JP2014045221A - Manufacturing method of flexible printed wiring board sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of FPC which allows for quality evaluation and condition change in the way of process while ensuring high manufacturing efficiency, and which does not require an uncurling process.SOLUTION: A manufacturing method of flexible printed wiring board includes a step for winding a sandwich film 60, which is formed by sandwiching a base material sheet 30b of an intermediate product by long films R1, R2, around a roll by pinching and sticking the long films from above and below while conveying the base material sheet, a step for processing the sandwich film while feeding, and a step for individualizing the base material sheet. In the step for processing the sandwich film, a through hole is made through the base material sheet by boring the sandwich film.

Description

  The present invention relates to a method for producing a flexible printed wiring board sheet.

A flexible printed wiring board (hereinafter referred to as a “magnetic head wiring board”) in which a supporting metal foil for supporting a magnetic head of a hard disk device and wiring for signal transmission are integrated is information such as a perpendicular magnetic recording system. Demand is further increasing with increasing density. In order to manufacture such a magnetic head wiring board in a large amount with high efficiency, it is not appropriate to batch-process a sheet containing several tens of the magnetic head wiring boards one by one. For this reason, a very long base material is supplied to the processing unit, the base material processed there is wound around a roll, and a roll-shaped base material is supplied to the next processing unit (roll-to-roll method) ) Has been disclosed (Patent Document 1). With this method, when the magnetic head wiring board is mass-produced, the manufacturing efficiency can be improved as compared with the batch processing method.
JP 2003-129282 A

According to the roll-to-roll method, there are factors that can improve the production efficiency, but there are the following problems.
(1) Quality evaluation or observation in an intermediate process is not possible. In addition, it is not possible to change the conditions in the intermediate process based on that.
(2) The roll has wrinkles on the sheet and requires a step for flattening.
The above (1) and (2) are production efficiency and quality degradation factors inherent to the roll-to-roll system. For this reason, it has been desired to develop a mass production method without the above-mentioned problems while obtaining a high production efficiency.
The present invention provides a method for producing a flexible printed wiring board sheet that can be subjected to quality evaluation in the middle of the process while obtaining a high production efficiency, and conditions can be changed corresponding to the result, and a process for correcting curl is unnecessary. The purpose is to do.

  The manufacturing method of the flexible printed wiring board sheet | seat of this invention is a manufacturing method of the flexible printed wiring board sheet | seat containing a some flexible printed wiring board. In this manufacturing method, a plurality of intermediate product base sheets before being completed as flexible printed wiring board sheets are conveyed in rows, from above and below the base sheet, and bonded with a long film, In a sandwich film, a step of winding a roll in the state of a sandwich film of a long film / a plurality of substrate sheets / a long film, a step of processing the sandwich film while unwinding the sandwich film from the roll, The step of separating the long film from the base material sheet and individualizing the base material sheet, and in the step of processing the sandwich film, the base material sheet is perforated through the sandwich film, Make a through hole in

According to the above method, among all the steps from the initial state of the base material sheet as a raw material to the end of processing, a process with better production efficiency is achieved by processing in the form of a sandwich film, and The process can be divided into processes that are more convenient to be processed in the form, and the process can proceed in an appropriate form. For example, after quality evaluation is performed in the form of an individual base sheet, the conditions can be changed to an appropriate one in processing with a long sandwich film. Thereby, according to the quality state in the middle of manufacture of a base material sheet, the manufacturing conditions in processing with a long sandwich film can be set flexibly.
Also, individual sheets are sandwiched between long films and wound on rolls, and after a predetermined treatment, the long rolls are peeled off and individual sheets are individualized. This step is unnecessary.
Furthermore, the length of the production line can also be shortened compared to a complete long continuous process. For this reason, it is easy to deal with the place restrictions of the factory.
The term “roll” represents a film wound in a roll shape, a roll core part for winding a long film around the roll, a cylindrical body or a columnar body for applying pressure to the long film, and the like. The term “roll” should be appropriately interpreted in accordance with the spirit of the present invention and in accordance with common sense. In addition, processing and processing (processing described later) are also used as words that mean the same thing.

  In the step of processing the sandwich film, a hole is formed through the sandwich film to form a through hole in the base sheet. As a result, holes such as alignment holes (reference holes) serving as a reference for processing can be efficiently formed.

