JP2020181221A - Electronic apparatus - Google Patents

Abstract

To provide an electronic apparatus excellent in portability; or to provide an electronic apparatus excellent in at-a-glance visibility; or to provide an electronic apparatus including new input means.SOLUTION: An electronic apparatus comprises: a display panel having flexibility; and two supports supporting the display panel. The two supports are connected by a connection. The display panel is fixed to one support and is provided to the other support slidably in one direction without being fixed thereto. The electronic apparatus is further provided with detection means that, when the display panel slides, can detect the amount of its displacement.SELECTED DRAWING: Figure 2

Description

One aspect of the present invention relates to a display device. Alternatively, the present invention relates to an electronic device including a display device.
In particular, it relates to a display device having flexibility. Alternatively, the present invention relates to an electronic device including a flexible display device.

One aspect of the present invention is not limited to the above technical fields. One aspect of the invention disclosed in the present specification and the like relates to a product, a method, or a manufacturing method. One aspect of the invention relates to a process, machine, manufacture, or composition (composition of matter). Therefore, more specifically, the technical field of one aspect of the present invention disclosed in the present specification is a semiconductor device.
A display device, a light emitting device, a power storage device, a storage device, an electronic device, a lighting device, an input device, an input / output device, a driving method thereof, or a manufacturing method thereof can be mentioned as an example.

In the present specification and the like, the semiconductor device refers to all devices that can function by utilizing the semiconductor characteristics. A semiconductor element such as a transistor, a semiconductor circuit, an arithmetic unit, and a storage device are one aspect of a semiconductor device. Imaging devices, display devices, liquid crystal display devices, light emitting devices, electro-optical devices, power generation devices (including thin-film solar cells, organic thin-film solar cells, etc.), and electronic devices
May have a semiconductor device.

In recent years, display devices are expected to be applied to various applications, and diversification is being promoted. For example, display devices used in portable electronic devices and the like are required to be thin, lightweight, and not easily damaged. In addition, new applications that have never existed before are required.

Further, Patent Document 1 discloses a flexible active matrix type light emitting device provided with a transistor as a switching element and an organic EL (Electro Luminescence) element on a film substrate.

Japanese Unexamined Patent Publication No. 2003-174153

In recent years, it has been studied to increase the display amount to be displayed by enlarging the display area of the display device to improve the listability of the display. On the other hand, in mobile device applications and the like, increasing the size of the display area reduces portability (also referred to as portability). Therefore, it has been difficult to achieve both improved display listability and high portability.

Further, it is desired that the display panel be provided with an input means as a user interface. For example, there is a display device (touch panel) having a function of inputting by touching the screen with a finger or a stylus.

One aspect of the present invention is to provide an electronic device having excellent portability. Alternatively, one of the issues is to provide an electronic device having excellent listability. Alternatively, one of the issues is to provide an electronic device that is not easily damaged. Alternatively, one of the issues is to provide an electronic device provided with a new input means.

Alternatively, one aspect of the present invention is to make the electronic device thinner. Alternatively, one of the issues is to reduce the weight of electronic devices. Alternatively, one of the issues is to provide new electronic devices.

The description of these issues does not prevent the existence of other issues. It is not necessary for one aspect of the present invention to solve all of these problems. In addition, problems other than the above are naturally clarified from the description of the specification and the like, and it is possible to extract problems other than the above from the description of the specification and the like.

One aspect of the present invention is an electronic device having a first support, a second support, a connection portion, and a display panel. The display panel also has a function of being able to be folded and displayed.
The first support and the second support are connected by a connecting portion, and the first support and the second support have a function of relatively rotating via the connecting portion. The display panel also has a portion fixed to the first support and is supported by the second support so that it can move in one direction with respect to the second support. And.

Further, another aspect of the present invention is an electronic device having a first support, a second support, a connection portion, a display panel, and a detection means. Further, the display panel has a function of being able to be bent and displayed, and the first support and the second support have a function of being connected by a connecting portion and relatively rotating via the connecting portion. The display panel also has a portion fixed to the first support and is supported by the second support so that it can move in one direction with respect to the second support. It has a function of changing the relative position with respect to the second support when the body and the second support are relatively rotated. Further, the detecting means has a function of detecting a relative position between the display panel and the second support.

Further, in the above, the detection means includes a light emitting element and a light receiving element, one of the light emitting element and the light receiving element is fixedly provided on the display panel, and the other of the light emitting element and the light receiving element is the first. It is preferable that the light receiving element is fixed to the support 2 and has a function of detecting light emission from the light emitting element.

Alternatively, in the above, the detection means includes a light emitting element and a light receiving element, and the light emitting element and the light receiving element are each fixed to a second support and provided, and the light emitting element is one of the display panels. It is preferable that the light receiving element has a function of irradiating the portion with light and has a function of detecting the reflected light from the display panel.

Alternatively, in the above, the display panel has a display unit and a non-display unit, the display unit has a first light emitting element, and the detection means has a second light emitting element and a light receiving element. The second light emitting element is provided in the non-display portion, the light receiving element is fixedly provided on the second support, and the light receiving element has a function of detecting light emission from the second light emitting element. Is preferable.

Further, in the above, the display panel is preferably positioned so as not to overlap with the center position of the first support, the connecting portion, and the second support in the thickness direction.

Further, the connecting portion preferably has an elastic body.

Further, the display panel preferably has a function as a touch sensor. Alternatively, it is preferable that a touch sensor is provided on the display panel.

According to the present invention, it is possible to provide an electronic device having excellent portability. Alternatively, it is possible to provide an electronic device having excellent listability. Alternatively, it is possible to provide an electronic device that is not easily damaged. Alternatively, an electronic device provided with a new input means can be provided. Alternatively, new electronic devices can be provided.

The description of these effects does not preclude the existence of other effects. It should be noted that one aspect of the present invention does not necessarily have to have all of these effects. It should be noted that the effects other than these are naturally clarified from the description of the description, drawings, claims, etc., and it is possible to extract the effects other than these from the description of the description, drawings, claims, etc. Is.

A configuration example of an electronic device according to an embodiment. A configuration example of an electronic device according to an embodiment. A configuration example of an electronic device according to an embodiment. A configuration example of an electronic device according to an embodiment. A configuration example of an electronic device according to an embodiment. A configuration example of an electronic device according to an embodiment. A configuration example of an electronic device according to an embodiment. A configuration example of an electronic device according to an embodiment. A configuration example of an electronic device according to an embodiment. The figure which shows an example of the light emitting panel which concerns on embodiment. The figure which shows an example of the light emitting panel which concerns on embodiment. The figure explaining the example of the manufacturing method of the light emitting panel which concerns on embodiment. The figure explaining the example of the manufacturing method of the light emitting panel which concerns on embodiment. The figure which shows an example of the touch panel which concerns on embodiment. The figure which shows an example of the touch panel which concerns on embodiment. The figure which shows an example of the touch panel which concerns on embodiment. The figure which shows an example of the touch panel which concerns on embodiment. A block diagram and a timing chart of the touch sensor. Circuit diagram of the touch sensor. A configuration example of an electronic device according to an embodiment.

The embodiment will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that the form and details of the present invention can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention is not construed as being limited to the description of the embodiments shown below.

In the configuration of the invention described below, the same reference numerals are commonly used in different drawings for the same parts or parts having similar functions, and the repeated description thereof will be omitted. Further, when referring to the same function, the hatch pattern may be the same and no particular sign may be added.

In addition, in each figure described in this specification, the size of each structure, the thickness of a layer, or a region is defined as.
May be exaggerated for clarity. Therefore, it is not necessarily limited to that scale.

It should be noted that the ordinal numbers such as "first" and "second" in the present specification and the like are added to avoid confusion of the components, and are not limited numerically.

(Embodiment 1)
In the present embodiment, a configuration example of the electronic device according to one aspect of the present invention will be described with reference to the drawings.

The electronic device of one aspect of the present invention is configured to include a flexible display panel and two supports that support the display panel. Also, the two supports are connected by a connecting portion. It is possible to fold the electronic device by relatively rotating the two housings via the connection. Therefore,
In the electronic device of one aspect of the present invention, the display surface of the display panel is held in a flat state, the display surface of the display panel is bent so as to be inside (inward bending), and the display surface of the display panel is outward. It is possible to bend it so that it becomes.

The electronic device according to one aspect of the present invention is excellent in listability due to a wide seamless display area when the display panel is unfolded. In addition, when the display panel is folded, it has excellent portability.

Here, in the electronic device of one aspect of the present invention, the display panel is fixed to one support and is supported by the other support so as to slide in one direction without being fixed. It is preferable to provide it. Then, when the angles of the two supports are changed, it is preferable that the display panel slides with respect to the support to which the display panel is not fixed, and the relative positions of the two are changed. With such a configuration, when the angles of the two supports are changed and a part of the display panel is bent, a force is applied only in the bending direction of the display panel, and the force is applied in the direction perpendicular to this (that is, that is, It is possible to substantially eliminate the force applied (in the direction perpendicular to the thickness direction of the display panel). That is, since no force is applied to pull or compress the display panel when the display panel is bent by sliding, damage to the display panel is suppressed, and a highly reliable electronic device can be realized.

Further, as described above, it is preferable to have a detecting means capable of detecting the displacement amount when the display panel slides. Since the displacement amount of the display panel changes depending on the angles of the two supports, it is possible to detect the angles of the two supports by detecting the displacement amount. For example, the displacement amount of the display panel can be detected by detecting a change in the relative position between the display panel and the support on the side where the display panel is not fixed. This relative position change is preferably detected optically. Further, it may be configured to detect mechanically or electrically.

In this way, by configuring the angle of the two supports to be detectable, the angle can be used as one input means in the electronic device. For example, it is possible to switch the display on the display panel according to the angles of the two supports. Further, in the state where the display surface of the display panel is folded so as to be inside, it is possible to perform an operation such as stopping the display of the display panel.

More specifically, the configuration can be as follows.

[Configuration example]
FIG. 1A shows a schematic perspective view of an electronic device 10 according to an aspect of the present invention.

The electronic device 10 includes a support 11a, a support 11b, a connection portion 12, a display panel 13, and a detection means 14.

The support 11a and the support 11b are connected via a connecting portion 12. Display panel 1
3 is arranged so as to overlap the support 11a, the support 11b, and the connecting portion 12. The display panel 13 is supported by at least the support 11a and the support 11b.

Specifically, the display panel 13 has a region fixed to the support 11a. Further, the display panel 13 is supported by the support 11b so that it can slide in one direction without being fixed to the support 11b.

Further, the display panel 13 has flexibility. Further, the display panel 13 has an area having a plurality of pixels (also referred to as a display area), and an image can be displayed in the display area. The pixel comprises a display element. In the following, the surface of the display panel 13 on the side where the image is displayed may be referred to as a display surface.

The support 11a and the support 11b can be relatively rotated via the connecting portion 12. For example, the support 11a and the support 11b can be deformed by folding or twisting via the connecting portion 12. Therefore, the electronic device 10 can be reversibly deformed from a state in which the display surface of the display panel 13 is flat to a state in which the display surface is bent.

The support 11a and the support 11b may have rigidity, or members that can be deformed by a force that causes the support itself to twist or bend may be used. Support 11a and support 11
For b, at least a material having a lower flexibility than the display panel 13 or the connecting portion 12 may be used, and an elastic body such as hard rubber may be used for the skeleton. In addition, as a material that can form each housing, a metal such as plastic or aluminum, an alloy such as stainless steel or titanium alloy, or rubber such as silicone rubber can be used.

For the connecting portion 12, a material that is partially or wholly deformed elastically can be preferably used. For example, the entire connecting portion 12 may be an elastic body, or at least the bending portion may have an elastic body. Alternatively, a configuration having a hinge having one or more rotation axes can be applied as the connecting portion 12.

When a material that elastically deforms is used as the connecting portion 12, the display surface shown in FIG. 1A is maintained in a flat state when a force for relatively rotating the support 11a and the support 11b is not applied. can do. Further, in order to maintain the state shown in FIGS. 1 (C) and 1 (E), the support 11a
It is preferable to have a mechanism for fixing the support 11b and the support 11b. For example, the support 11a and the support 11b may be separately provided with a detachable tool that can be mechanically detached, or the support 11a and the support 11b may be provided with a detachable mechanism. Alternatively, the support 11a and the support 11b may be fixed by magnetic force.

Further, when the connecting portion 12 is configured to have a hinge, FIGS. 1 (C) and 1 (E) are shown.
It is preferable to use a hinge provided with a mechanism for fixing the relative positions of the support 11a and the support 11b in the above-mentioned state because the above-mentioned attachment / detachment tool and attachment / detachment mechanism become unnecessary. Further, by using a hinge having a stepwise fixed position, as shown in FIGS. 1 (B) and 1 (D), the display panel 1
It can also be used in a state where the display surface of 3 is curved.

As the connecting portion 12, for example, a material having a Young's modulus lower than that of the support 11a and the support 11b can be used. Further, even when a material having a higher Young's modulus than the support 11a and the support 11b or a material having the same Young's modulus is used, the thickness of the connecting portion 12 is set to the thickness of the support 1.
Materials thinner than 1a and support 11b can also be applied. As a material that can form the connecting portion 12, plastic, rubber, metal, alloy, or the like can be used. For example, a material such as a silicone resin or a gel may be used.

