JP6748795B2 - Electronics - Google Patents

Description

One embodiment of the present invention relates to a display device. Alternatively, the present invention relates to an electronic device including a display device.
In particular, the present invention relates to a flexible display device. Alternatively, the present invention relates to an electronic device including a flexible display device.

Note that one embodiment of the present invention is not limited to the above technical field. One embodiment of the invention disclosed in this specification and the like relates to an object, a method, or a manufacturing method. One aspect of the present invention relates to a process, machine, manufacture, or composition (composition of matter). Therefore, more specifically, as a technical field of one embodiment of the present invention disclosed in this specification, a semiconductor device,
A display device, a light-emitting device, a power storage device, a storage device, an electronic device, a lighting device, an input device, an input/output device, a driving method thereof, or a manufacturing method thereof can be given as an example.

Note that in this specification and the like, a semiconductor device generally means a device that can function by utilizing semiconductor characteristics. A semiconductor circuit such as a transistor, a semiconductor circuit, an arithmetic unit, and a memory device are one mode of the semiconductor device. The imaging device, the display device, the liquid crystal display device, the light emitting device, the electro-optical device, the power generation device (including the thin film solar cell, the organic thin film solar cell, etc.), and the electronic device are
It may have a semiconductor device.

In recent years, display devices are expected to be applied to various purposes and are being diversified. For example, display devices used in portable electronic devices and the like are required to be thin, lightweight, and less likely to be damaged. In addition, there is a demand for new applications that have never existed before.

In addition, Patent Document 1 discloses a flexible active matrix light emitting device including a transistor that is a switching element and an organic EL (Electro Luminescence) element on a film substrate.

JP, 2003-174153, A

In recent years, it has been considered to increase the display amount by increasing the display area of a display device to improve the listability of the display. On the other hand, in a mobile device application or the like, if the display area is enlarged, the portability (also referred to as portability) is reduced. Therefore, it has been difficult to achieve both high displayability and high portability.

Further, it is desired that the display panel be provided with an input means as a user interface. For example, there is a display device (touch panel) having a function of inputting by touching the screen with a finger or a stylus.

An object of one embodiment of the present invention is to provide an electronic device with excellent portability. Another object is to provide an electronic device with an excellent listability. Another object is to provide an electronic device that is not easily damaged. Another object is to provide an electronic device including a new input unit.

Alternatively, it is an object of one embodiment of the present invention to reduce the thickness of an electronic device. Another object is to reduce the weight of electronic devices. Another object is to provide a new electronic device.

Note that the description of these problems does not prevent the existence of other problems. One aspect of the present invention need not solve all of these problems. In addition, problems other than the above are naturally clarified from the description in the specification and the like, and problems other than the above can be extracted from the description in the specification and the like.

One embodiment of the present invention is an electronic device including a first support, a second support, a connecting portion, and a display panel. In addition, the display panel has a function of bending and displaying.
The first support body and the second support body are connected by a connecting portion, and the first support body and the second supporting body have a function of relatively rotating via the connecting portion. Further, the display panel has a portion fixed to the first support and is supported by the second support so as to be movable in one direction with respect to the second support. And

Another embodiment of the present invention is an electronic device including a first supporting body, a second supporting body, a connecting portion, a display panel, and a detecting means. The display panel has a function of bending and displaying, and has a function of connecting the first support body and the second support body by a connection portion and relatively rotating through the connection portion. The display panel has a portion fixed to the first support and is supported by the second support so as to be movable in one direction with respect to the second support. It has a function of changing the relative position of the second support when the body and the second support are relatively rotated. Further, the detection means is characterized by having a function of detecting the relative position between the display panel and the second support.

Further, in the above, the detection means includes a light emitting element and a light receiving element, one of the light emitting element and the light receiving element is fixedly provided to the display panel, and the other of the light emitting element and the light receiving element is It is preferable that the light receiving element, which is fixedly provided on the second support, has a function of detecting light emitted from the light emitting element.

Alternatively, in the above, the detection means includes a light-emitting element and a light-receiving element, the light-emitting element and the light-receiving element are each fixedly provided to the second support, and the light-emitting element is one of the display panels. It is preferable that the light-receiving element has a function of irradiating the portion with light and the light-receiving element has a function of detecting reflected light from the display panel.

Alternatively, in the above, the display panel has a display portion and a non-display portion, the display portion has a first light emitting element, and the detection means has a second light emitting element and a light receiving element. The second light emitting element is provided in the non-display portion, the light receiving element is provided so as to be fixed to the second support, and the light receiving element has a function of detecting light emitted from the second light emitting element. It is preferable.

Further, in the above, it is preferable that the display panel is positioned so as not to overlap the center positions of the first support body, the connection portion, and the second support body in the thickness direction.

Further, it is preferable that the connecting portion has an elastic body.

The display panel preferably has a function as a touch sensor. Alternatively, a touch sensor is preferably provided so as to overlap with the display panel.

According to the present invention, an electronic device having excellent portability can be provided. Alternatively, it is possible to provide an electronic device having excellent listability. Alternatively, an electronic device that is not easily damaged can be provided. Alternatively, it is possible to provide an electronic device including a new input unit. Alternatively, a new electronic device can be provided.

Note that the description of these effects does not disturb the existence of other effects. Note that one embodiment of the present invention does not necessarily have to have all of these effects. It should be noted that the effects other than these are apparent from the description of the specification, drawings, claims, etc., and the effects other than these can be extracted from the description of the specification, drawings, claims, etc. Is.

6 is a configuration example of an electronic device according to an embodiment. 6 is a configuration example of an electronic device according to an embodiment. 6 is a configuration example of an electronic device according to an embodiment. 6 is a configuration example of an electronic device according to an embodiment. 6 is a configuration example of an electronic device according to an embodiment. 6 is a configuration example of an electronic device according to an embodiment. 6 is a configuration example of an electronic device according to an embodiment. 6 is a configuration example of an electronic device according to an embodiment. 6 is a configuration example of an electronic device according to an embodiment. FIG. 6 illustrates an example of a light-emitting panel according to an embodiment. FIG. 6 illustrates an example of a light-emitting panel according to an embodiment. 6A to 6C are diagrams illustrating an example of a method for manufacturing a light-emitting panel according to an embodiment. 6A to 6C are diagrams illustrating an example of a method for manufacturing a light-emitting panel according to an embodiment. FIG. 6 is a diagram showing an example of a touch panel according to an embodiment. FIG. 6 is a diagram showing an example of a touch panel according to an embodiment. FIG. 6 is a diagram showing an example of a touch panel according to an embodiment. FIG. 6 is a diagram showing an example of a touch panel according to an embodiment. A block diagram and a timing chart of a touch sensor. Circuit diagram of the touch sensor. 6 is a configuration example of an electronic device according to an embodiment.

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously modified without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below.

Note that, in the structure of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and repeated description thereof is omitted. Further, when referring to the same function, the hatch pattern may be the same and may not be given a reference numeral in particular.

Note that in each drawing described in this specification, the size of each component, the layer thickness, or the region is as follows.
May be exaggerated for clarity. Therefore, it is not necessarily limited to that scale.

Note that the ordinal numbers such as “first” and “second” in this specification and the like are added to avoid confusion among components, and are not numerically limited.

(Embodiment 1)
In this embodiment, structural examples of electronic devices of one embodiment of the present invention will be described with reference to the drawings.

An electronic device of one embodiment of the present invention includes a flexible display panel and two supports that support the display panel. Further, the two supports are connected by the connecting portion. It is possible to fold the electronic device by relatively rotating the two housings via the connecting portion. Therefore,
An electronic device according to one embodiment of the present invention is to hold a display surface of a display panel in a flat state, bend the display surface of the display panel to be inside (inward bending), and display the display surface of the display panel to outside. It can be bent so that

The electronic device according to one embodiment of the present invention is excellent in viewability due to a wide display area without a joint when the display panel is unfolded. Moreover, when the display panel is folded, it is excellent in portability.

Here, in the electronic device of one embodiment of the present invention, the display panel is fixed to one of the supports and is supported by the other support so as to slide in one direction without being fixed. It is preferable to provide. Then, when the angles of the two supports are changed, it is preferable that the display panel slides with respect to the support that is not fixed, and the relative positions of the two change. With such a configuration, when the angles of the two supports are changed and a part of the display panel is bent, a force is applied only in the direction in which the display panel is bent, and in a direction perpendicular to this (that is, It is possible to substantially eliminate the force applied in the direction perpendicular to the thickness direction of the display panel). That is, when the display panel is bent and the display panel is bent, a force for pulling or compressing the display panel is not applied. Therefore, damage to the display panel is suppressed, and a highly reliable electronic device can be realized.

Furthermore, it is preferable to include a detection unit that can detect the amount of displacement when the display panel slides as described above. Since the amount of displacement of the display panel changes depending on the angle between the two supports, it is possible to detect the angle between the two supports by detecting this amount of displacement. For example, the displacement amount of the display panel can be detected by detecting a change in the relative position between the display panel and the support body on the side where the display panel is not fixed. This change in relative position is preferably detected optically. Further, it may be configured to detect mechanically or electrically.

In this way, by making the angle of the two supports detectable, it becomes possible to use the angle as one input means in the electronic device. For example, it is possible to switch the display on the display panel according to the angle between the two supports. Further, in a state where the display surface of the display panel is folded inside, an operation such as stopping the display of the display panel can be performed.

More specifically, the following configurations can be adopted.

[Example of configuration]
FIG. 1A is a schematic perspective view of an electronic device 10 according to one embodiment of the present invention.

The electronic device 10 includes a support 11a, a support 11b, a connecting portion 12, a display panel 13, and a detecting unit 14.

The support 11a and the support 11b are connected via the connecting portion 12. Display panel 1
3 is arranged so as to overlap the support 11a, the support 11b, and the connecting portion 12. The display panel 13 is supported by at least the support 11a and the support 11b.

Specifically, the display panel 13 has a region fixed to the support 11a. Further, the display panel 13 is supported by the support 11b so that it can slide in one direction without being fixed to the support 11b.

Further, the display panel 13 has flexibility. The display panel 13 has a region having a plurality of pixels (also referred to as a display region), and an image can be displayed in the display region. The pixel includes a display element. In the following, of the surfaces of the display panel 13, the surface on the side where the image is displayed may be referred to as the display surface.

The support 11a and the support 11b can be relatively rotated via the connecting portion 12. For example, the support 11a and the support 11b can be deformed by folding or twisting via the connecting portion 12. Therefore, the electronic device 10 can reversibly deform the display surface of the display panel 13 from a flat display surface to a curved display surface.

The support 11a and the support 11b may have rigidity, or a member that is deformable with respect to a force of twisting or bending of the support itself may be used. Support 11a and support 11
For b, at least a material having a lower flexibility than the display panel 13 or the connecting portion 12 may be used, and an elastic body such as hard rubber may be used for its skeleton. In addition, as a material that can form each housing, a metal such as plastic or aluminum, an alloy such as stainless steel or a titanium alloy, or a rubber such as silicone rubber can be used.

For the connecting portion 12, a material that is partially or entirely elastically deformable can be preferably used. For example, the connecting portion 12 may be entirely elastic, or may have an elastic body at least in a bent portion. Alternatively, a structure having a hinge having one or more rotation shafts can be applied as the connecting portion 12.

When a material that elastically deforms is used for the connection portion 12 and a force that relatively rotates the support 11a and the support 11b is not applied, the display surface shown in FIG. 1A is kept flat. can do. Further, in order to maintain the state of FIG. 1(C) or FIG. 1(E), the support 11a
It is preferable to have a mechanism for fixing the and the support 11b. For example, the support 11a and the support 11b may be separately provided with a detachable tool capable of being mechanically detached, or the support 11a and the support 11b may be provided with a detachment mechanism. Alternatively, the support 11a and the support 11b may be fixed by magnetic force.

Further, in the case where the connecting portion 12 has a hinge, the structure shown in FIG.
It is preferable to use a hinge provided with a mechanism for fixing the relative positions of the support body 11a and the support body 11b in this state, because the above-described detachment tool or detachment mechanism is unnecessary. In addition, by using a hinge having a gradual fixed position, the display panel 1 can be formed as shown in FIGS. 1B and 1D.
It can also be used in a state where the display surface of 3 is curved.

As the connecting portion 12, for example, a material having a lower Young's modulus than the support 11a and the support 11b can be used. In addition, even when a material having a Young's modulus higher than that of the support 11a and the support 11b or a material having a similar Young's modulus is used, the thickness of the connecting portion 12 is set to
It is also possible to apply a material thinner than 1a and the support 11b. As a material that can form the connecting portion 12, plastic, rubber, metal, alloy, or the like can be used. For example, a material such as a silicone resin or a gel may be used.

FIG. 1A shows a state in which the display surface of the display panel 13 is held flat. By deforming the electronic device 10 from this state so that the display surface of the display panel 13 is bent inward, the state can be reversibly changed from the state of FIG. 1B to the state of FIG. 1C. Figure 1(C)
Then, the display panel 13 is in a state of being housed by being sandwiched between the support 11a and the support 11b. Such a form can be used when the electronic device 10 is not used or when the electronic device 10 is stored in a bag or the like.

Further, by deforming the electronic device 10 from the state shown in FIG. 1A so that the display surface of the display panel 13 is bent outward, the state shown in FIG. 1D is reversible to the state shown in FIG. Can be deformed. In FIG. 1E, the display surface of the display panel 13 is located along the upper surface, the side surface, and the lower surface of the electronic device 10. Since the state shown in FIG. 1E is smaller than the state shown in FIG. 1A, it is suitable for use in a public place or during movement.

