JP6819945B2 - Tuning fork type crystal vibration element and its manufacturing method, and tuning fork type crystal oscillator - Google Patents

Description

The present invention relates to a tuning fork type crystal vibrating element that operates based on the piezoelectric effect of quartz, a method for manufacturing the same, and a tuning fork type crystal oscillator.

As the tuning fork type crystal oscillator, a tuning fork type crystal vibrating element in which a pair of vibrating arms are extended in parallel from the base of the base material is used. Such a crystal oscillator is used for a timing device, a vibration gyro sensor, or the like mounted on an electronic device such as a mobile computer, a portable game machine, a mobile phone, an IC card, or a communication base station. With the miniaturization and high performance of electronic devices, the tuning fork type crystal oscillator and the tuning fork type crystal vibrating element built therein are required to be miniaturized and improved in reliability.

For example, Patent Document 1 discloses a vibrating piece having a base, a pair of vibrating arms extending from the base, and a supporting arm extending in parallel with the vibrating arm. The vibrating piece described in Patent Document 1 has notches on both main surfaces of the base so as to represent constriction for the purpose of reducing the loss of vibrating energy. In addition, in order to prevent the constriction of the base from being damaged when an impact such as a large displacement of the vibrating arm is applied, the vibrating arm comes into contact with the vibrating arm when it is displaced beyond the normal amplitude range. , Has a receiving part at the tip of the support arm.

Japanese Unexamined Patent Publication No. 2012-151639

However, in the vibrating piece described in Patent Document 1, in order to provide the receiving portion, the supporting arm must be provided in parallel with the vibrating arm, which hinders miniaturization.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a tuning fork type crystal vibrating element which can be miniaturized while improving impact resistance, a method for manufacturing the same, and a tuning fork type crystal oscillator. Is.

The tuning fork type crystal vibrating element according to one aspect of the present invention includes a base portion, a plurality of vibrating arm portions extending in a first direction from the base portion and arranging in a second direction intersecting the first direction, and at least one receiving portion. The base includes a connecting portion provided so as to commonly fix the bases of a plurality of vibrating arms, a supporting portion provided at a distance from the connecting portion in the first direction, and a connecting portion. The connecting portion and the supporting portion are provided so as to connect the connecting portion and the supporting portion, and the width in the second direction is provided with the connecting portion and the narrow portion smaller than the supporting portion, and the receiving portion is provided in the first direction. It is provided between the connecting portion and the supporting portion.

The tuning fork type crystal vibrating element according to another aspect of the present invention includes a base, a plurality of vibrating arms extending from the base in the first direction and arranging in a second direction intersecting the first direction, and at least one receiving portion. The base is provided with a connecting portion provided so as to commonly fix the bases of a plurality of vibrating arms, and a supporting portion provided at a distance from the connecting portion in the first direction. A plurality of receiving portions are provided between the connecting portion and the supporting portion so as to connect the connecting portion and the supporting portion and include a narrow portion having a width smaller than that of the connecting portion and the supporting portion in the second direction. When the vibrating arm exceeds a desired amplitude range, the displacement of the vibrating arm is regulated by contacting the connecting portion or the supporting portion in the first direction.

The method for manufacturing a sound-forked crystal vibrating element according to another aspect of the present invention includes a step of preparing a crystal substrate, a step of providing a photoresist layer on the crystal substrate, a step of patterning the photoresist layer, and patterning. A step of etching a crystal substrate by wet etching based on the photoresist layer to form a crystal piece, wherein the crystal piece extends from the base in the first direction and intersects the first direction. A plurality of vibrating arm portions arranged in two directions and at least one receiving portion are provided, and the base portion includes a connecting portion provided so as to commonly fix the bases of the plurality of vibrating arm portions, and a first direction. Is provided so as to connect the connecting portion and the supporting portion between the supporting portion provided at a distance from the connecting portion and the connecting portion and the supporting portion, and the width in the second direction is larger than that of the connecting portion and the supporting portion. The narrow portion is provided, and the receiving portion is provided between the connecting portion and the supporting portion in the first direction.

The tuning fork type crystal oscillator according to another aspect of the present invention includes a base member, a lid member forming an internal space between the base members, a tuning fork type crystal vibrating element housed in the internal space, and a tuning fork type. The tuning fork type crystal vibrating element includes a holding member for holding the crystal vibrating element on the base member, and the tuning fork type crystal vibrating element includes a base and a plurality of vibrating arms arranged in a second direction extending from the base in the first direction and intersecting the first direction. The base is provided with at least one receiving portion, and the base is provided at a distance from the connecting portion in the first direction with a connecting portion provided so as to commonly fix the bases of the plurality of vibrating arm portions. A narrow portion that is provided so as to connect the connecting portion and the supporting portion between the connecting portion and the supporting portion and has a width smaller than that of the connecting portion and the supporting portion in the second direction. The receiving portion is provided between the connecting portion and the supporting portion in the first direction, and the holding member fixes the supporting portion to the base member.

According to the present invention, it is possible to provide a tuning fork type crystal vibrating element which can be miniaturized while improving impact resistance, a method for manufacturing the same, and a tuning fork type crystal oscillator.

FIG. 1 is an exploded perspective view schematically showing the configuration of a tuning fork type crystal oscillator. FIG. 2 is a cross-sectional view schematically showing the configuration of the cross section of the tuning fork type crystal oscillator shown in FIG. 1 along the line II-II. FIG. 3 is a plan view schematically showing the configuration of the tuning fork type crystal vibrating element according to the first embodiment. FIG. 4 is a cross-sectional view schematically showing the configuration of the cross section of the tuning fork type crystal vibrating element shown in FIG. 3 along the IV-IV line. FIG. 5 is an enlarged plan view showing the structure of the base of the tuning fork type crystal oscillator more concretely. FIG. 6 is a plan view schematically showing the configuration of the tuning fork type crystal vibrating element according to the second embodiment. FIG. 7 is a plan view schematically showing the configuration of the tuning fork type crystal vibrating element according to the third embodiment. FIG. 8 is a flowchart showing a manufacturing process of the tuning fork type crystal vibrating element according to the fourth embodiment. FIG. 9 is a diagram showing a cross section of the crystal substrate along the electric axis in the step of cutting the crystal substrate shown in FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, in the second and subsequent embodiments, the components that are the same as or similar to those of the first embodiment are represented by the same or similar reference numerals as those of the first embodiment, and detailed description thereof will be omitted as appropriate. Further, regarding the effects obtained in the second and subsequent embodiments, the same as those in the first embodiment will be omitted as appropriate. The drawings of each embodiment are examples, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be limited to the embodiment.

<First Embodiment>
First, the tuning fork type crystal vibrating element 10 and the tuning fork type crystal oscillator 1 provided with the tuning fork type crystal vibrating element 10 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is an exploded perspective view schematically showing the configuration of a tuning fork type crystal oscillator. FIG. 2 is a cross-sectional view schematically showing the configuration of the cross section of the tuning fork type crystal oscillator shown in FIG. 1 along the line II-II. FIG. 3 is a plan view schematically showing the configuration of the tuning fork type crystal vibrating element according to the first embodiment.

