527285 五、發明說明（1) 發明領域： ， 本案係關於一種製作喷嘴片（Nozzle Plate, NP)的 方法’特別是指應用於製作印表機墨水匣之喷嘴片 (Nozzle plate，NP)的方法。527285 V. Description of the invention (1) Field of the invention: This case relates to a method for manufacturing nozzle plates (NP), especially a method for manufacturing nozzle plates (NP) of printer ink cartridges .
I j 丨發明背景： 製作印表機墨水匣之喷嘴片（Nozzle Plate，NP)的 過程包含了許多步驟，任一步驟都可能會對喷嘴片 (Nozzle Plate，NP)之喷嘴孔孔徑造成控制不良，控制 不良之噴嘴孔孔徑大小當然會降低喷嘴片（N 〇 z z 1 e :Plate，NP)之製程良率，亦會影響印表機之列印品質。 丨為瞭解習知技術，請參閱第一圖（a)〜（e)，其係為習 知製作喷嘴片（Nozzle Plate，NP)之製程示意圖，於豆 中： 〆、 如第一圖（a)所示，為了後續之電禱 (Electro-forming)製程，所以先以濺鍍（Sputter)的 方式在一玻璃板1 〇上方形成一薄鑛金屬膜層11以使做為電 鑄（Elect ro-forming)製程中陰極之玻璃板導電，該薄 丨鍍金屬膜層11係可以為一鉻層（Chromium Layer)或一鈦 丨層(Titanium Layer) 〇 如第一圖（b)所示，於該薄鍍金屬膜層1丨上方 形成一光阻層（Photoresist Layer) 12，並經由曝光與 527285 五、發明說明（2) 顯影之黃光製程以定義出光阻層（Photoresist Layer) 1 2上之喷嘴孔圖案。 | 如第一圖（c)所示，以濕|虫刻（We t E t ch i ng) I方式圖案化該薄鍍金屬膜層11後，去除該光阻層 I ( Photoresist Layer) 12° ; · ! 如第一圖（d)所示，將具有圖案之薄鍍金屬膜 i 層玻璃板1 5置於電鑄槽陰極，利用電鑄 (Electro-forming)方式形成一厚電鑄金屬膜層16於該 薄鍍金屬膜層1 1上方，較佳者，該厚電鑄金屬膜層1 6係可 | 以為一鎳層（N i eke 1 Lay er)。 丨 如第一圖（e)所示，將該厚電鑄金屬膜層16由 丨 具有圖案之薄鍍金屬膜層玻璃板15撕下，進行一檢測步驟 i :以判定喷嘴孔1 3之孔徑大小。 然而，習知技術之缺失在於： 第一圖（d)中，將具有圖案之薄鍍金屬膜層玻璃板15置 於電鑄槽陰極，利用電鱗（Electro-forming)方式形成 :一厚電鑄金屬膜層16於該薄鍍金屬膜層11上方。當然，根 丨 i據習知技術，在電鑄時，厚電鑄金屬膜層16亦會橫向成長 丨形成突出（Protrusion) 14，所以喷嘴孔13之孔徑大小係 : 可由電鑄（Elec tro-forming)時間之長短與電流之大小 所決定。然而，電鑄（E 1 ec t ro- f orm i ng)後的結果容易 ； 在玻璃板1 〇邊緣形成較厚的厚電鑄金屬膜層16而向破嗔板 | 1 〇中心遞減，致使玻璃板1 0邊緣之喷嘴孔孔徑較小而破壤 ! 板1〇中心之喷嘴孔孔徑較大，嚴重時，喷嘴孔13亦可能因I j 丨 Background of the Invention: The process of making the nozzle plate (NP) of a printer ink cartridge includes many steps, and any step may cause poor control of the nozzle hole diameter of the nozzle plate (NP) Of course, the poorly controlled nozzle hole diameter will certainly reduce the process yield of the nozzle sheet (N ozz 1 e: Plate, NP), and will also affect the printing quality of the printer.丨 To understand the conventional technology, please refer to the first diagrams (a) to (e), which are schematic diagrams of the conventional process for making nozzle plates (NP), in beans: 〆, as shown in the first diagram (a ), For the subsequent Electro-forming process, a thin mineral metal film layer 11 is first formed on a glass plate 10 by sputtering, so as to be electroformed (Electro The glass plate of the cathode is conductive during the forming process. The thin metallized layer 11 can be a Chromium layer or a titanium layer. As shown in the first figure (b), A photoresist layer 12 is formed on the thin metallized film layer 1 丨, and the photoresist layer 12 on the photoresist layer 12 is defined by the yellow light process of development through exposure and 527285. 5. Description of the invention (2) Nozzle hole pattern. | As shown in the first figure (c), after patterning the thin metallized film layer 11 in a wet | insect etch (We t E t ch i ng) I mode, remove the photoresist layer I (Photoresist Layer) 12 ° As shown in the first figure (d), a thin metallized film i-layered glass plate 15 with a pattern is placed on the cathode of an electroforming tank, and a thick electroformed metal film is formed by the electro-forming method. The layer 16 is above the thin metallized film layer 11. Preferably, the thick electroformed metal film layer 16 can be a nickel layer (N i eke 1 Lay er).