FIG. 1A shows a state in which the display surface of the display panel 13 is held in a flat state. By deforming the electronic device 10 so as to bend the display surface of the display panel 13 inward from this state, the electronic device 10 can be reversibly deformed from the state of FIG. 1 (B) to the state of FIG. 1 (C). FIG. 1 (C)
Then, the display panel 13 is sandwiched between the support 11a and the support 11b and stored. Such a form can be used when the electronic device 10 is not used or when it is stored in a bag or the like.

Further, by deforming the electronic device 10 so as to bend the display surface of the display panel 13 outward from the state shown in FIG. 1 (A), the state of FIG. 1 (D) is reversible to the state of FIG. 1 (E). Can be transformed. FIG. 1 (E) shows a state in which the display surface of the display panel 13 is located along the upper surface, side surface, and lower surface of the electronic device 10. Since the state shown in FIG. 1 (E) is smaller than the state shown in FIG. 1 (A), it is suitable for use in a public place or while moving.

[Cross-section configuration example]
FIG. 2A shows a schematic cross-sectional view of the electronic device 10 on the cut surface X1 shown in FIG. 1A. 2 (B) is a schematic cross-sectional view of the cut surface X2 shown in FIG. 1 (B), and FIG. 2 (C) is a schematic cross-sectional view of the cut surface X3 shown in FIG. 1 (D).

In FIG. 2A, the display panel 13 is arranged along the upper surface of each of the support 11a, the support 11b, and the connecting portion 12. The display panel 13 has an FPC (Flexi).
The ble Print Circuit) 15 is connected, and is electrically connected to the circuit board 16 provided inside the support 11a via the FPC 15. In addition, the circuit board 16
Is electrically connected to the battery 17 provided inside the first support 11a. Also,
As shown in FIG. 2A, the battery 17 may also be provided inside the second support 11b. Although not shown here, a circuit board on which an IC or the like for controlling the drive of the detection means 14 is mounted may be provided inside the support 11b. For example, the IC may have a function of driving the detection means 14 and a function of extracting a signal output from the detection means 14.

The display panel 13 is supported so as to be fixed to the support 11a. For example, a part of the display panel 13 may be adhered to the support 11a, or may be mechanically fixed by a fixing tool such as a screw.

On the other hand, the display panel 13 is supported without being fixed to the support 11b. In particular,
In FIG. 2A, the display panel 13 is supported so as to be slidable in the left-right direction with respect to the support 11b.

Here, the thickness direction of the display panel 13 (vertical direction in FIG. 2A) and the display panel 13
The display panel so that the display panel 13 does not move (shift) in one or both of the directions perpendicular to the bending direction when the is bent (the direction perpendicular to the paper surface in FIG. 2A). It is preferable that 13 is supported by the support 11b.

As described above, the display panel 13 is fixed to the support 11a and is supported so as not to be fixed to the support 11b. Therefore, the support 11a and the support 1 via the connecting portion 12
When 1b is rotated relatively, the display panel 13 is displaced with respect to the support 11b, so that the stress applied in the direction perpendicular to the thickness direction of the display panel 13 is relaxed, and the display panel 13 is damaged. It is possible to suppress the trouble of. Therefore, a highly reliable electronic device 10 can be realized.

FIG. 2A shows an example in which the detecting means 14 is arranged on the second support 11b. The detecting means 14 has a function of detecting the relative positions of the support 11b and the display panel 13. A specific configuration example of the detection means 14 will be described later. Here, FIG. 2A shows a configuration in which the detection means 14 is arranged on the support 11b, but the position of the detection means 14 can be appropriately set according to the configuration.

2 (B) and 2 (C) also show an enlarged view of a part of the support 11b.

As shown in FIG. 2B, when the display surface of the display panel 13 is bent so as to be inward, the display panel 13 and the support are supported so that the end portion of the display panel 13 on the support 11b side moves outward. The position relative to the body 11b shifts. On the other hand, as shown in FIG. 2C, when the display surface of the display panel 13 is bent so as to be outward, the end portion of the display panel 13 on the support 11b side moves inward with the display panel 13. The position relative to the support 11b shifts.

In this way, by detecting the relative positional deviation between the display panel 13 and the support 11b that occurs when the display panel 13 is bent, the relative position between the support 11a and the support 11b is detected from the value of this deviation. Positional relationship can be calculated. As a result, it becomes possible to detect the shape of the electronic device 10.

The above is the description of the cross-sectional configuration example.

[Displacement of display panel]
Hereinafter, the amount (displacement amount) of the relative positional deviation between the display panel 13 and the support 11b, which occurs when the electronic device 10 is deformed so as to bend the display panel 13, will be described.

FIG. 3A is a diagram schematically showing an electronic device according to an aspect of the present invention. The electronic device shown in FIG. 3A has a configuration in which the support 11a and the support 11b are connected by an elastic connecting portion 12. Further, a display panel 13_1 is provided on one surface of the support 11a, the connection portion 12, and the support 11b, and a display panel 13_1 is provided on the other surface. In FIG. 3A, a hatching pattern is added to show that the display panel 13_1 and the display panel 13_2 are fixed to a part of the surface of the support 11a.

Here, in order to explain both the case where the display surface of the display panel is inside and the case where the display surface is outside when the connection portion 12 is bent, an example having two display panels will be described.

Further, as shown in FIG. 3A, the thickness of each of the support 11a, the support 11b, and the connecting portion 12 is defined as the thickness t. Further, the length of the connecting portion 12 is set to the length L0. Display panel 13
It is assumed that the respective ends of _1 and the display panel 13_2 and the end of the support 11b coincide with each other. Further, in FIG. 3A, a neutral line (also referred to as a near line) 12a of the connecting portion 12 is shown by a broken line. Here, in the present specification and the like, the neutral line means a line connecting the center of the cross section of the object in the thickness direction when no stress is applied to the object.

Here, as shown in FIG. 3B, the neutral line 12a of the connecting portion 12 has an angle θ with a radius of curvature r0.
Consider when only curved. At this time, since the connecting portion 12 is an elastic body, the portion inside the connecting portion 12 inside the neutral line 12a shrinks due to the stress generated when the connecting portion 12 is curved, and the portion inside the connecting portion 12 is smaller than the neutral line 12a. The outer part will be stretched.

Here, for the sake of simplicity, when the connecting portion 12 is curved, the thickness of the connecting portion 12 does not change, and the neutral line 12a of the connecting portion 12 always passes through the center of the thickness of the connecting portion 12. Further, consider a case where the neutral wire 12a of the connecting portion 12 is curved with a constant radius of curvature from one end to the other end of the connecting portion 12.

In FIG. 3B, the length of the neutral line 12a of the connecting portion 12 is L0. Connection part 12
The radius of curvature r1 on the inner surface and the radius of curvature r2 on the outer surface are as follows.

Therefore, in the cross section shown in FIG. 3B, the length L1 of the inner surface of the connecting portion 12 and
The length L2 of the outer surface is as follows.

Here, since the display panel 13_1 is provided in contact with the inner surface of the connecting portion 12, if the display panel 13_1 does not expand and contract, the end portion of the display panel 13_1 shifts outward from the end portion of the support 11b. As described above, a part of the display panel 13_1 moves with respect to the support 11b. Similarly, since the display panel 13_2 is provided in contact with the outer surface of the connecting portion 12, since it is provided.
A part of the display panel 13_2 moves with respect to the support 11b so that the end of the display panel 13_2 shifts inward from the end of the support 11b. The displacement amount d1 of the display panel 13_1 with respect to the support 11b and the displacement amount d2 of the display panel 13_1 with respect to the support 11b are as follows when the displacement amount to the outside is positive.

From the equation (3), the displacement amount d1 of the display panel 13_1 and the displacement amount d of the display panel 13_2
It can be seen that each of 2 depends on the thickness t of the connecting portion 12 and the angle θ. Assuming that the thickness t of the connecting portion 12 is constant, the angle θ is detected by detecting the displacement amount d1 or the displacement amount d2.
Can be estimated.

Further, the size of the displacement amount d1 of the display panel 13_1 and the displacement amount d2 of the display panel 13_2 increases as the distance between the display panel 13_1 or the display panel 13_2 and the neutral line 12a increases. Therefore, the display panel is preferably located at least away from the neutral line 12a. That is, it is preferable that the display panel is positioned so as not to overlap the center positions of the support 11a, the connecting portion 12, and the second support 11b in the thickness direction.

In reality, there may be a portion where the thickness of the curved portion of the connecting portion 12 becomes thin. Therefore, there is a difference in the absolute value of the displacement amount between the case where the display surface is bent inward as shown in the display panel 13_1 of FIG. 3 (B) and the case where the display surface is bent outward as shown in the display panel 13_2. The amount of displacement may differ from the value of. Therefore, when calculating the angle θ from the relative displacement amount between the display panel 13 and the support 11b, it is preferable to correct it in consideration of the shape change when the connecting portion 12 is curved.

Further, here, the case where the connecting portion 12 has a plate-like shape is shown, but the present invention is not limited to this.
For example, as shown in FIGS. 4A and 4B, the wiring 18 can be provided in the cavity by forming the connection portion 12 having a cavity inside. The wiring 18 can electrically connect the support 11a and the circuit board, the battery, and the like provided inside the support 11b to each other. Further, as shown in FIGS. 4C and 4D, by forming the connecting portion 12 into a form having a bellows structure, the stress applied to the connecting portion 12 when the connecting portion 12 is bent can be reduced. .. Further, as shown in FIGS. 4 (E) and 4 (F), the connecting portion 12 may have a bellows structure having a cavity inside, and the wiring 18 may be provided in the cavity.

Further, although the case where an elastic body is used as the connecting portion 12 has been described here, the connecting portion 12
When a hinge is used as a hinge, the relative movable range of the support 11a and the support 11b can be limited. Therefore, the angle θ should be calculated more precisely from the relative displacement between the support 11b and the display panel 13. It is preferable because it can be used. At this time, it is preferable that the hinge has two or more rotation axes because a design with a higher degree of freedom is possible.

The above is the description of the displacement amount of the display panel.

[Configuration example of detection means]
As described above, the detecting means 14 refers to a mechanism having a function of detecting a change in the relative positions of the support 11b and the display panel 13.

It is preferable that the detecting means 14 has a configuration in which a change in position is optically detected. For example, one of the light emitting element and the light receiving element may be provided on the support 11b, and the other may be provided on the display panel 13. Alternatively, the support 11b may be provided with both a light emitting element and a light receiving element, and the light from the light emitting element reflected on the display panel 13 may be detected by the light receiving element. Further, both the light emitting element and the light receiving element may be provided on the display panel 13 to receive the reflected light from the support 11b.

More specifically, the following configuration can be used.

[Configuration Example 1]
FIG. 5A shows a schematic cross-sectional view of a region including the detection means 14 of the support 11b.

The support 11b has a first portion 31 that supports the display panel 13, a second portion 32 located on the display surface side of the display panel 13, and a second portion 32 located on the side opposite to the display surface side of the display panel 13. 3
And has a part of. The second portion 32 and the third portion 33 may function as exterior members of the support 11b.

The detection means 14 includes a plurality of light receiving elements 21 and a light emitting element 22.

In the configuration shown in FIG. 5A, the plurality of light receiving elements 21 are fixedly arranged on the surface of the second portion 32 of the support 11b facing the display panel 13. The light emitting element 22 is
It is fixedly arranged on the display panel 13. The light emitting element 22 can emit light toward the second portion 32 side of the support 11b, more specifically, the light receiving element 21 side.

The light emitted by the light emitting element 22 may be visible light, infrared rays, or ultraviolet rays. For example, a light emitting device that emits light having a peak of 1 or more in the wavelength range of 300 nm to 3000 nm can be applied. In particular, when infrared rays having a wavelength of 750 nm or more are used, it is less necessary to consider light leakage from the support 11b as compared with the case where visible light or ultraviolet rays are used, so that the design is easy and the safety can be improved. It is preferable because it is possible.

The light emitting element 22 includes, for example, an LED (Light Emitting Diode).
, An organic EL element, or a light emitting element such as an inorganic EL element can be applied. In particular, when the display panel 13 has a light emitting element such as an organic EL element in the pixel, the number of parts can be reduced by using the light emitting element manufactured in the same process as the pixel as the light emitting element 22. In that case, the light emitted from the light emitting element 22 becomes light including visible light.

The light receiving element 21 is an element capable of receiving light emitted from the light emitting element 22. As the light receiving element 21, for example, a light receiving element including a photoelectric conversion element such as a photodiode or a phototransistor can be applied. In addition, solid-state image sensors such as a CCD image sensor and a CMOS image sensor can also be applied.

Further, as will be described later, the light receiving element 21 may be provided on the display panel 13. At this time, particularly when the display panel 13 is an optical touch panel having a photoelectric conversion element such as a photodiode in the display region, it is preferable to manufacture the light receiving element 21 and the photoelectric conversion element in the same process.

5 (B) and 5 (C) are schematic perspective views showing the detecting means 14 and its main peripheral portions.

The display panel 13 has a display unit 13a and a non-display unit 13b. The display unit 13a is a portion having a plurality of pixels and capable of displaying an image or the like. Further, a light emitting element 22 is arranged in a part of the non-display unit 13b. The second portion 32 of the support 11b is arranged so as to overlap the non-display portion 13b of the display panel 13.

As shown in FIG. 5B, the light 23 emitted by the light emitting element 22 is emitted toward the display surface side of the display panel 13. At this time, the light receiving element 21 located in the traveling direction of the light 23 detects the light 23.