You may pattern-process with respect to this long resist film by making at least one of said long film into a long resist film. And after a patterning process, an etching process or a plating process, or an etching process and a plating process can be performed with respect to the said base material sheet in a sandwich film.
As a result, an improvement in production efficiency can be obtained. For example, since a resist pattern is used for processing other than the hole punching process on the base sheet, for example, the formation of the first resist film is performed at once by bonding of a long resist film. Efficiency can be improved by this point alone. The upper and lower long films described above may be a long resist film, depending on the case, depending on the structure of the flexible printed wiring board sheet that is the product. .

After individualizing the base sheet, before forming a new roll of sandwich film, quality assessment is performed on the individual base sheet to make the conditions appropriate for processing in the new sandwich film. It may be changed.
Thereby, quality evaluation or observation in an intermediate process can be performed, and based on this, conditions in the second process can be changed to an appropriate one.

Process the above individualized base sheet, then sandwich the base sheet with a new long film to create a new sandwich film roll, while feeding out the new sandwich film roll After processing the base material sheet, the base material sheet may be individualized and the personalized base material sheet may be processed.
As a result, in the case of a product that cannot be completed unless complicated processing is performed, the manufacturing efficiency can be increased while obtaining a highly reliable product. For example, in the case of a product in which a plurality of processes (first and second processes) such as an etching process and a plating process are performed in different parts, it is necessary to form the first and second resist patterns before each process. The formation of the first resist pattern for the first treatment and the first treatment are performed in one continuous sandwich film state. Then, a long film peels and a base material sheet is individualized. At this time, quality inspection can be performed on an individual base sheet, and a change in subsequent processing conditions is set according to the quality state. Thereafter, a second resist pattern is formed for the second treatment. In that case, a long film is used to form a sandwich film again. And a 2nd process can be performed in a sandwich film state. And after this 2nd process, a base material sheet is individualized.
A combination of processing with a sandwich film and processing with an individual substrate sheet is not limited to one in the processing flow, but can be performed multiple times to perform extremely complicated processing. Necessary products can be efficiently and of high quality. The above-mentioned long film may be a long resist film of the upper and lower long films in both the first process and the second process, but the magnetic head wiring board and the like are both in the first process and the second process. It is appropriate to use a long resist film on both the upper and lower sides.
Although it may be repeated, in the case of the method of manufacturing a magnetic head wiring board, the above-described process performed a plurality of times can be rephrased as follows. :
A method for manufacturing a flexible printed wiring board sheet including a plurality of magnetic head wiring boards, wherein a plurality of intermediate sheets of the flexible printed wiring board sheet are conveyed in a row while the upper and lower sides of the base sheet From at least one of them as a long resist film, sandwiched and bonded by a long film, and wound around a roll in the state of a long film / a plurality of base sheet / long film sandwich;
A step of processing the sandwich film and the base sheet while feeding the sandwich film from the roll; and peeling the long film of the sandwich film from the base sheet; A step of individualizing and a step of processing the individualized base sheet, and a first step from the roll winding step of the sandwich film to the processing of the individualized base sheet As a second step, further, a step of winding a new sandwich film containing the base sheet on a roll, a step of processing the base sheet in the new sandwich film, and individualizing the base sheet And a step of processing the individualized base sheet are added one or more times.

  The substrate sheet can be a wiring board including a metal foil for elastic support for a magnetic head of a hard disk device. As a result, a flexible printed wiring board in which a magnetic head support (such as stainless steel foil) and a wiring board that require complicated and precise processing can be efficiently manufactured while maintaining high quality.

An apparatus for manufacturing a flexible printed wiring board sheet described as a reference manufactures a flexible printed wiring board sheet including a plurality of flexible printed wiring boards. This manufacturing apparatus is bonded to a base sheet, which is an intermediate product of a flexible printed wiring board sheet, so as to be sandwiched between a plurality of upper long films and a lower long film. An apparatus for producing a sandwich film composed of a long film / a plurality of substrate sheets / a long film is provided. The sandwich film manufacturing apparatus includes a transport line for transporting a plurality of substrate sheets in a row, and a pair of rolls having axes on the upper side and the lower side of the transport line, with the roll axes parallel to each other. The upper and lower pressing rolls for bonding the upper and lower long films against the base sheet while the long films supplied from the upper and lower sides are moved along the transport line by the roll surface, and the long films are supplied. Therefore, the upper and lower roll support shafts, which are positioned at the upper and lower positions far from the upper and lower pressing rolls as viewed from the conveyance line and rotatably support the raw roll film, and the pressing rolls It is provided with the winder which is located in a back | latter stage and winds up a sandwich film on a roll.
Moreover, since it is a sandwich form in which the base sheets arranged in a row are sandwiched between long films, the curl is not firmly attached, and there is no need for a flattening process.