In FIGS. 1 to 3, the excitation electrodes, connection electrodes, and other electrodes provided in the tuning fork type crystal vibration element 10 are not shown. Further, the first direction D1, the second direction D2, and the third direction D3 shown in the drawing are, for example, directions orthogonal to each other. The first direction D1, the second direction D2, and the third direction D3 may intersect each other at an angle other than 90 °. Further, the first direction D1, the second direction D2, and the third direction D3 are not limited to the direction of the arrow shown in FIG. 1 (positive direction), and include the direction opposite to the arrow (negative direction).

The tuning fork type crystal oscillator 1 is a kind of crystal oscillator (Quartz Crystal Resonator Unit). Further, the tuning fork type crystal vibrating element 10 is a kind of crystal vibrating element (Quartz Crystal Resonator), and the exciting portion that excites according to the applied voltage corresponds to the parallel arm portion in the tuning fork shape. The crystal vibrating element is a piezoelectric vibrating element (Piezoelectric Resonator) that uses a crystal piece (Quartz Crystal Element) as a piezoelectric body that vibrates in response to an applied voltage.

As shown in FIG. 1, the tuning fork type crystal oscillator 1 includes a tuning fork type crystal vibrating element 10, a lid member 20, a base member 30, and a joining member 40. The base member 30 and the lid member 20 are cages for accommodating the tuning fork type crystal vibration element 10. In the example shown here, the lid member 20 has a concave shape, specifically, a box shape having an opening, and the base member 30 has a flat plate shape. The shapes of the lid member 20 and the base member 30 are not limited to the above. For example, the base member may have a concave shape, and both the lid member and the base member have an opening on the side facing each other. It may be.

The tuning fork type crystal vibrating element 10 has a crystal piece 11. The crystal piece 11 is a Z-plate crystal piece. Specifically, in a Cartesian coordinate system consisting of the X-axis, the Y-axis, and the Z-axis, the plane specified by the X-axis and the Y-axis is rotated clockwise around the Z-axis in the range of 0 to 5 degrees. A plane parallel to (hereinafter referred to as an "XY plane"; the same applies to a plane specified by another axis or another direction) is the main plane of the Z-plate crystal piece, and the direction parallel to the Z axis. Is the thickness of the Z-plate crystal piece. The Z-plate crystal piece is formed, for example, by etching a crystal substrate obtained by cutting and polishing an ingot of artificial quartz (Synthetic Quartz Crystal). The X-axis, Y-axis, and Z-axis are crystal crystal axes of quartz, respectively, and the X-axis corresponds to the electric axis, the Y-axis corresponds to the mechanical axis, and the Z-axis corresponds to the optical axis. Further, the X-axis is a polar axis having a positive direction. Hereinafter, the direction parallel to the + X axis is referred to as the + X axis direction. The same applies to the −X-axis direction, Y-axis direction, and Z-axis direction. A different cut other than the Z-plate crystal piece may be applied to the crystal piece 11.

The tuning fork type crystal oscillator 10 is defined so that the Y axis is parallel to the first direction D1, the X axis is parallel to the second direction D2, and the Z axis is parallel to the third direction D3. In the X-axis direction, which is the polar axis, the + X-axis direction is the positive direction of the second direction D2, and the −X-axis direction is the negative direction of the second direction D2. However, the first direction D1 may be along the Y-axis direction, and may be tilted in the range of −5 degrees to +5 degrees from the Y-axis direction, for example. Similarly, the second direction D2 may be tilted in the range of −5 degrees to +5 degrees from the X-axis direction, and the third direction D3 may also be tilted in the range of −5 degrees to +5 degrees from the Z-axis direction.

As shown in FIGS. 1 and 3, the tuning fork type crystal vibrating element 10 made of the crystal piece 11 of the Z plate has a base 50 and a vibrating arm 60 extending from the base 50 in the second direction D2.

The base portion 50 has a front surface (first main surface) 50a on the side facing the lid member 20, and a back surface (second main surface) 50b on the side facing the base member 30. The base portion 50 has a connecting portion 51, a supporting portion 52, and a narrow portion 53 arranged in a direction parallel to the first main surface 50a. The connecting portion 51 is provided at the base of the vibrating arm portion 60, and the vibrating arm portions 60 arranged in the second direction D2 are commonly fixed. The support portion 52 is provided at a distance from the connecting portion 51 in the first direction D1. The narrow portion 53 is provided between the connecting portion 51 and the supporting portion 52 so as to connect the connecting portion 51 and the supporting portion 52. The connecting portion 51 has a facing surface 51a facing the support portion 52, and the supporting portion 52 has a facing surface 51b facing the connecting portion 51. The narrow portion 53 is connected to the central portion of the facing surface 51a of the connecting portion 51, and is connected to the central portion of the facing surface 52a of the support portion 52. The narrow portion 53 has a constricted portion 53a having the minimum width in the second direction D2 when the first main surface 50a is viewed in a plan view. The constricted portion 53a is located at the central portion of the narrow portion 53 in the first direction D1.

The width of the connecting portion 51 in the second direction D2 is W1, the width of the supporting portion 52 in the second direction D2 is W2, and the width of the narrow portion 53 in the second direction D2 is W3. The width W3 is the width of the narrowed portion 53 at the constricted portion 53a. The width W3 is smaller than the width W1 and the width W2 (W3 <W1, W3 <W2). In other words, the shape of the base 50 is confined in the second direction D2 by the narrow portion 53 when the first main surface 50a of the base 50 is viewed in a plan view. Since the base 50 has a constricted shape, the propagation of vibration in the base 50 can be suppressed. Therefore, so-called vibration leakage, in which the vibration excited by the pair of vibrating arm portions 60 is transmitted to the outside through the base portion 50, can be suppressed. Further, as an example, the width W2 is larger than the width W1 (W1 <W2). However, the magnitude relationship between the width W1 and the width W2 is not limited to this, and the width W1 may be equal to or greater than the width W2.

Like the base portion 50, the vibrating arm portion 60 also has a front surface (first main surface) 60a on the side facing the lid member 20 and a back surface (second main surface) 60b on the side facing the base member 30. The vibrating arm portion 60 is a general term for the first vibrating arm portion 61 and the second vibrating arm portion 62 extending from the connecting portion 51 of the base portion 50 in the first direction D1 and lining up in the second direction D2. The first vibrating arm portion 61 is located on the second direction D2 positive direction side of the second vibrating arm portion 62. The first vibrating arm portion 61 and the second vibrating arm portion 62 are provided with a bottomed first groove 63a along the first direction D1 on the first main surface 60a, respectively, and the first direction is provided on the second main surface 60b. A bottomed second groove 63b along D1 is provided. The first groove 63a and the second groove 63b face each other in the third direction D3. By providing the first groove 63a and the second groove 63b in this way, the ease of movement of the first vibrating arm portion 61 and the second vibrating arm portion 62 is improved, and the first vibrating arm portion 61 and the second vibrating arm portion 61 are provided. Vibration leakage from the portion 62 to the base 50 can be suppressed.

