JP6808517B2 - Contact condition improvement device - Google Patents

Description

The present invention relates to a contact state improving device for improving the contact state between the contacted portion to be measured and the probe.

As a measuring device for measuring a measured quantity to be measured, a measuring device (battery tester) disclosed by the applicant in Patent Document 1 below is known. This measuring device can measure the amount to be measured (internal resistance) of the object to be measured based on the electric signal input / output via the probe (terminal) in contact with the contacted portion (electrode) of the object to be measured (battery). It is configured in.

JP-A-2007-212340 (Page 4, Fig. 1)

However, the above-mentioned measuring device has the following problems to be improved. Specifically, in the above-mentioned measuring device, the measured amount of the measurement target is measured based on the electric signal input / output via the probe brought into contact with the contacted portion of the measurement target. When an insulating film such as a metal oxide is formed on the surface, the contact state between the probe and the contacted portion may be poor, and it may be difficult to accurately measure the measured amount. In this case, a measuring device having a contact state improving function for improving the contact state between the probe and the contacted portion by increasing the voltage of the output electric signal to destroy the insulating film (for example, JP-A-2011-). Impedance measuring device disclosed by the applicant in Japanese Patent Application Laid-Open No. 85463: Hereinafter, this type of measuring device is also referred to as "measuring device with improvement function"). However, in this type of measuring device with an improvement function, only the contact state improving function cannot be used independently. Therefore, the contact state improvement between the above measuring device and the measuring device with the improving function that do not have the contact state improving function. It is difficult to make measurements using functions. Therefore, it is still difficult to accurately measure the measured amount of the measurement target in which the insulating film is formed on the surface of the contacted portion by using the above-mentioned measuring device that does not have the contact state improving function. There is a problem that the above-mentioned measuring device, which does not have a contact state improving function, cannot be effectively used, and improvement thereof is desired.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a contact state improving device capable of effectively utilizing a measuring device having no contact state improving function.

In order to achieve the above object, the contact state improving device according to claim 1 measures the measured amount of the measurement target based on the output signal and the input signal input / output via the probe in contact with the contacted portion of the measurement target. A contact state improving device that is configured to be connectable to a measuring device to be measured and improves the contact state between the contacted portion and the probe, and is a pair of output terminals for outputting the output signal in the measuring device. A pair of first terminals that can be connected to each other, a pair of second terminals that can be connected to a pair of input terminals for inputting the input signal in the measuring device, and the output signal are supplied to the contacted portion. A pair of third terminals to which each of the pair of probes can be connected, and a pair of third terminals to which the pair of probes to be connected to each of the second terminals and to input the input signal can be connected to each other. A first state in which the four terminals, a signal generation unit that generates a contact improvement signal supplied between the third terminal and the fourth terminal, and each of the first terminals and the third terminals are connected to each other. And, at least one of the first terminals and the third terminal corresponding to the at least one first terminal are disconnected, and the second state of connecting the signal generator and the third terminal is switched. It has a department.

Further, the contact state improving device according to claim 2 is the contact state improving device according to claim 1, and the switching unit corresponds to both of the first terminals and the first terminals in the second state, respectively. Both of the third terminals are disconnected from each other, and both the signal generation unit and the third terminals are connected.

Further, in the contact state improving device according to claim 3, in the contact state improving device according to claim 1, the signal generation unit is switched from the first state to the second state by the switching unit. When this is done, the contact improvement signal is generated.

Further, the contact state improving device according to claim 4 includes a determining unit for determining the quality of the contact state between the contacted portion and the probe in the contact state improving device according to any one of claims 1 to 3. When the determination unit determines that the contact state between the contacted portion and the probe is defective, the determination unit causes the switching unit to switch from the first state to the second state.

According to the contact state improving device according to claim 1, a first terminal that can be connected to the output terminal of the measuring device, a second terminal that can be connected to the input terminal of the measuring device, and a probe that supplies an output signal can be connected. A third terminal, a fourth terminal that is connected to the second terminal and can be connected to a probe that inputs an input signal, a signal generator that generates a contact improvement signal, and a first terminal and a third terminal. The contact state improvement function is provided by providing the first state to be connected and the switching unit for switching the second state in which the signal generation unit and the third terminal are connected by disconnecting the first terminal and the third terminal. By connecting the contact state improving device to the measuring device that has not been used, the contact state between the contacted portion to be measured and the probe can be improved and accurate measurement can be performed. Therefore, according to this contact state improving device, it is possible to fully effectively utilize the measuring device that does not have the contact state improving function.

