JP6808204B2 - Mask sheet, partial plating material manufacturing method and partial plating method - Google Patents

Description

The present invention relates to a method for producing a mask sheet and a partial plating material and a method for partial plating.

In the manufacture of electronic device parts such as lead frames of semiconductor devices, as a method of forming a plating film at a desired position on the surface of the material to be plated, the position where the plating film is formed is striped in the longitudinal direction. A method in which a mask sheet (masking tape) is attached to the surface of a strip-shaped material to be plated and plating is applied to the mask sheet is widely used. The partially plated material produced by this method has unnecessary parts removed by punching or the like, and becomes a part for an electronic device processed into a desired shape.
In such a so-called stripe plating method, a plating film is also formed on a portion of the surface of the partial plating material that is removed by punching or the like. Therefore, a part of the formed plating film is wasted. In particular, when an expensive precious metal is used for forming the plating film, the plating film is formed in a portion other than the originally required portion, which may increase the cost.
Even when the removed part is recycled, a metal (element) different from the material to be plated and the plating film is often used. Therefore, the removed part is treated as an "alloy" and is commercially available. The value drops significantly.

Other methods for forming the plating film only on the required portion of the surface of the material to be plated include, for example, a brush plating method and a spudger plating method. However, these methods are difficult to align, and there is a risk that a plating film may be formed on the surface of the material to be plated at a position deviated from a desired position. Further, with these methods, it is difficult to form a plating film having a particularly fine shape or a plating film having a high density (the distance between the plating films is narrow).

As a method for solving the above problem, for example, on the surface of a long metal strip having reference holes formed in the longitudinal direction, a masking tape reference hole formed at a predetermined interval corresponding to the reference hole and a shape to be plated should be plated. This is a method in which masking tapes with pattern plating holes are brought into close contact with each other for plating. Both reference holes are detected by sensors, and the long metal strip and masking tape are aligned so that the two reference holes match. A method of adjusting the relative feed rate with and (see Patent Document 1) and a method of applying an endless annular mask belt in close contact with a portion where a plating film is not formed to mask (see Patent Documents 2 and 3) are disclosed.

Japanese Unexamined Patent Publication No. 10-183390 Japanese Unexamined Patent Publication No. 2008-056958 Japanese Unexamined Patent Publication No. 2011-026654

The method disclosed in Patent Document 1 is premised on a drum plating method, and a sensor for detecting a reference hole of a long metal strip and a masking tape and a sensor for adjusting the relative feed rate of both must be attached. Therefore, it is not economical because the plating equipment already owned by the user cannot be used.
Further, in the methods disclosed in Patent Documents 2 and 3, the mask belt must be changed every time the size, shape, spacing, etc. of the plating film to be formed are different, which is troublesome and costly.

The present invention solves the above problems, and a plating apparatus already owned by the user can be used, and a plating film having high alignment accuracy and easily different sizes, shapes, intervals, etc. is formed. It is an object of the present invention to provide a mask sheet, a method for producing a partial plating material, and a method for partial plating.

The mask sheet of the present invention has a mask layer and a protective layer formed on the mask layer, and the mask layer has a plurality of openings corresponding to positions where a plating film is formed on a strip-shaped material to be plated. The plurality of openings may have the same shape or different shapes, and the protective layer is peeled off from the mask layer at the same time or after the mask layer is attached to the strip-shaped material to be plated.

Further, the mask sheet of the present invention has a mask layer, a first protective layer formed on the mask layer, and a second protective layer formed on a surface of the mask layer opposite to the surface on which the protective layer is formed. The mask layer has a plurality of openings corresponding to positions where a plating film is formed on the strip-shaped material to be plated, and the plurality of openings may have the same shape or different shapes. The second protective layer is peeled off from the mask layer at the same time or before the mask layer is attached to the strip-shaped material to be plated, and the first protective layer is formed by applying the mask layer to the strip-shaped material to be plated. Upon application, it is peeled off from the mask layer at the same time or thereafter.

The method for producing a partially plated material of the present invention includes a step of attaching the mask layer of the mask sheet to an arbitrary position on at least one surface of the strip-shaped plated material, and at least the mask layer of the strip-shaped plated material. The plating film is formed at a position corresponding to a plurality of openings of the mask layer, and has a step of forming a plating film on the surface to which the plating film is attached and a step of peeling off the mask layer. In the step of forming the plating film, the strip-shaped material to be plated is continuously fed in the longitudinal direction to continuously form the plating film on the strip-shaped material to be plated.

The metal constituting the plating film formed at positions corresponding to the plurality of openings may be the same metal or different metals.

The plating film formed at a position corresponding to the plurality of openings has two or more layers, and the metal constituting each layer of the plating film may be the same metal or a different metal.

The method for producing a partially plated material of the present invention further comprises a step of attaching a second mask sheet onto an arbitrary opening among the plurality of openings of the mask layer, and at least the second of the strip-shaped material to be plated. It has a step of forming a plating film on the surface to which the mask sheet of No. 1 is attached and a step of peeling off the second mask sheet, and a step of attaching the second mask sheet and the strip-shaped material to be plated. The step of forming the plating film on the surface to which the second mask sheet is attached and the step of peeling off the second mask sheet may be performed at least once each.

In the step of forming a plating film on at least the surface of the strip-shaped material to be plated to which the second mask sheet is attached, the strip-shaped plating is continuously fed in the longitudinal direction to continuously feed the strip-shaped plating. The plating film may be formed on the material.

The partial plating method of the present invention includes a step of attaching the mask layer to an arbitrary position on at least one surface of the strip-shaped material to be plated, and a plating film on at least the surface of the strip-shaped material to be plated to which the mask layer is attached. The plating film formed at a position corresponding to the plurality of openings has one or more layers, and has a step of forming the plating film and a step of peeling off the mask layer. By continuously feeding the strip-shaped material to be plated in the longitudinal direction, the plating film is continuously formed on the strip-shaped material to be plated.

The metal constituting the plating film formed at positions corresponding to the plurality of openings may be the same metal or different metals.