丨 As shown in the first figure (e), the thick electroformed metal film layer 16 is torn off from a thin metal plated glass plate 15 with a pattern, and a detection step i is performed to determine the aperture of the nozzle hole 13 size. However, the shortcomings of the conventional technology are as follows: In the first picture (d), a thin metal plated glass plate 15 having a pattern is placed on the cathode of an electroforming tank, and is formed by an electro-forming method: The cast metal film layer 16 is above the thin metal-plated film layer 11. Of course, according to the conventional technology, during electroforming, the thick electroformed metal film layer 16 will also grow laterally. Protrusions 14 are formed. Therefore, the aperture size of the nozzle hole 13 is: can be electroformed (Elec tro- It is determined by the length of time and the current. However, the results after electroforming (E 1 ec t ro-fom in ng) are easy; a thicker thick electroformed metal film layer 16 is formed on the edge of the glass plate 10 and decreases toward the center of the broken plate | 10 The hole diameter of the nozzle hole at the edge of the glass plate 10 is small and broken! The hole diameter of the nozzle hole at the center of the plate 10 is large. In severe cases, the nozzle hole 13 may also be damaged.
第5頁 527285 五、發明說明（3) 為相鄰之突出（pr〇trusi〇n)丨4成長速度太快而堵塞住喷 备孔1 3 (如第二圖所示），當然，控制不良之喷嘴孔孔徑 會造成製程良率上的降低。 職是之故，本發明鑑於習知技術之缺失，乃經悉心地 試驗’並一本鍥而不捨之研究精神，終發展出本案之『製 作噴嘴片的方法』。 發明簡述： 本案之主要目的，即在於提供一種提升製程良率之製 作印表機，墨水匣之喷嘴片的方法。 所本案之次要目的，即在於提供一種改善印表機列印品 質之製作印表機墨水匣之喷嘴片的方法。 本案之又一目的，即在於提供一種可控制喷嘴孔孔徑 均勻度之製作印表機墨水匣之噴嘴片的方法。 二 根據上述目的，本案一方面提供一種製作喷嘴片 法，其包含下列步驟：（a)提供一基板；（b)、形成一薄 鍍金屬膜^於該基板上方；（c)對該薄鍍金屬膜層基板 進行一電鑄（Electro-forming)製程，以形成一厚電鑄 $屬膜層於該薄鍍金屬膜層上方；以及（d)進行一黃光 製程與一蝕刻製程以圖案化該厚電鑄金屬膜層，俾以完 該喷嘴片的製作。 依據上述構想’其中該基板係為一玻璃板。 依據上述構想，其中該步驟（b)係以濺鍍（Sputter 527285 五、發明說明（4) )完成之。 依據上述構想，其中該薄鍍金屬膜層係為一鈦層 (Titanium Layer) 〇 依據上述構想，其中該薄艘金屬膜層係為一絡層 ；(Chromium Layer) 〇 I 依據上述構想5其中該步驟（C)係將該薄鍍金屬膜 層基板置於一電鑄槽之陰極，以進行該電鑄 \ ( Electro-forming)製程 。 依據上述構想，其中該厚電鑄金屬膜層係為一鎳層 (Nickel Layer) 〇 依據上述構想5其中該錄層（Nickel Layer)係介於 丨30〜8 0" m之間。 依據上述構想，其中該蝕刻製程係為一乾蝕刻（Dry Etch i ng)製程。 依據上述構想，其中該蝕刻製程係為一濕蝕刻（Wet Etch i ng)製程。 依據上述構想，其中於該步驟（d)之後更包含一步 驟：（e)將已圖案化之該厚電鑄金屬膜層由該薄鍍金屬 膜層撕下，以進行一檢測製程。 根據上述目的，本案另一方面提供一種製作喷嘴片的 |方法，其包含下列步驟：（a)提供一玻璃板；（b)以濺 I鍍（Sputter)方式形成一薄鍵金屬膜層於該玻璃板上 |方；（c)對該薄鍍金屬膜層基板進行一電鑄 (Electro-forming)製程，以形成一鎳層（Nickel 527285 五、發明說明（5)Page 5 527285 V. Description of the invention (3) The adjacent protrusion (pr〇trusi〇n) 丨 4 grows too fast and blocks the spray preparation hole 1 3 (as shown in the second figure), of course, poor control The nozzle hole diameter will reduce the yield of the process. For this reason, in view of the lack of known technology, the present invention has developed a "method for making a nozzle sheet" after careful testing and a spirit of persistent research. Brief description of the invention: The main purpose of this case is to provide a method for manufacturing nozzles of printers and ink cartridges which can improve process yield. The secondary purpose of this case is to provide a method for making the nozzle plate of a printer ink cartridge to improve the printing quality of the