Further, according to the contact state improving device according to claim 2, the switching unit disconnects both of the pair of first terminals and both of the pair of third terminals in the second state, and also connects with the signal generation unit. By connecting both of the third terminals, the contact state between the contacted portion that contacts the probe on the high potential side and the probe, and the contact between the contacted portion that contacts the probe on the low potential side and the probe. Since both conditions can be improved, more accurate measurements can be made.

Further, according to the contact state improving device according to claim 3, the signal generating unit generates a contact improving signal when the switching unit switches from the first state to the second state, thereby initially. By configuring the switching unit to maintain the first state in the state, it is possible to suppress power consumption of the power supply unit used for generating the contact improvement signal.

Further, according to the contact state improving device according to claim 4, when the determination unit determines that the contact state between the contacted portion and the probe is defective, the switching unit is switched from the first state to the second state. By executing the above, the process of determining whether or not the contact state between the contacted portion and the probe is defective and the process of improving the contact state when the contact state is poor are automatically executed. Therefore, the work efficiency (measurement efficiency) can be sufficiently improved.

It is a block diagram which shows the structure of the contact state improvement apparatus 1. It is 1st explanatory drawing explaining the use method of the contact state improvement apparatus 1. It is a 2nd explanatory drawing explaining the usage method of the contact state improvement apparatus 1.

Hereinafter, embodiments of the contact state improving device will be described with reference to the accompanying drawings.

First, the configuration of the contact state improving device 1 shown in FIG. 1 as an example of the contact state improving device will be described. The contact state improving device 1 is a contacted portion of a measurement target (for example, the electronic component 100 shown in FIG. 2) (contacted portions 101a and 101b shown in the figure: hereinafter, also referred to as “contacted portion 101” when not distinguished). Output signal So (as an example, DC constant current signal) and input signal Si (for example, DC constant current signal) that are input and output via probes (probes 60a to 60d shown in the figure: hereinafter also referred to as “probe 60” when not distinguished). As an example, a measuring device (for example, the measuring device 50 shown in the figure) for measuring a measured amount (for example, a resistance value) of a measurement target (for example, the electronic component 100 shown in the figure) based on a voltage signal). It is configured to be connectable (detachable) and has a function of improving the contact state between the contacted portion and the probe (“contact state improvement function”).

Specifically, as shown in FIG. 1, the contact state improving device 1 includes first terminals 11a and 11b (hereinafter, also referred to as "first terminal 11" when not distinguished) and second terminals 12a and 12b (hereinafter, also referred to as "first terminal 11"). When not distinguished, it is also referred to as "second terminal 12"), third terminals 13a, 13b (hereinafter, also referred to as "third terminal 13" when not distinguished), fourth terminals 14a, 14b (hereinafter, when not distinguished, "fourth terminal" Terminal 14 ”), signal generation units 21a and 21b (hereinafter, also referred to as“ signal generation unit 21 ”when not distinguished), switching units 31a, 31b (hereinafter, also referred to as“ switching unit 31 ”when not distinguished). And the determination units 41a and 41b (hereinafter, also referred to as "determination unit 41" when not distinguished) are provided.

As shown in FIG. 2, the first terminal 11a is configured to be able to be connected to the output terminal 54a on the high potential side (Hi side) for outputting the output signal So provided in the measuring device 50. .. Further, as shown in the figure, the first terminal 11b is configured to be able to be connected to the low potential (Lo side) output terminal 54b for outputting the output signal So provided in the measuring device 50. There is.

As shown in FIG. 2, the second terminal 12a is configured to be able to be connected to the input terminal 55a on the high potential side for inputting the input signal Si provided in the measuring device 50. Further, as shown in the figure, the second terminal 12b is configured to be able to be connected to the input terminal 55b on the low potential side for inputting the input signal Si provided in the measuring device 50.

