JP6759840B2 - Molding method of molded product - Google Patents
Molding method of molded product Download PDFInfo
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- JP6759840B2 JP6759840B2 JP2016158981A JP2016158981A JP6759840B2 JP 6759840 B2 JP6759840 B2 JP 6759840B2 JP 2016158981 A JP2016158981 A JP 2016158981A JP 2016158981 A JP2016158981 A JP 2016158981A JP 6759840 B2 JP6759840 B2 JP 6759840B2
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- 238000000465 moulding Methods 0.000 title claims description 81
- 238000000034 method Methods 0.000 title claims description 41
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 230000009477 glass transition Effects 0.000 claims description 16
- 239000012778 molding material Substances 0.000 claims description 13
- 238000004132 cross linking Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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- Reinforced Plastic Materials (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Description
本発明は、成形品の成形方法に関する。 The present invention relates to a method for molding a molded product.
従来から、例えば炭素繊維のような基材に樹脂を含浸させてなるプリプレグ（成形材）を加温しつつ、例えば車両のバンパーのような成形品をプレス成形する技術が知られている（特許文献１を参照。）。 Conventionally, there has been known a technique for press-molding a molded product such as a vehicle bumper while heating a prepreg (molding material) obtained by impregnating a base material such as carbon fiber with a resin (patented). See Document 1).
特許文献１に記載の成形方法では、成形材が冷却されるときに収縮することから、成形品の表面粗さを十分に抑制できない。したがって、成形品が外部に暴露されユーザーに目視されるようなものの場合、外観品質を保つために研磨処理を施す必要があることから、成形品の生産性が低下する。一方、単純に、成形材の成形温度を低くして収縮量を低減すれば、成形品の表面粗さを抑制できるが、成形に必要な時間が増大することから、成形品の生産性が低下する。 In the molding method described in Patent Document 1, the surface roughness of the molded product cannot be sufficiently suppressed because the molded material shrinks when it is cooled. Therefore, when the molded product is exposed to the outside and is visible to the user, it is necessary to perform a polishing process in order to maintain the appearance quality, which reduces the productivity of the molded product. On the other hand, if the molding temperature of the molded material is simply lowered to reduce the amount of shrinkage, the surface roughness of the molded product can be suppressed, but the time required for molding increases, so that the productivity of the molded product decreases. To do.
本発明の目的は、生産性を低下させることなく外観品質を保つことができる成形品の成形方法を提供することにある。 An object of the present invention is to provide a molding method for a molded product capable of maintaining appearance quality without reducing productivity.
上記目的を達成するための本発明の成形品の成形方法は、基材に樹脂を含浸させてなる成形材を用いて成形品を連続的に成形する方法である。かかる成形品の成形方法は、前記成形材を３次元架橋が始まる第１温度よりも低い第２温度まで加温しつつ前記成形品の形状に対応した予備金型によって予備成形した後、前記成形材を前記第１温度以上でガラス転移温度以下まで加温しつつ前記成形品の形状に対応した金型によって本成形する工程を有する。かかる工程は、前記金型によって一の前記成形材を成形する時間帯と、前記予備金型によって他の前記成形材を予備成形する時間帯と、を少なくとも一部重複させる。 The method for molding a molded product of the present invention for achieving the above object is a method for continuously molding a molded product using a molding material obtained by impregnating a base material with a resin. In the molding method of such a molded product, the molded product is premolded by a preliminary mold corresponding to the shape of the molded product while being heated to a second temperature lower than the first temperature at which the three-dimensional cross-linking starts, and then the molding is performed. It has a step of main molding with a mold corresponding to the shape of the molded product while heating the material to the glass transition temperature or lower at the first temperature or higher. In this step, at least a part of the time zone in which one of the molding materials is molded by the mold and the time zone in which the other molding material is premolded by the spare mold are overlapped.
かかる成形品の成形方法によれば、加温による成形を特定の温度領域で予備成形と本成形に分け、各々の成形時間帯を一部重複させることで生産性を低下させることなく外観品質を保つことができる。 According to the molding method of such a molded product, molding by heating is divided into pre-molding and main molding in a specific temperature range, and the appearance quality is improved without lowering the productivity by partially overlapping each molding time zone. Can be kept.