[Cross-section configuration example]
FIG. 2A shows a schematic cross-sectional view of the electronic device 10 taken along the cutting plane X1 shown in FIG. 2B is a schematic cross-sectional view taken along the cutting plane X2 shown in FIG. 1B, and FIG. 2C is a schematic cross-sectional view taken along the cutting plane X3 shown in FIG. 1D.

In FIG. 2A, the display panel 13 is arranged along the upper surface of each of the support 11a, the support 11b, and the connecting portion 12. Further, the display panel 13 has an FPC (Flexi
The ble print circuit 15 is connected, and is electrically connected to the circuit board 16 provided inside the support body 11 a through the FPC 15. In addition, the circuit board 16
Is electrically connected to a battery 17 provided inside the first support 11a. Also,
As shown in FIG. 2A, the battery 17 may be provided inside the second support 11b. Although not shown here, a circuit board on which an IC or the like for controlling the drive of the detection means 14 is mounted may be provided inside the support body 11b. For example, the IC may have a function of driving the detection unit 14 and a function of extracting a signal output from the detection unit 14.

The display panel 13 is supported so as to be fixed to the support 11a. For example, a part of the display panel 13 may be bonded to the support 11a, or may be mechanically fixed by a fixing tool such as a screw.

On the other hand, the display panel 13 is supported without being fixed to the support 11b. In particular,
In FIG. 2A, the display panel 13 is supported so as to be slidable in the left-right direction with respect to the support 11b.

Here, the thickness direction of the display panel 13 (vertical direction in FIG. 2A), and the display panel 13
In order to prevent the display panel 13 from moving (shifting) in one or both of the directions perpendicular to the bending direction when the sheet is bent (directions perpendicular to the paper surface in FIG. 2A), It is preferable that 13 is supported by the support 11b.

As described above, the display panel 13 is fixed to the support 11a and is supported not to be fixed to the support 11b. Therefore, the support 11a and the support 1 are connected via the connecting portion 12.
When the display panel 13 is displaced relative to the support 11b when the 1b is rotated relatively, the stress applied in the direction perpendicular to the thickness direction of the display panel 13 is relieved, and the display panel 13 is damaged. Can be suppressed. Therefore, the highly reliable electronic device 10 can be realized.

FIG. 2A shows an example in which the detection means 14 is arranged on the second support 11b. The detection means 14 has a function of detecting the relative positions of the support 11b and the display panel 13. A specific configuration example of the detection means 14 will be described later. Here, FIG. 2A shows a configuration in which the detection means 14 is arranged on the support 11b, but the position of the detection means 14 can be appropriately set according to the configuration.

2(B) and 2(C) also show an enlarged view of a part of the support 11b.

As shown in FIG. 2B, when the display surface of the display panel 13 is bent so as to be inward, the display panel 13 is supported so that the end portion of the display panel 13 on the support body 11b side moves outward. The position relative to the body 11b is displaced. On the other hand, when the display surface of the display panel 13 is bent outward as shown in FIG. The relative position with respect to the support 11b is displaced.

In this way, by detecting the relative positional deviation between the display panel 13 and the support 11b that occurs when the display panel 13 is bent, the relative value between the support 11a and the support 11b can be determined from the value of this deviation. It is possible to calculate various positional relationships. As a result, the shape of the electronic device 10 can be detected.

The above is the description of the cross-sectional configuration example.

[Displacement of display panel]
Below, the amount of displacement (displacement amount) of the relative position between the display panel 13 and the support 11b that occurs when the electronic device 10 is deformed so that the display panel 13 is bent will be described.

FIG. 3A is a diagram schematically illustrating an electronic device of one embodiment of the present invention. The electronic device illustrated in FIG. 3A has a structure in which the supporting body 11a and the supporting body 11b are connected to each other by a connecting portion 12 having elasticity. Further, the display panel 13_1 is provided on one surface of the support 11a, the connecting portion 12, and the support 11b, and the display panel 13_2 is provided on the other surface. Note that in FIG. 3A, a hatching pattern is given to indicate that the display panel 13_1 and the display panel 13_2 are fixed to part of the surface of the support 11a.

Here, in order to simultaneously explain both the case where the display surface of the display panel is inside and the case where the display surface is outside when the connecting portion 12 is bent, an example having two display panels will be described.

Further, as shown in FIG. 3A, the thickness of each of the support 11a, the support 11b, and the connecting portion 12 is set to a thickness t. Further, the length of the connecting portion 12 is set to L0. The display panel 13
It is assumed that the respective end portions of _1 and the display panel 13_2 and the end portion of the support body 11b coincide with each other. Further, in FIG. 3A, a neutral line (also referred to as a neutral line) 12a of the connecting portion 12 is shown by a broken line. In this specification and the like, the neutral line refers to a line connecting the centers of the cross-sections of the object in the thickness direction when no stress is applied to the object.

Here, as shown in FIG. 3(B), the neutral line 12a of the connecting portion 12 has an angle θ with a radius of curvature r0.
Think only when it is bent. At this time, since the connecting portion 12 is an elastic body, due to the stress generated when the connecting portion 12 is bent, the portion inside the neutral line 12a of the connecting portion 12 contracts, and the portion above the neutral line 12a of the connecting portion 12 contracts. The outer part will be stretched.

Here, for simplicity, when the connecting portion 12 is bent, the thickness of the connecting portion 12 does not change, and the neutral line 12a of the connecting portion 12 always passes through the center of the thickness of the connecting portion 12, Also, consider a case where the neutral line 12a of the connecting portion 12 is curved with a constant radius of curvature from one end to the other end of the connecting portion 12.

In FIG. 3B, the length of the neutral line 12a of the connecting portion 12 is L0. Also, the connecting portion 12
The radius of curvature r1 on the inner surface and the radius of curvature r2 on the outer surface are as follows.

Therefore, the length L1 of the inner surface of the connecting portion 12 in the cross section shown in FIG.
The length L2 of the outer surface is as follows.

Here, since the display panel 13_1 is provided in contact with the inner surface of the connecting portion 12, if the display panel 13_1 does not expand and contract, the end portion of the display panel 13_1 shifts outward from the end portion of the support 11b. Thus, a part of the display panel 13_1 moves with respect to the support 11b. Similarly, since the display panel 13_2 is provided in contact with the outer surface of the connecting portion 12,
A part of the display panel 13_2 moves with respect to the support 11b so that the end of the display panel 13_2 is displaced inward from the end of the support 11b. The displacement amount d1 of the display panel 13_1 with respect to the support 11b and the displacement amount d2 of the display panel 13_2 with respect to the support 11b are as follows when the outward displacement amount is positive.

From equation (3), the displacement amount d1 of the display panel 13_1 and the displacement amount d of the display panel 13_2
It can be seen that both 2 depend on the thickness t of the connecting portion 12 and the angle θ. Assuming that the thickness t of the connecting portion 12 is constant, the angle θ is detected by detecting the displacement amount d1 or the displacement amount d2.
Can be estimated.

Further, the magnitudes of the displacement amount d1 of the display panel 13_1 and the displacement amount d2 of the display panel 13_2 increase as the distance between the display panel 13_1 or the display panel 13_2 and the neutral line 12a increases. Therefore, it is preferable that the display panel is located at least apart from the neutral line 12a. That is, it is preferable that the display panel is positioned so as not to overlap the center positions of the support 11a, the connecting portion 12, and the second support 11b in the thickness direction.

Note that, in reality, there may be a portion where the thickness of the curved portion of the connecting portion 12 becomes thin. Therefore, when the display surface is bent inward as in the display panel 13_1 in FIG. 3B and when the display surface is bent as in the display panel 13_2, the absolute value of the displacement amount is different, and The displacement amount may be different from the value of. Therefore, when the angle θ is calculated from the relative displacement amount between the display panel 13 and the support body 11b, it is preferable to take into consideration the shape change when the connecting portion 12 is bent and to make a correction.

Further, here, the case where the connecting portion 12 has a plate shape is shown, but the connecting portion 12 is not limited to this.
For example, as shown in FIGS. 4A and 4B, the wiring 18 can be provided in the cavity by forming the connecting portion 12 having the cavity inside. The wiring 18 can electrically connect the circuit boards and batteries provided inside the support 11a and the support 11b to each other. In addition, as shown in FIGS. 4C and 4D, by forming the connecting portion 12 to have a bellows structure, the stress applied to the connecting portion 12 when the connecting portion 12 is bent can be reduced. .. Alternatively, as shown in FIGS. 4E and 4F, the connecting portion 12 may be configured to have a bellows structure in which a cavity is provided, and the wiring 18 may be provided in the cavity.

Further, here, the case where the elastic body is used as the connecting portion 12 has been described, but the connecting portion 12
When a hinge is used as, since the relative movable range of the support 11a and the support 11b can be limited, the angle θ can be calculated more accurately from the relative displacement amount between the support 11b and the display panel 13. It is preferable because it can At this time, it is preferable that the hinge has a structure having two or more rotation shafts because a more flexible design is possible.

The above is the description of the displacement amount of the display panel.

[Example of configuration of detection means]
As described above, the detection unit 14 refers to a mechanism having a function of detecting a change in the relative position between the support 11b and the display panel 13.

It is preferable that the detecting means 14 be configured to optically detect a change in position. For example, the support 11b may be provided with one of the light emitting element and the light receiving element, and the display panel 13 may be provided with the other. Alternatively, the support 11b may be provided with both a light emitting element and a light receiving element, and the light from the light emitting element reflected by the display panel 13 may be detected by the light receiving element. Further, both the light emitting element and the light receiving element may be provided on the display panel 13 to receive the reflected light from the support 11b.

More specifically, the following configurations can be used.

[Structure example 1]
FIG. 5A shows a schematic cross-sectional view of a region including the detecting means 14 of the support 11b.

The support 11b includes a first portion 31 that supports the display panel 13, a second portion 32 that is located on the display surface side of the display panel 13, and a second portion that is located on the opposite side of the display surface side of the display panel 13. Three
And a part of. The second portion 32 and the third portion 33 may function as an exterior member of the support body 11b.

The detection unit 14 has a plurality of light receiving elements 21 and a light emitting element 22.

In the configuration shown in FIG. 5A, the plurality of light receiving elements 21 are fixedly arranged on the surface of the second portion 32 of the support 11b facing the display panel 13. Further, the light emitting element 22 is
It is fixedly arranged on the display panel 13. The light emitting element 22 can emit light to the second portion 32 side of the support 11b, more specifically to the light receiving element 21 side.

The light emitted by the light emitting element 22 may be visible light, infrared light, or ultraviolet light. For example, a light-emitting element that emits light having one or more peaks in the wavelength range of 300 nm to 3000 nm can be used. In particular, when infrared rays having a wavelength of 750 nm or more are used, there is less need to consider light leakage from the support 11b as compared with the case where visible light or ultraviolet rays are used, so that the design is easy and the safety can be improved. It is preferable because it becomes possible.

As the light emitting element 22, for example, an LED (Light Emitting Diode) is used.
A light emitting element such as an organic EL element or an inorganic EL element can be applied. In particular, when the display panel 13 has a light emitting element such as an organic EL element in a pixel, if the light emitting element manufactured in the same step as the pixel is used as the light emitting element 22, the number of parts can be reduced. In that case, the light emitted from the light emitting element 22 becomes light including visible light.

The light receiving element 21 is an element capable of receiving light emitted from the light emitting element 22. As the light receiving element 21, for example, a light receiving element including a photoelectric conversion element such as a photodiode or a phototransistor can be applied. Besides, a solid-state image sensor such as a CCD image sensor or a CMOS image sensor can be applied.

Further, as will be described later, the light receiving element 21 may be provided on the display panel 13. At this time, particularly when the display panel 13 is an optical touch panel having a photoelectric conversion element such as a photodiode in the display area, it is preferable to manufacture the light receiving element 21 and the photoelectric conversion element in the same step.

FIGS. 5B and 5C are schematic perspective views showing the detection unit 14 and its main peripheral portion.

The display panel 13 has a display portion 13a and a non-display portion 13b. The display unit 13a has a plurality of pixels and can display an image or the like. Further, the light emitting element 22 is arranged in a part of the non-display portion 13b. The second portion 32 of the support 11b is arranged so as to overlap the non-display portion 13b of the display panel 13.

As shown in FIG. 5B, the light 23 emitted from the light emitting element 22 is emitted to the display surface side of the display panel 13. At this time, the light receiving element 21 located in the traveling direction of the light 23 detects the light 23.

Subsequently, it is assumed that the display panel 13 is displaced relative to the support 11b in the direction of the arrow shown in FIG. 5C from the state of FIG. 5B. At this time, the light emitting element 22 and the plurality of light receiving elements 21
Since the relative position with respect to changes, the light receiving element 21 different from that in the state of FIG. 5B is located in the traveling direction of the light 23 emitted from the light emitting element 22.

Note that FIG. 5B and the like show the case where the traveling direction of the light 23 is a direction substantially perpendicular to the surface of the display panel 13, but the traveling direction is not limited to this, and the traveling direction may be an oblique direction. In addition, the light emitting element 22
As the light emitting element, a light emitting element having high directivity may be used, or a light emitting element having an intensity distribution in the traveling direction may be used.

