JP6797125B2 - 高スループットワークインプロセスバッファ用のシステム及び方法 - Google Patents
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/67769—Storage means
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/67775—Docking arrangements
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Description
本願は、「高スループットワークインプロセスバッファ」(HIGH THROUGHPUT WORK IN PROCESS BUFFER)と題しMichael Brainを発明者とする2015年2月7日付米国暫定特許出願第62/113,376号に基づき米国特許法第119条(e)の規定による利益を主張する出願であるので、この参照を以て当該暫定特許出願の全容を本願に繰り入れることにする。
Claims (27)
- 半導体デバイス製造ツール用のバッファシステムであって、
封止可能容器を支持しうるよう構成された1個又は複数個の後退可能棚と、
半導体デバイス製造ツールに備わる1個又は複数個のロードポートより上方に配置可能な1個又は複数個のスライディングアセンブリであり、リニアレールシステム上に実装され、少なくとも1個の上記封止可能容器が配設されたときにその下側面の少なくとも一部分を支持するプレートを含み、上記1個又は複数個の後退可能棚より下方にある一通り又は複数通りの位置へと封止可能容器を輸送しうるよう構成された1個又は複数個のスライディングアセンブリと、
上記1個又は複数個の後退可能棚、上記1個又は複数個のスライディングアセンブリ及び上記1個又は複数個のロードポートを含む集合内の任意の2個間で封止可能容器を輸送しうるよう構成された1個又は複数個のリフティングアセンブリと、
を備えるバッファシステム。 - 請求項1のバッファシステムであって、上記1個又は複数個の後退可能棚のうち少なくとも1個を上記1個又は複数個のロードポートのうち少なくとも1個より上方に配置可能なバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個の後退可能棚が、
ローをなして並ぶ2個以上の後退可能棚を含むバッファシステム。 - 請求項3のバッファシステムであって、そのローが水平方向を向いているバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個のスライディングアセンブリが封止可能容器を直線状水平経路に沿い輸送するバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個のリフティングアセンブリが封止可能容器のうち少なくとも1個の下側面の少なくとも一部分を支持するバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個の後退可能棚、上記1個又は複数個のスライディングアセンブリ及び上記1個又は複数個のリフティングアセンブリのうち少なくとも2個が同時に動くバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個の後退可能棚のうち少なくとも1個が後退することで、上記1個又は複数個のリフティングアセンブリによる封止可能容器の鉛直輸送向けのクリアランスが提供されるバッファシステム。
- 請求項1のバッファシステムであって、プレートの運動がリードスクリュ、ベルトドライブ、テープドライブ、ケーブルドライブ及びリニアモータのうち少なくともいずれかにより推進されるバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個の後退可能棚及び上記1個又は複数個のスライディングアセンブリのうち少なくともいずれかが、封止可能容器上にある1個又は複数個の対応するスロットと係合し封止可能容器の柔軟な整列を実現するよう構成された1本又は複数個のキネマティックピンを有するバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個のリフティングアセンブリが封止可能容器を直線状鉛直経路に沿い輸送するバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個のリフティングアセンブリが、コンベアレール及びコンベアプレートのうち少なくともいずれかであり封止可能容器のうち少なくとも1個に係るものを支持するバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個のリフティングアセンブリのうち少なくとも1個の運動がケーブル、テープ及び平衡錘のうち少なくともいずれかにより推進されるバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個のリフティングアセンブリが、
1本又は複数本のフォークを備えるバッファシステム。 - 請求項1のバッファシステムであって、上記1個又は複数個のリフティングアセンブリ及び上記1個又は複数個のスライディングアセンブリのうち少なくともいずれかが、駆動部の故障を受け稼働するブレーキを有するバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個の後退可能棚、上記1個又は複数個のスライディングアセンブリ及び上記1個又は複数個のリフティングアセンブリのうち少なくともいずれかが、所定の限界を超えた運動を妨げる安全止めを有するバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個の後退可能棚、上記1個又は複数個のスライディングアセンブリ及び上記1個又は複数個のリフティングアセンブリのうち少なくともいずれかが半導体デバイス製造ラインツール内に統合可能であるバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個の後退可能棚、上記1個又は複数個のスライディングアセンブリ及び上記1個又は複数個のリフティングアセンブリのうち少なくともいずれかが半導体デバイス製造ラインツールに固定的に装着されているバッファシステム。
