JP6821299B2 - PTP sheet manufacturing equipment and PTP sheet manufacturing method - Google Patents

Description

The present invention relates to a PTP sheet manufacturing apparatus and a PTP sheet manufacturing method for forming a plurality of pockets on a sheet .

Conventionally, a PTP (Press Through Packaging) sheet manufacturing apparatus for molding a plurality of pockets for accommodating tablets and the like has a heating apparatus having an upper heating plate and a lower heating plate, and a molding having an upper molding plate and a lower molding plate. It has an apparatus, and after heating by sandwiching a resin sheet with a heating apparatus, the pocket portion is molded at a predetermined position by sandwiching the sheet with a molding apparatus and pressing it (see, for example, Patent Document 1).

The conventional PTP sheet manufacturing apparatus 100 will be described with reference to FIGS. 6 and 7. FIG. 6 is a schematic side view showing the heating device 110 and the molding device 112 portion of the conventional PTP sheet manufacturing apparatus extracted, and FIG. 7 is a schematic view of the PTP sheet on which the molding line with the crease F is formed. The figure (a) is a plan view, the figure (b) is a side view, and the figure (c) is an enlarged side view.

The PTP sheet manufacturing apparatus 100 transports the strip-shaped resin sheet (resin film) S'from the original roll (not shown) by intermittent feeding for each designed product unit row, and the resin sheet S'is transported in the middle of the transport. It is a device for heating and molding. The heating device 110 includes an upper heating plate 110a and a lower heating plate 110b, and the molding device 112 includes an upper molding plate 112a and a lower molding plate 112b, sandwiching the resin sheet S', and heating and molding, respectively. There is. That is, the heating / molding step of sandwiching the resin sheet S'between the heating device 110 and the molding device 112 and the transporting step of releasing the sandwiching of the resin sheet S'and intermittently feeding the resin sheet S'are repeatedly executed.

As shown in FIG. 6A, when the resin sheet S'is transported, the resin sheet S'is transported at a transport position TH'at a predetermined height, and the upper heating plate 110a and the lower heating plate 110b of the heating device 110 are transferred. It is retracted in the vertical direction so as to be separated from the resin sheet S'. Further, the upper molding plate 112a and the lower molding plate 112b of the molding apparatus 112 are also retracted in the vertical direction so as to be separated from the resin sheet S', but the distance x2 between the facing surfaces on the resin sheet S'side of both is , The distance between the facing surfaces of the upper heating plate 110a and the lower heating plate 110b is larger than x1.

Then, as shown in FIG. 3B, when the resin sheet S'is heated and molded, the upper heating plate 110a and the lower heating plate 110b of the heating device 110 move so as to be close to each other to sandwich the resin sheet S'. , The upper molding plate 112a and the lower molding plate 112b of the molding apparatus 112 move so as to be close to each other and sandwich the resin sheet S'. At this time, in the heating device 110, for example, only the lower heating plate 110b rises, and in the molding device 112, only the lower molding plate 112b rises.

In such a configuration, the position (height) PH1 of sandwiching the resin sheet S'in the molding apparatus 112 is the position (height) PH2 (here, the same as the transport position TH') of sandwiching the resin sheet S'in the heating device 110. Since it is higher than the position), the resin sheet S'located between the heating device 110 and the molding device 112 takes a path that rises diagonally, and the end portion on the upstream side of the lower molding plate 112b of the molding device 112. As a result, the resin sheet S'after the formation of the pocket portion A is formed with a forming line having a crease F as shown in FIGS. 6 (c) and 7 (c).

The positional relationship between the heating device 110 and the molding device 112 in this case is set for the following reasons.

First, the heating device 110 heats at about 140 ° C., but in order to improve the heating efficiency of the resin sheet S', the upper heating plate 110a and the lower heating plate 110b are transferred (moved) between the upper heating plate 110a and the lower heating plate 110b. Even if there is, it is necessary to prevent the two from being separated from the resin sheet S'as much as possible (distance x1 in FIG. 6A).

On the other hand, in the molding apparatus 112, molding is performed in a state of being cooled to about 18 ° C. Therefore, when the molded resin sheet S'is unwound and the newly heated resin sheet S'is moved to the molding apparatus 112 for the next molding, the cooled upper molding plate 112a (or lower molding plate 112b) is used. ) Comes into contact with the heated resin sheet S', the resin sheet S'is cooled, resulting in molding failure. In order to prevent this, the resin sheet S'drawn from the outlets of the upper heating plate 110a and the lower heating plate 110b is made of both as much as possible so as to avoid interference (do not contact) with the upper molding plate 112a and the lower molding plate 112b. It is necessary to pass it at a separated position (Fig. 6 (a)).

That is, when the resin sheet S'is being conveyed, the upper heating plate 110a and the lower heating plate 110b of the heating device 110 are brought as close as possible to the resin sheet S', while in the molding device 112, the upper heating plate 112a and the lower heating plate 112b are It is necessary to separate it from the resin sheet S'as much as possible.

Further, the resin sheet S'is easily charged with static electricity, and may be attracted to the upper molded plate 112a (or the lower molded plate 112b) depending on the situation. For this reason as well, when the resin sheet S'is moved, the resin sheet S'and the upper molded plate 112a (or the lower molded plate 112b) need to be separated from each other.

Further, a large number of recesses (not shown) for forming pockets are provided on the upper surface side of the lower molding plate 112b of the molding apparatus 112, and air provided in the upper molding plate 112 during molding of the resin sheet S' Compressed air is blown into the recess through the hole (not shown) to form the pocket portion A. That is, in the molding apparatus 112, it is necessary to prevent air from leaking during molding, and the upper molding plate 112a and the lower molding plate 112b need to sandwich and fix the resin sheet S'with a very strong force. Therefore, the structure of the upper molded plate 12a and the lower molded plate 112b requires strength, and if both the upper molded plate 112a and the lower molded plate 112b are movable, the manufacturing cost of the apparatus and the difficulty of design are increased. There is a problem that it ends up. Further, since a large structure is required to drive the upper molded plate 112a and the lower molded plate 112b up and down, there is a problem that workability is deteriorated at the time of mold change or the like. Therefore, conventionally, of the upper molded plate 112a and the lower molded plate 112b, only one of the upper molded plate 112a and the lower molded plate 112b provided with the recess for forming the pocket portion (for example, the lower molded plate 112b) can be moved up and down, and the other side for ejecting air. (For example, the upper molded plate 112a) is often not provided (fixed) with a drive mechanism for moving up and down, but only with a spring structure incorporated in order to fix the resin sheet S'at a set pressure. .. That is, as shown in FIG. 6B, at the time of molding, it is necessary to raise the lower molded plate 112b toward the upper molded plate 112a which is largely retracted upward from the resin sheet S'.

