JP6824797B2 - Manufacturing method of screen printing plate - Google Patents

Description

The present invention relates to a method for manufacturing a screen printing plate in which a metal mesh portion and a metal mask portion are integrally provided.

Conductor paste printing by a screen printing method is often used in the process of manufacturing a conductor layer in electronic components such as multilayer ceramic capacitors and multilayer ceramic inductors. However, since electronic components that are becoming smaller and smaller require a conductor layer having a small outer shape and thickness, conventional screen printing plates (screen printing plates in which openings are formed in a mesh with an emulsion) meet this requirement. It is becoming difficult to be satisfied with the accuracy. Therefore, recently, instead of the conventional screen printing plate, a screen printing plate having a metal mesh portion and a metal mask portion integrally used is used in the process of manufacturing the conductor layer.

Regarding a screen printing plate in which a metal mesh portion and a metal mask portion are integrally provided, Patent Document 1 described later describes (a1) a step of forming a pattern resist film on the surface of a master mold, and (a2) a pattern resist film of a master mold. Step of forming a primary electrodeposition layer having a thickness smaller than that of the pattern resist film on the surface portion not covered with (a3) Polishing the pattern resist film until the thickness becomes substantially uniform with the primary electrodeposition layer. Steps, (a4) a step of adhering a mesh screen to the surface of the pattern resist film and the primary electrodeposition layer, (a5) a step of forming a secondary electrodeposition layer on the surface of the mesh screen and the primary electrodeposition layer, (a6). ) A method for manufacturing a suspended metal mask (hereinafter referred to as known method 1) including a step of peeling a mesh screen from a master mold is disclosed.

Further, in Patent Document 2 described later, (b1) a step of forming a resist for forming a print opening pattern on the surface of the base metal, and (b2) a base metal is plated on a surface portion of the surface portion of the base metal not covered with the resist. The step of forming, (b3) the step of adhering the metal mesh to the surface of the base metal, (b4) the step of joining the base metal and the metal mesh by plating, (b5) the step of joining the base metal and the metal mesh. A method for manufacturing a suspended metal mask for printing (hereinafter referred to as known method 2) including a step of peeling the metal from the master mold and (b6) a step of peeling the resist from the opening pattern for printing of the base metal is disclosed.

However, in the known method 1, since the secondary electrodeposition layer formed on the surface of the primary electrodeposition layer in the step (a5) serves as the mask portion, the step (1) for obtaining the mask portion having an opening is obtained. ) To (3) are indispensable. Further, since it is necessary to bring the mesh screen into close contact with the surface of the primary electrodeposition layer (the electrodeposition layer not used as a mask) in the steps (a4) and (a5), the mesh screen is partially formed on the outer surface of the mask portion. It is easily exposed, and there is a concern that this exposure may cause problems such as impairing the smoothness of the outer surface of the mask portion and disturbing the shape of the opening, resulting in a decrease in printing accuracy.

Further, in the known method 2, when the base metal and the metal mesh joined in the step (b5) are peeled from the master mold, the resist is also peeled from the master mold, so that the base metal and the metal mesh are peeled from the master mold. The step (b6) of peeling the resist from the printing opening pattern of the base metal after peeling from the base metal is indispensable. Further, when the inner shape of the printing opening pattern of the base metal becomes smaller, it becomes difficult to peel the resist from the printing opening pattern of the base metal in the step (b6), so that peeling failure occurs and the resist is applied to the printing opening pattern. There is also a concern that

JP-A-2010-042567 International Publication No. 2014/098118

The problem to be solved by the present invention is a method for manufacturing a screen printing plate capable of eliminating the concerns of the publicly known methods 1 and 2 as much as possible, that is, manufacturing a screen printing plate capable of manufacturing a screen printing plate having high printing accuracy by a simple method. To provide a method.

