reduced in size as compared with the above-described configuration in which the resin material is melted by indirect heating such as heat conduction, heat transfer, and heat radiation. .

  Furthermore, the molding method according to the present embodiment is a molding method that does not require an expensive injection molding machine, and has the advantage that the equipment cost and the space saving can be greatly reduced.

  Furthermore, in the heating process according to the present embodiment, a cavity that is a space for filling a resin material between the movable mold 12 and the fixed mold 13 by making the movable mold 12 and the fixed mold 13 face each other. In a state where 111 is formed, the resin material M2 is irradiated with microwaves through the through hole 132 provided in the fixed mold 13. Further, in the material charging step, a resin material is charged into the cavity 111 through the through hole 132 provided in the fixed mold 13. That is, the through-hole 132 is used for both the charging of the resin material M1 and the microwave irradiation to the resin material M2. Thereby, since the number of the through-holes 132 provided in the fixed mold 13 can be reduced, the strength of the fixed mold 13 can be increased.

  Furthermore, the molding apparatus 1 according to the present embodiment has a suction unit that sucks the gas in the cavity 111 of the mold set 11 while the exhaust pipe 192 is connected to the exhaust path 123 formed in the movable mold 12. 19 is provided. In the material charging step, the suction unit 19 sucks the solid resin material M <b> 1 charged into the cavity 111 through the suction port 122 and the exhaust path 123. This makes it easy to spread the solid resin material M1 over the entire cavity 111, and accordingly, the occurrence of molding defects is reduced accordingly. In the heating process, the suction unit 19 sucks gas generated from the resin material M <b> 2 melted in the cavity 111 through the suction port 122 and the exhaust path 123. Thereby, since the quantity of the gas wound in the resin material M2 with which the cavity 111 is filled is reduced, generation of voids in the molded product can be suppressed, and the quality of the molded product can be improved.

  Further, in the material charging process according to the present embodiment, the mold lifting / lowering unit 25 is interposed between the contact surfaces 12a and 13a that are in contact with each other in the pressurizing / solidifying process in the movable mold 12 and the fixed mold 13. The fixed mold 13 is held in a state where the gap G1 is generated. In this state, the solid resin material M1 is put into the cavity 111. On the other hand, in the pressurizing / solidifying step, the mold clamping unit 22 presses the resin material M3 in the cavity 111 by bringing the contact surfaces 12a, 13a of the movable mold 12 and the fixed mold 13 into contact with each other. Thereby, by appropriately setting the distance of the gap G1 according to the type and size of the molded product to be manufactured, it is possible to suppress the occurrence of molding defects due to the shrinkage of the resin material in the pressurizing / solidifying step.

  Furthermore, the molding apparatus 1 according to the present embodiment includes a shield 27 that covers the movable mold 12, the fixed mold 13, and the microwave irradiation unit 15. Thereby, the influence on the external apparatus arrange | positioned around the shaping | molding apparatus 1 by the microwave radiated | emitted from the microwave irradiation part 15 is reduced.

(Embodiment 2)
In the first embodiment, the example in which the solid resin material M1 is supplied through the through hole 132 of the fixed mold 13 has been described. In contrast, in the molding method according to the present embodiment, a fixed mold is disposed vertically below the movable mold, and a solid resin material is placed on the fixed mold. Then, the resin material is heated and melted by microwaves in a state where the fixed mold and the movable mold are separated from each other, and then the fixed mold and the movable mold are brought into contact with each other to be solidified to generate a molded product. .

  As shown in FIG. 7, the molding apparatus 2 according to the present embodiment includes a movable platen 10, a mold set 2011, a microwave irradiation unit 15, a temperature adjustment unit 17, a fixed platen 21, a mold clamping unit 22, and a shield 27. . In FIG. 7, the same reference numerals as those in FIG.

  The mold set 2011 includes a metal movable mold (second mold) 2012 and a fixed mold (first mold) 2013. The fixed mold 2013 is disposed vertically below the movable mold 2012. The movable mold 2012 has a recess 2121, and the fixed mold 2013 has a protrusion 2131. In a state where the movable mold 2012 and the fixed mold 2013 are brought into contact with each other, one cavity 2111 is formed between the movable mold 2012 and the fixed mold 2013. The movable mold 2012 is fixed to the movable platen 10, and the fixed mold 2013 is fixed to the fixed platen 21. The microwave irradiation unit 15 is disposed at a position where microwaves can be irradiated from the side of the mold set 2011.

  Next, a molding method using the molding apparatus 2 according to the present embodiment will be described with reference to FIGS. The molding method according to the present embodiment is executed in the order of the material charging step, the heating step, the pressurization / solidification step, and the mold release step, as in the molding method described with reference to FIG. 2 in the first embodiment.