- 請求項18のバッファシステムであって、上記1個又は複数個のスライディングアセンブリの少なくとも一部分が半導体デバイス製造ラインツールの前側に片持ち梁形態で実装可能であるバッファシステム。
- 請求項1のバッファシステムであって、上記1個又は複数個の後退可能棚、上記1個又は複数個のスライディングアセンブリ及び上記1個又は複数個のリフティングアセンブリのうち少なくともいずれかが半導体デバイス製造ラインツール付近に配置可能であるバッファシステム。
- 請求項20のバッファシステムであって、上記1個又は複数個のスライディングアセンブリが天井に実装可能であるバッファシステム。
- 請求項20のバッファシステムであって、上記1個又は複数個のスライディングアセンブリが床に実装可能であるバッファシステム。
- 請求項1のバッファシステムであって、半導体デバイス製造ラインツールが、
半導体処理ツール、計量ツール及び検査ツールのうち少なくともいずれかを備えるバッファシステム。 - 請求項1のバッファシステムであって、更に、
自バッファシステムに備わる上記1個又は複数個の後退可能棚と第2バッファシステムに備わる1個又は複数個の後退可能棚との間で封止可能容器を輸送しうるよう構成された1個又は複数個のローラアセンブリを備えるバッファシステム。 - 請求項1のバッファシステムであって、上記1個又は複数個のリフティングアセンブリが、更に、上記1個又は複数個のリフティングアセンブリに係る1本又は複数本の走行経路沿いにある1個又は複数個の中間的な場所へと封止可能容器を輸送しうるよう構成されているバッファシステム。
- 1個又は複数個のロードポートと、
バッファサブシステムと、
を備え、そのバッファサブシステムが、
封止可能容器を支持しうるよう構成された1個又は複数個の後退可能棚と、
上記1個又は複数個のロードポートより上方に配置された1個又は複数個のスライディングアセンブリであり、リニアレールシステム上に実装され、少なくとも1個の上記封止可能容器が配設されたときにその下側面の少なくとも一部分を支持するプレートを含み、上記1個又は複数個の後退可能棚より下方にある一通り又は複数通りの位置へと封止可能容器を輸送しうるよう構成された1個又は複数個のスライディングアセンブリと、
上記1個又は複数個の後退可能棚、上記1個又は複数個のスライディングアセンブリ及び上記1個又は複数個のロードポートを含む集合内の任意の2個間で封止可能容器を輸送しうるよう構成された1個又は複数個のリフティングアセンブリと、
を有する半導体デバイス製造ラインツール。 - 請求項26の半導体デバイス製造ラインツールであって、
半導体処理ツール、計量ツール及び検査ツールのうち少なくともいずれかを備える半導体デバイス製造ラインツール。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562113376P | 2015-02-07 | 2015-02-07 | |
US62/113,376 | 2015-02-07 | ||
US15/016,635 | 2016-02-05 | ||
US15/016,635 US10177020B2 (en) | 2015-02-07 | 2016-02-05 | System and method for high throughput work-in-process buffer |
PCT/US2016/016917 WO2016127151A1 (en) | 2015-02-07 | 2016-02-08 | System and method for high throughput work-in-process buffer |
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JP2018504786A JP2018504786A (ja) | 2018-02-15 |
JP6797125B2 true JP6797125B2 (ja) | 2020-12-09 |
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JP (1) | JP6797125B2 (ja) |
KR (1) | KR102308671B1 (ja) |
CN (1) | CN107210257B (ja) |
IL (1) | IL253496B (ja) |
SG (1) | SG11201706235XA (ja) |
TW (1) | TWI684232B (ja) |
WO (1) | WO2016127151A1 (ja) |
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---|---|---|---|---|
US11348816B2 (en) * | 2018-07-31 | 2022-05-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for die container warehousing |
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US20160233120A1 (en) | 2016-08-11 |
US10177020B2 (en) | 2019-01-08 |
IL253496A0 (en) | 2017-09-28 |
KR102308671B1 (ko) | 2021-10-01 |
TWI684232B (zh) | 2020-02-01 |
IL253496B (en) | 2021-05-31 |
TW201639064A (zh) | 2016-11-01 |
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KR20170109065A (ko) | 2017-09-27 |
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