The tuning fork type crystal vibrating element 10 further has a receiving portion 70 between the connecting portion 51 of the base portion 50 and the supporting portion 52. The receiving portion 70 regulates the displacement of the pair of vibrating arm portions 60 when the pair of vibrating arm portions 60 exceeds a desired amplitude range. For example, the receiving portion 70 is a general term for the first receiving portion 71 and the second receiving portion 72 extending from the facing surface 52a of the support portion 52.

The first receiving portion 71 and the second receiving portion 72 are provided so as to sandwich the narrow portion 53 in the second direction D2. The first receiving portion 71 is preferably separated from the narrow portion 53 so as not to hinder the vibration of the vibrating arm portion 60. For example, the end of the facing surface 52a of the support portion 52 on the positive direction side in the second direction D2. It is connected to the portion and faces the end portion of the facing surface 51a of the connecting portion 51. It is also desirable that the second receiving portion 72 is also separated from the narrow portion 53, for example, the second receiving portion 72 is connected to the end portion of the facing surface 52a of the supporting portion 52 on the negative direction side in the second direction D2, and the connecting portion 51 faces the opposite surface. It faces the end of the surface 51a. The first receiving portion 71 and the second receiving portion 72 face the first vibrating arm portion 61 and the second vibrating arm portion 62 in the first direction D1, respectively. The first receiving portion 71 has a contact surface 71a on the side of the connecting portion 51 facing the facing surface 51a. Further, the second receiving portion 72 has a contact surface 72a on the side of the connecting portion 51 facing the facing surface 51a. The distance between the contact surfaces 71a and 72a of the receiving portions 71 and 72 and the facing surface 51a of the connecting portion 51 is smaller than the distance between the facing surface 51a of the connecting portion 51 and the facing surface 52a of the supporting portion 52.

In the tuning fork type crystal vibrating element 10, when a driving voltage is applied to each of the first vibrating arm 61 and the second vibrating arm 62 by an excitation electrode (not shown), the first vibrating arm 61 and the second vibrating arm 62 are applied. The portion 62 vibrates so as to approach or separate from each other in the direction indicated by the arrow in the figure at the tip of the vibrating arm portion 60. In other words, the vibrating arm portion 60 is excited in the arc direction starting from the connecting portion 51. When the tuning fork type crystal vibrating element 10 is stationary, or when the first vibrating arm 61 and the second vibrating arm 62 vibrate within the amplitude range due to excitation, the facing surface 51a and the first receiver of the connecting portion 51 The contact surface 71a of the portion 71 is separated, and the facing surface 51a of the connecting portion 51 and the contact surface 72a of the second receiving portion 72 are also separated.

When the first vibrating arm 61 and the second vibrating arm 62 are largely displaced beyond the amplitude range due to excitation, the contact surface 71a of the first receiving portion 71 or the contact surface 72a of the second receiving portion 72 becomes the connecting portion 51. In contact with the facing surface 51a of. Specifically, when an impact such that the first vibrating arm portion 61 is largely displaced in the positive direction side of the second direction D2 is applied to the tuning fork type crystal vibrating element 10, the facing surface 51a of the connecting portion 51 and the first receiver are first received. The contact surface 71a of the portion 71 comes into contact, and the first receiving portion 71 regulates the displacement of the first vibrating arm portion 61. Similarly, when an impact such that the second vibrating arm portion 62 is largely displaced to the negative direction side of the second direction D2 is applied to the tuning fork type crystal vibrating element 10, the second receiving portion 72 is subjected to the second vibrating arm portion 62. Regulate the displacement of.

When the first vibrating arm 61 or the second vibrating arm 62 is largely displaced in the second direction D2, the deformation stress is concentrated on the narrow portion 53 (particularly the constricted portion 53a). The first receiving portion 71 and the second receiving portion 72 regulate the displacement of the first vibrating arm portion 61 and the second vibrating arm portion 62 to reduce the deformation stress applied to the narrow portion 53, and the narrow portion 53. Suppresses damage. The case where the first vibrating arm 61 or the second vibrating arm 62 is largely displaced in the second direction D2 means, for example, a case where an impact is applied to the crystal piece 11 due to vibration or dropping during transportation.

The shape of the lid member 20 is concave, and is a box shape that opens toward the first main surface 32a of the base member 30. The lid member 20 is joined to the base member 30 to provide an internal space 26 surrounded by the lid member 20 and the base member 30. The tuning fork type crystal vibrating element 10 is housed in the internal space 26. The shape of the lid member 20 is not particularly limited as long as it can accommodate the tuning fork type crystal vibrating element 10. For example, the lid member 20 has a rectangular shape when the main surface of the top surface portion 21 is viewed in a plan view. .. The shape of the lid member 20 is defined, for example, by a long side parallel to the first direction D1, a short side parallel to the second direction D2, and a height parallel to the third direction D3. The material of the lid member 20 is not particularly limited, but is made of a conductive material such as metal. By including the conductive material, an electromagnetic shield function capable of shielding at least a part of electromagnetic waves entering and exiting the internal space 26 through the lid member 20 can be obtained.

As shown in FIG. 2, the lid member 20 has an inner surface 24 and an outer surface 25. The inner surface 24 is a surface on the inner space 26 side, and the outer surface 25 is a surface on the opposite side to the inner surface 24. The lid member 20 is connected to the top surface portion 21 facing the first main surface 32a of the base member 30 and the outer edge of the top surface portion 21, and is a side wall extending in a direction intersecting the main surface of the top surface portion 21. It has a part 22 and. Further, the lid member 20 has a facing surface 23 facing the first main surface 32a of the base member 30 at the concave opening end portion (the end portion of the side wall portion 22 on the side closer to the base member 30). The facing surface 23 extends in a frame shape so as to surround the tuning fork type crystal vibrating element 10.

The base member 30 holds the tuning fork type crystal vibrating element 10 in an excitable manner. The base member 30 has a flat plate shape. The base member 30 has a long side parallel to the first direction D1 direction, a short side parallel to the second direction D2, and a thickness parallel to the third direction D3. The base member 30 has a base 31. The substrate 31 has a first main surface 32a (front surface) and a second main surface 32b (back surface) facing each other. The substrate 31 is a sintered material such as an insulating ceramic (alumina). The substrate 31 is preferably made of a heat resistant material.

The base member 30 has electrode pads 33a and 33b provided on the first main surface 32a and external electrodes 35a, 35b, 35c and 35d provided on the second main surface 32b. The electrode pads 33a and 33b are terminals for electrically connecting the base member 30 and the tuning fork type crystal oscillator 10. Further, the external electrodes 35a, 35b, 35c, 35d are terminals for electrically connecting a circuit board (not shown) and the tuning fork type crystal oscillator 1. The electrode pad 33a is electrically connected to the external electrode 35a via the via electrode 34a extending in the third direction D3, and the electrode pad 33b is connected to the external electrode via the via electrode 34b extending in the third direction D3. It is electrically connected to 35b. The via electrodes 34a and 34b are formed in the via holes penetrating the substrate 31 in the third direction D3. The external electrodes 35c and 35d may be dummy electrodes to which an electric signal or the like is not input / output, or may be ground electrodes that supply a ground potential to the lid member 20 to improve the electromagnetic shield function of the lid member 20. The external electrodes 35c and 35d may be omitted.