In this way, by comparing the detection intensities of the light 23 received by the plurality of light receiving elements 21, it becomes possible to detect the relative positional relationship between the display panel 13 and the support 11b.

The accuracy of the position detected by the detection means 14 can be improved by arranging the plurality of light receiving elements 21 with as little space as possible in the relative displacement direction between the display panel 13 and the support 11b. For example, as shown in FIG. 6A, by arranging the projections of two adjacent light receiving elements 21 on a vector (arrow) parallel to the direction of displacement so as to overlap each other, the accuracy of the detected position is improved. Can be increased.

Further, as shown in FIG. 6B, even when two adjacent light receiving elements 21 are arranged with a gap, when the angular dependence of the light 23 from the light emitting element 22 is known in advance. In addition, it is possible to detect the position of the light emitting element 22 with high accuracy by calculating the peak position of the detected intensity from the values of the intensity detected by the plurality of light receiving elements 21.

Although the plurality of light receiving elements 21 are provided in the second portion 32 of the support 11b and the light emitting elements 22 are provided in the display panel 13 as the detecting means 14 here, the present invention is not limited to this.
For example, as shown in FIG. 7A, the display panel 13 is provided with a plurality of light receiving elements, and the support 11b is provided.
The light emitting element 22 may be provided in the second portion 32 of the.

In addition, as shown in FIG. 7B, the first portion 31 of the supporting body 11b has an opening, and the light emitting element 22 which emits light to the side opposite to the display surface of the display panel 13 and the supporting body. It may be configured to include a plurality of light receiving elements 21 provided in the third portion 33 of 11b.

Further, as shown in FIG. 7C, a plurality of light receiving elements 21 may be provided on the side opposite to the display surface of the display panel 13, and the light emitting element 22 may be provided on the third portion of the support 11b.

Further, in FIGS. 7B and 7C, the opening of the first portion 31 is at least the light emitting element 22.
It suffices to transmit the light emitted by, and may have a member having a light-transmitting property.

The above is the description of Configuration Example 1.

[Structure example 2]
Hereinafter, a configuration example in which a part of the configuration is different from the configuration example 1 will be described. The description of the same parts as those described above may be omitted.

FIG. 8A is a schematic perspective view showing the detection means 14 and its main peripheral portion.

A light receiving element 21 and a light emitting element 22 are arranged side by side on the surface of the second portion 32 of the support 11b facing the display panel 13.

As shown in FIG. 8A, the light 23 emitted by the light emitting element 22 is reflected by a part of the non-display portion 13 b of the display panel 13, and a part of the reflected light is received by the light receiving element 21. Since the intensity of the light received by the light receiving element 21 changes as the display panel 13 is displaced with respect to the support 11b, the relative change between the display panel 13 and the support 11b can be detected by detecting this change. The amount of displacement can be detected.

In the non-display portion 13b of the display panel 13, it is preferable that the portion that reflects the light 23 emitted from the light emitting element 22 has a portion having a different reflectance. More specifically, it suffices to have portions having different reflectances along the direction perpendicular to the displacement direction of the display panel 13.
For example, a wiring pattern provided in the non-display portion 13b, a driving circuit pattern, or the like can be used.

In addition, a pattern for position detection may be separately formed on the surface or inside of the non-display portion 13b of the display panel 13. For example, when the display panel 13 is displaced, a pattern in which high reflectance portions and low reflectance portions alternately appear may be formed. Such a pattern may be formed by a printing method or the like, or a display panel 13 having an uneven surface may be used.

8B to 8E show an example of a pattern for position detection that the non-display portion 13b of the display panel 13 has. The arrow in each drawing indicates the displacement direction of the display panel 13.

In FIG. 8A, the first region 24 having the first reflectance and the second region 25 having the second reflectance are provided. The stripe-shaped second display is arranged in a direction substantially parallel to the displacement direction of the display panel 13.
The area 25 has a pattern in which a plurality of areas are arranged.

Here, the difference in reflectance between the first reflectance and the second reflectance may be, for example, 5% or more, preferably 10% or more, and more preferably 15% or more. Further, the first reflectance and the second reflectance may have a difference in reflectance, and the first reflectance may be higher than the second reflectance,
May be low.

Further, as shown in FIG. 8C, the stripe-shaped second regions 25 may be arranged obliquely with respect to the displacement direction. Further, as shown in FIG. 8D, the second region 25 may have a lattice shape. Alternatively, as shown in FIG. 8E, the second region 25 may have a dot-shaped pattern.

Note that here, an example in which two portions having different reflectances are regularly arranged is shown.
The above portions having different reflectances may be regularly arranged. Further, two or more portions having different reflectances may be arranged irregularly.

Although the case where the light receiving element 21 and the light emitting element 22 are arranged in the second portion 32 of the support 11b has been described here, the light receiving element 21 and the light emitting element 22 may be arranged in the third portion 33. In that case,
As illustrated in the configuration example 1, the first portion 31 having the opening for transmitting the light emitted from the light emitting element 22 may be provided.

As described above, by providing both the light receiving element 21 and the light emitting element 22 on the support body 11b and detecting the relative position between the display panel 13 and the support body 11b by using the reflected light, the number of parts is increased. Can be reduced. Further, as a pattern for one detection provided in the non-display portion 13b of the display panel 13, a pattern such as wiring of the display panel 13 can be used,
It is possible to increase the degree of freedom in design.

The above is the description of Configuration Example 2.

In addition, in this Embodiment, although it was set as the structure provided with two support bodies, it can also be set as the structure provided with three or more support bodies. As the number of supports increases, the electronic device can be transformed into various shapes, and the range of applications expands. In FIGS. 9A to 9C, three supports (support 1
1c, 11d, 11e) is a configuration example of an electronic device. The electronic device shown in FIG. 9A has the configuration shown in FIG. 9B by bending the display panel 13 at two places.
The electronic device can be folded as in C).

When the display panel 13 has three or more supports, the display panel 13 may be fixed to one of the supports and may be slidably supported on the other support. Good. Further, among the supports that do not support the display panel 13, one or more supports may be provided with the above-described detection means. That is, assuming that the number of supports provided in the electronic device is n, the detection means may be provided on one or more and n-1 or less of the supports. The larger the number of supports having detection means, the more detailed the form of the electronic device can be detected, which is preferable. It is preferable to provide the detection means on all the supports that do not support the display panel 13.

In addition, the electronic device of one embodiment of the present invention can have a structure in which a variety of input means, output means, or input/output means is provided in a supporting body. For example, in FIG. 20, the input button 41, the power button 42, the external connection terminal 43, the card slot 44, the optical sensor 45, the camera 46, the light source 47, the speaker 48, and the microphone 49 are provided on the support 11a or the support 11b. Shows an example. Further, in FIG. 20, the battery 17 is built in each of the support 11a and the support 11b. The antenna 51 is mounted on a part of the support 11b.

At least part of this embodiment can be implemented in appropriate combination with any of the other embodiments described in this specification.

(Embodiment 2)
In this embodiment, a structural example and a manufacturing method example of a light-emitting panel which can be applied to the display panel included in the electronic device of one embodiment of the present invention will be described.

[Specific Example 1]
A plan view of the light-emitting panel is shown in FIG. 10A, and a dashed-dotted line A1-A2 in FIG.
An example of a cross-sectional view between them is shown in FIG. The light emitting panel shown in Example 1 is a top emission type light emitting panel using a color filter system. In this embodiment, the light-emitting panel has a structure in which one color is represented by three sub-pixels of R (red), G (green), and B (blue), and R (red), G (green), and the like. ), B (blue), W (white), or R (red), G (green), B (blue)
, Y (yellow) sub-pixels of four colors can express one color. The color elements are not particularly limited, and colors other than RGBW may be used, and may be composed of, for example, yellow, cyan, magenta, or the like.

The light-emitting panel illustrated in FIG. 10A includes a light-emitting portion 804, a driver circuit portion 806, an FPC (Fle
xible Printed Circuit) 808. Light emitting elements and transistors included in the light emitting portion 804 and the drive circuit portion 806 are sealed by the substrate 801, the substrate 803, and the sealing layer 823.

The light-emitting panel illustrated in FIG. 10C includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, and an insulating layer 8.
21, sealing layer 823, overcoat 849, coloring layer 845, light shielding layer 847, insulating layer 84
3, an adhesive layer 841, and a substrate 803. The sealing layer 823, the overcoat 849, the insulating layer 843, the adhesive layer 841, and the substrate 803 transmit visible light.

The light-emitting portion 804 includes a transistor 820 and a light-emitting element 830 over the substrate 801 with the adhesive layer 811 and the insulating layer 813 provided therebetween. The light emitting device 830 has a lower electrode 83 on the insulating layer 817.
1 and the EL layer 833 on the lower electrode 831 and the upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. An end portion of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 transmits visible light.

In addition, the light emitting portion 804 includes a coloring layer 845 that overlaps with the light emitting element 830, and a light shielding layer 847 that overlaps with the insulating layer 821. The coloring layer 845 and the light shielding layer 847 are covered with an overcoat 849. A space between the light emitting element 830 and the overcoat 849 is filled with a sealing layer 823.

The insulating layer 815 has an effect of suppressing diffusion of impurities into the semiconductor included in the transistor. As the insulating layer 817, it is preferable to select an insulating layer having a planarization function in order to reduce surface unevenness due to the transistor.

The driver circuit portion 806 includes a plurality of transistors over the substrate 801 with the adhesive layer 811 and the insulating layer 813 provided therebetween. In FIG. 10C, among the transistors included in the driver circuit portion 806,
One transistor is shown.

The insulating layer 813 and the substrate 801 are attached to each other with an adhesive layer 811. The insulating layer 843 and the substrate 803 are attached to each other with an adhesive layer 841. It is preferable to use a film with low water permeability for the insulating layer 813 and the insulating layer 843 because impurities such as water can be prevented from entering the light-emitting element 830 and the transistor 820 and the reliability of the light-emitting panel can be increased.

The conductive layer 857 is electrically connected to an external input terminal which transmits a signal (a video signal, a clock signal, a start signal, a reset signal, or the like) or a potential from the outside to the driver circuit portion 806.
Here, an example in which an FPC 808 is provided as an external input terminal is shown. In order to prevent an increase in the number of steps, the conductive layer 857 is preferably formed using the same material and the same step as the electrodes and wirings used for the light emitting portion and the driver circuit portion. Here, an example is shown in which the conductive layer 857 is formed using the same material and the same step as the electrode included in the transistor 820.

In the light-emitting panel illustrated in FIG. 10C, the connection body 825 is located over the substrate 803. The connection body 825 is connected to the conductive layer 857 through the openings provided in the substrate 803, the adhesive layer 841, the insulating layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815. Also, the connecting body 8
25 is connected to the FPC 808. The FPC 808 and the conductive layer 857 through the connection body 825.
Connect electrically. In the case where the conductive layer 857 and the substrate 803 overlap with each other, the conductive layer 857, the connection body 825, and F are formed by opening the substrate 803 (or using a substrate having an opening portion).
The PC 808 can be electrically connected.

In Specific Example 1, the insulating layer 813, the transistor 820, and the light-emitting element 830 are manufactured over a manufacturing substrate having high heat resistance, the manufacturing substrate is separated, and the insulating layer 8 is formed over the substrate 801 using the adhesive layer 811.
13 shows a light emitting panel that can be manufactured by transposing the transistor 13, the transistor 820, and the light emitting element 830. In addition, in Specific Example 1, the insulating layer 843 and the coloring layer 845 are formed over a manufacturing substrate having high heat resistance.
And a light-blocking layer 847 are manufactured, the manufacturing substrate is separated, and an insulating layer 843, a coloring layer 845, and a light-blocking layer 847 are transferred to the substrate 803 by using an adhesive layer 841 to manufacture a light-emitting panel.

When a material having low heat resistance (resin or the like) is used for the substrate, it is difficult to apply high temperature to the substrate in a manufacturing process; therefore, conditions for forming a transistor or an insulating layer over the substrate are limited. When a material having high water permeability (resin or the like) is used for the substrate, it is preferable to apply high temperature to form a film having low water permeability. In the manufacturing method of this embodiment, a transistor or the like can be manufactured over a manufacturing substrate with high heat resistance; therefore, a highly reliable transistor or a film with sufficiently low water permeability can be formed by applying high temperature. Then, by transferring them to the substrate 801 or the substrate 803, a highly reliable light-emitting panel can be manufactured. Accordingly, in one aspect of the present invention,
It is possible to realize a light emitting panel which is lightweight or thin and has high reliability. Details of the manufacturing method will be described later.

Note that a light-emitting element manufactured in the same step as the above-described light-emitting element 830 can be provided in the non-display portion and can be used as the light-emitting element 22 illustrated in Embodiment 1.

[Specific example 2]
A plan view of the light-emitting panel is shown in FIG. 10B, and a dashed-dotted line A3-A4 in FIG.
An example of a cross-sectional view in between is shown in FIG. The light emitting panel shown in the second specific example is a top emission type light emitting panel using a color filter system, which is different from the first specific example. Here, only the points different from the specific example 1 will be described in detail, and the points common to the specific example 1 will be omitted.

The light-emitting panel shown in FIG. 10D is different from the light-emitting panel shown in FIG. 10C in the following points.

The light-emitting panel illustrated in FIG. 10D includes a spacer 827 over the insulating layer 821. By providing the spacer 827, the distance between the substrate 801 and the substrate 803 can be adjusted.