以下、添付した図面を参照しながら、本発明の実施形態を説明する。図面において、同一の部材には同一の符号を付し、重複する説明を省略する。図面において、各部材の大きさや比率は、実施形態の理解を容易にするために誇張し、実際の大きさや比率とは異なる場合がある。 Hereinafter, embodiments of the present invention will be described with reference to the attached drawings. In the drawings, the same members are designated by the same reference numerals, and duplicate description will be omitted. In the drawings, the size and ratio of each member are exaggerated to facilitate understanding of the embodiment and may differ from the actual size and ratio.
（成形品２０の成形原理）
図１は、プリプレグ１０の成形を示す図である。図２は、プリプレグ１０の予備成形と本成形のタイムチャートを示す図である。図３は、プリプレグ１０の表面粗さと成形温度の関係を示す図である。図４は、プリプレグ１０の硬化時間と成形温度の関係を示す図である。図５は、プリプレグ１０の硬化度と硬化時間の関係を成形温度毎に示す図である。
(Molding principle of molded product 20)
FIG. 1 is a diagram showing molding of the prepreg 10. FIG. 2 is a diagram showing a time chart of pre-molding and main molding of the prepreg 10. FIG. 3 is a diagram showing the relationship between the surface roughness of the prepreg 10 and the molding temperature. FIG. 4 is a diagram showing the relationship between the curing time of the prepreg 10 and the molding temperature. FIG. 5 is a diagram showing the relationship between the degree of curing of the prepreg 10 and the curing time for each molding temperature.
まず、図１中の領域Ａ、Ｂ、ＣおよびＤを参照して、通常のプリプレグの成形方法を説明する。 First, a normal prepreg molding method will be described with reference to regions A, B, C and D in FIG.
図１中の領域Ａに示すように、プリプレグに含まれる樹脂は、加温されると液化しつつ体積が増加する。さらに、図１中の領域Ｂに示すように、硬化温度Ｔｃ［℃］に達した樹脂は、硬化しつつ体積が減少する。すなわち、樹脂は、領域Ｂにおいて、一定体積まで硬化収縮する。さらに、図１中の領域Ｃおよび領域Ｄに示すように、樹脂は、硬化温度Ｔｃ［℃］から室温Ｔｒ［℃］まで冷却されるときに体積が減少する。すなわち、樹脂は、領域ＣおよびＤにおいて、冷却収縮する。ここで、樹脂は、ガラス転移温度Ｔｇ［℃］を超えた領域Ｃと、ガラス転移温度Ｔｇ［℃］以下の領域Ｄで、冷却収縮の温度勾配が大きく異なる。すなわち、樹脂は、ガラス転移温度Ｔｇ［℃］を超えた領域Ｃまで加温すると、ガラス転移温度Ｔｇ［℃］まで冷却する際に大きく収縮してしまう。したがって、樹脂は、ガラス転移温度Ｔｇ［℃］を超えない範囲で加温することが好ましい。 As shown in region A in FIG. 1, the volume of the resin contained in the prepreg increases while liquefying when heated. Further, as shown in the region B in FIG. 1, the volume of the resin that has reached the curing temperature Tc [° C.] decreases while being cured. That is, the resin cures and shrinks to a certain volume in the region B. Further, as shown in regions C and D in FIG. 1, the volume of the resin decreases when it is cooled from the curing temperature Tc [° C.] to room temperature Tr [° C.]. That is, the resin cools and shrinks in regions C and D. Here, the resin has a significantly different temperature gradient of cooling shrinkage between the region C exceeding the glass transition temperature Tg [° C.] and the region D below the glass transition temperature Tg [° C.]. That is, when the resin is heated to the region C exceeding the glass transition temperature Tg [° C.], the resin shrinks significantly when cooled to the glass transition temperature Tg [° C.]. Therefore, it is preferable to heat the resin in a range not exceeding the glass transition temperature Tg [° C.].