The conductive holding members 36a and 36b are provided between the first main surface 32a of the base member 30 and the second main surface 50b of the base 50 of the tuning fork type crystal oscillator 10. Specifically, the conductive holding members 36a and 36b fix the support portion 52 of the base portion 50 to the base member 30. The conductive holding members 36a and 36b electrically connect the tuning fork type crystal vibration element 10 to the pair of electrode pads 33a and 33b of the base member 30. Further, the conductive holding members 36a and 36b hold the tuning fork type crystal vibrating element 10 on the first main surface 32a of the base member 30 so as to be excited. The conductive holding members 36a and 36b are conductive on a filler and a holding member for maintaining a distance between a resin material containing a thermosetting resin, an ultraviolet curable resin, etc., and a base member and a crystal oscillator, or for increasing the strength. It contains conductive particles and the like for imparting properties. The member for holding the tuning fork type crystal vibration element in the base member may be insulating. At this time, the tuning fork type crystal vibrating element may be electrically connected to the electrode pad by a conductive means such as a wire bond.

A sealing member 37 is provided on the first main surface 32a of the base member 30. In the example shown in FIG. 1, the shape of the sealing member 37 is a rectangular frame shape when the first main surface 32a is viewed in a plan view. Further, when the first main surface 32a is viewed in a plan view, the electrode pads 33a and 33b are arranged inside the sealing member 37, and the sealing member 37 is provided so as to surround the tuning fork type crystal vibration element 10. There is. The sealing member 37 is made of a conductive material. For example, by configuring the sealing member 37 with the same material as the electrode pads 33a and 33b, the sealing member 37 can be provided at the same time in the step of providing the electrode pads 33a and 33b.

The joining member 40 is provided over the entire circumference of the lid member 20 and the base member 30. Specifically, the joining member 40 is provided on the sealing member 37 and is formed in a rectangular frame shape. The sealing member 37 and the joining member 40 are sandwiched between the facing surface 23 of the side wall portion 22 of the lid member 20 and the first main surface 32a of the base member 30.

By joining both the lid member 20 and the base member 30 with the sealing member 37 and the joining member 40 sandwiched between them, the tuning fork type crystal vibrating element 10 is surrounded by the lid member 20 and the base member 30. Cavity) 26 is sealed. The internal space 26 preferably has an atmospheric pressure lower than the atmospheric pressure, and more preferably a vacuum state. According to this, it is possible to reduce the time-dependent fluctuation of the frequency characteristics of the tuning fork type crystal oscillator 1 due to the oxidation of the first excitation electrode 81 and the second excitation electrode 82, which will be described later. The sealing member 37 may be provided in a discontinuous frame shape, and the joining member 40 may also be provided in a discontinuous frame shape.

Next, with reference to FIG. 4, a more detailed configuration of the vibrating arm portion 60 and the operation of the tuning fork type crystal vibrating element 10 will be described. FIG. 4 is a cross-sectional view schematically showing the configuration of the cross section of the tuning fork type crystal vibrating element shown in FIG. 3 along the IV-IV line.

A first excitation electrode 81 and a second excitation electrode 82 are provided on the surfaces of the first vibrating arm portion 61 and the second vibrating arm portion 62, respectively. The first excitation electrode 81 is provided on both side surfaces of the first vibrating arm portion 61 and the second vibrating arm portion 62. Both side surfaces are a pair of side surfaces connecting the first main surface 60a and the second main surface 60b. That is, the first excitation electrode 81 faces each other so as to sandwich the first vibrating arm portion 61 and the second vibrating arm portion 62 in the second direction D2. The second excitation electrode 82 is provided inside each of the first groove 63a and the second groove 63b on the first main surface 60a and the second main surface 60b. Further, the second excitation electrode 82 is also provided on the outside of the first groove 63a and the second groove 63b.

The first excitation electrode 81 and the second excitation electrode 82 are electrodes made of, for example, a multi-layered metal film having nickel (Ni) or chromium (Cr) as a base layer and gold (Au) as the outermost layer. Since chromium has high adhesion to the crystal piece, peeling of the excitation electrode due to continuous operation for a long period of time can be suppressed. Since gold has high chemical stability, fluctuations in vibration characteristics due to oxidation of the excitation electrode can be suppressed.

The first excitation electrode 81 and the second excitation electrode 82 are electrically connected to the external electrode 35a and the external electrode 35b through the conductive holding member 36a and the conductive holding member 36b, respectively. When the first excitation electrode 81 and the second excitation electrode 82 form an electric field inside the first vibrating arm portion 61 and the second vibrating arm portion 62, both side surfaces of the first vibrating arm portion 61 and the second vibrating arm portion 62 are formed. Expands and contracts based on the magnitude of the voltage of the electric field. By applying an alternating electric field of a specific frequency between the first excitation electrode 81 and the second excitation electrode 82, the first vibrating arm portion 61 and the second vibrating arm portion 62 are formed into a pair of vibrating arm portions 60 in FIG. It vibrates at a resonance frequency so as to approach and separate from each other in the direction of the arrow shown at the tip of the.

Next, a more specific configuration of the base 50 will be described with reference to FIG. FIG. 5 is an enlarged plan view showing the structure of the base of the tuning fork type crystal oscillator more concretely. The connecting portion 51, the supporting portion 52, and the narrow portion 53 of the base portion 50 are provided by cutting a crystal substrate by wet etching, which will be described later. Further, although the etching residue is actually formed on the end face of the crystal piece 11 as shown in FIG. 5, in other figures, the etching residue is not shown for the sake of simplicity.

Quartz has a characteristic that the etching rate differs depending on the crystal orientation in chemical etching such as wet etching. Therefore, etching residues having different sizes may be generated on the end faces of the crystal pieces 11 processed by wet etching. The etching residue is a fin-shaped portion having a thickness thinner than that of the base 50. For example, the etching residue L1 is formed on the + X-axis direction side of the end faces of the base 50 extending in the Y-axis direction. Therefore, the etching residue L1 extends from the connecting portion 51 and the supporting portion 52 along the + X axis direction when the first main surface 50a of the base portion 50 is viewed in a plan view. The etching residue is not substantially formed on the end face extending in the Y-axis direction on the −X-axis direction side.

For example, the etching residues L21 and L22 are formed between the narrow portion 53 and the first receiving portion 71. When the first main surface 50a of the base portion 50 is viewed in a plan view, the etching residue L21 extends from the end faces of the narrow portion 53 and the support portion 52, and the etching residue L22 extends from the end faces of the first receiving portion 71 and the support portion 52. ing. Further, for example, the etching residues L31 and L32 are formed between the narrow portion 53 and the second receiving portion 72. When the first main surface 50a of the base portion 50 is viewed in a plan view, the etching residue L31 extends from the end faces of the narrow portion 53 and the support portion 52, and the etching residue L32 extends from the end faces of the second receiving portion 72 and the support portion 52. ing.