In the light-emitting panel illustrated in FIG. 10D, the sizes of the substrate 801 and the substrate 803 are different.
The connection body 825 is located over the insulating layer 843 and does not overlap with the substrate 803. The connection body 825 is connected to the conductive layer 857 through the openings provided in the insulating layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815. Since there is no need to provide an opening in the substrate 803, the material of the substrate 803 is not limited.

Note that a light-emitting element manufactured in the same step as the above-described light-emitting element 830 can be provided in the non-display portion and can be used as the light-emitting element 22 illustrated in Embodiment 1.

[Specific Example 3]
A plan view of the light-emitting panel is shown in FIG. 11A, and dashed-dotted line A5-A6 in FIG.
An example of a cross-sectional view between the two is shown in FIG. The light emitting panel shown in Example 3 is a top emission type light emitting panel using a separate coating system.

The light-emitting panel illustrated in FIG. 11A includes a light-emitting portion 804, a driver circuit portion 806, and an FPC 808. The light emitting element and the transistor included in the light emitting unit 804 and the driving circuit unit 806 are the substrate 8
01, the substrate 803, the frame-shaped sealing layer 824, and the sealing layer 823.

The light-emitting panel illustrated in FIG. 11C includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, and an insulating layer 8.
21, the sealing layer 823, the frame-shaped sealing layer 824, and the substrate 803. The sealing layer 823 and the substrate 803 transmit visible light.

The frame-shaped sealing layer 824 is preferably a layer having a higher gas barrier property than the sealing layer 823. This can prevent moisture and oxygen from entering the light emitting panel from the outside. Therefore, a highly reliable light emitting panel can be realized.

In the specific example 3, the light emission of the light emitting element 830 is extracted from the light emitting panel through the sealing layer 823. Therefore, it is preferable that the sealing layer 823 have higher light-transmitting properties than the frame-shaped sealing layer 824. Further, the sealing layer 823 preferably has a higher refractive index than the frame-shaped sealing layer 824. Further, the sealing layer 823 preferably has a smaller volume shrinkage during curing than the frame-shaped sealing layer 824.

The light-emitting portion 804 includes a transistor 820 and a light-emitting element 830 over the substrate 801 with the adhesive layer 811 and the insulating layer 813 provided therebetween. The light emitting device 830 has a lower electrode 83 on the insulating layer 817.
1 and the EL layer 833 on the lower electrode 831 and the upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. An end portion of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 transmits visible light.

The driver circuit portion 806 includes a plurality of transistors over the substrate 801 with the adhesive layer 811 and the insulating layer 813 provided therebetween. In FIG. 11C, among the transistors included in the driver circuit portion 806,
One transistor is shown.

The insulating layer 813 and the substrate 801 are attached to each other with an adhesive layer 811. Insulating layer 813
It is preferable to use a film with low water permeability for the light-emitting element 830 and the transistor 820 because impurities such as water can be suppressed and the reliability of the light-emitting panel can be increased.

The conductive layer 857 is electrically connected to the driving circuit portion 806 and an external input terminal for transmitting a signal or a potential from the outside. Here, an example in which an FPC 808 is provided as an external input terminal is shown. In addition, here, the conductive layer 857 is formed of the same material as an electrode included in the transistor 820,
An example manufactured in the same process is shown.

In the light-emitting panel illustrated in FIG. 11C, the connection body 825 is located over the substrate 803. The connection body 825 is connected to the conductive layer 857 through the openings provided in the substrate 803, the sealing layer 823, the insulating layer 817, and the insulating layer 815. Further, the connection body 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected to each other through the connection body 825.

In Specific Example 3, the insulating layer 813, the transistor 820, and the light-emitting element 830 are manufactured over a manufacturing substrate having high heat resistance, the manufacturing substrate is separated, and the insulating layer 8 is formed over the substrate 801 using the adhesive layer 811.
13 shows a light emitting panel that can be manufactured by transposing the transistor 13, the transistor 820, and the light emitting element 830. Since a transistor or the like can be manufactured over a manufacturing substrate with high heat resistance, a highly reliable transistor or a film with sufficiently low water permeability can be formed by applying high temperature. And
By transferring them to the substrate 801, a highly reliable light-emitting panel can be manufactured. Accordingly, in one embodiment of the present invention, a light-emitting panel which is lightweight or thin and has high reliability can be realized.

Note that a light-emitting element manufactured in the same step as the above-described light-emitting element 830 can be provided in the non-display portion and can be used as the light-emitting element 22 illustrated in Embodiment 1.

[Specific Example 4]
A plan view of the light-emitting panel is shown in FIG. 11B, which is a dashed-dotted line A7-A8 in FIG.
An example of a cross-sectional view between them is shown in FIG. The light emitting panel shown in Example 4 is a bottom emission type light emitting panel using a color filter system.

The light-emitting panel illustrated in FIG. 11D includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, a coloring layer 845, an insulating layer 817a, and an insulating layer 8.
17b, the conductive layer 816, the plurality of light emitting elements, the insulating layer 821, the sealing layer 823, and the substrate 803.
Have. Substrate 801, adhesive layer 811, insulating layer 813, insulating layer 815, insulating layer 817a,
The insulating layer 817b transmits visible light.

The light emitting portion 804 includes a transistor 820, a transistor 822, and a light emitting element 830 over a substrate 801 with an adhesive layer 811 and an insulating layer 813 provided therebetween. The light emitting element 830 includes a lower electrode 831 on the insulating layer 817, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. An end portion of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 transmits visible light. The position where the colored layer 845 which overlaps with the light-emitting element 830 is not particularly limited and may be provided, for example, between the insulating layers 817a and 817b, between the insulating layers 815 and 817a, or the like.

The driver circuit portion 806 includes a plurality of transistors over the substrate 801 with the adhesive layer 811 and the insulating layer 813 provided therebetween. In FIG. 11C, among the transistors included in the driver circuit portion 806,
Two transistors are shown.

The insulating layer 813 and the substrate 801 are attached to each other with an adhesive layer 811. Insulating layer 813
It is preferable to use a film with low water permeability for the light emitting element 830 and the transistors 820 and 822 because impurities such as water can be prevented from entering and the reliability of the light emitting panel can be increased.

The conductive layer 857 is electrically connected to the driving circuit portion 806 and an external input terminal for transmitting a signal or a potential from the outside. Here, an example in which an FPC 808 is provided as an external input terminal is shown. In addition, here, an example is shown in which the conductive layer 857 is manufactured using the same material and the same process as the conductive layer 816.

In Specific Example 4, the insulating layer 813, the transistor 820, the light-emitting element 830, and the like are manufactured over a manufacturing substrate having high heat resistance, the manufacturing substrate is separated, and the insulating layer 813 and the transistor are formed over the substrate 801 using the adhesive layer 811. A light emitting panel which can be manufactured by transposing 820, a light emitting element 830, and the like is shown. Since a transistor or the like can be manufactured over a manufacturing substrate with high heat resistance, a highly reliable transistor or a film with sufficiently low water permeability can be formed by applying high temperature. Then, by transferring them to the substrate 801, a highly reliable light-emitting panel can be manufactured. Accordingly, in one embodiment of the present invention, a light-emitting panel which is lightweight or thin and has high reliability can be realized.

Note that a light-emitting element manufactured in the same step as the above-described light-emitting element 830 can be provided in the non-display portion and can be used as the light-emitting element 22 illustrated in Embodiment 1.

[Specific Example 5]
FIG. 11E illustrates an example of a light-emitting panel which is different from the specific examples 1 to 4.

A light emitting panel illustrated in FIG. 11E includes a substrate 801, an adhesive layer 811, an insulating layer 813, a conductive layer 814, a conductive layer 857a, a conductive layer 857b, a light emitting element 830, an insulating layer 821, and a sealing layer 82.
3 and a substrate 803.

The conductive layers 857a and 857b have a function as external connection electrodes of the light-emitting panel and can be electrically connected to an FPC or the like.

The light emitting element 830 has a lower electrode 831, an EL layer 833, and an upper electrode 835. An end portion of the lower electrode 831 is covered with an insulating layer 821. The light emitting element 830 is a bottom emission type, a top emission type, or a dual emission type. The electrodes, the substrate, the insulating layer, and the like on the light extraction side each transmit visible light. The conductive layer 814 is the lower electrode 831.
To be electrically connected to.

The substrate on the light extraction side may have a hemispherical lens, a microlens array, a film having a concavo-convex structure, a light diffusion film, or the like as the light extraction structure. For example, the light extraction structure can be formed by adhering the lens or film on a resin substrate using an adhesive having a similar refractive index to the substrate or the lens or film.

The conductive layer 814 is not necessarily provided, but is preferably provided because a voltage drop due to the resistance of the lower electrode 831 can be suppressed. For the same purpose, a conductive layer electrically connected to the upper electrode 835 may be provided over the insulating layer 821, the EL layer 833, the upper electrode 835, or the like.

The conductive layer 814 is a single layer or a stacked layer using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, aluminum, or an alloy material containing any of these as a main component. Can be formed. The thickness of the conductive layer 814 can be, for example, 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0 or less.
． It is 5 μm or less.

When a paste (silver paste or the like) is used as the material of the conductive layer electrically connected to the upper electrode 835, the metal forming the conductive layer becomes granular and aggregates. Therefore, the surface of the conductive layer is rough and has many gaps, it is difficult for the EL layer 833 to completely cover the conductive layer, and electrical connection between the upper electrode and the conductive layer is easy, which is preferable. ..

In Specific Example 5, the insulating layer 813, the light-emitting element 830, and the like are manufactured over a manufacturing substrate with high heat resistance,
The manufacturing substrate is peeled off, and the insulating layer 813 and the light emitting element 83 are provided over the substrate 801 by using the adhesive layer 811.
It shows a light emitting panel that can be produced by transposing 0 and the like. On a high heat resistant fabrication substrate,
A highly reliable light-emitting panel can be manufactured by applying a high temperature to form a film having sufficiently low water permeability and transferring the film to the substrate 801. Accordingly, in one embodiment of the present invention, a light-emitting panel which is lightweight or thin and has high reliability can be realized.

Although an example of using a light-emitting element as a display element is shown here, one embodiment of the present invention is not limited to this.

For example, in this specification and the like, a display device, a display device that is a device including a display element, a display panel, a light-emitting element, and a light-emitting device that is a device including a light-emitting element use various modes or various elements. Can have Examples of a display element, a display device, a display panel, a light-emitting element, or a light-emitting device include an EL (electroluminescence) element (an EL element containing an organic substance and an inorganic substance, an organic EL element, an inorganic EL element), an LED (a white LED, a red LE).
D, green LED, blue LED, etc.), transistor (transistor that emits light in response to current), electron emission element, liquid crystal element, electronic ink, electrophoretic element, grating light valve (GLV), plasma display (PDP), MEMS ( Display element using a micro electro mechanical system, digital micromirror device (DMD), D
MS (Digital Micro Shutter), MIRASOL (registered trademark), IMOD (Interference Modulation) element, shutter type MEMS display element, optical interference type MEMS display element, electrowetting element, piezoelectric ceramic display, carbon Some include a display medium, such as a nanotube, whose contrast, brightness, reflectance, transmittance and the like change due to an electromagnetic effect. An example of a display device using an EL element is an EL display. As an example of a display device using an electron-emitting device, a field emission display (FED) or a SED type flat-panel display (SED: Surface-conduction Electron-emitter) is used.
Display) etc. As an example of a display device using a liquid crystal element, a liquid crystal display (transmissive liquid crystal display, semi-transmissive liquid crystal display, reflective liquid crystal display,
Direct-viewing type liquid crystal display, projection type liquid crystal display) etc. An example of a display device using electronic ink, an electronic powder fluid, or an electrophoretic element is electronic paper. In addition,
In the case of realizing a semi-transmissive liquid crystal display or a reflective liquid crystal display, some or all of the pixel electrodes may have a function as a reflective electrode. For example, part or all of the pixel electrode may include aluminum, silver, or the like. Further, in that case, a memory circuit such as SRAM can be provided below the reflective electrode. Thereby, the power consumption can be further reduced.

Note that a light-emitting element manufactured in the same step as the above-described light-emitting element 830 can be provided in the non-display portion and can be used as the light-emitting element 22 illustrated in Embodiment 1.

[Example of material]
Next, materials and the like that can be used for the light emitting panel will be described. Note that the description of the configuration described earlier in this specification may be omitted.

Materials such as glass, quartz, organic resins, metals, and alloys can be used for the substrate. For the substrate on the side from which light from the light emitting element is extracted, a material having a property of transmitting the light is used.

In particular, it is preferable to use a flexible substrate. For example, it is possible to use an organic resin, glass, metal, or alloy having a thickness such that it has flexibility.

Since organic resin has a smaller specific gravity than glass, using an organic resin as a flexible substrate
This is preferable because the light-emitting panel can be made lighter than when glass is used.

It is preferable to use a material having high toughness for the substrate. This makes it possible to realize a light-emitting panel that has excellent impact resistance and is less likely to be damaged. For example, by using an organic resin substrate, a thin metal substrate, or an alloy substrate, a light-emitting panel which is lighter in weight and less likely to be damaged than a glass substrate can be realized.

A metal material and an alloy material are preferable because they have high thermal conductivity and can easily conduct heat to the entire substrate, so that a local temperature increase in the light-emitting panel can be suppressed. The thickness of the substrate using a metal material or an alloy material is preferably 10 μm or more and 200 μm or less, more preferably 20 μm or more and 50 μm or less.