printer. Another object of this case is to provide a method for manufacturing a nozzle plate of a printer ink cartridge capable of controlling the uniformity of the hole diameter of the nozzle hole. According to the above purpose, on the one hand, the present invention provides a method for manufacturing a nozzle plate, which includes the following steps: (a) providing a substrate; (b) forming a thin metal plating film on the substrate; (c) forming the thin plating film; The metal film substrate is subjected to an electro-forming process to form a thick electroformed metal film layer over the thin metal-plated film layer; and (d) a yellow light process and an etching process are performed for patterning The thick electroformed metal film layer completes the fabrication of the nozzle plate. According to the above concept, wherein the substrate is a glass plate. According to the above concept, step (b) is completed by sputtering (Sputter 527285 V. Invention Description (4)). According to the above-mentioned concept, wherein the thin metal-plated film layer is a titanium layer (Titanium Layer) 〇 According to the above-mentioned concept, wherein the thin-ship metal film layer is a complex layer; (Chromium Layer) 〇I According to the above-mentioned concept 5 where the Step (C) is to place the thin metal-plated film substrate on the cathode of an electroforming tank to perform the electro-forming process. According to the above concept, the thick electroformed metal film layer is a nickel layer. According to the above concept 5, the nickel layer is between 30 m and 8 m. According to the above concept, the etching process is a dry etching process. According to the above concept, the etching process is a wet etching (Wet Etch i ng) process. According to the above-mentioned concept, step (d) further includes a step: (e) the patterned thick electroformed metal film layer is peeled off from the thin metal plating film layer to perform a detection process. According to the above purpose, another aspect of the present invention provides a method for manufacturing a nozzle plate, which includes the following steps: (a) providing a glass plate; (b) forming a thin key metal film layer by sputtering Glass plate | square; (c) performing an electro-forming process on the thin metallized film substrate to form a nickel layer (Nickel 527285 V. Description of the invention (5)
Layer)於該薄鍍金屬膜層上方；以及（d)進行一黃光製 程與一蝕刻製程以圖案化該鎳層（Nickel Layer)，俾以 完成該喷嘴片的製作。 依據上述構想，其中該薄鍍金屬膜層係為一鈦層 \ ( Titanium Layer) 〇 依據上述構想，其中該薄鍍金屬膜層係為一鉻層 (Chromium Layer) 〇 依據上述構想，其中該步驟（c)係將該薄鍍金屬膜 I層基板。置於一電鑄槽之陰極，以進行該電鑄 (Electro-forming)製程 。 依據上述構想，其中該鎳層（Nickel Layer)係介於 3 0〜8 0 // m之間。 依據上述構想，其中該蝕刻製程係為一乾蝕刻（Dry Et ch i ng)製程。 依據上述構想，其中該#刻製程係為一濕#刻（W e t E t ch i ng)製程。 依據上述構想，其中於該步驟（d)之後更包含一步 驟：（e)將已圖案化之該鎳層（Nickel Layer)由該薄 鑛金屬膜層撕下，以進行一檢測製程。 本案以及其進一步目的與功效，將參閱一較佳實施例 之詳細說明與所附之圖示，俾得一更深入之瞭解。 