When comparing the area of the etching residue when the first main surface 50a of the base portion 50 is viewed in a plan view, as an example, the etching residue L21 extends to the vicinity of the connecting portion 51, so that the etching residue L21 is larger than the etching residue L31. .. Therefore, the narrow portion 53 has higher impact resistance to displacement along the + X axis direction than the impact resistance to displacement of the connecting portion 51 along the −X axis direction. On the contrary, the narrow portion 53 may have a lower impact resistance to the displacement along the + X axis direction than the impact resistance to the displacement of the connecting portion 51 along the −X axis direction. That is, in the substantially U-shaped (crotch-shaped) region surrounded by the narrow portion 53, the first receiving portion 71, and the support portion 52, the etching residue L22 can be formed to be relatively larger than the etching residue L21. Further, in the crotch-shaped region surrounded by the narrow portion 53, the second receiving portion 72, and the support portion 52, the etching residue L31 can be formed to be relatively larger than the etching residue L32. From these facts, the etching residue L31 may be formed to be relatively larger than the etching residue L21.

The etching residue is not substantially formed on the contact surface 71a of the first receiving portion 71 and the contact surface 72a of the second receiving portion 72. The etching residue is not substantially formed on the facing surface 51a of the connecting portion 51. Therefore, when the vibrating arm portion 60 is largely displaced so as to exceed the normal amplitude range, the receiving portion 70 is opposed to the end surface of the connecting portion 51 with almost no etching residue due to the contact surfaces 71a and 72a having no etching residue. Receives surface 51a.

<Second Embodiment>
Next, the configuration of the tuning fork type crystal vibration element 110 according to the second embodiment will be described with reference to FIG. FIG. 6 is a plan view schematically showing the configuration of the tuning fork type crystal vibrating element according to the second embodiment. The difference from the tuning fork type crystal vibrating element 10 according to the first embodiment is that the receiving portion 170 is composed of one first receiving portion 171.

In the example shown in FIG. 6, the first receiving portion 171 is connected to the region of the facing surface 152a of the supporting portion 152 on the positive direction side of the second direction D2 with respect to the narrow portion 153. The first receiving portion 171 extends toward the connecting portion 151 along the first direction D1. By receiving the facing surface 151a of the connecting portion 151 by the contact surface 171a of the first receiving portion 171, it is possible to regulate a large displacement of the first vibrating arm portion 161 in the second direction D2 forward direction beyond the normal amplitude range. .. However, the position of the receiving portion 170 is not limited to the above, and may be provided in a region of the facing surface 152a of the supporting portion 152 on the side in the second direction D2 negative direction with respect to the narrow portion 153. According to this, a large displacement of the second vibrating arm portion 162 toward the second direction D2 negative direction can be regulated. As described above, since an anisotropic etching residue is generated on the end face of the tuning fork type crystal vibrating element due to etching anisotropy based on the crystal orientation of the crystal, the machines of the first vibrating arm and the second vibrating arm The target strength balance is lost. Therefore, when there is only one receiving part, the balance of the mechanical strength of the tuning fork type crystal oscillator is calculated or measured, and the receiving part is arranged so as to receive the displacement in the direction of low mechanical strength. desirable.

<Third Embodiment>
Next, the configuration of the tuning fork type crystal vibration element 210 according to the third embodiment will be described with reference to FIG. 7. FIG. 7 is a plan view schematically showing the configuration of the tuning fork type crystal vibrating element according to the third embodiment. In the tuning fork type crystal vibrating element 210 according to the third embodiment, the receiving portion 270 is connected to the facing surface 251a of the connecting portion 251 and extends toward the supporting portion 252 along the first direction D1. In other words, the contact surface 271a of the first receiving portion 271 and the contact surface 272a of the second receiving portion 272 face each other with a gap in the first direction D1 from the facing surface 252a of the support portion 252. Of the facing surfaces 252a of the support portion 252, the first receiving portion 271 is provided at the end on the positive direction side of the second direction D2, and the second receiving portion 272 is provided at the end on the negative direction side of the second direction D2. There is. The first receiving portion 271 regulates a large displacement of the first vibrating arm portion 261 by receiving the facing surface 252a of the supporting portion 252 by the contact surface 271a, and the second receiving portion 272 contacts the facing surface 252a of the support portion 252. By receiving it at 272a, a large displacement of the second vibrating arm portion 262 is regulated. As described above, the same effect as that of the first embodiment can be obtained in the third embodiment.

<Fourth Embodiment>
Next, a method for manufacturing the tuning fork type crystal vibration element according to the fourth embodiment will be described with reference to FIGS. 8 to 9. Further, the etching residue generation mechanism will be described by taking the etching residue L1 as an example. FIG. 8 is a flowchart showing a manufacturing process of the tuning fork type crystal vibrating element according to the fourth embodiment. FIG. 9 is a diagram showing a cross section of the crystal substrate along the electric axis in the step of cutting the crystal substrate shown in FIG. The fourth embodiment corresponds to the manufacturing process of the crystal piece 911 applicable to the tuning fork type crystal vibration element according to each of the above embodiments. After the step shown in FIG. 8, the tuning fork type crystal vibration element is completed through a step of providing an electrode such as an excitation electrode.

First, a crystal substrate is prepared (S11). The crystal substrate 910 is a plate-shaped member cut out from a single crystal of an artificial crystal so that the XY planes are the first main surface 910a and the second main surface 910b, and is, for example, a crystal wafer. The crystal substrate 910 is not limited to the crystal wafer as long as it has a plurality of element regions capable of forming a crystal piece of the tuning fork type crystal vibrating element and can form an aggregate element of the tuning fork type crystal vibrating element. .. The crystal substrate 910 may be, for example, a quadrangular plate-shaped member cut from a crystal wafer. The surface of the quartz substrate 910 is flattened by a polishing treatment such as chemical mechanical polishing after being cut into a flat plate. By adjusting the thickness of the crystal substrate 910 by this polishing process, the frequency characteristics of the tuning fork type crystal vibration element can be adjusted.

Next, a photoresist layer is provided (S12). In step S12, first, the first metal layer 912a is provided on the first main surface 910a of the crystal substrate 910 so that the first metal layer 912a and the second metal layer 912b sandwich the crystal substrate 910, and the second main surface 910b is provided. A second metal layer 912b is provided. The first metal layer 912a and the second metal layer 912b correspond to corrosion-resistant films against an etching solution (for example, ammonium fluoride or buffered hydrofluoric acid) used when etching the crystal substrate 910, and improve the etching processing accuracy. .. As the first metal layer 912a and the second metal layer 912b, for example, a multilayer film having a chromium (Cr) layer and a gold (Au) layer is used. The Cr layer, as a base layer, improves the adhesion of the first metal layer 912a and the second metal layer 912b to the crystal substrate 910. Further, the Au layer improves the corrosion resistance of the first metal layer 912a and the second metal layer 912b as the outermost layer. The film forming method of the first metal layer 912a and the second metal layer 912b is not particularly limited, and is provided by, for example, dry plating (dry process) such as a vapor deposition method or a sputtering method, or wet plating (wet process) such as electrolytic plating. Be done.

