JP2022001944A - Electronic apparatus - Google Patents

Abstract

To suppress a sense of separation in display of a display device, and to reduce power consumption of the display device.SOLUTION: An electronic apparatus comprises a display unit having flexibility, the display unit has a bent part, and the bent part is positioned in a region other than a center of the display unit. When the display unit is bent by the bent part, a first area of the display unit cannot be visually recognized from an outside, and a second area can be visually recognized. And, when a region having light transmissivity is provided and the display unit is bent by the bent part, a part of the display unit may be visually recognizable from the outside.SELECTED DRAWING: Figure 1

Description

The present invention relates to a product, a method, or a manufacturing method. Alternatively, the invention relates to a process, machine, manufacture, or composition (composition of matter). In particular, the present invention relates to, for example, a semiconductor device, a display device, a light emitting device, a lighting device, a power storage device, a method for driving them, or a method for manufacturing them. In particular, one aspect of the present invention relates to a display device, an electronic device, or a method for manufacturing the same. In particular, one aspect of the present invention relates to a display device, an electronic device, or a method for manufacturing the same, which utilizes an electroluminescence (hereinafter also referred to as EL) phenomenon.

In recent years, display devices are expected to be applied to various applications, and diversification is required. For example, display devices for mobile device applications are required to be small, thin, lightweight, and the like. On the other hand, it is desired that the display device has a large screen (the display area is wide), and it is also required to reduce the area of the display device other than the display area (so-called narrow frame).

Further, a light emitting element (also referred to as an EL element) utilizing the EL phenomenon is easy to be thin and lightweight.
It has features such as being able to respond to input signals at high speed and being able to be driven using a DC low voltage power supply, and its application to display devices is being studied.

For example, Patent Document 1 discloses a portable communication device having a display inside each of a foldable front panel and a main body. By configuring the front panel and the main body so that one side of each display comes into contact with each other, it is a portable communication device that achieves both a large screen size of the display and a miniaturization and weight reduction of the device itself.

Japanese Unexamined Patent Publication No. 2000-184026

However, since each display has a non-display area so as to surround the display area, Patent Document 1
In this configuration, there is a non-display area at the joint between the two displays and in the vicinity thereof. The wider the non-display area, the more one image displayed by a plurality of displays is visually recognized as separated by the viewer (the display also has a sense of separation).

Therefore, one aspect of the present invention is to provide a display device or an electronic device in which a feeling of separation of display is suppressed. Alternatively, one aspect of the present invention is intended to provide a small display device or electronic device. Alternatively, one aspect of the present invention is to provide a lightweight display device or electronic device. Alternatively, one aspect of the present invention is to provide a display device or an electronic device having a narrow frame. Alternatively, one aspect of the present invention is to provide a display device or an electronic device that is not easily damaged. Another aspect of the present invention is to provide a display device or an electronic device having reduced power consumption. Alternatively, one aspect of the present invention is intended to provide a new display device or electronic device.

The description of these issues does not preclude the existence of other issues. It should be noted that one aspect of the present invention does not necessarily have to solve all of these problems. Issues other than these are self-evident from the description of the description, drawings, claims, etc., and it is possible to extract problems other than these from the description of the specification, drawings, claims, etc. Is.

One aspect of the present invention has a flexible display. The display portion has a bent portion. The bent portion is located in a region other than the center of the display portion. The display portion may have a plurality of bent portions.
When having a plurality of bent portions, at least one of the bent portions is located in a region other than the center of the display portion.

Further, one aspect of the present invention has a flexible display portion and a translucent region. The display portion has a bent portion. When the display unit is bent, a part of the display unit can be visually recognized from the outside through the translucent region. The region having translucency may have an opening or a member having translucency, and may have other functions. For example, it may have functions such as a touch panel and a keyboard.

Further, one aspect of the present invention includes a housing, a flexible display unit, and a winding unit. The display unit is connected to the take-up unit, and the take-up unit has a function of winding up and storing a part of the display unit.

Further, one aspect of the present invention has a flexible display unit. The display unit has a first area and a second area.
Has an area of. Even when the first area is stored so that it cannot be seen from the outside
The second area is visible from the outside. Therefore, the second area can be used as a sub-display.

In the above configuration, the method of storing the first area of the display unit so that it cannot be visually recognized from the outside is
It may be a method of winding up the first region or a method of folding it. Further, it may be stored inside the housing.

Further, in each of the above configurations, the second area of the display unit may have other functions in addition to the function as the sub-display. For example, it may have functions such as a touch panel and a keyboard.

