JP6792458B2 - Manufacturing work machine - Google Patents

Description

The present invention relates to a manufacturing work machine that performs solder printing and component mounting on a substrate.

In a board manufacturing line in which electronic components are mounted on a board, a screen printing machine and a component mounting machine are generally arranged in series. In the screen printing machine arranged on the upstream side, the substrate is superposed on the mask on which the printing pattern holes are formed, and the cream solder is spread on the mask by the squeegee, so that the cream solder passing through the printing pattern holes is applied to the substrate. Is printed on. Then, the printed board is sent by a conveyor to a component mounting machine arranged on the downstream side, where the component taken out by the mounting head from the component supply unit is mounted on the board.

Japanese Unexamined Patent Publication No. 2013-236111

In the conventional board manufacturing line, a screen printing machine and a component mounting machine are arranged side by side, and in some cases, a sorting device for adjusting the transfer position of the board is required between the two machines. The substrate production line in which many aircraft are lined up in this way has a problem that the whole becomes long. Further, the solder-printed substrate is carried out by the conveyor of the screen printing machine, and is transferred by being transferred to the conveyor of the component mounting machine in the subsequent process. Alternatively, as described above, it may be conveyed via the sorting device. Therefore, it takes a long time for the transfer, and the adhesiveness of the cream solder may be impaired, or the solder shape may be deformed due to vibration during the transfer, which may deteriorate the quality of the substrate.

Therefore, an object of the present invention is to provide a manufacturing work machine that performs solder printing on a substrate and mounting of parts in order to solve such a problem.

The manufacturing work machine according to the present invention supplies the parts by a board positioning device that transports and holds the board to a work position in the machine, a parts supply device that houses a plurality of parts, and a mounting head that can suck and hold the parts. A mask between the component mounting device that mounts the components taken out from the device on the board positioned at the work position, the printing position corresponding to the board positioned at the working position, and the retracted position deviated from the printing position. It has a mask device for moving the printer, and a squeegee device for spreading cream solder on the mask at the printing position and moving the mask to the retracting place in the same direction as the mask moving to the retracting position.

According to the above configuration, the substrate is conveyed and held at the working position in the machine, and solder printing by spreading the cream solder on the substrate by the squeegee device is performed through the mask moved from the retracted position to the printing position. Will be done. Then, after printing, the mask device and the squeegee device move to the retracted position, and then the mounting head takes out the component from the component supply device, and the component is mounted on the printed substrate.

It is external perspective view which showed one Embodiment of the manufacturing work machine. It is a figure which showed the simple internal structure of the manufacturing work machine. It is the simple internal structure of the manufacturing work machine, and is the figure which showed the time of printing. It is a simple internal configuration of a manufacturing work machine, and is a diagram showing when parts are mounted.

Next, an embodiment of the manufacturing working machine according to the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view showing the manufacturing work machine of the present embodiment. The manufacturing work machine 1 constitutes a board manufacturing line for manufacturing a circuit board. A normal substrate manufacturing line has a configuration in which a screen printing machine that performs solder printing on a substrate and a component mounting machine that mounts electronic components or the like on the substrate are arranged in order. The manufacturing work machine 1 of the present embodiment is configured by integrating the functions of both machines, and is capable of solder printing on a substrate and mounting parts.

The entire manufacturing work machine 1 is covered with a machine body cover 2, monitors 3 and operation panels 4 are arranged in front of and behind the machine body, and signal lamps 5 and the like are also provided. Further, the machine body cover 2 is formed with board transfer openings 6 for passing the board on both side surfaces in the machine body width direction, so that the board can be delivered to and from other adjacent working machines. .. In addition, a component supply opening 7 is formed on the front surface of the machine body on the front side of the drawing so that a component supply device such as a tape feeder can be attached. In the present embodiment, the front-rear direction of the manufacturing work machine 1 is the Y-axis direction, the width direction in which the substrate is conveyed is the X-axis direction, and the height direction is the Z-axis direction.

Next, FIGS. 2 to 4 are simple internal configuration views of the manufacturing work machine 1 configured in the machine body cover 2, and show states in different work processes. The manufacturing work machine 1 has a solder printing function of applying cream solder to the substrate 10 from the upper surface of the mask 20 through a print pattern hole, and a component mounting function of mounting components on the substrate 10 on which solder printing has been performed. ing. Therefore, first, the structure of the solder printing function will be described. The solder printing structure includes a substrate transfer device 11 for transporting the substrate 10 on the lower side of the mask 20, a clamp device 12 for clamping the substrate, and the like, and a squeegee device 15 on the upper side for spreading cream solder on the mask 20. Etc. are configured.