The material forming the metal substrate or the alloy substrate is not particularly limited, but for example, a metal such as aluminum, copper, iron, titanium, nickel, or an alloy containing one or more metals selected from these metals is used. You can As the alloy, for example, an aluminum alloy or stainless steel can be preferably used.

In addition, when a material having a high thermal emissivity is used for the substrate, it is possible to suppress an increase in the surface temperature of the light emitting panel, and it is possible to suppress damage to the light emitting panel and a decrease in reliability. For example, the substrate may have a laminated structure of a metal substrate and a layer having a high thermal emissivity (for example, a metal oxide or a ceramic material can be used).

Examples of the flexible and translucent material include polyethylene terephthalate (PE
T), polyester resin such as polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethylmethacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, Polyamideimide resin, polyvinyl chloride resin and the like can be mentioned. In particular, it is preferable to use a material having a low coefficient of thermal expansion, and for example, a polyamideimide resin, a polyimide resin, PET or the like can be preferably used. Alternatively, a substrate in which a fibrous body is impregnated with a resin (also referred to as a prepreg) or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used.

As the flexible substrate, a layer using the above material may be a hard coat layer (for example, a silicon nitride layer) that protects the surface of the device from scratches, or a layer that can disperse the pressure (for example, an aramid resin). Layer) and the like may be laminated.

The flexible substrate can also be used by stacking a plurality of layers. In particular, when the glass layer is provided, the barrier property against water and oxygen can be improved and a highly reliable light-emitting panel can be obtained.

For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are stacked from the side closer to the light emitting element can be used. The thickness of the glass layer is 20 μm or more and 200 μm or less, preferably 25 μm or more and 100 μm or less. The glass layer having such a thickness can simultaneously realize high barrier property against water and oxygen and flexibility. The thickness of the organic resin layer is 1
The thickness is 0 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By providing such an organic resin layer on the outer side of the glass layer, cracks and cracks in the glass layer can be suppressed and mechanical strength can be improved. By applying such a composite material of a glass material and an organic resin to a substrate, a highly reliable flexible light emitting panel can be obtained.

For the adhesive layer and the sealing layer, various curable adhesives such as an ultraviolet curable photocurable adhesive, a reaction curable adhesive, a thermosetting adhesive, and an anaerobic adhesive can be used. These adhesives include epoxy resin, acrylic resin, silicone resin, phenol resin, polyimide resin,
Examples thereof include imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin, and the like. In particular, a material having low moisture permeability such as epoxy resin is preferable. Alternatively, a two-liquid mixed type resin may be used. Alternatively, an adhesive sheet or the like may be used.

Further, the above resin may contain a desiccant. For example, a substance that adsorbs water by chemisorption, such as an alkaline earth metal oxide (such as calcium oxide or barium oxide), can be used. Alternatively, a substance that adsorbs water by physical adsorption, such as zeolite or silica gel, may be used. The inclusion of the desiccant is preferable because impurities such as moisture can be prevented from entering the functional element and the reliability of the light-emitting panel can be improved.

Further, by mixing the resin with a filler having a high refractive index or a light scattering member, the light extraction efficiency from the light emitting element can be improved. For example, titanium oxide, barium oxide,
Zeolite, zirconium, etc. can be used.

The structure of the transistor included in the light emitting panel is not particularly limited. For example, a staggered transistor or an inverted staggered transistor may be used. Further, either a top gate type or a bottom gate type transistor structure may be used. The semiconductor material used for the transistor is not particularly limited, and examples thereof include silicon, germanium, silicon carbide, gallium nitride, and the like. Alternatively, an oxide semiconductor containing at least one of indium, gallium, and zinc such as an In—Ga—Zn-based metal oxide may be used.

The crystallinity of a semiconductor material used for a transistor is not particularly limited, and an amorphous semiconductor,
Any of semiconductors having crystallinity (microcrystalline semiconductor, polycrystalline semiconductor, single crystal semiconductor, or semiconductor partially having a crystalline region) may be used. It is preferable to use a semiconductor having crystallinity because deterioration of transistor characteristics can be suppressed.

Here, an oxide semiconductor is preferably applied to a semiconductor device such as a pixel, a driver circuit, or a transistor used for a touch sensor described later or the like. In particular, it is preferable to apply an oxide semiconductor whose bandgap is larger than that of silicon. It is preferable to use a semiconductor material having a wider bandgap and a smaller carrier density than silicon because the current in the off state of the transistor can be reduced.

For example, the above oxide semiconductor preferably contains at least indium (In) or zinc (Zn). More preferably, an In-M-Zn-based oxide (M is A
1, a metal such as Ti, Ga, Ge, Y, Zr, Sn, La, Ce or Hf).

In particular, the semiconductor layer has a plurality of crystal parts, the c-axis of which is perpendicular to the formation surface of the semiconductor layer or the upper surface of the semiconductor layer, and the grain boundaries are provided between adjacent crystal parts. It is preferable to use an oxide semiconductor film having no.

Since such an oxide semiconductor does not have a crystal grain boundary, cracks in the oxide semiconductor film are suppressed from being caused by stress when the display panel is bent. Therefore,
Such an oxide semiconductor can be preferably used for a display panel or the like which has flexibility and is bent.

By using such a material for the semiconductor layer, variation in electrical characteristics is suppressed and a highly reliable transistor can be realized.

In addition, due to the low off-state current, the charge accumulated in the capacitor through the transistor can be held for a long time. By applying such a transistor to a pixel, it is possible to stop the driving circuit while maintaining the gradation of the image displayed in each display region. As a result, an electronic device with extremely reduced power consumption can be realized.

It is preferable to provide a base film in order to stabilize the characteristics of the transistor. As the base film, an inorganic insulating film such as a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a silicon nitride oxide film can be used, and can be formed as a single layer or a stacked layer. The base film is formed by a sputtering method, a CVD (Chemical Vapor Deposition) method (plasma CVD
Method, thermal CVD method, MOCVD (Metal Organic CVD) method, etc., ALD
It can be formed using an (Atomic Layer Deposition) method, a coating method, a printing method, or the like. Note that the base film may be omitted if not necessary. In each of the above structure examples, the insulating layer 813 can also serve as a base film of the transistor.

As the light-emitting element, an element capable of emitting light can be used, and an element whose luminance is controlled by current or voltage is included in its category. For example, a light emitting diode (LED), an organic EL element, an inorganic EL element, or the like can be used.

The light emitting element may be any of a top emission type, a bottom emission type and a dual emission type. A conductive film that transmits visible light is used for the electrode on the light extraction side. Further, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted.

Examples of the conductive film that transmits visible light include indium oxide and indium tin oxide (ITO:
Indium tin oxide), indium zinc oxide, zinc oxide, gallium-added zinc oxide, or the like can be used. Further, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (for example, Titanium nitride) or the like can also be used by forming it so thin that it has a light-transmitting property. Alternatively, a stacked film of any of the above materials can be used as the conductive layer. For example, it is preferable to use a laminated film of an alloy of silver and magnesium and ITO, because conductivity can be increased.
Alternatively, graphene or the like may be used.

For the conductive film that reflects visible light, use a metal material such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy containing these metal materials. You can Further, lanthanum, neodymium, germanium, or the like may be added to the above metal material or alloy. Also, alloys containing aluminum (aluminum alloys) such as aluminum-titanium alloys, aluminum-nickel alloys, aluminum-neodymium alloys, silver-copper alloys, silver-palladium-copper alloys,
It can be formed using an alloy containing silver such as an alloy of silver and magnesium. An alloy containing silver and copper is preferable because it has high heat resistance. Further, by stacking a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and the metal oxide film include titanium and titanium oxide. In addition, a conductive film that transmits visible light and a film formed of a metal material may be stacked. For example, silver and ITO
And a laminated film of an alloy of silver and magnesium and ITO can be used.

The electrodes may be formed by a vapor deposition method or a sputtering method, respectively. In addition, a discharge method such as an inkjet method, a printing method such as a screen printing method, or a plating method can be used.

When a voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 831 and the upper electrode 835, holes are injected into the EL layer 833 from the anode side and electrons are injected from the cathode side. The injected electrons and holes are recombined in the EL layer 833, and the light emitting substance contained in the EL layer 833 emits light.

The EL layer 833 has at least a light emitting layer. The EL layer 833 is a layer other than the light emitting layer.
A substance having a high hole injecting property, a substance having a high hole transporting property, a hole blocking material, a substance having a high electron transporting property, a substance having a high electron injecting property, or a bipolar substance (having an electron transporting property and a hole transporting property). It may further have a layer containing a high substance).

For the EL layer 833, either a low molecular compound or a high molecular compound can be used, and an inorganic compound may be contained. The layers forming the EL layer 833 can be formed by a method such as an evaporation method (including a vacuum evaporation method), a transfer method, a printing method, an inkjet method, a coating method, or the like.

When a white light emitting element is used as the light emitting element 830, it is preferable that the EL layer 833 include two or more kinds of light emitting substances. For example, white light emission can be obtained by selecting the light-emitting substance so that the light emission of each of the two or more light-emitting substances has a complementary color relationship. For example, a luminescent substance that emits light such as R (red), G (green), B (blue), Y (yellow), and O (orange), or a spectral component of two or more colors of R, G, and B. It is preferable to include two or more of the light-emitting substances that emit light including. In addition, it is preferable to apply a light-emitting element in which a spectrum of light emitted from the light-emitting element 830 has two or more peaks within a wavelength range of a visible light region (e.g., 350 nm to 750 nm). The emission spectrum of the material having a peak in the yellow wavelength region is preferably a material having spectral components also in the green and red wavelength regions.

More preferably, the EL layer 833 preferably has a structure in which a light-emitting layer containing a light-emitting material emitting one color and a light-emitting layer containing a light-emitting material emitting another color are stacked. For example, E
The plurality of light emitting layers in the L layer 833 may be in contact with each other and stacked, or may be stacked via a separation layer. For example, a separation layer may be provided between the fluorescent light emitting layer and the phosphorescent light emitting layer.

The separation layer can be provided, for example, in order to prevent energy transfer (particularly triplet energy transfer) from an excited state of a phosphorescent material or the like generated in the phosphorescent light emitting layer to the fluorescent material or the like in the fluorescent light emitting layer. The separation layer may have a thickness of about several nm. Specifically, 0.
1 nm or more and 20 nm or less, or 1 nm or more and 10 nm or less, or 1 nm or more and 5 nm
It is the following. The separation layer includes a single material (preferably a bipolar substance) or a plurality of materials (preferably a hole transporting material and an electron transporting material).

The separation layer may be formed using a material contained in the light emitting layer which is in contact with the separation layer. This facilitates the production of the light emitting element and reduces the driving voltage. For example, when the phosphorescent emitting layer is made of a host material, an assist material, and a phosphorescent material (guest material), the separation layer may be formed of the host material and the assist material. In other words, the separation layer has a region containing no phosphorescent material, and the phosphorescent emitting layer has a region containing a phosphorescent material. This allows
The separation layer and the phosphorescent emitting layer can be vapor-deposited with or without the phosphorescent material. Further, with such a structure, the separation layer and the phosphorescent emitting layer can be formed in the same chamber.
Thereby, the manufacturing cost can be reduced.

The light-emitting element 830 may be a single element having one EL layer or a tandem element in which a plurality of EL layers are stacked with a charge generation layer interposed therebetween.

The light emitting element is preferably provided between a pair of insulating films having low water permeability. This can prevent impurities such as water from entering the light emitting element, and can suppress deterioration in reliability of the light emitting device.

As the insulating film having low water permeability, a film containing nitrogen and silicon such as a silicon nitride film or a silicon oxynitride film, a film containing nitrogen and aluminum such as an aluminum nitride film, or the like can be given. Also,
A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

For example, the water vapor transmission rate of an insulating film having low water permeability is 1×10 ⁻⁵ [g/m ² ·day] or less, preferably 1×10 ⁻⁶ [g/m ² ·day] or less, and more preferably 1 ×10 ^-7 [
g/m ² ·day] or less, and more preferably 1×10 ⁻⁸ [g/m ² ·day] or less.

It is preferable to use an insulating film having low water permeability for the insulating layer 813 and the insulating layer 843.

As the insulating layer 815, for example, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film can be used. In addition, the insulating layer 817, the insulating layer 817a,
As the insulating layer 817b, for example, an organic material such as polyimide, acrylic, polyamide, polyimide amide, or benzocyclobutene resin can be used. Also,
A low dielectric constant material (low-k material) or the like can be used. Alternatively, each insulating layer may be formed by stacking a plurality of insulating films.

The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. As the resin, for example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy resin, or phenol resin can be used. Particularly, it is preferable to use a photosensitive resin material and form the side wall of the opening so as to form an inclined surface having a continuous curvature.

A method for forming the insulating layer 821 is not particularly limited, and a photolithography method, a sputtering method, an evaporation method, a droplet discharging method (inkjet method or the like), a printing method (screen printing, offset printing, or the like) may be used.

The spacer 827 can be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. Examples of the inorganic insulating material and the organic insulating material include various materials that can be used for the insulating layer. Titanium, aluminum or the like can be used as the metal material. With the structure in which the spacer 827 including a conductive material and the upper electrode 835 are electrically connected to each other, potential drop due to the resistance of the upper electrode 835 can be suppressed. Also, the spacer 8
27 may have a forward taper shape or an inverse taper shape.

