JP6749056B2 - Electrolytic plating equipment - Google Patents

Description

The present invention relates to an electrolytic plating device.

The electrolytic plating technique is widely used, for example, for wiring formation of a wiring board.

Here, FIG. 3 schematically shows a conventional electrolytic plating apparatus 30. In the conventional electroplating apparatus 30, a long plating tank 31 for immersing the object to be plated and a long plating tank 31 laid along the longitudinal direction of the plating tank 31 are provided with an electric current for electrolytic plating. The belt-shaped power supply electrode 32 for attachment, the transport carrier 33 that moves while transporting the object to be plated from one end side to the other end side in the longitudinal direction in the plating tank 31, and the transport carrier 33 are attached. And a current collector 34 that draws a current for electrolytic plating from the power supply electrode 32 by sliding on the power supply electrode 32 as the transport carrier 33 moves.

Next, FIG. 4 shows a schematic enlarged view of the periphery of the current collector 34 in the conventional electrolytic plating apparatus 30. Here, the same parts as those in FIG. 3 will be described with the same reference numerals.
The current collector 34 has a sliding surface 34a on the lower side, and is attached to the transport carrier 33 with the sliding surface 34a being pressed against the power supply electrode 32. The current collector 34 is fixed vertically to the upper surface of the current collector 34, and the other ends of the two columns 36 with the springs 35 in a compressed state are inserted into the through holes formed in the carrier 33 to transport the carrier 33. It is attached by fixing with a nut 37 on the upper surface of. Then, as the carrier 33 moves, the current collector 34 slides on the power supply electrode 32 to extract an electric current for electrolytic plating from the power supply electrode 32.

However, if the sliding surface 34a on the sliding direction side, where a large amount of friction is applied to the power supply electrode 32 due to the sliding of the current collector 34, is abraded, the current collection is accompanied by the movement of the carrier 33. The drag force applied to the power feeding electrode 32 causes the wire 34 to be in a forward leaning state, and may be caught in, for example, a joint of the power feeding electrode 32.
Therefore, there is a problem that the current collector 34 cannot sufficiently contact with the power supply electrode 32 and the current for electrolytic plating cannot be stably taken out, which causes a problem in the quality of the object to be plated.

JP-A-5-207608

An object of the present invention is that even if the current collector is tilted due to wear, the current collector can slide on the power supply electrode to stably take out an electric current for electrolytic plating. An object of the present invention is to provide an electroplating apparatus that can supply the.

The electrolytic plating apparatus according to the present invention is provided with a long plating bath for immersing the object to be plated, and is laid along the longitudinal direction of the plating tank to supply an electric current for electrolytic plating to the object to be plated. The strip-shaped power supply electrode and the object to be plated are conveyed from one end side, which is the rear side in the longitudinal sliding direction in the plating tank, to the other end side, which is the front side in the sliding direction. While having a carrier carrier that moves while having a long sliding surface along the power supply electrode on the lower side, while being attached to the carrier carrier while pressing the sliding surface onto the power supply electrode, A current collector for collecting current for electrolytic plating from the power supply electrode by sliding the sliding surface on the power supply electrode with the movement of the carrier. , Is pressed onto the power supply electrode by a pressing mechanism having at least one spring provided on each of the one end side and the other end side of the current collector, and the pressing force of the pressing mechanism on the one end side is pressed on the other end side. It is characterized by being larger than the pressing force of the mechanism.

According to the electrolytic plating apparatus of the present invention, the pressing force of the pressing mechanism provided on one end side of the current collector is set to be larger than the pressing force of the pressing mechanism provided on the other end side.
Therefore, even if the sliding surface on the other end side is worn, by pressing one end side of the current collector onto the power supply electrode with a force larger than that of the other end side, it is possible to prevent the current collector from tilting forward. .. This allows the current collector to slide on the power supply electrode to stably extract the current for electrolytic plating from the power supply electrode, and as a result, it is possible to supply an object to be plated of good quality. A plating apparatus can be provided.

FIG. 1 is a schematic diagram showing an example of an embodiment of an electrolytic plating apparatus according to the present invention. FIG. 2 is an enlarged view of a main part of the electrolytic plating apparatus shown in FIG. FIG. 3 is a schematic diagram showing a conventional electrolytic plating apparatus. FIG. 4 is an enlarged view of a main part of the electrolytic plating apparatus shown in FIG.

Next, an example of the embodiment of the electrolytic plating apparatus of the present invention will be described based on FIGS. 1 and 2. The same parts in FIGS. 1 and 2 are designated by the same reference numerals in the description.
The electroplating apparatus 10 of the present example is a long plating tank 11 for immersing the object to be plated, and is laid along the longitudinal direction of the plating tank 11, and supplies a current for electrolytic plating to the object to be plated. Band-shaped power supply electrode 12, a carrier 13 that moves while transporting the object to be plated from one end side to the other end side in the longitudinal direction in the plating tank 11, and the power supply electrode 12 to the carrier carrier 13. A current collector 14 that is attached in a state of being pressed by and that slides on the power feeding electrode 12 as the transport carrier 13 moves to take out an electric current for electrolytic plating from the power feeding electrode 12. ing.

