JP6751554B2 - Lead frame used for resin molded body for mounting light emitting element, surface mount type light emitting device, and resin molded body for mounting light emitting element - Google Patents

Description

The present invention relates to a resin molded body for mounting a light emitting element, a surface mount type light emitting device, and a lead frame used for a resin molded body for mounting a light emitting element.

A light emitting device equipped with a light emitting element such as a light emitting diode (LED) or a laser diode (LD) can emit high-intensity light having excellent visibility, can be miniaturized, and consumes low power. It has many advantages such as long life. For this reason, the light emitting device is used as, for example, a light bulb, a downlight, a base light, a street light, a lighting fixture such as a traffic light, a backlight source such as a liquid crystal display, and the use thereof is rapidly expanding.

Such a light emitting device includes, for example, a lead frame having plate-shaped first leads and second leads arranged apart from each other and arranged on the same surface, and side edges of the first leads and the second leads. An insulating resin layer that is integrally molded into a portion and integrally connects the first lead and the second lead, and the upper and lower surfaces thereof are flush with each other with respect to the upper and lower surfaces of the leads. A light emitting element is mounted on the surfaces of the first lead and the second lead in a flat type resin molded body for mounting a light emitting element in which the upper and lower surfaces of the leads are exposed, and the light emitting element is further mounted. Those coated with a translucent resin layer to cover are provided (see, for example, Patent Document 1 (FIG. 16 and the like)).

Generally, in such a surface mount type light emitting device, a MAP (Mold Array Package) type lead frame in which a unit mounting area composed of a first lead and a second lead is connected in a plurality of lattices vertically and horizontally via a connecting piece is provided. A resin molded body for mounting a light emitting element is manufactured by installing it in a molding mold, injecting and thermosetting a curable resin into a gap between leads, and integrally molding a resin layer, and further, a predetermined position of each unit mounting region. A light-emitting element is mounted on each of the above, and the entire surface is covered with a translucent resin layer to produce an optical semiconductor package. Then, by cutting this package with a cutting blade, a plurality of individualized light-emitting devices can be efficiently produced. Manufactured.

In addition to the types of surface mount type light emitting devices, a non-flat reflector type light emitting element mounting resin molded body in which a reflector is integrally molded on a lead as a part of a resin layer is manufactured, and each lead in the reflector Various types are also provided in which a light emitting element is mounted on an exposed surface and the reflector is filled with a translucent resin layer covering the light emitting element (see, for example, Patent Documents 2 and 3).

In any of these surface-mounted light emitting devices, adhesion between the lead frame and the resin layer, that is, cracking due to peeling between the lead frames, and the like are problems, and in order to improve the mechanical strength against such cracking, As described in Patent Documents 1 to 3, a step is formed on the side edge of each lead on the lead frame side, which is formed by a notch groove notched on one of the upper and lower surfaces in the plate thickness direction, and is connected to the resin layer. In order to increase the contact area to improve the adhesion, and to improve the adhesion of the insulating part between the first lead and the second lead, which are particularly lacking in strength, a plurality of leads along the opposite edges of each lead. An uneven shape is provided (see Patent Document 2), and an anchor hole is provided in a lead region embedded by a reflector of a resin molded body for mounting a reflector type light emitting element to prevent peeling (cracking) (Patent). Reference 3) and the like have been proposed.

However, if a step or uneven shape is provided on the side edge of the lead as described above, the volume of the lead, which is a metal, is reduced by that amount, which is disadvantageous from the viewpoint of heat dissipation of the mounted light emitting element, and the lead is scraped. As a result, the strength of the lead frame itself is also reduced, so there is a certain limit to improving the mechanical strength. Further, particularly in the case of a flat type resin molded body for mounting a light emitting element, a three-dimensional structural part called a reflector is omitted, and only a low-strength translucent resin is coated, so that it is more mechanical than the reflector type. The strength is low, and it is not possible to form an anchor hole like the reflector type.

Therefore, in particular, a flat type resin molded body for mounting a light emitting element is individually mounted as a light emitting device when the light emitting element is mounted when it is taken out from the molding die, when it is managed after being taken out, or when the light emitting element is mounted. There is a risk that the lead side edge and the resin layer will peel off due to shearing force and crack during cutting, and the adhesion between the lead and the resin layer, mechanical strength against cracking, etc. There was a strong demand for improvement.

Japanese Unexamined Patent Publication No. 2015-133363 Japanese Unexamined Patent Publication No. 2014-199873 Japanese Unexamined Patent Publication No. 2015-56591

Therefore, what the present invention seeks to solve in view of the above-mentioned situation is a flat type light emitting element mounting resin capable of further increasing the adhesion between the lead frame and the resin layer, that is, the mechanical strength against peeling (cracking). A point of providing a molded body, a surface mount type light emitting device in which a light emitting element is mounted on the resin molded body, and a lead frame used for the resin molded body for mounting the light emitting element.