In step S12, next, the first photoresist layer 913a is provided on the first metal layer 912a so that the first photoresist layer 913a and the second photoresist layer 913b sandwich the crystal substrate 910, and the second metal layer is provided. A second photoresist layer 913b is provided on top of the 912b. In the first photoresist layer 913a and the second photoresist layer 913b, a photoresist solution containing a photoresist material is applied onto the first metal layer 912a and the second metal layer 912b, respectively, and the solvent is volatilized by heating. It is formed into a film. The method of applying the photoresist solution is, for example, a spin coating method. The photoresist material is a positive photosensitive resin having high solubility in the exposed portion from the viewpoint of improving the processing accuracy of the pattern obtained by developing the first photoresist layer 913a and the second photoresist layer 913b. Is desirable. The method of applying the photoresist solution is not particularly limited, and may be, for example, a spray coating method.

Next, the photoresist layer is exposed (S13). In step S13, the first photoresist layer 913a and the second photoresist layer 913b are irradiated with light such as ultraviolet light through a photomask on which the outer patterns of the plurality of crystal pieces 911 are drawn. The exposure apparatus used for exposure is a single-sided exposure apparatus that exposes only one of the first photoresist layer 913a and the second photoresist layer 913b. A double-sided exposure device capable of exposing both at the same time may be used.

Next, the photoresist layer is developed (S14). When the first photoresist layer 913a and the second photoresist layer 913b are positive photosensitive resins, the exposed portion is developed by immersing the first photoresist layer 913a and the second photoresist layer 913b in a developing solution. It dissolves in a solution and is removed. As a result, the outer pattern of the crystal piece 911 is patterned on the first photoresist layer 913a and the second photoresist layer 913b. In other words, a part of the first metal layer 912a and a part of the second metal layer 912b are exposed based on the outer shape pattern of the crystal piece 911, respectively.

Next, the crystal substrate is cut by wet etching (S15). In step S15, first, the exposed first metal layer 912a and the second metal layer 912b are etched based on the outer shape pattern of the crystal piece 911. As a result, a part of the crystal substrate 910 is exposed based on the outer shape pattern of the crystal piece 911. The first metal layer 912a and the second metal layer 912b are etched by, for example, wet etching of the Cr layer using a cerium-based etching solution and wet etching of the Au layer using an iodine-based etching solution.

In step S15, the crystal substrate 910 is then cut so as to penetrate the exposed portion. The crystal substrate 910 is etched by wet etching using a hydrofluoric acid-based etching solution to form a crystal piece 911 of a tuning fork type crystal vibrating element. As a result, the crystal substrate 910 is processed into an aggregate substrate having a plurality of crystal pieces 911. By simultaneously etching the crystal substrate 910 from both sides of the first main surface 910a and the second main surface 910b, the processing speed and processing accuracy are improved as compared with the processing method of etching from one side.

Next, the photoresist layer is removed (S16). When the etching process of the crystal substrate 910 is completed, the first metal layer 912a and the first photoresist layer 913a remain on the first main surface 910a of the crystal substrate 910, and the second metal layer 912b is left on the second main surface 910b. And the second photoresist layer 913b remains. The residue of the first photoresist layer 913a and the second photoresist layer 913b is removed from the crystal substrate 910 by cleaning with a solvent, and then the residue of the first metal layer 912a and the second metal layer 912b is removed.

In the above step S15, since the etching rate (etching rate) of the artificial crystal single crystal differs depending on the crystal orientation, the etching residue L1 is formed on the crystal piece 911 formed by etching. When the first main surface 911a of the crystal piece 911 is viewed in a plan view, the etching residue L1 extends outward from the first main surface 911a in a different size depending on the crystal axis direction.

As shown in FIG. 9, the cross section of the crystal piece 911 parallel to the XZ plane has a first main surface 911a, a second main surface 911b, and an etching residue L1. The first main surface 911a and the second main surface 911b correspond to the portions covered by the first metal layer 912a and the second metal layer 912b as the crystal substrate 910, respectively. The etching residue L1 corresponds to an end surface connecting the ends of the first main surface 911a and the second main surface 911b in the + X axis direction (positive direction of the electric axis).

In the region where the etching residue L1 is formed, for example, the etching process of the crystal substrate 910 proceeds in the direction in which the crystal plane is formed. Specifically, the crystal substrate 910 is etched so that the first main surface 910a approaches the crystal plane to form the first end surface 911c, and the second main surface 910b approaches the crystal plane. The second end surface 911d is formed by this. Following the inclination of the crystal plane with respect to the + X axis direction of the crystal, the first end surface 911c is inclined with respect to the first main surface 911a, and the second end surface 911d is inclined with respect to the second main surface 911b. As a result, the etching residue L1 is connected to the first end surface 911c which is connected to the first main surface 911a so as to form an obtuse angle on the crystal piece 911 side and the second main surface 911b which is connected to the second main surface 911b so as to form an obtuse angle on the crystal piece 911 side. It is composed of an end face 911d. The first end surface 911c and the second end surface 911d are the tips of the etching residue L1 in the + X axis direction, and are connected so as to form an angle θ1 on the crystal piece 911 side. On the contrary, the ends of the first main surface 911a and the second main surface 911b in the −X axis direction are connected by a third end surface 911e substantially orthogonal to the first main surface 911a and the second main surface 911b.

Since the etching residue L1 is generated, the length of the third end surface 911e on the XZ surface is smaller than the sum of the lengths of the first end surface 911c and the second end surface 911d on the XZ surface. Since the angle formed by the tip of the etching residue L1 is θ1, the end face having the etching residue L1 is an end face that does not substantially generate other etching residues (for example, the facing surface 51a of the connecting portion 51 and the contact surface 71a of the receiving portion 70). , 72a), it is more easily damaged by an external impact.

As described above, according to one aspect of the present invention, at least the base 50, the plurality of vibrating arm parts 60 extending from the base 50 to the first direction D1 and intersecting the first direction D1 and lining up in the second direction D2. A receiving portion 70 is provided, and the base portion 50 is spaced from the connecting portion 51 in the first direction D1 with the connecting portion 51 provided so as to commonly fix the bases of the plurality of vibrating arm portions 60. The support portion 52 is provided so as to connect the connecting portion 51 and the support portion 52 between the connecting portion 51 and the supporting portion 52, and the width in the second direction D2 is the width of the connecting portion 51 and the supporting portion. A tuning fork type crystal vibrating element 10 is provided which includes a narrow portion 53 smaller than 52, and the receiving portion 70 is provided between the connecting portion 51 and the supporting portion 52 in the first direction D1.