From these facts, in the conventional configuration, the position (height) of the surface (lower surface) of the upper heating plate 110a of the heating device 110 on the resin sheet S'side and the position (height) of the lower surface of the upper molding plate 112a of the molding apparatus 112 ( Height) had to be provided with the largest possible height difference (Δx').

In addition, in order to prevent the heated resin sheet S'from cooling before being molded, the outlet of the heating device 110 (downstream end) and the inlet of the molding device 112 (upstream end) are used. The distance L'of the part) needs to be close to each other in the transport direction of the resin sheet S'.

That is, the upper heating plate 110a (lower surface) of the heating device 110 is in a state where the distance L'of the outlet (downstream end) of the heating device 110 and the inlet (upstream end) of the molding device 112 is close to each other. And the upper forming plate 112a (lower surface) of the forming apparatus 112 must be provided with a large height difference Δx, whereby the resin sheet S'is obliquely provided between the outlet of the heating apparatus 110 and the inlet of the forming apparatus 112. It will be bent strongly by taking the ascending path.

If the pocket portion A is molded and cooled in the molding apparatus 112 with the resin sheet S'bent, the resin sheet S'will have bent streaks (creases) F in the molding unit. This crease does not disappear even in the subsequent downstream process, and there is a problem that the appearance of the resin sheet S'is spoiled.

Therefore, a technique has been developed in which a molding line having a crease (crease habit) is pressed again with a molding apparatus to make the molding line inconspicuous (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2003-081206 Japanese Unexamined Patent Publication No. 2012-218758

However, the technique described in Patent Document 2 is for making the molded line with creases inconspicuous, and cannot prevent the occurrence of creases themselves.

That is, even if the crease becomes inconspicuous, the crease does not disappear even in the subsequent downstream steps, so that it is insufficient in terms of providing a resin sheet (PTP sheet) having an excellent aesthetic appearance.

Further, if the resin sheet has creases, the transport of the resin sheet becomes unstable at the creases in the downstream process. If the transport of the resin sheet becomes unstable, for example, when the packaged body (drugs, etc.) is stored in the molded pocket portion A, the position shift occurs, or the stored packaged body vibrates in the pocket portion A. It becomes a big problem such as instability. Even if the creases are treated inconspicuously, there is a risk that the transport of the resin sheet may become unstable due to the creases once formed, so it is desirable not to cause the creases themselves. There is.

Further, in order to prevent the heated resin sheet from cooling before being molded as described above, the outlet of the heating device 110 (downstream end) and the inlet of the molding device 112 (upstream). It is necessary to bring the resin sheet close to the end portion in the transport direction of the resin sheet, but since the resin sheet S'is strongly bent as described above, the outlet (downstream side end portion) of the heating device 110 and the molding device 112 It was necessary to secure a distance L'at the entrance (upstream end) of at least about 3 mm. That is, there is a limit to bringing the outlet of the heating device 110 (downstream end) and the inlet of the molding device 112 (upstream end) close to each other, and there is a risk that the resin sheet may be cooled during this period.

(1) The present invention is a PTP sheet manufacturing apparatus for forming a plurality of pocket portions into a strip-shaped sheet to be conveyed, wherein a first heating plate arranged on one side of the sheet and the first heating plate A heating means for heating the sheet during transportation having a second heating plate arranged on the other side of the sheet facing the sheet, a first molded plate arranged on one side of the sheet, and the first forming plate. A molding means having a second molding plate arranged on the other side of the sheet facing the molding plate, and a molding means arranged on the downstream side of the heating means to mold the pocket portion into a part of the sheet. The heating means moves at least one of the first heating plate and the second heating plate during heating to sandwich the sheet at a sandwiching position, and the molding means uses the first molding during molding. At least one of the plate and the second molded plate is moved to sandwich the sheet at the sandwiching position, and the sandwiching position is different from the transport position of the sheet , and the sheet is the heating means. The PTP sheet manufacturing apparatus is a position that is in a straight line with the molding means, and the heating means and the molding means move in conjunction with each other to the sandwiching position .

According to such a configuration, the sheet can be maintained horizontally between the outlet of the heating means (downstream end) and the inlet of the molding means (upstream end), so that the occurrence of creases can be avoided and the appearance is aesthetically pleasing. An excellent sheet (PTP sheet) can be produced.

In addition, since creases do not occur, the sheet can be stably transported, and in the downstream process, the packaged body (drugs, etc.) may be misaligned when it is stored in the molded pocket, or the packaged material may be stored. It is possible to prevent problems such as the body vibrating in the pocket and becoming unstable.

According to such a configuration, when the heated sheet is moved to the molding means, the contact between the first molded plate or the second molded plate and the sheet can be avoided. Further, even if the sheet is attracted to the first molded plate (or the second molded plate) due to static electricity, contact between the two molded plates and the sheet can be avoided. That is, it is possible to prevent molding defects due to cooling of the sheet.

Further, since creases are not formed, it is not necessary to consider the interference between the creases and the pocket portion forming position when the sheet is intermittently fed, and the outlet of the heating means (downstream end) and the inlet of the forming means (upstream side). The distance of the end) can be made closer than before. This also reduces the possibility that the sheet will cool between the heating means and the molding means.

According to such a configuration, the sheet can be maintained horizontally between the outlet of the heating means (downstream end) and the inlet of the molding means (upstream end), so that the occurrence of creases can be avoided and the appearance is aesthetically pleasing. It is possible to provide a PTP wrapping machine capable of wrapping with an excellent sheet (PTP sheet).

In addition, since creases do not occur, the sheet can be stably transported, and in the downstream process, the packaged body (drugs, etc.) may be misaligned when it is stored in the molded pocket, or the packaged material may be stored. It is possible to prevent problems such as the body vibrating in the pocket and becoming unstable.