  First, in the material charging step, as shown in FIG. 8, the molding apparatus 2 immerses the pressing mechanism 222 of the mold clamping unit 22 into the mold clamping unit main body 221 (see the arrow AR201 in FIG. 8), thereby moving the movable mold. 2012 and the fixed mold 2013 are separated. Then, in a state where the movable mold 2012 and the fixed mold 2013 are separated from each other, the solid resin material M201 is placed at a predetermined position of the fixed mold 2013 (see an arrow AR202 in FIG. 8). Further, the mounting of the solid resin material M201 on the fixed mold 2013 may be transported by, for example, a transport device (not shown) that transports the solid resin material.

  Next, in the heating process, as shown in FIG. 9, the molding apparatus 2 is configured such that the movable mold 2012 and the fixed mold 2013 are separated by the microwave irradiation unit 15 in a state where the movable mold 2012 and the fixed mold 2013 are separated from each other. The resin material M202 is irradiated with microwaves from a gap spaced apart on the side of 2013 (see arrow AR203 in FIG. 9). Accordingly, the resin material M202 placed on the fixed mold 2013 is heated and melted. At this time, the gas generated when the resin material melts is released to the sides of the movable mold 2012 and the fixed mold 2013.

  Subsequently, in the pressurization / solidification step, the molding apparatus 2 causes the movable platen 10 to move to the fixed platen 21 by causing the pressing mechanism 222 of the mold clamping unit 22 to protrude from the mold clamping unit body 221 as shown in FIG. Move closer. Then, the molding apparatus 2 presses and crushes the resin material M203 with the movable mold 2012 and the fixed mold 2013 (see arrow AR204 in FIG. 10). At this time, the resin material M203 is crushed and reaches every corner in the cavity 2111 of the mold set 2011. Further, the molding apparatus 2 adjusts the temperature of the mold set 2011 to a preset temperature by the temperature adjusting unit 17. Thereby, the resin material M203 in the cavity 2111 is solidified. Thereby, the molding defect of the molded product resulting from the shrinkage accompanying the solidification of the resin material M203 is suppressed.

  Thereafter, in the mold release step, the molding apparatus 2 immerses the pressing mechanism 222 of the mold clamping unit 22 into the mold clamping unit main body 221 as shown in FIG. 11 (see the arrow AR205 in FIG. 11), thereby moving the mold. 2012 and the fixed mold 2013 are separated. Then, the molded product P2 placed on the fixed mold 2013 is taken out (see arrow AR206 in FIG. 11).

  As described above, according to the molding apparatus 2 according to the present embodiment, in the material charging step, the solid resin material is replaced with the fixed mold 2013 while the movable mold 2012 and the fixed mold 2013 are separated from each other. Placed at a predetermined position. In the heating step, the microwave irradiating unit 15 irradiates the resin material with microwaves from the separated gap in a state where the movable mold 2012 and the fixed mold 2013 are separated from each other. This eliminates the need to move the mold set 2011 in accordance with each of the material charging process, heating process, and pressurization / solidification process. Thereby, since the shaping | molding apparatus 2 can simplify a structure compared with the shaping | molding apparatus 1 which concerns on Embodiment 1, it can achieve size reduction of the whole apparatus.

  By the way, in the case of the conventional molding method, for example, Japanese Patent Publication No. 3-33492 provides a thermoplastic resin press molding method in which a sheet or film similar to a molten thermoplastic resin is previously set on the mold surface. Has been. However, in this type of molding method, since the material cannot be melted on the mold, it is necessary to place the material that has already melted on the mold. However, since the positional accuracy at the time of mounting on a metal mold | die does not come out, shaping | molding accuracy was not good. On the other hand, in the case of the molding method according to the present embodiment, a solid resin material can be placed on a fixed position on the fixed mold 2013 and then melted. Can be produced.

(Embodiment 3)
In Embodiment 1, the example of the shaping | molding apparatus 1 which has the movable unit U1 movable between a charging position, a heating position, and a pressurization position was demonstrated. On the other hand, in the molding apparatus according to the present embodiment, the movable platen and the mold clamping part are arranged vertically above the fixed platen. In the molding method according to the present embodiment, the resin material is charged and the resin material is irradiated with microwaves in a state where the mold set is disposed between the fixed platen and the movable platen.

  As shown in FIG. 12, the molding apparatus 3 according to the present embodiment includes a movable platen 3010, a mold set 3011, a microwave irradiation unit 15, a temperature adjustment unit 17, a fixed platen 21, a mold clamping unit 3022, and a hopper 26. And a shield 27. In FIG. 12, the same reference numerals as those in FIG.