According to the above aspect, since the receiving portion is provided between the supporting portion and the connecting portion, the crystal vibrating element can be miniaturized as compared with the configuration in which the receiving portion and the vibrating arm portion are arranged in the second direction. Further, when an external force is applied to the vibrating arm due to an external impact such as dropping, the base and the receiving portion come into contact with each other, and a large displacement of the vibrating arm beyond the normal amplitude range of the crystal vibrating element can be regulated. .. As a result, the impact resistance of the crystal vibrating element is improved, and damage to the vibrating arm and the base can be suppressed. Further, the vibrating arm portion is mechanically connected to the support portion via a narrow portion having a small vibration propagation region. Therefore, the vibration leakage from the connecting portion to the supporting portion is reduced, and the attenuation of the vibration energy in the vibrating arm portion can be suppressed.

The receiving portion 70 may be connected to either the connecting portion 51 or the supporting portion 52 and may extend toward the other. According to this, the tuning fork type crystal vibrating element can be miniaturized because a complicated structure or the like for providing the receiving portion is unnecessary.

The receiving portion 70 may be connected to the supporting portion 52. According to this, it is possible to suppress the influence of the receiving portion on the vibration characteristics of the tuning fork type crystal vibration element.

The support portion 52 may be a fixed portion to which the tuning fork type crystal vibration element 10 is fixed. According to this, vibration leakage from the vibrating arm portion to the cage such as the base member and the lid member of the tuning fork type crystal oscillator can be suppressed through the fixing portion. Further, by connecting the receiving portion to the fixed portion, the impact resistance of the tuning fork type crystal vibration element is improved.

The connecting portion 51 and the supporting portion 52 each have facing surfaces 51a and 52a facing each other in the first direction D1, and the narrow portion 53 is connected to the central portion of the facing surface 51a of the connecting portion 51 in the second direction D2. The receiving portion 70 may be connected to the facing surface 52a of the supporting portion 52 and may face the end portion of the facing surface 51a of the connecting portion 51 in the second direction D2. According to this, the interference between the receiving portion and the narrow portion can be suppressed.

The connecting portion 251 and the supporting portion 252 each have facing surfaces 251a and 252a facing each other in the first direction D1, and the narrow portion 253 is connected to the central portion of the facing surface 251a of the connecting portion 251 in the second direction D2. The receiving portion 270 may be connected to the end portion of the facing surface 251a of the connecting portion 251 in the second direction D2 and may face the facing surface 252a of the support portion 252. According to this, the interference between the receiving portion and the narrow portion can be suppressed.

The receiving portions 70 may be provided at at least two locations so as to sandwich the narrow portion 53 in the second direction D2. According to this, regardless of whether the direction of large displacement of the vibrating arm portion is the positive direction or the negative direction of the second direction, it can be regulated by the receiving portion.

The base 50, the vibrating arm 60, and the receiving portion 70 are provided with quartz, and the receiving portion 70 is a contact surface that contacts the connecting portion 51 or the supporting portion 52 when the vibrating arm portion 60 exceeds a desired amplitude range. It has 71a, 72a, and the contact surfaces 71a, 72a of the receiving portion 70 may extend along the electric axis of the crystal. According to this, the etching residue formed on the contact surface of the receiving portion is small. Therefore, it is possible to suppress particles generated due to damage to the etching residue when the receiving portion comes into contact with the base portion.

According to another aspect of the present invention, there is a base 50, a plurality of vibrating arm parts 60 extending from the base 50 in the first direction D1 and intersecting the first direction D1 in the second direction D2, and at least one receiver. A portion 70 is provided, and the base portion 50 is provided with a connecting portion 51 provided so as to commonly fix the bases of the plurality of vibrating arm portions 60, and a connecting portion 51 provided at a distance from the connecting portion 51 in the first direction D1. It is provided so as to connect the connecting portion 51 and the supporting portion 52 between the supporting portion 52 and the connecting portion 51 and the supporting portion 52, and the width in the second direction D2 is larger than that of the connecting portion 51 and the supporting portion 52. A small narrow portion 53 is provided, and the receiving portion 70 vibrates by contacting the connecting portion 51 or the supporting portion 52 in the first direction D1 when the plurality of vibrating arm portions 60 exceed a desired amplitude range. Provided is a tuning fork type crystal vibrating element 10 that regulates the displacement of the arm portion 60. In such an embodiment, the same effect as described above can be obtained.

According to another aspect of the present invention, a step of preparing the crystal substrate 910, a step of providing the photoresist layers 913a, 913b on the crystal substrate 910, a step of patterning the photoresist layers 913a, 913b, and patterning. The crystal substrate 910 is etched by wet etching based on the photoresist layers 913a and 913b to form the crystal piece 911, and the crystal piece 911 is transferred from the base 50 and the base 50 to the first direction D1. A plurality of vibrating arm portions 60 arranged in a second direction D2 intersecting the extension first direction D1 and at least one receiving portion 70 are provided, and the base portion 50 shares the roots of the plurality of vibrating arm portions 60. A connecting portion 51 provided so as to be fixed, a supporting portion 52 provided at a distance from the connecting portion 51 in the first direction D1, and a connecting portion 51 between the connecting portion 51 and the supporting portion 52. It is provided so as to connect the support portion 52, and includes a connecting portion 51 having a width in the second direction D2 and a narrow portion 53 having a width smaller than that of the supporting portion 52, and the receiving portion 70 is a connecting portion 51 in the first direction D1. A method for manufacturing a sound-forked crystal vibrating element provided between the support portion 52 and the support portion 52 is provided. In such an embodiment, the same effect as described above can be obtained.

In such an embodiment, the first direction D1 may extend along the mechanical axis Y of the crystal constituting the crystal piece 911, and the second direction D2 may extend along the electric axis X of the crystal. .. According to this, the end faces of the connecting portion and the receiving portion facing each other (the facing surface of the connecting portion and the contact surface of the receiving portion) can be formed so as not to generate an etching residue.

According to another aspect of the present invention, the base member 30, the lid member 20 forming the internal space 26 between the base member 30, the tuning fork type crystal oscillator 10 housed in the internal space 26, and the tuning fork. The tuning fork type crystal vibrating element 10 includes the conductive holding members 36a and 36b for holding the type crystal vibrating element 10 on the base member 30, and the tuning fork type crystal vibrating element 10 extends from the base 50 to the first direction D1 and extends from the base 50 to the first direction D1. A plurality of vibrating arm portions 60 arranged in the intersecting second direction D2 and at least one receiving portion 70 are provided, and the base portion 50 is provided so as to commonly fix the bases of the plurality of vibrating arm portions 60. The connecting portion 51 is connected to the supporting portion 52 provided at a distance from the connecting portion 51 in the first direction D1, and the connecting portion 51 and the supporting portion 52 are connected between the connecting portion 51 and the supporting portion 52. A narrow portion 53 having a width smaller than that of the connecting portion 51 and the supporting portion 52 in the second direction D2 is provided, and the receiving portion 70 is provided between the connecting portion 51 and the supporting portion 52 in the first direction D1. The conductive holding members 36a and 36b are provided with a tuning fork type crystal oscillator 1 in which the support portion 52 is fixed to the base member 30. In such an embodiment, the same effect as described above can be obtained.

