JP6773332B2 - 電子デバイスおよびその製造方法 - Google Patents
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Description
T. Fujie and S. Takeoka, in Nanobiotechnology, eds. D. A. Phoenix and A. Waqar, One Central Press, United Kingdom, 2014, pp. 68-94.
3 高分子ナノシート
4 電子素子
5 導電配線
6 能動部品
7 電源
8 電極
11 基板
12 犠牲層
14 インク受容層
21 銀ナノ粒子
31 第1高分子ナノシート
32 第2高分子ナノシート
Claims (11)
- 電子素子と、
前記電子素子の電極が形成されている1面全体を覆うように、かつ分子間力により前記電子素子と密着した厚さが1μm未満の高分子ナノシートと、
前記高分子ナノシート上に形成され、前記電子素子の電極と分子間力により密着し、電気的に接続する導電配線と、
を含むことを特徴とする電子デバイス。 - 前記高分子ナノシート上にインク受容層をさらに備え、前記導電配線が前記インク受容層上に印刷されて形成されたものであることを特徴とする請求項1に記載の電子デバイス。
- 前記電子素子は能動部品であり、前記能動部品に電力を供給する電源が、前記高分子ナノシート上にさらに配置されることを特徴とする請求項1または2に記載の電子デバイス。
- 前記高分子ナノシートが、ポリスチレンイソプレンスチレン、ポリジメチルシロキサン、シリコーン、ポリスチレン、ポリメタクリル酸、ポリ乳酸、ポリ乳酸グリコール酸共重合体、ポリ酢酸ビニル、キトサン、アルギン酸、酢酸セルロース、ヒアルロン酸、ゼラチン、および、コラーゲンのうちのいずれか一つからなることを特徴とする請求項1〜3のいずれか1項に記載の電子デバイス。
- 前記高分子ナノシートに厚さが1μm未満の他の高分子ナノシートが密着して貼り合わされており、前記電子素子は、前記高分子ナノシートと前記他の高分子ナノシートとの間に挟み込まれていることを特徴とする請求項1または2に記載の電子デバイス。
- 前記電子素子は能動部品であり、前記能動部品に電力を供給する電源が、前記高分子ナノシートと前記他の高分子ナノシートとの間にさらに挟み込まれることを特徴とする請求項5に記載の電子デバイス。
- 前記高分子ナノシートおよび前記他の高分子ナノシートが、それぞれポリスチレンイソプレンスチレン、ポリジメチルシロキサン、シリコーン、ポリスチレン、ポリメタクリル酸、ポリ乳酸、ポリ乳酸グリコール酸共重合体、ポリ酢酸ビニル、キトサン、アルギン酸、酢酸セルロース、ヒアルロン酸、ゼラチン、および、コラーゲンのうちのいずれか一つからなることを特徴とする請求項5または6に記載の電子デバイス。
- 前記導電配線が、金属ナノ粒子、半導体ナノ粒子、導電性高分子、および、ナノ炭素材料のうちの少なくとも一つからなることを特徴とする請求項1〜7のいずれか1項に記載の電子デバイス。
- 前記金属ナノ粒子が、銀、金、銅、および、ニッケルのうちの少なくとも一つであることを特徴とする請求項8に記載の電子デバイス。
- 基板上に厚さが1μm未満の第1高分子ナノシートを形成するステップと、
前記第1高分子ナノシート上に導電配線を形成するステップと、
前記導電配線に電子素子の電極が接するように前記電子素子を配置するステップと、
厚さが1μm未満の第2高分子ナノシートを、前記電子素子および前記導電配線を前記第1高分子ナノシートとの間に挟み込むようにして前記第1高分子ナノシートに密着して貼り合わせ、前記電子素子を前記第1高分子ナノシートに分子間力で接着し、前記電子素子の電極と前記導電配線とを分子間力で密着して電気的に接続するステップと、
前記第1高分子ナノシートから前記基板を分離するステップと
を含むことを特徴とする電子デバイスの製造方法。 - 前記第1高分子ナノシートを形成するステップにおいて、前記基板上に前記第1および第2高分子ナノシートを溶解しない溶剤で溶解可能な犠牲層を形成した後に、前記犠牲層上に前記第1高分子ナノシートを形成し、前記基板を分離するステップにおいて、前記犠牲層を前記溶剤で溶解して前記第1高分子ナノシートから前記基板を分離することを特徴とする請求項10に記載の電子デバイスの製造方法。
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JP2015096887 | 2015-05-11 | ||
JP2015096887 | 2015-05-11 | ||
PCT/JP2016/063841 WO2016181958A1 (ja) | 2015-05-11 | 2016-05-10 | 電子デバイスおよびその製造方法 |
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JP6773332B2 true JP6773332B2 (ja) | 2020-10-21 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109982745B (zh) * | 2016-11-28 | 2023-06-02 | Med-El电气医疗器械有限公司 | 用于喉部起搏器的呼吸监测传感器 |
KR102225172B1 (ko) * | 2019-04-05 | 2021-03-09 | 재단법인대구경북과학기술원 | 나노섬유 메쉬 습도센서 및 이의 제조방법 |
JP2020198396A (ja) * | 2019-06-04 | 2020-12-10 | 学校法人早稲田大学 | バッテリレス電子デバイス及び伝送システム |
JP2022545952A (ja) * | 2019-08-26 | 2022-11-01 | エクス-セルプリント リミテッド | 可変剛性モジュール |
US20220384315A1 (en) * | 2019-11-28 | 2022-12-01 | Prevayl Innovations Limited | Sensor semiconductor package, article comprising the same and manufacturing method thereof |
GB2589568A (en) | 2019-11-28 | 2021-06-09 | Prevayl Ltd | Sensor device, system and wearable article |
GB2589567A (en) * | 2019-11-28 | 2021-06-09 | Prevayl Ltd | Semiconductor package, article and method |
WO2023063070A1 (ja) | 2021-10-13 | 2023-04-20 | 国立大学法人東京工業大学 | 脳表に貼付して使用される記録及び/又は刺激用の神経電極とそれを用いた記録又は刺激方法 |
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WO2008143138A1 (ja) * | 2007-05-18 | 2008-11-27 | Toppan Printing Co., Ltd. | 配線基板、半導体パッケージ及び電子機器 |
JP5004193B2 (ja) * | 2008-12-26 | 2012-08-22 | 独立行政法人産業技術総合研究所 | ポリイミド薄膜の作製方法 |
JP2010161118A (ja) | 2009-01-06 | 2010-07-22 | Ube Nitto Kasei Co Ltd | 多孔質膜、多孔質膜形成用塗工液、その製造方法、積層基板および配線材料 |
DK2592915T3 (da) * | 2010-07-06 | 2022-04-19 | Fujikura Ltd | Fremstillingsfremgangsmåde til lamineret printplade |
JP2012069673A (ja) | 2010-09-22 | 2012-04-05 | Sony Corp | フレキシブル基板、フレキシブル基板の実装方法及び照明装置 |
JP2013258209A (ja) | 2012-06-11 | 2013-12-26 | Nitto Denko Corp | 封止シート、発光ダイオード装置およびその製造方法 |
US10006141B2 (en) * | 2013-06-20 | 2018-06-26 | Baker Hughes, A Ge Company, Llc | Method to produce metal matrix nanocomposite |
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- 2016-05-10 WO PCT/JP2016/063841 patent/WO2016181958A1/ja active Application Filing
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JPWO2016181958A1 (ja) | 2018-03-29 |
US10474188B2 (en) | 2019-11-12 |
US20180107244A1 (en) | 2018-04-19 |
WO2016181958A1 (ja) | 2016-11-17 |
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