Further, in each of the above configurations, the second region may be protected by a translucent member so that the surface is not exposed.

The display unit may have flexibility, and may have, for example, an electroluminescence element. Further, it may be configured to have a transistor. The transistor may be a transistor using silicon or a transistor using an oxide semiconductor. As the oxide semiconductor, an oxide containing any one of indium, gallium, and zinc can be used.

In one aspect of the present invention, it is possible to provide a display device or an electronic device in which the feeling of separation of the display is suppressed. Alternatively, in one aspect of the present invention, a small display device or electronic device can be provided. Alternatively, in one aspect of the present invention, a lightweight display device or electronic device can be provided. Alternatively, in one aspect of the present invention, a display device or an electronic device having a narrow frame can be provided. Alternatively, in one aspect of the present invention, it is possible to provide a display device or an electronic device that is not easily damaged. Alternatively, in one aspect of the present invention, it is possible to provide a display device or an electronic device having reduced power consumption. Alternatively, in one aspect of the present invention, a novel display device or electronic device can be provided.

The description of these effects does not preclude the existence of other effects. It should be noted that one aspect of the present invention does not necessarily have to have all of these effects. It should be noted that the effects other than these are self-evident from the description of the description, drawings, claims, etc., and it is possible to extract the effects other than these from the description of the description, drawings, claims, etc. Is.

The figure which shows an example of the electronic device. The figure which shows an example of the electronic device. The figure which shows an example of the electronic device. The figure which shows an example of the electronic device. The figure which shows an example of the electronic device. The figure which shows an example of the electronic device. The figure which shows an example of the electronic device. The figure which shows an example of the electronic device. The figure which shows an example of the display device. The figure which shows an example of the display device. The figure which shows an example of the display device. The figure which shows an example of the display device. The figure which shows an example of the display device. The figure which shows an example of the display device. The figure which shows an example of the display device. The figure which shows an example of the display device. The figure which shows an example of the display device. The figure which shows an example of the electronic device. The figure which shows an example of the electronic device. The figure which shows an example of the electronic device.

The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that the form and details of the present invention can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention is not construed as being limited to the description of the embodiments shown below.

In the configuration of the invention described below, the same reference numerals are commonly used between different drawings for the same parts or parts having similar functions, and the repeated description thereof will be omitted. Further, when referring to the same function, the hatch pattern may be the same and no particular reference numeral may be added.

Further, the position, size, range, etc. of each configuration shown in the drawings and the like may not represent the actual position, size, range, etc. for the sake of easy understanding. Therefore, the disclosed invention is not necessarily limited to the position, size, range, etc. disclosed in the drawings and the like.

(Embodiment 1)
In the present embodiment, the electronic device to which one aspect of the present invention is applied will be described with reference to FIGS. 1 and 2.

Examples of electronic devices include television devices (also referred to as televisions or television receivers), computers, digital cameras, digital video cameras, digital photo frames, mobile phones (also referred to as mobile phones and mobile phone devices), and portable types. Examples include large game machines such as game machines, mobile information terminals, sound reproduction devices, and pachinko machines.

These electronic devices may include an operation button, an external connection port, a speaker, a microphone, and the like, in addition to the display unit shown below. Further, by providing a touch panel or a sensor on the display unit, information can be input by touching or holding a finger on the display unit. It is also possible to switch the power ON / OFF operation, the type of the image displayed on the display unit, the volume, and the like by operating the operation buttons.

The electronic device of this embodiment has a highly flexible display unit. The electronic device of this embodiment is
It can be folded by bending the highly flexible display unit. The electronic device of the present embodiment has excellent portability in the folded state, and has excellent display listability due to a wide seamless display area in the unfolded state.

Further, when the electronic device of the present embodiment is not used, by bending the display surface so that the display surface is inward, it is possible to prevent the display surface from being scratched or soiled.

In the following, a foldable electronic device having a region having high flexibility and a region having low flexibility will be described as an example. The highly flexible region is a portion that can be bent and can be bent (hereinafter, also referred to as a bent portion).

In the electronic device of the present embodiment, the highly flexible region can be bent by either inward bending or outward bending.

In the present specification, the case of bending so that the display surface of the display unit is inside is referred to as "inward bending", and the case of bending so that the display surface of the display unit is outward is described as "outward bending". Further, the display surface in an electronic device or a display device refers to a surface on which the user visually recognizes the display unit.

