JP2015225331A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus that has excellent portability, an electronic apparatus that excels in listing capability, and an electronic apparatus comprising new input means.SOLUTION: Such a configuration is employed that a flexible display panel, and two supports that support it, are included. The two supports are connected together through a connection part. The display panel is fixed to one support, and is supported by the other support without fixation so as to be slide in one direction. Detection means is also provided, according to which, when the display panel slides, its displacement amount can be detected.

Description

  One embodiment of the present invention relates to a display device. Alternatively, the present invention relates to an electronic device including a display device. In particular, the present invention relates to a flexible display device. Alternatively, the present invention relates to an electronic device including a flexible display device.

  Note that one embodiment of the present invention is not limited to the above technical field. One embodiment of the invention disclosed in this specification and the like relates to an object, a method, or a manufacturing method. One aspect of the present invention relates to a process, a machine, a manufacture, or a composition (composition of matter). Therefore, the technical field of one embodiment of the present invention disclosed in this specification more specifically includes a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, an electronic device, a lighting device, an input device, and an input / output device. The driving method or the manufacturing method thereof can be given as an example.

  Note that in this specification and the like, a semiconductor device refers to any device that can function by utilizing semiconductor characteristics. A semiconductor element such as a transistor, a semiconductor circuit, an arithmetic device, and a memory device are one embodiment of the semiconductor device. An imaging device, a display device, a liquid crystal display device, a light emitting device, an electro-optical device, a power generation device (including a thin film solar cell, an organic thin film solar cell, and the like) and an electronic device may include a semiconductor device.

  In recent years, display devices are expected to be applied to various uses and are being diversified. For example, a display device used for a portable electronic device or the like is required to be thin, lightweight, or hardly damaged. In addition, there is a demand for new uses that have not been achieved in the past.

  Patent Document 1 discloses a flexible active matrix light-emitting device including a transistor as a switching element and an organic EL (Electro Luminescence) element on a film substrate.

JP 2003-174153 A

  In recent years, it has been studied to increase the display amount by increasing the display area of the display device and to improve the display listability. On the other hand, in portable device applications and the like, if the display area is enlarged, the portability (also referred to as portability) decreases. For this reason, it has been difficult to achieve both improvement in display listability and high portability.

  In addition, a configuration in which an input unit as a user interface is provided on the display panel is desired. For example, there is a display device (touch panel) to which a function of inputting by touching the screen with a finger or a stylus is added.

  An object of one embodiment of the present invention is to provide an electronic device with excellent portability. Another object is to provide an electronic device with excellent listability. Another object is to provide an electronic device which is not easily damaged. Another object is to provide an electronic device including new input means.

  Another object of one embodiment of the present invention is to reduce the thickness of an electronic device. Another object is to reduce the weight of an electronic device. Another object is to provide a novel electronic device.

  Note that the description of these problems does not disturb the existence of other problems. In one embodiment of the present invention, it is not necessary to solve all of these problems. Problems other than those described above are naturally clarified from the description of the specification and the like, and problems other than the above can be extracted from the description of the specification and the like.

  One embodiment of the present invention is an electronic device including a first support, a second support, a connection portion, and a display panel. The display panel has a function of being able to be folded and displayed. The first support body and the second support body are connected by a connection portion, and the first support body and the second support body have a function of rotating relatively through the connection portion. The display panel has a portion fixed to the first support, and is supported by the second support so that the display panel can move in one direction with respect to the second support. And

  Another embodiment of the present invention is an electronic device including a first support, a second support, a connection portion, a display panel, and detection means. The display panel has a function of being able to bend and display. The first support body and the second support body have a function of being connected by a connecting portion and relatively rotating through the connecting portion. The display panel has a portion fixed to the first support and is supported by the second support so that the display panel can move in one direction with respect to the second support. When the body and the second support are relatively rotated, the relative position of the second support is changed. The detecting means has a function of detecting a relative position between the display panel and the second support.

  In the above, the detection means includes a light emitting element and a light receiving element, and one of the light emitting element and the light receiving element is fixed to the display panel, and the other of the light emitting element and the light receiving element is the first Preferably, the light receiving element is fixed to the support 2 and has a function of detecting light emission from the light emitting element.

  Alternatively, in the above, the detection unit includes a light emitting element and a light receiving element, and the light emitting element and the light receiving element are each fixed to a second support, and the light emitting element is a part of the display panel. Preferably, the light receiving element has a function of irradiating light to the part, and the light receiving element has a function of detecting reflected light from the display panel.

  Alternatively, in the above, the display panel includes a display portion and a non-display portion, the display portion includes a first light emitting element, and the detection unit includes a second light emitting element and a light receiving element. The second light emitting element is provided in the non-display portion, the light receiving element is provided fixed to the second support, and the light receiving element has a function of detecting light emission from the second light emitting element. It is preferable.

  Moreover, in the above, it is preferable that the display panel is positioned so as not to overlap with the center position of each of the first support, the connection portion, and the second support in the thickness direction.

  Moreover, it is preferable that the said connection part has an elastic body.

  The display panel preferably has a function as a touch sensor. Alternatively, it is preferable that a touch sensor be provided over the display panel.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic device excellent in portability can be provided. Alternatively, an electronic device with excellent listability can be provided. Alternatively, an electronic device that is not easily damaged can be provided. Or an electronic device provided with a new input means can be provided. Alternatively, a new electronic device can be provided.

  Note that the description of these effects does not disturb the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. It should be noted that the effects other than these are naturally obvious from the description of the specification, drawings, claims, etc., and it is possible to extract the other effects from the descriptions of the specification, drawings, claims, etc. It is.

4 illustrates a configuration example of an electronic device according to an embodiment. 4 illustrates a configuration example of an electronic device according to an embodiment. 4 illustrates a configuration example of an electronic device according to an embodiment. 4 illustrates a configuration example of an electronic device according to an embodiment. 4 illustrates a configuration example of an electronic device according to an embodiment. 4 illustrates a configuration example of an electronic device according to an embodiment. 4 illustrates a configuration example of an electronic device according to an embodiment. 4 illustrates a configuration example of an electronic device according to an embodiment. 4 illustrates a configuration example of an electronic device according to an embodiment. FIG. 6 illustrates an example of a light-emitting panel according to an embodiment. FIG. 6 illustrates an example of a light-emitting panel according to an embodiment. 8A and 8B illustrate an example of a method for manufacturing a light-emitting panel according to Embodiment. 8A and 8B illustrate an example of a method for manufacturing a light-emitting panel according to Embodiment. The figure which shows an example of the touchscreen based on Embodiment. The figure which shows an example of the touchscreen based on Embodiment. The figure which shows an example of the touchscreen based on Embodiment. The figure which shows an example of the touchscreen based on Embodiment. The block diagram and timing chart figure of a touch sensor. The circuit diagram of a touch sensor. 4 illustrates a configuration example of an electronic device according to an embodiment.

  Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below.

  Note that in structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is not repeated. In addition, in the case where the same function is indicated, the hatch pattern is the same, and there is a case where no reference numeral is given.

  Note that in each drawing described in this specification, the size, the layer thickness, or the region of each component is exaggerated for simplicity in some cases. Therefore, it is not necessarily limited to the scale.

  In the present specification and the like, ordinal numbers such as “first” and “second” are used for avoiding confusion between components, and are not limited numerically.

(Embodiment 1)
In this embodiment, structural examples of electronic devices of one embodiment of the present invention will be described with reference to drawings.

  An electronic device of one embodiment of the present invention includes a flexible display panel and two supports that support the display panel. The two supports are connected by a connecting portion. It is possible to fold the electronic device by relatively rotating the two housings via the connection portion. Therefore, in the electronic device of one embodiment of the present invention, the display surface of the display panel is kept flat, the display surface of the display panel is bent (inward bending), and the display surface of the display panel is It can be bent so as to be on the outside.

  The electronic device of one embodiment of the present invention is excellent in listability due to a seamless wide display region when the display panel is expanded. In addition, when the display panel is folded, the portability is excellent.

  Here, in the electronic device of one embodiment of the present invention, the display panel is fixed to one support body and is supported by the other support body without being fixed so as to slide in one direction. It is preferable to provide it. And when the angle of two support bodies is changed, it is preferable to set it as the structure which slides with respect to the support body which the display panel is not fixed, and relative position of both changes. With such a configuration, when the angle of the two supports is changed and a part of the display panel is bent, a force is applied only in the direction in which the display panel is bent, and in a direction perpendicular to this (that is, The force applied (in a direction perpendicular to the thickness direction of the display panel) can be substantially eliminated. That is, when the display panel is bent by sliding, the display panel is not pulled or compressed, so that the display panel is prevented from being damaged, and a highly reliable electronic device can be realized.

  Furthermore, it is preferable to include detection means that can detect the amount of displacement when the display panel slides as described above. Since the amount of displacement of the display panel changes depending on the angle of the two supports, the angle of the two supports can be detected by detecting this amount of displacement. For example, the amount of displacement of the display panel can be detected by detecting a change in the relative position between the display panel and the support on the side on which the display panel is not fixed. This relative position change is preferably detected optically. Moreover, it is good also as a structure detected mechanically or electrically.

  Thus, by setting it as the structure which can detect the angle of two support bodies, it becomes possible to use the angle as one input means in an electronic device. For example, the display on the display panel can be switched according to the angle of the two supports. In addition, in a state where the display surface of the display panel is folded inward, an operation such as stopping display of the display panel can be performed.

  More specifically, the following configuration can be adopted.

[Configuration example]
FIG. 1A is a schematic perspective view of an electronic device 10 of one embodiment of the present invention.

  The electronic device 10 includes a support 11a, a support 11b, a connection unit 12, a display panel 13, and a detection unit 14.

  The support body 11a and the support body 11b are connected via the connection part 12. FIG. The display panel 13 is disposed so as to overlap the support 11 a, the support 11 b, and the connection portion 12. The display panel 13 is supported by at least the support 11a and the support 11b.

  Specifically, the display panel 13 has a region fixed to the support 11a. Further, the display panel 13 is supported by the support 11b so that it can slide in one direction without being fixed to the support 11b.

  Moreover, the display panel 13 has flexibility. The display panel 13 includes a region having a plurality of pixels (also referred to as a display region), and can display an image in the display region. The pixel includes a display element. In the following description, the surface of the display panel 13 on which the image is displayed may be referred to as a display surface.

  The support body 11a and the support body 11b can be relatively rotated via the connection portion 12. For example, it is possible to add deformation such as folding or twisting the support 11a and the support 11b via the connecting portion 12. Therefore, the electronic device 10 can be reversibly deformed from a state in which the display surface of the display panel 13 is flat to a state in which the display surface is bent.

  As the support body 11a and the support body 11b, the support body 11a may have rigidity, or a member that can be deformed by a force that the support body itself twists or curves may be used. The support 11a and the support 11b may be made of at least a material that is less flexible than the display panel 13 or the connection portion 12, and an elastic body such as hard rubber may be used for its skeleton. In addition, as a material that can form each housing, plastics, metals such as aluminum, alloys such as stainless steel and titanium alloy, rubbers such as silicone rubber, and the like can be used.

  The connection part 12 can use the material which one part or all elastically deforms. For example, the whole connection part 12 can be made into an elastic body, or it can be set as the structure which has an elastic body in the part which bends at least. Alternatively, a configuration having a hinge having one or more rotation axes can be applied as the connecting portion 12.

  When a material that is elastically deformed is used as the connection portion 12, the display surface shown in FIG. 1A is held flat when a force that relatively rotates the support 11 a and the support 11 b is not applied. can do. Moreover, in order to hold | maintain in the state of FIG.1 (C) and FIG.1 (E), it is preferable to have a mechanism which fixes the support body 11a and the support body 11b. For example, a detachable tool that can mechanically detach the support 11a and the support 11b may be provided separately, or the support 11a and the support 11b may include a detachment mechanism. Or it is good also as a structure which fixes the support body 11a and the support body 11b with magnetic force.

  Further, when the connection portion 12 is configured to have a hinge, a hinge having a mechanism for fixing the relative positions of the support 11a and the support 11b in the state of FIG. 1C or 1E is used. This is preferable because the above-described detachment tool and detachment mechanism are unnecessary. Further, by using a hinge having a stepwise fixing position, the display panel 13 can be used in a curved state as shown in FIGS. 1B and 1D.

  As the connection part 12, for example, a material having a lower Young's modulus than the support 11a and the support 11b can be used. Further, even when a material having a higher Young's modulus than the support 11a and the support 11b or a material having a similar Young's modulus is used, the thickness of the connecting portion 12 is made larger than that of the support 11a and the support 11b. Thin materials can also be applied. As a material that can constitute the connecting portion 12, plastic, rubber, metal, alloy, or the like can be used. For example, a material such as a silicone resin or a gel may be used.

  FIG. 1A shows a state where the display surface of the display panel 13 is held flat. By deforming the electronic device 10 so that the display surface of the display panel 13 is bent inward from this state, the state can be reversibly transformed to the state of FIG. 1C through the state of FIG. In FIG. 1C, the display panel 13 is sandwiched and accommodated between the support 11a and the support 11b. When the electronic device 10 is not used or stored in a bag or the like, such a form can be adopted.