  The mold set 3011 includes a metal movable mold (second mold) 3012 and a fixed mold (first mold) 3013. The fixed mold 3013 is arranged vertically below the movable mold 3012. The movable mold 3012 has a recess 3121, and the fixed mold 3013 has a protrusion 3131. A cavity 3111 is formed between the movable mold 3012 and the fixed mold 3013 in a state where the movable mold 3012 and the fixed mold 3013 are brought into contact with each other. The movable mold 3012 is provided with a plurality of through holes 3122 that penetrate from the upper wall surface of the movable mold 3012 to the cavity 3111. A metal lid 3124 is provided at the lower end of the through hole 3122. A suction port 122 and an exhaust path 123 are formed in the fixed mold 3013 in the same manner as the movable mold 12 according to the first embodiment. The movable mold 3012 is fixed to the movable platen 3010, and the fixed mold 3013 is fixed to the fixed platen 21.

  The movable platen 3010 is provided with a through hole 3101 that communicates with a through hole 3122 of a movable mold 3012 fixed to the movable platen 3010.

  The mold clamping unit 3022 includes a mold clamping unit main body 3221, a pressing mechanism 3222 that presses the movable platen 3010 toward the fixed platen 21, and a tie bar 223. The pressing mechanism 3222 is movable in a direction protruding with respect to the mold clamping unit main body 3221 and a direction immersing in (see arrow AR30 in FIG. 12). The mold clamping unit main body 3221 and the pressing mechanism 3222 are provided with a through path 3224 that communicates from vertically above the mold clamping unit 3221 to the through hole 3101 of the movable platen 3010 fixed to the tip of the pressing mechanism 3222.

  The hopper 26 is movable between a loading position for feeding the resin material vertically above the mold clamping portion 3022 and a retracted position (see arrow AR311 in FIG. 12). The microwave irradiation unit 15 is also movable between an irradiation position for irradiating the resin material with microwaves vertically above the mold clamping unit 3022 and a retracted position (see arrow AR312 in FIG. 12).

  Next, a molding method using the molding apparatus 3 according to the present embodiment will be described with reference to FIGS. 13 to FIG. 16, the same reference numerals as those in FIG. 3 to FIG. The molding method according to the present embodiment is executed in the order of the material charging step, the heating step, the pressurization / solidification step, and the mold release step, as in the molding method described with reference to FIG. 2 in the first embodiment.

  First, in the material charging process, the molding apparatus 3 moves the movable mold 3012 and the stationary mold 3013 between the movable mold 3012 and the stationary mold 3013 in a state where the gap G1 is generated between the contact surfaces 12a and 13a of the movable mold 3012 and the stationary mold 3013. Only spaced apart. Further, the molding apparatus 3 moves the hopper 26 vertically above the mold clamping unit 3022. Then, as shown in FIG. 13, the solid resin material M <b> 1 is poured into the cavity 3111 from the hopper 26 through the through-path 3224 and the through-holes 3101 and 3122 communicating with each other (see arrow AR <b> 301 in FIG. 13).

  Next, in the heating process, the molding apparatus 3 moves the microwave irradiation unit 15 vertically above the mold clamping unit 3022. Then, as shown in FIG. 14, the molding apparatus 3 irradiates the resin material M2 with microwaves through the through holes 3224, 3101 and 3012 by the microwave irradiation unit 15 (see arrow AR303 in FIG. 14). Melt M2. Here, the gas generated when the resin material melts is discharged to the outside of the mold set 3011 through the through-path 3224 and the through-holes 3101 and 3012 that are in communication with each other (see arrow AR304 in FIG. 14).

  Subsequently, in the pressurizing / solidifying step, the molding apparatus 3 closes the through hole 3122 of the movable mold 3012 with a lid 3124 as shown in FIG. Then, the molding apparatus 3 presses the movable mold 3012 fixed to the movable platen 3010 to the fixed mold 3013 with a preset pressure by the pressing mechanism 3222 of the mold clamping unit 3022 (see arrow AR306 in FIG. 15). Here, the molding apparatus 3 abuts the abutting surfaces 12a and 13a of the movable mold 3012 and the fixed mold 3013 while pressurizing the resin material M3 in the cavity 3111.

  Thereafter, in the mold releasing step, the molding apparatus 3 raises the movable mold 3012 (arrow AR307 in FIG. 16) to separate the fixed mold 13 and the movable mold 12 as shown in FIG. Then, the molded product P1 placed on the fixed mold 3013 is taken out.