In order to solve the above problems, the method for manufacturing a screen printing plate according to the present invention is a method for manufacturing a screen printing plate in which a metal mesh portion and a metal mask portion having an opening are integrally provided, and is a method for manufacturing a screen printing plate of a metal substrate. By the step of producing a master mold in which the insulator convex portion corresponding to the opening is integrally formed on the outer surface and the first electric casting, the outer surface region of the metal substrate of the master mold in which the insulator convex portion does not exist. In the step of forming the first electrodeposited metal foil having a thickness smaller than the convex portion of the insulator, and the second electric charge in a state where the metal mesh is brought into close contact with the outer surface of the convex portion of the insulator of the master mold. By casting, an electrodeposited metal film is formed on the surface of the metal mesh, and the outer surface of the first electrodeposited metal foil is continuous with the electrodeposited metal film and joined with the first electrodeposited metal foil. 2 The electrodeposited metal foil is formed, and the metal mesh portion made of the metal mesh and the electrodeposited metal film is integrated with the metal mask portion made of the first electrodeposited metal foil and the second electrodeposited metal foil. In the step of producing the compound, the electrodeposited metal film of the integrated product is peeled off from the outer surface of the convex portion of the insulator, and the first electrodeposited metal foil and the second electrodeposited metal foil are separated from the metal substrate. The present invention includes a step of extracting from the outer surface region where the insulator convex portion does not exist, and removing the integrated product from the master mold while leaving the insulator convex portion on the outer surface of the metal substrate.

According to the screen printing plate manufacturing method according to the present invention, a screen printing plate having high printing accuracy can be accurately manufactured by a simple method.

1 (A) and 1 (B) are explanatory views of a manufacturing process of a printing plate main body. 2 (A) and 2 (B) are explanatory views of a process of manufacturing a master mold. FIG. 3 is an explanatory diagram of the first electroforming process. 4 (A) and 4 (B) are explanatory views of the first electroforming process. FIG. 5 is an explanatory diagram of a process of bringing the metal mesh of the printing plate body into close contact with the insulator convex portion of the master mold. FIG. 6 is an explanatory diagram of the second electroforming process. 7 (A) and 7 (B) are explanatory views of the second electroforming process. FIG. 8 is an explanatory diagram of the mold release process. FIG. 9 is an explanatory diagram of the finishing process.

Hereinafter, a method for manufacturing a screen printing plate to which the present invention is applied will be described in order of steps with reference to FIGS. 1 to 9. By the way, the screen printing plate manufactured by this manufacturing method is useful for performing conductor paste printing by the screen printing method in the process of manufacturing the conductor layer in electronic parts such as multilayer ceramic capacitors and multilayer ceramic inductors. ..

<< Manufacturing process of printing plate main body 10: See FIG. 1 >>
When manufacturing the printing plate main body 10 shown in FIG. 1 (B), as shown in FIG. 1 (A), a metal mesh 11 having a rectangular outer shape is prepared, and a frame having a rectangular outer shape is provided on the outer peripheral portion thereof. The inner peripheral portion of the auxiliary mesh 12 forming the shape is fixed. Although not shown, an adhesive capable of obtaining high adhesive strength, preferably an adhesive such as an ultraviolet curable adhesive or a cyanoacrylate adhesive, can be used for fixing the metal mesh 11 and the auxiliary mesh 12.

The metal mesh 11 is formed by weaving metal wires such as stainless steel and tungsten in a grid pattern, and has a large number of holes. By the way, the thickness t2 of the metal mesh 11 (see FIG. 7A) is preferably 15 to 30 μm, and the opening is preferably 20 to 35 μm.

Since the metal mesh 11 shown in FIG. 7A has been subjected to calendar processing, a flat surface is formed at a portion where the metal wires on both sides in the thickness direction intersect. This calendar processing is a construction method whose main purpose is to reduce the thickness t2 of the metal mesh 11, but a metal wire having a small wire diameter is used for the metal mesh 11, and the thickness t2 is within the above numerical range. Calendar processing is not always necessary in the case of.

The auxiliary mesh 12 is formed by weaving synthetic resin wires such as polyester and polyarylate in a grid pattern, and has a large number of holes. Since the auxiliary mesh 12 serves to apply tension to the metal mesh 11, there is no particular limitation on its thickness.

Then, as shown in FIG. 1 (B), a plate frame 13 having a rectangular outer shape is prepared, and the outer peripheral portion of the auxiliary mesh 12 shown in FIG. 1 (A) is pulled outward on the lower surface thereof. While sticking. Although not shown, an adhesive capable of obtaining high adhesive strength, preferably an adhesive such as an ultraviolet curable adhesive or a cyanoacrylate adhesive, can be used for fixing the auxiliary mesh 12 to the plate frame 13.