較佳實施例說明：Layer) over the thin metallized film layer; and (d) performing a yellow light process and an etching process to pattern the Nickel Layer to complete the fabrication of the nozzle sheet. According to the above concept, wherein the thin metallized film layer is a titanium layer \ (Titanium Layer) 〇 According to the above concept, wherein the thin metallized film layer is a Chromium Layer 〇 According to the above concept, wherein the step (C) The thin metallized film I-layer substrate. The cathode is placed in an electroforming tank to perform the Electro-forming process. According to the above concept, the Nickel Layer is between 30 and 80 / m. According to the above concept, the etching process is a dry etching (Dry Et ch i ng) process. According to the above concept, the #etching process is a wet #etch (W e t E t ch i ng) process. According to the above-mentioned concept, after step (d), the method further includes a step: (e) the patterned nickel layer is peeled off from the thin mineral metal film layer to perform a detection process. This case, as well as its further purposes and effects, will refer to the detailed description of a preferred embodiment and the accompanying drawings for a deeper understanding. Description of the preferred embodiment:
第8頁 527285 五、發明說明（6) 如前所述，根據習知製作er7主m U . 卩表機墨水匣之嘖喈y n 術，喷嘴孔孔徑控制不良且合袢士 & 1 %片的技 丨此本發明係用以提供-種可控制 =因 丨嘴嘴片的方法，以改善印表機列印品二製作 丨明，請參閱第二圖（a)〜（e)，甘/认”、、’、本案發 丨片（Nozzle Plate，ΝΡ)之製程示意圖，於其中：、囔 如第三圖（a)所示’為了後續之電鑄 (Electro-forming)製程，所以先以濺鍍（Sputte 方式在一玻璃板3 0上方形成一薄鍍金屬膜層3丨以使做為電 鑄（Electro-forming)製程中陰極之玻璃板導電，該薄 錢金屬膜層31係可以為一鉻層（Chr〇mium Layer)或二欽 層(Titanium Layer) 〇 如第三圖（b)所示，利用電鑄 (Electro-forming)方式形成一厚電鑄金屬膜層3 2於該 薄鍍金屬膜層3 1上方，較佳者，該厚電鑄金屬膜層3 2係可 以為一鎳層（Nickel Layer)，該厚電鑄金屬膜層32係介 於3 0〜8 0 // m之間。 如第三圖（c)所示，於該厚電鑄金屬膜層32上 方形成一光阻層（Photoresist Layer) 33，並經由曝光 與顯影之黃光製程以定義出光阻層（Photoresist Layer )3 3上之噴嘴孔圖案。 如第三圖（d)所示，以一濕姓刻（Wet Etching )或一乾蝕刻（Dry Etching)方式圖案化該厚電鑄金屬 膜層32後，去除該光阻層（Photoresist Layer) 33。 527285 — ---------—__ —一 __________ _______ 五、發明說明（7) 如第三圖（e)所示，將該厚電鑄金屬膜層3 2由 薄鑛金屬膜層3 1撕下，進行一檢測步驟以判定喷嘴孔3 4之 孔徑大小。 本案係藉由濕蝕刻（Wet Etching)或乾蝕刻（Dry E t ch 1 ) _方式圖案化厚電鑄金屬膜層3 2上以形成喷嘴孔 3 4 (如第一圖（d)所示），藉由本發明製作之噴嘴孔結 構截面圖則如第四圖所示，由於光阻層（ph〇t〇resistPage 8 527285 V. Description of the invention (6) As mentioned above, according to the conventional technique of making er7 main m U. watch machine ink cartridges, the nozzle hole diameter is poorly controlled and the & The technology of this invention is to provide a kind of controllable method to improve the production of printed products on the printer. Please refer to the second picture (a) ~ (e), Gan / Acknowledge "," ', the schematic diagram of the process of the Nozzle Plate (NP) issued in this case, in which :, as shown in the third figure (a),' for the subsequent electro-forming process, so First, a thin metal film layer 3 is formed on a glass plate 30 by sputtering (Sputte method) to make the glass plate used as a cathode in the electro-forming process conductive. The thin metal film layer 31 is It can be a chromium layer or a titanium layer. As shown in the third figure (b), a thick electroformed metal film layer is formed by an electro-forming method. 2 2 Above the thin metallized film layer 31, preferably, the thick electroformed metal film layer 31 may be a nickel layer, which is a thick electroformed metal layer. The film layer 32 is between 30 and 8 0 // m. As shown in the third figure (c), a photoresist layer 33 is formed on the thick electroformed metal film layer 32 and passes through The yellow light process of exposure and development is used to define the nozzle hole pattern on the Photoresist Layer 3 3. As shown in the third figure (d), a wet name (Wet Etching) or a dry etching (Dry Etching) is used. After patterning the thick electroformed metal film layer 32, the photoresist layer 33 is removed. 