  A support shaft that rotatably supports the roll in order to feed the sandwich film out of the roll of the sandwich film, and a drilling device that aligns the punched-out sandwich film and opens a through hole. it can. As a result, drilling and the like can be performed efficiently.

  Further, with at least one of the upper and lower long films as a long resist film, a support shaft that rotatably supports the roll to roll out the sandwich film from the roll of sandwich film, and the sandwich film that has been fed out, And an exposure alignment holding unit that holds the alignment for exposure for forming the resist pattern. Thus, by using a long film as a resist film, the resist film can be formed on the upper and lower surfaces at once by eliminating a plurality of steps for applying the resist solution to the upper and lower surfaces. In addition, after the resist pattern is formed, the substrate sheets arranged in a row in the sandwich film can be successively processed. As a result, the production efficiency can be increased.

  Continuously peeling the long film from the base sheet and performing individualization on the base sheet in a subsequent stage for performing a predetermined treatment on the base sheet in the sandwich film, Can be further provided. This makes it possible to efficiently carry out sandwich film formation → individualization of base sheet. And since said apparatus structure can be made simple, it becomes possible to pursue the high manufacturing efficiency over the whole process process.

  According to the present invention, it is possible to obtain a method for producing a flexible printed wiring board sheet that is capable of quality evaluation in an intermediate process and a condition change corresponding to it while obtaining a high production efficiency and that does not require a curl correction process.

(Embodiment 1)
FIG. 1 is a plan view showing a flexible printed wiring board sheet 30 according to Embodiment 1 of the present invention. Here, the flexible printed wiring board is abbreviated as FPC, and the flexible printed wiring board sheet is abbreviated as FPC sheet. The entire FPC sheet 30 is rectangular, and a plurality of FPCs 10 are formed in the product area inside the outer frame. The FPC 10 is a magnetic head wiring board in which a supporting metal foil and a signal transmission wiring are integrated. In FIG. 1, the FPC sheet 30 is provided with a plating frame 21 that conducts when plating is performed.
In FIG. 1, the wiring 11 of the FPC 10 is indicated by one thick line, but more specifically, as shown in FIG. 2, for example, three or more conductors are arranged in parallel. The wiring 11 is arranged so that the tip part is bent and the bent parts are opposed to form a pair. A plating lead portion 11 k is provided extending from the wiring 11, and the plating lead portion 11 k is connected to the plating frame 21. The wiring 11 / plating lead part 11k / plating frame 21 is located in the wiring layer which is the same layer (height, thickness direction position) in FIG. 1 and FIG.
In order to explain the subsequent processing, a gold plating region (G region) is introduced in advance.
(G region): In the G region, a gold plating layer is formed for connection to the wiring 11. The insulating cover layer 9 is located on the other wiring layer, but the insulating cover layer 9 is removed at the gold-plated portion for connection. In the G region, the stainless steel foil in the predetermined region is cut out.