The plate frame 13 is made of a metal such as stainless steel or an aluminum alloy. The plate frame 13 serves to support the metal mesh 11 and the auxiliary mesh 12, and as long as it has rigidity that does not deform due to the tension, there are no particular restrictions on its cross-sectional shape and cross-sectional area.

Although FIG. 1 shows a printing plate main body 10 having an auxiliary mesh 12, the auxiliary mesh 12 is not always necessary, and a metal mesh 11 having a large size is prepared and the outer peripheral portion thereof is used as a plate. It may be fixed directly to the frame 13.

<< Manufacturing process of mother mold 20: See Fig. 2 >>
When producing the master mold 20 shown in FIG. 2 (B), as shown in FIG. 2 (A), a metal substrate 21 having a rectangular outer shape is prepared, and the outer surface 21a is subjected to polishing and cleaning treatments. Give. Electrolytic polishing and buffing can be preferably used for the polishing treatment, and alkaline degreasing cleaning and electrolytic cleaning can be preferably used for the cleaning treatment.

The metal substrate 21 is made of a metal such as stainless steel. The outer shape of the outer surface 21a of the metal substrate 21 is slightly smaller than the outer shape of the exposed portion of the metal mesh 11 shown in FIG. 1 (B). The metal substrate 21 is the main body of the master mold 20, and there is no particular limitation on the thickness thereof as long as it has rigidity that does not deform due to close contact.

Then, as shown in FIG. 2B, the insulator convex portion 22 corresponding to the opening portion 31a (see FIG. 8) of the metal mask portion 31 described later is integrally formed on the outer surface 21a of the metal substrate 21. .. Later, when the metal mask portion 31 has a large number of openings 31a, the same number and arrangement of the same number of insulator convex portions 22 as these openings 31a are formed on the outer surface 21a of the metal substrate 21.

The insulator convex portion 22 is made of an insulator material, preferably an insulating ceramic material such as aluminum oxide, silicon dioxide, or aluminum nitride. Of course, as the insulator material, in addition to the insulating ceramic material, a material having an insulating property such as silicon carbide or diamond-like carbon can also be used. Incidentally, the thickness (reference numeral omitted) of the insulator convex portion 22 is preferably 0.3 to 4 μm, and this thickness is the thickness t1a of the first electrodeposited metal leaf EF1a described later (FIGS. 4 (B) and FIG. 7 (B)) corresponds to the sum of the thickness t1b (see FIG. 7B) of the second electrodeposited metal leaf EF1b described later. Further, the outer shape of the insulator convex portion 22 when viewed from above in FIG. 2B corresponds to the outer shape when the opening 31a of the metal mask portion 31 described later is viewed from below in FIG. For example, when the outer shape of the opening 31a when viewed from the bottom of FIG. 8 is rectangular, the outer shape of the insulator convex portion 22 when viewed from above of FIG. 2B has a corresponding rectangular shape. Is. Of course, it goes without saying that various shapes other than the rectangle can be adopted as the outer shape of the insulator convex portion 22 when viewed from above in FIG. 2 (B).

Here, a method of integrally forming a large number of insulating convex portions 22 made of an insulating ceramic material on the outer surface 21a of the metal substrate 21 will be introduced.

<First Method> First, a commercially available negative photoresist sheet is attached to the outer surface 21a of the metal substrate 21, or a commercially available positive or negative photoresist agent is applied, and then photolithography is performed. By the method, unnecessary portions are eliminated to form a resist pattern having a large number of concave portions corresponding to a large number of insulating convex portions 22. Subsequently, a large number of resist patterns are formed by a physical vapor deposition method (PVD method) such as vacuum deposition, ion plating, or sputtering, or a chemical vapor deposition method (CVD method) such as plasma CVD, thermal CVD, or optical CVD. Insulating ceramic material is deposited to the desired thickness in the recesses of the. Subsequently, the resist pattern is peeled off from the outer surface 21a of the metal substrate 21 and removed, leaving only a large number of insulator convex portions 22 on the outer surface 21a of the metal substrate 21.

