JP6826995B2 - インジウム−スズ−銀ベースの無鉛はんだ - Google Patents

インジウム−スズ−銀ベースの無鉛はんだ Download PDF

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Publication number
JP6826995B2
JP6826995B2 JP2017557925A JP2017557925A JP6826995B2 JP 6826995 B2 JP6826995 B2 JP 6826995B2 JP 2017557925 A JP2017557925 A JP 2017557925A JP 2017557925 A JP2017557925 A JP 2017557925A JP 6826995 B2 JP6826995 B2 JP 6826995B2
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weight
alloy
silver
tin
solder
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Japanese (ja)
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JP2018520005A (ja
JP2018520005A5 (https=
Inventor
ペレイラ，ジョン
アンタヤ，スティーヴン・シー
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アプティブ・テクノロジーズ・リミテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Joining Of Glass To Other Materials (AREA)
JP2017557925A 2015-05-15 2016-05-12 インジウム−スズ−銀ベースの無鉛はんだ Active JP6826995B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562161966P 2015-05-15 2015-05-15
US62/161,966 2015-05-15
US201562168054P 2015-05-29 2015-05-29
US62/168,054 2015-05-29
PCT/US2016/032076 WO2016186954A1 (en) 2015-05-15 2016-05-12 Indium-tin-silver based lead free solder

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020083093A Division JP7082641B2 (ja) 2015-05-15 2020-05-11 インジウム－スズ－銀ベースの無鉛はんだ

Publications (3)

Publication Number Publication Date
JP2018520005A JP2018520005A (ja) 2018-07-26
JP2018520005A5 JP2018520005A5 (https=) 2019-03-22
JP6826995B2 true JP6826995B2 (ja) 2021-02-10

Family

ID=57320312

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017557925A Active JP6826995B2 (ja) 2015-05-15 2016-05-12 インジウム−スズ−銀ベースの無鉛はんだ
JP2020083093A Active JP7082641B2 (ja) 2015-05-15 2020-05-11 インジウム－スズ－銀ベースの無鉛はんだ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020083093A Active JP7082641B2 (ja) 2015-05-15 2020-05-11 インジウム－スズ－銀ベースの無鉛はんだ

Country Status (7)

Country Link
US (1) US9981347B2 (https=)
EP (1) EP3294489A4 (https=)
JP (2) JP6826995B2 (https=)
KR (1) KR102272298B1 (https=)
CN (4) CN116393868A (https=)
TW (1) TWI652354B (https=)
WO (1) WO2016186954A1 (https=)

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GB201515010D0 (en) * 2015-08-24 2015-10-07 Pilkington Group Ltd Electrical connector
CN111344903B (zh) 2017-11-07 2021-09-21 中央硝子株式会社 车窗用玻璃组件
CN112638575A (zh) * 2018-09-07 2021-04-09 中央硝子株式会社 车窗用玻璃组件
CN109648222A (zh) * 2019-01-21 2019-04-19 上海莜玮汽车零部件有限公司 一种无铅焊料合金及其应用
CN109702372A (zh) * 2019-03-06 2019-05-03 上海莜玮汽车零部件有限公司 无铅焊料合金及其应用
CN109852843A (zh) * 2019-04-02 2019-06-07 史伟华 一种铟锡银铜合金及其制备方法和应用
US11383330B2 (en) * 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition
CN113042842A (zh) * 2021-03-24 2021-06-29 河南东微电子材料有限公司 一种钌靶材与背板焊接的方法
JP2023091943A (ja) * 2021-12-21 2023-07-03 Ａｇｃ株式会社 積層部材
US12269127B2 (en) * 2022-04-22 2025-04-08 Magna Exteriors, Inc. Vehicular window assembly process with temperature control of the solder joint that attaches an electrical connector
CN115041863B (zh) * 2022-06-22 2023-04-25 浙江亚通新材料股份有限公司 一种汽车玻璃用复合钎料及其制备方法和应用

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Also Published As

Publication number Publication date
KR102272298B1 (ko) 2021-07-05
TWI652354B (zh) 2019-03-01
CN112958943A (zh) 2021-06-15
WO2016186954A1 (en) 2016-11-24
CN115139008B (zh) 2023-05-23
JP2018520005A (ja) 2018-07-26
KR20180006874A (ko) 2018-01-19
EP3294489A4 (en) 2019-04-10
TW201807211A (zh) 2018-03-01
CN116393868A (zh) 2023-07-07
EP3294489A1 (en) 2018-03-21
US20170368642A1 (en) 2017-12-28
JP2020124747A (ja) 2020-08-20
JP7082641B2 (ja) 2022-06-08
CN115139008A (zh) 2022-10-04
US9981347B2 (en) 2018-05-29
CN112958943B (zh) 2022-09-06
CN107635717B (zh) 2021-02-05
CN107635717A (zh) 2018-01-26

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