As shown in FIG. 2, the third terminals 13a and 13b are terminals to which probes 60a and 60b for supplying the output signal So to the contacted portions 101a and 101b of the electronic component 100 are connected, respectively, and as an example. , Each consists of jacks to which plugs attached to the cables of probes 60a and 60b can be connected. In this case, the third terminal 13a corresponds to the probe 60a that supplies the high potential side of the output signal So, and the third terminal 13b corresponds to the probe 60b that supplies the low potential side of the output signal So.

As shown in FIG. 2, the fourth terminals 14a and 14b are terminals to which the probes 60c and 60d for inputting the input signal Si are connected, respectively, and are attached to the cables of the probes 60c and 60d as an example. It consists of jacks to which the plugs can be connected. In this case, the fourth terminal 14a corresponds to the probe 60c that inputs the high potential side of the input signal Si, and the fourth terminal 14b corresponds to the probe 60d that inputs the low potential side of the input signal Si. Further, as shown in FIG. 1, the fourth terminal 14a is connected to the second terminal 12a, and the fourth terminal 14b is connected to the second terminal 12b.

As shown in FIG. 1, the signal generation units 21a and 21b are configured in the same manner and supply contact between the third terminal 13a and the fourth terminal 14a and between the third terminal 13b and the fourth terminal 14b. The improvement signal Sb is generated respectively. Here, the contact improvement signal Sb, for example, when an insulating film such as a metal oxide is formed on the surface of the contacted portion 101, breaks the insulating film to cause the contacted portion 101 and the probe 60. It is an electric signal for improving the contact (conduction) state of, and as an example, the voltage value Vm is controlled to about 10V and the current value Im is controlled to about 10mA.

In this case, as an example, the signal generation units 21a and 21b are signal generation circuits composed of a power supply unit 22 composed of a battery having an output voltage of about 1.5 V and a boost-type switching regulator, as shown in FIG. 23, resistors 24a and 24b for pull-up, resistors 24c for current limiting, a capacitor 25 for smoothing, and MOSFET 26 which is an example of a switch are provided. In this case, the signal generation circuit 23 operates when the switching unit 31 executes switching from the first state to the second state, which will be described later. Therefore, in the signal generation units 21a and 21b, the contact improvement signal Sb is generated when the switching from the first state to the second state is executed.

Further, the signal generation units 21a and 21b are separated from each other (disconnected) from each other with reference potentials (low potentials) so as to be in a floating state with each other. By configuring the resistor 24c with a variable resistor, the current value of the contact improvement signal Sb can be limited to an arbitrary current value.

The switching unit 31a disconnects the first state of connecting the first terminal 11a and the third terminal 13a, the first terminal 11a and the third terminal 13a, and connects the signal generation unit 21a and the third terminal 13a. Switch the second state to connect. In this case, the switching unit 31a operates in response to the control signal Sc output from the determination unit 41a. Specifically, the switching unit 31a maintains the first state in the state where the control signal Sc is not output (initial state), and maintains the second state in the state where the control signal Sc is output. The switching unit 31a also operates in response to a manual operation to switch between the first state and the second state.

Similar to the switching unit 31a, the switching unit 31b connects the first terminal 11b and the third terminal 13b according to the control signal Sc output from the determination unit 41b and the manual operation, and the first state. The terminal 11b and the third terminal 13b are disconnected, and the second state of connecting the signal generation unit 21b and the third terminal 13b is switched.

The determination units 41a and 41b are activated when an start switch (not shown) is operated, and perform a determination process for determining the quality of the contact state between each probe 60 and the contacted portion 101 of the electronic component 100. In this case, the determination unit 41a receives a determination signal between the third terminal 13a and the fourth terminal 14a (between the probes 60a and 60c connected to the third terminal 13a and the fourth terminal 14a, respectively) in the determination process. Is output, and the resistance value between the contact portions of the probes 60a and 60c in the contacted portion 101a is determined based on the current value of the determination signal and the voltage value between the third terminal 13a and the fourth terminal 14a. When the resistance value is specified and the resistance value is equal to or higher than the reference value, it is determined that the contact state between the probes 60a and 60c and the contacted portion 101a is poor.