FIG. 3 is a view showing a sandwich film manufacturing apparatus 50 which is a core apparatus included in the FPC sheet manufacturing apparatus of the present invention. In FIG. 3, the base material sheet 30 b at the stage of the intermediate product before being completed as an FPC sheet is transported by the transport device 51. As the transport device 51, any existing device that transports a sheet-like material can be used. For example, it may be a plurality of rollers arranged along the transport direction. The conveyance line is formed by connecting a central portion in plan view of a workpiece tangent (surface) on which the conveyance device supports the base sheet 30b.
The upper and lower pressing rolls 55 are positioned so as to sandwich the base sheet 30b on the transport line with the roll axes parallel to each other above and below the transport line. A long film is wound around the roll surface of the pressing roll 55 from the rolls of the long films R1 and R2 supported by the roll support shaft 57 so that the long films R1 and R2 follow the transport line. To. Since force is applied to the pressing rolls in a direction to shorten the distance between the axes, the shafts of the pressing rolls are preferably arranged so as to be movable in the vertical direction.
The long films R1 and R2 are both resist long films and are usually sold in the form of rolls. The roll support shaft 57 is a shaft that freely supports a roll-shaped resist film distributed from a vendor in a sandwich film manufacturing apparatus. The roll support shaft 57 may be horizontally fixed to a support frame or a wall standing on the floor, or may be a suspension support in which the roll support shaft is supported horizontally at both ends in a swing shape and suspended. The long resist films R1 and R2 are drawn from the rolls supported by the respective roll support shafts 57 toward the pressing roll 55 and wound around the roll surface of the pressing roll 55 in an arc shape. An adhesive is applied to the long resist films R1 and R2, and the adhesive layer faces the base sheet 30b. The long resist films R1 and R2 are bonded to the base sheet 30b through the adhesive layer by the pressing roll 55, and the sandwich film 60 is composed of the long film R1 / base sheet 30b / long film R2. To be. In the sandwich film 60, a plurality of individual substrate sheets 30b are arranged in a line and sandwiched between the long resist films R1 and R2.
The sandwich film 60 is wound up by a winder (winding roll) 53 and rolled. The roll of the sandwich film 60 is sent to the next resist pattern forming step (first time).
The process of forming the sandwich film 60 using the above sandwich film manufacturing apparatus 50 is used a plurality of times in the subsequent processes for completing the FPC sheet 30. The more the post-process, the more processing is added to the base material sheet 30b of the intermediate product.

Next, the content of the above-mentioned base material sheet 30b is demonstrated concretely. FIG. 4A shows a state where a polyimide insulating layer 2 is formed on the stainless steel foil 1. The stainless steel foil 1 is used to elastically support a magnetic head (not shown) while slightly floating from the disk surface, and requires a predetermined elastic modulus.
Next, as shown in FIG. 4B, a conductor thin film 3 is formed on the polyimide layer 2 by electroless plating. The conductive thin film 3 becomes a base conductive layer for forming the wiring 11 by electroplating. This stainless steel foil 1 / polyimide layer 2 / conductor thin film 3 is the content of the base material sheet 30b when the sandwich film 60 is first formed. That is, in the first sandwich film forming step, the base sheet 30b having the cross section of FIG. 4B is conveyed on the conveying device 51 shown in FIG.
FIG. 4C is a cross-sectional view showing the sandwich film 60 manufactured by the sandwich film manufacturing apparatus 50. However, the sandwich film 60 having the content shown in FIG. 4C is the sandwich film 60 produced first (first time) in the FPC sheet manufacturing process as described above.

FIG. 5 is a diagram illustrating a cross section of the sandwich film 60 after a series of processing is performed on the sandwich film 60 until the long resist films R1 and R2 are peeled off.
FIG. 5A is a view showing a state in which resist films R1 and R2 of the sandwich film 60 in the state of FIG. 4C are exposed and developed to form a resist pattern. The resist pattern has a pattern for etching the stainless steel foil 1 and forming the wiring 11 by plating.
An apparatus for forming this resist pattern is shown in FIGS. A roll support shaft 61a for feeding the sandwich film 60 out of the roll is provided. As shown in FIG. 6A, the unwound sandwich film 60 is exposed by UV irradiation through a reticle (not shown) in an exposure device 62. At this time, an exposure alignment holding unit 62a that aligns and holds the sandwich film 60 is used so that a predetermined region of the base sheet 30b of the sandwich film 60 is exposed. During the exposure, the sandwich film 60 stops moving. When one exposure is completed, the sandwich film 60 is advanced by that amount for the next area exposure. Since this is repeated, the sandwich film 60 moves intermittently. That is, it progresses or stops. During this time, the roll winding shaft 61b winds the sandwich film 60 while intermittently rotating and stopping.
Next, as shown in FIG. 6B, the exposed sandwich film fed from the support shaft 61 c is developed through the developer tank 63. Thereafter, the cleaning / drying device 64 is passed through, leaving a predetermined portion, and unnecessary portions are removed, and patterning is completed. During this time, the sandwich film 60 is advanced at a constant speed so that each processing region passes for a certain period of time. In the exposure step of FIG. 6A and the development, washing and drying steps of FIG. 6B, the progress of the sandwich film 60 is one (exposure) is intermittent and the other (development etc.) is continuous. Since it is different, it cannot be carried out continuously, and is wound around a roll once after exposure. Then, processing such as development is performed while the sandwich film 60 is fed out from the roll at a constant speed.
A roller 65 is arranged for the driving force of the traveling movement. In FIG. 6 (b), after cleaning and drying, instead of the roller 65, a roll take-up device for temporarily stopping the processing may be used here instead of the roller 65.
The conventional mechanism in this field does not have a mechanism in which the sandwich film 60 fed out from the roll supported by the support shaft 61a is held for exposure alignment by the exposure alignment holder 62a. Is. In the sandwich film 60, the base sheet is intermittently sandwiched between the long resist films R1 and R2, and the exposure alignment holder 62a is positioned so that a predetermined area of the base sheet 30b is exposed. Hold together.