( 2 ) The present invention is also a method for manufacturing a PTP sheet in which a plurality of pockets are formed on a strip-shaped sheet to be conveyed, and a first heating plate arranged on one side of the sheet and the first heating plate. A heating step of heating the sheet during transportation by a second heating plate arranged on the other side of the sheet facing the sheet, and a first molded plate arranged on one side of the heated sheet. A molding step of molding the pocket portion in a part of the sheet by a second molding plate arranged on the other side of the sheet facing the first molding plate is provided, and between the heating step and the molding step. In the heating step in a state where the sheet does not bend, at least one of the first heating plate and the second heating plate is moved to sandwich the sheet at the sandwiching position, and in the molding step. , sandwiching the sheet in the pinching position by moving at least one of the molding plate of the second mold plate and the first mold plate, said pinching position, Tsu position der different from the transport position of the sheet At a position where the height of the sheet is in a straight line between the heating means having the first heating plate and the second heating plate and the molding means having the first molding plate and the second molding plate. It is a PTP sheet manufacturing method characterized in that the heating plate and the molded plate are interlocked and moved to the sandwiching position.

According to such a configuration, the sheet can be maintained horizontally between the outlet of the heating means (downstream end) and the inlet of the molding means (upstream end), so that the occurrence of creases can be avoided and the appearance is aesthetically pleasing. An excellent method for producing a sheet (PTP sheet) can be provided.

In addition, since creases do not occur, the sheet can be stably transported, and in the downstream process, the packaged body (drugs, etc.) may be misaligned when it is stored in the molded pocket, or the packaged material may be stored. It is possible to prevent problems such as the body vibrating in the pocket and becoming unstable.

According to such a configuration, when the heated sheet is moved to the molding means, the contact between the first molded plate or the second molded plate and the sheet can be avoided. Further, even if the sheet is attracted to the first molded plate (or the second molded plate) due to static electricity, contact between the two molded plates and the sheet can be avoided. That is, it is possible to prevent molding defects due to cooling of the sheet.

Further, since creases are not formed, it is not necessary to consider the interference between the creases and the pocket portion forming position when the sheet is intermittently fed, and the outlet of the heating means (downstream end) and the inlet of the forming means (upstream side). The distance of the end) can be made closer than before. This also reduces the possibility that the sheet will cool between the heating means and the molding means.

According to such a configuration, the sheet can be maintained horizontally between the outlet of the heating means (downstream end) and the inlet of the molding means (upstream end), so that the occurrence of creases can be avoided and the appearance is aesthetically pleasing. An excellent method for producing a PTP package can be provided.

In addition, since creases do not occur, the sheet can be stably transported, and in the downstream process, the packaged body (drugs, etc.) may be misaligned when it is stored in the molded pocket, or the packaged material may be stored. It is possible to prevent problems such as the body vibrating in the pocket and becoming unstable.

Even when the pocket is molded with a molding device, the resin sheet does not form a molding line with creases, so the PTP sheet manufacturing device and PTP are excellent in aesthetics, avoid molding defects, and can be stably conveyed. A sheet manufacturing method can be provided.

It is an overall view which shows one preferable embodiment of the PTP packaging machine which concerns on this invention. It is a schematic view of the PTP sheet molded by the PTP sheet manufacturing apparatus which concerns on this invention, is (a) plan view, (b) side view. It is a side view which shows the main part of the PTP sheet manufacturing apparatus. It is a side view which shows the main part of the PTP sheet manufacturing apparatus. It is a side view which shows the main part of the PTP sheet manufacturing apparatus. It is a side view for demonstrating the prior art. It is a figure for demonstrating the prior art, (a) plan view, (b) side view, (c) enlarged side view.

Hereinafter, the PTP (Press Through Packaging) sheet manufacturing apparatus 10 according to the present invention will be described in detail with reference to FIGS. 1 to 5.

<First Embodiment>

FIG. 1 is a schematic view showing an example of a PTP packaging machine 50 including the PTP sheet manufacturing apparatus 10 of the present embodiment. 2A and 2B are views showing an example of a PTP sheet molded by the PTP sheet manufacturing apparatus 10 of the present embodiment, in which FIG. 2A is a plan view and FIG. 2B is a side view. Further, FIG. 3 is a side view showing a main part of the PTP sheet manufacturing apparatus 10 of the present embodiment, FIG. 3A is a side view at the time of transporting the sheet, and FIGS. It is a side view at the time of heating and molding of a sheet. In this drawing and the subsequent drawings, some configurations will be omitted as appropriate to simplify the drawings.

As shown in FIG. 1, in the PTP packaging machine 50, the raw fabric roll 11 on which the resin sheet S is wound is rotatably set on the upstream side (left side in the drawing) of the apparatus. The resin sheet S is continuously pulled out from the original roll 11 by the feed roller 12, is hung on the plurality of rollers 13, and is guided to the heating device 15. The heating device 15 has a first heating plate 15a and a second heating plate 15b, and is adapted to heat a predetermined portion (pocket portion molding region) of the resin sheet S.

The molding apparatus 16 is arranged in close proximity to the downstream side of the heating apparatus 15. The molding apparatus 16 has a first forming plate 16a and a second forming plate 16b, and forms the pocket portion A by pneumatic molding on the pocket portion forming region of the resin sheet S partially heated by the heating device 15 ( (See FIG. 2). The heating device 15 and the molding device 16 will be described in detail later.

Auxiliary cooling device 32 having a first auxiliary cooling plate 32a and a second auxiliary cooling plate 32b is provided downstream of the molding device 16. The resin sheet S that has been molded in the pocket portion A that has passed through the molding apparatus 16 is sandwiched between the first auxiliary cooling plate 32a and the second auxiliary cooling plate 32b and cooled again, so that the molding of the pocket portion A is fixed. A feeding device 14 that intermittently feeds the resin sheet S is arranged downstream of the auxiliary cooling device 32, and the feeding device 14 clamps the resin sheet S and lowers a distance corresponding to one molding length. , The operation of opening the clamp, ascending, and returning to the original position is repeated. The resin sheet S sent out from the feeding device 14 is hung on the dancer roller 19 and the idle roller 17 and conveyed by a predetermined route.