<Second Method> First, a mask sheet prepared in advance is attached to the outer surface 21a of the metal substrate 21. This mask sheet has a large number of holes corresponding to a large number of insulator protrusions 22. Subsequently, as in the first method, an insulating ceramic material is formed in a large number of holes in the mask sheet by a physical vapor deposition method (PVD method) or a chemical vapor deposition method (CVD method) to obtain a desired thickness. Accumulate until now. Subsequently, the mask sheet is peeled off from the outer surface 21a of the metal substrate 21 and removed, leaving only a large number of insulator convex portions 22 on the outer surface 21a of the metal substrate 21.

<< First electroforming process: see FIGS. 3 and 4 >>
As shown in FIG. 3, the master mold 20 described above is placed in a bathtub (not shown) containing a bath liquid and an anode, and the first electroplating is performed using the metal substrate 21 of the master mold 20 as a cathode. Do.

As the bath liquid for performing the first electroforming, a watt bath, a nickel sulfamate bath, a nickel sulfamate bath, or the like can be preferably used. Further, as the anode, a titanium mesh bag containing nickel pieces or nickel grains, a polypropylene mesh bag containing nickel pieces or nickel grains and a titanium energizing rod, or the like can be preferably used. Further, the electrolytic conditions for performing the first electroforming are preferably a bath temperature of 40 to 60 ° C. and an anode and cathode current densities of 1 to 4 A / dm ^{2 in} the case of a watt bath and a nickel sulfamate bath. , The electrolysis time is 0.6 to 20 minutes. In the case of a sulfamate nickel bath, the bath temperature is preferably 25 to 70 ° C., the current densities of the anode and cathode are 1 to 5 A / dm ² , and the electrolysis time is 0.5 to 20 minutes.

At the start stage of the first electroplating, as shown in FIG. 4A, the outer surface region 21a1 of the metal substrate 21 in which the insulator convex portion 22 does not exist corresponds to the thickness of the insulator convex portion 22. There is a dent (sign omitted). At the final stage of the first electroplating, as shown in FIG. 4B, the first electrodeposited metal foil EF1a is formed in the outer surface region 21a1 where the insulator convex portion 22 of the metal substrate 21 does not exist. As can be seen from FIG. 4B, the thickness t1a of the first electrodeposited metal foil EF1a formed by the first electrocasting is smaller than the thickness of the insulator convex portion 22. The reason why the thickness t1a of the first electrodeposited metal leaf EF1a is made smaller than the thickness of the insulator convex portion 22 is the gap GA for forming the second electrodeposited metal leaf EF1b described later (see FIG. 7A). Is to be secured between the metal mesh 11 and the outer surface (reference numeral omitted) of the first electrodeposited metal foil EF1a. Further, in order to form the second electrodeposition metal leaf EF1b described later without any trouble by the second electroplating described later, the gap GA should be set as small as possible, that is, the thickness t1b of the second electrodeposited metal leaf EF1b described later ( (See FIG. 7B) is preferably set to be smaller than the thickness t1a of the first electrodeposited metal leaf EF1a.

<< Step of bringing the metal mesh 11 of the printing plate body 10 into close contact with the insulator convex portion 22 of the master mold 20: see FIG. 5 >>
The printing plate main body 10 and the master mold 20 described above are prepared, and as shown in FIG. 5, the metal mesh 11 of the printing plate main body 10 is relatively pressed against the outer surface 22a of the insulator convex portion 22 of the master mold 20. The metal mesh 11 is brought into close contact with the outer surface 22a of the insulator convex portion 22. When the number of the insulator convex portions 22 is large, sufficient adhesion cannot be obtained if the pressing force is small, and conversely, if the pressing force is too strong, the metal mesh 11 may be deformed to partially create a gap. It is preferable to repeat the trial to determine the optimum pressing force. After the metal mesh 11 is brought into close contact with the outer surface 22a of the insulator convex portion 22, a holder such as a tape (not shown) hung from the outer surface opposite to the outer surface 21a of the metal substrate 21 toward the plate frame 13 is used. , The close contact state is maintained.