  In addition, by deforming the electronic device 10 so that the display surface of the display panel 13 is bent outward from the state illustrated in FIG. 1A, the state is reversible to the state illustrated in FIG. 1E via the state illustrated in FIG. Can be transformed. In FIG. 1E, the display surface of the display panel 13 is located along the upper surface, the side surface, and the lower surface of the electronic device 10. Since the state shown in FIG. 1E is smaller than the state shown in FIG. 1A, it is suitable for use in a public place or during movement.

[Section configuration example]
FIG. 2A shows a schematic cross-sectional view of the electronic device 10 at the cutting plane X1 shown in FIG. 2B is a schematic cross-sectional view taken along the cutting plane X2 shown in FIG. 1B, and FIG. 2C is a schematic cross-sectional view taken along the cutting plane X3 shown in FIG.

  In FIG. 2A, the display panel 13 is disposed along the upper surfaces of the support 11a, the support 11b, and the connection portion 12. Further, an FPC (Flexible Print Circuit) 15 is connected to the display panel 13, and is electrically connected to a circuit board 16 provided inside the support 11 a via the FPC 15. The circuit board 16 is electrically connected to a battery 17 provided in the first support 11a. Further, as shown in FIG. 2A, the battery 17 may also be provided inside the second support 11b. In addition, although not shown here, you may have the circuit board which mounted IC etc. for controlling the drive of the detection means 14 inside the support body 11b. For example, the IC may have a function of driving the detection unit 14 and a function of extracting a signal output from the detection unit 14.

  The display panel 13 is supported so as to be fixed to the support 11a. For example, a part of the display panel 13 may be bonded to the support 11a, or may be mechanically fixed by a fixing tool such as a screw.

  On the other hand, the display panel 13 is supported without being fixed to the support 11b. Specifically, in FIG. 2A, the display panel 13 is supported so as to be slidable in the left-right direction with respect to the support 11b.

  Here, the thickness direction of the display panel 13 (the vertical direction in FIG. 2A) and the direction perpendicular to the bending direction when the display panel 13 is bent (the direction perpendicular to the paper surface in FIG. 2A). It is preferable that the display panel 13 is supported by the support 11b so that the display panel 13 does not move (displace) in one or both of them.

  As described above, the display panel 13 is supported so as to be fixed to the support 11a and not fixed to the support 11b. Therefore, when the support body 11a and the support body 11b are rotated relative to each other via the connecting portion 12, the display panel 13 is displaced with respect to the support body 11b, so that the direction is perpendicular to the thickness direction of the display panel 13. The stress applied to the substrate can be relaxed, and problems such as breakage of the display panel 13 can be suppressed. Therefore, the highly reliable electronic device 10 can be realized.

  FIG. 2A shows an example in which the detection means 14 is arranged on the second support 11b. The detection means 14 has a function of detecting the relative position of the support 11b and the display panel 13. A specific configuration example of the detection unit 14 will be described later. Here, FIG. 2A shows a configuration in which the detection means 14 is disposed on the support 11b, but the position of the detection means 14 can be appropriately set according to the configuration.

  FIGS. 2B and 2C also show enlarged views of a part of the support 11b.

  As shown in FIG. 2B, when the display surface of the display panel 13 is bent so as to be inward, the display panel 13 and the support are supported so that the end on the support 11b side of the display panel 13 moves outward. The relative position with respect to the body 11b shifts. On the other hand, as shown in FIG. 2C, when the display panel 13 is bent so that the display surface faces outward, the end of the display panel 13 on the support 11b side moves inward. The relative position with respect to the support 11b shifts.

  In this way, by detecting the relative positional shift between the display panel 13 and the support 11b that occurs when the display panel 13 is bent, the relative value between the support 11a and the support 11b is determined from the value of the shift. A simple positional relationship can be calculated. As a result, the shape of the electronic device 10 can be detected.

  The above is the description of the cross-sectional configuration example.

[Displacement of display panel]
Hereinafter, the amount of displacement (displacement) of the relative position between the display panel 13 and the support 11b that occurs when the electronic device 10 is deformed so as to bend the display panel 13 will be described.

  FIG. 3A is a diagram schematically illustrating an electronic device of one embodiment of the present invention. The electronic device illustrated in FIG. 3A has a structure in which a support 11a and a support 11b are connected by a connecting portion 12 having elasticity. Further, a display panel 13_1 is provided on one surface of the support 11a, the connection portion 12, and the support 11b, and a display panel 13_2 is provided on the other surface. Note that in FIG. 3A, a hatching pattern is attached to show that the display panel 13_1 and the display panel 13_2 are fixed to part of the surface of the support 11a.

  Here, in order to simultaneously explain both the case where the display surface of the display panel is on the inside and the outside when the connecting portion 12 is bent, an example having two display panels will be described.

  Further, as shown in FIG. 3A, the thicknesses of the support 11a, the support 11b, and the connecting portion 12 are defined as thickness t. Further, the length of the connecting portion 12 is set to a length L0. Further, it is assumed that the end portions of the display panel 13_1 and the display panel 13_2 coincide with the end portion of the support 11b. Further, in FIG. 3A, a neutral line (also referred to as a neutral line) 12a of the connecting portion 12 is indicated by a broken line. In this specification and the like, the neutral line refers to a line that connects the centers in the thickness direction in the cross section of an object when no stress is applied to the object.

  Here, as shown in FIG. 3B, consider a case where the neutral line 12a of the connecting portion 12 is bent by an angle θ with a curvature radius r0. At this time, since the connecting portion 12 is an elastic body, the stress is generated when the connecting portion 12 is bent, so that the portion inside the neutral line 12a of the connecting portion 12 is contracted, and the neutral portion 12a of the connecting portion 12 is contracted. The outer part will stretch.

  Here, for the sake of simplicity, when the connecting portion 12 is bent, the thickness of the connecting portion 12 does not change, and the neutral line 12a of the connecting portion 12 always passes through the center of the thickness of the connecting portion 12, Consider a case where the neutral line 12a of the connecting portion 12 is curved with a constant radius of curvature from one end of the connecting portion 12 to the other end.

  In FIG. 3B, the length of the neutral line 12a of the connecting portion 12 is L0. Further, the curvature radius r1 on the inner surface of the connecting portion 12 and the curvature radius r2 on the outer surface are as follows.

  Therefore, in the cross section shown in FIG. 3B, the length L1 of the inner surface of the connecting portion 12 and the length L2 of the outer surface are as follows.

  Here, since the display panel 13_1 is provided in contact with the inner surface of the connection portion 12, if the display panel 13_1 does not expand and contract, the end portion of the display panel 13_1 is shifted outward from the end portion of the support 11b. As described above, a part of the display panel 13_1 moves with respect to the support 11b. Similarly, since the display panel 13_2 is provided in contact with the outer surface of the connection portion 12, a part of the display panel 13_2 is arranged so that the end of the display panel 13_2 is displaced inward from the end of the support 11b. Moves relative to the support 11b. The displacement d1 of the display panel 13_1 with respect to the support 11b and the displacement d2 of the display panel 13_2 with respect to the support 11b are as follows when the outward displacement is positive.

  From equation (3), it can be seen that the displacement d1 of the display panel 13_1 and the displacement d2 of the display panel 13_2 both depend on the thickness t of the connecting portion 12 and the angle θ. If the thickness t of the connecting portion 12 is constant, the angle θ can be estimated by detecting the displacement amount d1 or the displacement amount d2.

  In addition, the displacement d1 of the display panel 13_1 and the displacement d2 of the display panel 13_2 increase as the distance between the display panel 13_1 or the display panel 13_2 and the neutral line 12a increases. Therefore, the display panel is preferably located at least away from the neutral line 12a. That is, it is preferable that the display panel is positioned so as not to overlap the center position of each of the support 11a, the connection portion 12, and the second support 11b in the thickness direction.

  In practice, there may be a portion where the thickness of the curved portion of the connecting portion 12 is reduced. Therefore, there is a difference in the absolute value of the displacement amount between the case where the display surface is bent inward as in the display panel 13_1 in FIG. 3B and the case in which the display surface is bent outward as in the display panel 13_2. The displacement may be different from the value of. Therefore, when the angle θ is calculated from the relative displacement amount between the display panel 13 and the support 11b, it is preferable to correct in consideration of the shape change when the connecting portion 12 is bent.

  Although the case where the connecting portion 12 has a plate shape is shown here, the present invention is not limited to this. For example, as shown in FIGS. 4A and 4B, the wiring 18 can be provided in the cavity by using the connection portion 12 having a cavity inside. The wiring 18 can electrically connect a circuit board, a battery, and the like provided inside the support 11a and the support 11b. Further, as shown in FIGS. 4C and 4D, the connection portion 12 having a bellows structure can reduce stress applied to the connection portion 12 when the connection portion 12 is bent. . As shown in FIGS. 4E and 4F, the connection portion 12 may have a bellows structure in which a cavity is provided, and the wiring 18 may be provided in the cavity.

  Here, the case where an elastic body is used as the connection portion 12 has been described. However, when a hinge is used as the connection portion 12, the relative movable range of the support body 11a and the support body 11b can be limited. Furthermore, the angle θ can be calculated from the relative displacement between the support 11b and the display panel 13, which is preferable. At this time, it is preferable that the hinge has two or more rotating shafts because a design with a higher degree of freedom is possible.

  The above is the description of the displacement amount of the display panel.

[Configuration example of detection means]
As described above, the detection means 14 refers to a mechanism having a function of detecting a relative position change between the support 11b and the display panel 13.

  The detection means 14 is preferably configured to optically detect a change in position. For example, one of a light emitting element or a light receiving element is provided on the support 11b, and the other is provided on the display panel 13. Alternatively, both the light emitting element and the light receiving element may be provided on the support 11b, and the light from the light emitting element reflected on the display panel 13 may be detected by the light receiving element. Moreover, it is good also as a structure which provides both the light emitting element and the light receiving element in the display panel 13, and receives the reflected light from the support body 11b.

  More specifically, the following configuration can be used.

[Configuration example 1]
FIG. 5A shows a schematic cross-sectional view of a region including the detection means 14 of the support 11b.

  The support 11 b includes a first portion 31 that supports the display panel 13, a second portion 32 that is located on the display surface side of the display panel 13, and a second portion that is located on the side opposite to the display surface side of the display panel 13. 3 parts. The second portion 32 and the third portion 33 may function as an exterior member of the support 11b.

  The detection unit 14 includes a plurality of light receiving elements 21 and a light emitting element 22.

  In the configuration shown in FIG. 5A, the plurality of light receiving elements 21 are fixedly arranged on the surface of the second portion 32 of the support 11b facing the display panel 13, respectively. The light emitting element 22 is fixed to the display panel 13. The light emitting element 22 can emit light to the second portion 32 side of the support 11b, more specifically, to the light receiving element 21 side.

  The light emitted from the light emitting element 22 may be visible light, infrared light, or ultraviolet light. For example, a light-emitting element that emits light having one or more peaks in a wavelength range of 300 nm to 3000 nm can be used. In particular, when infrared rays having a wavelength of 750 nm or more are used, the design is easy and the safety is improved because it is less necessary to consider light leakage from the support 11b than when using visible light or ultraviolet rays. This is preferable because it becomes possible.

  For example, a light emitting element such as an LED (Light Emitting Diode), an organic EL element, or an inorganic EL element can be used as the light emitting element 22. In particular, when the display panel 13 includes a light emitting element such as an organic EL element in a pixel, the number of components can be reduced by using a light emitting element manufactured in the same process as the pixel as the light emitting element 22. In that case, light emission from the light emitting element 22 becomes light including visible light.

  The light receiving element 21 is an element that can receive light emitted from the light emitting element 22. As the light receiving element 21, for example, a light receiving element including a photoelectric conversion element such as a photodiode or a phototransistor can be applied. In addition, a solid-state imaging device such as a CCD image sensor or a CMOS image sensor can be applied.

  As will be described later, the light receiving element 21 may be provided on the display panel 13. At this time, in particular, in the case where the display panel 13 is an optical touch panel having a photoelectric conversion element such as a photodiode in the display area, it is preferable to manufacture the light receiving element 21 and the photoelectric conversion element in the same process.

  5B and 5C are schematic perspective views showing the detection means 14 and its main peripheral part.

  The display panel 13 includes a display unit 13a and a non-display unit 13b. The display unit 13a has a plurality of pixels and can display an image or the like. Moreover, the light emitting element 22 is arrange | positioned at a part of non-display part 13b. The second portion 32 of the support 11b is disposed so as to overlap the non-display portion 13b of the display panel 13.

  As shown in FIG. 5B, the light 23 emitted from the light emitting element 22 is emitted to the display surface side of the display panel 13. At this time, the light receiving element 21 positioned in the traveling direction of the light 23 detects the light 23.

  Subsequently, it is assumed that the display panel 13 is displaced relative to the support 11b in the direction of the arrow illustrated in FIG. 5C from the state illustrated in FIG. At this time, since the relative positions of the light emitting element 22 and the plurality of light receiving elements 21 change, the light receiving element 21 that is different from the state in FIG. Will be located.

  5B and the like show a case where the traveling direction of the light 23 is substantially perpendicular to the surface of the display panel 13, but the present invention is not limited to this and may travel in an oblique direction. As the light emitting element 22, a light emitting element with high directivity may be used, or a light emitting element having an intensity distribution with respect to the traveling direction may be used.