Returning to the contents of the sandwich film, FIG. 5B is a diagram showing a state in which the portion of the stainless steel foil 1 not covered with the resist film R2 is etched. FIG. 5C is a diagram showing a state in which the copper wiring 11 is formed by electrolytic plating on the portion of the conductor thin film 3 not covered with the resist film R1. Next, as shown in FIG. 5D, the resist films R1 and R2 are peeled off, and the base sheet 30b is individualized.
FIG. 7 is a view showing an apparatus for processing the sandwich film 60 from the state of FIG. 5A to the state of FIG. 5D. As described above, the sandwich film 60 including the resist pattern is formed from the roll (not shown) once wound on the roll and from the roller 65 (see FIG. 5A) when continuously processed. As shown in FIG. 5 (b), it is carried into the etching apparatus 66. In the etching device 66, an etchant for etching the stainless steel foil is emitted and etched. After etching, cleaning and drying are performed. Subsequently, it is immersed in the electroplating tank 67, the copper plating layer 11 is formed, and the state of FIG.5 (c) is implement | achieved. Subsequently, it is carried into the resist stripping device 68, and the resist films R1 and R2 are stripped. As a result, the base sheet 30b is individualized. The resist stripping device 68 may be a dry process ashing device.
The resist stripping device 68 is disposed in a subsequent stage for performing copper plating on the base sheet 30b, and strips the resist long film from the base sheet to individualize the base sheet 30b. In the subsequent stage of the apparatus for processing the base sheet 30b intermittently positioned in a row in the sandwich film, the resist long films R1 and R2 are continuously peeled off to form the base sheet 30b. The mechanism of individualizing the device has not been seen in this field.

The above processing steps correspond to the first process of sandwich film formation → patterning on a resist film → processing on a base sheet → peeling a resist film and individualizing the base sheet.
Next, as shown in FIG. 8, the exposed portion of the conductive thin film 3 is removed by etching the individual base material sheet 30b. This is preparation for forming a gold plating layer only on the wiring 11 by electroplating.

Next, as shown in FIG. 9A, the second sandwich film 60 is produced by sandwiching the base sheet 30b with the long resist films R3 and R4, and patterned on the resist films R3 and R4. To do. For the production of the sandwich film 60, a sandwich film production apparatus 50 shown in FIG. 3 is used. In FIG. 9A, the resist film R4 is patterned. Patterning is performed using the apparatus shown in FIGS. 6A and 6B as described above. The resist films R3 and R4 are the same as the resist films R1 and R2.
Next, as shown in FIG. 9B, the portion of the polyimide layer 2 exposed from the resist film R4 is removed by etching. This process is also a preparation for the gold plating process described later.
Next, as shown in FIG. 9C, the resist films R3 and R4 are peeled off, and the base sheet 30b is individualized. In this resist film peeling, the same type of device as the resist peeling device 68 in FIG. 7 can be used, but it is not desirable to share it. The individualization shown in FIG. 9C is performed after the polyimide layer 2 is etched, and it is necessary to dispose it after the polyimide etching apparatus (not shown). This is the second process of sandwich film formation → patterning on a resist film → processing on a substrate sheet → resist film peeling and substrate sheet individualization.