The lower clamp device 12 and the like are assembled to the elevating device 13. In the elevating device 13, the elevating table 21 is connected to the elevating motor 23 via the ball screw mechanism 22, and the elevating device 13 can move in the vertical direction. A pair of mask supports 25 are provided on the elevating table 21 in the front-rear direction (Y-axis direction) of the machine body via a support table 24, and a clamp device 12 is assembled between them. A mask support plate 251 that comes into contact with the mask 20 is fixed to the upper surface of each mask support 25. A ball screw mechanism 26 is attached to one of the mask supports 25 (on the right side of the drawing), and the distance from the other mask support 25 can be adjusted by the output of the drive motor.

In the clamp device 12, a pair of side frames 32 are arranged on a support base 31, and a ball screw mechanism 33 is provided on one side, so that the distance between the two can be adjusted by the rotation of the clamp motor. Further, a clamp portion 35 is formed at the upper end portion of each side frame 32, and the substrate 10 can be gripped by adjusting the distance between them. A substrate transfer device 11 is assembled to the pair of side frames 32, and is configured to convey while supporting the end portions of the substrate 10 by conveyor belts on both sides.

Further, a backup device 14 is provided between the pair of side frames 32. In the backup device 14, a plurality of backup pins 38 are attached to the backup table 37, and the substrate 10 is lifted via the backup pins 38. The clamp device 12 is supported by a ball screw mechanism in which the support base 31 is connected to the lifting motor 27, and the backup table 37 is supported by the lifting motor 28 fixed to the support base 31 via the ball screw mechanism. Has been done.

Next, the squeegee device 15 applies the cream solder to the substrate 10 located under the mask 20 by pushing the cream solder into the print pattern holes of the mask 20 while rolling. The squeegee device 15 is mounted on the traveling table 43 in a state in which a pair of squeegee heads 41 and 42 provided with squeegees can be raised and lowered by a cylinder. The traveling table 43 is slidably assembled with a guide rod erected in the front-rear direction of the machine body (not shown), and is configured to move linearly in the horizontal direction. The traveling table 43 is configured with a drive transmission mechanism that converts the rotational output of the drive motor into linear motion and transmits it. As the drive transmission mechanism, for example, a ball screw mechanism or a pulley / belt mechanism is used.

By the way, the manufacturing work machine 1 of the present embodiment is configured so that the mask 20 moves in the front-rear direction (Y-axis direction) of the machine body. That is, the mask 20 moves between the printing position above the substrate 10 shown in FIG. 2 and the retracted position provided on the rear side of the machine body shown in FIG. Therefore, although not specifically shown, the manufacturing work machine 1 is configured with a mask device provided with a drive mechanism for moving a mask holder that holds the mask 20 detachably to each position. In the drive mechanism, the mask holder is slidably assembled to the guide rail in the front-rear direction of the machine body, and moves by receiving the driving force in the same direction. As the drive means, a configuration is conceivable in which the rotational output of the drive motor is converted into a linear motion of the mask holder via a ball screw mechanism, a pulley / belt mechanism, or the like. Alternatively, the mask 20 may be moved by using the driving means of the squeegee device 15. For example, a connecting mechanism is provided between the squeegee heads 41 and 42 and the mask holder so that the mask 20 (mask holder) is integrally moved according to the movement of the traveling table 43.

The manufacturing work machine 1 is provided with a mask camera 45 for detecting the mask 20 at the printing position and a cleaning device 16 for wiping off dirt on the lower surface of the mask. In particular, since the mask 20 side moves, the mask camera 45 and the cleaning device 16 are provided at fixed positions. The mask camera 45 captures the mask mark attached to the mask 20, and the relative position with respect to the substrate 10 is confirmed based on the imaged data. Further, the cleaning device 16 is provided with a cleaning head 53 in which the cleaning paper 55 is sent from the unwinding roller 51 to the winding roller 52, and the cleaning paper 55 is pressed against the lower surface of the mask 20 in the meantime. The cleaning device 16 is mounted on a telescopic actuator and can move in the vertical direction. Therefore, as the cleaning device 16 moves up and down, the cleaning paper 55 can be switched between a cleaning state in which the mask 20 is in contact and a standby state in which the cleaning paper 55 is separated from the mask 20.

Next, the structure of the component mounting function provided in the manufacturing work machine 1 will be described. In addition to the clamp device 12 and the backup device 14 described above, the component mounting structure includes a component supply device including a tape feeder 17 and a component mounting device including a mounting head 18 for mounting components. The mounting head 18 of the component mounting device is provided with a component suction nozzle so as to protrude downward, and can suck, hold, and release the component by the negative pressure and the positive pressure of air. The component suction nozzle is configured to move in the vertical direction with respect to the head body by an elevating mechanism.