  In this manner, by comparing the detection intensities of the light 23 received by the plurality of light receiving elements 21, it is possible to detect the relative positional relationship between the display panel 13 and the support 11b.

  The accuracy of the position detected by the detection means 14 can be improved by arranging the plurality of light receiving elements 21 with as little gap as possible with respect to the relative displacement direction between the display panel 13 and the support 11b. For example, as shown in FIG. 6A, by arranging the projections of the two adjacent light receiving elements 21 with respect to a vector (arrow) parallel to the direction of displacement so as to overlap each other, the accuracy of the detected position can be improved. Can be increased.

  In addition, as shown in FIG. 6B, even when two adjacent light receiving elements 21 are arranged with a gap therebetween, the angular dependence of the light 23 from the light emitting element 22 is known in advance. In other words, the position of the light emitting element 22 can be detected with high accuracy by calculating the peak position of the detected intensity from the values of the detected intensity by the plurality of light receiving elements 21.

  Here, as the detection means 14, the plurality of light receiving elements 21 are provided in the second portion 32 of the support 11 b and the light emitting elements 22 are provided in the display panel 13, but are not limited thereto. For example, as shown in FIG. 7A, the display panel 13 may be provided with a plurality of light receiving elements, and the light emitting element 22 may be provided in the second portion 32 of the support 11b.

  Further, as shown in FIG. 7B, the first portion 31 of the support 11b has an opening, the light emitting element 22 that emits light on the side opposite to the display surface of the display panel 13, and the support It is good also as a structure provided with the some light receiving element 21 provided in the 3rd part 33 of 11b.

  7C, a plurality of light receiving elements 21 may be provided on the side opposite to the display surface of the display panel 13, and a light emitting element 22 may be provided in the third portion of the support 11b.

  7B and 7C, the opening of the first portion 31 only needs to transmit at least light emitted from the light-emitting element 22, and may include a light-transmitting member.

  The above is the description of the configuration example 1.

[Configuration example 2]
Hereinafter, a configuration example in which a part of the configuration is different from the configuration example 1 will be described. Note that a description overlapping with the above may be omitted.

  FIG. 8A is a schematic perspective view showing the detection means 14 and its main peripheral part.

  A light receiving element 21 and a light emitting element 22 are arranged side by side on the surface of the second portion 32 of the support 11b facing the display panel 13.

  As shown in FIG. 8A, the light 23 emitted from the light emitting element 22 is reflected by a part of the non-display portion 13 b of the display panel 13, and a part of the reflected light is received by the light receiving element 21. As the display panel 13 is displaced with respect to the support 11b, the intensity of the light received by the light receiving element 21 changes. By detecting this change, the display panel 13 and the support 11b are relatively relative to each other. The amount of displacement can be detected.

  In the non-display portion 13b of the display panel 13, it is preferable that the portion that reflects the light 23 emitted from the light emitting element 22 has a portion having a different reflectance. More specifically, it is only necessary to have portions having different reflectances along a direction perpendicular to the displacement direction of the display panel 13. For example, a wiring pattern provided in the non-display portion 13b, a drive circuit pattern, or the like can be used.

  Further, a pattern for position detection may be separately formed on the surface or inside of the non-display portion 13b of the display panel 13. For example, a pattern may be formed such that when the display panel 13 is displaced, high reflectance portions and low reflectance portions appear alternately. Such a pattern may be formed by a printing method or the like, or a pattern in which an uneven shape is formed on the surface of the display panel 13 may be used.

  8B to 8E show examples of patterns for position detection that the non-display portion 13b of the display panel 13 has. In addition, the arrow in each figure has shown the displacement direction of the display panel 13. FIG.

  FIG. 8A includes a first region 24 having a first reflectance and a second region 25 having a second reflectance. The display panel 13 has a pattern in which a plurality of stripe-like second regions 25 are arranged in a direction substantially parallel to the displacement direction of the display panel 13.

  Here, the difference in reflectance between the first reflectance and the second reflectance may be, for example, 5% or more, preferably 10% or more, more preferably 15% or more. The first reflectance and the second reflectance only have to be different from each other, and the first reflectance may be higher or lower than the second reflectance.

  Further, as shown in FIG. 8C, the stripe-shaped second regions 25 may be arranged obliquely with respect to the displacement direction. Further, as shown in FIG. 8D, the second region 25 may have a lattice shape. Further, as shown in FIG. 8E, a pattern in which the second regions 25 are arranged in a dot shape may be used.

  Here, an example is shown in which two portions having different reflectances are regularly arranged, but two or more portions having different reflectances may be regularly arranged. Moreover, it is good also as a structure by which the part from which two or more reflectances differ is arrange | positioned irregularly.

  Although the case where the light receiving element 21 and the light emitting element 22 are disposed in the second portion 32 of the support 11b has been described here, a configuration in which the light receiving element 21 and the light emitting element 22 are disposed in the third portion 33 may be employed. In that case, as illustrated in the configuration example 1, the first portion 31 having an opening through which the light emitted from the light emitting element 22 is transmitted may be provided.

  As described above, by providing both the light receiving element 21 and the light emitting element 22 on the support 11b and detecting the relative position between the display panel 13 and the support 11b using the reflected light, the number of parts is reduced. Can be reduced. In addition, as a pattern for one detection provided in the non-display portion 13b of the display panel 13, a pattern such as a wiring included in the display panel 13 can be used, so that the degree of freedom in design can be increased.

  The above is the description of the configuration example 2.

  In addition, in this Embodiment, although it was set as the structure provided with two support bodies, it can also be set as the structure provided with three or more support bodies. The greater the number of supports, the more the electronic device can be deformed into various shapes and the range of applications is expanded. FIGS. 9A to 9C illustrate a configuration example of an electronic device including three supports (supports 11c, 11d, and 11e). The electronic device illustrated in FIG. 9A can be folded as illustrated in FIG. 9C through the form illustrated in FIG. 9B by bending the display panel 13 in two places.

  Further, when the display panel 13 is configured to have three or more supports, the display panel 13 is fixed to one of the supports and supported to be slidable without being fixed to the other support. That's fine. Moreover, what is necessary is just to set it as the structure which provides the detection means mentioned above in the 1 or more support body among the support bodies which do not support the display panel 13. FIG. In other words, when the number of supports provided in the electronic device is n, the detection means may be provided on one of the supports of 1 to n−1. A larger number of supports having detection means is preferable because the form of the electronic device can be detected in more detail. Preferably, detection means is provided on all the supports that do not support the display panel 13.

  Further, the electronic device of one embodiment of the present invention can have a structure in which a variety of input means, output means, or input / output means is provided on a support. For example, in FIG. 20, an input button 41, a power button 42, an external connection terminal 43, a card slot 44, an optical sensor 45, a camera 46, a light source 47, a speaker 48, and a microphone 49 are provided on the support 11a or the support 11b. An example is shown. In FIG. 20, a battery 17 is built in each of the support 11a and the support 11b. An antenna 51 is mounted on part of the support 11b.

  This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

(Embodiment 2)
In this embodiment, a structural example and a manufacturing method example of a light-emitting panel that can be used for the display panel included in the electronic device of one embodiment of the present invention will be described.

[Specific Example 1]
FIG. 10A is a plan view of the light-emitting panel, and FIG. 10C illustrates an example of a cross-sectional view taken along dashed-dotted line A1-A2 in FIG. The light-emitting panel shown in Example 1 is a top emission type light-emitting panel using a color filter method. In the present embodiment, the light-emitting panel includes, for example, a configuration in which one color is expressed by three subpixels of R (red), G (green), and B (blue), or R (red) and G (green). ), B (blue), W (white), or R (red), G (green), B (blue), Y (yellow) sub-pixels of one color can be applied. . The color element is not particularly limited, and colors other than RGBW may be used. For example, the color element may be composed of yellow, cyan, magenta, or the like.

  A light-emitting panel illustrated in FIG. 10A includes a light-emitting portion 804, a driver circuit portion 806, and an FPC (Flexible Printed Circuit) 808. Light-emitting elements and transistors included in the light-emitting portion 804 and the driver circuit portion 806 are sealed with a substrate 801, a substrate 803, and a sealing layer 823.

  A light-emitting panel illustrated in FIG. 10C includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 821, and a sealing layer. 823, an overcoat 849, a coloring layer 845, a light-blocking layer 847, an insulating layer 843, an adhesive layer 841, and a substrate 803. The sealing layer 823, the overcoat 849, the insulating layer 843, the adhesive layer 841, and the substrate 803 transmit visible light.

  The light-emitting portion 804 includes a transistor 820 and a light-emitting element 830 over a substrate 801 with an adhesive layer 811 and an insulating layer 813 interposed therebetween. The light-emitting element 830 includes a lower electrode 831 over the insulating layer 817, an EL layer 833 over the lower electrode 831, and an upper electrode 835 over the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. An end portion of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 transmits visible light.

  In addition, the light-emitting portion 804 includes a colored layer 845 that overlaps with the light-emitting element 830 and a light-blocking layer 847 that overlaps with the insulating layer 821. The coloring layer 845 and the light shielding layer 847 are covered with an overcoat 849. A space between the light emitting element 830 and the overcoat 849 is filled with a sealing layer 823.

  The insulating layer 815 has an effect of suppressing diffusion of impurities into a semiconductor included in the transistor. As the insulating layer 817, an insulating layer having a planarization function is preferably selected in order to reduce surface unevenness due to the transistor.

  The driver circuit portion 806 includes a plurality of transistors over the substrate 801 with the adhesive layer 811 and the insulating layer 813 interposed therebetween. FIG. 10C illustrates one of the transistors included in the driver circuit portion 806.

  The insulating layer 813 and the substrate 801 are attached to each other with an adhesive layer 811. The insulating layer 843 and the substrate 803 are attached to each other with an adhesive layer 841. It is preferable to use a film with low water permeability for the insulating layer 813 and the insulating layer 843 because impurities such as water can be prevented from entering the light-emitting element 830 and the transistor 820 and the reliability of the light-emitting panel is improved.

  The conductive layer 857 is electrically connected to an external input terminal that transmits an external signal (a video signal, a clock signal, a start signal, a reset signal, or the like) or a potential to the driver circuit portion 806. Here, an example in which an FPC 808 is provided as an external input terminal is shown. In order to prevent an increase in the number of steps, the conductive layer 857 is preferably formed using the same material and the same steps as the electrodes and wirings used for the light-emitting portion and the driver circuit portion. Here, an example in which the conductive layer 857 is manufactured using the same material and the same process as the electrode included in the transistor 820 is described.

  In the light-emitting panel illustrated in FIG. 10C, the connection body 825 is positioned over the substrate 803. The connection body 825 is connected to the conductive layer 857 through an opening provided in the substrate 803, the adhesive layer 841, the insulating layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815. Further, the connection body 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected through the connection body 825. In the case where the conductive layer 857 and the substrate 803 overlap with each other, the conductive layer 857, the connection body 825, and the FPC 808 can be electrically connected by opening the substrate 803 (or using a substrate having an opening). .

  In Example 1, the insulating layer 813, the transistor 820, and the light-emitting element 830 are manufactured over a manufacturing substrate with high heat resistance, the manufacturing substrate is peeled off, and the insulating layer 813 or the transistor 820 is formed over the substrate 801 with the use of the adhesive layer 811. The light emitting panel which can be produced by transposing the light emitting element 830 is shown. In Example 1, the insulating layer 843, the colored layer 845, and the light-blocking layer 847 are formed over a manufacturing substrate with high heat resistance, the manufacturing substrate is peeled off, and the insulating layer 843 is formed over the substrate 803 with the use of the adhesive layer 841. 1 shows a light-emitting panel that can be manufactured by transposing a colored layer 845 and a light-shielding layer 847.

  In the case where a material with low heat resistance (such as a resin) is used for the substrate, it is difficult to apply a high temperature to the substrate in a manufacturing process, and thus there are limitations on conditions for forming a transistor or an insulating layer over the substrate. In the case where a material with high water permeability (such as a resin) is used for the substrate, it is preferable to form a film with low water permeability by applying high temperature. In the manufacturing method of this embodiment, a transistor or the like can be manufactured over a manufacturing substrate with high heat resistance; therefore, a highly reliable transistor or a film with sufficiently low water permeability can be formed by applying high temperature. Then, by transferring them to the substrate 801 or the substrate 803, a highly reliable light-emitting panel can be manufactured. Accordingly, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and has high reliability can be realized. Details of the manufacturing method will be described later.

  Note that a light-emitting element manufactured in the same process as the light-emitting element 830 described above is provided in the non-display portion, whereby the light-emitting element 22 illustrated in Embodiment Mode 1 can be used.

[Specific Example 2]
FIG. 10B is a plan view of the light-emitting panel, and FIG. 10D illustrates an example of a cross-sectional view taken along dashed-dotted line A3-A4 in FIG. The light emitting panel shown in specific example 2 is a top emission type light emitting panel using a color filter method, which is different from the specific example 1. Here, only the points different from the specific example 1 will be described in detail, and the description of the points common to the specific example 1 will be omitted.

  The light-emitting panel illustrated in FIG. 10D is different from the light-emitting panel illustrated in FIG.

  The light-emitting panel illustrated in FIG. 10D includes a spacer 827 over the insulating layer 821. By providing the spacer 827, the distance between the substrate 801 and the substrate 803 can be adjusted.

