JP6830175B2 - 圧力センサアセンブリ、測定装置、およびそれらの製造方法 - Google Patents
圧力センサアセンブリ、測定装置、およびそれらの製造方法 Download PDFInfo
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- JP6830175B2 JP6830175B2 JP2020503927A JP2020503927A JP6830175B2 JP 6830175 B2 JP6830175 B2 JP 6830175B2 JP 2020503927 A JP2020503927 A JP 2020503927A JP 2020503927 A JP2020503927 A JP 2020503927A JP 6830175 B2 JP6830175 B2 JP 6830175B2
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
Description
− セラミック基板と、信号処理要素と、センサ素子との積層を含む、圧力センサ装置の製造ステップ、
− 圧力センサ装置を、膜を備えることができる圧力センサハウジングに導入するステップ、
− 圧力センサ装置の導入後、圧力センサハウジング内に残っている残留容積を非圧縮性流体で充填するステップ、および
− 圧力センサハウジングを膜で閉じるステップ。
Claims (9)
- 少なくとも1つの圧力センサ装置(12)を備えた圧力センサアセンブリ(10)であって、前記圧力センサ装置(12)は、セラミック基板(14)と、少なくとも1つの信号処理要素(24)と、少なくとも1つのセンサ素子(20)とを備えた積層を有し、前記圧力センサ装置(12)は、膜(32)を備えたセンサハウジング(30)に導入され、前記膜(32)を備える前記センサハウジング(30)の残留容積が、非圧縮性流体(38)で充填され、前記センサ素子(20)は、前記膜(32)に面しかつこから離間した、前記セラミック基板(14)とは反対側の表面を含み、前記非圧縮性流体(38)は、前記センサ素子(20)の前記表面と前記膜(32)との間に存在し、前記積層を少なくとも横方向にも取り囲み、前記少なくとも1つの信号処理要素(24)が、前記セラミック基板(14)と前記少なくとも1つのセンサ要素(20)との間に配置され、
前記セラミック基板(14)は縁部に切り欠き部を有し、前記少なくとも1つの信号処理要素(24)と前記少なくとも1つのセンサ要素(20)とが前記切り欠き部から離間した位置における前記セラミック基板(14)上に配置され、
前記切り欠き部は、前記センサハウジング(30)に形成された開口部(46)と連通する
圧力センサアセンブリ。 - 前記センサ素子(20)は、先進多孔質シリコンMEMSセンサ素子(20)として設けられ適合された、請求項1に記載の圧力センサアセンブリ。
- 前記少なくとも1つの信号処理要素はASICである、請求項1から2のいずれか一項に記載の圧力センサアセンブリ。
- 前記膜(32)の前記センサハウジング(30)との反対側に、略間接的に前記膜(32)を覆う機械的保護部材(48)が配置された、請求項1から3のいずれか一項に記載の圧力センサアセンブリ。
- 前記非圧縮性流体は油、特に合成油として構成された、請求項1から4のいずれか一項に記載の圧力センサアセンブリ。
- 圧力センサアセンブリ(10)、特に請求項1から5のいずれか一項に記載の、少なくとも1つの圧力センサ装置(12)を有する圧力センサアセンブリ(10)の製造方法であって、少なくとも、
− セラミック基板(14)と、信号処理要素(24)と、センサ素子(20)との積層を含む前記圧力センサ装置(12)の製造ステップであって、前記信号処理要素(24)は、前記セラミック基板(14)と、前記センサ素子(20)との間に配置される、ステップと、
− 前記圧力センサ装置(12)を、膜(32)を備えることのできる圧力センサハウジング(30)に導入するステップと、
− 前記圧力センサ装置(12)の導入後、前記圧力センサハウジング(30)内に残っている残留容積を非圧縮性流体(38)で充填するステップと、
− 前記圧力センサハウジング(30)を膜(32)および/または密閉ボール(48)で閉じるステップと、
を備える方法。 - 前記非圧縮性流体で充填するべき残留容積を減らすために、少なくとも1つの充填要素(36)、好ましくは複数の充填要素(36)を、前記圧力センサハウジング(30)の1つまたは複数のハウジング領域と、前記圧力センサ装置(12)との間に配置する、請求項6に記載の方法。
- 測定装置(100)に前記圧力センサアセンブリ(10)の数に対応する数の収容部を設け、前記収容部では、膜(32)が作動流体に面する場合、前記測定装置(100)の接続片(104)の一種のフランジ(105)で、ハウジングリング(42)が形成する縁部で支持されるように、前記少なくとも1つの圧力センサアセンブリ(10)が使用位置で収容された、請求項1から5の圧力センサアセンブリ(10)を備えた測定装置(100)。
- 前記圧力センサアセンブリ(10)の前記ハウジングリング(42)と、前記接続片(104)の前記フランジ(105)との間には、封止手段(106)、特にOリングが配置可能であるかまたは配置された、請求項8に記載の測定装置。
Applications Claiming Priority (3)
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DE102017212866.6A DE102017212866A1 (de) | 2017-07-26 | 2017-07-26 | Drucksensoranordnung, Messvorrichtung und Verfahren zu deren Herstellung |
DE102017212866.6 | 2017-07-26 | ||
PCT/EP2018/069810 WO2019020529A1 (de) | 2017-07-26 | 2018-07-20 | Drucksensoranordnung, messvorrichtung und verfahren zu deren herstellung |
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JP2020528150A JP2020528150A (ja) | 2020-09-17 |
JP6830175B2 true JP6830175B2 (ja) | 2021-02-17 |
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JP2020503927A Active JP6830175B2 (ja) | 2017-07-26 | 2018-07-20 | 圧力センサアセンブリ、測定装置、およびそれらの製造方法 |
Country Status (4)
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US (1) | US11199461B2 (ja) |
JP (1) | JP6830175B2 (ja) |
DE (1) | DE102017212866A1 (ja) |
WO (1) | WO2019020529A1 (ja) |