  As described above, according to the molding apparatus 3 according to the present embodiment, the through hole 3101 is provided in the movable platen 3010, and the through path 3224 is provided in the mold clamping unit main body 3221 and the pressing mechanism 3222. The through hole 3122 is also provided in the movable mold 3012 fixed to the movable platen 3010, and the through path 3224 and the through holes 3101 and 3122 communicate with each other. In the molding method according to the present embodiment, the resin material introduced into the cavity 3111 of the mold set 3011 and the microwave irradiation to the resin material introduced into the cavity 3111 are penetrated by the through-path 3224 that communicates with each other. And through holes 3101 and 3122. This eliminates the need for a mechanism for moving the mold lifting / lowering unit 25 and the movable unit U1 as in the molding apparatus 1 according to the first embodiment. Therefore, the configuration is simpler than that of the molding apparatus 1 according to the first embodiment. It can be.

(Modification)
Although the embodiments of the present invention have been described above, the present invention is not limited to the configurations of the above-described embodiments. For example, in the pressurization / solidification step of the molding method according to Embodiment 1, a molding method for manufacturing a molded product partially different in thickness by moving a mold partially independent of other parts, Also good.

  As shown in FIG. 17, the molding apparatus 4 used in the molding method according to this modification includes a movable platen 4010, a mold set 4011, a microwave irradiation unit 15, a temperature adjustment unit 17, a suction unit 19, and a fixed platen 21. A mold clamping unit 4022, a mold lifting unit 25, a hopper 26, and a shield 27. In FIG. 17, the same reference numerals as those in FIG.

  The mold set 4011 includes a metal first sub movable mold 4012, a second sub movable mold 4014, and a fixed mold 13. The first sub movable mold 4012 has a convex portion 4121 corresponding to the shape of the molded product, a through hole 4012a that penetrates the first sub movable mold 4012 in the vertical direction and the second sub movable mold 4014 is inserted through the first sub movable mold 4012. , Is formed. Then, in a state where the first sub movable mold 4012 and the second sub movable mold 4014 are opposed to the fixed mold 13, the first sub movable mold 4012, the second sub movable mold 4014, and the fixed mold are used. A cavity 4111 is formed between the mold 13 and the mold 13. In the first sub movable mold 4012, a suction port 122 and an exhaust path 123 are formed as in the movable mold 12 according to the first embodiment. The second sub movable mold 4014 is inserted into the through hole 4012a of the first sub movable mold 4012 and is movable in the vertical direction (see arrow AR401 in FIG. 17) with respect to the first sub movable mold 4012.

  The movable platen 4010 is formed with a through hole 4010a that penetrates in the vertical direction of the movable platen 4010 and through which the second sub movable mold 4014 is inserted.

  The mold clamping unit 4022 includes a mold clamping unit main body 4221, a first pressing mechanism 4222 and a second pressing mechanism 4224 that press the mold clamping unit main body 4221 and the mold set 4011 toward the fixed platen 21, a tie bar 223, Have The first pressing mechanism 4222 and the second pressing mechanism 4224 can move independently of each other in a direction protruding from the mold clamping unit main body 4221 and a direction immersing in (see arrows AR4010 and AR4011 in FIG. 17). .

  The movable platen 4010, the mold set 4011, and the mold lifting / lowering unit 25 are provided with a movable unit U4 that is movable between the aforementioned charging position, heating position, and pressure position (see arrow AR400 in FIG. 17). It is composed.

  Next, a molding method using the molding apparatus 3 according to this modification will be described with reference to FIGS. 17 and 18. The molding method according to this modification is executed in the order of the material charging step, the heating step, the pressurization / solidification step, and the mold release step, as in the molding method described with reference to FIG. 2 in the first embodiment. First, in the material charging step, the molding apparatus 4 moves the movable unit U4 to the charging position, and then charges the solid resin material from the hopper 26 to the cavity 4111 through the through hole 132 of the fixed mold 13. Next, in the heating step, the molding apparatus 3 moves the movable unit U3 to the heating position, and then the microwave irradiation unit 15 converts the resin material in the cavity 4111 through a part of the through hole 132 of the fixed mold 13. The resin material M403 is melted by irradiation with microwaves.

  Subsequently, in the pressurization / solidification step, the molding apparatus 3 moves the movable unit U4 to the pressurization position after closing the through hole 132 of the fixed mold 13 with the lid 134 as shown in FIG. Then, the molding apparatus 4 presses the mold set 4011 against the fixed platen 21 with a preset pressure by the first pressing mechanism 4222 and the second pressing mechanism 4224 of the mold clamping unit 4022 (see arrows AR402 and AR403 in FIG. 18). ). Here, the first pressing mechanism 4222 and the second pressing mechanism 4224 operate independently of each other, and move the second sub movable mold 4014 closer to the fixed mold 13 than the first sub movable mold 4012. As a result, the portion of the resin material M403 pressed by the second sub movable mold 4014 is thinner than the portion pressed by the first sub movable mold 4012.