A packaged body supply device 18 is installed at a predetermined position above the transport path of the resin sheet S, and a packaged body (for example, a tablet) is supplied to each pocket portion A from the packaged body supply device 18. To. A sealing device 20 is arranged on the downstream side of the packaged body supply device 18, and the resin sheet S supplied by the packaged body is guided to the sealing device 20.

On the other hand, the original roll 22 on which the lid film 21 made of an aluminum sheet or the like is wound is rotatably installed near the carry-out end side of the PTP packaging machine 50. The lid film 21 pulled out from the original roll 22 is hung on a plurality of rollers 23, passes through a predetermined path, and is guided to the sealing device 20. Then, in this sealing device 20, the lid film 21 is coated so as to cover the upper surface of the resin sheet S, and the contact portion between the two films (the unformed region of the pocket portion A of the resin sheet S) is heat-sealed. It is sealed.

The seal device 20 includes a seal roller 20a having a built-in heater and a seal receiving roller 20b having a recess on the surface corresponding to a pocket portion A formed in the resin sheet S. The vertical and horizontal spacing of the recesses formed in the seal receiving roller 20b matches the vertical and horizontal spacing of the pocket portion A formed in the resin sheet S. As a result, the resin sheet S is hung in a state where the formed pocket portion A is aligned with the recess provided in the seal receiving roller 20b. Therefore, as the seal receiving roller 20b rotates, the resin sheet S is also conveyed. Then, the resin sheet S and the lid film 21 pass between the seal roller 20a and the seal receiving roller 20b in a state where they are overlapped with each other, and when the resin sheet S and the lid film 21 are overlapped, they are sandwiched between both rollers and pressed in a heated state to form a pocket portion. The unformed region is closely sealed, and the object to be packaged in the pocket portion A is sealed.

Further, on the downstream side of the sealing device 20, there is an engraving device 25 for engraving a lot number or the like on the film, and a predetermined position of the film is half-cut to be around the pocket portion A so that the film can be separated into predetermined numbers. The slitter device 26 and the punching device 27 that form an easy-to-cut line are arranged in this order. The punching device 27 punches a predetermined position of the sealed and integrated resin sheet S and the lid film 21 to manufacture a PTP package having n × m pockets A. Since the marking device 25, the slitter device 26, and the punching device 27 are basically the same as the conventional PTP packaging machine, detailed description thereof will be omitted.

The PTP sheet S manufactured by the PTP sheet manufacturing apparatus 10 of the present embodiment will be described with reference to FIG.

The PTP sheet S is, for example, a resin sheet such as a PP film or a PVC film, contains a packaged object (for example, a tablet or the like), and has a plurality of pocket portions A arranged in a matrix. In the present embodiment, the resin sheet before molding of the pocket portion A and the resin sheet (PTP sheet) after molding of the pocket portion A may be collectively referred to as "resin sheet S" when it is not necessary to distinguish them. is there. The PTP sheet S constitutes, for example, a PTP package, and the packaged body is supplied from the packaged body supply device 18 shown in FIG. 1 to the pocket portion A, and in the sealing process by the sealing device 20, the lid film 21 is used. The object to be packaged is packaged by crimping to the PTP sheet S. What is packaged in this way is a PTP package, and when opened, the contents are pushed out from the pocket portion A side to destroy the lid film 21, and the packaged body is taken out. Here, the pocket portion A has a substantially circular shape in a plan view, and a downwardly convex storage area is formed. A plurality of pocket portions A are arranged in a matrix. Further, a plurality of pocket portions A in the block B (indicated by a broken line) are simultaneously molded by molding the pocket portion forming region once. Further, the resin sheet S is intermittently fed for each block B. The arrangement of the pocket portions A and the number in one block B are not limited to the illustrated example.

As shown in FIGS. 1 and 3, the PTP sheet manufacturing apparatus 10 includes a heating means (heating apparatus 15), a molding means (molding apparatus 16), and an auxiliary cooling device 32 (not shown in FIG. 2). Ru.

In the present embodiment, as an example, a strip-shaped resin sheet S having a predetermined width is formed so that its molding surface (a surface parallel to the transport surface on which the pocket portion A is molded) is substantially horizontal to the floor surface. The PTP sheet manufacturing apparatus 10 for transporting in the transport direction T (from the left side to the right side in the drawing) will be described.

As shown in FIG. 3, a heating device 15 is arranged on the upstream side (left side in the drawing) and a molding device 16 is arranged on the downstream side (right side in the drawing) on the transport path T of the resin sheet S.

The heating device 15 is located on one side of the resin sheet S (upper in this example) and on the other side of the resin sheet S (lower in this example) facing the first heating plate 15a. A second heating plate 15b is provided. In the following description, the first heating plate 15a will be referred to as an "upper heating plate 15a" and the second heating plate 15b will be referred to as a "lower heating plate 15b".

The upper heating plate 15a and the lower heating plate 15b are arranged to face each other with respect to the molding surface of the resin sheet S, and move in a direction perpendicular to the molding surface of the resin sheet S (here, in the vertical direction) by, for example, cylinder driving. It is provided as possible. The distance (gap) x1 between the facing surfaces of the upper heating plate 15a and the lower heating plate 15b is appropriately selected depending on the thickness of the resin sheet S. As an example, when heating for molding (closest contact), the resin is used. It is separated from the sheet S at a close distance in contact or non-contact, and as an example, x1 = 0.3 mm to 0.5 mm, and when the sheet is conveyed, x1 = 1.0 mm to 10 mm. In addition, it is further separated (for example, about several tens of centimeters) during maintenance. The entire surface of the resin sheet S passing through the heating device 15 sandwiched between the upper heating plate 15a and the lower heating plate 15b is heated at, for example, about 140 ° C. and softened.

The molding apparatus 16 is placed on one side (upper in this example) of the resin sheet S and on the other side (lower in this example) of the resin sheet S facing the first forming plate 16a. A second molding plate 16b is provided, and a pocket portion A for one block B is molded on a part (pocket portion forming region) of the resin sheet S heated by the heating device 15. In the following description, the first molded plate 16a will be referred to as an "upper molded plate 16a" and the second molded plate 16b will be referred to as a "lower molded plate 16b".

The lower molding plate 16b of the molding apparatus 16 is provided with a plurality of recesses 162 for molding the pocket portion A. Further, the upper forming plate 16a is provided with a forming pressure air path 161 for blowing compressed air (pressure air) into the plurality of recesses 162 corresponding to the plurality of recesses 162.