The conductive layer used for a light-emitting panel, which functions as an electrode or wiring of a transistor, an auxiliary electrode of a light-emitting element, or the like, includes a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, or scandium, or a material thereof. A single layer or a stacked layer can be formed using an alloy material containing the element. Alternatively, the conductive layer may be formed using a conductive metal oxide. As the conductive metal oxide, indium oxide (In ₂ O ₃ or the like), tin oxide (SnO ₂ or the like), zinc oxide (ZnO), ITO, indium zinc oxide (I
n ₂ O ₃ —ZnO, etc.) or these metal oxide materials containing silicon oxide can be used.

The colored layer is a colored layer that transmits light in a specific wavelength band. For example, a red (R) color filter that transmits light in the red wavelength band, a green (G) color filter that transmits light in the green wavelength band, and a blue (B) filter that transmits light in the blue wavelength band A color filter or the like can be used. Each colored layer is formed at a desired position using various materials by a printing method, an inkjet method, an etching method using a photolithography method, or the like.

The light shielding layer is provided between the adjacent colored layers. The light shielding layer blocks light from the adjacent light emitting elements and suppresses color mixing between the adjacent light emitting elements. Here, light leakage can be suppressed by providing the end portion of the colored layer so as to overlap the light shielding layer. As the light shielding layer,
A material that blocks light emission from the light emitting element can be used, and for example, the black matrix may be formed using a metal material or a resin material containing a pigment or a dye. Note that it is preferable to provide the light-blocking layer in a region other than the light-emitting portion such as the driver circuit portion because unintended light leakage due to guided light or the like can be suppressed.

Further, an overcoat may be provided to cover the coloring layer and the light shielding layer. By providing the overcoat, diffusion of impurities contained in the coloring layer into the light emitting element can be prevented. The overcoat is made of a material that transmits light emitted from the light emitting element. For example, an inorganic insulating film such as a silicon nitride film or a silicon oxide film, or an organic insulating film such as an acrylic film or a polyimide film can be used. A laminated structure of a film and an inorganic insulating film may be used.

When the material for the sealing layer is applied on the colored layer and the light shielding layer, it is preferable to use a material having high wettability with respect to the material for the sealing layer as the overcoat material. For example, it is preferable to use an oxide conductive film such as an ITO film or a metal film such as an Ag film that is thin enough to have a light-transmitting property as the overcoat.

As the connection body, a paste-like or sheet-like material obtained by mixing metal particles with a thermosetting resin and exhibiting anisotropic conductivity by thermocompression bonding can be used. As metal particles,
For example, it is preferable to use particles in which two or more kinds of metals are layered, such as nickel particles coated with gold. Alternatively, it is preferable to use a material in which the surface of a granular resin is coated with a metal.

[Example of manufacturing method]
Next, a method for manufacturing a light-emitting panel will be illustrated with reference to FIGS. Here, the light-emitting panel having the structure of Specific Example 1 (FIG. 11C) will be described as an example.

First, the peeling layer 203 is formed over the formation substrate 201, and the insulating layer 813 is formed over the peeling layer 203. Next, the plurality of transistors, the conductive layer 857, the insulating layer 815, the insulating layer 817, the plurality of light-emitting elements, and the insulating layer 821 are formed over the insulating layer 813. Note that the insulating layer 821, the insulating layer 817, and the insulating layer 815 are opened so that the conductive layer 857 is exposed (FIG. 12A).
).

Further, the peeling layer 207 is formed over the manufacturing substrate 205, and the insulating layer 843 is formed over the peeling layer 207. Next, the light-blocking layer 847, the coloring layer 845, and the overcoat 84 are formed over the insulating layer 843.
9 is formed (FIG. 12B).

As the manufacturing substrate 201 and the manufacturing substrate 205, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate, or the like can be used, respectively.

Further, for the glass substrate, for example, a glass material such as aluminosilicate glass, aluminoborosilicate glass, barium borosilicate glass can be used. When the temperature of the subsequent heat treatment is high, a strain having a strain point of 730° C. or higher is preferably used. In addition, barium oxide (
By including a large amount of BaO), a more practical heat resistant glass can be obtained. Alternatively, crystallized glass or the like can be used.

When a glass substrate is used as the manufacturing substrate, formation of an insulating film such as a silicon oxide film, a silicon oxynitride film, a silicon nitride film, or a silicon nitride oxide film between the manufacturing substrate and the peeling layer can prevent contamination from the glass substrate. It can be prevented and is preferable.

As the peeling layer 203 and the peeling layer 207, an element selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, and silicon, and the element, respectively, can be used. It is a single layer or a laminated layer made of an alloy material containing the above or a compound material containing the element. The crystal structure of the layer containing silicon may be amorphous, microcrystalline, or polycrystalline.

The peeling layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. The coating method includes a spin coating method, a droplet discharge method, and a dispensing method.

When the separation layer has a single-layer structure, it is preferable to form a tungsten layer, a molybdenum layer, or a layer containing a mixture of tungsten and molybdenum. Alternatively, a layer containing tungsten oxide or oxynitride, a layer containing molybdenum oxide or oxynitride, or a layer containing oxide or oxynitride of a mixture of tungsten and molybdenum may be formed. In addition,
The mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

In the case where a layered structure of a layer containing tungsten and a layer containing an oxide of tungsten is formed as the separation layer, a layer containing tungsten is formed and an insulating film formed of an oxide is formed thereover. The fact that a layer containing an oxide of tungsten is formed at the interface between the tungsten layer and the insulating film may be utilized. Further, the surface of the layer containing tungsten is subjected to thermal oxidation treatment, oxygen plasma treatment, nitrous oxide (N ₂ O) plasma treatment, treatment with a highly oxidizing solution such as ozone water, etc. You may form the layer containing. Further, the plasma treatment or the heat treatment may be performed in oxygen, nitrogen, nitrous oxide alone, or in a mixed gas atmosphere of the gas and other gas. By changing the surface state of the peeling layer by the above plasma treatment or heat treatment, it is possible to control the adhesion between the peeling layer and an insulating film to be formed later.

Each insulating layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. For example, the film formation temperature is 250° C. or higher and 400 by the plasma CVD method.
By forming the film at a temperature of not more than 0° C., it is possible to obtain a dense film having a very low water permeability.

After that, a material to be the sealing layer 823 is applied to the surface of the manufacturing substrate 205 provided with the coloring layer 845 or the surface of the manufacturing substrate 201 provided with the light-emitting element 230, and the surface is provided with the sealing layer 823 interposed therebetween. The manufacturing substrate 201 and the manufacturing substrate 205 are attached so that they face each other (see FIG.
C)).

Then, the manufacturing substrate 201 is peeled off, and the exposed insulating layer 813 and the substrate 801 are attached to the adhesive layer 81.
Stick together using 1. Further, the manufacturing substrate 205 is separated, and the exposed insulating layer 843 and the substrate 803 are attached to each other with the adhesive layer 841. Although the substrate 803 does not overlap with the conductive layer 857 in FIG. 13A, the conductive layer 857 and the substrate 803 may overlap with each other.

Note that various methods can be appropriately used for the peeling step. For example, when a layer including a metal oxide film is formed as a peeling layer on the side which is in contact with the layer to be peeled, the metal oxide film can be weakened by crystallization and the layer to be peeled can be peeled from the formation substrate. In the case where an amorphous silicon film containing hydrogen is formed as a peeling layer between a manufacturing substrate having high heat resistance and a layer to be peeled, the amorphous silicon film can be removed by irradiation with laser light or etching. The layer to be peeled can be peeled from the production substrate. Further, as a peeling layer, a layer including a metal oxide film is formed on a side which is in contact with a peeled layer, the metal oxide film is weakened by crystallization, and a part of the peeling layer is dissolved in a solution or NF.
After being removed by etching using a fluoride gas such as ₃ , ₃ , BrF ₃ , ClF ₃ or the like, the metal oxide film that has been weakened can be peeled off. Further, a film containing nitrogen, oxygen, hydrogen, or the like (eg, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, or an oxygen-containing alloy film) is used as the separation layer, and the separation layer is irradiated with laser light. A method may be used in which nitrogen, oxygen, or hydrogen contained in the peeling layer is released as a gas to promote peeling between the layer to be peeled and the substrate. Further, a method of mechanically removing the production substrate on which the layer to be peeled is formed or by etching with a solution or a fluoride gas such as NF ₃ , BrF ₃ , or ClF ₃ can be used. In this case, the peeling layer may not be provided.

In addition, the peeling step can be performed more easily by combining a plurality of the above peeling methods. That is, laser light irradiation, etching of the peeling layer with gas or solution, mechanical removal with a sharp knife or scalpel to make the peeling layer and the layer to be peeled easily peeled off, and then physically removed. Peeling can also be performed by force (by a machine or the like).

Alternatively, the layer to be peeled may be peeled from the manufacturing substrate by allowing a liquid to penetrate into the interface between the peeling layer and the layer to be peeled. Further, when peeling, it may be peeled while applying a liquid such as water.

As another peeling method, when the peeling layer is formed of tungsten, peeling may be performed while etching the peeling layer with a mixed solution of aqueous ammonia and hydrogen peroxide.

Note that when peeling is possible at the interface between the formation substrate and the layer to be peeled, the peeling layer may not be provided. For example, glass is used as a manufacturing substrate, an organic resin such as polyimide, polyester, polyolefin, polyamide, polycarbonate, or acrylic is formed in contact with the glass, and an insulating film, a transistor, or the like is formed over the organic resin. In this case, by heating the organic resin,
It can be peeled off at the interface between the production substrate and the organic resin. Alternatively, a metal layer may be provided between the manufacturing substrate and the organic resin, and the metal layer may be heated by supplying an electric current to the metal layer to perform separation at the interface between the metal layer and the organic resin.

Finally, the insulating layer 843 and the sealing layer 823 are opened to expose the conductive layer 857 (FIG. 13B). Note that in the case where the substrate 803 overlaps with the conductive layer 857, the conductive layer 85
The substrate 803 and the adhesive layer 841 are also opened to expose 7 (FIG. 13C). The means for opening is not particularly limited, and for example, a laser ablation method, an etching method, an ion beam sputtering method or the like may be used. Alternatively, a cut may be made in the film over the conductive layer 857 by using a sharp blade or the like, and part of the film may be peeled off by physical force.

Through the above steps, a light-emitting panel can be manufactured.

At least part of this embodiment can be implemented in appropriate combination with any of the other embodiments described in this specification.

(Embodiment 3)
In this embodiment, structural examples of a foldable touch panel that can be applied to the display panel included in the electronic device of one embodiment of the present invention will be described with reference to FIGS. Note that Embodiment 2 can be referred to for materials that can be used for each layer.

[Configuration example 1]
FIG. 14A is a top view of the touch panel. 14B is a cross-sectional view taken along dashed-dotted line AB in FIG. 14A and dashed-dotted line CD. FIG. 14C is a cross-sectional view taken along alternate long and short dash line E-F in FIG.

As shown in FIG. 14A, the touch panel 390 has a display portion 301.

The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. Imaging pixel 308
Can detect a finger or the like touching the display portion 301. Accordingly, a touch sensor can be configured using the image pickup pixels 308.

The pixel 302 includes a plurality of subpixels (for example, the subpixel 302R), and the subpixel includes a light emitting element and a pixel circuit which can supply power for driving the light emitting element.

The pixel circuit is electrically connected to a wiring capable of supplying a selection signal and a wiring capable of supplying an image signal.

The touch panel 390 also includes a scan line driver circuit 303g(1) that can supply a selection signal to the pixel 302 and an image signal line driver circuit 303s(1) that can supply an image signal to the pixel 302.

The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

The imaging pixel circuit is electrically connected to a wiring that can supply a control signal and a wiring that can supply a power supply potential.

As the control signal, for example, a signal capable of selecting an imaging pixel circuit for reading a recorded imaging signal, a signal capable of initializing the imaging pixel circuit, and a time at which the imaging pixel circuit detects light are determined. It is possible to name a signal that can be used.

The touch panel 390 includes an image pickup pixel drive circuit 303g(2) capable of supplying a control signal to the image pickup pixel 308 and an image pickup signal line drive circuit 303s(2) for reading an image pickup signal.

As shown in FIG. 14B, the touch panel 390 includes a substrate 510 and a substrate 570 facing the substrate 510.

A flexible material can be favorably used for the substrate 510 and the substrate 570.

A material in which transmission of unintended impurities is suppressed can be preferably used for the substrate 510 and the substrate 570. For example, the water vapor transmission rate is 10 ⁻⁵ g/m ² ·day or less, preferably 1
0 ^-6 g ^/ m 2 · day or less is material can be suitably used.

Materials having approximately the same linear expansion coefficient can be preferably used for the substrate 510 and the substrate 570. For example, a material having a coefficient of linear expansion of 1×10 ⁻³ /K or less, preferably 5×10 ⁻⁵ /K or less, more preferably 1×10 ⁻⁵ /K or less can be preferably used.

The substrate 510 is a stacked body in which a flexible substrate 510b, an insulating layer 510a that prevents unintended diffusion of impurities into a light-emitting element, and an adhesive layer 510c that bonds the flexible substrate 510b and the insulating layer 510a are stacked.

The substrate 570 is a stack of a flexible substrate 570b, an insulating layer 570a that prevents unintended diffusion of impurities into the light-emitting element, and an adhesive layer 570c that attaches the flexible substrate 570b and the insulating layer 570a.