527285 — ---------—__ — one __________ _______ 5. Description of the invention (7) As shown in the third figure (e), the thick electroformed metal film layer 32 is torn off from the thin mineral metal film layer 31, and a detection step is performed to determine the pore size of the nozzle holes 34. In this case, wet etching is used (Wet Etching) or dry etching (Dry E t ch 1) _ pattern the thick electroformed metal film layer 32 to form the nozzle holes 3 4 (as shown in the first figure (d)), which are produced by the present invention. The cross-sectional view of the nozzle hole structure is shown in the fourth figure, because the photoresist layer (ph〇t〇resist
Layer) 3 3可於進行濕餘刻（wet Etching)或乾钱刻 (Dry Etching)時保護其正下方之厚電鑄金屬膜層32， 所以雖然厚電鑄金屬膜層32有側蝕（Side Etching)現象 f t ’厚電鑄金屬膜層32的頂端35仍能免於被蝕刻，即使 一 iorming)後的結果容易在玻璃板30邊緣 二所Γ 、f _金屬膜層3 2而向玻璃板10中心遞減，# — „ 月匕、、隹持於一固定之孔梭大小d。所 以，稭由本發明，不僅提供_絲π〜…+也 ^ ^ + 捉供一種可控制唷嘴孔孔徑均勻度 之製作喷嘴片的方法’亦能改i J %改善印表機列印品質。 本案得由熟悉本技藝之人丄k a ^田& & 、 又人士任施匠思而為諸般修飾， 然皆不脫如附申請專利範圍所欲保護者。Layer) 3 3 can protect the thick electroformed metal film layer 32 directly under the wet Etching or dry etch, so although the thick electroformed metal film layer 32 has side etch (Side Etching) phenomenon ft 'Thick top 35 of electroformed metal film layer 32 can still be prevented from being etched, even if an iorming) result is easily on the edge of glass plate 30 Γ, f _ metal film layer 3 2 to the glass plate 10 Center decreasing, # — „Moon dagger, and hold on a fixed hole shuttle size d. Therefore, the present invention not only provides _ silk π ~ ... + but also ^ ^ + to control a uniform hole diameter The method of making nozzle pieces can also improve the printing quality of the printer. This case can be modified by people who are familiar with this technique 丄 Ka ^ & & However, it is not as good as those who want to protect the scope of patent application.
第10頁 527285 圖式簡單說明 圖示說明： 第一圖（a)〜（e):習知製作喷嘴片（Nozzle Plate，NP)之製程示意圖； 第二圖：習知技術製作之喷嘴孔結構截面圖； 第三圖：本發明製作喷嘴片（Nozzle Plate，NP)之 製程示意圖；以及 第四圖：本發明製作之喷嘴孔結構截面圖。 圖號說明： 10 玻 璃 板 12 光 阻 層 14 突 出 16 厚 電 鑄 金 屬 31 薄 鍍 金 屬 膜 33 光 阻 層 35 頂 端 11: 薄 13 ： 喷 15 ·· 具 屬 膜層 30 ： 玻 層 3 2 ·· 厚 34 ： 喷 鍍金屬膜層 嘴孔 有圖案之薄鍍金 膜層玻璃板 璃板 電鑄金屬膜層 嘴孔527285 on page 10 Brief description of the diagram: The first pictures (a) ~ (e): the schematic diagram of the process for making nozzle plates (NP); the second picture: the nozzle hole structure made by the conventional technology Sectional view; the third diagram: a schematic diagram of the manufacturing process of the nozzle plate (NP) of the present invention; and the fourth diagram: a sectional view of the nozzle hole structure produced by the present invention. Description of drawing number: 10 glass plate 12 photoresist layer 14 protruding 16 thick electroformed metal 31 thin metal film 33 photoresist layer 35 top 11: thin 13: spray 15 ·· with film layer 30: glass layer 3 2 ·· Thickness 34: Patterned thin gold-plated film layer with sprayed metal film nozzle hole, glass plate, glass plate, electroformed metal film nozzle hole