  Thereafter, in the mold release process, the molding apparatus 4 moves the movable unit U4 out of the pressurizing position, and then uses the mold lifting / lowering unit 25 to fix the fixed mold 13, the first sub movable mold 4012, and the second sub. The movable mold 4014 is separated.

  By the way, the mold of a molded product having a thin part is generally a mold set 11 having no structure for partial pressurization as shown in FIG. 1, and the dimension of the cavity corresponding to the thin part is generally the thickness of the thin part. It narrows accordingly. If it does so, resin will not penetrate | invade into the cavity corresponding to this thin part, As a result, there exists a possibility that the molding defect of a thin part may arise. On the other hand, according to this configuration, first, the shape of the cavity 4111 of the mold set 4011 is made to be a shape in which the resin material easily spreads over the whole, and the resin material is spread over the entire cavity 4111. Thereafter, the second sub movable mold 4014 is moved independently of the first sub movable mold 4012 to form a thin portion of the molded product. Thereby, since the molding defect of the thin part of the molded product is suppressed, it becomes possible to manufacture a high-quality molded product having a partially different thickness.

  In the molding method according to Embodiment 1, the example in which only the solid resin material M1 is charged into the cavity 111 of the mold set 11 and filled in the material charging step has been described. However, the method is not limited to this, and a molding method in which a base material formed of a material other than the resin material is molded with resin may be used. As a base material, the base material formed from glass fiber material, carbon fiber material, etc. is employ | adopted, for example. The base material may be a solid sheet such as a film other than the above-described materials. Further, the base material may be a cut fiber material of glass fiber or carbon fiber. Further, the base material may be a member that adds an assembly function to the molded product, such as a bolt insert nut for inserting a bolt. Alternatively, the base material may be a member that adds a function of electrically connecting to another electric circuit to the molded product, such as a metal terminal or a metal bus bar. Furthermore, the base material may be a member that adds a display function for displaying information to the viewer on the molded product, such as a display board. In addition, the base material may be a member that improves the design and decorative properties of a molded product such as an emblem.

  Next, a molding method for molding a base material according to this modification with a resin will be described with reference to FIGS. 19 (A) and 19 (B). 19A and 19B, the same reference numerals as those in FIG. 3 are assigned to the same configurations as those in the first embodiment. Further, in FIGS. 19A and 19B, the temperature adjustment unit, the suction unit, the suction port, and the exhaust passage are not shown. Here, as shown in FIG. 19A, a metal mold set 5011 made of a movable mold 5012 and a fixed mold 5013 made of metal is used, and the movable mold 5012 is perpendicular to the fixed mold 5013. The case where it arrange | positions below is demonstrated. First, in the material charging step, the base material F1 that is a member that reinforces the molded product is placed in the concave portion 5121 of the movable mold 5012 in a state where the movable mold 5012 and the fixed mold 5013 are separated from each other.

  Next, as shown in FIG. 19B, the convex portion 5131 of the fixed mold 5013 is fitted into the concave portion 5121 of the movable mold 5012 so that the movable mold 5012 and the fixed mold 5013 are opposed to each other. In this way, the cavity 5111 in which the base material F1 is disposed inside is formed between the movable mold 5012 and the fixed mold 5013. In this state, the resin material M501 is filled into the cavity 5111 by introducing the solid resin material M501 into the cavity 5111 through the through hole 5132 of the fixed mold 5013 (see arrow AR501 in FIG. 19B). To do. Thereafter, in the heating step, the resin material filled in the cavity 5111 is irradiated with microwaves. Then, similarly to the molding method according to Embodiment 1, a pressurization / solidification step and a release step are performed.

  In addition, the shaping | molding method which molds the base material which concerns on this modification with resin is not limited to the above-mentioned shaping | molding method demonstrated using FIG. 19 (A) and (B). Another molding method according to this modification will be described with reference to FIGS. 20A and 20B and FIG. In FIGS. 20A and 20B and FIG. 21, the same reference numerals as those in FIG. 20A and 20B and FIG. 21, the temperature adjustment unit, the suction unit, the suction port, and the exhaust passage are not shown. First, in the material charging step, as shown in FIG. 20A, the resin material M601 is charged into the cavity 5111 with the movable mold 5012 and the fixed mold 5013 facing each other (in FIG. 20A). ) And the cavity 5111 is filled with the resin material M601.

  Next, after the movable mold 5012 and the fixed mold 5013 are separated from each other, the base material F2 is placed on the resin material M601 accumulated in the concave portion 5121 of the movable mold 5012 as shown in FIG. Put. Subsequently, as shown in FIG. 21, the movable mold 5012 and the fixed mold 5013 are again brought close to each other, and a gap G1 is formed between the contact surface 12a of the movable mold 5012 and the contact surface 13a of the fixed mold 5013. In a state where is formed, the movable mold 5012 and the fixed mold 5013 are opposed to each other. Thereafter, in the heating step, the resin material filled in the cavity 5111 is irradiated with microwaves. Then, similarly to the molding method according to Embodiment 1, a pressurization / solidification step and a release step are performed.