The lower molded plate 16b can be moved in the vertical (vertical) direction by a driving mechanism (for example, a cam mechanism) (not shown), and the vertical operating range is, for example, about 30 mm. Instead of the drive by the cam mechanism, a link mechanism or a piston mechanism driven by a servomotor may be used.

On the other hand, the upper molded plate 16a has a built-in spring structure for fixing the resin sheet S at a set pressure, but does not have (fixed) a drive mechanism for moving it up and down.

In the molding apparatus 16, the temperatures of the upper molding plate 16a and the lower molding plate 16b at the time of molding are cooled to, for example, about 18 ° C., and the resin sheet S softened by heating by the upper molding plate 16a and the lower molding plate 16b is formed from above and below. By sandwiching and blowing compressed air onto the recess 162 of the lower molding plate 16b, the resin sheet S is cooled while molding the concave pocket portion A, and the molding is fixed.

As shown in FIG. 6A, when the resin sheet S is transported (moved), the upper heating plate 15a and the lower heating plate 15b of the heating device 15 are retracted in the vertical direction so as to be separated from the resin sheet S. .. The resin sheet S is transported, for example, from the floor surface at a transport position TH at a predetermined height. As an example, the thickness of the resin sheet S is 0.3 mm, and the facing surfaces of the upper heating plate 15a and the lower heating plate 15b (the surface (lower surface) of the upper heating plate 15a on the resin sheet S side and the resin of the lower heating plate 15b). The distance x1 between the surfaces (upper surface) on the sheet S side is 1.0 mm.

Further, the upper molding plate 16a and the lower molding plate 16b of the molding apparatus 16 are also retracted in the vertical direction so as to be separated from the resin sheet S, but the facing surfaces on the resin sheet S side of both (the resin sheet of the upper molding plate 16a). The distance x2 between the surface on the S side (lower surface) and the surface (upper surface) on the resin sheet S side of the lower molded plate 16b is larger than the distance x1 between the facing surfaces of the upper heating plate 15a and the lower heating plate 15b. (For example, x2 = about 30 mm).

Further, the distance x3 between the lower surface of the upper molded plate 16a and the molded surface of the resin sheet S during transportation of the resin sheet S is, for example, about 2.5 mm, and the lower surface of the upper molded plate 16a is the upper heating plate 15a of the heating device 15. It is located at a position higher than the lower surface of the above (position separated from the resin sheet S) (the lower surface of the upper heating plate 15a and the lower surface of the upper molded plate 16a are provided with a height difference Δx).

FIGS. (B) and (c) show states during heating and molding (heating step and molding step). FIG. 3B is a side view showing the state of the heating device 15 and the molding device 16 after moving up and down, and FIG. 3C shows the positions of the heating device 15 and the molding device 16 which are in the shunting position during transportation. It is a side view which shows the position of the resin sheet S at the time of transport by a broken line, and superimposing it on FIG.

As shown in FIGS. (B) and (c), in the heating step of the resin sheet S, the upper heating plate 15a and the lower heating plate 15b of the heating device 15 move so as to be close to each other, and the first resin sheet S is the first. In addition to sandwiching the region, in the molding step, the upper molding plate 16a and the lower molding plate 16b of the molding apparatus 16 move so as to be close to each other to sandwich the second region of the resin sheet S.

More specifically, in the heating device 15, in the heating step, the positions of the upper heating plate 15a and the lower heating plate 15b during transportation in the figure (a) are set to the respective reference positions (see the broken line in the figure (c)). Then, the lower heating plate 15b rises, for example, 2.7 mm from the reference position of the lower heating plate 15b, and the upper heating plate 15a rises, for example, 2.0 mm from the reference position of the upper heating plate 15a. As a result, the distance x1 between the facing surfaces of the upper heating plate 15a and the lower heating plate 15b is close to 0.3 mm, and the predetermined sandwiching position (for example, the height in the vertical direction) above the transport position TH is shown. Position, height position in the direction perpendicular to the surface of the conveyed resin sheet S) The resin sheet S is sandwiched between PHs. As a result, the resin sheet S located between the upper heating plate 15a and the lower heating plate 15b is lifted above the reference position (transport position TH) of the resin sheet S indicated by the alternate long and short dash line by both the heating plates 15a and 15b. The upper heating plate 15a and the lower heating plate 15b have a built-in heater, and heat the resin sheet S at a predetermined temperature (for example, 140 ° C.) for a predetermined time to soften the resin sheet S into a moldable state.

On the other hand, in the molding apparatus 16, in the molding step, assuming that the positions of the upper molding 16a and the lower molding plate 16b during transportation in the figure (a) are the respective reference positions (see the broken line in the figure (c)), the lower molding Only the plate 16b rises, for example, 30.0 mm from the reference position of the lower molded plate 16b, and is above the transfer position TH, and is a predetermined sandwiching position (for example, a vertical height position, the resin sheet S to be conveyed). The resin sheet S, which has been heated and intermittently conveyed, is sandwiched at PH (height position in the direction perpendicular to the surface of the surface).

The heating step by the heating device 15 and the molding process of the pocket portion A by the molding device 16 are executed at the same time. At this time, the region heated by the heating device 15 (first region) is set to be wider than the region where the pocket portion is molded by the molding apparatus 16 (pocket portion molding region, second region). The moving distance of the resin sheet S that is intermittently conveyed is the length in the front-rear direction that can be processed by the molding apparatus 16 at one time. As a result, the resin sheet S advances while intermittently moving in the heating device 15 a plurality of times, is preheated and softened, and is finally located near the downstream side at the time of the next temporary stop carried out from the heating device 15. It is set in the molding apparatus 16. Then, as the lower forming plate 16b moves upward, the resin sheet S located between the upper forming plate 16a and the lower forming plate 16b is lifted upward by the lower forming plate 16b, and both forming plates are lifted at the sandwiching position PH. It is sandwiched between 16a and 16b and pressed against the lower molding plate 16b by the compressed air supplied from the compressed air passage 161 for molding to form the pocket portion A. Further, the molding air passing through the molding compressed air path 161 is exhausted from the lower molding plate 16b.