For example, a material containing polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide, polycarbonate or a resin having an acrylic, urethane, epoxy or siloxane bond can be used for the adhesive layer.

The substrate 570 and the substrate 510 are attached to each other by the sealing layer 560. The sealing layer 560 has a refractive index larger than that of air. When light is extracted to the sealing layer 560 side, the sealing layer 560 also serves as an optical bonding layer. The pixel circuit and the light emitting element (for example, the first light emitting element 350R) are provided on the substrate 51.
0 and the substrate 570.

The pixel 302 includes a subpixel 302R, a subpixel 302G, and a subpixel 302B (FIG. 14).
(C)). Further, the sub-pixel 302R includes a light-emitting module 380R, the sub-pixel 302G includes a light-emitting module 380G, and the sub-pixel 302B includes a light-emitting module 380B.

For example, the sub-pixel 302R includes a pixel circuit including a first light-emitting element 350R and a transistor 302t that can supply power to the first light-emitting element 350R (FIG. 14B).
.. Further, the light emitting module 380R includes a first light emitting element 350R and an optical element (for example, a coloring layer 367R).

The light-emitting element 350R includes a first lower electrode 351R, an upper electrode 352, and an EL layer 353 between the lower electrode 351R and the upper electrode 352 (FIG. 14C).

The EL layer 353 includes the first EL layer 353a, the second EL layer 353b, and the first EL layer 3
An intermediate layer 354 is provided between 53a and the second EL layer 353b.

The light emitting module 380R includes the first coloring layer 367R on the substrate 570. The colored layer may be one that transmits light having a specific wavelength, and for example, one that selectively transmits light exhibiting red, green, blue, or the like can be used. Alternatively, a region through which light emitted from the light emitting element is directly transmitted may be provided.

For example, the light emitting module 380R includes the first light emitting element 350R and the first colored layer 367R.
A sealing layer 360 which is in contact with.

The first colored layer 367R is positioned so as to overlap with the first light-emitting element 350R. As a result, part of the light emitted from the light emitting element 350R is transmitted through the sealing layer 360 also serving as an optical bonding layer and the first colored layer 367R, and is emitted to the outside of the light emitting module 380R as indicated by the arrow in the figure. To be done.

The touch panel 390 includes a light shielding layer 367BM on the substrate 570. The light-blocking layer 367BM is provided so as to surround the coloring layer (eg, the first coloring layer 367R).

The touch panel 390 includes an antireflection layer 367p at a position overlapping the display unit 301. As the antireflection layer 367p, for example, a circularly polarizing plate can be used.

The touch panel 390 includes an insulating layer 321. The insulating layer 321 is the transistor 302t
Covers. Note that the insulating layer 321 can be used as a layer for planarizing unevenness due to the pixel circuit. Further, an insulating layer in which a layer capable of suppressing diffusion of impurities into the transistor 302t or the like is stacked can be applied to the insulating layer 321.

The touch panel 390 includes a light emitting element (eg, the first light emitting element 350R) over the insulating layer 321.

The touch panel 390 includes the partition wall 328 that overlaps the end portion of the first lower electrode 351R as the insulating layer 3.
21 on. In addition, a spacer 329 that controls the distance between the substrate 510 and the substrate 570 is provided over the partition wall 328.

The image signal line driver circuit 303s(1) includes a transistor 303t and a capacitor 303c. Note that the driver circuit can be formed over the same substrate in the same step as the pixel circuit. 14
As illustrated in (B), the transistor 303t may have the second gate 304 over the insulating layer 321. The second gate 304 may be electrically connected to the gate of the transistor 303t, or may have different potentials applied thereto. If necessary, the second gate 304 may be provided in the transistor 308t, the transistor 302t, or the like.

The imaging pixel 308 includes a photoelectric conversion element 308p and an imaging pixel circuit for detecting light emitted to the photoelectric conversion element 308p. The imaging pixel circuit also includes a transistor 308t.

For example, a pin photodiode can be used for the photoelectric conversion element 308p.

The touch panel 390 includes a wiring 311 that can supply a signal, and a terminal 319 is provided on the wiring 311. An FPC 309(1) capable of supplying signals such as an image signal and a synchronization signal is electrically connected to the terminal 319. In addition, FPC309 (
A printed wiring board (PWB) may be attached to 1).

Transistors formed in the same process are replaced by a transistor 302t and a transistor 303.
and the transistor such as the transistor 308t. Embodiment 2 can be referred to for the structure of the transistor.

In addition to the gates, sources, and drains of transistors, as materials that can be used for various wirings and electrodes that form a touch panel, aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or A simple metal composed of tungsten or an alloy containing this as a main component is used as a single layer structure or a laminated structure. For example, a single-layer structure of an aluminum film containing silicon, a two-layer structure of laminating an aluminum film on a titanium film, a two-layer structure of laminating an aluminum film on a tungsten film, and a copper film on a copper-magnesium-aluminum alloy film. Stacked two-layer structure, two-layer structure in which a copper film is stacked on a titanium film, two-layer structure in which a copper film is stacked on a tungsten film, a titanium film or a titanium nitride film and the titanium film or the titanium nitride film A three-layer structure in which an aluminum film or a copper film is further laminated, and a titanium film or a titanium nitride film is further formed thereon; a molybdenum film or a molybdenum nitride film; Stacking membranes,
Further, there is a three-layer structure in which a molybdenum film or a molybdenum nitride film is formed thereover. In addition,
A transparent conductive material containing indium oxide, tin oxide or zinc oxide may be used. Further, it is preferable to use copper containing manganese because controllability of a shape by etching is enhanced.

Note that a light-emitting element manufactured in the same step as the above-described light-emitting element (e.g., the first light-emitting element 350R or the like) is provided in the non-display portion and can be used as the light-emitting element 22 described in Embodiment 1. Further, by providing an imaging pixel manufactured in the same process as the imaging pixel 308 including the photoelectric conversion element 308p and the imaging pixel circuit described above in the non-display portion, it can be used as the light receiving element 21 exemplified in the first embodiment.

[Configuration example 2]
15A and 15B are perspective views of the touch panel 505. For clarity, representative components are shown. FIG. 16 is a cross-sectional view taken along alternate long and short dash line X1-X2 shown in FIG.

The touch panel 505 includes a display portion 501 and a touch sensor 595 (FIG. 15B).
.. In addition, the touch panel 505 includes a substrate 510, a substrate 570, and a substrate 590. Note that each of the substrate 510, the substrate 570, and the substrate 590 has flexibility.

The display portion 501 includes a substrate 510, a plurality of pixels on the substrate 510, and a plurality of wirings 511 that can supply signals to the pixels. The plurality of wirings 511 are routed to the outer peripheral portion of the substrate 510, and some of them form terminals 519. The terminal 519 is connected to the FPC 509 (1
) And electrical connection.

The substrate 590 includes a touch sensor 595 and a plurality of wirings 598 electrically connected to the touch sensor 595. The plurality of wirings 598 are routed around the outer peripheral portion of the substrate 590, and a part of them constitutes terminals. Then, the terminal is electrically connected to the FPC 509(2). Note that in FIG. 15B, electrodes, wirings, and the like of the touch sensor 595 provided on the back surface side (back side of the paper surface) of the substrate 590 are illustrated by solid lines for clarity.

As the touch sensor 595, for example, a capacitance type touch sensor can be applied. As the electrostatic capacity method, there are a surface type electrostatic capacity method, a projection type electrostatic capacity method and the like.

Projection-type capacitance methods include self-capacitance methods and mutual capacitance methods, mainly due to differences in drive methods. The use of the mutual capacitance method is preferable because simultaneous multiple points can be detected.

In the following, FIG. 15B shows a case where a projection capacitive touch sensor is applied.
Will be explained.

Note that various sensors that can detect proximity or contact of a detection target such as a finger can be applied.

The projected capacitive touch sensor 595 includes an electrode 591 and an electrode 592. The electrode 591 is electrically connected to any of the plurality of wirings 598, and the electrode 592 is connected to the plurality of wirings 598.
Electrically connect to any of the other.

As shown in FIGS. 15A and 15B, the electrode 592 has a shape in which a plurality of quadrilaterals which are repeatedly arranged in one direction are connected to each other by a corner portion.

The electrode 591 has a quadrilateral shape and is repeatedly arranged in a direction intersecting with the extending direction of the electrode 592.

The wiring 594 electrically connects the two electrodes 591 which sandwich the electrode 592. At this time, it is preferable that the area of the intersection of the electrode 592 and the wiring 594 be as small as possible. As a result, the area of the region where the electrode is not provided can be reduced, and the unevenness of the transmittance can be reduced. As a result, it is possible to reduce the uneven brightness of the light passing through the touch sensor 595.

Note that the shapes of the electrodes 591 and the electrodes 592 are not limited to this and can take various shapes. For example, the plurality of electrodes 591 are arranged so that a gap is not formed as much as possible, and the electrodes
A plurality of 92 may be provided so as to be separated from each other so that a region which does not overlap with the electrode 591 is formed. At this time, it is preferable to provide a dummy electrode electrically insulated from two adjacent electrodes 592 because the area of a region having different transmittance can be reduced.

The touch sensor 595 includes a substrate 590, electrodes 591 and electrodes 592 arranged in a staggered manner on the substrate 590, an insulating layer 593 covering the electrodes 591 and electrodes 592, and an adjacent electrode 591.
The wiring 594 for electrically connecting

The adhesive layer 597 attaches the substrate 590 to the substrate 570 so that the touch sensor 595 overlaps the display portion 501.

The electrodes 591 and the electrodes 592 are formed using a conductive material having a light-transmitting property. As the light-transmitting conductive material, a conductive oxide such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, or zinc oxide to which gallium is added can be used. Note that a film containing graphene can also be used. The film containing graphene can be formed by reducing a film containing graphene oxide, which is formed into a film shape, for example. Examples of the reducing method include a method of applying heat.

After a conductive material having a light-transmitting property is formed over the substrate 590 by a sputtering method, an unnecessary portion is removed by various patterning techniques such as a photolithography method and the electrode 59 is formed.
1 and the electrode 592 can be formed.

The material used for the insulating layer 593 is, for example, a resin such as acrylic or epoxy,
In addition to a resin having a siloxane bond, an inorganic insulating material such as silicon oxide, silicon oxynitride, or aluminum oxide can be used.

Further, an opening reaching the electrode 591 is provided in the insulating layer 593, and the wiring 594 electrically connects the adjacent electrodes 591. Since the light-transmitting conductive material can increase the aperture ratio of the touch panel, it can be preferably used for the wiring 594. In addition, the electrode 591 and the electrode 59
A material having higher conductivity than 2 can reduce the electric resistance and thus can be preferably used for the wiring 594.

One electrode 592 extends in one direction, and a plurality of electrodes 592 are provided in a stripe shape.

The wiring 594 is provided so as to intersect with the electrode 592.

A pair of electrodes 591 is provided so as to sandwich the one electrode 592, and a wiring 594 is provided as a pair of electrodes 591.
Are electrically connected.

Note that the plurality of electrodes 591 do not necessarily have to be arranged in a direction orthogonal to the one electrode 592, and may be arranged so as to form an angle of less than 90 degrees.

The one wiring 598 is electrically connected to the electrode 591 or the electrode 592. A part of the wiring 598 functions as a terminal. As the wiring 598, for example, a metal material such as aluminum, gold, platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy material containing the metal material can be used. it can.

Note that the touch sensor 595 can be protected by providing an insulating layer which covers the insulating layer 593 and the wiring 594.

In addition, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

As the connection layer 599, various anisotropic conductive films (ACF: Anisotropic) are used.
Conductive Film) and anisotropic conductive paste (ACP: Anisotro)
pic Conductive Paste) or the like can be used.

The adhesive layer 597 has a light-transmitting property. For example, a thermosetting resin or an ultraviolet curable resin can be used, and specifically, a resin such as acrylic, urethane, epoxy, or a resin having a siloxane bond can be used.

The display portion 501 includes a plurality of pixels arranged in a matrix. The pixel includes a display element and a pixel circuit that drives the display element.

In this embodiment, the case where an organic EL element that emits white light is applied to a display element is described; however, the display element is not limited to this.

For example, organic EL elements having different emission colors may be applied to each sub-pixel so that the color of light emitted from each sub-pixel is different.

For the substrate 510, the substrate 570, and the sealing layer 560, a structure similar to that in Structural Example 1 can be applied.

The pixel includes a sub pixel 502R, and the sub pixel 502R includes a light emitting module 580R.

The sub-pixel 502R includes a pixel circuit including a first light emitting element 550R and a transistor 502t capable of supplying power to the first light emitting element 550R. Further, the light emitting module 580R includes a first light emitting element 550R and an optical element (for example, the coloring layer 567R).

The light emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode.

The light emitting module 580R has a first colored layer 567R in the light extraction direction.

Further, when the sealing layer 560 is provided on the light extraction side, the sealing layer 560 is in contact with the first light-emitting element 550R and the first coloring layer 567R.

The first coloring layer 567R is positioned so as to overlap with the first light-emitting element 550R. As a result, part of the light emitted by the light emitting element 550R passes through the first colored layer 567R and is emitted to the outside of the light emitting module 580R in the direction of the arrow shown in the figure.

The display portion 501 has a light shielding layer 567BM in a light emitting direction. The light-blocking layer 567BM is provided so as to surround the coloring layer (eg, the first coloring layer 567R).