Further, in the determination process, the determination unit 41b transmits a determination signal between the third terminal 13b and the fourth terminal 14b (between the probes 60b and 60d connected to the third terminal 13b and the fourth terminal 14b, respectively). Output to specify the resistance value between the contact portions of the probes 60b and 60d in the contacted portion 101b based on the current value of the determination signal and the voltage value between the third terminal 13b and the fourth terminal 14b. When the resistance value is equal to or higher than the reference value, it is determined that the contact state between the probes 60b and 60d and the contacted portion 101b is poor. Further, the determination units 41a and 41b output a control signal Sc when the contact state between the probe 60 and the contacted unit 101 is determined to be defective, and the switching unit 31a. 31b is made to execute the switching from the first state to the second state.

Next, a method of using the contact state improving device 1 will be described with reference to the drawings.

First, a usage method in which the contact state improving device 1 is connected to the measuring device 50 for measuring the measured quantity to be measured by the four-terminal method will be described. In this case, as shown in FIG. 2, the measuring device 50 has a signal generation unit 51 that generates a DC constant current signal as the output signal So and a voltage detection unit that detects the voltage value Vm of the voltage signal as the input signal Si. 52, a processing unit 53 that calculates a resistance value as a measured quantity based on the current value Im of the output signal So and the voltage value Vm detected by the voltage detection unit 52, and the output terminals 54a and 54b and the input terminals described above. It includes 55a and 55b. Further, in the initial state, the contact state improving device 1 is in the above-mentioned first state (a state in which the first terminal 11a and the third terminal 13a are connected and the first terminal 11b and the third terminal 13b are connected). It shall be maintained at.

First, as shown in FIG. 2, the first terminal 11a of the contact state improving device 1 and the output terminal 54a (output terminal on the high potential side) of the measuring device 50 are connected, and the first terminal of the contact state improving device 1 is connected. 11b and the output terminal 54b (output terminal on the low potential side) of the measuring device 50 are connected. Next, as shown in the figure, the second terminal 12a of the contact state improving device 1 and the input terminal 55a (input terminal on the high potential side) of the measuring device 50 are connected, and the second terminal of the contact state improving device 1 is connected. The 12b and the input terminal 55b (the input terminal on the low potential side) of the measuring device 50 are connected.

Subsequently, as shown in FIG. 2, a plug (not shown) attached to the cable of the probe 60a is connected to the third terminal 13a of the contact state improving device 1, and the plug attached to the cable of the probe 60b is not shown. Is connected to the third terminal 13b of the contact state improving device 1. Next, as shown in the figure, a plug (not shown) attached to the cable of the probe 60c is connected to the fourth terminal 14a of the contact state improving device 1, and a plug (not shown) attached to the cable of the probe 60d is connected. The plug is connected to the fourth terminal 14b of the contact state improving device 1.

Subsequently, as shown in FIG. 2, the probes 60a and 60c are brought into contact with the contacted portion 101a of the electronic component 100 to be measured, and the probes 60b and 60d are brought into contact with the contacted portion 101b of the electronic component 100.

Next, the start switch (not shown) in the contact state improving device 1 is operated. In response to this, the determination units 41a and 41b of the contact state improving device 1 are activated to execute the determination process. In this determination process, the determination unit 41a outputs a determination signal between the third terminal 13a and the fourth terminal 14a (between the probes 60a and 60c connected to the third terminal 13a and the fourth terminal 14a, respectively). Then, the resistance value between the contact portions of the probes 60a and 60c in the contacted portion 101a is specified based on the current value of the determination signal and the voltage value between the third terminal 13a and the fourth terminal 14a. In this case, for example, when an insulating film such as a metal oxide is not formed on the surface of the contacted portion 101a and the contact state between the contacted portion 101a and the probes 60a and 60c is good, the resistance value is higher than the reference value. Therefore, the determination unit 41a determines that the contact state is good and does not output the control signal Sc. At this time, the switching unit 31a does not switch from the first state to the second state, and the first state in which the first terminal 11a and the third terminal 13a are connected is maintained.