つぎに、図１中の領域Ｐ、Ｑ、ＲおよびＳに加えて図２を参照して、実施形態のプリプレグ１０の成形方法を説明する。 Next, a method of molding the prepreg 10 of the embodiment will be described with reference to FIG. 2 in addition to the regions P, Q, R and S in FIG.
図１中の領域Ｐは、プリプレグ１０の予備成形に相当する。領域Ｐに示すように、プリプレグ１０を、３次元架橋が始まる第１温度Ｔ１［℃］よりも若干低い第２温度Ｔ２［℃］まで加温しつつ、図２に示すように予備金型１０２によって予備成形する。 The region P in FIG. 1 corresponds to the preforming of the prepreg 10. As shown in the region P, the prepreg 10 is heated to the second temperature T2 [° C.], which is slightly lower than the first temperature T1 [° C.] at which the three-dimensional cross-linking starts, and as shown in FIG. 2, the reserve mold 102 Pre-molded by.
図１中の領域Ｑ、ＲおよびＳは、プリプレグ１０の本成形に相当する。領域Ｑに示すように、予備成形を終えたプリプレグ１０を、予備金型１０２から金型１０３に移し替えた後、ガラス転移温度Ｔｇ［℃］まで加温しつつ、図２に示すように金型１０３によって本成形する。その後、プリプレグ１０に含まれる樹脂は、領域Ｒに示すようにガラス転移温度Ｔｇ［℃］において一定体積まで硬化収縮してから、領域Ｓに示すように室温Ｔｒ［℃］まで冷却収縮する。 Regions Q, R and S in FIG. 1 correspond to the main molding of the prepreg 10. As shown in region Q, after the pre-molded prepreg 10 is transferred from the preliminary mold 102 to the mold 103, the gold is heated to the glass transition temperature Tg [° C.] as shown in FIG. Main molding is performed by the mold 103. Then, the resin contained in the prepreg 10 is cured and shrunk to a certain volume at the glass transition temperature Tg [° C.] as shown in the region R, and then cooled and shrunk to room temperature Tr [° C.] as shown in the region S.
図１中の領域Ｐ、Ｑ、ＲおよびＳの熱サイクルによって成形する実施形態のプリプレグ１０は、加温する上限の温度をガラス転移温度［Ｔｇ°］に抑えていることから、図１中の領域Ａ、Ｂ、ＣおよびＤの熱サイクルによって成形する通常のプリプレグよりも、樹脂の最大収縮（硬化収縮と冷却収縮の和）を十分に抑制することができる。すなわち、実施形態では、プリプレグ１０を予備成形および本成形の際に、そのプリプレグ１０をガラス転移温度Ｔｇ［℃］よりも高温にしないことから、加温したプリプレグ１０を冷却するときの収縮量を十分に低減できる。 Since the prepreg 10 of the embodiment formed by the thermal cycle of the regions P, Q, R and S in FIG. 1 suppresses the upper limit temperature for heating to the glass transition temperature [Tg °], the temperature in FIG. 1 is shown in FIG. The maximum shrinkage of the resin (sum of curing shrinkage and cooling shrinkage) can be sufficiently suppressed as compared with a normal prepreg formed by the thermal cycle of regions A, B, C and D. That is, in the embodiment, when the prepreg 10 is preformed and main molded, the temperature of the prepreg 10 is not made higher than the glass transition temperature Tg [° C.], so that the amount of shrinkage when the heated prepreg 10 is cooled is set. It can be reduced sufficiently.
ここで、図２に示すように、金型１０３によって一のプリプレグ１０を成形する時間帯と、予備金型１０２によって（次の）他のプリプレグ１０を予備成形する時間帯を一致させる。すなわち、予備成形を終えているＮ−１番目（例えば９番目）のプリプレグ１０を本成形しているときに、Ｎ番目（例えば１０番目）のプリプレグ１０を予備成形する。つぎに、直前に予備成形を終えたＮ番目（例えば１０番目）のプリプレグ１０を本成形しているときに、Ｎ＋１番目（例えば１１番目）のプリプレグ１０を予備成形する。このようにして、図２に示すように、２つのプリプレグ１０を常に並行して成形する。このような成形方法によれば、一つの生産ラインにおいて、単位時間当たりの成形品２０の生産数を倍増することができる。 Here, as shown in FIG. 2, the time zone in which one prepreg 10 is molded by the mold 103 and the time zone in which the (next) other prepreg 10 is preformed by the spare mold 102 are matched. That is, when the N-1st (for example, 9th) prepreg 10 that has been preformed is being main-molded, the Nth (for example, 10th) prepreg 10 is preformed. Next, when the Nth (for example, 10th) prepreg 10 which has been preformed immediately before is main-molded, the N + 1th (for example, 11th) prepreg 10 is preformed. In this way, as shown in FIG. 2, the two prepregs 10 are always molded in parallel. According to such a molding method, the number of molded products 20 produced per unit time can be doubled in one production line.