Subsequently, it is assumed that the display panel 13 is displaced relative to the support 11b in the direction of the arrow shown in FIG. 5C from the state of FIG. 5B. At this time, the light emitting element 22 and the plurality of light receiving elements 21
Since the relative position with respect to is changed, the light receiving element 21 different from the state shown in FIG. 5B is located in the traveling direction of the light 23 emitted by the light emitting element 22.

Note that FIG. 5B and the like show a case where the traveling direction of the light 23 is substantially perpendicular to the surface of the display panel 13, but the traveling direction is not limited to this and may travel in an oblique direction. Light emitting element 22
As a result, a light emitting element having high directivity may be used, or a light emitting element having an intensity distribution with respect to the traveling direction may be used.

In this way, by comparing the detection intensities of the light 23 received by the plurality of light receiving elements 21, it is possible to detect the relative positional relationship between the display panel 13 and the support 11b.

The accuracy of the position detected by the detecting means 14 can be improved by arranging the plurality of light receiving elements 21 as closely as possible with respect to the relative displacement direction between the display panel 13 and the support 11b. For example, as shown in FIG. 6A, the accuracy of the detected position can be determined by arranging the projections of the two adjacent light receiving elements 21 so as to overlap each other with respect to the vector (arrow) parallel to the displacement direction. Can be enhanced.

Further, as shown in FIG. 6B, even when two adjacent light receiving elements 21 are arranged with a gap, the angle dependence of the light 23 from the light emitting element 22 is known in advance. By calculating the peak position of the detection intensity from the values of the detection intensity by the plurality of light receiving elements 21, the position of the light emitting element 22 can be detected with high accuracy.

Here, as the detection means 14, a plurality of light receiving elements 21 are provided in the second portion 32 of the support 11b, and the light emitting element 22 is provided in the display panel 13, but the present invention is not limited to this.
For example, as shown in FIG. 7A, the display panel 13 is provided with a plurality of light receiving elements, and the support 11b is provided.
The light emitting element 22 may be provided in the second portion 32 of the above.

Further, as shown in FIG. 7B, the first portion 31 of the support 11b has an opening, and the light emitting element 22 that emits light on the side opposite to the display surface of the display panel 13 and the support. A plurality of light receiving elements 21 provided in the third portion 33 of 11b may be provided.

Further, as shown in FIG. 7C, a plurality of light receiving elements 21 may be provided on the side opposite to the display surface of the display panel 13, and a light emitting element 22 may be provided on the third portion of the support 11b.

Further, in FIGS. 7B and 7C, the opening of the first portion 31 is at least the light emitting element 22.
It suffices to transmit the light emitted by, and may have a member having translucency.

The above is the description of the configuration example 1.

[Configuration Example 2]
Hereinafter, a configuration example in which a part of the configuration is different from the configuration example 1 will be described. The description of the part that overlaps with the above may be omitted.

FIG. 8A is a schematic perspective view showing the detecting means 14 and its main peripheral portion.

The light receiving element 21 and the light emitting element 22 are arranged side by side on the surface of the support 11b facing the display panel 13 of the second portion 32.

As shown in FIG. 8A, the light 23 emitted by the light emitting element 22 is reflected by a part of the non-display portion 13b of the display panel 13, and a part of the reflected light is received by the light receiving element 21. As the display panel 13 is displaced with respect to the support 11b, the intensity of the light received by the light receiving element 21 changes. Therefore, by detecting this change, the display panel 13 and the support 11b are relative to each other. The amount of displacement can be detected.

In the non-display portion 13b of the display panel 13, it is preferable that the portion that reflects the light 23 emitted by the light emitting element 22 has a portion having a different reflectance. More specifically, it suffices to have portions having different reflectances along the direction perpendicular to the displacement direction of the display panel 13.
For example, a wiring pattern provided on the non-display unit 13b, a drive circuit pattern, or the like can be used.

Further, a pattern for position detection may be separately formed on the surface or inside of the non-display portion 13b of the display panel 13. For example, when the display panel 13 is displaced, a pattern may be formed in which portions having high reflectance and portions having low reflectance appear alternately. Such a pattern may be formed by a printing method or the like, or a pattern having an uneven shape formed on the surface of the display panel 13 may be used.

8 (B) to 8 (E) show an example of a pattern for position detection included in the non-display portion 13b of the display panel 13. The arrows in each figure indicate the displacement direction of the display panel 13.

In FIG. 8A, it has a first region 24 having a first reflectance and a second region 25 having a second reflectance. A striped second in a direction substantially parallel to the displacement direction of the display panel 13.
Region 25 has a pattern in which a plurality of regions are arranged.

Here, the difference in reflectance between the first reflectance and the second reflectance may be, for example, 5% or more, preferably 10% or more, and more preferably 15% or more. Further, the first reflectance and the second reflectance need only have a difference in the reflectance, and the first reflectance may be higher than the second reflectance.
It may be low.

Further, as shown in FIG. 8C, the striped second region 25 may be arranged obliquely with respect to the displacement direction. Further, as shown in FIG. 8D, the second region 25 may have a grid-like shape. Further, as shown in FIG. 8 (E), the second region 25 may be a pattern arranged in a dot shape.

Here, an example is shown in which two parts having different reflectances are regularly arranged, but 2
The portions having different reflectances may be regularly arranged. Further, two or more portions having different reflectances may be arranged irregularly.

Further, although the case where the light receiving element 21 and the light emitting element 22 are arranged in the second portion 32 of the support 11b has been described here, the configuration may be such that the light receiving element 21 and the light emitting element 22 are arranged in the third portion 33. In that case,
As illustrated in the first configuration example, the first portion 31 having an opening for transmitting the light emitted by the light emitting element 22 may be provided.

In this way, both the light receiving element 21 and the light emitting element 22 are provided on the support 11b, and the relative position between the display panel 13 and the support 11b is detected by using the reflected light. Can be reduced. Further, as a pattern for one detection provided in the non-display unit 13b of the display panel 13, a pattern such as wiring included in the display panel 13 can be used.
It is possible to increase the degree of freedom in design.

The above is the description of the configuration example 2.

In the present embodiment, the configuration includes two supports, but the configuration may include three or more supports. As the number of supports increases, the electronic device can be transformed into various shapes, and the range of applications expands. 9 (A) to 9 (C) show three supports (support 1).
A configuration example of an electronic device including 1c, 11d, 11e) is shown. The electronic device shown in FIG. 9 (A) is subjected to the form shown in FIG. 9 (B) by bending the display panel 13 at two points, and is shown in FIG. 9 (B).
The electronic device can be folded as in C).

Further, in the case of a configuration having three or more supports, the display panel 13 is fixed to one of the supports and is supported so as to be slidable without being fixed to the other support. Just do it. Further, among the supports that do not support the display panel 13, the above-mentioned detection means may be provided on one or more of the supports. That is, assuming that the number of supports provided in the electronic device is n, the detection means may be provided on one or more and n-1 or less of the supports. The larger the number of supports having the detecting means, the more detailed the form of the electronic device can be detected, which is preferable. Preferably, all the supports that do not support the display panel 13 are provided with the detecting means.

Further, the electronic device of one aspect of the present invention may be configured to be provided with various input means, output means, or input / output means on the support. For example, in FIG. 20, an input button 41, a power button 42, an external connection terminal 43, a card slot 44, an optical sensor 45, a camera 46, a light source 47, a speaker 48, and a microphone 49 are provided on the support 11a or the support 11b. An example is shown. Further, in FIG. 20, a battery 17 is built in each of the support 11a and the support 11b. Further, the antenna 51 is mounted on a part of the support 11b.

This embodiment can be carried out in combination with at least a part thereof as appropriate with other embodiments described in the present specification.

(Embodiment 2)
In the present embodiment, a configuration example and a manufacturing method example of a light emitting panel applicable to the display panel of the electronic device of one aspect of the present invention will be described.

[Specific example 1]
A plan view of the light emitting panel is shown in FIG. 10 (A), and the alternate long and short dash line A1-A2 in FIG. 10 (A) is shown.
An example of the cross-sectional view between the two is shown in FIG. 10 (C). The light emitting panel shown in Specific Example 1 is a top emission type light emitting panel using a color filter method. In the present embodiment, the light emitting panel has, for example, a configuration in which one color is expressed by sub-pixels of three colors of R (red), G (green), and B (blue), or R (red) and G (green). ), B (blue), W (white), or R (red), G (green), B (blue)
, Y (yellow) four-color sub-pixels can be applied to express one color. The color element is not particularly limited, and a color other than RGBW may be used, and may be composed of, for example, yellow, cyan, magenta, or the like.

The light emitting panel shown in FIG. 10 (A) includes a light emitting unit 804, a drive circuit unit 806, and an FPC (Fle).
It has a xible Printed Circuit) 808. The light emitting elements and transistors included in the light emitting unit 804 and the drive circuit unit 806 are sealed by the substrate 801 and the substrate 803, and the sealing layer 823.

The light emitting panel shown in FIG. 10C includes a substrate 801, an adhesive layer 811 and an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light emitting elements, and an insulating layer 8.
21, sealing layer 823, overcoat 849, colored layer 845, light-shielding layer 847, insulating layer 84
3. It has an adhesive layer 841 and a substrate 803. The sealing layer 823, the overcoat 849, the insulating layer 843, the adhesive layer 841, and the substrate 803 transmit visible light.

The light emitting unit 804 has a transistor 820 and a light emitting element 830 on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light emitting element 830 is a lower electrode 83 on the insulating layer 817.
1. It has an EL layer 833 on the lower electrode 831 and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 transmits visible light.

Further, the light emitting unit 804 has a colored layer 845 that overlaps with the light emitting element 830 and a light shielding layer 847 that overlaps with the insulating layer 821. The colored layer 845 and the light-shielding layer 847 are covered with an overcoat 849. The space between the light emitting element 830 and the overcoat 849 is filled with a sealing layer 823.

The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductors constituting the transistor. Further, for the insulating layer 817, it is preferable to select an insulating layer having a flattening function in order to reduce surface irregularities caused by transistors.

The drive circuit unit 806 has a plurality of transistors on the substrate 801 via the adhesive layer 811 and the insulating layer 813. In FIG. 10C, among the transistors included in the drive circuit unit 806,
It shows one transistor.

The insulating layer 813 and the substrate 801 are bonded by an adhesive layer 811. Further, the insulating layer 843 and the substrate 803 are bonded to each other by the adhesive layer 841. It is preferable to use a film having low water permeability for the insulating layer 813 and the insulating layer 843 because impurities such as water can be suppressed from entering the light emitting element 830 and the transistor 820, and the reliability of the light emitting panel is improved.

The conductive layer 857 is electrically connected to an external input terminal that transmits an external signal (video signal, clock signal, start signal, reset signal, etc.) or potential to the drive circuit unit 806.
Here, an example in which the FPC 808 is provided as the external input terminal is shown. In order to prevent an increase in the number of steps, it is preferable that the conductive layer 857 is made of the same material and the same steps as the electrodes and wiring used for the light emitting part and the drive circuit part. Here, an example in which the conductive layer 857 is manufactured by the same material and the same process as the electrodes constituting the transistor 820 is shown.

In the light emitting panel shown in FIG. 10C, the connector 825 is located on the substrate 803. The connecting body 825 is connected to the conductive layer 857 through openings provided in the substrate 803, the adhesive layer 841, the insulating layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815. In addition, the connecting body 8
25 is connected to FPC808. FPC808 and conductive layer 857 via connector 825
Connects electrically. When the conductive layer 857 and the substrate 803 overlap, the substrate 803 is opened (or a substrate having an opening is used) to open the conductive layer 857, the connector 825, and F.
The PC808 can be electrically connected.

In Specific Example 1, the insulating layer 813, the transistor 820, and the light emitting element 830 are manufactured on the manufactured substrate having high heat resistance, the manufactured substrate is peeled off, and the insulating layer 8 is formed on the substrate 801 using the adhesive layer 811.
A light emitting panel that can be manufactured by transposing 13, a transistor 820, and a light emitting element 830 is shown. Further, in Specific Example 1, the insulating layer 843 and the colored layer 845 are placed on the manufactured substrate having high heat resistance.
A light emitting panel that can be produced by producing the light-shielding layer 847, peeling off the manufacturing substrate, and transposing the insulating layer 843, the colored layer 845, and the light-shielding layer 847 on the substrate 803 using the adhesive layer 841 is shown.

When a material having low heat resistance (resin or the like) is used for the substrate, it is difficult to apply a high temperature to the substrate in the manufacturing process, so that the conditions for forming a transistor or an insulating layer on the substrate are limited. When a material having high water permeability (resin or the like) is used for the substrate, it is preferable to apply a high temperature to form a film having low water permeability. In the manufacturing method of the present embodiment, a transistor or the like can be manufactured on a manufacturing substrate having high heat resistance, so that a highly reliable transistor or a film having sufficiently low water permeability can be formed by applying a high temperature. Then, by transposing them onto the substrate 801 or the substrate 803, a highly reliable light emitting panel can be produced. Thus, in one aspect of the invention,
A light emitting panel that is lightweight or thin and has high reliability can be realized. Details of the manufacturing method will be described later.

By providing the light emitting element manufactured in the same process as the above-mentioned light emitting element 830 in the non-display portion, it can be used as the light emitting element 22 illustrated in the first embodiment.

[Specific example 2]
FIG. 10 (B) shows a plan view of the light emitting panel, and the alternate long and short dash line A3-A4 in FIG. 10 (B) is shown.
An example of the cross-sectional view between the two is shown in FIG. 10 (D). The light emitting panel shown in Specific Example 2 is a top emission type light emitting panel using a color filter method, which is different from Specific Example 1. Here, only the points different from the specific example 1 will be described in detail, and the points common to the specific example 1 will be omitted.