<< Second electroforming process: see FIGS. 6 and 7 >>
As shown in FIG. 6, the contact object (reference numeral omitted) between the printing plate main body 10 and the master mold 20 described above is placed in a bathtub (not shown) containing the bath liquid and the anode, and the master mold 20 is placed. The second electroforming is performed using the metal substrate 21 of the above as a cathode.

As the bath liquid for performing the second electroforming, a watt bath, a nickel sulfamate bath, a nickel sulfamate bath, or the like can be preferably used. Further, as the anode, a titanium mesh bag containing nickel pieces or nickel grains, a polypropylene mesh bag containing nickel pieces or nickel grains and a titanium energizing rod, or the like can be preferably used. Further, the electrolytic conditions for performing the second electroforming are preferably a bath temperature of 40 to 60 ° C. and an anode and cathode current densities of 0.3 to 0. In the case of a watt bath and a nickel sulfamate bath. 5A / dm ² , electrolysis time is 5 to 30 minutes. In the case of a sulfamate nickel bath, the bath temperature is preferably 25 to 70 ° C., the current densities of the anode and cathode are 0.3 to 0.5 A / dm ² , and the electrolysis time is 5 to 30 minutes.

At the start stage of the second electroforming, as shown in FIG. 7A, the lower surface of the metal mesh 11 is in close contact with the outer surface 22a of the insulator convex portion 22, and the outer surface of the first electrodeposited metal foil EF1a and the metal There is a gap GA corresponding to {thickness of the insulator convex portion 22-thickness t1a of the first electrodeposited metal foil EF1a} with the lower surface of the mesh 11. Since the thickness accuracy of the insulator convex portion 22 is higher and the variation is smaller than that of the first electrodeposited metal foil EF1a, the accuracy of the thickness t1 of the metal mask portion 31 described later is higher. At the final stage of the second electroforming, as shown in FIG. 7B, the electrodeposited metal film EF2 is formed on the surface of the metal mesh 11, and the first electrodeposited metal is utilized by utilizing the gap GA. On the outer surface of the foil EF1a, a second electrodeposited metal foil EF1b that is continuous with the electrodeposited metal film EF2 and is joined to the first electrodeposited metal foil EF1a is formed. Incidentally, the thickness of the electrodeposited metal film EF2 formed here (reference numeral omitted) is preferably 0.3 to 2 μm, and the thickness of the second electrodeposited metal foil EF1b bonded to the first electrodeposited metal foil EF1a. t1b corresponds to {thickness of the insulator convex portion 22-thickness t1a of the first electrodeposited metal foil EF1a}. That is, in the second electrocasting step, the metal mesh portion 32 composed of the metal mesh 11 and the electrodeposited metal film EF2, the second electrodeposited metal foil EF1b continuous with the electrodeposited metal film EF2, and the second electrodeposited metal foil. An integrated product 30 is produced with a metal mask portion 31 having a thickness of t1 (thickness t1a + thickness t1b) made of the first metal electrodeposition foil EF1a to which the EF1b is bonded. Further, as described above, if the thickness t1b of the second electrodeposited metal leaf EF1b is set to be smaller than the thickness t1a of the first electrodeposited metal leaf EF1a, in the second electroforming step. The second electrodeposited metal leaf EF1b can be formed without any trouble, for example, without forming a gap, and can be satisfactorily bonded to the first electrodeposited metal leaf EF1a. In FIG. 7B, a broken line is drawn between the first electrodeposited metal leaf EF1a and the second electrodeposited metal leaf EF1b, and this broken line is for convenience showing the boundary between the two and the thickness of both. It is a thing.

<< Mold release process: see Fig. 8 >>
After producing the integrated product 30 shown in FIG. 7 (B), the material in close contact between the printing plate main body 10 and the mother mold 20 is taken out from the bathtub, and the holder is removed to release the holding of the product in the close contact state. Then, as shown in FIG. 8, the electrodeposited metal film EF2 of the integrated body 30 is peeled off from the outer surface 22a of the insulator convex portion 22, and the first electrodeposited metal foil EF1a and the second electrodeposited metal foil EF1b are made of metal. The integrated body 30 is separated from the master mold 20 by extracting it from the outer surface region 21a1 where the insulator convex portion 22 of the substrate 21 does not exist.