The plating film formed at a position corresponding to the plurality of openings has two or more layers, and the metal constituting each layer of the plating film may be the same metal or a different metal.

The partial plating method of the present invention further includes a step of attaching a second mask sheet onto an arbitrary opening among a plurality of openings of the mask sheet, and at least the second mask sheet of the strip-shaped material to be plated. It has a step of forming a plating film on the surface to which the plating film is attached and a step of peeling off the second mask sheet, and a step of attaching the second mask sheet and at least the first of the strip-shaped materials to be plated. The step of forming the plating film on the surface to which the second mask sheet is attached and the step of peeling off the second mask sheet may be performed once or more.

In the step of forming a plating film on at least the surface of the strip-shaped material to be plated to which the second mask sheet is attached, the strip-shaped plating is continuously fed in the longitudinal direction to continuously feed the strip-shaped plating. The plating film may be formed on the material.

In the mask sheet, partial plating material manufacturing method and partial plating method of the present invention, the plating apparatus already owned by the user can be used, the alignment accuracy is high, and the size, shape, spacing, etc. can be easily obtained. Can form different plating films.

It is a schematic diagram (cross-sectional view) which shows a part of the mask sheet which concerns on one Embodiment (1st Embodiment) of this invention. It is a schematic diagram (plan view) which shows a part of the mask sheet which concerns on one Embodiment (1st Embodiment) of this invention. It is a schematic diagram (perspective view) which shows a part of the mask sheet which concerns on one Embodiment (1st Embodiment) of this invention. It is a schematic diagram (plan view) which shows a part of the mask sheet which concerns on the modification of one Embodiment (1st Embodiment) of this invention. It is a schematic diagram (cross-sectional view) which shows a part of the mask sheet which concerns on other embodiment (second embodiment) of this invention. It is a schematic diagram (plan view) which shows a part of the mask sheet which concerns on other embodiment (second embodiment) of this invention. It is a schematic diagram (perspective view) which shows a part of the mask sheet which concerns on other embodiment (second embodiment) of this invention. It is a schematic diagram (perspective view) which shows a part of the state which the mask layer is attached to the strip-shaped material to be plated with respect to the manufacturing method of the partial plating material which concerns on one Embodiment (1st Embodiment) of this invention. It is a schematic diagram (perspective view) which shows a part of the partial plating material manufactured by the manufacturing method of the partial plating material which concerns on one Embodiment (1st Embodiment) of this invention. Regarding the method for producing a partial plating material according to another embodiment (second embodiment) of the present invention, a schematic view (plan view) showing a strip-shaped material to be plated to which a mask layer and a second mask sheet are attached. is there. It is a schematic diagram (plan view) which shows a part of the partial plating material manufactured by the manufacturing method of the partial plating material which concerns on another embodiment (second embodiment) of this invention. Regarding a modified example of the method for producing a partial plating material according to another embodiment (second embodiment) of the present invention, a schematic view (planar plan) showing a strip-shaped material to be plated to which a mask layer and a second mask sheet are attached. Figure). Regarding a modified example of the method for producing a partial plating material according to another embodiment (second embodiment) of the present invention, a schematic view (plan view) showing a strip-shaped material to be plated after the first formation of a plating film. Is. Regarding a modified example of the method for producing a partial plating material according to another embodiment (second embodiment) of the present invention, a schematic view (plan view) showing a strip-shaped material to be plated after the formation of the second plating film. Is. It is a schematic diagram (plan view) which shows the partial plating material manufactured by the modification of the manufacturing method of the partial plating material which concerns on another embodiment (second embodiment) of this invention. It is a schematic diagram (plan view) which shows the strip-shaped plated material to which the mask layer 1010 is attached, with respect to the manufacturing method of the partial plating material which concerns on another embodiment (third embodiment) of this invention. Regarding the method for producing a partial plating material according to another embodiment (third embodiment) of the present invention, a strip-shaped material to be plated is formed by forming a plating film 1210 (nickel and gold 2) and attaching a mask layer 1110. It is a schematic diagram (plan view) to represent. It is a schematic diagram (plan view) which shows the partial plating material manufactured by the manufacturing method of the partial plating material which concerns on another embodiment (third embodiment) of this invention.

Hereinafter, an embodiment of the mask sheet, the method for producing the partial plating material, and the partial plating method of the present invention will be described in detail. It goes without saying that the present invention is not limited to the following embodiments.

1. 1. Mask sheet <first embodiment>
The configuration of the mask sheet according to the present embodiment will be described with reference to FIGS. 1 to 3.

As shown in FIG. 1, the mask sheet 100 according to the present embodiment has a mask layer 110 and a protective layer 120 formed on the mask layer 110.

The mask layer 110 is made of a flexible material such as a resin, and is preferably a film-like resin. Examples of the resin include polyethylene resin, polyethylene terephthalate resin, polyethylene naphthalate resin, polypropylene resin, polyethylene resin, polyimide resin, acrylic resin, and modified resins thereof. These can be used alone or in combination of two or more.

The thickness of the mask layer 110 can be adjusted as appropriate, but is preferably 30 μm or more and 150 μm or less, for example. More preferably, the thickness is, for example, 30 μm or more and 100 μm or less, and 40 μm or more and 80 μm or less is particularly preferable.
The size (width and length) of the mask layer 110 can be adjusted according to the size (width and length) of the strip-shaped material to be plated, which will be described later.

Further, as shown in FIGS. 2 and 3, the mask layer 110 has a plurality of openings 130 corresponding to positions where a plating film is formed on the strip-shaped material to be plated.
In the present embodiment, the shape of the opening 130 formed in the mask layer 110 is the same shape (round shape), but each may be different in shape according to the shape of the plating film to be formed, and a part thereof may be formed. It may have the same shape.
Further, as shown in FIG. 4, the opening 130 may be formed so as to have openings 130a, 130b, 130c, 130d having different shapes as one unit and repeating the same.
As described above, the shape, size, number, spacing, etc. of the openings 130 can be appropriately changed depending on the application.