The display portion 501 includes the antireflection layer 567p at a position overlapping the pixel. Antireflection layer 567
As p, for example, a circularly polarizing plate can be used.

The display portion 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. Note that the insulating film 521 can be used as a layer for planarizing unevenness due to the pixel circuit. Further, a stacked film including a layer that can suppress diffusion of impurities can be applied to the insulating film 521. As a result, it is possible to prevent the reliability of the transistor 502t and the like from being deteriorated due to the unexpected diffusion of impurities.

The display portion 501 has a light emitting element (eg, the first light emitting element 550R) over the insulating film 521.

The display portion 501 has a partition 528 which overlaps with an end portion of the first lower electrode over the insulating film 521. In addition, a spacer that controls the distance between the substrate 510 and the substrate 570 is provided over the partition 528.

The scan line driver circuit 503g(1) includes a transistor 503t and a capacitor 503c. Note that the driver circuit can be formed over the same substrate in the same step as the pixel circuit.

The display portion 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 has a wiring 5
11 is provided. It should be noted that F that can supply signals such as image signals and synchronization signals
PC 509(1) is electrically connected to the terminal 519.

A printed wiring board (PWB) may be attached to the FPC 509(1).

The display portion 501 has wirings such as a scan line, a signal line, and a power supply line. The various conductive films described above can be used for wiring.

Note that various transistors can be applied to the display portion 501. A structure in the case of applying a bottom-gate transistor to the display portion 501 is illustrated in FIGS.

For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

For example, a semiconductor layer containing polycrystalline silicon which is crystallized by a treatment such as laser annealing can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

In addition, a structure in which a top-gate transistor is applied to the display portion 501 is shown in FIG.
It is shown in FIG.

For example, a semiconductor layer including a single crystal silicon film transferred from polycrystalline silicon or a single crystal silicon substrate or the like is formed into a transistor 502t and a transistor 5 illustrated in FIG.
It can be applied to 03t.

Note that a light-emitting element manufactured in the same step as the above-described light-emitting element (eg, the first light-emitting element 550R or the like) is provided in the non-display portion and can be used as the light-emitting element 22 described in Embodiment 1.

[Configuration example 3]
FIG. 17 is a sectional view of the touch panel 505B. The touch panel 505B described in this embodiment includes a display portion 501 which displays supplied image information on the side where a transistor is provided and a touch sensor which is provided on the substrate 510 side of the display portion. The touch panel 505 of Configuration Example 2 is different. Here, different configurations are described in detail, and the above description is used for portions where similar configurations can be used.

The first coloring layer 567R is positioned so as to overlap with the first light-emitting element 550R. In addition, in FIG.
The light-emitting element 550R illustrated in A) emits light to the side where the transistor 502t is provided. As a result, part of the light emitted by the light emitting element 550R passes through the first colored layer 567R and is emitted to the outside of the light emitting module 580R in the direction of the arrow shown in the figure.

The display portion 501 has a light shielding layer 567BM in a light emitting direction. The light-blocking layer 567BM is provided so as to surround the coloring layer (eg, the first coloring layer 567R).

The touch sensor 595 is provided on the substrate 510 side of the display portion 501 (FIG. 17A).
).

The adhesive layer 597 is provided between the substrate 510 and the substrate 590, and the display portion 501 and the touch sensor 5 are provided.
Stick 95 together.

Note that various transistors can be applied to the display portion 501. A structure in which a bottom-gate transistor is applied to the display portion 501 is illustrated in FIGS.

For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

For example, a semiconductor layer including polycrystalline silicon or the like is used as the transistor 5 illustrated in FIG.
02t and the transistor 503t.

17A and 17B show a structure in which a top-gate transistor is applied to the display portion 501.
It is shown in FIG.

For example, a semiconductor layer including polycrystalline silicon, a transferred single crystal silicon film, or the like is formed as shown in FIG.
It can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

Note that a light-emitting element manufactured in the same step as the above-described light-emitting element (eg, the first light-emitting element 550R or the like) is provided in the non-display portion and can be used as the light-emitting element 22 described in Embodiment 1.

At least part of this embodiment can be implemented in appropriate combination with any of the other embodiments described in this specification.

(Embodiment 4)
In this embodiment, an example of a touch panel driving method which can be applied to a display panel included in an electronic device of one embodiment of the present invention will be described with reference to drawings.

[Example of sensor detection method]
FIG. 18A is a block diagram illustrating a structure of a mutual capacitance touch sensor. FIG.
In (A), a pulse voltage output circuit 601 and a current detection circuit 602 are shown. Note that FIG.
In (A), an electrode 621 to which a pulse voltage is applied and an electrode 622 for detecting a change in current are shown as six wirings X1-X6 and Y1-Y6, respectively. 18 (
A) shows a capacitor 603 formed by overlapping the electrodes 121 and 122. The functions of the electrode 121 and the electrode 122 may be replaced with each other.

The pulse voltage output circuit 601 is a circuit for sequentially applying pulses to the wirings X1-X6. The electrode 1 forming the capacitor 603 by applying the pulse voltage to the wirings X1-X6
An electric field is generated at 21 and the electrode 122. The electric field generated between the electrodes is blocked by the capacitance 60
It is possible to detect the proximity or contact of the detection target by utilizing the change in the mutual capacitance of No. 3.

The current detection circuit 602 is a circuit for detecting a change in current in the wirings Y1 to Y6 due to a change in mutual capacitance in the capacitor 603. In the wirings Y1 to Y6, there is no change in the current value detected without the proximity or contact of the detected object, but if the mutual capacitance decreases due to the proximity or contact of the detected object, the current value will decrease. Detect changes that decrease. The current may be detected using an integrating circuit or the like.

Next, FIG. 18B shows a timing chart of input/output waveforms in the mutual capacitance touch sensor shown in FIG. In FIG. 18B, detection objects are detected in each matrix in one frame period. Further, in FIG. 18B, when the detected object is not detected (
Two cases are shown: non-touch) and detection (touch) of the detected object. Regarding the wirings Y1 to Y6, a waveform having a voltage value corresponding to the detected current value is shown.

A pulse voltage is sequentially applied to the wirings X1-X6, and Y1-
The waveform on the wiring of Y6 changes. If there is no proximity or contact with the detected object, X1-X6
The waveform of Y1-Y6 changes uniformly according to the change of the voltage of the wiring. On the other hand, since the current value decreases at the location where the object to be detected approaches or contacts, the waveform of the voltage value corresponding to this also changes.

In this way, by detecting the change in mutual capacitance, it is possible to detect the proximity or contact of the detection target.

18A illustrates the structure of a passive touch sensor in which only the capacitor 603 is provided at a wiring intersection as a touch sensor, an active touch sensor including a transistor and a capacitor may be used. FIG. 19 shows an example of one sensor circuit included in the active touch sensor.

The sensor circuit includes a capacitor 603, a transistor 611, a transistor 612, and a transistor 613. A signal G2 is applied to a gate of the transistor 613, a voltage VRES is applied to one of a source and a drain, and the other is electrically connected to one electrode of the capacitor 603 and the gate of the transistor 611. One of a source and a drain of the transistor 611 is electrically connected to one of a source and a drain of the transistor 612, and the other has a voltage V
SS is given. A signal G2 is applied to the gate of the transistor 612, and the other of the source and the drain is electrically connected to the wiring ML. The voltage VSS is applied to the other electrode of the capacitor 603.

Next, the operation of the sensor circuit will be described. First, as the signal G2, the transistor 613 is used.
The potential corresponding to the voltage VRES is applied to the node n to which the gate of the transistor 611 is connected by applying the potential for turning on the transistor. Then, a potential for turning off the transistor 613 is applied as the signal G2, so that the potential of the node n is held.

Then, the potential of the node n changes from VRES as the mutual capacitance of the capacitance 603 changes due to the proximity or contact of the detection target such as a finger.

In the reading operation, the signal G1 is supplied with a potential for turning on the transistor 612. The current flowing through the transistor 611, that is, the current flowing through the wiring ML changes depending on the potential of the node n. By detecting this current, it is possible to detect the proximity or contact of the detected object.

As the transistor 611, the transistor 612, and the transistor 613, a transistor in which an oxide semiconductor is used for a semiconductor layer in which a channel is formed is preferably used. In particular, by applying such a transistor to the transistor 613, the potential of the node n can be held for a long period of time, and the operation of re-supplying VRES to the node n (
The frequency of refresh operations can be reduced.

At least part of this embodiment can be implemented in appropriate combination with any of the other embodiments described in this specification.

10 electronic equipment 11a support 11b support 11c support 11d support 11e support 12 connection part 12a neutral line 13 display panel 13_1 display panel 13_2 display panel 13a display part 13b non-display part 14 detection means 15 FPC
16 circuit board 17 battery 18 wiring 21 light receiving element 22 light emitting element 23 light 24 area 25 area 31 part 32 part 33 part 41 input button 42 power button 43 external connection terminal 44 card slot 45 optical sensor 46 camera 47 light source 48 speaker 49 microphone 51 Antenna 121 Electrode 122 Electrode 201 Fabrication substrate 203 Release layer 205 Production substrate 207 Release layer 230 Light emitting element 301 Display unit 302 Pixel 302B Subpixel 302G Subpixel 302R Subpixel 302t Transistor 303c Capacitance 303g(1) Scan line driver circuit 303g(2) Imaging pixel drive circuit 303s(1) Image signal line drive circuit 303s(2) Imaging signal line drive circuit 303t Transistor 304 Gate 308 Imaging pixel 308p Photoelectric conversion element 308t Transistor 309 FPC
311 wiring 319 terminal 321 insulating layer 328 partition wall 329 spacer 350R light emitting element 351R lower electrode 352 upper electrode 353 EL layer 353a EL layer 353b EL layer 354 intermediate layer 360 sealing layer 367BM light shielding layer 367p antireflection layer 367R coloring layer 380B light emitting module 380G Light emitting module 380R Light emitting module 390 Touch panel 501 Display unit 502R Sub-pixel 502t Transistor 503c Capacity 503g Scan line driving circuit 503t Transistor 505 Touch panel 505B Touch panel 509 FPC
510 substrate 510a insulating layer 510b flexible substrate 510c adhesive layer 511 wiring 519 terminal 521 insulating film 528 partition wall 550R light emitting element 560 sealing layer 567BM light shielding layer 567p antireflection layer 567R coloring layer 570 substrate 570a insulating layer 570b flexible substrate 570c Adhesive layer 580R Light emitting module 590 Substrate 591 Electrode 592 Electrode 593 Insulation layer 594 Wiring 595 Touch sensor 597 Adhesive layer 598 Wiring 599 Connection layer 601 Pulse voltage output circuit 602 Current detection circuit 603 Capacitance 611 Transistor 612 Transistor 613 Transistor 621 Electrode 622 Electrode 801 Substrate 803 substrate 804 light emitting unit 806 drive circuit unit 808 FPC
811 Adhesive layer 813 Insulating layer 814 Conductive layer 815 Insulating layer 816 Conductive layer 817 Insulating layer 817a Insulating layer 817b Insulating layer 820 Transistor 821 Insulating layer 822 Transistor 823 Sealing layer 824 Sealing layer 825 Connector 827 Spacer 830 Light emitting element 831 Lower electrode 833 EL layer 835 Upper electrode 841 Adhesive layer 843 Insulating layer 845 Coloring layer 847 Light shielding layer 849 Overcoat 857 Conductive layer 857a Conductive layer 857b Conductive layer

Claims (5)

A display panel having flexibility, a support having a function of supporting the display panel, and a light receiving element,
The display panel includes a pixel including a transistor including an oxide semiconductor,
The support has an opening overlapping with the display panel,
The light receiving element is arranged on the opposite side of the display surface of the display panel and at a position overlapping the opening,
The light receiving element has a function of detecting light transmitted through the opening from the display panel side,
The display panel, an electronic apparatus having a function of displaying is controlled according to the light which the light receiving element has detected. A display panel having flexibility, a support having a function of supporting the display panel, and a light receiving element,
The display panel includes a pixel including a transistor including an oxide semiconductor,
The support has an opening overlapping with the display panel,
The display panel has a foldable region, and the region does not overlap the opening,
The light receiving element is arranged on the opposite side of the display surface of the display panel and at a position overlapping the opening,
The light receiving element has a function of detecting light transmitted through the opening from the display panel side,
The display panel, an electronic apparatus having a function of displaying is controlled according to the light which the light receiving element has detected. A display panel having flexibility, a support having a function of supporting the display panel, and a light receiving element,
The display panel includes a pixel including a transistor including an oxide semiconductor,
The support has an opening overlapping with the display panel,
The light receiving element is arranged on the opposite side of the display surface of the display panel and at a position overlapping the opening,
The display panel has a function of controlling display according to light detected by the light receiving element,
The electronic device transmits the light from the display panel side through the opening and enters the light receiving element. A display panel having flexibility, a support having a function of supporting the display panel, and a light receiving element,
The display panel includes a pixel including a transistor including an oxide semiconductor,
The support has an opening overlapping with the display panel,
The display panel has a foldable region, and the region does not overlap the opening,
The light receiving element is arranged on the opposite side of the display surface of the display panel and at a position overlapping the opening,
The display panel has a function of controlling display according to light detected by the light receiving element,
The electronic device transmits the light from the display panel side through the opening and enters the light receiving element. In any one of Claim 1 thru|or 4 ,
The display panel is an electronic device having a light emitting element at a position overlapping with the light receiving element.

Images