Due to this release, an opening having a depth and an inner shape substantially matching the thickness and outer shape of the insulator convex portion 22 in the metal mask portion 31 composed of the first electrodeposited metal foil EF1a and the second electrodeposited metal foil EF1b. Part 31a is formed. Further, since the bonding force of the insulator convex portion 22 to the outer surface 21a of the metal substrate 21 is much higher than the bonding force when the photoresist convex portion is formed on the outer surface 21a of the metal substrate 21, the integrated body 30 is used as a mother. When the mold is released from the mold 20, the insulator convex portion 22 does not come off from the outer surface 21a of the metal substrate 21.

<< Finishing process: see Fig. 9 >>
After the mold release shown in FIG. 8 is completed, the outer peripheral portion of the metal mesh portion 32 shown in FIG. 9, that is, the portion not used for screen printing is covered with an emulsion portion (not shown) and shown in FIG. A reinforcing film (not shown) such as a silver film is attached to the upper surface of the auxiliary mesh 12 for reinforcement.

In the above-mentioned manufacturing method, (1) a master mold 20 in which an insulator convex portion 22 corresponding to the opening 31a of the metal mask portion 31 is integrally formed on the outer surface 21a of the metal substrate 21 is manufactured, and (2) the first time. A first electrodeposited metal foil EF1a having a thickness smaller than that of the insulator convex portion was formed in the outer surface region 21a1 where the insulator convex portion 22 of the metal substrate 21 did not exist, and (3) insulation of the master mold 20 was performed. With the metal mesh 11 in close contact with the outer surface 22a of the body convex portion 22, the electrodeposited metal film EF2 is formed on the surface of the metal mesh 11 by the second electric casting, and the outer surface of the first electrodeposited metal foil EF1a is formed. A second electrodeposited metal foil EF1b continuous with the electrodeposited metal film EF2 and joined to the first electrodeposited metal foil EF1a is formed, and the metal mesh portion 32 composed of the metal mesh 11 and the electrodeposited metal film EF2 is formed. An integral body 30 with the metal mask portion 31 composed of the first electrodeposited metal foil EF1a and the second electrodeposited metal foil EF1b is produced, and (4) the electrodeposited metal film EF2 of the integrated body 30 is attached to the outer surface of the insulator convex portion 22. While peeling from 22a, the first electrodeposited metal foil EF1a and the second electrodeposited metal foil EF1b are extracted from the outer surface region 21a1 where the insulator convex portion 22 of the metal substrate 21 does not exist, and the insulator convex portion 22 is removed from the metal substrate 21. The integrated body 30 is separated from the master mold 20 while remaining on the outer surface 21a of the above.

That is, by using the master mold 20 in which the insulator convex portion 22 is integrally formed on the outer surface 21a of the metal substrate 21, the metal mesh portion 32 composed of the metal mesh 11 and the electrodeposited metal film EF2 and the first electrodeposited metal foil A screen printing plate integrally provided with a metal mask portion 31 made of EF1a and a second electrodeposited metal foil EF1b can be accurately manufactured by a simple method.

Further, even if the integrated body 30 of the metal mesh portion 32 and the metal mask portion 31 is separated from the master mold 20, the insulator convex portion 22 does not come off from the outer surface 21a of the metal substrate 21, so that the master mold 20 can be repeatedly used to produce a screen-printed plate of the same form. That is, also in this respect, the production of the screen printing plate is simplified.

Further, since the metal mask portion 31 (first electrodeposited metal foil EF1a and second electrodeposited metal foil EF1b) having a thickness corresponding to the thickness of the insulator convex portion 22 of the master mold 20 can be reliably produced, the metal mask The metal mesh 11 can be prevented from being exposed on the outer surface of the portion 31, the smoothness of the outer surface can be ensured, and the opening 31a having an extremely beautiful shape can be formed, whereby the screen with extremely high printing accuracy. Printing can be realized.