In the present embodiment, the positioning hole 140 is formed in the mask layer 110, but the formation of the positioning hole is arbitrary, and in the present invention, the mask in which the positioning hole is not formed in the mask layer 110 as shown in FIG. Of course, the sheet is also included.

The protective layer 120 is made of a flexible material such as a resin, and is preferably a film-like resin. Examples of the resin include polyethylene resin, polyethylene terephthalate resin, polyethylene naphthalate resin, polypropylene resin, polyethylene resin, polyimide resin, acrylic resin, and modified resins thereof. These can be used alone or in combination of two or more.

The thickness of the protective layer 120 can be adjusted as appropriate, but is preferably 30 μm or more and 150 μm or less, for example. More preferably, the thickness is, for example, 30 μm or more and 100 μm or less, and 40 μm or more and 80 μm or less is particularly preferable.
The size (width and length) of the protective layer 120 can be adjusted according to the size (width and length) of the mask layer 110.

As shown in FIGS. 2 and 3, the mask sheet 100 also has an opening formed in the protective layer 120, but the formation of the opening in the protective layer 120 is optional, and the protective layer in the present invention. Of course, a mask sheet having no opening formed in 120 is also included.

Further, in the present embodiment, positioning holes are also formed in the protective layer 120, but the formation of the positioning holes is arbitrary, and the present invention naturally includes a mask sheet in which the protective layer 120 does not have positioning holes. ..

The mask sheet of the present embodiment is produced, for example, by the following method.

First, a protective layer 120 made of a resin film and having a first adhesive layer made of an adhesive on one side thereof is placed on one side of the mask layer 110 so that the first adhesive layer is in contact with the surface of the mask layer 110. Paste together.
A second adhesive layer made of an adhesive may be formed on the other surface of the mask layer 110 (the surface that is not in contact with the protective layer 120). As will be described later, when the mask layer 110 is attached to the strip-shaped material to be plated, the mask layer 110 can be attached so that the second adhesive layer is in contact with at least one surface of the strip-shaped material to be plated.

To form the opening 130 in the mask layer 110, for example, the opening 130 is formed in the mask layer 110 using a film cutter or the like, and then the mask layer 110 in which the opening 130 is formed and the protective layer 120 are bonded together. May be good.
Further, after the mask layer 110 and the protective layer 120 are bonded together, the opening 130 may be formed in the mask layer 110 by using a film cutter. In this case, the opening 130 may be formed in the mask layer 110 so as to penetrate the protective layer 120, and the surface side on which the protective layer 120 is not formed so that the opening 130 is formed only in the mask layer 110. It may be processed from.
From the viewpoint of simplifying the process and work, a method is preferably used in which the mask layer 110 and the protective layer 120 are bonded together, and then the opening 130 is formed in the mask layer 110 so as to penetrate the protective layer 120 as well.

In the mask sheet 100, the protective layer 120 is peeled off from the mask layer 110 at the same time as or after the mask layer 110 is attached to the strip-shaped material to be plated. By doing so, the mask sheet 100 can attach the mask layer 110 to the strip-shaped material to be plated while maintaining the shape of the opening 130 of the mask layer 110.

That is, when the mask layer 110 is attached to the strip-shaped material to be plated, tensile stress in the longitudinal direction is particularly likely to occur in the mask layer 110. Since the mask layer 110 has an opening 130, it is easy to stretch, and if the mask layer 110 is stretched by this tensile stress, the shape of the opening 130 is deformed, which is desirable for a strip-shaped material to be plated. There is a risk that the plating film having the same shape cannot be formed or the plating film cannot be formed at a desired position.

In particular, when a device for continuously attaching the mask layer 110 to the strip-shaped material to be plated is used, a large force (tension) may be applied to the mask layer 110.
Further, in order to form a plating film on a strip-shaped material to be plated, it is common to use a device (continuous plating device) for continuously forming a plating film by continuously feeding the strip-shaped material to be plated in the longitudinal direction. Is the target. Then, the mask layer 110 can be attached to the strip-shaped material to be plated, for example, in the process of continuously attaching the strip-shaped material to be plated in the longitudinal direction by a continuous plating apparatus. However, even in this case, a large force (tension) can be applied to the mask layer 110.

However, as described above, in the mask sheet 100, the protective layer 120 is peeled off from the mask layer 110 when the mask layer 110 is attached to or after the strip-shaped material to be plated, so that the protective layer 120 is affected by the tensile stress in the mask layer 110. Stretching can be suppressed, and deformation of the opening 130 can be suppressed.

As described above, since the mask sheet 100 can suppress the stretching of the mask layer 110 and the deformation of the opening 130, the accuracy of the shape and position of the plating film formed on the strip-shaped material to be plated can be improved.

The mask sheet 100 is preferably strip-shaped. Further, the width in the lateral direction is preferably the same as or shorter than that of the strip-shaped material to be plated.

<Second embodiment>
The configuration of the mask sheet according to the present embodiment will be described with reference to FIGS. 5 to 7.

As shown in FIG. 5, the mask sheet 200 according to the present embodiment has a mask layer 210, a first protective layer 220 formed on the mask layer 210, and a surface on which the protective layer 220 of the mask layer 210 is formed. It has a second protective layer 230 formed on the opposite surface to the surface.

The mask layer 210 can have the same configuration as the mask layer 110.

The thickness of the mask layer 210 can be adjusted as appropriate, but is preferably 30 μm or more and 150 μm or less, for example. More preferably, the thickness is, for example, 30 μm or more and 100 μm or less, and 40 μm or more and 80 μm or less is particularly preferable.
The size (width and length) of the mask layer 210 can be adjusted according to the size (width and length) of the strip-shaped material to be plated, which will be described later.

Further, as shown in FIGS. 6 and 7, the mask layer 210 has a plurality of openings 240 corresponding to positions where a plating film is formed on the strip-shaped material to be plated.
In the present embodiment, the shape of the opening 240 formed in the mask layer 210 is the same shape (round shape), but each may be different in shape according to the shape of the plating film to be formed, and a part thereof may be formed. It may have the same shape.
Further, the opening 240 may be formed so as to have an opening having a different shape as one unit and repeating the same as the opening 130 in the modified example of the first embodiment.
As described above, the shape, size, number, spacing, etc. of the openings 240 can be appropriately changed depending on the application.