1 (A) and 2 (A) are a plan view of an electronic device when the display unit is expanded, and FIG. 1 (B) is a plan view of the electronic device when the display unit is folded. .. FIG. 1 (C) is shown in FIG.
This is an example of a side view of the electronic device when the display unit shown in (B) is folded, as viewed from the direction of the arrow. 2 (B) and 2 (C) are examples of side views when the electronic device shown in FIG. 2 (A) is viewed from the direction of the arrow, and FIG. 2 (D) is an example of FIG. 2 (A). It is an example of the cross-sectional view between the alternate long and short dash lines AB in.

The electronic device shown in FIG. 1A has a highly flexible region E1, a less flexible region E2, and a less flexible region E3, and has a highly flexible region and a flexible region. Each low area is banded (striped)
It is provided in. In the present embodiment, a plurality of highly flexible regions and a plurality of inflexible regions are shown to be parallel to each other, but the regions may not be arranged in parallel.

In the electronic device shown in FIG. 1, the highly flexible region E1 is located in a region other than the center of the display unit. That is, the width of the low flexibility region E2 is smaller than the width of the low flexibility region E3 (E3).
> E2). Further, the configuration is not limited to the configuration shown in FIG. 1, and the width of the low flexibility region E2 may be larger than the width of the low flexibility region E3 (E2> E3).

In the electronic device shown in FIG. 1, the portion included in the highly flexible region E1 of the display portion can function as a bent portion. When the electronic device shown in FIG. 1 (A) is bent in the highly flexible region E1, a part of the display portion located in the low flexibility region E3 is flexible as shown in FIG. 1 (B). It overlaps with the less flexible region E2, but the other part does not overlap with the less flexible region E2 and is exposed. That is, in the folded state, a part of the display unit cannot be visually recognized from the outside, and the other part can be visually recognized. Therefore, even in the folded state, a part of the visible display unit can be used as a sub-display. The sub-display can be provided with a function to display a clock display or an incoming call display such as an e-mail or a telephone.

By using a part of the display unit as a sub-display, it is not necessary to separately provide a sub-display. Therefore, the manufacturing process can be simplified and the cost can be reduced.

Further, by using a part of the display unit as a sub-display, it is not necessary to use the entire display area in order to obtain a part of the information. Therefore, the power consumption of the display unit can be reduced as compared with the case where the entire display unit is used. That is, the power consumption of the electronic device can be suppressed by hiding the display area that is folded and invisible to the user.

In the case of a display device having a main display and a sub-display independently, the sub-display often has a lower definition than the main display from the viewpoint of simplifying the manufacturing process and reducing the cost. On the other hand, in one aspect of the present invention, a part of the main display can be used as a sub display. Therefore, even when using the sub-display, the display can be viewed with the same definition as the main display.

Therefore, in one aspect of the present invention, it is preferable to use a high-definition display device for the display unit. By applying one aspect of the present invention, a part of the main display area composed of this high-definition display device can be used as a sub-display. A high-definition sub-display can be obtained without increasing the manufacturing process and cost.

The electronic device of this embodiment has a flexible display unit. The display unit may have flexibility, and various display devices can be used. The display device is, for example, an EL element (EL element containing organic and inorganic substances, an organic EL element, an inorganic EL element), an LED (white LED, a red LED, a green LED, a blue LED, etc.), and a transistor (light emitting according to a current). Transistor), electron emitting element, liquid crystal element, electronic ink, electrophoresis element, grating light valve (GLV), plasma display (PDP), display element using MEMS (micro electro mechanical system), digital micro mirror device (DMD
), DMS (Digital Micro Shutter), Interferometric Modulation (IMOD) element, Shutter type MEMS display element, Optical interference type MEMS display element, Electrowetting element, piezoelectric ceramic display, Display element using carbon nanotubes, etc. Have at least one of. In addition to these, a display medium whose contrast, brightness, reflectance, transmittance and the like are changed by an electric or magnetic action may be provided. As an example of a display device using an electron emitting element, a field emission display (FED) or an SED type planar display (SED: Surface Conduction Electro)
n-emitter Display) and the like. Further, as an example of a display device using a liquid crystal element, a liquid crystal display (transmissive liquid crystal display, semi-transmissive liquid crystal display, reflective liquid crystal display, direct-view liquid crystal display, projection type liquid crystal display) and the like can be mentioned. In addition, electronic ink, powder fluid that operates electronically, electronic paper, which is an example of a display device using an electrophoretic element, and the like can be mentioned. In the case of realizing a semi-transmissive liquid crystal display or a reflective liquid crystal display, a part or all of the pixel electrodes may have a function as a reflective electrode. For example, a part or all of the pixel electrodes may have aluminum, silver, or the like. Further, in that case, it is also possible to provide a storage circuit such as SRAM under the reflective electrode. Thereby, the power consumption can be further reduced.