The component mounting device is provided with a Y-axis drive mechanism that linearly moves the mounting head 18 in the front-rear direction (Y-axis direction) of the machine body and an X-axis drive mechanism that linearly moves the mounting head 18 in the width direction of the machine body (X-axis direction). ing. For example, as the X-axis drive mechanism, a mounting head 18 may be slidably assembled to a beam member extending in the X-axis direction and moved by a ball screw mechanism and a drive motor. As the Y-axis drive mechanism, a linear motor configured by providing linear sliders at both ends of the beam member and arranging linear guides along the Y-axis direction can be considered. Therefore, by controlling the drive mechanisms of both axes, the mounting head 18 can be moved to an arbitrary position on the XY plane.

A board camera 46 is integrally formed on the mounting head 18. Therefore, in the manufacturing work machine 1, the substrate camera 46 moves on the XY plane and images the substrate mark attached to the substrate 10, so that the relative positions of the substrate 10 and the mask 20 are based on the imaged data. Is to be confirmed. In addition, the substrate camera 46 also captures a printing pattern on the solder-printed substrate 10. Therefore, the print inspection is performed based on the imaged data.

Further, a parts camera 47 is provided between the tape feeder 17 which is a parts supply device and the clamp device 12. The parts camera 47 captures an image of an electronic component held by the mounting head 18 from below, and can detect damage to the electronic component and the holding position and posture of the held electronic component from the image data. There is. Electronic components that are determined to be discarded by such component detection are put into the component collection box.

Subsequently, the operation of the manufacturing work machine 1 will be described. First, as shown in FIG. 2, the substrate 10 entered through the substrate transfer opening 6 is conveyed between the pair of side frames 32 by the conveyor belt of the substrate transfer device 11. Then, the backup table 37 is raised by the drive of the elevating motor 28, and the substrate 10 is lifted from the conveyor belt so as to be pushed up by the backup pin 38. Further, one side frame 32 is moved by the drive motor via the ball screw mechanism 33, and the substrate 10 is sandwiched and held by the clamp portions 35 of the pair of side frames 32.

Next, the elevating motor 27 is driven, and as shown in FIG. 3, the entire clamp device 12 holding the substrate 10 rises, and the clamp portion 35 and the substrate 10 are aligned with the height of the mask support plate 251. Be done. Then, the substrate mark of the substrate 10 is imaged by the substrate camera 46. At this time, the mask 20 is in the retracted position as shown in FIG. 4, and the upper surface of the substrate 10 is opened so that the image can be taken by the substrate camera 46. Therefore, the X-axis drive mechanism and the Y-axis drive mechanism of the mounting head 18 move the substrate camera 46 on the XY plane, and the substrate mark of the substrate 10 is imaged.

After that, as shown in FIG. 2, the mounting head 18 and the substrate camera 46 return to the standby position, and the mask 20 and the squeegee device 15 move and are arranged at the printing position on the substrate 10. Then, the mask mark of the mask 20 is imaged by the mask camera 45. The amount of positional deviation of the relative positions of the substrate 10 and the mask 20 in the X, Y, and θ directions is calculated from the imaged data of the mask mark and the imaged data of the substrate mark acquired earlier, and is configured on the support base 24. Positional deviation correction is performed by the correction device.

Next, as shown in FIG. 3, the elevating table 21 is raised by driving the elevating motor 23, and stops at a height at which the upper surface of the mask support plate 251, the clamp portion 35, and the substrate 10 lightly contacts the lower surface of the mask 20. To do. Then, on the upper surface side of the mask 20, for example, the squeegee head 41 of the squeegee device 15 is lowered and moved to the rear of the machine body, so that the cream solder is rolled on the mask 20 by the squeegee at the lower end. Therefore, the cream solder passes through the printing pattern holes, and solder printing is performed on the substrate 10 located under the mask 20.

After the printed pattern is formed on the substrate 10 in this way, as shown in FIG. 4, the elevating table 21 is lowered and the substrate 10 is separated from the mask 20. Then, the mask 20 and the squeegee device 15 move to the rear of the machine body and are arranged at the evacuation position. At that time, the cleaning device 16 is raised, and the cleaning paper 55 is pressed against the lower surface of the mask 20 by the cleaning head 53. Therefore, the dirt on the lower surface of the mask 20 is wiped off by moving itself. In the cleaning device 16, the cleaning paper 55 is sent from the unwinding roller 51 to the winding roller 52 at a predetermined timing, and the used portion is wound up to renew the cleaning portion of the cleaning head 53.