  In the light-emitting panel illustrated in FIG. 10D, the sizes of the substrate 801 and the substrate 803 are different. The connection body 825 is located on the insulating layer 843 and does not overlap with the substrate 803. The connection body 825 is connected to the conductive layer 857 through an opening provided in the insulating layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815. Since there is no need to provide an opening in the substrate 803, the material of the substrate 803 is not limited.

  Note that a light-emitting element manufactured in the same process as the light-emitting element 830 described above is provided in the non-display portion, whereby the light-emitting element 22 illustrated in Embodiment Mode 1 can be used.

[Specific Example 3]
FIG. 11A is a plan view of the light-emitting panel, and FIG. 11C illustrates an example of a cross-sectional view taken along dashed-dotted line A5-A6 in FIG. The light-emitting panel shown in the third specific example is a top emission type light-emitting panel using a painting method.

  A light-emitting panel illustrated in FIG. 11A includes a light-emitting portion 804, a driver circuit portion 806, and an FPC 808. Light-emitting elements and transistors included in the light-emitting portion 804 and the driver circuit portion 806 are sealed with a substrate 801, a substrate 803, a frame-shaped sealing layer 824, and a sealing layer 823.

  A light-emitting panel illustrated in FIG. 11C includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 821, and a sealing layer. 823, a frame-shaped sealing layer 824, and a substrate 803. The sealing layer 823 and the substrate 803 transmit visible light.

  The frame-shaped sealing layer 824 is preferably a layer having a higher gas barrier property than the sealing layer 823. Thereby, it can suppress that a water | moisture content and oxygen penetrate | invade into a light emission panel from the outside. Therefore, a highly reliable light-emitting panel can be realized.

  In Specific Example 3, light emitted from the light-emitting element 830 is extracted from the light-emitting panel through the sealing layer 823. Therefore, the sealing layer 823 preferably has higher translucency than the frame-shaped sealing layer 824. In addition, the sealing layer 823 preferably has a higher refractive index than the frame-shaped sealing layer 824. In addition, the sealing layer 823 preferably has a smaller volumetric shrinkage during curing than the frame-shaped sealing layer 824.

  The light-emitting portion 804 includes a transistor 820 and a light-emitting element 830 over a substrate 801 with an adhesive layer 811 and an insulating layer 813 interposed therebetween. The light-emitting element 830 includes a lower electrode 831 over the insulating layer 817, an EL layer 833 over the lower electrode 831, and an upper electrode 835 over the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. An end portion of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 transmits visible light.

  The driver circuit portion 806 includes a plurality of transistors over the substrate 801 with the adhesive layer 811 and the insulating layer 813 interposed therebetween. FIG. 11C illustrates one of the transistors included in the driver circuit portion 806.

  The insulating layer 813 and the substrate 801 are attached to each other with an adhesive layer 811. It is preferable to use a film with low water permeability for the insulating layer 813 because impurities such as water can be prevented from entering the light-emitting element 830 and the transistor 820 and the reliability of the light-emitting panel can be improved.

  The conductive layer 857 is electrically connected to an external input terminal that transmits an external signal or potential to the driver circuit portion 806. Here, an example in which an FPC 808 is provided as an external input terminal is shown. Here, an example in which the conductive layer 857 is manufactured using the same material and the same process as the electrode included in the transistor 820 is described.

  In the light-emitting panel illustrated in FIG. 11C, the connection body 825 is positioned over the substrate 803. The connection body 825 is connected to the conductive layer 857 through an opening provided in the substrate 803, the sealing layer 823, the insulating layer 817, and the insulating layer 815. Further, the connection body 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected through the connection body 825.

  In Example 3, the insulating layer 813, the transistor 820, and the light-emitting element 830 are manufactured over a manufacturing substrate with high heat resistance, the manufacturing substrate is peeled off, and the insulating layer 813 and the transistor 820 are formed over the substrate 801 with the use of the adhesive layer 811. The light emitting panel which can be produced by transposing the light emitting element 830 is shown. Since a transistor or the like can be manufactured over a manufacturing substrate with high heat resistance, a highly reliable transistor or a film with sufficiently low water permeability can be formed by applying high temperature. Then, by transferring them to the substrate 801, a highly reliable light-emitting panel can be manufactured. Accordingly, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and has high reliability can be realized.

  Note that a light-emitting element manufactured in the same process as the light-emitting element 830 described above is provided in the non-display portion, whereby the light-emitting element 22 illustrated in Embodiment Mode 1 can be used.

[Specific Example 4]
FIG. 11B is a plan view of the light-emitting panel, and FIG. 11D illustrates an example of a cross-sectional view taken along dashed-dotted line A7-A8 in FIG. The light-emitting panel shown in Example 4 is a bottom emission type light-emitting panel using a color filter method.

  A light-emitting panel illustrated in FIG. 11D includes a substrate 801, an adhesive layer 811, an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, a coloring layer 845, an insulating layer 817a, an insulating layer 817b, a conductive layer 816, The light-emitting element includes a plurality of light-emitting elements, an insulating layer 821, a sealing layer 823, and a substrate 803. The substrate 801, the adhesive layer 811, the insulating layer 813, the insulating layer 815, the insulating layer 817a, and the insulating layer 817b transmit visible light.

  The light-emitting portion 804 includes a transistor 820, a transistor 822, and a light-emitting element 830 over a substrate 801 with an adhesive layer 811 and an insulating layer 813 interposed therebetween. The light-emitting element 830 includes a lower electrode 831 over the insulating layer 817, an EL layer 833 over the lower electrode 831, and an upper electrode 835 over the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. An end portion of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 transmits visible light. There is no particular limitation on the position at which the colored layer 845 which overlaps with the light-emitting element 830, and for example, the colored layer 845 may be provided between the insulating layer 817a and the insulating layer 817b or between the insulating layer 815 and the insulating layer 817a.

  The driver circuit portion 806 includes a plurality of transistors over the substrate 801 with the adhesive layer 811 and the insulating layer 813 interposed therebetween. FIG. 11C illustrates two transistors among the transistors included in the driver circuit portion 806.

  The insulating layer 813 and the substrate 801 are attached to each other with an adhesive layer 811. It is preferable to use a film with low water permeability for the insulating layer 813 because impurities such as water can be prevented from entering the light-emitting element 830 and the transistors 820 and 822 and the reliability of the light-emitting panel is improved.

  The conductive layer 857 is electrically connected to an external input terminal that transmits an external signal or potential to the driver circuit portion 806. Here, an example in which an FPC 808 is provided as an external input terminal is shown. Here, an example in which the conductive layer 857 is manufactured using the same material and the same process as the conductive layer 816 is described.

  In Example 4, the insulating layer 813, the transistor 820, the light-emitting element 830, and the like are manufactured over a manufacturing substrate with high heat resistance, the manufacturing substrate is peeled off, and the insulating layer 813 or the transistor is formed over the substrate 801 with the use of the adhesive layer 811. A light-emitting panel that can be manufactured by transposing 820, the light-emitting element 830, and the like is shown. Since a transistor or the like can be manufactured over a manufacturing substrate with high heat resistance, a highly reliable transistor or a film with sufficiently low water permeability can be formed by applying high temperature. Then, by transferring them to the substrate 801, a highly reliable light-emitting panel can be manufactured. Accordingly, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and has high reliability can be realized.

  Note that a light-emitting element manufactured in the same process as the light-emitting element 830 described above is provided in the non-display portion, whereby the light-emitting element 22 illustrated in Embodiment Mode 1 can be used.

[Specific Example 5]
FIG. 11E illustrates an example of a light-emitting panel different from the specific examples 1 to 4.

  A light-emitting panel illustrated in FIG. 11E includes a substrate 801, an adhesive layer 811, an insulating layer 813, a conductive layer 814, a conductive layer 857a, a conductive layer 857b, a light-emitting element 830, an insulating layer 821, a sealing layer 823, and a substrate 803. Have

  The conductive layers 857a and 857b function as external connection electrodes of the light-emitting panel and can be electrically connected to an FPC or the like.

  The light-emitting element 830 includes a lower electrode 831, an EL layer 833, and an upper electrode 835. An end portion of the lower electrode 831 is covered with an insulating layer 821. The light-emitting element 830 is a bottom emission type, a top emission type, or a dual emission type. The electrode, substrate, insulating layer, and the like on the light extraction side each transmit visible light. The conductive layer 814 is electrically connected to the lower electrode 831.

  The substrate on the light extraction side may have a hemispherical lens, a microlens array, a film with a concavo-convex structure, a light diffusion film, or the like as the light extraction structure. For example, the light extraction structure can be formed by adhering the lens or film on a resin substrate using an adhesive having a refractive index comparable to that of the substrate or the lens or film.

  The conductive layer 814 is not necessarily provided, but is preferably provided because a voltage drop due to the resistance of the lower electrode 831 can be suppressed. For the same purpose, a conductive layer electrically connected to the upper electrode 835 may be provided over the insulating layer 821, the EL layer 833, the upper electrode 835, or the like.

  The conductive layer 814 is a single layer or a stacked layer using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, aluminum, or an alloy material containing these as a main component. Can be formed. The film thickness of the conductive layer 814 can be, for example, 0.1 μm to 3 μm, and preferably 0.1 μm to 0.5 μm.

  When a paste (silver paste or the like) is used as a material for the conductive layer electrically connected to the upper electrode 835, the metal constituting the conductive layer becomes granular and aggregates. Therefore, the surface of the conductive layer is rough and there are many gaps, and it is difficult for the EL layer 833 to completely cover the conductive layer, and it is easy to make an electrical connection between the upper electrode and the conductive layer. .

  In Example 5, the insulating layer 813, the light-emitting element 830, and the like are manufactured over a manufacturing substrate with high heat resistance, the manufacturing substrate is peeled off, and the insulating layer 813, the light-emitting element 830, and the like are formed over the substrate 801 using the adhesive layer 811. The light emitting panel which can be produced by transposing is shown. A highly reliable light-emitting panel can be manufactured by forming a film with sufficiently low water permeability on a manufacturing substrate with high heat resistance and transferring the film to the substrate 801. Accordingly, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and has high reliability can be realized.

  Note that here, an example in which a light-emitting element is used as a display element is described; however, one embodiment of the present invention is not limited thereto.

  For example, in this specification and the like, a display element, a display device or a display panel including a display element, a light-emitting element, and a light-emitting device including a light-emitting element use various forms or various elements Can have. As an example of a display element, a display device, a display panel, a light emitting element, or a light emitting device, an EL (electroluminescence) element (an EL element including an organic substance and an inorganic substance, an organic EL element, an inorganic EL element), an LED (white LED, red LED) , Green LED, blue LED, etc.), transistor (transistor that emits light in response to current), electron-emitting device, liquid crystal device, electronic ink, electrophoretic device, grating light valve (GLV), plasma display (PDP), MEMS (micro) Display elements using electro-mechanical systems, digital micromirror devices (DMD), DMS (digital micro shutters), MIRASOL (registered trademark), IMOD (interference modulation) elements, shutter-type MEMS table Some devices, such as optical interference MEMS display devices, electrowetting devices, piezoelectric ceramic displays, and carbon nanotubes, have display media whose contrast, brightness, reflectance, transmittance, and the like change due to electromagnetic action. . An example of a display device using an EL element is an EL display. As an example of a display device using an electron-emitting device, there is a field emission display (FED), a SED type flat display (SED: Surface-conduction Electron-emitter Display), or the like. As an example of a display device using a liquid crystal element, there is a liquid crystal display (a transmissive liquid crystal display, a transflective liquid crystal display, a reflective liquid crystal display, a direct view liquid crystal display, a projection liquid crystal display) and the like. An example of a display device using electronic ink, electronic powder fluid, or an electrophoretic element is electronic paper. Note that in the case of realizing a transflective liquid crystal display or a reflective liquid crystal display, part or all of the pixel electrode may have a function as a reflective electrode. For example, part or all of the pixel electrode may have aluminum, silver, or the like. Further, in that case, a memory circuit such as an SRAM can be provided under the reflective electrode. Thereby, power consumption can be further reduced.

  Note that a light-emitting element manufactured in the same process as the light-emitting element 830 described above is provided in the non-display portion, whereby the light-emitting element 22 illustrated in Embodiment Mode 1 can be used.

[Example of material]
Next, materials that can be used for the light-emitting panel will be described. In addition, description may be abbreviate | omitted about the structure demonstrated previously in this specification.

  For the substrate, materials such as glass, quartz, organic resin, metal, and alloy can be used. The substrate on the side from which light from the light-emitting element is extracted is formed using a material that transmits light.

  In particular, it is preferable to use a flexible substrate. For example, organic resin or flexible glass, metal, or alloy can be used.

  Since the specific gravity of an organic resin is smaller than that of glass, it is preferable to use an organic resin as the flexible substrate because the light-emitting panel can be reduced in weight compared to the case of using glass.

  It is preferable to use a material having high toughness for the substrate. Thereby, it is possible to realize a light-emitting panel that is excellent in impact resistance and is not easily damaged. For example, by using an organic resin substrate, a thin metal substrate, or an alloy substrate, it is possible to realize a light-emitting panel that is lighter and less likely to be damaged than a glass substrate.