In the base sheet 30b in the individualized state, the gold plating layer 15 is then formed on the wiring 11 and the conductive thin film 3 as shown in FIG. In the gold plating process, a current flows through the plating frame 21 and the plating lead portion 11k shown in FIGS. That is, gold ions, which are cations, adhere to the wiring 11 and the conductive thin film 3 that are conducted to the cathode via the plating frame 21 and the plating lead portion 11k. The stainless steel foil 1 is covered with a resist film (not shown). The gold plating layer 15 is formed by the adhesion of the gold ions.
Thereafter, as shown in FIG. 10B, the FPC sheet 30 is completed by being covered with the insulating layer 9. A cross section of the G region of the FPC sheet 30 shown in FIG. 2 is displayed in FIG.

(Points in manufacturing method of FPC sheet of embodiment of present invention)
FIG. 11 is a flowchart separately showing a process with a sandwich film and a process with an individual base sheet in the embodiment of the present invention. The point is that the individual base sheet 30b is sandwiched between the resist long films to produce a sandwich film, and the processing is performed in the form of a sandwich film in the form of one continuous film, and the individual base materials The processing step of processing in the form of a sheet is to repeat the process once or twice or more. In the present embodiment, it is repeated twice as shown in FIG. With this, (e1) a sandwich film that can be seen (visually) or inspected directly, knowing the current state of the base sheet accurately, and proceeding efficiently and continuously. The processing conditions can be changed, and high efficiency and high product quality can be balanced. In addition, (e2) The use of a resist pattern is indispensable for the production of FPC. Therefore, since the first resist film is arranged at once by adhesion of a long resist film, the efficiency is limited even in terms of the arrangement of the resist film. An improvement can be obtained. (E3) From the standpoint of high efficiency, curling does not occur more strongly than in the case of a complete long continuous process, so that it is not necessary to add a process for flattening. Further, (e4) the length of the production line can be shortened as compared with a complete long continuous process in which high efficiency is pursued to the limit.
The FPC manufacturing apparatus is for realizing the above FPC manufacturing method and contributes to realizing the advantages of the above manufacturing method.

(Embodiment 2)
FIG. 12 is a diagram for explaining a method of manufacturing an FPC sheet according to Embodiment 2 of the present invention. This embodiment is characterized in that a resist film is not used for the long film. This is the same in that a long film / base sheet / long film sandwich film is formed using a long film with an adhesive and wound on a roll. In this case, patterning is not performed on the long film, and a punching process is performed to open a through hole in the sandwich film 60. There may be many holes, such as holes for alignment and holes for connection. In many cases, the hole forming process is performed at the initial stage of the base sheet, but the hole forming process may be performed at a later stage. In this case, a long resist film can be used for the long film, but since the resist film is expensive, it is possible to obtain a high production efficiency while suppressing the manufacturing cost by using a non-resist long film. .

  Although the embodiments and examples of the present invention have been described above, the embodiments and examples of the present invention disclosed above are merely examples, and the scope of the present invention is the implementation of these inventions. It is not limited to the form. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  According to the present invention, high production efficiency and high product quality can be obtained in a well-balanced manner. Wiring boards are the basic components of many electronic products, and are expected to show their power in the production of complicated and high-tech integrated wiring boards.

It is a top view which shows the FPC sheet in Embodiment 1 of this invention. It is the elements on larger scale of the wiring part in FPC of FIG. It is a figure which shows the sandwich film production apparatus in the FPC manufacturing apparatus of Embodiment 1 of this invention. It is sectional drawing of a base material sheet, (a) is the state which formed the polyimide layer on stainless steel foil, (b) is the state of the base material sheet which forms a conductor thin film on it and throws into a sandwich film preparation apparatus (C) is a figure which shows a state when the sandwich film containing a base material sheet is formed. It is sectional drawing of a sandwich film following FIG.4 (c), (a) is the state which performed the patterning process to the resist film, (b) is the state which etched stainless steel foil, (c) is electroplating. (D) is a figure which shows the state which peeled the resist film and individualized the base material sheet in the state which formed the wiring. 2 shows a part of a production line for forming a resist pattern in an FPC sheet production apparatus, where (a) shows an apparatus for performing an exposure process on a resist film, and (b) shows an apparatus for development, washing and drying. It is a figure which shows the processing apparatus which separates a resist and performs individualization of a base material sheet, after performing a copper plating process etc. with the said resist pattern to a base material sheet. It is a figure which shows the state which etched the part of the conductor thin film on the individual base material sheet. The process for the second sandwich film is shown, (a) shows the state where the resist pattern is formed, (b) shows the state where the polyimide layer has been etched, (c) shows the state where the resist is peeled and the base sheet is individualized. It is a figure which shows the state which carried out. (A) is a figure which shows the state which carried out the gold plating process to the individual base material sheet, and (b) is the state coat | covered with the insulating layer. In Embodiment 1 of this invention, it is a flowchart which shows separately the process by a sandwich film, and the process by an individual base material sheet. In Embodiment 2 of this invention, it is a flowchart which divides | segments and shows the process with an individual base material sheet | seat by carrying out the punching process to a base material sheet by the through-hole punching process with respect to a sandwich film.