The light emitting panel shown in FIG. 10 (D) is different from the light emitting panel shown in FIG. 10 (C) in the following points.

The light emitting panel shown in FIG. 10D has a spacer 827 on the insulating layer 821. By providing the spacer 827, the distance between the substrate 801 and the substrate 803 can be adjusted.

Further, in the light emitting panel shown in FIG. 10D, the sizes of the substrate 801 and the substrate 803 are different.
The connector 825 is located on the insulating layer 843 and does not overlap the substrate 803. The connecting body 825 is connected to the conductive layer 857 through the openings provided in the insulating layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815. Since it is not necessary to provide an opening in the substrate 803, the material of the substrate 803 is not limited.

By providing the light emitting element manufactured in the same process as the above-mentioned light emitting element 830 in the non-display portion, it can be used as the light emitting element 22 illustrated in the first embodiment.

[Specific example 3]
FIG. 11 (A) shows a plan view of the light emitting panel, and the alternate long and short dash line A5-A6 in FIG. 11 (A) is shown.
An example of the cross-sectional view between the two is shown in FIG. 11 (C). The light emitting panel shown in Specific Example 3 is a top emission type light emitting panel using a separate painting method.

The light emitting panel shown in FIG. 11A has a light emitting unit 804, a drive circuit unit 806, and an FPC 808. The light emitting elements and transistors included in the light emitting unit 804 and the drive circuit unit 806 are the substrate 8
It is sealed by 01, a substrate 803, a frame-shaped sealing layer 824, and a sealing layer 823.

The light emitting panel shown in FIG. 11C includes a substrate 801, an adhesive layer 811 and an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light emitting elements, and an insulating layer 8.
It has 21, a sealing layer 823, a frame-shaped sealing layer 824, and a substrate 803. The sealing layer 823 and the substrate 803 transmit visible light.

The frame-shaped sealing layer 824 is preferably a layer having a higher gas barrier property than the sealing layer 823. As a result, it is possible to prevent water and oxygen from entering the light emitting panel from the outside. Therefore, a highly reliable light emitting panel can be realized.

In Specific Example 3, the light emitted from the light emitting element 830 is taken out from the light emitting panel via the sealing layer 823. Therefore, it is preferable that the sealing layer 823 has a higher translucency than the frame-shaped sealing layer 824. Further, the sealing layer 823 preferably has a higher refractive index than the frame-shaped sealing layer 824. Further, it is preferable that the sealing layer 823 has a smaller volume shrinkage during curing than the frame-shaped sealing layer 824.

The light emitting unit 804 has a transistor 820 and a light emitting element 830 on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light emitting element 830 is a lower electrode 83 on the insulating layer 817.
1. It has an EL layer 833 on the lower electrode 831 and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 transmits visible light.

The drive circuit unit 806 has a plurality of transistors on the substrate 801 via the adhesive layer 811 and the insulating layer 813. In FIG. 11C, among the transistors included in the drive circuit unit 806,
It shows one transistor.

The insulating layer 813 and the substrate 801 are bonded by an adhesive layer 811. Insulation layer 813
It is preferable to use a film having low water permeability because impurities such as water can be suppressed from entering the light emitting element 830 and the transistor 820, and the reliability of the light emitting panel is improved.

The conductive layer 857 is electrically connected to an external input terminal that transmits a signal or potential from the outside to the drive circuit unit 806. Here, an example in which the FPC 808 is provided as the external input terminal is shown. Further, here, the conductive layer 857 is made of the same material as the electrodes constituting the transistor 820.
An example produced in the same process is shown.

In the light emitting panel shown in FIG. 11C, the connector 825 is located on the substrate 803. The connecting body 825 is connected to the conductive layer 857 through the openings provided in the substrate 803, the sealing layer 823, the insulating layer 817, and the insulating layer 815. Further, the connecting body 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected via the connecting body 825.

In Specific Example 3, the insulating layer 813, the transistor 820, and the light emitting element 830 are manufactured on the manufactured substrate having high heat resistance, the manufactured substrate is peeled off, and the insulating layer 8 is formed on the substrate 801 using the adhesive layer 811.
A light emitting panel that can be manufactured by transposing 13, a transistor 820, and a light emitting element 830 is shown. Since a transistor or the like can be manufactured on a manufacturing substrate having high heat resistance, a highly reliable transistor or a film having sufficiently low water permeability can be formed by applying a high temperature. And
By transposing them onto the substrate 801 it is possible to produce a highly reliable light emitting panel. Thereby, in one aspect of the present invention, a light emitting panel that is lightweight or thin and has high reliability can be realized.

By providing the light emitting element manufactured in the same process as the above-mentioned light emitting element 830 in the non-display portion, it can be used as the light emitting element 22 illustrated in the first embodiment.

[Specific example 4]
FIG. 11 (B) shows a plan view of the light emitting panel, and the alternate long and short dash line A7-A8 in FIG. 11 (B) is shown.
An example of the cross-sectional view between the two is shown in FIG. 11 (D). The light emitting panel shown in Specific Example 4 is a bottom emission type light emitting panel using a color filter method.

The light emitting panel shown in FIG. 11D includes a substrate 801, an adhesive layer 811 and an insulating layer 813, a plurality of transistors, a conductive layer 857, an insulating layer 815, a colored layer 845, an insulating layer 817a, and an insulating layer 8.
17b, conductive layer 816, multiple light emitting elements, insulating layer 821, sealing layer 823, and substrate 803.
Have. Substrate 801, adhesive layer 811, insulating layer 813, insulating layer 815, insulating layer 817a,
And the insulating layer 817b transmits visible light.

The light emitting unit 804 has a transistor 820, a transistor 822, and a light emitting element 830 on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light emitting element 830 has a lower electrode 831 on the insulating layer 817, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 transmits visible light. The position where the colored layer 845 overlapping the light emitting element 830 is provided is not particularly limited, and may be provided, for example, between the insulating layer 817a and the insulating layer 817b, or between the insulating layer 815 and the insulating layer 817a.

The drive circuit unit 806 has a plurality of transistors on the substrate 801 via the adhesive layer 811 and the insulating layer 813. In FIG. 11C, among the transistors included in the drive circuit unit 806,
Two transistors are shown.

The insulating layer 813 and the substrate 801 are bonded by an adhesive layer 811. Insulation layer 813
It is preferable to use a film having low water permeability because impurities such as water can be suppressed from entering the light emitting element 830 and the transistors 820 and 822, and the reliability of the light emitting panel is improved.

The conductive layer 857 is electrically connected to an external input terminal that transmits a signal or potential from the outside to the drive circuit unit 806. Here, an example in which the FPC 808 is provided as the external input terminal is shown. Further, here, an example in which the conductive layer 857 is manufactured by the same material and the same process as the conductive layer 816 is shown.

In Specific Example 4, the insulating layer 813, the transistor 820, the light emitting element 830, and the like are manufactured on the manufactured substrate having high heat resistance, the manufactured substrate is peeled off, and the insulating layer 813 and the transistor are formed on the substrate 801 using the adhesive layer 811. A light emitting panel that can be manufactured by transposing 820, a light emitting element 830, or the like is shown. Since a transistor or the like can be manufactured on a manufacturing substrate having high heat resistance, a highly reliable transistor or a film having sufficiently low water permeability can be formed by applying a high temperature. Then, by transposing them on the substrate 801, a highly reliable light emitting panel can be produced. Thereby, in one aspect of the present invention, a light emitting panel that is lightweight or thin and has high reliability can be realized.

By providing the light emitting element manufactured in the same process as the above-mentioned light emitting element 830 in the non-display portion, it can be used as the light emitting element 22 illustrated in the first embodiment.

[Specific example 5]
FIG. 11 (E) shows an example of a light emitting panel different from the specific examples 1 to 4.

The light emitting panel shown in FIG. 11 (E) includes a substrate 801, an adhesive layer 811, an insulating layer 813, a conductive layer 814, a conductive layer 857a, a conductive layer 857b, a light emitting element 830, an insulating layer 821, and a sealing layer 82.
It has 3 and a substrate 803.

The conductive layer 857a and the conductive layer 857b have a function as an external connection electrode of the light emitting panel and can be electrically connected to an FPC or the like.

The light emitting element 830 has a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the lower electrode 831 is covered with an insulating layer 821. The light emitting element 830 is a bottom emission type, a top emission type, or a dual emission type. The electrodes, substrates, insulating layers, etc. on the light-extracting side each transmit visible light. The conductive layer 814 is the lower electrode 831.
And electrically connect.

The substrate on the light-extracting side may have a hemispherical lens, a microlens array, a film having an uneven structure, a light diffusing film, or the like as the light-extracting structure. For example, a light extraction structure can be formed by adhering the lens or film on a resin substrate with the substrate or an adhesive having a refractive index similar to that of the lens or film.

Although it is not always necessary to provide the conductive layer 814, it is preferable to provide the conductive layer 814 because the voltage drop due to the resistance of the lower electrode 831 can be suppressed. Further, for the same purpose, a conductive layer electrically connected to the upper electrode 835 may be provided on the insulating layer 821, the EL layer 833, the upper electrode 835, or the like.

The conductive layer 814 is a single layer or laminated using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, aluminum, or an alloy material containing these as the main components. Can be formed. The film thickness of the conductive layer 814 can be, for example, 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0.
.. It is 5 μm or less.

When a paste (silver paste or the like) is used as the material of the conductive layer that is electrically connected to the upper electrode 835, the metals constituting the conductive layer become granular and aggregate. Therefore, the surface of the conductive layer is rough and has many gaps, it is difficult for the EL layer 833 to completely cover the conductive layer, and it is easy to establish an electrical connection between the upper electrode and the conductive layer, which is preferable. ..

In Specific Example 5, an insulating layer 813, a light emitting element 830, and the like are manufactured on a manufactured substrate having high heat resistance.
The manufactured substrate is peeled off, and the insulating layer 813 and the light emitting element 83 are placed on the substrate 801 using the adhesive layer 811.
A light emitting panel that can be manufactured by transposing 0 mag is shown. On a highly heat-resistant fabrication substrate
A highly reliable light emitting panel can be produced by applying a high temperature to form a film having sufficiently low water permeability and transposing it onto the substrate 801. Thereby, in one aspect of the present invention, a light emitting panel that is lightweight or thin and has high reliability can be realized.

Although an example in which a light emitting element is used as the display element is shown here, one aspect of the present invention is not limited to this.

For example, in the present specification and the like, a display element, a display device having a display element or a display panel, a light emitting element, and a light emitting device having a light emitting element may use various forms or various elements. Can have. Examples of display elements, display devices, display panels, light emitting elements or light emitting devices include EL (electroluminescence) elements (EL elements containing organic and inorganic substances, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LE).
D, green LED, blue LED, etc.), transistor (transistor that emits light according to current), electron emitting element, liquid crystal element, electronic ink, electrophoresis element, grating light valve (GLV), plasma display (PDP), MEMS ( Display element using micro-electromechanical system), Digital Micromirror Device (DMD), D
MS (Digital Micro Shutter), MIRASOL (Registered Trademark), IMOD (Interference Modulation) Element, Shutter MEMS Display Element, Optical Interference MEMS Display, Electrowetting Element, piezoelectric Ceramic Display, Carbon Some devices, such as nanotubes, have a display medium whose contrast, brightness, reflectance, transmittance, etc. change due to an electromagnetic action. An example of a display device using an EL element is an EL display or the like. As an example of a display device using an electron emitting element, a field emission display (FED) or a SED type planar display (SED: Surface-conduction Electron-emitter)
Display) and so on. As an example of a display device using a liquid crystal element, a liquid crystal display (transmissive liquid crystal display, semi-transmissive liquid crystal display, reflective liquid crystal display, etc.)
Direct-view liquid crystal display, projection liquid crystal display), etc. An example of a display device using an electronic ink, an electronic powder fluid, or an electrophoretic element is an electronic paper. In addition, it should be noted
In the case of realizing a transflective liquid crystal display or a reflective liquid crystal display, a part or all of the pixel electrodes may have a function as a reflective electrode. For example, a part or all of the pixel electrodes may have aluminum, silver, or the like. Further, in that case, it is also possible to provide a storage circuit such as SRAM under the reflective electrode. Thereby, the power consumption can be further reduced.

By providing the light emitting element manufactured in the same process as the above-mentioned light emitting element 830 in the non-display portion, it can be used as the light emitting element 22 illustrated in the first embodiment.

[Example of material]
Next, materials and the like that can be used for the light emitting panel will be described. The configuration described above in this specification may be omitted.

Materials such as glass, quartz, organic resin, metal, and alloy can be used for the substrate. For the substrate on the side that extracts light from the light emitting element, a material having translucency to the light is used.

In particular, it is preferable to use a flexible substrate. For example, an organic resin or a glass, metal, or alloy having a thickness sufficient to have flexibility can be used.

Since organic resin has a lower specific gravity than glass, if organic resin is used as a flexible substrate,
It is preferable that the light emitting panel can be made lighter than the case where glass is used.

It is preferable to use a material having high toughness for the substrate. As a result, a light emitting panel having excellent impact resistance and being hard to be damaged can be realized. For example, by using an organic resin substrate or a thin metal substrate or alloy substrate, it is possible to realize a light emitting panel that is lighter in weight and less likely to be damaged as compared with the case of using a glass substrate.