Among them, a display device using an organic EL element is preferable because it has high flexibility and impact resistance and can be made thin and lightweight. By using a display device using an organic EL element for the display unit, for example, it can be bent with a radius of curvature of 1 mm or more and 100 mm or less.
It can be suitably used for electronic devices that can be folded once or more by inward bending or outward bending.

In the present embodiment, the highly flexible region E1 in the electronic device may have at least a flexible display device. In FIG. 1, the highly flexible region E1 has a display device 11. Further, as shown in FIG. 2D, the display device 11 has a display area 11a and a display area 11a.
It may have a non-display area 11b. As the display device 11, for example, a display device using an organic EL element is preferable because it can be made thin and lightweight in addition to high flexibility and impact resistance.

The low-flexibility regions E2 and E3 in an electronic device have at least a flexible display device and a support having a lower flexibility than the display device.

The electronic devices shown in FIGS. 1 and 2 (A), (B), and (D) are the support 15a and the support 1.
Has 5b. The supports 15a and 15b are less flexible than the display device 11. Support 1
5a and 15b are separated from each other.

The support may be provided on at least one of the display surface side and the side opposite to the display surface of the display device, but as shown in FIGS. 1 and 2, the support 15a is provided on the display surface side of the display device 11. If the support 15b is provided on the side opposite to the display surface, the display device can be sandwiched between the pair of supports, so that the mechanical strength in the low flexibility region is increased and the electronic device is less likely to be damaged, which is preferable.

Further, instead of the supports 15a and 15b, the support 15 shown in FIG. 2C is used to support the support 1.
The display device 11 may be arranged between the five.

It is preferable to have the support only on either the display surface side or the side opposite to the display surface of the display device 11, because the electronic device can be made thinner or lighter. For example, it may be an electronic device having only the support 15b without using the support 15a.

It is preferable that the highly flexible region E1 and the less flexible regions E2 and E3 have the display device and the protective layer having a higher flexibility than the support in an overlapping manner. As a result, the highly flexible region E1 of the electronic device becomes a region having flexibility and high mechanical strength, and the electronic device can be made less likely to be damaged. Even in a highly flexible region, the electronic device can be configured to be hard to break due to deformation due to an external force or the like.

In FIG. 1, the display device 11 has a surface opposite to the display surface protected by the protective layer 13.

The thickness of each of the display device 11, the supports 15a and 15b, and the protective layer 13 is preferably such that the support is the thickest and the display device is the thinnest. Further, as for the flexibility of each of the display device 11, the support 15a, and the protective layer 13, for example, it is preferable that the support 15a and 15b have the lowest flexibility and the display device 11 has the highest flexibility. With such a configuration, the difference in flexibility between the highly flexible region E1 and the less flexible regions E2 and E3 becomes large, and the region can be reliably bent in the highly flexible region. Can be. As a result, bending can be suppressed in the region E2 or E3 having low flexibility, and the reliability of the electronic device can be improved. In addition, it is possible to suppress deterioration of the design of the electronic device in the folded state.

If the display device 11 has a protective layer on both the display surface side and the side opposite to the display surface, the display device can be sandwiched by the pair of protective layers, so that the mechanical strength of the electronic device is increased and the electronic device is less likely to be damaged. It is preferable.

For example, as shown in FIG. 2B, in the low flexibility regions E2 and E3, the pair of protective layers 13a and 13b are located between the pair of supports 15a and 15b, and the display device 11 is paired. It is preferably located between the protective layers 13a and 13b.

Alternatively, as shown in FIG. 2C, in the low flexibility regions E2 and E3, the pair of protective layers 13a and 13b are located between the supports 15, and the display device 11 is the pair of protective layers 13a. 13b
It is preferably located between.

It is preferable to have the protective layer only on one of the display surface side and the side opposite to the display surface of the display device, because the electronic device can be made thinner or lighter. For example, it may be an electronic device having only the protective layer 13b without using the protective layer 13a.

Further, when the protective layer 13a on the display surface side of the display device is a light-shielding film, it is possible to suppress the irradiation of the non-display area of the display device with external light. This is preferable because it can suppress photodegradation of transistors and the like included in the drive circuit included in the non-display region.