  Metal materials and alloy materials are preferable because they have high thermal conductivity and can easily conduct heat to the entire substrate, which can suppress a local temperature increase of the light-emitting panel. The thickness of the substrate using a metal material or an alloy material is preferably 10 μm to 200 μm, and more preferably 20 μm to 50 μm.

  The material constituting the metal substrate or the alloy substrate is not particularly limited. For example, a metal such as aluminum, copper, iron, titanium, nickel, or an alloy containing one or more metals selected from these metals is used. Can do. As the alloy, for example, an aluminum alloy or stainless steel can be suitably used.

  In addition, when a material having a high thermal emissivity is used for the substrate, the surface temperature of the light-emitting panel can be suppressed from being increased, and the light-emitting panel can be prevented from being broken or reduced in reliability. For example, the substrate may have a stacked structure of a metal substrate and a layer having a high thermal emissivity (for example, a metal oxide or a ceramic material can be used).

  Examples of the material having flexibility and translucency include, for example, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, Examples include polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, and polyvinyl chloride resin. In particular, it is preferable to use a material having a low coefficient of thermal expansion. For example, a polyamideimide resin, a polyimide resin, PET, or the like can be suitably used. In addition, a substrate in which a fibrous body is impregnated with a resin (also referred to as a prepreg) or a substrate in which an inorganic filler is mixed with an organic resin to reduce the thermal expansion coefficient can be used.

  As a flexible substrate, a layer using the above material is a hard coat layer (for example, a silicon nitride layer) that protects the surface of the device from scratches, or a layer of a material that can disperse the pressure (for example, an aramid resin). Layer etc.) may be laminated.

  The flexible substrate can be used by stacking a plurality of layers. In particular, when the glass layer is used, the barrier property against water and oxygen can be improved and a highly reliable light-emitting panel can be obtained.

  For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are stacked from the side close to the light-emitting element can be used. The thickness of the glass layer is 20 μm or more and 200 μm or less, preferably 25 μm or more and 100 μm or less. The glass layer having such a thickness can simultaneously realize a high barrier property and flexibility against water and oxygen. The thickness of the organic resin layer is 10 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By providing such an organic resin layer outside the glass layer, it is possible to suppress breakage and cracking of the glass layer and improve mechanical strength. By applying such a composite material of a glass material and an organic resin to a substrate, a highly reliable flexible light-emitting panel can be obtained.

  For the adhesive layer and the sealing layer, various curable adhesives such as a UV curable adhesive, a reactive curable adhesive, a thermosetting adhesive, and an anaerobic adhesive can be used. Examples of these adhesives include epoxy resins, acrylic resins, silicone resins, phenol resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, EVA (ethylene vinyl acetate) resins, and the like. In particular, a material with low moisture permeability such as an epoxy resin is preferable. Alternatively, a two-component mixed resin may be used. Further, an adhesive sheet or the like may be used.

  Further, the resin may contain a desiccant. For example, a substance that adsorbs moisture by chemical adsorption, such as an alkaline earth metal oxide (such as calcium oxide or barium oxide), can be used. Alternatively, a substance that adsorbs moisture by physical adsorption, such as zeolite or silica gel, may be used. The inclusion of a desiccant is preferable because impurities such as moisture can be prevented from entering the functional element and the reliability of the light-emitting panel is improved.

  Moreover, the light extraction efficiency from a light emitting element can be improved by mixing the said resin with a filler with a high refractive index, or a light-scattering member. For example, titanium oxide, barium oxide, zeolite, zirconium, or the like can be used.

  There is no particular limitation on the structure of the transistor included in the light-emitting panel. For example, a staggered transistor or an inverted staggered transistor may be used. Further, a top-gate or bottom-gate transistor structure may be employed. A semiconductor material used for the transistor is not particularly limited, and examples thereof include silicon, germanium, silicon carbide, and gallium nitride. Alternatively, an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In—Ga—Zn-based metal oxide, may be used.

  There is no particular limitation on the crystallinity of a semiconductor material used for the transistor, and any of an amorphous semiconductor and a semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor partially including a crystal region) is used. May be used. It is preferable to use a crystalline semiconductor because deterioration of transistor characteristics can be suppressed.

  Here, it is preferable to use an oxide semiconductor for a semiconductor device such as a transistor used in a pixel, a driver circuit, a touch sensor described later, or the like. In particular, an oxide semiconductor having a larger band gap than silicon is preferably used. It is preferable to use a semiconductor material with a wider band gap and lower carrier density than silicon because current in an off state of the transistor can be reduced.

  For example, the oxide semiconductor preferably contains at least indium (In) or zinc (Zn). More preferably, an oxide represented by an In-M-Zn-based oxide (M is a metal such as Al, Ti, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf) is included.

  In particular, the semiconductor layer has a plurality of crystal parts, and the crystal part has a c-axis oriented perpendicular to the formation surface of the semiconductor layer or the top surface of the semiconductor layer, and a grain boundary between adjacent crystal parts. It is preferable to use an oxide semiconductor film which does not contain any oxide.

  Since such an oxide semiconductor does not have a crystal grain boundary, a crack in the oxide semiconductor film due to stress when the display panel is bent is suppressed. Therefore, such an oxide semiconductor can be favorably used for a display panel which is flexible and curved.

  By using such a material for the semiconductor layer, a change in electrical characteristics is suppressed and a highly reliable transistor can be realized.

  In addition, due to the low off-state current, the charge accumulated in the capacitor through the transistor can be held for a long time. By applying such a transistor to a pixel, the driving circuit can be stopped while maintaining the gradation of an image displayed in each display region. As a result, an electronic device with extremely low power consumption can be realized.

  In order to stabilize the characteristics of the transistor, it is preferable to provide a base film. As the base film, an inorganic insulating film such as a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a silicon nitride oxide film can be used, which can be formed as a single layer or a stacked layer. The base film is formed by sputtering, CVD (Chemical Vapor Deposition) (plasma CVD, thermal CVD, MOCVD (Metal Organic CVD), etc.), ALD (Atomic Layer Deposition), coating, printing, etc. it can. Note that the base film is not necessarily provided if not necessary. In each of the above structural examples, the insulating layer 813 can also serve as a base film of the transistor.

  As the light-emitting element, an element capable of self-emission can be used, and an element whose luminance is controlled by current or voltage is included in its category. For example, a light emitting diode (LED), an organic EL element, an inorganic EL element, or the like can be used.

  The light emitting element may be any of a top emission type, a bottom emission type, and a dual emission type. A conductive film that transmits visible light is used for the electrode from which light is extracted. In addition, a conductive film that reflects visible light is preferably used for the electrode from which light is not extracted.

  The conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide (ITO), indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or the like. In addition, a metal material such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, an alloy including these metal materials, or a nitride of these metal materials (for example, Titanium nitride) can also be used by forming it thin enough to have translucency. In addition, a stacked film of the above materials can be used as a conductive layer. For example, it is preferable to use a laminated film of silver and magnesium alloy and ITO because the conductivity can be increased. Further, graphene or the like may be used.

  For the conductive film that reflects visible light, for example, a metal material such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy including these metal materials is used. Can do. In addition, lanthanum, neodymium, germanium, or the like may be added to the metal material or alloy. Also, alloys containing aluminum (aluminum alloys) such as aluminum and titanium alloys, aluminum and nickel alloys, aluminum and neodymium alloys, silver and copper alloys, silver and palladium and copper alloys, and silver and magnesium alloys It can form using the alloy containing silver, such as. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, the oxidation of the aluminum alloy film can be suppressed by stacking the metal film or the metal oxide film in contact with the aluminum alloy film. Examples of the material for the metal film and metal oxide film include titanium and titanium oxide. Alternatively, the conductive film that transmits visible light and a film made of a metal material may be stacked. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, or the like can be used.

  The electrodes may be formed using a vapor deposition method or a sputtering method, respectively. In addition, it can be formed using a discharge method such as an inkjet method, a printing method such as a screen printing method, or a plating method.

  When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835, holes are injected into the EL layer 833 from the anode side and electrons are injected from the cathode side. The injected electrons and holes are recombined in the EL layer 833, and the light-emitting substance contained in the EL layer 833 emits light.

  The EL layer 833 includes at least a light-emitting layer. The EL layer 833 is a layer other than the light-emitting layer as a substance having a high hole-injecting property, a substance having a high hole-transporting property, a hole blocking material, a substance having a high electron-transporting property, a substance having a high electron-injecting property, or a bipolar property A layer containing a substance (a substance having a high electron transporting property and a high hole transporting property) or the like may be further included.

  For the EL layer 833, either a low molecular compound or a high molecular compound can be used, and an inorganic compound may be included. The layers constituting the EL layer 833 can be formed by a method such as a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an ink jet method, or a coating method.

  In the case where a white light-emitting element is used as the light-emitting element 830, the EL layer 833 preferably includes two or more kinds of light-emitting substances. For example, white light emission can be obtained by selecting the light emitting material so that the light emission of each of the two or more light emitting materials has a complementary color relationship. For example, a light emitting material that emits light such as R (red), G (green), B (blue), Y (yellow), and O (orange), or spectral components of two or more colors of R, G, and B It is preferable that 2 or more are included among the luminescent substances which show light emission containing. In addition, it is preferable to apply a light-emitting element whose emission spectrum from the light-emitting element 830 has two or more peaks in the wavelength range of visible light (for example, 350 nm to 750 nm). The emission spectrum of the material having a peak in the yellow wavelength region is preferably a material having spectral components in the green and red wavelength regions.

  More preferably, the EL layer 833 preferably has a structure in which a light-emitting layer including a light-emitting material that emits one color and a light-emitting layer including a light-emitting material that emits another color are stacked. For example, the plurality of light-emitting layers in the EL layer 833 may be stacked in contact with each other or may be stacked via a separation layer. For example, a separation layer may be provided between the fluorescent light emitting layer and the phosphorescent light emitting layer.

  The separation layer can be provided, for example, in order to prevent energy transfer (particularly triplet energy transfer) by a Dexter mechanism from an excited state of the phosphorescent material generated in the phosphorescent light emitting layer to the fluorescent material in the fluorescent light emitting layer. The separation layer may have a thickness of about several nm. Specifically, the thickness is 0.1 nm to 20 nm, or 1 nm to 10 nm, or 1 nm to 5 nm. The separation layer includes a single material (preferably a bipolar substance) or a plurality of materials (preferably a hole transport material and an electron transport material).

  The separation layer may be formed using a material included in the light emitting layer in contact with the separation layer. This facilitates the production of the light emitting element and reduces the driving voltage. For example, when the phosphorescent light-emitting layer is formed of a host material, an assist material, and a phosphorescent material (guest material), the separation layer may be formed using the host material and the assist material. In other words, the separation layer has a region not containing a phosphorescent material, and the phosphorescent light-emitting layer has a region containing a phosphorescent material. Thereby, the separation layer and the phosphorescent light emitting layer can be deposited with or without the phosphorescent material. Further, with such a structure, the separation layer and the phosphorescent light emitting layer can be formed in the same chamber. Thereby, manufacturing cost can be reduced.

  The light-emitting element 830 may be a single element having one EL layer or a tandem element in which a plurality of EL layers are stacked with a charge generation layer interposed therebetween.

  The light-emitting element is preferably provided between a pair of insulating films with low water permeability. Thereby, impurities such as water can be prevented from entering the light emitting element, and a decrease in reliability of the light emitting device can be suppressed.

  Examples of the low water-permeable insulating film include a film containing nitrogen and silicon such as a silicon nitride film and a silicon oxynitride film, and a film containing nitrogen and aluminum such as an aluminum nitride film. Alternatively, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

For example, the water vapor transmission rate of an insulating film having low water permeability is 1 × 10 ⁻⁵ [g / m ² · day] or less, preferably 1 × 10 ⁻⁶ [g / m ² · day] or less, more preferably 1 × 10 ⁻⁷ [g / m ² · day] or less, more preferably 1 × 10 ⁻⁸ [g / m ² · day] or less.

  An insulating film with low water permeability is preferably used for the insulating layer 813 and the insulating layer 843.

  As the insulating layer 815, for example, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film can be used. As the insulating layer 817, the insulating layer 817a, and the insulating layer 817b, organic materials such as polyimide, acrylic, polyamide, polyimide amide, and benzocyclobutene resin can be used, for example. Further, a low dielectric constant material (low-k material) or the like can be used. Each insulating layer may be formed by stacking a plurality of insulating films.

  The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. As the resin, for example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy resin, phenol resin, or the like can be used. In particular, it is preferable to use a photosensitive resin material so that the side wall of the opening has an inclined surface formed with a continuous curvature.

  A method for forming the insulating layer 821 is not particularly limited, and a photolithography method, a sputtering method, a vapor deposition method, a droplet discharge method (such as an ink jet method), a printing method (such as screen printing or offset printing) may be used.

  The spacer 827 can be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, as the inorganic insulating material and the organic insulating material, various materials that can be used for the insulating layer can be given. As the metal material, titanium, aluminum, or the like can be used. By adopting a structure in which the spacer 827 including a conductive material is electrically connected to the upper electrode 835, a potential drop due to the resistance of the upper electrode 835 can be suppressed. Further, the spacer 827 may have a forward tapered shape or a reverse tapered shape.