In the present invention, in order to solve the above-mentioned problems, a lead frame having plate-shaped first leads and second leads arranged apart from each other and arranged on the same surface, and each lead of the first lead and the second lead. It is an insulating resin layer that is continuously integrally molded with the side edge portion of the above and integrally connects the first lead and the second lead, and the upper and lower surfaces thereof are connected flush to the upper and lower surfaces of each lead. A flat type resin molded body for mounting a light emitting element, which is provided with a resin layer and the upper and lower surfaces of the leads are exposed, and at least one of the first lead and the second lead of the lead frame. A through hole penetrating vertically and a bottomed communication groove open on one of the upper and lower surfaces extending from the opening of the through hole to the side edge portion of the lead are provided, and the resin layer is formed by the integral molding. A resin molded body for mounting a light emitting element is configured, characterized in that the through hole is provided with an anchor portion formed by flowing the molding resin through the communication groove.

Here, it is preferable that the through hole is provided at a position close to the opposite edge portion on the side where the first lead and the second lead face each other among the side edge portions of the lead.

In particular, it is preferable that the through hole is provided at the lead corner portion facing the end of the facing edge portion.

Further, the side edge portion in which the communication groove is continuous from the opening of the through hole to the end of the facing edge portion and forms the lead corner portion together with the facing edge portion. It is preferable that it extends to.

Further, it is preferable that the through holes are provided at two lead corners facing both ends of the facing edge portions.

Further, it is preferable that the communication groove is a groove formed by half-etching. The half-etching process means etching from one side of the lead frame and processing it to an arbitrary thickness, and the thickness is not particularly limited to 50%. The same applies not only to the processing of the communication groove but also to the case of using it for processing other parts.

Further, it is preferable that the through hole has a larger opening area of the opening on the opposite side of the upper and lower sides than the opening through which the communication groove communicates.

In particular, it is preferable that the openings on the opposite sides of the top and bottom are formed of an outwardly spreading tapered inner peripheral surface formed by half-etching.

Further, a step formed by a notch groove notched on the communication groove side in the plate thickness direction is formed at the side edge portion where the communication groove extends, and the communication groove is formed in the notch groove. Those that communicate with each other are preferable.

In particular, it is preferable that the notch groove is a groove formed by half-etching.

Further, it is preferable that the lead frame has a plurality of unit mounting regions composed of the first lead and the second lead arranged vertically and horizontally on the same surface via a connecting portion.

Further, it is preferable that the resin molded product is a transfer molded product. The transfer molded body is a molded body formed by transfer molding.

Further, the present invention provides a surface mount type light emitting device including the resin molded body for mounting each light emitting element according to the present invention and a light emitting element mounted so as to be energized on the surfaces of the first lead and the second lead. Also configure.

Here, it is preferable that a translucent resin layer made of a translucent resin covering the light emitting element is further provided.

Further, the present invention is a lead frame used for each of the resin molded bodies for mounting a light emitting element according to the present invention, the plate-shaped first lead and the second lead which are separated from each other and arranged on the same surface. In at least one of the first lead and the second lead, the through hole penetrated vertically and one of the upper and lower surfaces extending from the opening of the through hole to the side edge portion of the lead had an opening. A lead frame provided with the communication groove on the bottom is also provided.

According to the invention of the present application as described above, despite the flat type, an anchor portion continuous in the through hole of the lead is integrally molded in the resin layer, and the adhesion and integrity of the resin layer and the lead frame (lead) are associative. It is possible to significantly increase the mechanical strength against cracks between the two. That is, in the present invention, at least one of the first lead and the second lead of the lead frame is opened to a through hole that penetrates vertically and one of the upper and lower surfaces that extends from the opening of the through hole to the side edge of the lead. A bottomed communication groove is provided, and by integrally molding the resin layer, the molding resin flows through the communication groove and an anchor portion is formed even though there is no molding space for the reflector in the through hole. Will be done.

Compared to providing a step on the lead side edge or providing an uneven shape, such an anchor portion is made of a metal material because the through hole communicates with the outside of the lead through a bottomed communication groove that maintains the metal material. It is possible to suppress the reduction in the volume of the lead, secure the heat dissipation of the mounted light emitting element, suppress the decrease in the strength of the lead frame itself, and the metal bottom of the communication groove is a molding resin compared to a simple recess. The effect of improving the adhesiveness and mechanical strength such as peeling and cracking is also remarkably excellent. Of course, the present invention can further improve the mechanical strength such as adhesion and cracking in combination with the above-mentioned conventional steps and uneven shapes.