When the mask 20 moves and the upper part of the substrate 10 is opened, the component mounting on the substrate 10 is performed next. In the tape feeder 17, electronic components are sent to the component supply position by unwinding the component tape. Therefore, the mounting head 18 moves to the component supply position of the tape feeder 17, and the electronic component sucked and held by the suction nozzle is taken out. Then, when the mounting head 18 passes over the parts camera 47, the electronic component held by the suction nozzle is imaged, and the comparison determination with the component information input in advance is performed based on the imaged data. As a result, in the case of nonconformity determination, the electronic component is collected. On the other hand, when it is determined to be a conforming component, the electronic component is carried to the substrate 10 and mounted at a predetermined position on the printed pattern.

A plurality of tape feeders 17 are installed in the component supply opening 7, and a plurality of electronic components of the same type or different types are repeatedly mounted on the substrate. Then, after mounting the electronic component, the mounting head 18 returns to the position shown in FIG. 2 and stands by. After that, the substrate 10 is released from the clamp portion 35 with one side frame 32 separated, and the substrate 10 supported by the backup pin 38 is transferred to the conveyor belt by lowering the backup table 37. Therefore, by driving the board transfer device 11, the board on which solder printing and component mounting have been performed is carried out from the board transfer opening 6 opposite to the carry-in.

Therefore, since the manufacturing work machine 1 performs solder printing and component mounting on the substrate 10, each process previously performed by the screen printing machine and the component mounting machine can be performed by one unit. It becomes possible to shorten the line length of the substrate manufacturing line. Then, since the solder printing and the component mounting are performed while the substrate 10 is clamped at one place, the movement from the solder printing process to the component mounting process can be omitted, and the production efficiency can be improved. In addition, since the substrate 10 is no longer transported, the time required to mount the parts after solder printing is shortened, and it is possible to prevent the adhesiveness of the cream solder from being impaired and the solder shape from being deformed due to vibration during transfer. It can improve the quality of the product.

The manufacturing work machine 1 is designed to move the mask 20 attached to the mask holder in the front-rear direction of the machine body, but by providing a connecting mechanism between the squeegee heads 41 and 42 and the mask holder, the squeegee device 15 The drive transmission mechanism for movement that is inherently provided can be used. Therefore, it is not necessary to provide a dedicated drive transmission mechanism for moving the mask 20. Further, the substrate camera 46 needs to be moved for detecting the clamp position with respect to the substrate 10 and for printing inspection of the printed pattern formed on the substrate, but it is configured integrally with the mounting head 18 provided with the moving mechanism. Therefore, it is not necessary to provide the substrate camera 46 with a dedicated moving mechanism.

In a normal screen printing machine, the cleaning device 16 moves to clean the mask 20, but in the manufacturing work machine 1, the mask 20 moves, so that it is not necessary to provide a moving mechanism for the cleaning device 16. Further, the mask camera 45 for detecting the position of the mask 20 at the time of printing is also configured to move in a normal screen printing machine, but in the manufacturing work machine 1, the mask 20 moves, so that the mask camera 45 is relative to the mask camera 45. There is no need to provide a moving mechanism.

Although one embodiment of the present invention has been described above, the present invention is not limited to this, and various modifications can be made without departing from the spirit of the present invention.
In the above embodiment, the mask device in which the mask holder is horizontally moved in the front-rear direction of the machine body is shown, but in order to shorten the dimensions of the manufacturing work machine in the front-rear direction, for example, the posture is changed so that the mask 20 stands upright. However, it may be moved to the rear of the aircraft.

1 ... Manufacturing work machine 2 ... Machine cover 6 ... Board transfer opening 7 ... Parts supply opening 10 ... Board 11 ... Board transfer device 12 ... Clamping device 13 ... Lifting device 14 ... Backup device 15 ... Squeegee device 16 ... Cleaning device 17 … Tape feeder 18… Mounting head 20… Mask 45… Mask camera 46… Board camera 47… Parts camera

Claims (5)

A board positioning device that transports and holds the board to the working position in the machine,
A parts supply device that houses multiple parts and
A component mounting device that mounts a component taken out from the component supply device on a board positioned at a working position by a mounting head capable of sucking and holding the component.
A mask device that moves a mask between a printing position corresponding to a substrate positioned at the working position and a retracting position deviating from the printing position.
A manufacturing work machine having a squeegee device capable of spreading cream solder on a mask at a printing position and moving to a retracting place in the same direction as the mask moving to the retracting position. A connecting mechanism is provided between the mask device and the squeegee device, and the movably assembled mask moves between the printing position and the retracted position by the drive mechanism of the squeegee device. The manufacturing work machine according to claim 1. The manufacturing work machine according to claim 1 or 2, further comprising a cleaning device for pressing a cleaning paper against the lower surface of a mask that moves between the printing position and the retracting position. The manufacturing work machine according to any one of claims 1 to 3, wherein a substrate camera is mounted on the mounting head. The manufacturing work machine according to any one of claims 1 to 4, wherein a mask camera is installed in the middle of moving between the printing position and the retracting position.

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