In the present embodiment, the positioning holes 250 are formed in the mask layer 210, but the formation of the positioning holes is arbitrary, and the present invention naturally includes a mask sheet in which the positioning holes are not formed in the mask layer 210. ..

The first protective layer 220 can have the same configuration as the protective layer 120.

The thickness of the first protective layer 220 can be adjusted as appropriate, but is preferably 30 μm or more and 150 μm or less, for example. More preferably, the thickness is, for example, 30 μm or more and 100 μm or less, and 40 μm or more and 80 μm or less is particularly preferable.
The size (width and length) of the first protective layer 220 can be adjusted according to the size (width and length) of the mask layer 210.

As shown in FIGS. 6 and 7, the mask sheet 200 also formed an opening in the first protective layer 220, but the formation of the opening in the first protective layer 220 is optional. The present invention naturally includes a mask sheet in which an opening is not formed in the first protective layer 220.

Further, in the present embodiment, the positioning hole is also formed in the first protective layer 220, but the formation of the positioning hole is arbitrary, and the positioning hole is not formed in the first protective layer 220 in the present invention. Of course, a mask sheet is also included.

The second protective layer 230 can have the same configuration as the protective layer 120 and the first protective layer 210.

The thickness of the second protective layer 230 can be adjusted as appropriate, but is preferably 30 μm or more and 150 μm or less, for example. More preferably, the thickness is, for example, 30 μm or more and 100 μm or less, and 40 μm or more and 80 μm or less is particularly preferable.
The size (width and length) of the second protective layer 230 can be adjusted according to the size (width and length) of the mask layer 210.

As shown in FIGS. 6 and 7, the mask sheet 200 also formed an opening in the second protective layer 230, but the formation of the opening in the second protective layer 230 is optional. The present invention naturally includes a mask sheet in which an opening is not formed in the second protective layer 230.

Further, in the present embodiment, the positioning hole is also formed in the second protective layer 230, but the formation of the positioning hole is arbitrary, and the positioning hole is not formed in the second protective layer 230 in the present invention. Of course, a mask sheet is also included.

The mask sheet of the present embodiment is produced, for example, by the following method.

First, a protective layer 220 made of a resin film and having a first adhesive layer made of an adhesive on one side thereof is placed on one side of the mask layer 210 so that the first adhesive layer is in contact with the surface of the mask layer 210. Paste together.

A second adhesive layer made of an adhesive is formed on the other surface of the mask layer 210 (the surface that is not in contact with the first protective layer 220), and the second adhesive layer is the second protective layer 230. The mask layer 210 is attached to this so that it touches one surface.
When the mask layer 210 is attached to the strip-shaped material to be plated, the mask layer 210 can be attached so that the second adhesive layer is in contact with at least one surface of the strip-shaped material to be plated.

The timing of attaching the first protective layer 220 and the second protective layer 230 to the mask layer 210 can be changed as appropriate, and both can be attached to the mask layer 210 at the same time or either of them can be attached to the mask layer 210 first.

To form the opening 240 in the mask layer 210, for example, the opening 240 is formed in the mask layer 210 using a film cutter or the like, and then the mask layer 210 in which the opening 240 is formed and the first protective layer 220 are formed. The second protective layer 230 may be attached.
Further, after the mask layer 210 and at least one of the first protective layer 220 and the second protective layer 230 are bonded together, an opening 240 may be formed in the mask layer 210 by using a film cutter. In this case, the opening 240 may be formed in the mask layer 210 so as to penetrate at least the first protective layer 220.
From the viewpoint of simplifying the process and work, after the mask layer 210, the first protective layer 220 and the second protective layer 230 are bonded to each other, the mask layer 210 is formed so as to penetrate at least the first protective layer 220. A method of forming the opening 240 is preferably used. By doing so, it is possible to suppress cutting damage (miscut) of the mask layer 210 when forming the opening 240, and it is possible to form the opening 240 with high accuracy.

In the mask sheet of the present embodiment, the second protective layer 230 is peeled off from the mask layer 210 at the same time as or before the mask layer 210 is attached to the strip-shaped material to be plated.

Further, the first protective layer 220 is peeled off from the mask layer 210 at the same time as or after the mask layer 210 is attached to the strip-shaped material to be plated. By doing so, the mask layer 210 can attach the mask layer 210 to the strip-shaped material to be plated while maintaining the shape of the opening 240.

That is, when the mask layer 210 is attached to the strip-shaped material to be plated, tensile stress is likely to be generated in the mask layer 210 particularly in the longitudinal direction. Since the mask layer 210 has an opening 240, it is easy to stretch, and if the mask layer 210 is stretched due to this tensile stress, the shape of the opening 240 is deformed, which is desirable for a strip-shaped material to be plated. There is a risk that the plating film having the same shape cannot be formed or the plating film cannot be formed at a desired position.

In particular, when a device for continuously attaching the mask layer 210 to the strip-shaped material to be plated is used, a large force (tension) may be applied to the mask layer 210.
Further, in order to form a plating film on a strip-shaped material to be plated, it is common to use a device (continuous plating device) for continuously forming a plating film by continuously feeding the strip-shaped material to be plated in the longitudinal direction. Is the target. The mask layer 210 can also be attached to the strip-shaped material to be plated, for example, in a process in which the strip-shaped material to be plated is continuously formed in the longitudinal direction by a continuous plating apparatus. However, even in this case, a large force (tension) can be applied to the mask layer 210.

However, as described above, in the mask sheet 200, when the mask layer 210 is attached to the strip-shaped material to be plated, or after the application, the first protective layer 220 is peeled off from the mask layer 210, so that the first protective layer 220 masks. Stretching due to tensile stress in the layer 210 can be suppressed, and deformation of the opening 240 can be suppressed.