つぎに、図３を参照して、プリプレグ１０の表面粗さと成形温度の関係を説明する。 Next, the relationship between the surface roughness of the prepreg 10 and the molding temperature will be described with reference to FIG.
プリプレグ１０の成形温度を下げる程、プリプレグ１０に含まれる樹脂（高分子）を冷却させるときの収縮量を低減することができる。その結果、図３に示すように、樹脂の冷却が完了したときのプリプレグ１０の表面粗さが小さくなる。したがって、成形品２０の外観品質を保つことができる。 As the molding temperature of the prepreg 10 is lowered, the amount of shrinkage when the resin (polymer) contained in the prepreg 10 is cooled can be reduced. As a result, as shown in FIG. 3, the surface roughness of the prepreg 10 when the cooling of the resin is completed becomes small. Therefore, the appearance quality of the molded product 20 can be maintained.
つぎに、図４および図５を参照して、プリプレグ１０の硬化度と硬化時間の関係を成形温度の観点から説明する。 Next, with reference to FIGS. 4 and 5, the relationship between the degree of curing and the curing time of the prepreg 10 will be described from the viewpoint of the molding temperature.
図４に示すように、プリプレグ１０に含まれる樹脂は、プリプレグ１０の成形温度を上げる程、３次元架橋（重合）の速度が上がる。すなわち、プリプレグ１０の成形温度を上げる程、樹脂の硬化反応が促進される。その結果、樹脂の硬化時間が短縮される。したがって、成形品２０の生産性が上がる。 As shown in FIG. 4, the resin contained in the prepreg 10 increases the speed of three-dimensional cross-linking (polymerization) as the molding temperature of the prepreg 10 increases. That is, as the molding temperature of the prepreg 10 is raised, the curing reaction of the resin is promoted. As a result, the curing time of the resin is shortened. Therefore, the productivity of the molded product 20 is increased.
具体的には、図５に示すように、プリプレグ１０に含まれる樹脂は、その成形温度（Ｄ℃＞Ｃ℃＞Ｂ℃＞Ａ℃）を上げる程、硬化が完了するまでの時間が短縮される（成形品２０の生産性が上がる）。すなわち、プリプレグ１０の成形温度を上げると、プリプレグ１０の成形時間を短縮することができる。樹脂は、外気に暴露した状態において室温Ｔｒ［℃］以上で硬化が進行する。 Specifically, as shown in FIG. 5, as the molding temperature (D ° C> C ° C> B ° C> A ° C) of the resin contained in the prepreg 10 is raised, the time required for curing to be completed is shortened. (The productivity of the molded product 20 is increased). That is, if the molding temperature of the prepreg 10 is raised, the molding time of the prepreg 10 can be shortened. Curing of the resin proceeds at room temperature Tr [° C.] or higher when exposed to the outside air.