Further, since the through hole is provided at a position close to the opposite edge portion on the side where the first lead and the second lead face each other in the side edge portion of the lead, there is no connection piece for connecting the leads. It is possible to efficiently reinforce the mechanical strength of the insulating portion between the leads, which is relatively prone to peeling and cracking, against the cracking and the like.

In particular, since the through hole is provided at the lead corner facing the end of the facing edge portion, the lead corner is likely to be the first trigger for peeling / cracking of the insulating portion between the first lead and the second lead. It is possible to improve the adhesion and unity at the position of the part and to reinforce it efficiently. Further, in the case of the lead corner portion, the communication groove can be provided near the lead corner portion as compared with the one provided near the center of the facing edge portion, and it is easy to smoothly flow the molding resin through the communication groove portion. As a result, the anchor portion integrally molded as the resin layer can also be obtained with high strength without defects.

Further, if there is a through hole near the center of the facing edge portion, the possibility that the light emitting element is mounted on the anchor portion increases, and in that case, it is not so preferable in terms of heat dissipation and conductivity, but the above-mentioned By providing it at the corner of the lead as shown, such a possibility is reduced, and when mounting on the anchor portion is avoided, the mounting workability is improved.

Further, the side edge portion in which the communication groove is continuous from the opening of the through hole to the end of the facing edge portion and forms the lead corner portion together with the facing edge portion. Since it extends to the opposite edge portion, the molding resin smoothly flows from the communication groove, and the molding efficiency and quality of the anchor portion can be improved. That is, when the communication groove extends to the opposite edge portion, the molding resin that has once flowed between the leads changes its direction and flows into the communication groove, but the communication groove extends in the direction of the side edge portion. As a result, the communication groove is in the direction along the flow direction of the molding resin flowing between the leads, the molding resin flows more smoothly, and the through holes are efficiently filled.

Further, since the through holes are provided at the two lead corners facing both ends of the facing edge portions, the cracking can be prevented more reliably.

Further, the communication groove can be easily and efficiently formed by half-etching.

Further, since the through hole is set to have a larger opening area of the opening on the vertically opposite side than the opening through which the communication groove communicates, it is possible to prevent the anchor portion of the resin layer to be molded from coming off. , Adhesion and integrity can be further enhanced, and mechanical strength against cracks and the like can be further enhanced.

Further, the openings on the opposite sides can be easily and efficiently formed on the tapered inner peripheral surface that spreads outward by half-etching.

Further, a step formed by a notch groove notched on the communication groove side in the plate thickness direction is formed at the side edge portion where the communication groove extends, and the communication groove communicates with the inside of the notch groove. Since it has a structure, the molding resin that has flowed into the notch groove flows into the communication groove as it is, and the through hole is efficiently filled.

Further, the notch groove can be easily and efficiently formed by half-etching like the conventional step, and the communication groove can be efficiently formed by half-etching at the same time, which can improve the manufacturing efficiency. it can.

The plan view which shows the resin molded body for mounting a light emitting element which concerns on the typical embodiment of this invention. Similarly, an enlarged plan view of the resin molded body for mounting the light emitting element as seen from the upper surface side. Similarly, an enlarged bottom view seen from the lower surface side of the resin molded body for mounting the light emitting element. (A) is an enlarged plan view of the resin molded body for mounting a light emitting element as seen from the upper surface side, (b) is a sectional view taken along the line AA of (a), and (c) is a sectional view taken along line BB of (a). Similarly, an enlarged bottom view seen from the lower surface side of the resin molded body for mounting the light emitting element. The plan view which shows the lead frame also used for the resin molded body for mounting a light emitting element. Similarly, an enlarged plan view seen from the upper surface side of the lead frame. Similarly, an enlarged bottom view seen from the lower surface side of the lead frame. (A) is an enlarged plan view of the lead frame as seen from the upper surface side, (b) is a CC sectional view, and (c) is a DD sectional view. Similarly, an enlarged bottom view seen from the lower surface side of the lead frame. A perspective view showing a light emitting device also made of a resin molded body for mounting a light emitting element. (A) is a plan view showing a sample of Example 1, and (b) is a plan view showing a sample of Comparative Example 1.

Next, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 1 to 5, the resin molded body M for mounting a light emitting element according to the present invention has plate-shaped first leads 21 and second leads 22 that are separated from each other and arranged on the same surface. The frame F is integrally formed with the side edges 21c and 22c of the first lead 21 and the second lead 22, and the first lead 21 and the second lead 22 are integrally connected to each other. The resin layer 4 includes a resin layer 4 whose upper and lower surfaces are flush with respect to the upper and lower surfaces 21a, 21b, 22a, 22b of the leads, and the upper and lower surfaces 21a, 21b of the leads 21 and 22. , 22a, 22b are configured as a flat type with exposed parts.