As described above, since the mask sheet 200 can suppress the stretching of the mask layer 210 and the deformation of the opening 240, the accuracy of the shape and position of the plating film formed on the strip-shaped material to be plated can be improved.

The mask sheet 200 is preferably strip-shaped. Further, the width in the lateral direction is preferably the same as or shorter than that of the strip-shaped material to be plated.

2. 2. Manufacturing Method of Partial Plating Material <First Embodiment>
As the material to be plated used in the method for producing a partial plating material according to the present embodiment, a strip-shaped material is preferably used. The material of the strip-shaped material to be plated is not particularly limited, and copper, iron, stainless steel, or the like can be appropriately used.
The strip-shaped material to be plated may be subjected to base plating in advance, or positioning holes for alignment with the mask layer of the mask sheet may be formed.

In the present embodiment, the mask layer can be attached to an arbitrary position of the strip-shaped material to be plated. That is, the mask layer may be attached so as to cover the entire strip-shaped material to be plated, or may be attached so as to cover a part of the strip-shaped material to be plated.

In the method for producing a partial plating material of the present embodiment, first, a mask layer is attached to at least one surface of the strip-shaped material to be plated. The surface of the strip-shaped material to be plated to which the mask layer is attached is arbitrarily selected, and may be either single-sided or double-sided.
Further, the strip-shaped material to be plated and the mask layer can be attached so that the positioning holes formed in the strip-shaped material to be plated and the positioning holes formed in the mask layer match. When no positioning holes are formed in both, for example, a plating film that forms the strip-shaped material to be plated, the initial end of the mask layer, and the position of the opening closest to the initial end of the mask layer. May be positioned so as to have a desired interval and position, and the mask layer may be attached to the surface of the strip-shaped material to be plated accordingly.

In the present embodiment, the position of the mask layer to be attached to the strip-shaped material to be plated can be adjusted by a dimensional inspection using an image sensor.
Such position adjustment is often performed by using a pilot, but using a pilot complicates the process, and there is a risk that the pilot may get caught in the pilot hole when pulling up the pilot. However, if the position adjustment is performed by using the dimensional inspection using the image sensor as described above, a complicated process can be omitted, and the time and cost required for manufacturing the partial plating material can be reduced.

Hereinafter, an embodiment of the strip-shaped material to be plated to which the mask layer is attached will be described with reference to FIG.
As shown in FIG. 8, the mask layer 110 is attached to the upper surface of the strip-shaped material to be plated 300. Since the mask layer 110 has a plurality of openings 130, the plating film can be formed only on the portion of the strip-shaped material to be plated 300 corresponding to the openings 130.
In the present embodiment, the shape of the opening 130 formed in the mask layer 110 is the same shape (round shape), but each may be different in shape according to the shape of the plating film to be formed. The portions may have the same shape.

Then, a plating film is formed on the strip-shaped material to be plated 300 to which the mask layer 110 is attached. As the apparatus used for forming the plating film, any device that can continuously form the plating film by continuously feeding the strip-shaped material to be plated in the longitudinal direction can be preferably used. Further, as the plating method, any of a method of immersing in a plating layer, a method of spraying, and a method of performing electroless plating can be preferably used.
As described above, the method for producing the partial plating material of the present embodiment is already possessed by the user because the plating film can be formed at a required position of the material to be plated without selecting the method for forming the plating film. Plating equipment can be used and it is very economical.

Further, by changing the size, shape, spacing, etc. of the openings 130 of the mask layer 110, the size, shape, spacing, etc. of the plating film to be formed can be easily changed. That is, for example, as disclosed in FIG. 4, each opening having a different shape, size, and spacing, such as a mask sheet 100 having a mask layer 110 having openings 130a, 130b, 130c, and 130d having different shapes. By using the mask sheet 100 having the mask layer 110 having the above-mentioned, plating films having different shapes, sizes and intervals corresponding to the respective openings can be partially formed on the surface of the material to be plated. it can.
As described above, in the method for producing the partial plating material of the present embodiment, the shape of the plating film and the like can be appropriately changed only by changing the shape of the opening of the mask layer, and the opening formed in the mask layer, for example. Since it is possible to easily change the shape and the like of the above, and only a part of the shape, it can be suitably used for the production of prototypes and small lot parts.

Further, in the present embodiment, the plating film formed at a position corresponding to the plurality of openings may be one or more layers.
Examples of the method of forming the plating film into a plurality of layers (multilayer plating) include a method of forming a plating film on a strip-shaped material to be plated 300 to which the mask layer 110 is attached a plurality of times. At this time, the metals forming the plating film forming each layer may be the same or different. That is, for example, the plating film of the first layer can be formed using nickel, and the plating film of the second layer can be formed using gold. The plating film of the first layer and the plating film of the second layer can be continuously formed.
As described above, the method for producing a partial plating material of the present embodiment can easily and continuously form a plurality of layers of plating films with high accuracy.

Further, as described above, in the present embodiment, the mask layer 110 can be attached to an arbitrary position of the strip-shaped material to be plated 300. Therefore, for example, the mask layer 110 is attached to a part of the strip-shaped material to be plated 300, and a mask sheet having no opening is attached to the other part to form a plating film made of nickel, and then the opening. A step of peeling off a mask sheet having no portion and attaching a mask layer (not shown) having another opening to the portion to further form a plating film made of silver can be performed. In the partial plating material produced in this manner, a part of the plating film is a multi-layer plating film in which the first layer is a nickel plating film and the second layer is a silver plating film, and some other plating layers are silver. It can be a single-layer plating film of a plating film.
As described above, the mask layer 110 to be attached to the surface of the strip-shaped material to be plated 300 does not have to cover all of the strip-shaped material to be plated 300, does not have to be continuously attached, and further, a plurality of masks. Layers (mask sheets with) can also be used.

Then, a desired plating film is formed, and the mask layer 110 (or another mask sheet or other mask layer) is peeled off from the strip-shaped material to be plated 300.

In the present embodiment, the mask layer 110 is formed with the positioning hole 140, but the mask layer 110 without the positioning hole 140 may be used.