ここで、プリプレグ１０に含まれる樹脂は、３次元架橋が始まる第１温度Ｔ１［℃］以上に加温されると、その後に加温が中止されても、自ら発熱して硬化が完了する。一方、樹脂は、３次元架橋が始まる第１温度Ｔ１［℃］に達する前に加温が中止されると、温度が低下すると共に軟化して元の硬度に戻る。樹脂は、３次元架橋が始まる直前の時点において、例えば１０％程度硬化が進む。３次元架橋が始まる直前の時点における樹脂の硬化の程度は、樹脂の材質等に依存する。 Here, when the resin contained in the prepreg 10 is heated to a temperature T1 [° C.] or higher at which the three-dimensional cross-linking starts, even if the heating is subsequently stopped, heat is generated by itself and curing is completed. On the other hand, if the heating of the resin is stopped before reaching the first temperature T1 [° C.] at which the three-dimensional cross-linking starts, the temperature decreases and the resin softens and returns to the original hardness. The resin is cured by, for example, about 10% at the time immediately before the start of the three-dimensional cross-linking. The degree of curing of the resin immediately before the start of the three-dimensional cross-linking depends on the material of the resin and the like.
（成形品２０の成形方法）
図６は、成形品２０の成形方法を示すフローチャートである。図７Ａ〜図７Ｅは、成形品２０の成形方法を示す模式図である。
(Molding method of molded product 20)
FIG. 6 is a flowchart showing a molding method of the molded product 20. 7A to 7E are schematic views showing a molding method of the molded product 20.
まず、図７Ａに示すように、巻回された長尺状のプリプレグ１０を伸長させつつ、一定の間隔毎に、切断刃１０１によって切断して個片化する。ここで、プリプレグ１０（成形材に相当）は、炭素繊維、ガラス繊維、および有機繊維等の織物シート（基材に相当）に対して、熱硬化性を備えたエポキシ樹脂やフェノール樹脂等の樹脂を含浸させたものである（図６のカット工程Ｓ１１）。 First, as shown in FIG. 7A, the wound long prepreg 10 is stretched and cut by the cutting blade 101 at regular intervals to be individualized. Here, the prepreg 10 (corresponding to the molding material) is a resin such as an epoxy resin or a phenol resin having thermosetting property with respect to a woven sheet (corresponding to a base material) such as carbon fiber, glass fiber, and organic fiber. Is impregnated (cutting step S11 in FIG. 6).
つぎに、図７Ｂに示すように、個片化されたプリプレグ１０を必要な厚みに調整するために複数枚積層する（図６の積層工程Ｓ１２）。 Next, as shown in FIG. 7B, a plurality of individualized prepregs 10 are laminated in order to adjust the thickness to a required thickness (lamination step S12 in FIG. 6).
つぎに、図７Ｃに示すように、複数枚積層されたプリプレグ１０を予備金型１０２によって予備成形する。予備金型１０２は、成形品２０の形状に対応している。予備金型１０２は、少なくとも固定型１０２Ｎにヒータ１０２Ｕを内蔵している。予備金型１０２の移動型１０２Ｍを上昇させて、固定型１０２Ｎに積層したプリプレグ１０を載置した後、移動型１０２Ｍを降下させてプリプレグ１０を挟み込み型締めする。ヒータ１０２Ｕによって温調した予備金型１０２によって、プリプレグ１０を３次元架橋が始まる第１温度Ｔ１［℃］よりも低い第２温度Ｔ２［℃］まで加温する。第２温度Ｔ２［℃］は、一例として、第１温度Ｔ１［℃］よりも若干低い温度とする。プリプレグ１０を第２温度Ｔ２［℃］まで加温してから、そのプリプレグ１０を予備金型１０２から取り出す（図６のプリフォーム工程Ｓ１３）。 Next, as shown in FIG. 7C, a plurality of laminated prepregs 10 are premolded by the spare mold 102. The spare mold 102 corresponds to the shape of the molded product 20. The spare mold 102 has a heater 102U built in at least the fixed mold 102N. The movable mold 102M of the spare mold 102 is raised to place the prepreg 10 laminated on the fixed mold 102N, and then the mobile mold 102M is lowered to sandwich and mold the prepreg 10. The reserve mold 102, which is temperature-controlled by the heater 102U, heats the prepreg 10 to a second temperature T2 [° C.], which is lower than the first temperature T1 [° C.] at which three-dimensional cross-linking begins. The second temperature T2 [° C.] is, for example, a temperature slightly lower than the first temperature T1 [° C.]. After the prepreg 10 is heated to the second temperature T2 [° C.], the prepreg 10 is taken out from the reserve mold 102 (preform step S13 in FIG. 6).