In particular, at least one of the first lead 21 and the second lead 22 of the lead frame F has a through hole 60 that penetrates vertically and an opening 60b of the through hole 60, as shown in FIGS. 4 and 5. An anchor groove 23 formed of an open bottomed communication groove 61 is provided on one of the upper and lower surfaces extending to the side edge portion 21c / 22c of the lead 21/22, and the resin layer 4 integrally formed therein is provided with an anchor groove 23. Is provided with an anchor portion 41 formed by flowing a molding resin through a communication groove 61 into a through hole 60 of the anchor groove 23. In this way, the anchor portion 41 can be integrally molded with the resin layer 4 in spite of the flat type through the communication groove 61, and the adhesion and integrity between the resin layer 4 and the lead frames F (leads 21 and 22) can be improved. It is enhanced and the mechanical strength against cracks between the two is significantly improved.

As shown in FIGS. 6 to 10, in the lead frame F, a plurality of unit mounting regions 1 composed of the first lead 21 and the second lead 22 are arranged in a matrix vertically and horizontally on the same surface via the connecting portion 3. It was done. The first lead 21 and the second lead 22 of each unit mounting area 1 have the same vertical dimension and horizontal dimension, and have a shape that is line-symmetric with respect to the gap 10 extending in the vertical direction between the leads, specifically, each. It is configured in a substantially rectangular shape. However, the present invention is not limited to such a shape and dimensional relationship between leads, and each lead may have a polygonal shape, an oval shape, or an irregular shape, or may be configured to have different shapes and dimensions. ..

The insulating portion 40 is formed by filling the gap 10 between the first lead 21 and the second lead 22 with resin. The insulating portion 40 extending in the vertical direction between the leads is originally a line in which cracks are likely to occur when a bending external force is applied. However, as described later, in this example, the anchor portion 41 is a side edge around each lead. Of the portions 21c / 22c, the leads facing the insulating portion 40 are provided at positions close to the opposite edge portions 21d / 22d on the opposite side, thereby improving the adhesion between the insulating portion 40 and each lead, making it difficult to crack, and bending. The strength is increased.

As shown in FIGS. 1 and 6, a substantially rectangular frame 11 that surrounds the aggregate at intervals is provided around the aggregate of the unit mounting area 1 that is connected in a plurality of vertically and horizontally. The aggregate is integrally supported by the frame 11 by being connected to the frame by the connecting pieces 12 extending from the leads 21 and 22 located on the outermost sides of the body and adjacent to the frame 11. There is. In this example, a plurality of unit mounting areas 1 are provided vertically and horizontally in this way, but a single row vertically or horizontally, or only one unit mounting area may be provided.

The lead frame F is formed by subjecting a substantially rectangular metal plate having a thin plate-like conductivity to a process such as etching or punching by pressing. The material of the metal plate is not particularly limited, but for example, iron, copper, phosphor bronze, copper alloy and the like can be used. Further, it is also preferable that the entire surface or a part of the surface is plated. The connecting portion 3 for connecting the unit mounting areas 1 in the vertical direction is provided with two connecting pieces between the adjacent leads 21, 21 and 22 and 22, respectively, and is connected in the horizontal direction. Also for No. 3, two connection pieces are provided between the adjacent leads 21 and 22 respectively.

Then, by cutting all of these connecting portions 3 extending in all directions of each unit mounting region 1 (the connecting portion 3 and the connecting piece 12 for the unit mounting region 1 adjacent to the frame body 11), each unit mounting region 1 is divided. It is configured so that it can be separated. The number of connecting portions 3 between the leads is not particularly limited, and the shape, inclination angle, and the like can be appropriately set. The same applies to the connecting piece 12. The connecting portion 3 and the connecting piece 12 are preferably half-etched so as to be thinner than the lead thickness in order to improve the flow of the resin in the resin layer 4.

The first lead 21 and the second lead 22 of the lead frame F are provided with anchor grooves 23 including the through holes 60 and the communication grooves 61 at two corners of the four corners on the side facing the gap 10. This is a lead corner portion where there is no problem in mounting the light emitting element 5 described later and resin easily flows into the lead corner portion, and the insulating portion 40 (gap 10) side which is likely to trigger peeling / cracking especially when an external bending force is applied. Anchor portions 41 are provided at the two corners of the above so as to be formed, and are provided at efficient positions in terms of increasing the mechanical strength of the resin molded body M for mounting a light emitting element.