A partial plating material 400 manufactured by forming the plating film on a strip-shaped material to be plated 300 to which the mask layer 110 shown in FIG. 8 is attached will be described with reference to FIG.

As shown in FIG. 9, a plating film 410 is formed on the upper surface of the partial plating material 400 only at a portion corresponding to the plurality of openings 130 of the mask layer 110.
The plating film 410 may be formed of the same metal or may be formed of different metals.
Further, the plating film 410 may be one layer or a plurality of layers, and further, among the plating films 410, although the plating film 410 is a plurality of layers, the metal constituting each layer may be the same, or different metals. It may be.

In the present embodiment, the plating film 410 is formed on one side of the strip-shaped material to be plated 300 (partial plating material 400), but it goes without saying that the same plating film may be formed on both sides thereof.

Further, the partial plating method according to the present embodiment can be performed by the same procedure as described above.

<Second embodiment>
The strip-shaped material to be plated and the mask layer used in the method for producing the partial plating material according to the present embodiment may be the same as or different from those used in the first embodiment. Can also be used.

In the method for producing a partial plating material of the present embodiment, first, a mask layer is attached to at least one surface of the strip-shaped material to be plated. The surface of the strip-shaped material to be plated to which the mask layer is attached is arbitrarily selected, and may be either single-sided or double-sided.
The strip-shaped material to be plated and the mask layer can be attached and positioned in the same manner as in the first embodiment.

Then, in the present embodiment, the second mask sheet is attached on an arbitrary opening among the plurality of openings of the mask layer.
As the second mask sheet, a strip-shaped one is preferably used. The second mask sheet may have the same configuration as the mask layers 110 and 210, the protective layer 120, the first protective layer 220, and the second protective layer 230.
Further, the second mask sheet has an adhesive layer made of an adhesive. The thickness of the second mask sheet can be changed as appropriate.
Further, the material for forming the adhesive layer is not particularly limited, and any material can be appropriately used as long as the second mask sheet and the mask layer can be brought into close contact with each other and can be peeled off after the plating film is formed. it can.
The width of the second mask sheet in the lateral direction can be adjusted as appropriate as long as it can cover any opening of the mask layer.

Further, the second mask sheet may or may not have the opening as long as it can cover an arbitrary opening among the plurality of openings of the mask layer. Further, any opening of the mask layer may be covered at an arbitrary position, and may not be entirely covered.
When an opening is formed in the second mask sheet, a positioning hole for aligning with the strip-shaped material to be plated and the mask layer may be formed.

An embodiment of the strip-shaped material to be plated to which the mask layer and the second mask sheet are attached will be described with reference to FIG.
As shown in FIG. 10, the mask layer 110 is attached to the upper surface of the strip-shaped material to be plated 300. The mask layer 110 has a plurality of openings 130a, 130b, 130c, 130d. A second mask sheet 500 is attached on the openings 130a and 130d of the mask layer 110.

Then, a plating film is formed on the strip-shaped material to be plated 300 to which the mask layer 110 and the second mask sheet 500 are attached. As the apparatus and plating method used for forming the plating film, the same apparatus and method as in the first embodiment can be used.

Next, the second mask sheet 500 is peeled off, and a plating film is formed again on the strip-shaped material to be plated 300 from which the second mask sheet 500 has been peeled off. The above-mentioned plating apparatus and plating method can be used for forming this plating film. In forming the plating film, it is preferable to use a metal different from the metal constituting the previously formed plating film. That is, for example, nickel can be used in the formation of the first plating film, and gold can be used in the formation of the second plating film.

Next, the mask layer 110 is peeled off.

In the partial plating material 600 produced in this manner, as shown in FIG. 11, for example, a part of the plating film has a nickel plating film as the first layer and a gold plating film as the second layer. A part of the other plating layer can be a single-layer plating film of a gold plating film.
That is, the plating films 610a and 610d of FIG. 11 have a nickel plating film as the first layer and a gold plating film as the second layer, and the plating films 610b and 610c are single layer plating films of the gold plating film. be able to.

After the second plating film forming step, the third plating film forming step may be performed using yet another metal before the mask layer 110 is peeled off.

Further, in the present embodiment, a step of attaching the second mask sheet 500, a step of forming a plating film on the surface of the strip-shaped material to be plated 300 to which the second mask sheet 500 is attached, and a second mask sheet. The step of peeling off the 500 may be performed a plurality of times.
That is, for example, the second mask sheet 500 is attached to an arbitrary opening among the plurality of openings 130a, 130b, 130c, 130d of the mask layer 110, and the mask layer 110 and the second mask sheet 500 are attached. A plating film is formed on the strip-shaped material to be plated 300, the second mask sheet 500 is peeled off, and then another second mask sheet (not shown) is applied to the plurality of openings of the mask layer 110. Stick on any opening. Then, a plating film is formed again on the strip-shaped material to be plated 300.
After that, another second mask sheet may be peeled off to further form a plating film on the strip-shaped material to be plated 300.
As described above, the method for producing the partial plating material of the present embodiment can be easily performed by using the second mask sheet 500 and the other second mask sheet, and easily by using the conventional plating apparatus and plating method. A plating film of any metal and any number of layers can be formed at an arbitrary position of the strip-shaped material to be plated 300.

Further, as described above, since the opening can be formed in the second mask sheet 500, for example, the second layer plating film having a slightly smaller shape or a different shape is formed on the first layer plating film. It is also possible to form.
In this case, the shape of the plating film and the like can be appropriately changed only by changing the shapes of the openings of the mask layer 110 and the second mask sheet 500, and for example, the mask layer 110 and / or the second mask sheet 500 can be changed. Since the shape of the formed opening and the like can be easily changed from the middle, and only a part thereof can be easily changed, it can be suitably used for the production of prototypes and small lot parts.

In the present embodiment, the plating films 610a, 610b, 610c, and 610d are formed on one side of the strip-shaped material to be plated 300 (partial plating material 600), but similar plating films may be formed on both sides thereof. Of course.