すなわち、実施形態では、プリプレグ１０の硬化反応を促進するために、プリプレグ１０に含まれる樹脂を３次元架橋が始まる第１温度Ｔ１［℃］直前の第２温度まで加温する。樹脂は、図５に示す３次元架橋領域まで反応が促進されると、形状の追随性が低下することから、図５に示す初期架橋領域の範囲内において加温する。 That is, in the embodiment, in order to accelerate the curing reaction of the prepreg 10, the resin contained in the prepreg 10 is heated to the second temperature immediately before the first temperature T1 [° C.] at which the three-dimensional cross-linking starts. When the reaction is promoted to the three-dimensional crosslinked region shown in FIG. 5, the resin has a reduced shape followability. Therefore, the resin is heated within the range of the initial crosslinked region shown in FIG.
つぎに、図７Ｄに示すように、第２温度まで加温され予備成形された状態のプリプレグ１０を、金型１０３によってさらに加温しつつ本成形する。金型１０３は、成形品２０の形状に対応している。金型１０３は、少なくとも固定型１０３Ｎにヒータ１０３Ｕを内蔵している。金型１０３の移動型１０３Ｍを上昇させて、固定型１０３Ｎに予備成形されたプリプレグ１０を載置した後、移動型１０３Ｍを降下させて、予備成形された状態のプリプレグ１０を挟み込み型締めする。ヒータ１０３Ｕによって温調した金型１０３によって、プリプレグ１０を第１温度Ｔ１［℃］以上であってガラス転移温度Ｔｇ［℃］以下の温度に加温する。一例として、樹脂をガラス転移温度Ｔｇ［℃］まで加温する。プリプレグ１０の硬化反応が完了してから冷却して、そのプリプレグ１０を金型１０３から取り出し、プレス成形を完了する（図６の成形工程Ｓ１４）。 Next, as shown in FIG. 7D, the prepreg 10 in a preformed state that has been heated to the second temperature is main-molded while being further heated by the mold 103. The mold 103 corresponds to the shape of the molded product 20. The mold 103 has a heater 103U built into at least the fixed mold 103N. The movable mold 103M of the mold 103 is raised to place the preformed prepreg 10 on the fixed mold 103N, and then the movable mold 103M is lowered to sandwich and mold the preformed prepreg 10. The prepreg 10 is heated to a temperature equal to or higher than the first temperature T1 [° C.] and lower than the glass transition temperature Tg [° C.] by the mold 103 whose temperature is controlled by the heater 103U. As an example, the resin is heated to the glass transition temperature Tg [° C.]. After the curing reaction of the prepreg 10 is completed, the prepreg 10 is cooled, the prepreg 10 is taken out from the mold 103, and press molding is completed (molding step S14 in FIG. 6).
ここで、図７Ｃに示す予備成形（プリフォーム工程Ｓ１３）と、図７Ｄに示す本成形（成形工程Ｓ１４）を、図２に示すように同時に行う。すなわち、予備成形を終えた一のプリプレグ１０を本成形しているときに、次に生産する他のプリプレグ１０を予備成形する。このようにして、プリプレグ１０から成形品２０を連続的に成形する。このような成形方法によれば、一つの生産ラインにおいて、単位時間当たりの成形品２０の生産数を倍増することができる。 Here, the preforming (preform step S13) shown in FIG. 7C and the main molding (molding step S14) shown in FIG. 7D are simultaneously performed as shown in FIG. That is, while one prepreg 10 that has been preformed is being main-molded, the other prepreg 10 to be produced next is preformed. In this way, the molded product 20 is continuously molded from the prepreg 10. According to such a molding method, the number of molded products 20 produced per unit time can be doubled in one production line.
つぎに、図７Ｅに示すように、本成形されたプリプレグ１０を板状の載置台１０５に載置し、プリプレグ１０の外縁を切断刃１０４によって切断して廃棄し、成形品２０を完成させる（図６のトリム工程Ｓ１５）。 Next, as shown in FIG. 7E, the molded prepreg 10 is placed on a plate-shaped mounting table 105, and the outer edge of the prepreg 10 is cut by the cutting blade 104 and discarded to complete the molded product 20 ( The trim step S15 in FIG. 6).