Since the metal material and the alloy material have high thermal conductivity and can easily conduct heat to the entire substrate, it is possible to suppress a local temperature rise of the light emitting panel, which is preferable. The thickness of the substrate using the metal material or alloy material is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less.

The material constituting the metal substrate or alloy substrate is not particularly limited, and for example, a metal such as aluminum, copper, iron, titanium, or nickel, or an alloy containing one or more metals selected from these metals is used. Can be done. As the alloy, for example, an aluminum alloy, stainless steel, or the like can be preferably used.

Further, when a material having a high thermal emissivity is used for the substrate, it is possible to suppress an increase in the surface temperature of the light emitting panel, and it is possible to suppress destruction of the light emitting panel and deterioration of reliability. For example, the substrate may have a laminated structure of a metal substrate and a layer having a high thermal emissivity (for example, a metal oxide or a ceramic material can be used).

Examples of the flexible and translucent material include polyethylene terephthalate (PE).
T), polyester resin such as polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethylmethacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, Examples thereof include polyamideimide resin and polyvinyl chloride resin. In particular, it is preferable to use a material having a low coefficient of thermal expansion, and for example, a polyamide-imide resin, a polyimide resin, PET and the like can be preferably used. Further, a substrate in which a fiber body is impregnated with a resin (also referred to as a prepreg) or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used.

As the flexible substrate, the layer using the above material is a hard coat layer (for example, a silicon nitride layer) that protects the surface of the device from scratches or the like, or a layer of a material that can disperse the pressure (for example, an aramid resin). It may be configured by being laminated with a layer or the like).

The flexible substrate can also be used by laminating a plurality of layers. In particular, when the structure has a glass layer, the barrier property against water and oxygen can be improved, and a highly reliable light emitting panel can be obtained.

For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side close to the light emitting element can be used. The thickness of the glass layer is 20 μm or more and 200 μm or less, preferably 25 μm or more and 100 μm or less. A glass layer having such a thickness can simultaneously realize high barrier property against water and oxygen and flexibility. The thickness of the organic resin layer is 1
It is 0 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By providing such an organic resin layer on the outside of the glass layer, cracks and cracks in the glass layer can be suppressed and the mechanical strength can be improved. By applying such a composite material of a glass material and an organic resin to a substrate, an extremely reliable and flexible light emitting panel can be obtained.

As the adhesive layer and the sealing layer, various curable adhesives such as a photocurable adhesive such as an ultraviolet curable type, a reaction curable type adhesive, a heat curable type adhesive, and an anaerobic type adhesive can be used. These adhesives include epoxy resin, acrylic resin, silicone resin, phenol resin, polyimide resin, etc.
Examples thereof include imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin and the like. In particular, a material having low moisture permeability such as epoxy resin is preferable. Further, a two-component mixed type resin may be used. Moreover, you may use an adhesive sheet or the like.

Further, the resin may contain a desiccant. For example, a substance that adsorbs water by chemisorption, such as an oxide of an alkaline earth metal (calcium oxide, barium oxide, etc.), can be used. Alternatively, a substance that adsorbs water by physical adsorption, such as zeolite or silica gel, may be used. When a desiccant is contained, impurities such as water can be suppressed from entering the functional element, and the reliability of the light emitting panel is improved, which is preferable.

Further, by mixing the resin with a filler having a high refractive index or a light scattering member, the light extraction efficiency from the light emitting element can be improved. For example, titanium oxide, barium oxide,
Zeolites, zirconium and the like can be used.

The structure of the transistor included in the light emitting panel is not particularly limited. For example, it may be a staggered transistor or an inverted staggered transistor. Further, either a top gate type or bottom gate type transistor structure may be used. The semiconductor material used for the transistor is not particularly limited, and examples thereof include silicon, germanium, silicon carbide, and gallium nitride. Alternatively, an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In-Ga-Zn-based metal oxide, may be used.

The crystallinity of the semiconductor material used for the transistor is also not particularly limited, and the amorphous semiconductor,
Any of the semiconductors having crystallinity (microcrystalline semiconductors, polycrystalline semiconductors, single crystal semiconductors, or semiconductors having a partially crystalline region) may be used. It is preferable to use a semiconductor having crystallinity because deterioration of transistor characteristics can be suppressed.

Here, it is preferable to apply an oxide semiconductor to a semiconductor device such as a pixel, a drive circuit, or a transistor used for a touch sensor or the like described later. In particular, it is preferable to apply an oxide semiconductor having a bandgap larger than that of silicon. It is preferable to use a semiconductor material having a wider bandgap and a smaller carrier density than silicon because the current in the off state of the transistor can be reduced.

For example, the oxide semiconductor preferably contains at least indium (In) or zinc (Zn). More preferably, In—M—Zn-based oxide (M is A)
Contains oxides represented by (metals such as l, Ti, Ga, Ge, Y, Zr, Sn, La, Ce or Hf).

In particular, the semiconductor layer has a plurality of crystal portions, and the c-axis of the crystal portion is oriented perpendicular to the surface to be formed of the semiconductor layer or the upper surface of the semiconductor layer, and grain boundaries are formed between adjacent crystal portions. It is preferable to use an oxide semiconductor film that does not have.

Since such an oxide semiconductor does not have a crystal grain boundary, it is possible to prevent cracks from being generated in the oxide semiconductor film due to stress when the display panel is curved. Therefore,
Such an oxide semiconductor can be suitably used for a display panel or the like which has flexibility and is used by being curved.

By using such a material as the semiconductor layer, fluctuations in electrical characteristics are suppressed, and a highly reliable transistor can be realized.

In addition, the low off-current makes it possible to retain the charge accumulated in the capacitance via the transistor for a long period of time. By applying such a transistor to a pixel, it is possible to stop the drive circuit while maintaining the tone of the image displayed in each display area. As a result, it is possible to realize an electronic device with extremely reduced power consumption.

It is preferable to provide a base film for stabilizing the characteristics of the transistor. As the base film, an inorganic insulating film such as a silicon oxide film, a silicon nitride film, a silicon oxide film, or a silicon nitride film can be used, and can be produced as a single layer or laminated. The base film is a sputtering method or a CVD (Chemical Vapor Deposition) method (plasma CVD).
Method, thermal CVD method, MOCVD (Metal Organic CVD) method, etc.), ALD
It can be formed by using (Atomic Layer Deposition) method, coating method, printing method and the like. The base film may not be provided if it is not necessary. In each of the above configuration examples, the insulating layer 813 can also serve as the base film of the transistor.

As the light emitting element, an element capable of self-luminous light can be used, and an element whose brightness is controlled by a current or a voltage is included in the category. For example, a light emitting diode (LED), an organic EL element, an inorganic EL element, or the like can be used.

The light emitting element may be any of a top emission type, a bottom emission type, and a dual emission type. A conductive film that transmits visible light is used for the electrode on the side that extracts light. Further, it is preferable to use a conductive film that reflects visible light for the electrode on the side that does not take out light.

The conductive film that transmits visible light is, for example, indium oxide, indium tin oxide (ITO:
It can be formed by using Indium Tin Oxide), indium zinc oxide, zinc oxide, zinc oxide added with gallium, or the like. Further, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (for example, Titanium nitride) or the like can also be used by forming it thin enough to have translucency. Further, the laminated film of the above material can be used as the conductive layer. For example, it is preferable to use a laminated film of an alloy of silver and magnesium and ITO because the conductivity can be enhanced.
Moreover, graphene or the like may be used.

As the conductive film that reflects visible light, for example, a metal material such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy containing these metal materials should be used. Can be done. Further, lanthanum, neodymium, germanium or the like may be added to the above metal materials or alloys. Also, aluminum-containing alloys (aluminum alloys) such as aluminum-titanium alloys, aluminum-nickel alloys, aluminum-neodim alloys, silver-copper alloys, silver-palladium-copper alloys, etc.
It can be formed by using an alloy containing silver such as an alloy of silver and magnesium. Alloys containing silver and copper are preferable because they have high heat resistance. Further, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the material of the metal film and the metal oxide film include titanium and titanium oxide. Further, the conductive film that transmits visible light and the film made of a metal material may be laminated. For example, silver and ITO
, A laminated film of silver and magnesium alloy and ITO can be used.

The electrodes may be formed by a vapor deposition method or a sputtering method, respectively. In addition, it can be formed by using a ejection method such as an inkjet method, a printing method such as a screen printing method, or a plating method.

When a voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 831 and the upper electrode 835, holes are injected into the EL layer 833 from the anode side, and electrons are injected from the cathode side. The injected electrons and holes are recombined in the EL layer 833, and the luminescent substance contained in the EL layer 833 emits light.

The EL layer 833 has at least a light emitting layer. The EL layer 833 is a layer other than the light emitting layer.
Highly hole-injectable substance, highly hole-transporting substance, hole blocking material, highly electron-transporting substance, highly electron-injecting substance, or bipolar substance (electron-transporting and hole-transporting property) It may further have a layer containing a high substance) or the like.

Either a low molecular weight compound or a high molecular weight compound can be used for the EL layer 833, and an inorganic compound may be contained. The layers constituting the EL layer 833 can be formed by a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an inkjet method, a coating method, or the like.

When a white light emitting element is applied as the light emitting element 830, it is preferable that the EL layer 833 contains two or more kinds of light emitting substances. For example, white light emission can be obtained by selecting a light emitting substance so that the light emission of each of two or more light emitting substances has a complementary color relationship. For example, a luminescent substance that emits light such as R (red), G (green), B (blue), Y (yellow), O (orange), or spectral components of two or more colors of R, G, and B, respectively. It is preferable to contain two or more of the luminescent substances exhibiting luminescence including. Further, it is preferable to apply a light emitting element having two or more peaks in the spectrum of light emission from the light emitting element 830 within the wavelength range of the visible light region (for example, 350 nm to 750 nm). Further, the emission spectrum of the material having a peak in the yellow wavelength region is preferably a material having a spectral component also in the green and red wavelength regions.

More preferably, the EL layer 833 has a structure in which a light emitting layer containing a light emitting material that emits one color and a light emitting layer containing a light emitting material that emits another color are laminated. For example, E
The plurality of light emitting layers in the L layer 833 may be laminated in contact with each other, or may be laminated via a separation layer. For example, a separation layer may be provided between the fluorescence light emitting layer and the phosphorescence light emitting layer.

The separation layer can be provided, for example, to prevent energy transfer (particularly triplet energy transfer) by the Dexter mechanism from the excited state of the phosphorescent material or the like generated in the phosphorescent light emitting layer to the fluorescent material or the like in the fluorescent light emitting layer. The separation layer may have a thickness of about several nm. Specifically, 0.
1 nm or more and 20 nm or less, or 1 nm or more and 10 nm or less, or 1 nm or more and 5 nm
It is as follows. The separation layer comprises a single material (preferably a bipolar material) or multiple materials (preferably hole-transporting and electron-transporting materials).

The separation layer may be formed by using a material contained in the light emitting layer in contact with the separation layer. This facilitates the fabrication of the light emitting element and reduces the drive voltage. For example, when the phosphorescent layer is composed of a host material, an assist material, and a phosphorescent material (guest material), the separation layer may be formed of the host material and the assist material. In other words, the separation layer has a region containing no phosphorescent material, and the phosphorescent light emitting layer has a region containing a phosphorescent material. This will
The separation layer and the phosphorescent layer can be vapor-deposited with or without a phosphorescent material. Further, with such a configuration, the separation layer and the phosphorescent light emitting layer can be formed in the same chamber.
As a result, the manufacturing cost can be reduced.

Further, the light emitting element 830 may be a single element having one EL layer, or may be a tandem element in which a plurality of EL layers are laminated via a charge generation layer.

The light emitting element is preferably provided between a pair of low-permeability insulating films. As a result, it is possible to prevent impurities such as water from entering the light emitting element, and it is possible to suppress a decrease in the reliability of the light emitting device.

Examples of the insulating film having low water permeability include a film containing nitrogen and silicon such as a silicon nitride film and a silicon oxide nitride film, and a film containing nitrogen and aluminum such as an aluminum nitride film. Also,
A silicon oxide film, a silicon nitride film, an aluminum oxide film, or the like may be used.

For example, the amount of water vapor permeated by an insulating film having low water permeability is 1 × ^10-5 [g / m ² · day] or less, preferably 1 × ^10-6 [g / m ² · day] or less, more preferably 1. × ^10-7 [
It is g / m ² · day] or less, more preferably 1 × ^10-8 [g / m ² · day] or less.

It is preferable to use an insulating film having low water permeability for the insulating layer 813 and the insulating layer 843.

As the insulating layer 815, for example, an inorganic insulating film such as a silicon oxide film, a silicon nitride film, or an aluminum oxide film can be used. Further, the insulating layer 817, the insulating layer 817a,
As the insulating layer 817b, for example, organic materials such as polyimide, acrylic, polyamide, polyimideamide, and benzocyclobutene resin can be used. Also,
A low dielectric constant material (low-k material) or the like can be used. Further, each insulating layer may be formed by laminating a plurality of insulating films.

The insulating layer 821 is formed by using an organic insulating material or an inorganic insulating material. As the resin, for example, a polyimide resin, a polyamide resin, an acrylic resin, a siloxane resin, an epoxy resin, a phenol resin, or the like can be used. In particular, it is preferable to use a photosensitive resin material and form the side wall of the opening so that the side wall is an inclined surface formed with a continuous curvature.

The method for forming the insulating layer 821 is not particularly limited, but a photolithography method, a sputtering method, a vapor deposition method, a droplet ejection method (injection method, etc.), a printing method (screen printing, offset printing, etc.) and the like may be used.