Further, the partial plating method according to the present embodiment can be performed by the same procedure as described above.

<Modified example of the second embodiment>
A modified example of the method for producing the partial plating material according to the second embodiment will be described with reference to FIGS. 12 to 15. In this modification, the plurality of second mask sheets can be attached on any of the plurality of openings of the mask layer.

First, as shown in FIG. 12, a mask layer 710 having a plurality of openings 730a, 730b, 730c, 730d, and 730e is attached to the upper surface of the strip-shaped material to be plated 300, and the openings 730a of the mask layer 710 are attached. The second mask sheet 500 is attached on the 730d, and the second mask sheet 800 is attached on the openings 730b and 730e of the mask layer 710.
The mask layer 710 can have the same configuration as the mask layers 110 and 210. Further, the second mask sheet 800 can have the same configuration as the second mask sheet 500.
Further, in the present embodiment, although the mask layer 710 does not have the positioning holes, the mask layer 710 in which the positioning holes are appropriately formed may be used. The same applies to the second mask sheets 500 and 800.

Then, in a state where the mask layer 710 is attached on the strip-shaped material to be plated 300 and the second mask sheets 500 and 800 are attached on the mask layer 710, a plating film using, for example, copper is used on the strip-shaped material to be plated 300. To form.
At this point, as shown in FIG. 13, a plating film 910c (single layer of copper) is formed at a position corresponding to the opening 730c in the strip-shaped material to be plated 300. The plating adhering to the second mask sheets 500 and 800 is not shown.

Next, the second mask sheet 500 is peeled off, and a plating film is formed on the strip-shaped material to be plated 300 from which the second mask sheet 500 has been peeled off, for example, using nickel.
At this point, as shown in FIG. 14, the plating film 910c formed at a position corresponding to the opening 730c in the strip-shaped material to be plated 300 becomes a two-layer plating film of copper and nickel, and the opening 730a, Plating films 910a and 910d (single layer of nickel) are formed at positions corresponding to 730d. The plating adhering to the second mask sheet 800 is not shown.

Then, the second mask sheet 800 is peeled off, and a plating film is formed on the strip-shaped material to be plated 300 from which the second mask sheet 800 has been peeled off, for example, using gold.

Next, the mask layer 710 is peeled off.

In the partial plating material 900 manufactured in this modification, as shown in FIG. 15, the plating film 910c has three layers of copper, nickel and gold, and the plating films 910a and 910d have two layers of nickel and gold. Further, plating films 910b and 910e (single layer of gold) are formed at positions corresponding to the openings 730b and 730e.

As described above, in this modification, different metals were used in the first, second, and third plating film forming steps, but the same metal, or at least one of them, was used as a different metal in all three times. You can also do it.
As described above, in this modification, the constituent metal of the plating film of the partial plating material can be easily changed.

Further, the partial plating method according to this modification can be performed by the same procedure as described above.

<Third embodiment>
The strip-shaped material to be plated and the mask layer used in the method for producing the partial plating material according to the present embodiment are different even if they are the same as those used in the first embodiment and the second embodiment. However, any of them can be used.

The method for producing the partial plating material according to the present embodiment will be described with reference to FIGS. 16 to 18.

First, as shown in FIG. 16, a mask layer 1010 having a plurality of openings 1030 is attached to at least one surface of the strip-shaped material to be plated 300. The surface of the strip-shaped material to be plated 300 to which the mask layer 1010 is attached is arbitrarily selected, and may be either single-sided or double-sided.
The strip-shaped material to be plated 300 and the mask layer 1010 can be attached and positioned in the same manner as in the first embodiment and the second embodiment. In the present embodiment, the strip-shaped material to be plated 300 is attached so as to cover the entire surface.
Further, the mask layer 1010 can have the same configuration as the mask layers 110, 210, 710.
In the present embodiment, the mask layer 1010 does not have a positioning hole, but the mask layer 1010 which has a positioning hole may be used as appropriate.

Then, a plating film is formed on the strip-shaped material to be plated 300 to which the mask layer 1010 is attached. As the apparatus and plating method used for forming the plating film, the same apparatus and method as those of the first embodiment and the second embodiment can be used. In this embodiment, for example, nickel is used to form a plating film.
Furthermore, a plating film is formed on the strip-shaped material to be plated 300. In this embodiment, for example, gold is used to form a plating film.

Then, the mask layer 1010 is peeled off.

At this point, as shown in FIG. 17, a plating film 1210 (two layers of nickel and gold plating) is formed at a position corresponding to the opening 1030 in the strip-shaped material to be plated 300.

Next, the mask layer 1110 having the opening 1130 is attached to the strip-shaped material to be plated 300.
The strip-shaped material to be plated 300 and the mask layer 1110 can be attached and positioned in the same manner as in the first embodiment and the second embodiment. In the present embodiment, the strip-shaped material to be plated 300 is attached so as to cover the entire surface.
Further, the mask layer 1110 can have the same configuration as the mask layers 110, 210, 710, 1010.
In the present embodiment, the mask layer 1110 does not have a positioning hole, but a mask layer 1110 having a positioning hole may be used as appropriate.

Then, the plating film is formed again on the strip-shaped material to be plated 300 to which the mask layer 1110 is attached. The above-mentioned plating apparatus and plating method can be used for forming this plating film. In this embodiment, for example, copper is used to form a plating film.
Furthermore, a plating film is formed on the strip-shaped material to be plated 300. In this embodiment, for example, tin is used to form a plating film.

Next, the mask layer 1110 is peeled off.

In the partial plating material 1200 manufactured in the present embodiment, as shown in FIG. 18, the plating film 1210 has two layers of nickel and gold, and the plating film 1220 (copper and copper) is located at a position corresponding to the opening 1130. Two layers of tin) will be formed.

As described above, the method for producing the partial plating material of the present embodiment is an arbitrary method of strip-shaped material to be plated 300 by using the mask layers 1010 and 1110, easily and by using the conventional plating apparatus and plating method. A plating film of any metal and any number of layers can be formed at the position.