  In the case of these molding methods, a molded product in which the base materials F1 and F2 are exposed on a part of the surface can be produced.

  Still another molding method according to this modification will be described with reference to FIGS. 22A and 22B and FIG. 22A and 22B and FIG. 23, the same reference numerals as those in FIG. Further, in FIGS. 22A and 22B and FIG. 23, the temperature adjustment unit, the suction unit, the suction port, and the exhaust passage are not shown. First, as shown in FIG. 22A, the resin material M601 is put into the cavity 5111 with the movable mold 5012 and the fixed mold 5013 facing each other (see the arrow AR701 in FIG. 22A). The resin material M701 is accumulated in a part of the cavity 5111.

  Next, after the movable mold 12 and the fixed mold 13 are separated from each other, the base material F3 is placed on the resin material M701 accumulated in the concave portion 5121 of the movable mold 5012 as shown in FIG. Put. Subsequently, as shown in FIG. 23, the movable mold 5012 and the fixed mold 5013 are brought closer to each other, and a gap G1 is formed between the contact surface 12a of the movable mold 5012 and the contact surface 13a of the fixed mold 5013. In a state where is formed, the movable mold 5012 and the fixed mold 5013 are opposed to each other. In this state, the movable mold 12 and the fixed mold 13 are again brought into contact with each other, and then a solid resin material is introduced into the cavity 5111 (see the arrow AR702 in FIG. 23), and the resin material M701 in the cavity 5111 is not accumulated. Is filled with a resin material M702. Thereafter, in the heating step, the resin materials M701 and M702 filled in the cavity 5111 are irradiated with microwaves.

  In the case of this molding method, a molded product in which the base material F3 is embedded can be produced.

  Also, the molding method according to the second embodiment may be a molding method in which a base material formed from a material other than the resin material is molded with resin. In this case, in the material charging step, as shown in FIG. 24, the base material F4, which is a member that reinforces the molded product, is fixed to the predetermined mold 2013 with the movable mold 2012 and the fixed mold 2013 separated from each other. Place it at the position. Then, in a state where the movable mold 2012 and the fixed mold 2013 are separated from each other, the solid resin material M201 is placed on the base material F4 at a predetermined position of the movable mold 2012. Thereafter, the microwave is irradiated in a state where the movable mold 2012 and the fixed mold 2013 are separated from each other.

  Further, in the material charging process according to the present modification, for example, as shown in FIG. 25A, the solid resin material M201 is transferred to the movable mold 2012 with the movable mold 2012 and the fixed mold 2013 separated from each other. The base material F5 may be placed on the resin material M201 after being placed at a predetermined position.

  Alternatively, as shown in FIG. 25B, in the material charging step, first, in a state where the movable mold 2012 and the fixed mold 2013 are separated from each other, the solid resin material M801 is placed at a predetermined position of the movable mold 2012. Then, the base material F6 is placed on the resin material M801. Thereafter, the resin material 802 may be placed on the base material F6 in a state where the movable mold 2012 and the fixed mold 2013 are separated from each other. That is, the base material F6 may be sandwiched between the two resin materials M801 and M802. In addition, in FIG. 25 (A) and (B), the temperature control part 17 is abbreviate | omitting illustration.

  By the way, when manufacturing the above-described so-called integrally molded product by injection molding, a resin material and a fiber material are melt-kneaded in advance, and the melt-kneaded material is injected into a mold cavity to produce an integrally molded product. Is common. However, in the case of this molding method, the fiber material is refined by a relatively large shear stress applied to the fiber material when the resin material and the fiber material are melt-kneaded or injected into the cavity of the mold. If it does so, there exists a possibility that the fiber material contained in the integrally molded article produced by this shaping | molding method may be refined | miniaturized excessively, and the improvement of the intensity | strength of an integrally molded article may become difficult. In contrast, according to the present configuration, a solid resin material kneaded with a fiber material such as a glass fiber material or a carbon fiber material, and a resin material is placed in the cavity 111 in advance. Since the shear stress applied to the fiber material can be reduced, the strength or rigidity of the molded product can be improved. In addition, since a base material, which is a member formed of glass fiber material, carbon fiber material, or the like, which reinforces the molded product, is placed in the cavity 111 in advance, the shear stress applied to the base material can be reduced. At least one of strength and rigidity can be improved.

  In the first embodiment, the configuration in which the through hole 132 is provided only in the fixed mold 13 has been described. However, the configuration is not limited thereto, or the configuration in which the through hole is provided only in the movable mold 12 or the through hole May be provided in both the movable mold 12 and the fixed mold 13.