As shown in FIG. 2D, the opening of the protective layer 13a provided on the display surface side of the display device 11 overlaps with the display area 11a of the display device. Further, the non-display area 11 that surrounds the display area 11a in a frame shape.
b and the protective layer 13a are provided so as to overlap each other. The protective layer 13b provided on the side opposite to the display surface of the display device 11 overlaps the display area 11a and the non-display area 11b. The protective layer 13b is provided so as to be in contact with the surface opposite to the display surface of the display device 11 in a wider range than the protective layer 13a, and particularly preferably to be in contact with the entire surface opposite to the display surface of the display device 11. Therefore, the display device can be protected more reliably, and the reliability of the electronic device can be improved.

The protective layer and the support can be formed by using plastic, metal, alloy, rubber or the like. By using plastic, rubber, etc., it is possible to obtain a protective layer and support that are lightweight and resistant to damage.
preferable. For example, silicone rubber may be used as the protective layer, and stainless steel or aluminum may be used as the support.

Further, it is preferable to use a material having high toughness for the protective layer and the support. This makes it possible to realize an electronic device having excellent impact resistance and being hard to be damaged. For example, by using an organic resin, a thin metal material, or an alloy material, it is possible to realize an electronic device that is lightweight and is not easily damaged. note that,
For the same reason, it is preferable to use a material having high toughness for the substrate constituting the display device.

The protective layer or support located on the display surface side does not have to be translucent as long as the display areas of the display devices do not overlap. When the protective layer or support located on the display surface side overlaps with at least a part of the display area, it is preferable to use a material that transmits the display from the display device. The translucency of the protective layer or support located on the side opposite to the display surface of the display device does not matter.

Various adhesives can be used to bond any two of the protective layer, support, and display device. For example, a curable resin that cures at room temperature, such as a two-component mixed resin, and a photocurable resin. Resins such as resins and thermosetting resins can be used. Further, a sheet-shaped adhesive may be used. Further, each configuration of the electronic device may be fixed by using a screw penetrating any two or more of the protective layer, the support, and the display device, a pin to be held, a clip, and the like.

The electronic device of the present embodiment may have a sensor for determining whether or not the highly flexible region is bent. For example, it can be configured by using a switch, a MEMS pressure sensor, a pressure sensitive sensor, or the like.

The protective layer 13 may be provided at a plurality of locations. As an example, FIG. 18A shows an example in which two protective layers 13 are provided. In this case, the display device 11 can be made visible by the bending method as shown in FIG. 18 (B). Further, FIG. 18
The display device 11 can be hidden by the folding method shown in (C). Thereby, the display device 11 can be protected. By changing the bending place in this way, a plurality of functions can be realized.

Also, if the display device is completely fixed by the protective layer or support, when bending the electronic device,
The display device may be pulled and the display device may be damaged. Further, when the electronic device is deployed, a force is applied in the direction in which the display device contracts, and the display device may be damaged. It is preferable that the electronic device of the present embodiment is a protective layer or a support, and the display device is not completely fixed. As a result, the display device slides when the electronic device is bent or unfolded, so that the position of the display device with respect to the protective layer or the support changes. Therefore, a force is applied to the display device, and it is possible to prevent the display device from being damaged.

This embodiment can be appropriately combined with other embodiments.

(Embodiment 2)
In the present embodiment, the electronic device of one aspect of the present invention will be described with reference to FIG.

The electronic device shown in FIG. 3 is an electronic device provided with a translucent region 17. The translucent region is formed by using a translucent member.

The electronic device shown in FIG. 3 has a region E1 having a high flexibility, a region E2 having a low flexibility, a region E3 having a low flexibility, and a region E4 including a region 17 having a translucency. It has a highly flexible region E1 in the center. That is, the sum of the width of the low flexibility region E2 and the width of the region E4 including the translucent region 17 is substantially the same as the width of the low flexibility region E3.

In the electronic device shown in FIG. 3, the portion included in the highly flexible region E1 of the display device 11 can function as a bent portion. When the electronic device shown in FIG. 3A is bent in the highly flexible region E1, as shown in FIG. 3B, the translucent region 17 and the display region 11a of the display unit overlap. Therefore, the user can visually recognize a part of the display area 11a of the display unit via the translucent area 17. Therefore, even when the electronic device is folded, a part of the display unit that can be visually recognized through the translucent region 17 can be used as a sub-display.

As shown in FIG. 3B, in the folded state of the electronic device, the display unit is protected by a translucent member. Therefore, since it is possible to prevent the display surface from being exposed, it is possible to alleviate an external impact on the display surface and suppress scratches and stains.

The translucent region 17 may be configured to have an opening or a translucent member. In the case of a configuration having a member having translucency, it is preferable because the surface of the display portion is protected from being exposed. Further, the translucent region 17 may have other functions. For example, it may have functions such as a touch panel and a keyboard. When the translucent area 17 has a function of a touch panel, a keyboard, or the like, a button, a keyboard, or the like can be displayed on a part of a display unit that functions as a sub-display.