In this example, only one through hole 60 is provided in each of these two corners, but two or more through holes may be provided in each corner. In this case, in order to prevent cracking, they may be arranged along the opposite edge portions 21d / 22d, but when approaching the central portion, the heat dissipation property and the strength decrease in relation to the light emitting element 5, so such a problem occurs. It should not occur. Further, when two or more through holes are provided in this way, a communication groove 61 that opens to the lead side edge portion 21c / 22c is provided only in the through hole located at the corner where the resin easily flows, and the other through holes are provided. It is preferable to provide a groove communicating with the above.

Further, when the left and right leads 21 and 22 have different sizes, through holes 60 may be provided at two corners on the side facing the gap 10 only for the larger lead. This is because when the sizes of the leads are different, the facing edge portion of the larger lead is located near the center of the unit mounting area, and cracks are likely to occur along the facing edge portion. Of course, also in this case, it is also preferable to provide through holes 60 at the two corners of both leads as in this example. In this example, the opening shape of each through hole 60 is circular, but other shapes may be used.

Further, when the surface of the lead frame F on which the light emitting element 5 is mounted is the upper surface and the opposite side is the lower surface, the communication grooves 61 forming the anchor groove 23 are through holes 60 formed in the leads 21 and 22. Extends from the opening 60b on the lower surface side toward the side edge portion 21e which is a side edge portion continuous with the end of the facing edge portion 21d / 22d and forms a lead corner portion together with the facing edge portion 21d / 22d. It is open. By opening to the side edge portion 21e in this way, the molding resin can easily flow into the through hole 60 through the communication groove 61 as compared with the case of opening to the opposite edge portion 21d / 22d, and the molding efficiency of the anchor portion 41 is improved. , The molding quality can be improved.

These bottomed communication grooves 61 can be easily and efficiently formed by half-etching. In this example, a step 24 formed by a notch groove notched on the lower surface side is formed on the side edge portion 21c of each of the leads 21 and 22, and the communication groove 61 is provided so as to open in the notch groove. .. The step 24 of the side edge portion 21c formed by the notch groove is also formed by half-etching, and is efficiently processed at the same time as the communication groove 61. By adopting a structure in which the communication groove 61 communicates with the notch groove of the step 24 in this way, the molding resin flowing into the notch groove flows efficiently into the communication groove 61 as it is, and the through hole 60 is efficiently filled. Will be done.

In this example, the bottomed communication groove 61 is formed by opening on the lower surface side of each lead, but it may be provided on the upper surface side. It can also be provided on both the upper and lower sides. Further, a second groove extending toward the facing edge portion 21d may be provided separately from the communication groove 61 extending toward the side edge portion 21e for one through hole 60. Further, it may be a substantially fan-shaped groove that opens at both edges.

The opening 60a on the upper surface side of the lead of the through hole 60 is set so that the opening area is larger than the opening 60b on the lower surface side through which the communication groove 61 communicates. Specifically, as shown in FIG. 9B, a tapered inner peripheral surface 60c that spreads outward is formed around the periphery excluding the side of the side edge portion 21e where the communication groove 61 extends. With such a configuration, the anchor portion 41 to be molded is prevented from coming off from the through hole 60, the adhesion and the integrity are further improved, and the mechanical strength against cracks and the like is further enhanced. Such an inner peripheral surface 60c can be easily and efficiently formed by half-etching the opening 60a from the upper surface side.

Various conventionally known methods can be adopted for integrally molding the resin layer 4 on the lead frame F, for example, a thermoplastic resin such as injection molding, transfer molding, RIM molding, casting molding, press molding, compression molding, etc. Various molding methods generally used for thermosetting resins such as epoxy resin and silicone resin are used. Of these, transfer molding is preferable in that the molding cycle is short and the moldability is good. The molding conditions can be set arbitrarily, for example, the molding temperature is also arbitrary, but 100 ° C. or higher, more preferably 120 ° C. or higher, and further, in terms of fast curing, short molding cycle, and easy moldability. A temperature of 150 ° C. or higher is preferable.

After molding by various methods as described above, it is also optional to post-cure (after-cure) if necessary. The heat resistance tends to be higher when the product is cured afterwards. The molding may be carried out at a constant temperature, but the temperature may be changed in multiple steps or continuously as required. It is preferable to carry out the reaction while raising the temperature in multiple steps or continuously rather than at a constant temperature in that a uniform cured product without distortion can be easily obtained. Further, it is preferable to carry out at a constant temperature in that the molding cycle can be shortened.