  In the first embodiment, the example in which the suction port 122 and the exhaust path 123 for sucking the gas existing in the cavity 111 of the mold set 11 are provided only in the movable mold 12 has been described. However, the present invention is not limited thereto, and the suction port and the exhaust path are provided only in the fixed mold 13, or the suction port and the exhaust path are provided in both the movable mold 12 and the fixed mold 13. It may be a configuration.

  In the heating process according to the first embodiment, for example, a temperature measurement unit that measures the temperature of the resin material M2 is provided, and the microwave is applied until the temperature of the resin material M2 measured by the temperature measurement unit reaches a preset reference temperature. You may make it irradiate.

  In the first embodiment, the example in which the through-hole 132 of the fixed mold 13 is used both for charging the solid resin material M1 in the material charging process and for irradiating the resin material M2 with microwaves in the heating process has been described. . However, the microwave irradiation to the resin material M2 in the heating process is not necessarily limited to the configuration performed through the through hole 132. For example, the movable mold 12 or the fixed mold 13 has a through hole dedicated to microwave irradiation ( (Not shown) may be provided, and the resin material M2 may be irradiated with microwaves through the through hole.

  In the first embodiment, a fixed mold having a concave portion and a rod-shaped or wedge-shaped movable mold are provided, and added to the resin material M2 by adjusting the amount of the movable mold entering the concave portion of the fixed mold. The structure which adjusts a pressure may be sufficient.

  In the first embodiment, in order to spread the solid resin material M1 over the entire cavity 111 of the mold set 11, for example, the entire mold set 11 may be vibrated. Specifically, a configuration in which ultrasonic waves are applied to the entire mold set 11 may be employed.

  The molding apparatus 1 according to Embodiment 1 may include a static electricity removing unit that removes static electricity generated in the solid resin material M1.

  In the material charging step according to the second embodiment, the resin material to be placed on the fixed mold 2013 is not limited to a block (block) type, for example, a pellet, flake, or powder resin It may be a material.

  In the second embodiment, the configuration including the movable platen 10, the mold set 2011, the microwave irradiation unit 15, the fixed platen 21, and the shield 27 that covers the entire mold clamping unit 22 has been described. However, the present invention is not limited to this, for example, a cover having an electromagnetic wave shielding function and movable between a position covering the resin material M202 placed on the fixed mold 2013 and a position not covering the resin material M202. (Not shown) may be provided. In this case, in the heating step, the cover is moved to the first position covering the resin material M202, and the microwave irradiation unit 15 is disposed inside the cover, and the movable mold 2012 and the fixed mold 2013 are separated from each other. The microwave may be applied to the resin material M202 from the gap. Then, after the heating process is completed, the cover may be moved to a position where the resin material M202 is not covered.

  In each embodiment, an example in which the movable molds 12 and 2012 and the fixed molds 13 and 2013 are used and the movable molds 12 and 2012 are brought close to the fixed molds 13 and 2013 in the pressurization / solidification process has been described. . However, the present invention is not limited to this. For example, a configuration in which two movable molds are used and the two movable molds are brought close to each other in the pressurizing / solidifying step may be employed.

  In each embodiment, the configuration in which the mold sets 11 and 2011 are forcibly cooled by the temperature adjustment unit 17 has been described. However, the present invention is not limited to this, and for example, the mold set 11 may be naturally cooled. .

  For example, the molding method according to each embodiment may be performed in a state where the mold sets 11 and 2011 are arranged in a vacuum chamber in a reduced pressure atmosphere. According to this structure, generation | occurrence | production of the void in a molded article can be reduced.

  Regarding the resin material used in each embodiment, the thermoplastic material is described as an example in the first embodiment, but may be a thermosetting material such as EP.

  In the material charging process according to Embodiment 2, the solid resin material M201 may be preheated before being placed on the movable mold 2012. In this case, the heating time with microwaves can be reduced. The preheating step of the solid resin material M201 may be performed using, for example, an infrared heater.

  In each embodiment and each modification, the example using a metal mold set has been described. However, the present invention is not limited to this, and a mold set formed of a material different from metal may be used. In this case, the lid that is attached to the mold set and closes the through hole provided in the fixed mold or the movable mold is made of a material having a thermal expansion coefficient close to that of the mold set material. It may be formed. Further, a porous material having a thermal expansion coefficient close to that of the material of the mold set may be disposed inside the suction port provided in the fixed mold or the movable mold, instead of the porous metal. .

  As mentioned above, although embodiment of this invention and the modification (Including what was written in the description, the following is the same) were demonstrated, this invention is not limited to these. The present invention includes a combination of the embodiments and modifications as appropriate, and a modification appropriately added thereto.