1 Stainless steel foil, 2 Polyimide layer (insulating layer), 3 Conductor thin film, 9 Cover insulating layer, 10 Wiring board (FPC), 11 Wiring, 11k Plating lead part, 15 Gold plating layer, 21 Plating frame, 30 Wiring board sheet, 30b Substrate sheet (intermediate product), 50 sandwich film production device, 51 transport device, 53 winder (roll), 55 pressing roll, 57 roll support shaft, 60 sandwich film, 61a, 61b, 61c support shaft, 62 exposure Apparatus, 62a exposure alignment holding unit, 63 developing apparatus, 64 cleaning / drying apparatus, 65 driving roller, 66 etching apparatus, 67 electroplating tank, 68 resist stripping apparatus, 70 FPC manufacturing apparatus, R1, R2, R3, R4 resist Long film.

Claims (7)

A method for producing a flexible printed wiring board sheet including a plurality of flexible printed wiring boards,
A plurality of substrate sheets of intermediate products of the flexible printed wiring board sheets are conveyed in a row, and are sandwiched and bonded by a long film from the top and bottom of the substrate sheet, and then a long film / a plurality of substrate sheets / Winding the roll in the state of a sandwich film of long film,
A step of processing the sandwich film while unwinding the sandwich film from the roll;
In the sandwich film, the step of peeling the long film from the base sheet and individualizing the base sheet,
The method of manufacturing a flexible printed wiring board sheet, wherein in the step of processing the sandwich film, a hole is formed through the sandwich film to form a through hole in the base sheet.   The manufacturing method of the flexible printed wiring board sheet | seat of Claim 1 which pattern-processes with respect to this long resist film by using at least one of the said long film as a long resist film.   The manufacturing method of the flexible printed wiring board sheet | seat of Claim 2 which performs an etching process or a plating process, or an etching process and a plating process with respect to the said base material sheet in the said sandwich film.   The individualized base sheet is processed, and then a sandwich film roll is newly produced by sandwiching the base sheet with a new long film, while the new sandwich film roll is fed out. The flexible print according to any one of claims 1 to 3, wherein after processing the base sheet, the base sheet is individualized and the individual base sheet is processed. A method of manufacturing a wiring board sheet.   After individualizing the base sheet and before forming a roll of the new sandwich film, the individualized base sheet is evaluated for quality, and the conditions in the processing on the new sandwich film are determined. The method for producing a flexible printed wiring board sheet according to claim 4, wherein the method is changed to an appropriate one.   The manufacturing method of the flexible printed wiring board sheet | seat of any one of Claims 1-5 whose said base material sheet is a wiring board containing the metal foil for elastic support for the magnetic heads of a hard-disk apparatus. A method for producing a flexible printed wiring board sheet including a plurality of magnetic head wiring boards,
While transporting a plurality of substrate sheets of intermediate products of the flexible printed wiring board sheet in a row, at least one of the substrate sheets is sandwiched and bonded by a long film as a long resist film from the top and bottom of the substrate sheet. Winding a roll in a state of a sandwich film of a long film / a plurality of base sheet / long film,
A process of processing the sandwich film and the base sheet while feeding the sandwich film from the roll;
Peeling the long film of the sandwich film from the base sheet, and individualizing the base sheet;
A process of processing the individualized base material sheet,
The process from the roll winding process of the sandwich film to the process to the individualized base material sheet as the first process,
Thereafter, a step of winding a new sandwich film containing the base sheet on a roll, a step of processing the base sheet in the new sandwich film, a step of individualizing the base sheet, and individualization A method for producing a flexible printed wiring board sheet, wherein the step of processing the substrate sheet is added one or more times.

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