Further, since the thickness t1 of the metal mask portion 31 (first electrodeposited metal foil EF1a and second electrodeposited metal foil EF1b) can be adjusted by the thickness of the insulator convex portion 22 of the master mold 20, the metal mask portion 31 It is extremely easy to control the thickness t1 of the metal mask portion 31, and the metal mask portion 31 having a desired thickness can be manufactured with high accuracy.

Further, since the depth and inner shape of the opening 31a of the metal mask portion 31 can be adjusted by the thickness and outer shape of the insulator convex portion 22 of the master mold 20, the depth and inner shape of the opening 31a of the metal mask portion 31 can be adjusted. The shape can be controlled extremely easily, and the desired depth and the inner-shaped opening 31a can be accurately formed in the metal mask portion 31.

Further, among the first electrodeposited metal foil EF1a and the second electrodeposited metal foil EF1b constituting the metal mask portion 31, the thickness t1b of the second electrodeposited metal foil EF1b is changed to the thickness t1a of the first electrodeposited metal foil EF1a. If it is set to be smaller than, the second electrodeposited metal leaf EF1b can be formed without any trouble in the second electrocasting step, and the bonding with the first electrodeposited metal leaf EF1a can be performed satisfactorily. ..

10 ... Printing plate body, 11 ... Metal mesh, 12 ... Auxiliary mesh, 13 ... Plate frame, 20 ... Mother mold, 21 ... Metal substrate, 21a ... Outer surface of metal substrate, 21a1 ... Insulator convex part of metal substrate does not exist Outer surface region, 22 ... Insulator convex portion, 22a ... Outer surface of insulator convex portion, 30 ... Metal mesh portion and metal mask portion integrated, 31 ... Metal mask portion, 31a ... Opening, EF1a ... First electrodeposition Metal foil, EF1b ... second electrodeposited metal foil, 32 ... metal mesh portion, EF2 ... electrodeposited metal film.

Claims (7)

A method for manufacturing a screen printing plate in which a metal mesh portion and a metal mask portion having an opening are integrally provided.
A step of producing a master mold in which an insulator convex portion corresponding to the opening is integrally formed on the outer surface of the metal substrate, and
A step of forming a first electrodeposited metal foil having a thickness smaller than that of the insulator convex portion in an outer surface region of the metal substrate of the master mold where the insulator convex portion does not exist by the first electroforming.
With the metal mesh in close contact with the outer surface of the insulator convex portion of the master mold, an electrodeposited metal film is formed on the surface of the metal mesh by the second electric casting, and the first electrodeposited metal foil is formed. A second electrodeposited metal foil that is continuous with the electrodeposited metal film and is joined to the first electrodeposited metal foil is formed on the outer surface of the metal mesh, and the metal mesh portion composed of the metal mesh and the electrodeposited metal film. And the step of producing an integral product of the first electrodeposition metal foil and the metal mask portion made of the second electrodeposition metal foil.
The electrodeposited metal film of the integrated material is peeled off from the outer surface of the insulator convex portion, and the first electrodeposited metal foil and the second electrodeposited metal foil are absent from the insulator convex portion of the metal substrate. A step of removing the integrated product from the master mold while extracting the insulator from the outer surface region and leaving the convex portion of the insulator on the outer surface of the metal substrate is provided.
How to make a screen printing plate. The thickness of the metal mask portion made of the first electrodeposited metal foil and the second electrodeposited metal foil is adjusted by the thickness of the convex portion of the insulator.
The method for manufacturing a screen printing plate according to claim 1. The depth and inner shape of the opening of the metal mask portion are adjusted by the thickness and outer shape of the convex portion of the insulator.
The method for manufacturing a screen printing plate according to claim 1 or 2. The thickness of the second electrodeposited metal leaf is set smaller than the thickness of the first electrodeposited metal foil.
The method for manufacturing a screen printing plate according to any one of claims 1 to 3. The insulator convex portion is formed by a physical vapor deposition method using an insulator material.
The method for manufacturing a screen printing plate according to any one of claims 1 to 4. The insulator convex portion is formed by a chemical vapor deposition method using an insulator material.
The method for manufacturing a screen printing plate according to any one of claims 1 to 4. An insulating ceramic material is used as the insulator material.
The method for manufacturing a screen printing plate according to claim 5 or 6.

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