JP6789271B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP6789271B2
JP6789271B2 JP2018173317A JP2018173317A JP6789271B2 JP 6789271 B2 JP6789271 B2 JP 6789271B2 JP 2018173317 A JP2018173317 A JP 2018173317A JP 2018173317 A JP2018173317 A JP 2018173317A JP 6789271 B2 JP6789271 B2 JP 6789271B2
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JP
Japan
Prior art keywords
ball screw
screw shaft
nozzle
electric motor
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018173317A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020044476A (ja
Inventor
賢太郎 西岡
賢太郎 西岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2018173317A priority Critical patent/JP6789271B2/ja
Priority to KR1020190078224A priority patent/KR102419943B1/ko
Priority to CN201910688091.5A priority patent/CN110911308A/zh
Publication of JP2020044476A publication Critical patent/JP2020044476A/ja
Application granted granted Critical
Publication of JP6789271B2 publication Critical patent/JP6789271B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2018173317A 2018-09-18 2018-09-18 基板処理装置 Active JP6789271B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018173317A JP6789271B2 (ja) 2018-09-18 2018-09-18 基板処理装置
KR1020190078224A KR102419943B1 (ko) 2018-09-18 2019-06-28 기판 처리 장치
CN201910688091.5A CN110911308A (zh) 2018-09-18 2019-07-29 基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018173317A JP6789271B2 (ja) 2018-09-18 2018-09-18 基板処理装置

Publications (2)

Publication Number Publication Date
JP2020044476A JP2020044476A (ja) 2020-03-26
JP6789271B2 true JP6789271B2 (ja) 2020-11-25

Family

ID=69814481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018173317A Active JP6789271B2 (ja) 2018-09-18 2018-09-18 基板処理装置

Country Status (3)

Country Link
JP (1) JP6789271B2 (zh)
KR (1) KR102419943B1 (zh)
CN (1) CN110911308A (zh)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06226179A (ja) * 1991-03-07 1994-08-16 Fuji Photo Film Co Ltd 塗布装置
JPH11311919A (ja) * 1998-04-30 1999-11-09 Ricoh Co Ltd 画像形成装置
JP2002267046A (ja) * 2001-03-08 2002-09-18 Mitsubishi Heavy Ind Ltd 制振装置およびこれに支持された管路又はダクトを備えた設備
KR20070035476A (ko) * 2004-02-24 2007-03-30 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법
JP2008196606A (ja) * 2007-02-13 2008-08-28 Shimizu Corp 回転慣性質量ダンパーおよびその設置構造
JP2010058097A (ja) * 2008-09-08 2010-03-18 Toray Ind Inc 塗布方法および塗布装置、並びにプラズマディスプレイ用部材の製造方法およびその製造装置。
JP5926782B2 (ja) * 2014-09-19 2016-05-25 Dmg森精機株式会社 工作機械およびブレーキチェック方法
JP6725374B2 (ja) * 2016-09-13 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6860357B2 (ja) * 2017-01-20 2021-04-14 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法

Also Published As

Publication number Publication date
CN110911308A (zh) 2020-03-24
KR102419943B1 (ko) 2022-07-11
JP2020044476A (ja) 2020-03-26
KR20200032631A (ko) 2020-03-26

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