The spacer 827 can be formed by using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, examples of the inorganic insulating material and the organic insulating material include various materials that can be used for the insulating layer. As the metal material, titanium, aluminum and the like can be used. By electrically connecting the spacer 827 containing the conductive material and the upper electrode 835, the potential drop due to the resistance of the upper electrode 835 can be suppressed. Also, spacer 8
27 may have a forward taper shape or a reverse taper shape.

The conductive layer used for the light emitting panel, which functions as an electrode or wiring of a transistor or an auxiliary electrode of a light emitting element, is, for example, a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, or these. It can be formed in a single layer or laminated by using an alloy material containing the above elements. Further, the conductive layer may be formed by using a conductive metal oxide. Conductive metal oxides include indium oxide (In ₂ O _3, etc.), tin oxide (SnO _2, etc.), zinc oxide (ZnO), ITO, and indium zinc oxide (I).
n ₂ O _3- ZnO, etc.) or those metal oxide materials containing silicon oxide can be used.

The colored layer is a colored layer that transmits light in a specific wavelength band. For example, a red (R) color filter that transmits light in the red wavelength band, a green (G) color filter that transmits light in the green wavelength band, and a blue (B) color filter that transmits light in the blue wavelength band. A color filter or the like can be used. Each colored layer is formed at a desired position by a printing method, an inkjet method, an etching method using a photolithography method, or the like using various materials.

The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from adjacent light-emitting elements and suppresses color mixing between adjacent light-emitting elements. Here, light leakage can be suppressed by providing the end portion of the colored layer so as to overlap the light-shielding layer. As a light-shielding layer
A material that blocks light emission from the light emitting element can be used. For example, a black matrix may be formed by using a metal material or a resin material containing a pigment or a dye. It is preferable to provide the light-shielding layer in a region other than the light-emitting portion such as the drive circuit portion because it is possible to suppress unintended light leakage due to waveguide light or the like.

Further, an overcoat may be provided to cover the colored layer and the light-shielding layer. By providing the overcoat, it is possible to prevent the impurities contained in the colored layer from diffusing into the light emitting element. The overcoat is made of a material that transmits light emitted from the light emitting element. For example, an inorganic insulating film such as a silicon nitride film or a silicon oxide film or an organic insulating film such as an acrylic film or a polyimide film can be used for organic insulation. A laminated structure of a film and an inorganic insulating film may be used.

Further, when the material of the sealing layer is applied on the colored layer and the light-shielding layer, it is preferable to use a material having high wettability with respect to the material of the sealing layer as the overcoat material. For example, it is preferable to use an oxide conductive film such as an ITO film or a metal film such as an Ag film which is thin enough to have translucency as the overcoat.

As the connecting body, a paste-like or sheet-like material in which metal particles are mixed with a thermosetting resin, which exhibits anisotropic conductivity by thermocompression bonding, can be used. As metal particles,
For example, it is preferable to use particles in which two or more kinds of metals are layered, such as nickel particles coated with gold. Alternatively, it is preferable to use a material in which the surface of the granular resin is coated with metal.

[Example of manufacturing method]
Next, a method for manufacturing the light emitting panel will be illustrated with reference to FIGS. 12 and 13. Here, a light emitting panel having the configuration of Specific Example 1 (FIG. 11 (C)) will be described as an example.

First, the release layer 203 is formed on the production substrate 201, and the insulating layer 813 is formed on the release layer 203. Next, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light emitting elements, and an insulating layer 821 are formed on the insulating layer 813. The insulating layer 821, the insulating layer 817, and the insulating layer 815 are opened so that the conductive layer 857 is exposed (FIG. 12 (A)).
).

Further, the release layer 207 is formed on the production substrate 205, and the insulating layer 843 is formed on the release layer 207. Next, a light-shielding layer 847, a colored layer 845, and an overcoat 84 are placed on the insulating layer 843.
9 is formed (FIG. 12 (B)).

As the production substrate 201 and the production substrate 205, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate, or the like can be used, respectively.

Further, as the glass substrate, for example, a glass material such as aluminosilicate glass, aluminoborosilicate glass, and bariumborosilicate glass can be used. When the temperature of the subsequent heat treatment is high, it is preferable to use one having a strain point of 730 ° C. or higher. In addition, barium oxide (
By containing a large amount of BaO), more practical heat-resistant glass can be obtained. In addition, crystallized glass or the like can be used.

When a glass substrate is used as the manufacturing substrate, if an insulating film such as a silicon oxide film, a silicon nitride film, a silicon nitride film, or a silicon nitride film is formed between the manufacturing substrate and the release layer, the glass substrate is contaminated. It can be prevented and is preferable.

The release layer 203 and the release layer 207 include elements selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, and silicon, respectively. It is a single layer or a laminated layer composed of an alloy material containing the element or a compound material containing the element. The crystal structure of the layer containing silicon may be amorphous, microcrystal, or polycrystalline.

The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. The coating method includes a spin coating method, a droplet ejection method, and a dispensing method.

When the release layer has a single layer structure, it is preferable to form a tungsten layer, a molybdenum layer, or a layer containing a mixture of tungsten and molybdenum. Further, a layer containing a tungsten oxide or an oxide nitride, a layer containing a molybdenum oxide or an oxide nitride, or a layer containing an oxide or an oxide nitride of a mixture of tungsten and molybdenum may be formed. In addition, it should be noted
The mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

Further, when forming a laminated structure of a layer containing tungsten and a layer containing an oxide of tungsten as a release layer, a layer containing tungsten is formed, and an insulating film formed of an oxide is formed on the upper layer. , It may be utilized that a layer containing a tungsten oxide is formed at the interface between the tungsten layer and the insulating film. Further, the surface of the layer containing tungsten, thermal oxidation treatment, oxygen plasma treatment, nitrous oxide (N 2 _O) plasma treatment, an oxide of tungsten processing or the like in the strong oxidizing solution such as ozone water A layer containing may be formed. Further, the plasma treatment and the heat treatment may be carried out by oxygen, nitrogen, nitrous oxide alone, or in a mixed gas atmosphere of the gas and another gas. By changing the surface state of the release layer by the above plasma treatment or heat treatment, it is possible to control the adhesion between the release layer and the insulating film formed later.

Each insulating layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. For example, the film formation temperature is set to 250 ° C. or higher by the plasma CVD method.
By forming the temperature below ° C, a dense and extremely low water permeability film can be obtained.

After that, a material to be a sealing layer 823 is applied to the surface of the manufacturing substrate 205 provided with the colored layer 845 and the like or the surface of the manufacturing substrate 201 provided with the light emitting element 230 and the like, and the surface is passed through the sealing layer 823. The production substrate 201 and the production substrate 205 are bonded together so that they face each other (FIG. 12 (FIG. 12).
C)).

Then, the production substrate 201 is peeled off, and the exposed insulating layer 813 and the substrate 801 are attached to the adhesive layer 81.
Paste using 1. Further, the manufactured substrate 205 is peeled off, and the exposed insulating layer 843 and the substrate 803 are bonded together using the adhesive layer 841. In FIG. 13A, the substrate 803 is configured not to overlap with the conductive layer 857, but the conductive layer 857 and the substrate 803 may overlap.

In the peeling step, various methods can be appropriately used. For example, when a layer containing a metal oxide film is formed on the side in contact with the layer to be peeled as the release layer, the metal oxide film can be fragile by crystallization and the layer to be peeled can be peeled from the manufactured substrate. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the highly heat-resistant fabrication substrate and the layer to be peeled off, the amorphous silicon film is removed by irradiating or etching laser light. , The layer to be peeled off can be peeled off from the manufactured substrate. Further, as a peeling layer, a layer containing a metal oxide film is formed on the side in contact with the layer to be peeled, the metal oxide film is weakened by crystallization, and a part of the peeling layer is made into a solution or NF.
After being removed by etching with a fluorine gas such as ₃ , BrF ₃ , ClF _3, etc., it can be peeled off in a weakened metal oxide film. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) is used as the release layer, and the release layer is irradiated with laser light. A method may be used in which nitrogen, oxygen or hydrogen contained in the peeling layer is released as a gas to promote the peeling between the peeled layer and the substrate. Further, a method of mechanically removing the production substrate on which the layer to be peeled is formed or etching with a solution or a fluorine gas such as NF ₃ , BrF ₃ , ClF ₃ or the like can be used. In this case, it is not necessary to provide the release layer.

Further, the peeling step can be performed more easily by combining a plurality of the peeling methods. That is, after irradiating the peeling layer with laser light, etching the peeling layer with a gas or solution, and mechanically removing the peeling layer with a sharp knife or a knife to make the peeling layer and the layer to be peeled easy to peel off, it is physically removed. Peeling can also be performed by force (by machine or the like).

Further, the peeled layer may be peeled from the manufactured substrate by infiltrating the liquid into the interface between the peeled layer and the peeled layer. Further, when peeling, the peeling may be performed while sprinkling a liquid such as water.

As another peeling method, when the peeling layer is formed of tungsten, it is preferable to perform peeling while etching the peeling layer with a mixed solution of aqueous ammonia and hydrogen peroxide.

If peeling is possible at the interface between the manufactured substrate and the layer to be peeled, the peeling layer may not be provided. For example, glass is used as a manufacturing substrate, and an organic resin such as polyimide, polyester, polyolefin, polyamide, polycarbonate, or acrylic is formed in contact with the glass, and an insulating film, a transistor, or the like is formed on the organic resin. In this case, by heating the organic resin,
It can be peeled off at the interface between the manufacturing substrate and the organic resin. Alternatively, a metal layer may be provided between the production substrate and the organic resin, the metal layer may be heated by passing an electric current through the metal layer, and peeling may be performed at the interface between the metal layer and the organic resin.

Finally, the conductive layer 857 is exposed by opening the insulating layer 843 and the sealing layer 823 (FIG. 13 (B)). When the substrate 803 overlaps with the conductive layer 857, the conductive layer 85
The substrate 803 and the adhesive layer 841 are also opened to expose 7. (FIG. 13 (C)). The means for opening is not particularly limited, and for example, a laser ablation method, an etching method, an ion beam sputtering method, or the like may be used. Further, the film on the conductive layer 857 may be cut with a sharp blade or the like, and a part of the film may be peeled off by a physical force.

From the above, the light emitting panel can be manufactured.

This embodiment can be carried out in combination with at least a part thereof as appropriate with other embodiments described in the present specification.

(Embodiment 3)
In the present embodiment, a configuration example of a foldable touch panel applicable to the display panel of the electronic device of one aspect of the present invention will be described with reference to FIGS. 14 to 17. For the materials that can be used for each layer, the second embodiment can be referred to.

[Configuration Example 1]
FIG. 14A is a top view of the touch panel. 14 (B) is a cross-sectional view between the alternate long and short dash lines AB and the alternate long and short dash line CD of FIG. 14 (A). 14 (C) is a cross-sectional view between the alternate long and short dash lines EF of FIG. 14 (A).

As shown in FIG. 14A, the touch panel 390 has a display unit 301.

The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. Imaging pixel 308
Can detect a finger or the like touching the display unit 301. Thereby, the touch sensor can be configured by using the image pickup pixel 308.

The pixel 302 includes a plurality of sub-pixels (for example, sub-pixel 302R), and the sub-pixel includes a light emitting element and a pixel circuit capable of supplying electric power for driving the light emitting element.

The pixel circuit is electrically connected to a wiring capable of supplying a selection signal and a wiring capable of supplying an image signal.

Further, the touch panel 390 includes a scanning line drive circuit 303g (1) capable of supplying a selection signal to the pixel 302, and an image signal line drive circuit 303s (1) capable of supplying an image signal to the pixel 302.

The image pickup pixel 308 includes a photoelectric conversion element and an image pickup pixel circuit for driving the photoelectric conversion element.

The imaging pixel circuit is electrically connected to a wiring capable of supplying a control signal and a wiring capable of supplying a power supply potential.

As the control signal, for example, a signal capable of selecting an imaging pixel circuit for reading the recorded imaging signal, a signal capable of initializing the imaging pixel circuit, and a time for the imaging pixel circuit to detect light are determined. Can be mentioned as a signal that can be generated.

The touch panel 390 includes an imaging pixel drive circuit 303g (2) capable of supplying a control signal to the imaging pixel 308, and an imaging signal line driving circuit 303s (2) for reading the imaging signal.

As shown in FIG. 14B, the touch panel 390 has a substrate 510 and a substrate 570 facing the substrate 510.

A flexible material can be suitably used for the substrate 510 and the substrate 570.

A material in which the permeation of unintended impurities is suppressed can be suitably used for the substrate 510 and the substrate 570. For example, the transmittance of water vapor is ^10-5 g / m ² · day or less, preferably 1.
0 ^-6 g ^/ m 2 · day or less is material can be suitably used.

Materials having approximately the same coefficient of linear expansion can be suitably used for the substrate 510 and the substrate 570. For example, a material having a linear expansion coefficient of 1 × 10 ^-3 / K or less, preferably 5 × 10 ^-5 / K or less, and more preferably 1 × 10 ^-5 / K or less can be preferably used.

The substrate 510 is a laminated body in which a flexible substrate 510b, an insulating layer 510a for preventing unintended diffusion of impurities to a light emitting element, and an adhesive layer 510c for bonding the flexible substrate 510b and the insulating layer 510a are laminated.

The substrate 570 is a laminate of a flexible substrate 570b, an insulating layer 570a that prevents unintended impurities from diffusing into a light emitting element, and an adhesive layer 570c that adheres the flexible substrate 570b and the insulating layer 570a.