Further, the shape of the region 17 having translucency is not particularly limited. Although the case of a substantially quadrangle is shown in FIG. 3, it may be a circle or a polygon. Also, the supports 15a and 15b
May be formed of a translucent material so that the entire low flexibility region is translucent.

The translucent region 17 can be arranged in various sizes. As an example,
19 (A), 19 (B), and 19 (C) show examples of electronic devices when the area of the translucent region 17 is smaller than that of FIG. Since the translucent region 17 is small, for example, an operation button 31 or an image sensor 32 can be arranged in the region E4 including the translucent region 17.

Alternatively, the configuration shown in one drawing and the configuration shown in another drawing may be combined to form an electronic device having a new configuration. For example, an example in which FIG. 1 and FIG. 3 are combined is shown in FIG. 20 (A).
), FIG. 20 (B), and FIG. 20 (C).

This embodiment can be appropriately combined with other embodiments.

(Embodiment 3)
In the present embodiment, the electronic device of one aspect of the present invention will be described with reference to FIGS. 4 to 6.
In this embodiment, an electronic device provided with a plurality of highly flexible regions will be described.

By providing a plurality of highly flexible regions, it is possible to bend a plurality of times. for that reason,
When having a display unit of the same size, it is possible to fold a plurality of times rather than to fold the display unit once, which makes the electronic device more compact when folded, and a more portable electronic device can be obtained. In addition, if the electronic device has the same size when folded, the display unit that can be folded more times becomes a larger display unit in the unfolded state, so that the electronic device has better visibility. You can get the equipment.

4 to 6 show an example of an electronic device provided with a plurality of highly flexible regions. In FIG. 4,
An example in which four highly flexible regions E1 are provided is shown. The electronic device shown in FIG. 4 (A) is shown in FIG. 4 (C).
As shown in, by folding in the highly flexible region E1, it can be folded like a folding screen. At this time, as shown in FIG. 4B, only a part of the display unit can be visually recognized by the user. In the electronic device shown in FIG. 4A, since the width of the low flexibility region E2 is substantially the same (substantially uniform), it can be folded to be substantially equal to the width of E2, and is in an unfolded state. It can be about one-fifth wide.

Further, FIG. 5 shows an example in which three highly flexible regions E1 are provided. The electronic device shown in FIG. 5 (A) can be folded like a folding screen as shown in FIG. 5 (C) by bending in the highly flexible region E1. As a result, in the state shown in FIG. 5B, a part of the display unit can be visually recognized through the translucent region 17.

The number of highly flexible regions is not particularly limited and may be two or five or more.

Further, although FIGS. 4 and 5 show an example of folding in a folding screen shape, the folding method is not limited to the folding screen shape. It may be bent by various methods.

Further, the number of times of bending is not particularly limited. In an electronic device having a plurality of highly flexible regions E1, it is not always necessary to fold the electronic device using all the highly flexible regions E1. For example, the electronic device shown in FIG. 6 (A) has seven highly flexible regions E1. Figure 6
(B) is an example of bending once in any highly flexible region E1 and is shown in FIG. 6 (C).
Is an example in which the display device 11 is bent once so as to be hidden, and FIG. 6D is an example in which the display device 11 is bent four times.

By providing a plurality of highly flexible regions E1 in the electronic device, any highly flexible region E1 can be provided.
In 1, it becomes possible to bend the electronic device. Therefore, the shape of the folded electronic device can be made into a desired shape. In addition, the size of the folded state can be set to a desired size. That is, the electronic device can be folded according to the size and shape of the bag or pocket to be stored.

By providing a plurality of highly flexible regions E1, in a folded state of the electronic device,
The size of the display unit exposed to the outside or the position where the display unit is exposed can be adjusted. Therefore, it is possible to set a sub-display of a size desired by the user. Further, by providing a plurality of highly flexible regions E1, it is possible to set a sub-display having a desired arrangement. For example, right-handed and left-handed people have different arrangements of easy-to-use sub-displays, but by providing multiple highly flexible areas E1, there are also requests for arrangements that are easy for right-handed people and left-handed people. I can respond.

By providing a plurality of highly flexible regions E1, the bending location can be changed, so that the damage caused by the bending can be dispersed and the reliability of the electronic device can be improved.

4 to 6 show a case where the widths of the plurality of low-flexibility regions are substantially the same (substantially equal), but as shown in FIG. 1, the widths of the low-flexibility regions are each. It may be different.
Further, although FIG. 6 shows an example of having no translucent region, a translucent region may be provided.