  The present invention can be widely used for manufacturing resin molded products such as automobile interior and exterior parts.

1, 2, 3, 4: Molding device, 10, 3010, 4010: movable platen, 11, 2011, 3011, 4011: mold set, 12, 2012, 3012, 5012: movable mold, 12a, 13a: contact Surface, 13, 2013, 3013, 5013: fixed mold, 15: microwave irradiation unit, 17: temperature adjusting unit, 19: suction unit, 21: fixed platen, 22, 3022, 4022: mold clamping unit, 25: mold Mold lifting part, 26: Hopper, 27: Shield, 111, 2111, 1211, 3111, 4111, 5111: Cavity, 121, 3131, 4121, 5131: Protruding part, 122: Suction port, 123: Exhaust passage, 131, 131 3121, 5121: recess, 132, 3101, 3122, 3224, 4010a, 4012a, 5132: through hole, 133: f , 134, 3124: lid, 151: high frequency generator, 152: waveguide, 171: temperature control unit main body, 172: heat medium pipe, 191: vacuum pump, 192: exhaust pipe, 221, 3221, 4221 : Mold clamping body, 222, 3222: pressing mechanism, 223: tie bar, 4012: first sub movable mold, 4014: second sub movable mold, 4222: first pressing mechanism, 4224: second pressing mechanism, G1 : Gap, U1, U3: Movable unit, F1, F2, F3, F4, F5, F6: Base material, M1, M2, M3, M201, M202, M203, M403, M501, M601, M701, M702, M801, M802 : Resin material, P1, P2: Molded product

Claims (13)

A first step of introducing a resin material between the first mold and the second mold;
A second step of heating and melting the resin material by irradiating the resin material with microwaves;
A third step of pressing and solidifying the molten resin material by bringing the first mold and the second mold close to each other and bringing the first mold and the second mold into contact with each other;
A fourth step of taking out a molded product formed from the resin material by separating the first mold and the second mold,
Molding method. In the second step, a cavity that is a space for filling the resin material between the first mold and the second mold by making the first mold and the second mold face each other. In the formed state, the resin material is irradiated with microwaves through a through-hole penetrating the cavity from at least one outer wall surface of the first mold and the second mold.
The molding method according to claim 1. In the first step, the resin material is introduced into the cavity through the through hole provided in at least one of the first mold and the second mold.
The molding method according to claim 2. In the first step, the gas is introduced into the cavity through a suction port and an exhaust path for sucking a gas present in the cavity provided in at least one of the first mold and the second mold. Sucking the resin material,
The molding method according to claim 2 or 3. In the second step, the molten metal is melted in the cavity through a suction port and an exhaust path for sucking gas existing in the cavity provided in at least one of the first mold and the second mold. Sucking the gas generated from the resin material
The molding method according to any one of claims 2 to 4. In the first step,
A base material that is a member that reinforces the molded product in a state where the first mold is disposed vertically below the second mold and the first mold and the second mold are separated from each other, After placing on the first mold,
With the first mold and the second mold facing each other, the cavity in which the base material is disposed inside is formed between the first mold and the second mold. The resin material is put into the cavity through the through hole.
The molding method according to any one of claims 2 to 5. In the first step, the resin material is placed in the first mold in a state where the first mold is positioned vertically below the second mold and the first mold and the second mold are separated from each other. Place in a predetermined position on the mold,
The molding method according to claim 1. In the first step, a base material that is a member that reinforces the molded product or adds a function to the molded product is placed at a predetermined position of the first mold,
The molding method according to claim 7. In the second step, in the state where the first mold and the second mold are separated, the resin material is irradiated with microwaves from the separated gap.
The molding method according to claim 7 or 8. A first mold;
A second mold,
A microwave irradiation unit for melting the resin material by irradiating the resin material placed between the first mold and the second mold with microwaves;
A mold clamping unit that pressurizes the resin material by bringing the first mold and the second mold close to each other and bringing the first mold and the second mold into contact with each other.
Molding equipment. At least one of the first mold and the second mold is formed between the first mold and the second mold when the first mold and the second mold are opposed to each other. A cavity that is a space filled with the resin material is provided with a through-hole penetrating from the outer wall surface,
The microwave irradiation unit irradiates the resin material with microwaves through the through hole.
The molding apparatus according to claim 10. It further comprises a suction part for sucking gas,
At least one of the first mold and the second mold is formed with a suction port and an exhaust path for sucking a gas present in the cavity,
The suction part sucks the gas present in the cavity through the suction port and the exhaust path,
The molding apparatus according to claim 11. A shielding unit that covers at least the first mold, the second mold, and the microwave irradiation unit, and shields the microwaves irradiated from the microwave irradiation unit;
The molding apparatus according to any one of claims 10 to 12.

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