A conductive layer used for a light-emitting panel that functions as an electrode or a wiring of a transistor, an auxiliary electrode of a light-emitting element, or the like is, for example, a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, or scandium. An alloy material containing any of the above elements can be used to form a single layer or a stacked layer. The conductive layer may be formed using a conductive metal oxide. Examples of the conductive metal oxide include indium oxide (In ₂ O ₃ etc.), tin oxide (SnO ₂ etc.), zinc oxide (ZnO), ITO, indium zinc oxide (In ₂ O ₃ —ZnO etc.) or these A metal oxide material containing silicon oxide can be used.

  The colored layer is a colored layer that transmits light in a specific wavelength band. For example, a red (R) color filter that transmits light in the red wavelength band, a green (G) color filter that transmits light in the green wavelength band, and a blue (B) that transmits light in the blue wavelength band A color filter or the like can be used. Each colored layer is formed at a desired position using a variety of materials by a printing method, an inkjet method, an etching method using a photolithography method, or the like.

  The light shielding layer is provided between the adjacent colored layers. The light shielding layer shields light from adjacent light emitting elements and suppresses color mixing between adjacent light emitting elements. Here, light leakage can be suppressed by providing the end portion of the colored layer so as to overlap the light shielding layer. For the light-blocking layer, a material that blocks light emitted from the light-emitting element can be used. For example, a black matrix may be formed using a metal material, a resin material containing a pigment, or a dye. Note that the light shielding layer is preferably provided in a region other than the light emitting portion such as the drive circuit portion because unintended light leakage due to guided light or the like can be suppressed.

  Moreover, you may provide the overcoat which covers a colored layer and a light shielding layer. By providing the overcoat, diffusion of impurities and the like contained in the colored layer to the light emitting element can be prevented. The overcoat is made of a material that transmits light emitted from the light emitting element. For example, an inorganic insulating film such as a silicon nitride film or a silicon oxide film, or an organic insulating film such as an acrylic film or a polyimide film can be used. A laminated structure of a film and an inorganic insulating film may be used.

  In addition, when the sealing layer material is applied on the colored layer and the light shielding layer, it is preferable to use a material having high wettability with respect to the sealing layer material as the overcoat material. For example, it is preferable to use an oxide conductive film such as an ITO film or a metal film such as an Ag film that is thin enough to have translucency as the overcoat.

  As the connection body, a paste-like or sheet-like material obtained by mixing metal particles with a thermosetting resin and exhibiting anisotropic conductivity by thermocompression bonding can be used. As the metal particles, it is preferable to use particles in which two or more kinds of metals are layered, for example, nickel particles coated with gold. Or it is preferable to use the material which coat | covered the surface of the granular resin with the metal.

[Example of production method]
Next, a method for manufacturing the light-emitting panel is illustrated with reference to FIGS. Here, a light-emitting panel having the structure of specific example 1 (FIG. 11C) is described as an example.

  First, the separation layer 203 is formed over the formation substrate 201, and the insulating layer 813 is formed over the separation layer 203. Next, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, and an insulating layer 821 are formed over the insulating layer 813. Note that the insulating layer 821, the insulating layer 817, and the insulating layer 815 are opened so that the conductive layer 857 is exposed (FIG. 12A).

  Further, the separation layer 207 is formed over the manufacturing substrate 205 and the insulating layer 843 is formed over the separation layer 207. Next, a light-blocking layer 847, a colored layer 845, and an overcoat 849 are formed over the insulating layer 843 (FIG. 12B).

  As the manufacturing substrate 201 and the manufacturing substrate 205, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate, or the like can be used, respectively.

  Moreover, glass materials, such as aluminosilicate glass, alumino borosilicate glass, barium borosilicate glass, can be used for a glass substrate, for example. When the temperature of the subsequent heat treatment is high, a material having a strain point of 730 ° C. or higher is preferably used. A more practical heat-resistant glass can be obtained by containing a large amount of barium oxide (BaO). In addition, crystallized glass or the like can be used.

  In the case where a glass substrate is used as the formation substrate, if an insulating film such as a silicon oxide film, a silicon oxynitride film, a silicon nitride film, or a silicon nitride oxide film is formed between the formation substrate and the separation layer, contamination from the glass substrate can be prevented. This is preferable because it can be prevented.

  As the peeling layer 203 and the peeling layer 207, an element selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, and silicon, respectively, It is a single layer or a laminated layer made of an alloy material containing or a compound material containing the element. The crystal structure of the layer containing silicon may be any of amorphous, microcrystalline, and polycrystalline.

  The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. Note that the coating method includes a spin coating method, a droplet discharge method, and a dispensing method.

  In the case where the separation layer has a single-layer structure, a tungsten layer, a molybdenum layer, or a layer containing a mixture of tungsten and molybdenum is preferably formed. Alternatively, a layer containing tungsten oxide or oxynitride, a layer containing molybdenum oxide or oxynitride, or a layer containing an oxide or oxynitride of a mixture of tungsten and molybdenum may be formed. Note that the mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

In the case of forming a stacked structure of a layer containing tungsten and a layer containing tungsten oxide as the peeling layer, a layer containing tungsten is formed, and an insulating film formed of an oxide is formed thereon. Alternatively, the fact that a layer containing an oxide of tungsten is formed at the interface between the tungsten layer and the insulating film may be utilized. Further, the surface of the layer containing tungsten is subjected to thermal oxidation treatment, oxygen plasma treatment, nitrous oxide (N ₂ O) plasma treatment, treatment with a solution having strong oxidizing power such as ozone water, and the like to form tungsten oxide. An included layer may be formed. Plasma treatment and heat treatment may be performed in oxygen, nitrogen, nitrous oxide alone, or a mixed gas atmosphere of the gas and other gases. By changing the surface state of the release layer by the plasma treatment or the heat treatment, the adhesion between the release layer and an insulating film to be formed later can be controlled.

  Each insulating layer can be formed using a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. For example, by forming the insulating film at a film formation temperature of 250 ° C. or more and 400 ° C. or less by the plasma CVD method. , A dense and very low water-permeable film can be obtained.

  After that, a material to be the sealing layer 823 is applied to the surface of the manufacturing substrate 205 on which the colored layer 845 or the like is provided or the surface of the manufacturing substrate 201 on which the light-emitting element 230 or the like is provided. The manufacturing substrate 201 and the manufacturing substrate 205 are attached to each other so as to face each other (FIG. 12C).

  Then, the manufacturing substrate 201 is peeled off, and the exposed insulating layer 813 and the substrate 801 are attached to each other using the adhesive layer 811. Further, the manufacturing substrate 205 is peeled off, and the exposed insulating layer 843 and the substrate 803 are attached to each other using the adhesive layer 841. In FIG. 13A, the substrate 803 does not overlap with the conductive layer 857; however, the conductive layer 857 and the substrate 803 may overlap.

Note that various methods can be appropriately used for the peeling step. For example, in the case where a layer including a metal oxide film is formed on the side in contact with the layer to be peeled, the metal oxide film is weakened by crystallization and the layer to be peeled can be peeled from the manufacturing substrate. In the case where an amorphous silicon film containing hydrogen is formed as a separation layer between a manufacturing substrate with high heat resistance and a layer to be separated, the amorphous silicon film can be removed by laser light irradiation or etching. The layer to be peeled can be peeled from the manufacturing substrate. In addition, a layer including a metal oxide film is formed on the side in contact with the layer to be peeled as the peeling layer, the metal oxide film is made brittle by crystallization, and a part of the peeling layer is made of solution, NF ₃ , BrF ₃ , ClF After removal by etching using a fluorination gas such as _3, it can be peeled off in the weakened metal oxide film. Further, a film containing nitrogen, oxygen, hydrogen, or the like (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, or the like) is used as the peeling layer, and the peeling layer is irradiated with laser light. A method may be used in which nitrogen, oxygen, or hydrogen contained in the peeling layer is released as a gas to promote peeling between the layer to be peeled and the substrate. Alternatively, a manufacturing substrate over which the layer to be peeled is formed can be mechanically removed or removed by etching with a solution or a fluoride gas such as NF ₃ , BrF ₃ , or ClF ₃ . In this case, the release layer is not necessarily provided.

  Moreover, a peeling process can be more easily performed by combining two or more said peeling methods. In other words, laser beam irradiation, etching of the release layer with gas or solution, mechanical removal with a sharp knife or scalpel, etc. to make the release layer and the release layer easy to peel off, Peeling can also be performed by force (by machine or the like).

  Alternatively, the layer to be peeled may be peeled from the manufacturing substrate by infiltrating a liquid into the interface between the peeling layer and the layer to be peeled. Alternatively, the peeling may be performed while a liquid such as water is applied.

  As another peeling method, when the peeling layer is formed of tungsten, the peeling may be performed while etching the peeling layer with a mixed solution of ammonia water and hydrogen peroxide water.

  Note that in the case where peeling is possible at the interface between the manufacturing substrate and the layer to be peeled, the peeling layer is not necessarily provided. For example, glass is used as a manufacturing substrate, an organic resin such as polyimide, polyester, polyolefin, polyamide, polycarbonate, or acrylic is formed in contact with the glass, and an insulating film, a transistor, or the like is formed over the organic resin. In this case, the organic resin can be peeled at the interface between the manufacturing substrate and the organic resin by heating. Alternatively, a metal layer may be provided between the manufacturing substrate and the organic resin, and current may be supplied to the metal layer to heat the metal layer, and separation may be performed at the interface between the metal layer and the organic resin.

  Finally, the conductive layer 857 is exposed by opening the insulating layer 843 and the sealing layer 823 (FIG. 13B). Note that in the case where the substrate 803 overlaps with the conductive layer 857, the substrate 803 and the adhesive layer 841 are also opened to expose the conductive layer 857 (FIG. 13C). The opening means is not particularly limited, and for example, a laser ablation method, an etching method, an ion beam sputtering method, or the like may be used. Alternatively, the film on the conductive layer 857 may be cut using a sharp blade or the like, and a part of the film may be peeled off by a physical force.

  Through the above, a light-emitting panel can be manufactured.

  This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

(Embodiment 3)
In this embodiment, a structure example of a foldable touch panel that can be used for the display panel included in the electronic device of one embodiment of the present invention will be described with reference to FIGS. Note that Embodiment 2 can be referred to for materials that can be used for each layer.

[Configuration example 1]
FIG. 14A is a top view of the touch panel. FIG. 14B is a cross-sectional view taken along the dashed-dotted line AB in FIG. 14A and between the dashed-dotted line CD. FIG. 14C is a cross-sectional view taken along alternate long and short dash line E-F in FIG.

  As shown in FIG. 14A, the touch panel 390 includes a display portion 301.

  The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. The imaging pixel 308 can detect a finger or the like that touches the display unit 301. Accordingly, a touch sensor can be configured using the imaging pixel 308.

  The pixel 302 includes a plurality of subpixels (for example, the subpixel 302R), and the subpixel includes a light emitting element and a pixel circuit that can supply power for driving the light emitting element.

  The pixel circuit is electrically connected to a wiring that can supply a selection signal and a wiring that can supply an image signal.

  The touch panel 390 includes a scanning line driver circuit 303g (1) that can supply a selection signal to the pixel 302 and an image signal line driver circuit 303s (1) that can supply an image signal to the pixel 302.

  The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

  The imaging pixel circuit is electrically connected to a wiring that can supply a control signal and a wiring that can supply a power supply potential.

  As the control signal, for example, a signal that can select an imaging pixel circuit that reads a recorded imaging signal, a signal that can initialize the imaging pixel circuit, and a time that the imaging pixel circuit detects light are determined. Signals that can be used.

  The touch panel 390 includes an imaging pixel driving circuit 303g (2) that can supply a control signal to the imaging pixel 308, and an imaging signal line driving circuit 303s (2) that reads the imaging signal.

  As illustrated in FIG. 14B, the touch panel 390 includes a substrate 510 and a substrate 570 that faces the substrate 510.

  A flexible material can be preferably used for the substrate 510 and the substrate 570.

A material in which the transmission of unintended impurities is suppressed can be preferably used for the substrate 510 and the substrate 570. For example, a material having a water vapor permeability of 10 ⁻⁵ g / m ² · day or less, preferably 10 ⁻⁶ g / m ² · day or less can be suitably used.

A material having approximately the same linear expansion coefficient can be preferably used for the substrate 510 and the substrate 570. For example, a material having a linear expansion coefficient of 1 × 10 ⁻³ / K or less, preferably 5 × 10 ⁻⁵ / K or less, more preferably 1 × 10 ⁻⁵ / K or less can be suitably used.

  The substrate 510 is a stacked body in which a flexible substrate 510b, an insulating layer 510a that prevents unintended diffusion of impurities into the light-emitting element, and an adhesive layer 510c that bonds the flexible substrate 510b and the insulating layer 510a are stacked.

  The substrate 570 is a stacked body of a flexible substrate 570b, an insulating layer 570a that prevents unintentional diffusion of impurities into the light-emitting element, and an adhesive layer 570c that bonds the flexible substrate 570b and the insulating layer 570a.

  For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide, polycarbonate, or a material containing a resin having an acrylic, urethane, epoxy, or siloxane bond can be used for the adhesive layer.

  The sealing layer 560 bonds the substrate 570 and the substrate 510 together. The sealing layer 560 has a higher refractive index than air. In the case where light is extracted to the sealing layer 560 side, the sealing layer 560 also serves as an optical bonding layer. The pixel circuit and the light-emitting element (eg, the first light-emitting element 350R) are between the substrate 510 and the substrate 570.