As described above, in the present embodiment, the resin sheet S is sandwiched when the upper molded plate 16a and the lower molded plate 16b sandwich the second region of the resin sheet S at the sandwiching position (height) PH. The upper heating plate 15a and the lower heating plate 15b are arranged at positions sandwiching the first region of the resin sheet S at the position PH, and the upper heating plate 15a and the lower heating plate 15b are the most for heating the resin sheet S. approach. Then, the heating device 15 and the molding device 16 sandwich the resin sheet S in a positional relationship so that the resin sheet S does not bend between the heating device 15 and the molding device 16.

More specifically, during heating by the heating device 15 and molding by the molding device 16, the resin sheet S is placed at a position (pinching position PH) higher than the reference position (transport position TH) during transportation, and the heating device 15 and the molding device 16 The resin sheet S is set so that the position (height) along the transport direction does not change between the heating device 15 and the molding device 16. That is, in a state where the heating device 15 and the molding device 16 sandwich the resin sheet S, the resin sheet S sandwiched between the heating device 15 and the molding device 16 and the resin sheet S between the heating device 15 and the molding device 16. It is set so that and is in a straight line. Here, in the "sandwiching of the sheet by the heating device 15 (state in which the heating device 15 sandwiches the resin sheet S)", the upper heating plate 15a and the lower heating plate 15b have a predetermined interval when the resin sheet S is heated. Includes keeping close proximity. Further, "the resin sheet S is located in a straight line" means that the resin sheet S sandwiched by the molding apparatus 16 at a predetermined sandwiching position PH is adjacent to the upper heating plate 15a and the lower heating plate 15b during heating. When there is a sheet between the two (when the resin sheet S is sandwiched by the molding apparatus 16 at a predetermined sandwiching position PH, the upstream side of the resin sheet S is the upper heating plate 15a and the lower portion which are close to each other during heating. (When sandwiched by the heating device 15 so as to be located between the heating plate 15b) is included. Then, heating and molding are performed in a state where the positions (heights) of the resin sheets S are matched.

When the resin sheet S is conveyed, both the heating plates 15a and 15b are heated while the upper heating plate 15a and the lower heating plate 15b are separated from the resin sheet S while increasing the distance x1 between the facing surfaces in the heating device 15. As it descends from the position at the time of molding, the lower molding plate 16b moves downward in the molding apparatus 16 so as to be separated from the resin sheet S. As a result, the resin sheet S and the upper molded plate 16a are separated by a sufficient distance x3.

By doing so, the resin sheet S can be maintained horizontally between the outlet of the heating device 15 (downstream end) and the inlet of the molding device 16 (upstream end), so that the occurrence of creases can be avoided. , A resin sheet (PTP sheet) S having an excellent appearance can be manufactured.

In addition, since creases do not occur, the resin sheet S can be stably conveyed, and in the downstream process, a misalignment may occur when the packaged body (drug, etc.) is stored in the molded pocket portion A. It is possible to prevent the occurrence of problems such as the packaged body vibrating in the pocket portion A and becoming unstable.

On the other hand, as shown in FIG. 6A, when the resin sheet S is conveyed, the upper heating plate 15a and the lower heating plate 15b of the heating device 15 are brought as close as possible to the resin sheet S, while the upper molding plate in the molding device 16 The 16a and the lower molded plate 16b should be separated from the resin sheet S as much as possible, and the position (height) of the lower surface of the upper heating plate 15a of the heating device 15 and the position (height) of the lower surface of the upper molding plate 16a of the molding device 16. Can provide as large a height difference Δx as possible.

Specifically, at the time of transportation, the distance x1 between the upper heating plate 15a and the lower heating plate 15b can be sufficiently close (for example, about x1 = 1.0 mm) in the heating device 15. As a result, it is possible to prevent the heating efficiency from deteriorating.

At the same time, in the molding apparatus 16, the distance x3 between the lower surface of the upper molding plate 16a and the molding surface of the resin sheet S and the distance x2 between the upper surface of the lower molding plate 16b and the molding surface of the resin sheet S are sufficient (for example, x2). = 30.0 mm, x3 = 2.5 mm) and at the position (height) of the lower surface of the upper heating plate 15a of the heating device 15 and the position (height) of the lower surface of the upper molding plate 16a of the molding device 16. A sufficient height difference Δx (for example, Δx = 2.0 mm) can be provided.

As a result, when the heated resin sheet S is moved to the molding apparatus 16, contact between the upper molding plate 16a or the lower molding plate 16b and the resin sheet S can be avoided. Further, even if the resin sheet S is attracted to the upper molded plate 16a (or the lower molded plate 16b) due to static electricity, contact between the two molded plates 16a and 16b and the resin sheet S can be avoided. That is, it is possible to prevent molding defects due to cooling of the resin sheet S.

Further, since the crease is not formed, it is not necessary to consider the interference between the crease and the pocket portion forming position when the resin sheet S is intermittently fed, and the outlet (downstream side end portion) of the heating device 15 and the molding device 16 The distance L of the inlet (upstream end) can be made closer than before (at least about 3 mm) (for example, it can be made closer to about 0.5 mm to 2 mm). As a result, the possibility that the resin sheet S cools between the heating device 15 and the molding device 16 can be reduced.

In this example, the case where both the upper heating plate 15a and the lower heating plate 15b are moved upward during heating has been described, but the resin sheet S is sandwiched between the heating device 15 and the molding device 16 during heating and molding. The configuration is not limited to the above example as long as the position (height position) PH is the same. That is, depending on the thickness of the resin sheet S and the setting of the retreat position of the heating device 15 and the molding device 16 during transportation, only the upper heating plate 15a may be moved, or only the lower heating plate 15b may be moved. it can.

<Second Embodiment>

A second embodiment of the PTP sheet manufacturing apparatus 10 of the present invention will be described with reference to FIG. FIG. 4A is a side view of the sheet during transportation, and FIGS. 4B and 4C are side views of the sheet during heating and molding.

In the second embodiment, another example in which heating and molding are performed in a state where the sandwiching position (height) PH of the resin sheet S is matched will be described. In this embodiment as well, the resin sheet S is sandwiched between the heating device 15 and the molding device 16 at a sandwiching position PH higher than the reference position (transporting position TH) during transport during heating by the heating device 15 and molding by the molding device 16. The resin sheet S is set so that the position (height) along the transport direction does not change between the heating device 15 and the molding device 16.