Further, as described above, since the opening can be formed in the second mask sheet 500, for example, the second layer plating film having a slightly smaller shape or a different shape is formed on the first layer plating film. It is also possible to form.
In this case, the shape of the plating film can be appropriately changed by simply changing the shape of the openings of the mask layers 1010 and 1110, and for example, the shape of the openings formed in the mask layers 1010 and 1110 can be changed from the middle. Since it is possible to easily change only a part of the parts, it can be suitably used for the production of prototypes and small lot parts.

In the present embodiment, the plating films 1210 and 1220 are formed on one side of the strip-shaped material to be plated 300 (partial plating material 1200), but it goes without saying that similar plating films may be formed on both sides thereof.

Further, the partial plating method according to the present embodiment can be performed by the same procedure as described above.

Mask sheet ... 100,200
Mask layer ... 110, 210, 710, 1010, 1110
Protective layer ... 120
First protective layer ... 220
Second protective layer ... 230
Openings: 130, 130a, 130b, 130c, 130d, 240, 730a, 730b, 730c, 730d, 730e, 1030, 1130
Positioning holes ... 140, 250
Strip-shaped material to be plated ... 300
Partial plating material: 400, 600, 900, 1200
Plating film: 410, 610a, 610b, 610c, 610d, 910a, 910b, 910c, 910d, 910e, 1210, 1220
Second mask sheet ... 500,800

Claims (12)

A method for producing a mask sheet having a mask layer and a protective layer formed on the mask layer.
A manufacturing method for forming a plurality of openings corresponding to positions where a plating film is formed on a strip-shaped material to be plated on the mask layer and the protective layer after the mask layer and the protective layer are bonded together.
The plurality of openings may have the same shape or different shapes.
A method for producing a mask sheet, wherein the protective layer is peeled off from the mask layer at the same time or after the mask layer is attached to the strip-shaped material to be plated. A method for producing a mask sheet having a mask layer, a first protective layer formed on the mask layer, and a second protective layer formed on the surface of the mask layer opposite to the surface on which the protective layer is formed. There,
Manufacture of forming a plurality of openings corresponding to positions where a plating film is formed on a strip-shaped material to be plated on the mask layer and the first protective layer after the mask layer and the first protective layer are bonded together. Is the way
The plurality of openings may have the same shape or different shapes.
The second protective layer is peeled off from the mask layer at the same time or before the mask layer is attached to the strip-shaped material to be plated, and the first protective layer is formed by applying the mask layer to the strip-shaped material to be plated. A method for producing a mask sheet that is peeled off from the mask layer at the same time or after the application. A step of attaching a mask layer of a mask sheet manufactured by the manufacturing method according to claim 1 or 2 to an arbitrary position on at least one surface of the strip-shaped material to be plated.
A step of forming a plating film on at least the surface of the strip-shaped material to be plated to which the mask layer is attached, and
A method for producing a partial plating material, which comprises a step of peeling off the mask layer.
The plating film formed at a position corresponding to a plurality of openings of the mask layer is one or more layers.
A method for producing a partial plating material for continuously forming the plating film on the strip-shaped material to be plated by continuously feeding the strip-shaped material to be plated in the longitudinal direction in the step of forming the plating film. The method for producing a partial plating material according to claim 3, wherein the metal constituting the plating film formed at positions corresponding to the plurality of openings may be the same metal or a different metal. The plating film formed at a position corresponding to the plurality of openings has two or more layers.
The method for producing a partial plating material according to claim 3 or 4, wherein the metal constituting each layer of the plating film may be the same metal or a different metal. Further, a step of attaching a second mask sheet onto an arbitrary opening among the plurality of openings of the mask layer, and
A step of forming a plating film on at least the surface of the strip-shaped material to be plated to which the second mask sheet is attached, and
It has a step of peeling off the second mask sheet.
A step of attaching the second mask sheet, a step of forming a plating film on at least the surface of the strip-shaped material to be plated to which the second mask sheet is attached, and a step of peeling off the second mask sheet. The method for producing a partial plating material according to any one of claims 3 to 5, wherein each of the above is performed once or more. In the step of forming a plating film on at least the surface of the strip-shaped plating material to which the second mask sheet is attached, the strip-shaped plating is continuously fed in the longitudinal direction to continuously feed the strip-shaped plating. The method for producing a partially plated material according to claim 6, wherein the plating film is formed on the material. A step of attaching the mask layer of the mask sheet manufactured by the manufacturing method according to claim 1 or 2 to an arbitrary position on at least one surface of the strip-shaped material to be plated.
A step of forming a plating film on at least the surface of the strip-shaped material to be plated to which the mask layer is attached, and
A partial plating method including a step of peeling off the mask layer.
The plating film formed at a position corresponding to the plurality of openings has one or more layers.
A partial plating method for continuously forming the plating film on the strip-shaped material to be plated by continuously feeding the strip-shaped material to be plated in the longitudinal direction in the step of forming the plating film. The partial plating method according to claim 8, wherein the metal constituting the plating film formed at positions corresponding to the plurality of openings may be the same metal or different metals. The plating film formed at a position corresponding to the plurality of openings has two or more layers.
The partial plating method according to claim 8 or 9, wherein the metal constituting each layer of the plating film may be the same metal or a different metal. Further, a step of attaching a second mask sheet onto an arbitrary opening among the plurality of openings of the mask layer, and
A step of forming a plating film on at least the surface of the strip-shaped material to be plated to which the second mask sheet is attached, and
It has a step of peeling off the second mask sheet.
A step of attaching the second mask sheet, a step of forming a plating film on at least the surface of the strip-shaped material to be plated to which the second mask sheet is attached, and a step of peeling off the second mask sheet. The partial plating method according to any one of claims 8 to 10, wherein each of the above is performed once or more. In the step of forming a plating film on at least the surface of the strip-shaped plating material to which the second mask sheet is attached, the strip-shaped plating is continuously fed in the longitudinal direction to continuously feed the strip-shaped plating. The partial plating method according to claim 11, wherein the plating film is formed on the material.

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