  The pixel 302 includes a sub-pixel 302R, a sub-pixel 302G, and a sub-pixel 302B (FIG. 14C). The subpixel 302R includes a light emitting module 380R, the subpixel 302G includes a light emitting module 380G, and the subpixel 302B includes a light emitting module 380B.

  For example, the sub-pixel 302R includes a pixel circuit including a first light-emitting element 350R and a transistor 302t that can supply power to the first light-emitting element 350R (FIG. 14B). The light emitting module 380R includes a first light emitting element 350R and an optical element (for example, a colored layer 367R).

  The light-emitting element 350R includes a first lower electrode 351R, an upper electrode 352, and an EL layer 353 between the lower electrode 351R and the upper electrode 352 (FIG. 14C).

  The EL layer 353 includes a first EL layer 353a, a second EL layer 353b, and an intermediate layer 354 between the first EL layer 353a and the second EL layer 353b.

  The light emitting module 380R includes the first colored layer 367R on the substrate 570. The colored layer may be any layer that transmits light having a specific wavelength. For example, a layer that selectively transmits light exhibiting red, green, blue, or the like can be used. Or you may provide the area | region which permeate | transmits the light which a light emitting element emits as it is.

  For example, the light-emitting module 380R includes a sealing layer 360 that is in contact with the first light-emitting element 350R and the first colored layer 367R.

  The first colored layer 367R is positioned so as to overlap with the first light-emitting element 350R. Accordingly, part of the light emitted from the light emitting element 350R passes through the sealing layer 360 that also serves as the optical bonding layer and the first colored layer 367R, and is emitted to the outside of the light emitting module 380R as indicated by arrows in the drawing. Is done.

  The touch panel 390 includes a light shielding layer 367BM on the substrate 570. The light shielding layer 367BM is provided so as to surround the colored layer (for example, the first colored layer 367R).

  The touch panel 390 includes an antireflection layer 367p at a position overlapping the display unit 301. For example, a circularly polarizing plate can be used as the antireflection layer 367p.

  The touch panel 390 includes an insulating layer 321. The insulating layer 321 covers the transistor 302t. Note that the insulating layer 321 can be used as a layer for planarizing unevenness caused by the pixel circuit. An insulating layer in which layers capable of suppressing diffusion of impurities to the transistor 302t and the like are stacked can be applied to the insulating layer 321.

  The touch panel 390 includes a light-emitting element (eg, the first light-emitting element 350R) over the insulating layer 321.

  The touch panel 390 includes a partition 328 over the insulating layer 321 that overlaps with an end portion of the first lower electrode 351R. In addition, a spacer 329 for controlling the distance between the substrate 510 and the substrate 570 is provided over the partition 328.

  The image signal line driver circuit 303s (1) includes a transistor 303t and a capacitor 303c. Note that the driver circuit can be formed over the same substrate in the same process as the pixel circuit. As illustrated in FIG. 14B, the transistor 303t may include the second gate 304 over the insulating layer 321. The second gate 304 may be electrically connected to the gate of the transistor 303t, or a different potential may be applied thereto. If necessary, the second gate 304 may be provided in the transistor 308t, the transistor 302t, or the like.

  The imaging pixel 308 includes a photoelectric conversion element 308p and an imaging pixel circuit for detecting light irradiated on the photoelectric conversion element 308p. The imaging pixel circuit includes a transistor 308t.

  For example, a pin-type photodiode can be used for the photoelectric conversion element 308p.

  The touch panel 390 includes a wiring 311 that can supply a signal, and a terminal 319 is provided in the wiring 311. Note that an FPC 309 (1) that can supply a signal such as an image signal and a synchronization signal is electrically connected to the terminal 319. Note that a printed wiring board (PWB) may be attached to the FPC 309 (1).

  A transistor formed in the same process can be used as a transistor such as the transistor 302t, the transistor 303t, and the transistor 308t. Embodiment 2 can be referred to for the structure of the transistor.

  In addition to the gate, source, and drain of the transistor, materials that can be used for various wirings and electrodes constituting the touch panel include aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or A single metal made of tungsten or an alloy containing the single metal as a main component is used as a single layer structure or a laminated structure. For example, a single layer structure of an aluminum film containing silicon, a two layer structure in which an aluminum film is stacked on a titanium film, a two layer structure in which an aluminum film is stacked on a tungsten film, and a copper film on a copper-magnesium-aluminum alloy film Two-layer structure to be laminated, two-layer structure to laminate a copper film on a titanium film, two-layer structure to laminate a copper film on a tungsten film, a titanium film or a titanium nitride film, and an overlay on the titanium film or the titanium nitride film A three-layer structure in which an aluminum film or a copper film is laminated, and a titanium film or a titanium nitride film is further formed thereon, a molybdenum film or a molybdenum nitride film, and an aluminum film or a copper layer stacked on the molybdenum film or the molybdenum nitride film There is a three-layer structure in which films are stacked and a molybdenum film or a molybdenum nitride film is further formed thereon. Note that a transparent conductive material containing indium oxide, tin oxide, or zinc oxide may be used. Further, it is preferable to use copper containing manganese because the controllability of the shape by etching is increased.

  Note that a light-emitting element manufactured in the same step as the above-described light-emitting element (eg, the first light-emitting element 350R) can be used as the light-emitting element 22 illustrated in Embodiment Mode 1 by providing it in a non-display portion. In addition, by providing an imaging pixel manufactured in the same process as the imaging pixel 308 including the photoelectric conversion element 308p and the imaging pixel circuit described above in the non-display portion, the light receiving element 21 exemplified in Embodiment 1 can be used.

[Configuration example 2]
15A and 15B are perspective views of the touch panel 505. FIG. Note that representative components are shown for clarity. FIG. 16 is a cross-sectional view taken along alternate long and short dash line X1-X2 in FIG.

  The touch panel 505 includes a display portion 501 and a touch sensor 595 (FIG. 15B). The touch panel 505 includes a substrate 510, a substrate 570, and a substrate 590. Note that the substrate 510, the substrate 570, and the substrate 590 are all flexible.

  The display portion 501 includes a substrate 510, a plurality of pixels on the substrate 510, and a plurality of wirings 511 that can supply signals to the pixels. The plurality of wirings 511 are routed to the outer peripheral portion of the substrate 510, and a part of them constitutes a terminal 519. A terminal 519 is electrically connected to the FPC 509 (1).

  The substrate 590 includes a touch sensor 595 and a plurality of wirings 598 that are electrically connected to the touch sensor 595. The plurality of wirings 598 are routed around the outer periphery of the substrate 590, and a part thereof constitutes a terminal. The terminal is electrically connected to the FPC 509 (2). Note that in FIG. 15B, for the sake of clarity, electrodes, wirings, and the like of the touch sensor 595 provided on the back surface side (the back side of the paper surface) of the substrate 590 are indicated by solid lines.

  As the touch sensor 595, for example, a capacitive touch sensor can be applied. Examples of the electrostatic capacity method include a surface electrostatic capacity method and a projection electrostatic capacity method.

  As the projected capacitance method, there are mainly a self-capacitance method and a mutual capacitance method due to a difference in driving method. The mutual capacitance method is preferable because simultaneous multipoint detection is possible.

  Hereinafter, a case where a projected capacitive touch sensor is used will be described with reference to FIG.

  Note that various sensors that can detect the proximity or contact of a detection target such as a finger can be applied.

  The projected capacitive touch sensor 595 includes an electrode 591 and an electrode 592. The electrode 591 is electrically connected to any one of the plurality of wirings 598, and the electrode 592 is electrically connected to any one of the plurality of wirings 598.

  As shown in FIGS. 15A and 15B, the electrode 592 has a shape in which a plurality of quadrilaterals repeatedly arranged in one direction are connected at corners.

  The electrode 591 has a quadrangular shape, and is repeatedly arranged in a direction intersecting with the direction in which the electrode 592 extends.

  The wiring 594 electrically connects two electrodes 591 sandwiching the electrode 592. At this time, a shape in which the area of the intersection of the electrode 592 and the wiring 594 is as small as possible is preferable. Thereby, the area of the area | region in which the electrode is not provided can be reduced, and the nonuniformity of the transmittance | permeability can be reduced. As a result, luminance unevenness of light transmitted through the touch sensor 595 can be reduced.

  Note that the shapes of the electrode 591 and the electrode 592 are not limited thereto, and various shapes can be employed. For example, a plurality of electrodes 591 may be arranged so as not to have a gap as much as possible, and a plurality of electrodes 592 may be provided with an insulating layer interposed therebetween so that a region that does not overlap with the electrode 591 is formed. At this time, it is preferable to provide a dummy electrode electrically insulated from two adjacent electrodes 592 because the area of a region having different transmittance can be reduced.

  The touch sensor 595 includes a substrate 590, electrodes 591 and 592 that are arranged in a staggered manner on the substrate 590, an insulating layer 593 that covers the electrodes 591 and 592, and wiring 594 that electrically connects adjacent electrodes 591.

  The adhesive layer 597 bonds the substrate 590 to the substrate 570 so that the touch sensor 595 overlaps the display portion 501.

  The electrodes 591 and 592 are formed using a light-transmitting conductive material. As the light-transmitting conductive material, a conductive oxide such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, or zinc oxide to which gallium is added can be used. Note that a film containing graphene can also be used. The film containing graphene can be formed, for example, by reducing a film containing graphene oxide formed in a film shape. Examples of the reduction method include a method of applying heat.

  A conductive material having a light-transmitting property is formed over the substrate 590 by a sputtering method, and then unnecessary portions are removed by various patterning techniques such as a photolithography method to form the electrode 591 and the electrode 592. it can.

  As a material used for the insulating layer 593, for example, an inorganic insulating material such as silicon oxide, silicon oxynitride, or aluminum oxide can be used in addition to a resin such as acrylic or epoxy, a resin having a siloxane bond.

  An opening reaching the electrode 591 is provided in the insulating layer 593, and the wiring 594 electrically connects the adjacent electrodes 591. Since the light-transmitting conductive material can increase the aperture ratio of the touch panel, it can be preferably used for the wiring 594. A material having higher conductivity than the electrodes 591 and 592 can be preferably used for the wiring 594 because electric resistance can be reduced.

  One electrode 592 extends in one direction, and a plurality of electrodes 592 are provided in stripes.

  The wiring 594 is provided so as to cross the electrode 592.

  A pair of electrodes 591 is provided with one electrode 592 interposed therebetween, and a wiring 594 electrically connects the pair of electrodes 591.

  Note that the plurality of electrodes 591 are not necessarily arranged in a direction orthogonal to the one electrode 592, and may be arranged at an angle of less than 90 degrees.

  One wiring 598 is electrically connected to the electrode 591 or the electrode 592. Part of the wiring 598 functions as a terminal. As the wiring 598, for example, a metal material such as aluminum, gold, platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy material including the metal material is used. it can.

  Note that an insulating layer that covers the insulating layer 593 and the wiring 594 can be provided to protect the touch sensor 595.

  In addition, the connection layer 599 electrically connects the wiring 598 and the FPC 509 (2).

  As the connection layer 599, various anisotropic conductive films (ACF: Anisotropic Conductive Film), anisotropic conductive pastes (ACP: Anisotropic Conductive Paste), or the like can be used.

  The adhesive layer 597 has a light-transmitting property. For example, a thermosetting resin or an ultraviolet curable resin can be used, and specifically, a resin such as acrylic, urethane, epoxy, or a resin having a siloxane bond can be used.

  The display unit 501 includes a plurality of pixels arranged in a matrix. The pixel includes a display element and a pixel circuit that drives the display element.

  In this embodiment, the case where an organic EL element that emits white light is applied to a display element will be described; however, the display element is not limited to this.

  For example, organic EL elements having different emission colors may be applied to each sub-pixel so that the color of light emitted from each sub-pixel is different.

  The substrate 510, the substrate 570, and the sealing layer 560 can have the same structure as that of the structure example 1.

  The pixel includes a sub-pixel 502R, and the sub-pixel 502R includes a light emitting module 580R.

  The sub-pixel 502R includes a pixel circuit including a first light-emitting element 550R and a transistor 502t that can supply power to the first light-emitting element 550R. The light emitting module 580R includes a first light emitting element 550R and an optical element (for example, a colored layer 567R).

  The light-emitting element 550R includes a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode.

  The light emitting module 580R includes the first colored layer 567R in the direction in which light is extracted.

  In the case where the sealing layer 560 is provided on the light extraction side, the sealing layer 560 is in contact with the first light-emitting element 550R and the first colored layer 567R.

  The first colored layer 567R is positioned so as to overlap with the first light-emitting element 550R. Thus, part of the light emitted from the light emitting element 550R passes through the first colored layer 567R and is emitted to the outside of the light emitting module 580R in the direction of the arrow shown in the drawing.

  The display portion 501 includes a light shielding layer 567BM in a direction in which light is emitted. The light-blocking layer 567BM is provided so as to surround the colored layer (for example, the first colored layer 567R).

  The display portion 501 includes an antireflection layer 567p at a position overlapping the pixel. As the antireflection layer 567p, for example, a circularly polarizing plate can be used.