This embodiment can be appropriately combined with other embodiments.

(Embodiment 4)
In the present embodiment, the electronic device of one aspect of the present invention will be described with reference to FIG. 7. In this embodiment, an electronic device having a wide region with high flexibility will be described. By providing a wide region of high flexibility, it is possible to bend the region of high flexibility at a desired position.

FIG. 7 shows an electronic device when the width of the highly flexible region E1 is wider than that of the less flexible region E2.

FIG. 7A is a plan view of the electronic device in an unfolded state, and FIG. 7B is a plan view in a state of being folded a plurality of times. FIG. 7 (C) shows a state in which a plurality of folds are folded, but FIG. 7 (B) shows.
FIG. 7 (D) is a plan view when the number of times of folding is smaller than that in the state shown in FIG. 7 (D), and FIG. 7 (D) is a plan view when folded once.

As described above, since the electronic device shown in FIG. 7 has a wide region E1 having high flexibility, it can be bent at an arbitrary position in the region E1 having high flexibility. Therefore, the bending position and the number of times of bending can be freely set. By freely setting the bending position and the number of times of bending, it is possible to freely set the size and arrangement of a part of the display unit that can be visually recognized by the user in the folded state. In addition, the shape and size of the folded state can be freely set.

Further, since the bending place can be changed by providing the highly flexible region E1 widely, the damage given to the electronic device by bending can be dispersed, and the reliability of the electronic device can be improved. Can be done.

Although FIG. 7 shows an example of having no translucent region, a translucent region may be provided.

This embodiment can be appropriately combined with other embodiments.

(Embodiment 5)
In the present embodiment, the electronic device of one aspect of the present invention will be described with reference to FIG. In the first to fourth embodiments, the mode in which the display unit is folded has been described, but in the present embodiment, the mode in which the display unit is wound up will be described.

The electronic device shown in the present embodiment has a display unit and a winding unit. The display is flexible. The take-up part winds up a part of the display part (first region 11c) (roll up).
, Reel), has the function of storing.

The electronic device shown in FIG. 8 has a housing 10, a display device 11, a winding unit 16, and a fixing unit 19. Further, the operation button 21 may be provided. The display device 11 has a first region 11c and a second region 11c.
Has a region of 11d. Further, a member 20 may be provided at the end of the second region 11d, and a member 18 may be provided at the boundary between the first region 11c and the second region 11d of the display unit.

FIG. 8 (A) is a perspective view in a state where the display unit is expanded, and FIG. 8 (B) is a perspective view in a state in which a part (first region 11c) of the display unit is wound up. C) is the second area 11d of the display unit.
It is a side view of the state which was wound around the outside of a housing.

When the display unit is stored, as shown in FIG. 8B, a part of the display unit (first region 11c) is wound and stored by the winding unit 16. The part that was not stored (second area 11)
As shown in FIG. 8C, d) is wound around the outside of the housing 10 and fixed by the fixing portion 19.
Even when the display unit is housed and brought into a state of excellent portability, a part of the display unit (second area 11d) located on the outside of the housing 10 can be visually recognized by the user. That is, it can be used as a sub-display.

As shown in FIG. 8, the boundary separating the first region 11c and the second region 11d of the display unit is as shown in FIG.
The member 18 can be provided. The member 18 has a function of preventing the second region 11d from being wound around the winding portion 16. The member 18 may not be provided. When the member 18 is not provided, since there is no boundary between the first region 11c and the second region 11d, the display unit has excellent visibility, and the display unit can be a display unit in which the feeling of separation of the display is suppressed. ..

Further, as shown in FIG. 8, the fixing portion 19 may have a function of fixing the second region 11d when the second region 11d is wound around the outside of the housing 10. The length that can be fixed may be adjusted according to the length of the region 11d. Further, the fixing portion 19 may also have a function of fixing the housing at an arbitrary position. For example, the fixing portion 19 may have a function of fixing the electronic device shown in the present embodiment to a pocket or the like.

It is preferable to provide the member 20 at the end of the display portion (the end of the second region 11d). Member 20
Can be easily fixed by the fixing portion 19.

As shown in the present embodiment, by providing the winding portion, it is possible to suppress damage caused by bending of the display portion. Further, since it is possible to suppress bending of the display unit at an acute angle, the effect of improving the reliability of the display unit can be obtained.

This embodiment can be appropriately combined with other embodiments.