On the other hand, when an insulating film such as a metal oxide is formed on the surface of the contacted portion 101a and the contact state between the contacted portion 101a and the probes 60a, 60c is poor, the probe 60a, 60c in the contacted portion 101a Since the resistance value between the contact portions is larger than the reference value, the determination unit 41a determines that the contact state is defective in the determination process and outputs the control signal Sc to the switching unit 31a. At this time, the switching unit 31a operates as shown by the broken line in FIG. 1 to execute switching from the first state to the second state. As a result, the first terminal 11a and the third terminal 13a are disconnected, and the signal generation unit 21a and the third terminal 13a are connected.

Further, in the signal generation unit 21a, the enable terminal of the signal generation circuit 23 pulled up by the resistor 24a is powered by the switching from the first state to the second state (operation of the switching unit 31a shown by the broken line in FIG. 1). The signal generation circuit 23 operates by being connected to the low potential side of the unit 22, and outputs a contact improvement signal Sb in which the output voltage (about 1.5V) of the power supply unit 22 is boosted to about 10V. At the same time, the MOSFET 26 operates by connecting the gate terminal pulled up by the resistor 24b to the low potential side of the power supply unit 22, and transmits the contact improvement signal Sb generated by the signal generation circuit 23 to the resistor 24c. It is output to the third terminal 13a via. At this time, the resistor 24c limits (controls) the current value Im of the contact improvement signal Sb to about 10 mA.

At this time, the contact improvement signal Sb flows through the current path including the signal generation unit 21a, the fourth terminal 14a, the probe 60c, the contacted portion 101a, the probe 60a, the third terminal 13a, and the signal generation unit 21a. , Is supplied to the contacted portion 101a. As a result, the insulating film formed on the surface of the contacted portion 101a is destroyed, and the contact state between the contacted portion 101a and the probes 60a and 60c is improved (the contact state becomes good).

Next, since the contact state between the contacted portion 101a and the probes 60a, 60c is improved, the resistance value between the contacted portions of the probes 60a, 60c in the contacted portion 101a becomes smaller than the reference value. The unit 41a stops the output of the control signal Sc. In response to this, the switching unit 31a executes switching from the second state to the first state, and the first terminal 11a and the third terminal 13a are connected.

Further, the determination unit 41b executes the same processing as the determination processing executed by the determination unit 41a to output and stop the output of the control signal Sc, and the switching unit 31b and the switching unit 31a described above accordingly. In addition to operating in the same manner, the signal generation unit 21b operates in the same manner as the signal generation unit 21a described above according to the operation of the switching unit 31b. As a result, the insulating film formed on the surface of the contacted portion 101b is destroyed, and the contact state between the contacted portion 101b and the probes 60b and 60d is improved (the contact state is improved).

In the above example, the determination units 41a and 41b are made to execute the determination process so that the switching units 31a and 31b are made to switch between the first state and the second state. However, the switching units 31a and 31b are manually operated. By operating, switching between the first state and the second state can be executed.

Subsequently, an operation unit (not shown) in the measuring device 50 is operated to instruct the start of measurement. In response to this, the signal generation unit 51 of the measuring device 50 generates the output signal So. Further, the output signal So is output via the output terminals 54a and 54b of the measuring device 50 (see FIG. 2), and is a contact state improving device via the first terminals 11a and 11b connected to the output terminals 54a and 54b. Enter in 1. Further, as shown in FIG. 1, the first state is maintained by the switching units 31a and 31b. Therefore, the output signal So input via the first terminals 11a and 11b is connected to the probes 60a and 60b to the third terminals 13a and 13b via the switching units 31a and 31b and the third terminals 13a and 13b. (See Fig. 2).

In this case, the contact state between each contacted portion 101 and each probe 60 is improved by the above-mentioned determination processing of the determination units 41a and 41b and each operation of the signal generation units 21a and 21b and the switching units 31a and 31b. (The contact condition is good). Therefore, the output signal So is supplied from the probes 60a and 60b to the contacted portions 101a and 101b and flows through the electronic component 100, whereby the input signal corresponding to the resistance value of the electronic component 100 is connected between the contacted portions 101a and 101b. A voltage signal as Si is generated (see FIG. 2).

Further, since the contact state between the contacted portion 101a and the probe 60c and the contact state between the contacted portion 101b and the probe 60d are good, the input signal Si comes into contact with the probes 60b and 60d and the fourth terminals 14a and 14b. Input to the state improvement device 1.