Although the curing time can be set variously, it is preferable to react at a relatively low temperature for a long time rather than reacting at a high temperature for a short time in that a uniform cured product without distortion can be easily obtained. On the contrary, it is preferable to react at high temperature for a short time in that the molding cycle can be shortened. The pressure at the time of molding can be variously set as needed, and molding can be performed under normal pressure, high pressure, or reduced pressure. Curing under reduced pressure is preferable in terms of suppressing the generation of voids, improving the filling property, and easily removing the volatile matter generated in some cases. In terms of preventing cracks in the molded product, it is preferable to cure the molded product under pressure.

At the time of molding, first, a predetermined mold having a cavity corresponding to the shape of the resin molded body for which the lead frame F is to be created, for example, fixed in two mold blocks, and the lead frame F is sandwiched between the cavities. The aggregates of the unit mounting regions 1A and 1B are housed and fixed therein, and the resin is supplied into the cavity to form the resin molded body M.

The mold is cavityless, and the lead frame F is clamped by a mold that is flat on both the top and bottom. The runners other than the aggregate can be manufactured by providing a cavity in the mold. The supplied molding resin spreads in the gap between the first lead 21 and the second lead 22, and is molded with the upper and lower surfaces of the first lead 21 and the second lead 22 exposed, and the resin molded product such as the reflector is formed. Not laminated. However, the notch groove forming the step 24 and the above-mentioned anchor groove 23 (through hole 60 and communication groove 61) are filled with molding resin, and the resin molded body M is substantially flat at the top and bottom and has protrusions such as reflectors. It is molded as a substantially flat one. That is, even though there is no molding space for the reflector, the molding resin flows into the through hole 60 through the communication groove 61, and the anchor portion 41 is formed.

The lower surfaces of the first lead 21 and the second lead 22 function as electrodes of the surface mount type light emitting device D. The upper surfaces of the leads 21 and 22 function as mounting surfaces for mounting the light emitting element 5 in an electrically connected state. Various resins can be used as the molding resin of the resin layer 4, and for example, a thermosetting resin can be preferably used. When a thermosetting resin is used, the resin can be reliably cured by heating the filled resin.

In the molded resin molded body M, burrs may be generated at the joint portion between the lead serving as the electrode portion and the resin layer 4, and it is preferable to remove the burrs from the viewpoint of ensuring the reliability of energization. Examples of the method for removing burrs include a method using electrolysis using the lead 21/22 as a cathode (electrolysis method) and a method of colliding particles as media with the resin molded product M (blast method). In the electrolysis method, hydrogen is generated on the lead surface, and the adhesion between the lead and the burr can be weakened by the atmospheric pressure at the time of gas generation. Such a method is a generally used method as shown in JP-A-63-252431, and can be performed by a method known in the present invention.

In electrolysis, the electrode is a general conductive material for both the anode and cathode, such as transition metals such as gold, platinum, silver, copper, iron, cobalt, nickel, zinc, and tin, alloys made of them, or carbon such as stainless steel. It is possible to use steels, graphite, indium tin oxide and the like. The electrolytic solution preferably contains an inorganic salt or hydroxide having a high degree of ionization. Further, from the viewpoint of safety, an electrolytic solution mainly containing a neutral or weakly basic inorganic salt is preferable. The concentration of the electrolytic solution is preferably 10 to 200 g / L, more preferably 30 to 100 g / L. If it is too dilute, electrolysis is not performed efficiently, which is not preferable, and if it is too thick, electrolysis may occur or the metal component of the lead may be eluted, which is not preferable.

The electrolysis conditions are preferably 1 to 10 A / dm ² in terms of current density, and more preferably ² to 7 A / dm ² . After electrolysis, the molded product may be washed with an aqueous solution containing an acid for the purpose of neutralizing the remaining basic components or removing the oxide film on the lead surface. The acids used are preferably inorganic acids and organic acids, particularly preferably hydrochloric acid, sulfuric acid, sulfite, persulfate, nitric acid, nitrite, boric acid, phosphoric acid and the like, and the organic acids are acetic acid and citric acid. , Tartrate acid, pyruvate, malic acid, ethylenediamine tetraacetic acid and the like are preferable. The blasting method can be performed using a known sandblasting device or wet blasting device. For example, the methods shown in Japanese Patent No. 4901184 and Japanese Patent No. 2620666 can be used.

Then, the light emitting element 5 is mounted in each unit mounting region 1 of the resin molded body M configured in this way. Specifically, the light emitting element 5 is flip-chip mounted so as to straddle between the first lead 21 and the second lead 22. As the light emitting element 5, various light emitting elements such as a light emitting diode can be used. Then, a translucent resin layer 6 made of a translucent resin is formed on the entire upper surface of the resin molded body M on which the light emitting element 5 is mounted, and the light emitting element 5 is sealed. In this example, flip-chip mounting is illustrated, but of course, a light emitting element mounted on a bonding wire can also be mounted.