  The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. Note that the insulating film 521 can be used as a layer for planarizing unevenness caused by the pixel circuit. In addition, a stacked film including a layer that can suppress diffusion of impurities can be applied to the insulating film 521. Accordingly, a decrease in reliability of the transistor 502t and the like due to unexpected impurity diffusion can be suppressed.

  The display portion 501 includes a light-emitting element (eg, the first light-emitting element 550R) over the insulating film 521.

  The display portion 501 includes a partition wall 528 over the insulating film 521 that overlaps with an end portion of the first lower electrode. In addition, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided over the partition wall 528.

  The scan line driver circuit 503g (1) includes a transistor 503t and a capacitor 503c. Note that the driver circuit can be formed over the same substrate in the same process as the pixel circuit.

  The display portion 501 includes a wiring 511 that can supply a signal, and a terminal 519 is provided in the wiring 511. Note that an FPC 509 (1) that can supply a signal such as an image signal and a synchronization signal is electrically connected to the terminal 519.

  Note that a printed wiring board (PWB) may be attached to the FPC 509 (1).

  The display portion 501 includes wiring such as scanning lines, signal lines, and power supply lines. The various conductive films described above can be used for the wiring.

  Note that various transistors can be applied to the display portion 501. A structure in the case of applying a bottom-gate transistor to the display portion 501 is illustrated in FIGS.

  For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

  For example, a semiconductor layer containing polycrystalline silicon crystallized by a process such as laser annealing can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

  FIG. 16C illustrates a structure in the case where a top-gate transistor is applied to the display portion 501.

  For example, a semiconductor layer including a single crystal silicon film or the like transferred from a polycrystalline silicon, a single crystal silicon substrate, or the like can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

  Note that a light-emitting element manufactured in the same process as the above-described light-emitting element (eg, the first light-emitting element 550R) can be provided as the light-emitting element 22 illustrated in Embodiment Mode 1 by providing it in a non-display portion.

[Configuration example 3]
FIG. 17 is a cross-sectional view of the touch panel 505B. A touch panel 505B described in this embodiment includes a display portion 501 that displays supplied image information on a side where a transistor is provided and a touch sensor provided on the substrate 510 side of the display portion. This is different from the touch panel 505 in the configuration example 2. Here, different configurations will be described in detail, and the above description is used for the portions where the same configurations can be used.

  The first colored layer 567R is positioned so as to overlap with the first light-emitting element 550R. In addition, the light-emitting element 550R illustrated in FIG. 17A emits light to the side where the transistor 502t is provided. Thus, part of the light emitted from the light emitting element 550R passes through the first colored layer 567R and is emitted to the outside of the light emitting module 580R in the direction of the arrow shown in the drawing.

  The display portion 501 includes a light shielding layer 567BM in a direction in which light is emitted. The light-blocking layer 567BM is provided so as to surround the colored layer (for example, the first colored layer 567R).

  The touch sensor 595 is provided on the substrate 510 side of the display portion 501 (FIG. 17A).

  The adhesive layer 597 is between the substrate 510 and the substrate 590, and the display portion 501 and the touch sensor 595 are attached to each other.

  Note that various transistors can be applied to the display portion 501. A structure in the case where a bottom-gate transistor is applied to the display portion 501 is illustrated in FIGS.

  For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

  For example, a semiconductor layer containing polycrystalline silicon or the like can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

  FIG. 17C illustrates a structure in the case where a top-gate transistor is applied to the display portion 501.

  For example, a semiconductor layer including polycrystalline silicon, a transferred single crystal silicon film, or the like can be applied to the transistor 502t and the transistor 503t illustrated in FIG.

  Note that a light-emitting element manufactured in the same process as the above-described light-emitting element (eg, the first light-emitting element 550R) can be provided as the light-emitting element 22 illustrated in Embodiment Mode 1 by providing it in a non-display portion.

  This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

(Embodiment 4)
In this embodiment, an example of a touch panel driving method that can be used for the display panel included in the electronic device of one embodiment of the present invention will be described with reference to drawings.

[Example of sensor detection method]
FIG. 18A is a block diagram illustrating a structure of a mutual capacitive touch sensor. FIG. 18A shows a pulse voltage output circuit 601 and a current detection circuit 602. Note that in FIG. 18A, an electrode 621 to which a pulse voltage is applied and an electrode 622 for detecting a change in current are illustrated as six wirings of X1-X6 and Y1-Y6, respectively. FIG. 18A illustrates a capacitor 603 formed by overlapping the electrode 121 and the electrode 122. Note that the functions of the electrode 121 and the electrode 122 may be interchanged.

  The pulse voltage output circuit 601 is a circuit for sequentially applying pulses to the wiring lines X1 to X6. When a pulse voltage is applied to the wiring of X1-X6, an electric field is generated in the electrode 121 and the electrode 122 forming the capacitor 603. By utilizing the fact that the electric field generated between the electrodes causes a change in the mutual capacitance of the capacitor 603 due to shielding or the like, it is possible to detect the proximity or contact of the detection object.

  The current detection circuit 602 is a circuit for detecting a change in current in the wirings Y1 to Y6 due to a change in mutual capacitance in the capacitor 603. In the wiring of Y1-Y6, there is no change in the current value detected when there is no proximity or contact with the detected object, but the current value when the mutual capacitance decreases due to the proximity or contact with the detected object. Detect changes that decrease. Note that current detection may be performed using an integration circuit or the like.

  Next, FIG. 18B shows a timing chart of input / output waveforms in the mutual capacitance type touch sensor shown in FIG. In FIG. 18B, the detection target is detected in each matrix in one frame period. Further, FIG. 18B shows two cases, that is, a case where the detected object is not detected (non-touch) and a case where the detected object is detected (touch). In addition, about the wiring of Y1-Y6, the waveform made into the voltage value corresponding to the detected electric current value is shown.

  A pulse voltage is sequentially applied to the X1-X6 wiring, and the waveform of the Y1-Y6 wiring changes according to the pulse voltage. When there is no proximity or contact of the detection object, the waveform of Y1-Y6 changes uniformly according to the change of the voltage of the wiring of X1-X6. On the other hand, since the current value decreases at the location where the detection object is close or in contact, the waveform of the voltage value corresponding to this also changes.

  In this way, by detecting the change in mutual capacitance, the proximity or contact of the detection target can be detected.

  In FIG. 18A, a structure of a passive touch sensor in which only a capacitor 603 is provided at a wiring intersection as a touch sensor is shown; however, an active touch sensor including a transistor and a capacitor may be used. FIG. 19 shows an example of one sensor circuit included in an active touch sensor.

  The sensor circuit includes a capacitor 603, a transistor 611, a transistor 612, and a transistor 613. In the transistor 613, a signal G2 is supplied to a gate, a voltage VRES is supplied to one of a source and a drain, and the other is electrically connected to one electrode of the capacitor 603 and the gate of the transistor 611. One of a source and a drain of the transistor 611 is electrically connected to one of a source and a drain of the transistor 612, and the voltage VSS is applied to the other. The gate of the transistor 612 is supplied with the signal G2, and the other of the source and the drain is electrically connected to the wiring ML. The voltage VSS is applied to the other electrode of the capacitor 603.

  Next, the operation of the sensor circuit will be described. First, a potential for turning on the transistor 613 is applied as the signal G2, so that a potential corresponding to the voltage VRES is applied to the node n to which the gate of the transistor 611 is connected. Next, a potential for turning off the transistor 613 is supplied as the signal G2, so that the potential of the node n is held.

  Subsequently, as the mutual capacitance of the capacitor 603 changes due to the proximity or contact of a detection target such as a finger, the potential of the node n changes from VRES.

  In the reading operation, a potential for turning on the transistor 612 is applied to the signal G1. The current flowing through the transistor 611, that is, the current flowing through the wiring ML changes in accordance with the potential of the node n. By detecting this current, the proximity or contact of the detection object can be detected.

  As the transistor 611, the transistor 612, and the transistor 613, a transistor in which an oxide semiconductor is used for a semiconductor layer in which a channel is formed is preferably used. In particular, when such a transistor is used as the transistor 613, the potential of the node n can be held for a long time, and the frequency of the operation (refresh operation) of supplying VRES to the node n can be reduced. it can.

  This embodiment can be implemented in appropriate combination with at least part of the other embodiments described in this specification.

DESCRIPTION OF SYMBOLS 10 Electronic device 11a Support body 11b Support body 11c Support body 11d Support body 11e Support body 12 Connection part 12a Neutral line 13 Display panel 13_1 Display panel 13_2 Display panel 13a Display part 13b Non-display part 14 Detection means 15 FPC
16 circuit board 17 battery 18 wiring 21 light receiving element 22 light emitting element 23 light 24 area 25 area 31 part 32 part 33 part 41 input button 42 power button 43 external connection terminal 44 card slot 45 optical sensor 46 camera 47 light source 48 speaker 49 microphone 51 Antenna 121 Electrode 122 Electrode 201 Fabrication substrate 203 Peeling layer 205 Fabrication substrate 207 Peeling layer 230 Light emitting element 301 Display portion 302 Pixel 302B Subpixel 302G Subpixel 302R Subpixel 302t Transistor 303c Capacitor 303g (1) Scan line driver circuit 303g (2) Image pickup pixel drive circuit 303s (1) Image signal line drive circuit 303s (2) Image pickup signal line drive circuit 303t Transistor 304 Gate 308 Image pickup pixel 308p Photoelectric conversion element 308t Transistor 309 FPC
311 Wiring 319 Terminal 321 Insulating layer 328 Partition 329 Spacer 350R Light emitting element 351R Lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Intermediate layer 360 Sealing layer 367BM Light shielding layer 367p Antireflection layer 367R Coloring layer 380B Light emitting module 380G Light emitting module 380R Light emitting module 390 Touch panel 501 Display unit 502R Subpixel 502t Transistor 503c Capacity 503g Scan line driver circuit 503t Transistor 505 Touch panel 505B Touch panel 509 FPC
510 substrate 510a insulating layer 510b flexible substrate 510c adhesive layer 511 wiring 519 terminal 521 insulating film 528 partition 550R light emitting element 560 sealing layer 567BM light shielding layer 567p antireflection layer 567R colored layer 570 substrate 570a insulating layer 570b flexible substrate 570c Adhesion layer 580R Light emitting module 590 Substrate 591 Electrode 592 Electrode 593 Insulation layer 594 Wiring 595 Touch sensor 597 Adhesion layer 598 Wiring 599 Connection layer 601 Pulse voltage output circuit 602 Current detection circuit 603 Capacitance 611 Transistor 612 Transistor 613 Transistor 621 Electrode 622 Electrode 801 Substrate 803 Substrate 804 Light emitting unit 806 Drive circuit unit 808 FPC
811 Adhesive layer 813 Insulating layer 814 Conductive layer 815 Insulating layer 816 Conductive layer 817 Insulating layer 817a Insulating layer 817b Insulating layer 820 Transistor 821 Insulating layer 822 Transistor 823 Sealing layer 824 Sealing layer 825 Connector 827 Spacer 830 Light emitting element 831 Lower electrode 833 EL layer 835 Upper electrode 841 Adhesive layer 843 Insulating layer 845 Colored layer 847 Light shielding layer 849 Overcoat 857 Conductive layer 857a Conductive layer 857b Conductive layer

Claims (9)

A first support, a second support, a connection portion, and a display panel;
The display panel has a function that can be folded and displayed,
The first support and the second support are connected by the connecting portion,
The first support body and the second support body have a function of relatively rotating through the connection portion,
The display panel has a portion fixed to the first support;
The display panel is supported by the second support so that the display panel can move in one direction with respect to the second support.
Electronics. A first support, a second support, a connection portion, a display panel, and a detection means;
The display panel has a function that can be folded and displayed,
The first support and the second support are connected by the connecting portion,
The first support body and the second support body have a function of relatively rotating through the connection portion,
The display panel has a portion fixed to the first support;
The display panel is supported by the second support so that the display panel can move in one direction with respect to the second support.
The display panel has a function of changing a relative position with respect to the second support when the first support and the second support are relatively rotated.
The detection means has a function of detecting the relative position between the display panel and the second support.
Electronics. In claim 2,
The detection means includes a light emitting element and a light receiving element,
One of the light emitting element and the light receiving element is provided fixed to the display panel,
The other of the light emitting element and the light receiving element is provided fixed to the second support,
The light receiving element has a function of detecting light emission from the light emitting element.
Electronics. In claim 2,
The detection means includes a light emitting element and a light receiving element,
The light emitting element and the light receiving element are each fixed to a second support,
The light emitting element has a function of irradiating a part of the display panel with light,
The light receiving element has a function of detecting reflected light from the display panel;
Electronics. In claim 2,
The display panel has a display unit and a non-display unit,
The display unit includes a first light emitting element,
The detection means includes a second light emitting element and a light receiving element,
The second light emitting element is provided in the non-display portion,
The light receiving element is provided fixed to the second support,
The light receiving element has a function of detecting light emission from the second light emitting element.
Electronics. In any one of Claims 1 thru | or 5,
The display panel is positioned so as not to overlap the center position in the thickness direction of each of the first support, the connection portion, and the second support.
Electronics. In any one of Claims 1 thru | or 6,
The connection part has an elastic body,
Electronics. In any one of Claims 1 thru | or 7,
The display panel has a function as a touch sensor,
Electronics. In any one of Claims 1 thru | or 7,
A touch sensor is provided on the display panel,
Electronics.

Images