以上説明した実施形態の作用効果を説明する。 The action and effect of the embodiments described above will be described.
成形品２０の成形方法は、基材（炭素繊維に相当）に樹脂を含浸させてなるプリプレグ１０（成形材に相当）を用いて成形品２０を連続的に成形する方法である。かかる成形品２０の成形方法は、プリプレグ１０を３次元架橋が始まる第１温度Ｔ１［℃］よりも低い第２温度Ｔ２［℃］まで加温しつつ成形品２０の形状に対応した予備金型１０２によって予備成形した後、プリプレグ１０を第１温度Ｔ１［℃］以上で加温しつつ成形品２０の形状に対応した金型１０３によって本成形する工程を有する。かかる工程は、金型１０３によって一のプリプレグ１０を成形する時間帯と、予備金型１０２によって他のプリプレグ１０を予備成形する時間帯と、を少なくとも一部重複させる。 The molding method of the molded product 20 is a method of continuously molding the molded product 20 using a prepreg 10 (corresponding to a molding material) obtained by impregnating a base material (corresponding to carbon fiber) with a resin. In the molding method of the molded product 20, the reserve mold corresponding to the shape of the molded product 20 is heated while heating the prepreg 10 to a second temperature T2 [° C.] lower than the first temperature T1 [° C.] at which the three-dimensional cross-linking starts. After pre-molding with 102, the prepreg 10 is heated at a first temperature of T1 [° C.] or higher, and is main-molded with a mold 103 corresponding to the shape of the molded product 20. In this step, at least a part of the time zone in which one prepreg 10 is molded by the mold 103 and the time zone in which the other prepreg 10 is premolded by the reserve mold 102 are overlapped.
かかる成形品２０の成形方法によれば、予備成形および本成形の際にプリプレグ１０をガラス転移温度Ｔｇ［℃］よりも高温にしないことから、加温したプリプレグ１０を冷却するときの収縮量を低減できる。また、かかる成形品２０の成形方法によれば、（予備成形を終えた）一のプリプレグ１０を本成形しているときに、（次の）他のプリプレグ１０を予備成形することから、複数のプリプレグ１０を同時に成形することができる。したがって、かかる成形品２０の成形方法によれば、生産性を低下させることなく外観品質を保つことができる。 According to the molding method of the molded product 20, the prepreg 10 is not heated to a temperature higher than the glass transition temperature Tg [° C.] during pre-molding and main molding, so that the amount of shrinkage when the heated prepreg 10 is cooled can be reduced. Can be reduced. Further, according to the molding method of the molded product 20, a plurality of (next) other prepregs 10 are preformed during main molding of one (preformed) prepreg 10. The prepreg 10 can be molded at the same time. Therefore, according to the molding method of the molded product 20, the appearance quality can be maintained without lowering the productivity.
工程は、本成形においてプリプレグ１０をガラス転移温度Ｔｇ［℃］まで加温することが好ましい。 In the main step, it is preferable to heat the prepreg 10 to the glass transition temperature Tg [° C.] in the main molding.
かかる成形品２０の成形方法によれば、本成形に必要な時間を最も短縮して、生産性を向上させることができる。 According to the molding method of the molded product 20, the time required for the main molding can be shortened most and the productivity can be improved.
工程は、金型１０３によって一のプリプレグ１０を成形する時間帯と、予備金型１０２によって他のプリプレグ１０を予備成形する時間帯と、を一致させることが好ましい。 In the step, it is preferable that the time zone in which one prepreg 10 is molded by the mold 103 and the time zone in which the other prepreg 10 is premolded by the spare mold 102 are matched.
かかる成形品２０の成形方法によれば、予備成形を終えたプリプレグ１０を本成形するときに待ち時間や空き時間が発生しないことから、生産性を向上させることができる。 According to the molding method of the molded product 20, the productivity can be improved because no waiting time or free time is generated when the prepreg 10 which has been preformed is main-molded.
工程は、温調した予備金型１０２および金型１０３によってプリプレグ１０を加温することが好ましい。 In the step, it is preferable to heat the prepreg 10 by the temperature-controlled reserve mold 102 and the mold 103.