The plating tank 11 is formed in a container shape by joining a plurality of flat plates made of vinyl chloride, for example, by welding. A plating solution is placed in the plating tank 11 and, for example, an object to be plated mounted on a rack is immersed. Further, an electrode (not shown) connected to the anode of the plating power source is arranged at a position facing the object to be plated connected to the cathode (not shown) of the plating power source.

The power supply electrode 12 is made of a metal having good conductivity such as copper, and is laid along the plating bath 11 described above. The power supply electrode 12 is connected to the cathode of the plating power supply. The upper surface of the power supply electrode 12 is polished smoothly, and the current collector 14 slides on the power supply electrode 12 to extract a current for electrolytic plating.

The transport carrier 13 is made of stainless steel that is resistant to corrosion by the plating solution, has an arm structure 15 for immersing the object to be plated in the plating tank 11, and moves the object to be plated immersed in the plating tank 11 in the longitudinal direction. It is equipped with a moving device for moving while conveying.

The current collector 14 is made of a highly conductive metal such as copper. As shown in FIG. 2, the current collector 14 has the sliding surface 14 a provided on the lower side in contact with the power supply electrode 12 and the other end side which is the front side with respect to the sliding direction of the current collector 14. , And via the pressing mechanism 16 provided on the rear end side. The pressing mechanism 16 includes a spring 17, a column 18, and a nut 19. The lower end of the column 18 having the compressed spring 17 mounted thereon is fixed vertically to the upper surface of the current collector 14. The upper end of the column 18 is inserted into a through hole formed in the carrier 13 and fixed by a nut 19 on the upper surface of the carrier 13 via a bush.
The pressing mechanism 16 on the other end side is provided with one spring, whereas the pressing mechanism 16 on one end side is provided with two springs, and the pressing mechanism 16 on the one end side supplies the current collector 14 to the power supply electrode 12 The force for pressing to is set to be larger than the force for pressing the current collector 14 to the power supply electrode 12 by the pressing mechanism 16 on the other end side. The current collector 14 is urged toward the power supply electrode 12 by these pressing mechanisms 16, and as a result of the movement of the carrier 13, the current collector 14 slides on the power supply electrode 12 while adhering well to the electrolytic plating. It has the function of taking out the current for power supply from the power supply electrode 12.
In the present invention, the pressing force of the pressing mechanism 16 on the one end side is set to be larger than the pressing force of the pressing mechanism 16 on the other end side. Therefore, even if the sliding surface 14a on the front side with respect to the sliding direction is worn, one end side of the current collector 14 is pressed onto the power supply electrode 12 with a larger force than the other end side, so that the current collector 14 is Can be prevented from leaning forward. This allows the current collector 14 to slide on the power supply electrode 12 to stably extract the current for electrolytic plating from the power supply electrode 12, and as a result, to supply an object to be plated of good quality. It is possible to provide an electrolytic plating apparatus capable of performing the above.

The present invention is not limited to the example of the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in this example, the pressing mechanism 16 on the other end side has one spring 17, whereas the pressing mechanism 16 on the one end side has two springs 17. The mechanism 16 includes the springs 17 one by one, and the spring constant of the spring 17 used for the pressing mechanism 16 on the one end side may be larger than the spring constant of the spring 17 used for the pressing mechanism 16 on the other end side. ..

10 Plating Device 11 Plating Tank 12 Power Supply Electrode 13 Carrier Carrier 14 Current Collector 16 Pressing Mechanism 17 Spring

Claims (2)

A long plating tank for immersing the object to be plated, and a strip-shaped power supply electrode that is laid along the longitudinal direction of the plating tank and supplies a current for electrolytic plating to the object to be plated. A carrier that moves while moving the object to be plated from one end side that is the rear side with respect to the longitudinal sliding direction in the plating tank to the other end side that is the front side with respect to the sliding direction. ,
It has a long sliding surface along the power feeding electrode on the lower side, and is attached to the transport carrier in a state where the sliding surface is pressed onto the power feeding electrode, and the transport carrier. A current collector for extracting the current for the electrolytic plating from the power feeding electrode by sliding the sliding surface on the power feeding electrode with the movement of the plating device,
The current collector is pressed onto the power supply electrode by a pressing mechanism having at least one spring provided on each of the one end side and the other end side of the current collector, and is pressed by the pressing mechanism on the one end side. The plating apparatus is characterized in that the pressure is larger than the pressing force of the pressing mechanism on the other end side. The plating apparatus according to claim 1, wherein the pressing mechanism on the other end side has one spring, and the pressing mechanism on the one end side has two springs.

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