As shown in FIG. 3A, when the resin sheet S is transported (moved), the upper heating plate 15a of the heating device 15 pushes the resin sheet S downward and is transported at a predetermined transport position TH. Here, "pushing downward" means that the resin sheet S is bridged between the roll 13 on the upstream side and the roll 13 on the downstream side of the heating device 15, and no force other than the roll 13 is applied to the resin sheet S (FIG. FIG. It means pushing down below (see 1). As a result, the upper heating plate 15a comes into contact with the resin sheet S, but the lower heating plate 15b is retracted downward so as to be separated from the resin sheet S. In this case as well, the distance x1 between the facing surfaces of the upper heating plate 15a and the lower heating plate 15b is 1.0 mm.

Further, the upper molding plate 16a and the lower molding plate 16b of the molding apparatus 16 are also retracted in the vertical direction so as to be separated from the resin sheet S, but the distance x2 between the facing surfaces on the resin sheet S side of both (for example, x2 =). 30 mm) is larger than the distance x1 between the facing surfaces of the upper heating plate 15a and the lower heating plate 16b.

Further, the distance x3 between the lower surface of the upper molded plate 16a during transportation of the resin sheet S and the molding surface of the resin sheet S is, for example, about 2.5 mm, and the lower surface of the upper molded plate 16a is the upper heating plate 15a of the heating device 15. It is located at a position (a position separated from the resin sheet S) about 2.0 mm higher than the lower surface of the resin sheet (Δx = 2.0 mm).

FIGS. (B) and (c) show states during heating and molding (heating step and molding step). FIG. 3B is a side view showing the state of the heating device 15 and the molding device 16 after the vertical movement, and FIG. 3C is a side view showing the state of the heating device 15 and the molding device 16 after being moved up and down, and FIG. It is a side view which shows the position of the apparatus 16 by a broken line, and shows the position of a resin sheet S at the time of transport by a dotted chain line.

As shown in FIGS. (B) and (c), when the resin sheet S is heated and molded, the upper heating plate 15a and the lower heating plate 15b of the heating device 15 move upward while being close to each other to sandwich the resin sheet S. At the same time, the upper molding plate 16a and the lower molding plate 16b of the molding apparatus 16 move so as to be close to each other to sandwich the resin sheet S.

More specifically, in the heating device 15, assuming that the positions of the upper heating plate 15a and the lower heating plate 15b during transportation in the figure (a) are the respective reference positions (see the broken line in the figure (c)), the lower heating is performed. The plate 15b rises, for example, 2.7 mm from the reference position of the lower heating plate 15b, and the upper heating plate 15a rises, for example, 2.0 mm from the reference position of the upper heating plate 15a. As a result, the distance x1 between the facing surfaces of the upper heating plate 15a and the lower heating plate 15b is close to 0.3 mm, and is higher than the reference position (transport position TH) at the time of transportation, which is a predetermined pinching position (vertical) in the figure. (Height position in the direction) The resin sheet S is sandwiched between PH.

As a result, the resin sheet S located between the upper heating plate 15a and the lower heating plate 15b is lifted above the reference position (dashed line) of the resin sheet S by both the heating plates 15a and 15b. In this example, the pinching position PH is a state in which the resin sheet S is bridged between the roll 13 on the upstream side and the roll 13 on the downstream side of the heating device 15 and no force other than the roll 13 is applied (see FIG. 1). The position (height).

On the other hand, in the molding apparatus 16, if the positions of the upper molding 16a and the lower molding plate 16b during transportation in the figure (a) are set to the respective reference positions (see the broken line in the figure (c)), only the lower molding plate 16b is used. The resin sheet S, which is heated and intermittently conveyed, is sandwiched at a predetermined sandwiching position (height position in the vertical direction) PH, which is raised by, for example, 30.0 mm from the reference position of the lower molded plate 16b.

Then, when the resin sheet S is conveyed, in the heating device 15, the upper heating plate 15a and the lower heating plate 15b are separated from the resin sheet S while increasing the distance x1 between the facing surfaces thereof, and the upper heating plate 15a is separated from the resin sheet S. The lower molding plate 16b moves away from the resin sheet S in the molding apparatus 16 while moving downward so as to press. As a result, the resin sheet S and the upper molded plate 16a are separated by a sufficient distance x3.

In this example, the case where both the upper heating plate 15a and the lower heating plate 15b are moved upward during heating has been described, but the resin sheet S is sandwiched between the heating device 15 and the molding device 16 during heating and molding. The configuration is not limited to the above example as long as the positions (height positions) match. That is, depending on the thickness of the resin sheet S and the setting of the retreat position of the heating device 15 and the molding device 16 during transportation, only the upper heating plate 15a may be moved, or only the lower heating plate 15b may be moved. it can.

Other configurations are the same as those in the first embodiment.

<Third Embodiment>

A third embodiment of the PTP sheet manufacturing apparatus 10 of the present invention will be described with reference to FIG. FIG. 5A is a side view of the sheet during transportation, and FIGS. 5B and 5C are side views of the sheet during heating and molding.

The third embodiment is also another example in which heating and molding are performed in a state where the positions (heights) of the resin sheets S are matched. In the present embodiment, the position (height) of the resin sheet S is set so as not to change during heating by the heating device 15 and molding by the molding device 16 and when the resin sheet S is conveyed.

As shown in FIG. 3A, when the resin sheet S is transported (moved), the upper heating plate 15a and the lower heating plate 15b of the heating device 15 are retracted in the vertical direction so as to be separated from the resin sheet S. , The resin sheet S is transported at a predetermined transport height TH. As an example, the distance x1 between the facing surfaces of the upper heating plate 15a and the lower heating plate 15b is 1.0 mm.

Further, the upper molding plate 16a and the lower molding plate 16b of the molding apparatus 16 are also retracted in the vertical direction so as to be separated from the resin sheet S, but the distance x2 between the facing surfaces on the resin sheet S side of both (for example, 30). (0.0 mm) is larger than the distance x1 between the facing surfaces of the upper heating plate 15a and the lower heating plate 16b.

Further, the distance x3 between the lower surface of the upper molded plate 16a and the molded surface of the resin sheet S during transportation of the resin sheet S is, for example, about 2.7 mm, and the lower surface of the upper molded plate 16a is the upper heating plate 15a of the heating device 15. It is located at a position (a position separated from the resin sheet S) about 2.0 mm higher than the lower surface of the resin sheet (Δx = 2.0 mm).