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---|---|---|---|---|
US11460363B2 (en) | 2019-03-29 | 2022-10-04 | Honeywell International Inc. | Pressure sensors and methods of manufacturing a pressure sensor |
CN110631620A (zh) * | 2019-09-29 | 2019-12-31 | 歌尔股份有限公司 | 一种传感器装置 |
DE102020210143A1 (de) | 2020-08-11 | 2022-02-17 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Sensors sowie Sensor |
Family Cites Families (17)
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JPS60183478A (ja) * | 1984-02-29 | 1985-09-18 | フジテツク株式会社 | エレベ−タの防犯装置 |
US5285690A (en) * | 1992-01-24 | 1994-02-15 | The Foxboro Company | Pressure sensor having a laminated substrate |
US6311561B1 (en) | 1997-12-22 | 2001-11-06 | Rosemount Aerospace Inc. | Media compatible pressure sensor |
US6550337B1 (en) | 2000-01-19 | 2003-04-22 | Measurement Specialties, Inc. | Isolation technique for pressure sensing structure |
JP2001227902A (ja) * | 2000-02-16 | 2001-08-24 | Mitsubishi Electric Corp | 半導体装置 |
US6577244B1 (en) | 2000-05-22 | 2003-06-10 | Schlumberger Technology Corporation | Method and apparatus for downhole signal communication and measurement through a metal tubular |
DE10032579B4 (de) | 2000-07-05 | 2020-07-02 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement |
US6584853B2 (en) | 2001-10-12 | 2003-07-01 | Kavlico Corporation | Corrosion-proof pressure transducer |
JP2004045076A (ja) | 2002-07-09 | 2004-02-12 | Fuji Koki Corp | 圧力センサ |
DE102004036035B4 (de) | 2003-12-16 | 2015-10-15 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements sowie ein Halbleiterbauelement, insbesondere ein Membransensor |
JP4548066B2 (ja) * | 2004-09-24 | 2010-09-22 | 株式会社デンソー | 圧力センサ |
DE102007005862A1 (de) * | 2007-02-06 | 2008-08-14 | Siemens Audiologische Technik Gmbh | Schaltungsvorrichtung mit bebondetem SMD-Bauteil |
DE102008028757B4 (de) * | 2008-06-17 | 2017-03-16 | Epcos Ag | Verfahren zur Herstellung einer Halbleiterchipanordnung |
DE102012210752A1 (de) | 2012-06-25 | 2014-01-23 | Robert Bosch Gmbh | Druckerfassungsmodul sowie Drucksensorvorrichtung mit einem solchen Druckerfassungsmodul |
JP6136644B2 (ja) * | 2013-06-28 | 2017-05-31 | 富士電機株式会社 | 半導体圧力センサ装置およびその製造方法 |
FR3032791B1 (fr) * | 2015-02-18 | 2018-09-07 | L'essor Francais Electronique | Capteur de pression miniature a membrane metallique et procede de fabrication |
GB2542332A (en) * | 2015-06-29 | 2017-03-22 | Continental automotive systems inc | Pressure sensor device with a MEMS piezoresistive element attached to an in-circuit ceramic board |
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2017
- 2017-07-26 DE DE102017212866.6A patent/DE102017212866A1/de active Pending
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2018
- 2018-07-20 WO PCT/EP2018/069810 patent/WO2019020529A1/de active Application Filing
- 2018-07-20 JP JP2020503927A patent/JP6830175B2/ja active Active
- 2018-07-20 US US16/633,462 patent/US11199461B2/en active Active
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US20200386643A1 (en) | 2020-12-10 |
WO2019020529A1 (de) | 2019-01-31 |
JP2020528150A (ja) | 2020-09-17 |
DE102017212866A1 (de) | 2019-01-31 |
US11199461B2 (en) | 2021-12-14 |
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