For example, a material containing polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide, polycarbonate or acrylic, urethane, epoxy or a resin having a siloxane bond can be used for the adhesive layer.

The sealing layer 560 has a substrate 570 and a substrate 510 bonded together. The sealing layer 560 has a refractive index higher than that of air. Further, when light is taken out to the sealing layer 560 side, the sealing layer 560 also serves as an optical bonding layer. The pixel circuit and the light emitting element (for example, the first light emitting element 350R) are the substrate 51.
It is between 0 and the substrate 570.

The pixel 302 has a sub-pixel 302R, a sub-pixel 302G, and a sub-pixel 302B (FIG. 14).
(C)). Further, the sub-pixel 302R includes a light emitting module 380R, the sub pixel 302G includes a light emitting module 380G, and the sub pixel 302B includes a light emitting module 380B.

For example, the sub-pixel 302R includes a pixel circuit including a transistor 302t capable of supplying power to the first light emitting element 350R and the first light emitting element 350R (FIG. 14B).
.. Further, the light emitting module 380R includes a first light emitting element 350R and an optical element (for example, a colored layer 367R).

The light emitting element 350R has a first lower electrode 351R, an upper electrode 352, and an EL layer 353 between the lower electrode 351R and the upper electrode 352 (FIG. 14 (C)).

The EL layer 353 includes a first EL layer 353a, a second EL layer 353b, and a first EL layer 3.
An intermediate layer 354 is provided between 53a and the second EL layer 353b.

The light emitting module 380R has a first colored layer 367R on the substrate 570. The colored layer may be any one that transmits light having a specific wavelength, and for example, one that selectively transmits light exhibiting red, green, blue, or the like can be used. Alternatively, a region that transmits the light emitted by the light emitting element as it is may be provided.

For example, the light emitting module 380R includes a first light emitting element 350R and a first colored layer 367R.
It has a sealing layer 360 in contact with.

The first colored layer 367R is located at a position overlapping with the first light emitting element 350R. As a result, a part of the light emitted by the light emitting element 350R passes through the sealing layer 360 also serving as the optical bonding layer and the first colored layer 367R, and is emitted to the outside of the light emitting module 380R as shown by the arrows in the drawing. Will be done.

The touch panel 390 has a light-shielding layer 367BM on the substrate 570. The light-shielding layer 367BM is provided so as to surround the colored layer (for example, the first colored layer 367R).

The touch panel 390 is provided with an antireflection layer 367p at a position overlapping the display unit 301. As the antireflection layer 367p, for example, a circularly polarizing plate can be used.

The touch panel 390 includes an insulating layer 321. The insulating layer 321 is a transistor 302t
Is covering. The insulating layer 321 can be used as a layer for flattening the unevenness caused by the pixel circuit. Further, an insulating layer in which a layer capable of suppressing diffusion of impurities to a transistor 302t or the like is laminated can be applied to the insulating layer 321.

The touch panel 390 has a light emitting element (for example, the first light emitting element 350R) on the insulating layer 321.

The touch panel 390 has an insulating layer 3 having a partition wall 328 that overlaps the end of the first lower electrode 351R.
Have on 21. Further, a spacer 329 that controls the distance between the substrate 510 and the substrate 570 is provided on the partition wall 328.

The image signal line drive circuit 303s (1) includes a transistor 303t and a capacitance 303c. The drive circuit can be formed on the same substrate in the same process as the pixel circuit. FIG. 14
As shown in (B), the transistor 303t may have a second gate 304 on the insulating layer 321. The second gate 304 may be electrically connected to the gate of the transistor 303t, or may be given different potentials. If necessary, the second gate 304 may be provided in the transistor 308t, the transistor 302t, or the like.

The image pickup pixel 308 includes an image pickup pixel circuit for detecting the light emitted to the photoelectric conversion element 308p and the photoelectric conversion element 308p. Further, the imaging pixel circuit includes a transistor 308t.

For example, a pin type photodiode can be used for the photoelectric conversion element 308p.

The touch panel 390 includes a wiring 311 capable of supplying a signal, and a terminal 319 is provided in the wiring 311. An FPC 309 (1) capable of supplying signals such as an image signal and a synchronization signal is electrically connected to the terminal 319. In addition, FPC309 (
A printed wiring board (PWB) may be attached to 1).

Transistors formed in the same process are referred to as transistors 302t and transistors 303.
It can be applied to transistors such as t and transistor 308t. For the configuration of the transistor, the second embodiment can be referred to.

In addition to the gate, source and drain of the transistor, the materials that can be used for the various wiring and electrodes that make up the touch panel include aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or A single metal made of tungsten or an alloy containing this as a main component is used as a single layer structure or a laminated structure. For example, a single-layer structure of an aluminum film containing silicon, a two-layer structure in which an aluminum film is laminated on a titanium film, a two-layer structure in which an aluminum film is laminated on a tungsten film, and a copper film on a copper-magnesium-aluminum alloy film. Two-layer structure for laminating, two-layer structure for laminating a copper film on a titanium film, two-layer structure for laminating a copper film on a tungsten film, a titanium film or a titanium nitride film, and the titanium film or the titanium nitride film. A three-layer structure in which an aluminum film or a copper film is laminated and a titanium film or a titanium nitride film is formed on the film, a molybdenum film or a molybdenum nitride film, and an aluminum film or copper laminated on the molybdenum film or the molybdenum nitride film Laminate the membranes
Further, there is a three-layer structure or the like in which a molybdenum film or a molybdenum nitride film is formed on the molybdenum film. In addition, it should be noted
A transparent conductive material containing indium oxide, tin oxide or zinc oxide may be used. Further, it is preferable to use copper containing manganese because the controllability of the shape by etching is improved.

By providing a light emitting element manufactured in the same step as the above-mentioned light emitting element (for example, the first light emitting element 350R or the like) in the non-display portion, it can be used as the light emitting element 22 illustrated in the first embodiment. Further, by providing the imaging pixel produced in the same process as the imaging pixel 308 including the photoelectric conversion element 308p and the imaging pixel circuit described above in the non-display portion, the light receiving element 21 illustrated in the first embodiment can be used.

[Configuration Example 2]
15 (A) and 15 (B) are perspective views of the touch panel 505. For clarification, typical components are shown. FIG. 16 is a cross-sectional view between the alternate long and short dash lines X1-X2 shown in FIG. 15 (A).

The touch panel 505 includes a display unit 501 and a touch sensor 595 (FIG. 15 (B)).
.. Further, the touch panel 505 has a substrate 510, a substrate 570, and a substrate 590. The substrate 510, the substrate 570, and the substrate 590 all have flexibility.

The display unit 501 includes a plurality of pixels on the substrate 510 and the substrate 510, and a plurality of wirings 511 capable of supplying signals to the pixels. The plurality of wirings 511 are routed to the outer peripheral portion of the substrate 510, and a part of them constitutes the terminal 519. Terminal 519 is FPC509 (1)
) And electrically connect.

The substrate 590 includes a touch sensor 595 and a plurality of wirings 598 that are electrically connected to the touch sensor 595. A plurality of wirings 598 are routed around the outer peripheral portion of the substrate 590, and a part of them constitutes a terminal. Then, the terminal is electrically connected to the FPC 509 (2). In FIG. 15B, for clarity, the electrodes, wiring, and the like of the touch sensor 595 provided on the back surface side (back side of the paper surface) of the substrate 590 are shown by solid lines.

As the touch sensor 595, for example, a capacitance type touch sensor can be applied. Examples of the capacitance method include a surface type capacitance method and a projection type capacitance method.

The projected capacitance method includes a self-capacitance method and a mutual capacitance method mainly due to the difference in the drive method. It is preferable to use the mutual capacitance method because simultaneous multipoint detection is possible.

In the following, FIG. 15B shows a case where a projection type capacitance type touch sensor is applied.
Will be described using.

It should be noted that various sensors capable of detecting the proximity or contact of a detection target such as a finger can be applied.

The projection type capacitance type touch sensor 595 has an electrode 591 and an electrode 592. The electrode 591 is electrically connected to one of the plurality of wires 598, and the electrode 592 is the plurality of wires 598.
Electrically connect to any of the others.

As shown in FIGS. 15A and 15B, the electrode 592 has a shape in which a plurality of quadrilaterals repeatedly arranged in one direction are connected at a corner.

The electrode 591 is a quadrilateral and is repeatedly arranged in a direction intersecting the extending direction of the electrode 592.

The wiring 594 electrically connects two electrodes 591 that sandwich the electrode 592. At this time, it is preferable that the area of the intersection between the electrode 592 and the wiring 594 is as small as possible. As a result, the area of the region where the electrodes are not provided can be reduced, and the unevenness of the transmittance can be reduced. As a result, it is possible to reduce the uneven brightness of the light transmitted through the touch sensor 595.

The shapes of the electrodes 591 and 592 are not limited to this, and various shapes can be taken. For example, a plurality of electrodes 591 are arranged so as not to form a gap as much as possible, and the electrodes 5 are interposed via an insulating layer.
A plurality of 92s may be provided at intervals so as to form a region that does not overlap with the electrode 591. At this time, it is preferable to provide a dummy electrode electrically insulated from the two adjacent electrodes 592 because the area of regions having different transmittances can be reduced.

The touch sensor 595 includes a substrate 590, electrodes 591 and 592 arranged in a staggered pattern on the substrate 590, an insulating layer 593 covering the electrodes 591 and 592, and adjacent electrodes 591.
594 is provided for electrically connecting the above.

In the adhesive layer 597, the substrate 590 is attached to the substrate 570 so that the touch sensor 595 overlaps the display unit 501.

The electrodes 591 and 592 are formed by using a conductive material having translucency. As the conductive material having translucency, conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide added with gallium can be used. A membrane containing graphene can also be used. The graphene-containing film can be formed by reducing, for example, a film-like film containing graphene oxide. Examples of the method of reduction include a method of applying heat.

After a conductive material having translucency is formed on the substrate 590 by a sputtering method, unnecessary parts are removed by various patterning techniques such as a photolithography method, and the electrode 59
1 and electrode 592 can be formed.

Examples of the material used for the insulating layer 593 include resins such as acrylic and epoxy.
In addition to the resin having a siloxane bond, an inorganic insulating material such as silicon oxide, silicon oxide nitride, or aluminum oxide can also be used.

Further, an opening reaching the electrode 591 is provided in the insulating layer 593, and the wiring 594 electrically connects the adjacent electrodes 591. Since the translucent conductive material can increase the aperture ratio of the touch panel, it can be suitably used for the wiring 594. Further, the electrode 591 and the electrode 59
A material having a higher conductivity than 2 can be suitably used for the wiring 594 because the electric resistance can be reduced.

One electrode 592 extends in one direction, and a plurality of electrodes 592 are provided in a stripe shape.

The wiring 594 is provided so as to intersect the electrode 592.

A pair of electrodes 591 are provided so as to sandwich one electrode 592, and the wiring 594 is a pair of electrodes 591.
Are electrically connected.

The plurality of electrodes 591 do not necessarily have to be arranged in a direction orthogonal to one electrode 592, and may be arranged so as to form an angle of less than 90 degrees.

One wire 598 is electrically connected to the electrode 591 or the electrode 592. A part of the wiring 598 functions as a terminal. As the wiring 598, for example, a metal material such as aluminum, gold, platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy material containing the metal material can be used. it can.

The touch sensor 595 can be protected by providing an insulating layer covering the insulating layer 593 and the wiring 594.

Further, the connection layer 599 electrically connects the wiring 598 and the FPC 509 (2).

The connecting layer 599 includes various anisotropic conductive films (ACF: Anisotropic).
Conducive Film) and anisotropic conductive paste (ACP: Anisotro)
picConductive Paste) and the like can be used.

The adhesive layer 597 is translucent. For example, a thermosetting resin or an ultraviolet curable resin can be used, and specifically, a resin such as acrylic, urethane, epoxy, or a resin having a siloxane bond can be used.

The display unit 501 includes a plurality of pixels arranged in a matrix. The pixel includes a display element and a pixel circuit for driving the display element.

In the present embodiment, a case where an organic EL element that emits white light is applied to the display element will be described, but the display element is not limited to this.

For example, an organic EL element having a different emission color may be applied to each sub-pixel so that the color of the light emitted to each sub-pixel is different.

The same configuration as that of the first configuration can be applied to the substrate 510, the substrate 570, and the sealing layer 560.

The pixel includes a sub-pixel 502R, and the sub-pixel 502R includes a light emitting module 580R.

The sub-pixel 502R includes a pixel circuit including a transistor 502t capable of supplying electric power to the first light emitting element 550R and the first light emitting element 550R. Further, the light emitting module 580R includes a first light emitting element 550R and an optical element (for example, a colored layer 567R).

The light emitting element 550R has an EL layer between the lower electrode, the upper electrode, and the lower electrode and the upper electrode.

The light emitting module 580R has a first colored layer 567R in the direction of extracting light.

When the sealing layer 560 is provided on the side from which light is taken out, the sealing layer 560 is in contact with the first light emitting element 550R and the first colored layer 567R.

The first colored layer 567R is located at a position overlapping the first light emitting element 550R. As a result, a part of the light emitted by the light emitting element 550R passes through the first colored layer 567R and is emitted to the outside of the light emitting module 580R in the direction of the arrow shown in the drawing.