FIGS. (B) and (c) show states during heating and molding (heating step and molding step). FIG. 3B is a side view showing the state of the heating device 15 and the molding device 16 after the vertical movement, and FIG. 3C is a side view showing the state of the heating device 15 and the molding device 16 after being moved up and down. It is a side view which showed the position of the apparatus 16 by a broken line.

As shown in FIGS. (B) and (c), when the resin sheet S is heated and molded, the upper heating plate 15a of the heating device 15 moves downward and comes close to the lower heating plate 15b to sandwich the resin sheet S. At the same time, the upper molding plate 16a and the lower molding plate 16b of the molding apparatus 16 move so as to be close to each other to sandwich the resin sheet S.

More specifically, in the heating device 15, assuming that the positions of the upper heating plate 15a and the lower heating plate 15b during transportation in the figure (a) are the respective reference positions (see the broken line in the figure (c)), the upper heating is performed. The plate 15a is lowered by, for example, 0.7 mm from the reference position of the upper heating plate 15a (the lower heating plate 15b does not move). As a result, the distance x1 between the facing surfaces of the upper heating plate 15a and the lower heating plate 15b is close to 0.3 mm. Then, the resin sheet S is sandwiched at a predetermined sandwiching position (height position in the vertical direction) PH which is the same as the reference position (transportation position TH) at the time of transportation.

On the other hand, in the molding apparatus 16, assuming that the positions of the upper molding 16a and the lower molding plate 16b during transportation in the figure (a) are the respective reference positions (see the broken line in the figure (c)), the upper molding plate 16a is the upper portion. The lower molded plate 16b is lowered by, for example, 2.7 mm from the reference position of the molded plate 16a, and the lower molded plate 16b is raised by, for example, 30.0 mm from the reference position of the lower molded plate 16b. The resin sheet S that has been heated and intermittently transported is sandwiched at the PH (height position).

In this example, a drive mechanism (for example, a cam mechanism, etc.) for the upper molded plate 16a is additionally required, but as compared with the first embodiment and the second embodiment, the resin sheet S is used during heating / molding or transportation. The force (tension) applied to the can be minimized.

In this example, the case where only the upper heating plate 15a is moved downward during heating has been described, but the sandwiching position (height position) of the resin sheet S between the heating device 15 and the molding device 16 during heating and molding. The above example is not limited as long as the configurations are the same. That is, depending on the thickness of the resin sheet S and the setting of the saving position of the heating device 15 and the molding device 16 during transportation, only the lower heating plate 15b may be moved, or both the upper heating plate 15a and the lower heating plate 15b may be moved. It can also be done.

Other configurations are the same as those in the first embodiment.

The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit and technical idea.

That is, in the above embodiment, the position, size, length, shape, material, orientation, etc. of each configuration can be appropriately changed.

For example, in each of the above embodiments, the upper heating plate 15a and the lower heating plate 15b are described in the heating device 15, and the upper molding plate 16a and the lower molding plate 16b are described in the molding device 16, but the first heating plate of the heating device 15 is described. The 15a and the second heating plate 15b mean that there are two heating plates facing each other across the resin sheet S, and the first molding plate 16a and the second molding plate 16b of the molding apparatus 16 sandwich the resin sheet S. Means that there are two forming plates facing each other. That is, the resin sheet S transported between the heating device 15 and the molding device 16 may be transported in a substantially vertical direction or in an oblique direction (obliquely upward, diagonally downward) close to the vertical direction, in which case leftward heating. The plate 15a, the right heating plate 15b, the left molded plate 16a, the right molded plate 16b, and the like.

Further, in the molding of the pocket portion A, in addition to the compressed air molding, the molding by the plug pin or the molding by the combination of the compressed air molding and the plug pin may be performed.

Further, a guide member may be provided to regulate meandering in the width direction when the resin sheet S is softened. The guide members may be provided, for example, on the sides of the PTP sheet manufacturing apparatus 10, which are both ends in the sheet width direction.

S Sheet A Pocket part 10 PTP sheet manufacturing equipment 15 Heating equipment 15a First heating plate 15b Second heating plate 16 Molding equipment 16a First molding plate 16b Second molding plate 50 PTP packaging machine

Claims (2)

A PTP sheet manufacturing device that forms a plurality of pockets on a strip-shaped sheet to be conveyed.
It has a first heating plate arranged on one side of the sheet and a second heating plate arranged on the other side of the sheet facing the first heating plate, and heats the sheet during transportation. With heating means
It has a first molded plate arranged on one side of the sheet and a second molded plate arranged on the other side of the sheet facing the first molded plate, and is arranged on the downstream side of the heating means. A molding means for molding the pocket portion on a part of the sheet is provided.
The heating means moves at least one of the first heating plate and the second heating plate during heating to sandwich the sheet at the sandwiching position.
The molding means moves at least one of the first molding plate and the second molding plate at the time of molding to sandwich the sheet at the sandwiching position.
The pinching position is a position different from the conveying position of the sheet is aligned on a position between said shaping means the sheet heating means,
The heating means and the molding means move in conjunction with each other to the sandwiching position.
A PTP sheet manufacturing apparatus characterized in that. A PTP sheet manufacturing method in which a plurality of pockets are formed on a strip-shaped sheet to be conveyed.
A heating step of heating the sheet during transportation by a first heating plate arranged on one side of the sheet and a second heating plate arranged on the other side of the sheet facing the first heating plate. ,
The pocket portion is formed in a part of the sheet by the first molded plate arranged on one side of the heated sheet and the second molded plate arranged on the other side of the sheet facing the first molded plate. Has a molding process to mold
In the heating step, at least one of the first heating plate and the second heating plate is moved and sandwiched in a state where the sheet is not bent between the heating step and the molding step. In the molding step, at least one of the first molded plate and the second molded plate is moved to sandwich the sheet at the sandwiched position.
The sandwiching position is a position different from the transport position of the sheet, and the heating means having the first heating plate and the second heating plate, and the molding means having the first molding plate and the second molding plate. a position where the height of the sheet is on a straight line between,
The heating plate and the molded plate move in conjunction with each other to the sandwiching position.
A method for producing a PTP sheet.

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