As described above, according to one aspect of the present invention, it is possible to provide a tuning fork type crystal vibrating element which can be miniaturized while improving impact resistance, a method for manufacturing the same, and a tuning fork type crystal oscillator.

It should be noted that the embodiments described above are for facilitating the understanding of the present invention, and are not for limiting and interpreting the present invention. The present invention can be modified / improved without departing from the spirit of the present invention, and the present invention also includes an equivalent thereof. That is, those skilled in the art with appropriate design changes to each embodiment are also included in the scope of the present invention as long as they have the features of the present invention. For example, each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those exemplified, and can be appropriately changed. In addition, the elements included in each embodiment can be combined as technically possible, and the combination thereof is also included in the scope of the present invention as long as the features of the present invention are included.

1 ... Tuning fork type crystal oscillator 10 ... Tuning fork type crystal vibrating element 11 ... Crystal piece 30 ... Base member 40 ... Joining member 50 ... Base 51 ... Connecting part 52 ... Supporting part 53 ... Narrow part 51a, 52a ... Facing surface 60 ... Vibrating arm 61 ... 1st vibrating arm 62 ... 2nd vibrating arm 70 ... receiving part 71 ... 1st receiving part 72 ... 2nd receiving part 71a, 72a ... contact surfaces L1, L21, L22, L31, L32 ... etching Residue

Claims (11)

At the base,
A plurality of vibrating arms extending in the first direction from the base and lining up in the second direction intersecting the first direction.
With at least one receiving part
With
The base is
A connecting portion provided so as to commonly fix the bases of the plurality of vibrating arms, and a connecting portion.
A support portion provided at a distance from the connecting portion in the first direction, and a support portion.
A narrow portion that is provided between the connecting portion and the supporting portion so as to connect the connecting portion and the supporting portion and has a width smaller than that of the connecting portion and the supporting portion in the second direction.
With
The receiving portion is provided between the connecting portion and the supporting portion in the first direction .
The base portion, the vibrating arm portion, and the receiving portion are provided by quartz.
The receiving portion has a contact surface that comes into contact with the connecting portion or the supporting portion when the vibrating arm portion exceeds a desired amplitude range.
The contact surface of the receiving portion extends along the electrical axis of the crystal.
Tuning fork type crystal vibration element. The receiving portion is connected to one of the connecting portion and the supporting portion and extends toward the other.
The tuning fork type crystal vibrating element according to claim 1. The receiving portion is connected to the supporting portion,
The tuning fork type crystal vibration element according to claim 2. The support portion is a fixed portion to which the tuning fork type crystal vibrating element is fixed.
The tuning fork type crystal vibration element according to claim 3. The connecting portion and the supporting portion each have facing surfaces facing each other in the first direction.
The narrow portion is connected to the central portion of the facing surface of the connecting portion in the second direction.
The receiving portion is connected to the facing surface of the supporting portion and faces the end portion of the facing surface of the connecting portion in the second direction.
The tuning fork type crystal vibrating element according to claim 1 or 2. The connecting portion and the supporting portion each have facing surfaces facing each other in the first direction.
The narrow portion is connected to the central portion of the facing surface of the connecting portion in the second direction.
The receiving portion is connected to an end portion of the facing surface of the connecting portion in the second direction and faces the facing surface of the support portion.
The tuning fork type crystal vibrating element according to claim 1 or 2. The receiving portions are provided at at least two locations so as to sandwich the narrow portion in the second direction.
The tuning fork type crystal vibrating element according to any one of claims 1 to 6. At the base,
A plurality of vibrating arms extending in the first direction from the base and lining up in the second direction intersecting the first direction.
With at least one receiving part
With
The base is
A connecting portion provided so as to commonly fix the bases of the plurality of vibrating arms, and a connecting portion.
A support portion provided at a distance from the connecting portion in the first direction, and a support portion.
A narrow portion that is provided between the connecting portion and the supporting portion so as to connect the connecting portion and the supporting portion and has a width smaller than that of the connecting portion and the supporting portion in the second direction.
With
The base portion, the vibrating arm portion, and the receiving portion are provided by quartz.
The contact surface of the receiving portion extends along the electrical axis of the crystal and extends.
When the plurality of vibrating arm portions exceed a desired amplitude range, the receiving portion displaces the vibrating arm portion by contacting the contact surface with the connecting portion or the supporting portion in the first direction. regulate,
Tuning fork type crystal vibration element. The process of preparing the crystal substrate and
A step of providing a photoresist layer on the crystal substrate and
The step of patterning the photoresist layer and
A step of forming a crystal piece by etching the crystal substrate based on the patterned photoresist layer by wet etching, and
Including
The crystal piece includes a base, a plurality of vibrating arms extending in a first direction from the base and lining up in a second direction intersecting the first direction, and at least one receiving portion.
The base includes a connecting portion provided so as to commonly fix the bases of the plurality of vibrating arms, a supporting portion provided at a distance from the connecting portion in the first direction, and the above. It is provided between the connecting portion and the supporting portion so as to connect the connecting portion and the supporting portion, and includes the connecting portion and a narrow portion having a width smaller than that of the supporting portion in the second direction.
The receiving portion is provided between the connecting portion and the supporting portion in the first direction .
The base portion, the vibrating arm portion, and the receiving portion are provided by quartz.
The receiving portion has a contact surface that comes into contact with the connecting portion or the supporting portion when the vibrating arm portion exceeds a desired amplitude range.
The contact surface of the receiving portion extends along the electrical axis of the crystal.
A method for manufacturing a tuning fork type crystal oscillator. The first direction extends along the mechanical axis of the crystal constituting the crystal piece.
The second direction extends along the electrical axis of the crystal.
The method for manufacturing a tuning fork type crystal vibrating element according to claim 9. With the base member
A lid member that forms an internal space between the base member and
The tuning fork type crystal vibrating element housed in the internal space and
A holding member that holds the tuning fork type crystal vibrating element to the base member is provided.
The tuning fork type crystal vibrating element is
At the base,
A plurality of vibrating arms extending in the first direction from the base and lining up in the second direction intersecting the first direction.
With at least one receiving part
With
The base is
A connecting portion provided so as to commonly fix the bases of the plurality of vibrating arms, and a connecting portion.
A support portion provided at a distance from the connecting portion in the first direction, and a support portion.
A narrow portion that is provided between the connecting portion and the supporting portion so as to connect the connecting portion and the supporting portion and has a width smaller than that of the connecting portion and the supporting portion in the second direction.
With
The receiving portion is provided between the connecting portion and the supporting portion in the first direction.
The base portion, the vibrating arm portion, and the receiving portion are provided by quartz.
The receiving portion has a contact surface that comes into contact with the connecting portion or the supporting portion when the vibrating arm portion exceeds a desired amplitude range.
The contact surface of the receiving portion extends along the electrical axis of the crystal.
The holding member is a tuning fork type crystal oscillator in which the support portion is fixed to the base member.

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