The display unit 501 has a light-shielding layer 567BM in the direction of emitting light. The light-shielding layer 567BM is provided so as to surround the colored layer (for example, the first colored layer 567R).

The display unit 501 is provided with the antireflection layer 567p at a position overlapping the pixels. Anti-reflective layer 567
For example, a circular polarizing plate can be used as p.

The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 can be used as a layer for flattening the unevenness caused by the pixel circuit. Further, a laminated film including a layer capable of suppressing the diffusion of impurities can be applied to the insulating film 521. As a result, it is possible to suppress a decrease in reliability of the transistor 502t or the like due to unexpected diffusion of impurities.

The display unit 501 has a light emitting element (for example, the first light emitting element 550R) on the insulating film 521.

The display unit 501 has a partition wall 528 that overlaps the end of the first lower electrode on the insulating film 521. Further, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528.

The scanning line drive circuit 503g (1) includes a transistor 503t and a capacitance 503c. The drive circuit can be formed on the same substrate in the same process as the pixel circuit.

The display unit 501 includes a wiring 511 capable of supplying a signal, and the terminal 519 is a wiring 5
It is provided in 11. In addition, F which can supply signals such as an image signal and a synchronization signal
PC509 (1) is electrically connected to terminal 519.

A printed wiring board (PWB) may be attached to the FPC 509 (1).

The display unit 501 has wiring such as a scanning line, a signal line, and a power supply line. The various conductive films described above can be used for wiring.

In addition, various transistors can be applied to the display unit 501. 16 (A) and 16 (B) show the configuration when the bottom gate type transistor is applied to the display unit 501.

For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 502t and the transistor 503t shown in FIG. 16 (A).

For example, a semiconductor layer containing polycrystalline silicon crystallized by a treatment such as laser annealing can be applied to the transistor 502t and the transistor 503t shown in FIG. 16B.

Further, FIG. 16 shows a configuration when a top gate type transistor is applied to the display unit 501.
It is illustrated in (C).

For example, a semiconductor layer including a single crystal silicon film transferred from a polycrystalline silicon or a single crystal silicon substrate or the like is shown in FIG. 16C as a transistor 502t and a transistor 5
It can be applied to 03t.

By providing a light emitting element manufactured in the same step as the above-mentioned light emitting element (for example, the first light emitting element 550R or the like) in the non-display portion, it can be used as the light emitting element 22 illustrated in the first embodiment.

[Configuration Example 3]
FIG. 17 is a cross-sectional view of the touch panel 505B. The touch panel 505B described in the present embodiment is provided with a display unit 501 for displaying the supplied image information on the side where the transistor is provided, and a touch sensor is provided on the substrate 510 side of the display unit. , It is different from the touch panel 505 of the configuration example 2. Here, different configurations will be described in detail, and the above description will be incorporated where similar configurations can be used.

The first colored layer 567R is located at a position overlapping the first light emitting element 550R. In addition, FIG. 17 (
The light emitting element 550R shown in A) emits light to the side where the transistor 502t is provided. As a result, a part of the light emitted by the light emitting element 550R passes through the first colored layer 567R and is emitted to the outside of the light emitting module 580R in the direction of the arrow shown in the drawing.

The display unit 501 has a light-shielding layer 567BM in the direction of emitting light. The light-shielding layer 567BM is provided so as to surround the colored layer (for example, the first colored layer 567R).

The touch sensor 595 is provided on the substrate 510 side of the display unit 501 (FIG. 17 (A)).
).

The adhesive layer 597 is located between the substrate 510 and the substrate 590, and is a display unit 501 and a touch sensor 5.
Paste 95 together.

In addition, various transistors can be applied to the display unit 501. The configuration when the bottom gate type transistor is applied to the display unit 501 is shown in FIGS. 17A and 17B.

For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 502t and the transistor 503t shown in FIG. 17 (A).

For example, the transistor 5 in which the semiconductor layer containing polycrystalline silicon or the like is shown in FIG. 17 (B).
It can be applied to 02t and transistor 503t.

Further, FIG. 17 shows a configuration when a top gate type transistor is applied to the display unit 501.
It is illustrated in (C).

For example, FIG. 17 shows a semiconductor layer containing polycrystalline silicon, a transferred single crystal silicon film, or the like.
It can be applied to the transistor 502t and the transistor 503t shown in (C).

By providing a light emitting element manufactured in the same step as the above-mentioned light emitting element (for example, the first light emitting element 550R or the like) in the non-display portion, it can be used as the light emitting element 22 illustrated in the first embodiment.

This embodiment can be carried out in combination with at least a part thereof as appropriate with other embodiments described in the present specification.

(Embodiment 4)
In the present embodiment, an example of a touch panel driving method applicable to the display panel of the electronic device of one aspect of the present invention will be described with reference to the drawings.

[Example of sensor detection method]
FIG. 18A is a block diagram showing a configuration of a mutual capacitance type touch sensor. FIG. 18
In (A), the pulse voltage output circuit 601 and the current detection circuit 602 are shown. Note that FIG.
In (A), the electrode 621 to which the pulse voltage is applied and the electrode 622 to detect the change in the current are shown as six wirings of X1-X6 and Y1-Y6, respectively. Also shown in FIG.
A) illustrates the capacitance 603 formed by the superposition of the electrodes 121 and 122. The functions of the electrode 121 and the electrode 122 may be interchanged with each other.

The pulse voltage output circuit 601 is a circuit for sequentially applying pulses to the wirings of X1-X6. Electrode 1 forming a capacitance 603 by applying a pulse voltage to the wiring of X1-X6
An electric field is generated in 21 and the electrode 122. The electric field generated between the electrodes has a capacity of 60 due to shielding or the like.
By utilizing the fact that the mutual capacitance of 3 is changed, the proximity or contact of the object to be detected can be detected.

The current detection circuit 602 is a circuit for detecting a change in the current in the wirings of Y1 to Y6 due to a change in the mutual capacitance in the capacitance 603. In the wiring of Y1-Y6, there is no change in the current value detected when there is no proximity or contact of the detected object, but the current value when the mutual capacitance decreases due to the proximity or contact of the detected object to be detected. Detects a decreasing change. The current may be detected by using an integrator circuit or the like.

Next, FIG. 18B shows a timing chart of input / output waveforms in the mutual capacitance type touch sensor shown in FIG. 18A. In FIG. 18B, it is assumed that the detected object is detected in each matrix in one frame period. Further, in FIG. 18B, when the detected object is not detected (
Two cases are shown: non-touch) and detection of the object to be detected (touch). The wiring of Y1-Y6 shows a waveform with a voltage value corresponding to the detected current value.

A pulse voltage is sequentially applied to the wiring of X1-X6, and Y1- according to the pulse voltage.
The waveform in the Y6 wiring changes. X1-X6 when there is no proximity or contact with the object to be detected
The waveform of Y1-Y6 changes uniformly according to the change of the voltage of the wiring. On the other hand, since the current value decreases at the location where the object to be detected is close to or in contact with the object to be detected, the corresponding voltage value waveform also changes.

By detecting the change in mutual capacitance in this way, the proximity or contact of the object to be detected can be detected.

Further, although FIG. 18A shows the configuration of a passive type touch sensor in which only the capacity 603 is provided at the intersection of the wirings as the touch sensor, an active type touch sensor having a transistor and a capacity may be used. FIG. 19 shows an example of one sensor circuit included in the active touch sensor.

The sensor circuit has a capacitance 603, a transistor 611, a transistor 612, and a transistor 613. Transistor 613 is given a signal G2 to the gate, voltage VRES is given to one of the source or drain, and the other is electrically connected to one electrode of capacitance 603 and the gate of transistor 611. In transistor 611, one of the source and drain is electrically connected to one of the source and drain of transistor 612, and the voltage V is connected to the other.
SS is given. A signal G2 is given to the gate of the transistor 612, and the other of the source and the drain is electrically connected to the wiring ML. A voltage VSS is applied to the other electrode of capacitance 603.

Subsequently, the operation of the sensor circuit will be described. First, the transistor 613 as the signal G2
By giving the potential to turn on, the potential corresponding to the voltage VRES is given to the node n to which the gate of the transistor 611 is connected. Next, the potential for turning off the transistor 613 is given as the signal G2, so that the potential of the node n is maintained.

Subsequently, the potential of the node n changes from VRES as the mutual capacitance of the capacitance 603 changes due to the proximity or contact of the object to be detected such as a finger.

The read operation gives the signal G1 a potential to turn on the transistor 612. The current flowing through the transistor 611, that is, the current flowing through the wiring ML changes according to the potential of the node n. By detecting this current, the proximity or contact of the object to be detected can be detected.

As the transistor 611, the transistor 612, and the transistor 613, it is preferable to use a transistor in which an oxide semiconductor is applied to a semiconductor layer on which a channel is formed. In particular, by applying such a transistor to the transistor 613, it becomes possible to maintain the potential of the node n for a long period of time, and the operation of resupplying the VRES to the node n (
The frequency of refresh operation) can be reduced.

This embodiment can be carried out in combination with at least a part thereof as appropriate with other embodiments described in the present specification.

10 Electronic equipment 11a Support 11b Support 11c Support 11d Support 11e Support 12 Connection 12a Neutral line 13 Display panel 13_1 Display panel 13_1 Display panel 13a Display 13b Non-display 14 Detection means 15 FPC
16 Circuit board 17 Battery 18 Wiring 21 Light receiving element 22 Light emitting element 23 Light 24 Area 25 Area 31 Part 32 Part 33 Part 41 Input button 42 Power button 43 External connection terminal 44 Card slot 45 Optical sensor 46 Camera 47 Light source 48 Speaker 49 Microphone 51 Antenna 121 Electrode 122 Electrode 201 Fabrication board 203 Peeling layer 205 Peeling board 207 Peeling layer 230 Light emitting element 301 Display unit 302 pixel 302B Sub pixel 302G Sub pixel 302R Sub pixel 302t Transistor 303c Capacity 303g (1) Scanning line drive circuit 303g (2) Imaging pixel drive circuit 303s (1) Image signal line drive circuit 303s (2) Imaging signal line drive circuit 303t Transistor 304 Gate 308 Imaging pixel 308p Photoelectric conversion element 308t Transistor 309 FPC
311 Wiring 319 Terminal 321 Insulation layer 328 Partition 329 Spacer 350R Light emitting element 351R Lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Intermediate layer 360 Sealing layer 367BM Light shielding layer 367p Anti-reflection layer 367R Colored layer 380B Light emitting module 380R Light emitting module 390 Touch panel 501 Display unit 502R Sub-pixel 502t Transistor 503c Capacity 503g Scanning line drive circuit 503t Transistor 505 Touch panel 505B Touch panel 509 FPC
510 Substrate 510a Insulation layer 510b Flexible substrate 510c Adhesive layer 511 Wiring 519 Terminal 521 Insulation film 528 Partition 550R Light emitting element 560 Sealing layer 567BM Light shielding layer 567p Antireflection layer 567R Colored layer 570 Substrate 570a Insulation layer 570b Flexible substrate 570c Adhesive layer 580R Light emitting module 590 Board 591 Electrode 592 Electrode 593 Insulation layer 594 Wiring 595 Touch sensor 597 Adhesive layer 598 Wiring 599 Connection layer 601 Pulse voltage output circuit 602 Current detection circuit 603 Capacity 611 Transistor 612 Transistor 613 Transistor 621 Electrode 622 Electrode 801 Substrate 803 Board 804 Light emitting unit 806 Drive circuit unit 808 FPC
811 Adhesive layer 813 Insulation layer 814 Conductive layer 815 Insulation layer 816 Conductive layer 817 Insulation layer 817a Insulation layer 817b Insulation layer 820 Transistor 821 Insulation layer 822 Transistor 823 Sealing layer 824 Sealing layer 825 Connection body 827 Spacer 830 Light emitting element 831 Lower electrode 833 EL layer 835 Upper electrode 841 Adhesive layer 843 Insulation layer 845 Colored layer 847 Light-shielding layer 849 Overcoat 857 Conductive layer 857a Conductive layer 857b Conductive layer

Claims (5)

A display panel that is flexible and has the function of being bent so that the display surface is on the inside.
A first support and a second support having a function of supporting the display panel,
An electronic device having a hinge connecting the first support and the second support.
The hinge has a function of fixing the angle between the first support and the second support at a plurality of positions.
An electronic device having a function of switching the display of the display panel according to the angle. A display panel that is flexible and has the function of being bent so that the display surface is on the inside.
A first support and a second support having a function of supporting the display panel,
An electronic device having a hinge connecting the first support and the second support.
The hinge has a function of fixing the first support and the second support in a state where the display surface is curved.
An electronic device having a function of switching the display of the display panel according to an angle between the first support and the second support. A display panel that is flexible and has the function of being bent so that the display surface is on the inside.
A first support and a second support having a function of supporting the display panel,
An electronic device having a hinge connecting the first support and the second support.
The hinge has a function of fixing the angle between the first support and the second support at a plurality of positions.
An electronic device having a function of switching the display of the display panel according to the angle and a function of stopping the display of the display panel when the display panel is folded. A display panel that is flexible and has the function of being bent so that the display surface is on the inside.
A first support and a second support having a function of supporting the display panel,
An electronic device having a hinge connecting the first support and the second support.
The hinge has a function of fixing the first support and the second support in a state where the display surface is curved.
A function of switching the display of the display panel according to an angle between the first support and the second support, and a function of stopping the display of the display panel when the display panel is folded. Electronic equipment to have. In any one of claims 1 to 4,
An electronic device having a magnet having a function of fixing the first support and the second support.

Images