Next, the resin molded body M in which the light emitting element 5 is sealed with the translucent resin is cut vertically and horizontally so as to separate the unit mounting regions 1 from each other, and is separated into individual units for each unit mounting region. A light emitting device D as shown in 11 is obtained. In addition to mounting and sealing the light emitting element and then separating it into individual pieces, it is possible to separate the light emitting elements into individual pieces after mounting and before sealing, and then individually seal the light emitting elements. It may be individually mounted and sealed.

Although the embodiments of the present invention have been described above, the present invention is not limited to these examples, and it goes without saying that the present invention can be implemented in various forms without departing from the gist of the present invention.

Hereinafter, the results of bending strength tests on the individualized resin molded product samples of Example 1 and Comparative Example 1 of the present invention will be described. The present invention is not limited to:

(Sample of Example 1)
In Example 1, a lead frame having the structure shown in FIGS. 6 to 10 was used. The lead frame was Ag-plated and made of Cu having a length of 50 mm, a width of 55 mm, and a thickness of 0.25 mm. The aggregate dimensions of the unit mounting area in the frame are 40.7 mm in length and 48.1 mm in width, and a total of 143 unit mounting areas are provided in 11 rows in length and 13 rows in width, and the pitch is 3.7 mm in both length and width. is there. The dimensions of the first lead and the second lead constituting each unit mounting area are 3.7 mm in length and 1.55 mm in width, respectively. The gap between the leads has a width of 0.2 mm, and each through hole formed at the two corners of each lead has an opening diameter of φ0.3 mm on the upper surface side, an opening diameter of φ0.2 mm on the lower surface side, and a communication groove. The width of is 0.2 mm.

A resin layer was integrally molded on this lead frame by transfer molding to obtain a resin molded body. For molding, the curable resin composition shown in Table 1 was prepared, and a tablet was prepared by the method shown below, and then molding was performed.

Production Example 1 of the component (B) is as follows. A stirrer, a dropping funnel, and a cooling tube were set in a 5 L four-necked flask. 1800 g of toluene and 1440 g of 1,3,5,7-tetramethylcyclotetrasiloxane were placed in this flask, and the mixture was heated and stirred in an oil bath at 120 ° C. A mixed solution of 200 g of triallyl isocyanurate, 200 g of toluene and 1.44 mL of a xylene solution of a platinum vinyl siloxane complex (containing 3 wt% as platinum) was added dropwise over 50 minutes. The obtained solution was heated as it was for 6 hours and stirred, and then unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure. By 1H-NMR measurement, this product has the following structure in which a part of the SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane reacts with triallyl isocyanurate.

For tableting, the curable resin composition prepared as described above was compressed with a tablet manufacturing tool consisting of a metal pestle and a mortar to obtain a tablet. Specifically, a predetermined amount of the compound was placed in a mortar having a diameter of 13 mm and compressed with a pestle at a pressure of 100 kg / cm ² for 5 seconds from above to obtain a tablet having a predetermined volume.

The transfer molding was carried out using a G-Line manual press manufactured by Apic Yamada Corporation. A mold clamping force of 40 tons, an injection pressure of 14 MPa, an injection speed of 3 mm / sec, and 5.0 g of a white compound were weighed, shaped into a columnar shape (tabletized as described above), loaded into a cylinder, and molded. The molding conditions were 170 ° C. and 150 seconds. The mold was cavityless, and the lead frame was clamped with a flat mold on both the top and bottom.

After molding, it was cured (after-cured) at 180 ° C. for 1 hour in a hot air oven, and then the lead frame was diced with a cutting disc to prepare a sample. FIG. 12A is a plan view showing an individualized sample of Example 1.

(Sample of Comparative Example 1)
In Comparative Example 1, each lead of the lead frame has no through hole and communication groove, and other than being omitted, other configurations of the lead frame, molding of the resin layer (resin composition, molding method, etc.), and individual pieces It is the same as the sample of Example 1 until the conversion. FIG. 12B is a plan view showing the individualized sample of Comparative Example 1.

(Bending strength test)
Bending strength tests were performed on each of the samples of Example 1 and Comparative Example 1. In the bending strength test, the bending breaking strength was measured by a texture analyzer (manufactured by TA XT plus, Stable Micro Systems) by a method based on the main body strength test of JISC6000068-2-77. However, in order to measure the breaking strength, the pressurization described in 5.4.1 c) of this standard is not retained, but the pressurizing jig is held by the insulating portion 40 whose longitudinal direction of the pressurizing jig is shown in FIGS. It was made parallel to the extending direction and lowered at a speed of 0.2 mm / sec to give a load to the main body, and the strength at break was evaluated as the bending strength. The results of the bending strength test are shown in Table 2.