Next, the input signal Si input to the contact state improving device 1 is connected to the second terminals 12a and 12b and the second terminals 12a and 12b, respectively, which are connected to the fourth terminals 14a and 14b, respectively. Input to the measuring device 50 via the input terminals 55a and 55b of (see FIG. 2).

Subsequently, the voltage detection unit 52 of the measuring device 50 detects the voltage value Vm of the input signal Si input via the input terminals 55a and 55b (see FIG. 2). Next, the processing unit 53 of the measuring device 50 calculates the resistance value as the measured quantity based on the current value Im of the output signal So and the voltage value Vm detected by the voltage detecting unit 52. Subsequently, the processing unit 53 causes the calculated resistance value to be displayed on a display unit (not shown). In this case, since the contact state between each contacted portion 101 and each probe 60 is improved, the output signal So is reliably supplied to the contacted portions 101a and 101b via the probes 60a and 60b, and the probes 60c, As a result of being able to reliably input the input signal Si to the measuring device 50 via the 60d, the resistance value of the electronic component 100 can be accurately measured.

As described above, by using the contact state improving device 1, it is possible to accurately measure the measured amount to be measured while improving the contact state by using the measuring device 50 which does not have the contact state improving function. Therefore, it is possible to fully effectively utilize the measuring device 50 which does not have the contact state improving function.

Next, a usage method in which the contact state improving device 1 is connected to the measuring device 70 (see FIG. 3) for measuring the measured quantity to be measured by the two-terminal method will be described. In the following description, the same components as those of the measuring device 50 described above are designated by the same reference numerals, and duplicate description will be omitted. In this case, as shown in the figure, the measuring device 70 includes the signal generation unit 51, the voltage detection unit 52, and the processing unit 53 described above. Further, the measuring device 70 has an input / output terminal 71a on the high potential side for outputting the output signal So and inputting the input signal Si, and a low potential side for outputting the output signal So and inputting the input signal Si. The input / output terminal 71b of the above is provided.

In this usage example, as shown in FIG. 3, the first terminal 11a of the contact state improving device 1 and the input / output terminal 71a (input / output terminal on the high potential side) of the measuring device 70 are connected, and the contact state improving device is connected. The first terminal 11b of No. 1 and the input / output terminal 71b (input / output on the low potential side) of the measuring device 70 are connected. Next, as shown in the figure, the plug of the probe 60a is connected to the third terminal 13a of the contact state improving device 1, and the plug of the probe 60b is connected to the third terminal 13b of the contact state improving device 1. Subsequently, the plug of the probe 60c is connected to the fourth terminal 14a of the contact state improving device 1, and the plug of the probe 60d is connected to the fourth terminal 14b of the contact state improving device 1.

Next, as shown in FIG. 3, the probes 60a and 60c are brought into contact with the contacted portion 101a of the electronic component 100 to be measured, and the probes 60b and 60d are brought into contact with the contacted portion 101b of the electronic component 100.

Next, the start switch (not shown) in the contact state improving device 1 is operated. In response to this, the determination units 41a and 41b of the contact state improving device 1 execute the above-mentioned determination process to output and stop the output of the control signal Sc, and the switching units 31a and 31b perform the above-mentioned operations accordingly. At the same time, the signal generation units 21a and 21b perform the above operations according to the operations of the switching units 31a and 31b. As a result, when the insulating film formed on the surface of the contacted portions 101a and 101b is formed, the insulating film is destroyed and the contact state between the contacted portions 101a and 101b and each probe 60 is improved. (The contact condition becomes good).

It is also possible to switch between the first state and the second state by manually operating the switching units 31a and 31b without causing the determination units 41a and 41b to execute the determination process. Further, in this embodiment, since the measuring device 70 measures the measured amount to be measured by the two-terminal method, the probes 60c and 60d are used to improve the contact state between each contacted portion 101 and each probe 60. It is only used, not used when measuring the amount to be measured. Therefore, after the processing for improving the contact state is completed, the probes 60c and 60d may be separated from the contacted portions 101a and 101b (the contact state may be released), or the plugs of the probes 60c and 60d may be plugged. It may be removed from the four terminals 14a and 14b.