かかる成形品２０の成形方法によれば、プリプレグ１０を簡便かつ効率的に加温することができる。 According to the molding method of the molded product 20, the prepreg 10 can be heated easily and efficiently.
そのほか、本発明は、特許請求の範囲に記載された構成に基づき様々な改変が可能であり、それらについても本発明の範疇である。 In addition, the present invention can be modified in various ways based on the configurations described in the claims, and these are also within the scope of the present invention.
例えば、図７Ｄに示す本成形（成形工程Ｓ１４）に必要な時間が、図７Ｃに示す予備成形（プリフォーム工程Ｓ１３）に必要な時間の半分であれば、プリプレグ１０を本成形する金型１０３を１台使用し、かつ、プリプレグ１０を予備成形する予備金型１０２を２台使用して、成形品２０の生産を行うことができる。このように成形品２０を生産すれば、前工程（プリフォーム工程Ｓ１３）から後工程（成形工程Ｓ１４）に至る際に、互いの工程に空き時間が生じないことから、成形品２０の生産性を維持することができる。 For example, if the time required for the main molding (molding step S14) shown in FIG. 7D is half the time required for the preforming (preform step S13) shown in FIG. 7C, the mold 103 for main molding the prepreg 10 The molded product 20 can be produced by using one unit and using two spare molds 102 for preforming the prepreg 10. When the molded product 20 is produced in this way, the productivity of the molded product 20 is increased because there is no free time in each process from the pre-process (preform step S13) to the post-process (molding step S14). Can be maintained.
１０ プリプレグ（成形材）、
２０ 成形品、
１０１，１０４ 切断刃、
１０２ 予備金型、
１０３ 金型、
１０２Ｍ，１０３Ｍ 移動型、
１０２Ｎ，１０３Ｎ 固定型、
１０２Ｕ，１０３Ｕ ヒータ、
１０５ 載置台、
Ｓ１１ カット工程、
Ｓ１２ 積層工程、
Ｓ１３ プリフォーム工程（工程）、
Ｓ１４ 成形工程（工程）、
Ｓ１５ トリム工程、
Ｔ１ 第１温度（樹脂の３次元架橋が始まる温度）、
Ｔ２ 第２温度（第１温度よりも低い温度）、
Ｔｃ （樹脂の）硬化温度、
Ｔｇ （樹脂の）ガラス転移温度、
Ｔｒ 室温。
10 prepreg (molding material),
20 Molded product,
101,104 cutting blade,
102 Spare mold,
103 mold,
102M, 103M mobile type,
102N, 103N fixed type,
102U, 103U heater,
105 mounting stand,
S11 cutting process,
S12 Laminating process,
S13 Preform process (process),
S14 Molding process (process),
S15 trim process,
T1 first temperature (temperature at which three-dimensional cross-linking of resin begins),
T2 2nd temperature (lower than 1st temperature),
Tc (resin) curing temperature,
Tg (resin) glass transition temperature,
Tr room temperature.
Claims (3)
前記成形材を３次元架橋が始まる第１温度よりも低い第２温度まで加温しつつ前記成形品の形状に対応した予備金型によって予備成形した後、前記成形材を前記第１温度以上でガラス転移温度以下まで加温しつつ前記成形品の形状に対応した金型によって本成形する工程を有し、
前記工程は、前記金型によって一の前記成形材を成形する時間帯と、前記予備金型によって他の前記成形材を予備成形する時間帯と、を少なくとも一部重複させる、成形品の成形方法。 A method of continuously molding a molded product using a molding material obtained by impregnating a base material with resin.
After pre-molding the molded material with a preliminary mold corresponding to the shape of the molded product while heating it to a second temperature lower than the first temperature at which three-dimensional cross-linking starts, the molded material is heated at the first temperature or higher. It has a step of main molding with a mold corresponding to the shape of the molded product while heating to the glass transition temperature or lower .
The step is a method for molding a molded product, in which at least a part of a time zone for molding one molding material with the mold and a time zone for premolding another molding material with the spare mold overlap. ..
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