From the results in Table 2, it can be seen that the resin molded product according to the present invention having an anchor portion has nearly twice the strength as compared with the one without the anchor portion.

1 Unit mounting area 3 Connecting part 4 Resin layer 5 Light emitting element 6 Translucent resin layer 10 Gap 11 Frame body 12 Connecting piece 21 1st lead 21a Upper surface 21b Lower surface 21c Side edge 21d Opposing edge 21e Side edge 22 2nd Lead 22a Upper surface 22b Lower surface 22c Side edge 22d Opposing edge 22e Side edge 23 Anchor groove 24 Step 40 Insulation 41 Anchor 60 Through hole 60a, 60b Opening 60c Inner peripheral surface 61 Communication groove D Light emitting device F Lead frame M Resin molded body

Claims (10)

A lead frame having a plate-shaped first lead and a second lead that are separated from each other and arranged on the same surface,
It is an insulating resin layer that is continuously integrally molded with the side edges of the first lead and the second lead, and integrally connects the first lead and the second lead, and the upper and lower surfaces thereof are each. It has a resin layer that is flush with the upper and lower surfaces of the lead.
A flat type resin molded body for mounting a light emitting element in which the upper and lower surfaces of each lead are exposed.
The lead frame is formed by connecting a plurality of unit mounting regions including the first lead and the second lead on the same surface via a connecting portion.
At least one of the first lead and the second lead of the lead frame has a through hole that penetrates vertically and a bottom that is open to one of the upper and lower surfaces extending from the opening of the through hole to the side edge of the lead. Is provided with a communication groove
The through hole is set to have a larger opening area of the opening on the opposite side than the opening through which the communication groove communicates.
At the side edge portion where the communication groove extends, a step formed by a notch groove notched on the communication groove side in the plate thickness direction is formed, and the communication groove communicates with the inside of the notch groove.
The connecting portion is thinner than the lead thickness and is provided on the vertically opposite side so as to be flush with the surface of the first lead or the second lead on the vertically opposite side.
A resin molded body for mounting a light emitting element, wherein the resin layer includes an anchor portion formed by flowing a molding resin into the through hole through the communication groove by the integral molding. The resin molded body for mounting a light emitting element according to claim 1, wherein the through hole is provided at a position close to the opposite edge portion on the side where the first lead and the second lead face each other in the side edge portion of the lead. The resin molded body for mounting a light emitting element according to claim 2, wherein the through hole is provided at a lead corner portion facing the end of the facing edge portion. The communication groove extends from the opening of the through hole to a side edge portion that is continuous with the end of the facing edge portion and forms the lead corner portion together with the facing edge portion. The resin molded body for mounting a light emitting element according to claim 3. The resin molded body for mounting a light emitting element according to claim 3 or 4, wherein the through holes are provided in two lead corners facing both ends of the facing edge portions. The present invention according to any one of claims 1 to 5 , wherein the lead frame is formed by connecting a plurality of unit mounting regions including the first lead and the second lead vertically and horizontally on the same surface via a connecting portion. Resin molded body for mounting light emitting elements. The resin molded body for mounting a light emitting element according to any one of claims 1 to 6 , wherein the resin molded body is a transfer molded body. The resin molded body for mounting a light emitting element according to any one of claims 1 to 7 .
A light emitting element mounted so as to be energized on each surface of the first lead and the second lead,
A surface mount type light emitting device equipped with. The surface mount type light emitting device according to claim 8 , further comprising a translucent resin layer made of a translucent resin that covers the light emitting element. It has a plate-shaped first lead and a second lead that are separated from each other and arranged on the same surface.
A plurality of unit mounting areas composed of the first lead and the second lead are continuously provided on the same surface via a connecting portion.
In at least one of the first lead and the second lead,
The through hole that penetrated vertically and
An open bottomed communication groove is provided on one of the upper and lower surfaces extending from the opening of the through hole to the side edge of the lead.
The through hole is set to have a larger opening area of the opening on the opposite side than the opening through which the communication groove communicates.
At the side edge portion where the communication groove extends, a step formed by a notch groove notched on the communication groove side in the plate thickness direction is formed, and the communication groove communicates with the inside of the notch groove.
Claims 1 to 1 in which the connecting portion is thinner than the lead thickness and is provided in a state of being close to the vertically opposite sides so as to be flush with the vertically opposite surfaces of the first lead or the second lead. A lead frame used for the resin molded body for mounting a light emitting element according to any one of 7 .

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