Subsequently, an operation unit (not shown) in the measuring device 70 is operated to instruct the start of measurement. In response to this, the signal generation unit 51 of the measuring device 70 generates the output signal So, and the output signal So is connected to the input / output terminals 71a, 71b of the measuring device 70, the first terminals 11a, 11b, 1st. It is output to the third terminals 13a and 13b connected to the terminals 11a and 11b and the probes 60a and 60b connected to the third terminals 13a and 13b.

In this case, since the contact state between each contacted portion 101 and each probe 60 is improved, the output signal So is supplied from the probes 60a and 60b to the contacted portions 101a and 101b and flows through the electronic component 100, whereby the electronic component 100 flows. A voltage signal as an input signal Si corresponding to the resistance value of the electronic component 100 is generated between the contacted portions 101a and 101b.

Subsequently, the voltage detection unit 52 of the measuring device 70 detects the voltage value Vm between the input / output terminals 71a and 71b (the voltage value Vm of the input signal Si input via the input / output terminals 71a and 71b). Next, the processing unit 53 of the measuring device 70 calculates the resistance value as the measured quantity based on the current value Im of the output signal So and the voltage value Vm detected by the voltage detecting unit 52. Subsequently, the processing unit 53 causes the calculated resistance value to be displayed on a display unit (not shown).

Also in this usage example, by using the contact state improving device 1, it is possible to accurately measure the measured amount to be measured while improving the contact state by using the measuring device 70 which does not have the contact state improving function. Therefore, it is possible to fully effectively utilize the measuring device 70 which does not have the contact state improving function.

As described above, the contact state improving device 1 has a first terminal 11 that can be connected to the output terminal 54 of the measuring device 50, a second terminal 12 that can be connected to the input terminal 55 of the measuring device 50, and an output signal So. A third terminal 13 to which the probe 60 to be supplied can be connected, a fourth terminal 14 to which the probe 60 connected to the second terminal 12 and input the input signal Si can be connected, and a signal for generating a contact improvement signal Sb. The first state in which the generation unit 21 and the first terminal 11 and the third terminal 13 are connected, and the signal generation unit 21 and the third terminal 13 are connected by disconnecting the first terminal 11 and the third terminal 13. It includes a switching unit 31 for switching the second state. Therefore, according to the contact state improving device 1, by connecting the contact state improving device 1 to the measuring devices 50 and 70 having no contact state improving function, the contact state between the contacted portion 101 and the probe 60 can be changed. It can be improved and accurate measurement can be performed. Therefore, according to the contact state improving device 1, the measuring devices 50 and 70 having no contact state improving function can be fully utilized.

Further, according to the contact state improving device 1, the switching unit 31 disconnects both the first terminals 11a and 11b and both the third terminals 13a and 13b in the second state, and the signal generation unit 21a. , 21b and both the third terminals 13a and 13b are connected to each other to bring the probes 60a and 60c on the high potential side into contact with each other, and the contact state between the probes 60a and 60c and the low potential side. Since both the contact state between the contacted portion 101b and the probes 60b and 60d, which are in contact with the probes 60b and 60d, can be improved, more accurate measurement can be performed.

Further, according to the contact state improving device 1, the signal generating unit 21 generates a contact improving signal Sb when the switching unit 31 switches from the first state to the second state, thereby initially. By configuring the switching unit 31 to maintain the first state in the state, it is possible to suppress power consumption of the power supply unit 22 used for generating the contact improvement signal Sb.

Further, according to the contact state improving device 1, when the determination unit 41 determines that the contact state between the contacted unit 101 and the probe 60 is defective, the switching unit 31 is switched from the first state to the second state. By executing the switching, the process of determining whether or not the contact state between the contacted portion 101 and the probe 60 is defective and the process of improving the contact state when the contact state is poor are automatically executed. Since it can be performed, the work efficiency (measurement efficiency) can be sufficiently improved.

The contact state improving device is not limited to the configuration of the contact state improving device 1 described above, and includes, for example, two signal generation units 21a and 21b and two switching units 31a and 31b, and the first terminal in the second state. Although both of the 11a and 11b and both the third terminals 13a and 13b are disconnected from each other and both the signal generation units 21a and 21b and the third terminals 13a and 13b are connected to each other, the signal A configuration including only one of the generation units 21a and 21b and one switching unit 31 corresponding to the one, that is, between the third terminal 13a and the fourth terminal 14a, and between the third terminal 13b and the fourth terminal. It is also possible to adopt a configuration in which the contact improvement signal Sb is supplied to only one of the 14b and the 14b. Also in this configuration, the two probes 60 that are in contact with one of the contacted portions 101 are connected to the third terminal 13 and the fourth terminal 14 to which the contact improvement signal Sb is supplied, and one of the contacted portions is connected. After improving the contact state between the 101 and the two probes 60, the two probes 60 that are in contact with the other contacted portion 101 are supplied with the contact improvement signal Sb at the third terminal 13 and the fourth terminal 14. By reconnecting to and improving the contact state between the other contacted portion 101 and the two probes 60, the contact state between both of the two contacted portions 101 and each probe 60 can be improved.

Further, the example in which the signal generation unit 21 is configured so as to automatically start the generation of the contact improvement signal Sb when the switching unit 31 switches from the first state to the second state has been described above. A signal generation unit 21 having a configuration for generating a contact improvement signal Sb can also be adopted in the first state.

Further, a configuration example in which the switching unit 31 is made to switch between the first state and the second state by the control signal Sc output from the determination unit 41 that determines the quality of the contact state between the contacted unit 101 and the probe 60. However, for example, when the measuring device has a function of outputting a signal capable of determining the quality of the contact state between the contacted portion 101 and the probe 60, the signal causes the switching unit 31 to output a signal. It is also possible to adopt a configuration in which switching between the first state and the second state is executed. It is also possible to adopt a configuration including a switching unit 31 that executes switching between the first state and the second state only by manual operation.

Further, the example in which the contact state improving device 1 is connected to the measuring devices 50 and 70 for measuring the resistance value as an example of the measured quantity is used, but various measured quantities other than the resistance value (for example, capacitance) have been described above. The contact state improving device 1 can be connected to various measuring devices for measuring (or inductance).

1 Contact state improvement device 11a, 11b 1st terminal 12a, 12b 2nd terminal 13a, 13b 3rd terminal 14a, 14b 4th terminal 21a, 21b Signal generation unit 31a, 31b Switching unit 41a, 41b Judgment unit 50, 70 Measuring device 60a to 60d Probe 100 Electronic components 101a, 101b Contacted part Sb Contact improvement signal Si input signal So output signal

Claims (4)

It is configured to be connectable to a measuring device that measures the measured quantity of the measurement target based on the output signal and input signal input / output via the probe that is in contact with the contacted portion of the measurement target. A contact state improving device for improving the contact state with the probe.
A pair of first terminals that can be connected to a pair of output terminals for outputting the output signal in the measuring device, and a pair that can be connected to a pair of input terminals for inputting the input signal in the measuring device. The second terminal, the pair of third terminals to which the pair of probes for supplying the output signal to the contacted portion can be connected, and the input signal connected to each of the second terminals. A pair of fourth terminals to which the pair of probes for input can be connected, a signal generation unit for generating a contact improvement signal supplied between the third terminal and the fourth terminal, and each of the first terminals. The first state in which the terminals and the third terminals are connected to each other, and at least one of the first terminals and the third terminal corresponding to the at least one first terminal are disconnected and the signal is generated. A contact state improving device including a switching unit for switching a second state for connecting the unit and the third terminal. In the second state, the switching unit disconnects both of the first terminals and both of the third terminals corresponding to the first terminals, and also disconnects both the signal generation unit and the third terminal. The contact state improving device according to claim 1, which connects both terminals. The contact state improving device according to claim 1 or 2, wherein the signal generating unit generates the contact improving signal when switching from the first state to the second state is executed by the switching unit. A determination unit for determining the quality of the contact state between the contacted portion and the probe is provided.
According to claims 1 to 3, the determination unit causes the switching unit to switch from the first state to the second state when the contact state between the contacted portion and the probe is determined to be defective. The contact condition improving device according to any one.

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