(Embodiment 6)
In the present embodiment, an example of a display panel that can be used for the display unit of the display device according to one aspect of the present invention is shown. In the present embodiment, as an example of the display panel, a light emitting device having flexibility using an organic EL element is shown, but one aspect of the present invention is not limited to this.

<Structure Example 1-1>
9 (A) shows a plan view of the light emitting device, and FIG. 9 (B) shows the alternate long and short dash line X1-Y1 of FIG. 9 (A).
The cross-sectional view between them is shown. The light emitting device shown in FIG. 9B is a top emission type light emitting device using a separate painting method.

The light emitting device shown in FIG. 9A includes a light emitting unit 491, a drive circuit unit 493, and an FPC (Flexib).
It has a printed Circuit) 495. The organic EL elements and transistors included in the light emitting unit 491 and the drive circuit unit 493 are the flexible substrate 420, the flexible substrate 428, and the flexible substrate 428.
And is sealed by an adhesive layer 407.

The light emitting device shown in FIG. 9B includes a flexible substrate 420, an adhesive layer 422, an insulating layer 424, a transistor 455, an insulating layer 463, an insulating layer 465, an insulating layer 405, and an organic EL element 450 (lower electrode 401, EL). Layer 402, top electrode 403), adhesive layer 407, flexible substrate 428,
And has a conductive layer 457. The flexible substrate 428, the adhesive layer 407, and the upper electrode 403 transmit visible light.

In the light emitting unit 491 of the light emitting device shown in FIG. 9B, the transistor 455 and the organic EL element 450 are provided on the flexible substrate 420 via the adhesive layer 422 and the insulating layer 424. The organic EL element 450 includes a lower electrode 401 on the insulating layer 465 and an EL layer 4 on the lower electrode 401.
It has 02 and an upper electrode 403 on the EL layer 402. The lower electrode 401 is electrically connected to the source electrode or drain electrode of the transistor 455. The lower electrode 401 preferably reflects visible light. The end of the lower electrode 401 is covered with an insulating layer 405.

The drive circuit unit 493 has a plurality of transistors. FIG. 9B shows one of the transistors included in the drive circuit unit 493.

The conductive layer 457 is electrically connected to an external input terminal for transmitting an external signal (video signal, clock signal, start signal, reset signal, etc.) or potential to the drive circuit unit 493. Here, an example in which FPC495 is provided as an external input terminal is shown.

In order to prevent an increase in the number of steps, it is preferable that the conductive layer 457 is made of the same material as the electrodes and wiring used for the light emitting portion and the drive circuit portion, and is manufactured in the same process. Here, an example in which the conductive layer 457 is made of the same material as the source electrode and drain electrode of the transistor and in the same process is shown.

The insulating layer 463 has an effect of suppressing the diffusion of impurities into the semiconductor constituting the transistor. Further, for the insulating layer 465, it is preferable to select an insulating film having a flattening function in order to reduce the surface unevenness caused by the transistor.

<Structure Example 1-2>
9 (A) shows a plan view of the light emitting device, and FIG. 9 (C) shows the alternate long and short dash line X1-Y1 of FIG. 9 (A).
The cross-sectional view between them is shown. The light emitting device shown in FIG. 9C is a bottom emission type light emitting device using a color filter method.

The light emitting device shown in FIG. 9C has a flexible substrate 420, an adhesive layer 422, an insulating layer 424, a transistor 454, a transistor 455, an insulating layer 463, a colored layer 432, an insulating layer 465, a conductive layer 435, and an insulating layer 467. It has an insulating layer 405, an organic EL element 450 (lower electrode 401, EL layer 402, and upper electrode 403), an adhesive layer 407, a flexible substrate 428, and a conductive layer 457. Flexible substrate 420, adhesive layer 422, insulating layer 424, insulating layer 463, insulating layer 465
, The insulating layer 467, and the lower electrode 401 transmit visible light.

In the light emitting unit 491 of the light emitting device shown in FIG. 9C, a switching transistor 454, a current control transistor 455, and an organic EL element 450 are placed on the flexible substrate 420 via the adhesive layer 422 and the insulating layer 424. Is provided. The organic EL element 450 has an insulating layer 46.
7. It has a lower electrode 401, an EL layer 402 on the lower electrode 401, and an upper electrode 403 on the EL layer 402. The lower electrode 401 is electrically connected to the source electrode or the drain electrode of the transistor 455 via the conductive layer 435. The end of the lower electrode 401 is the insulating layer 40
It is covered with 5. The upper electrode 403 preferably reflects visible light. Further, the light emitting device has a colored layer 432 that overlaps with the organic EL element 450 on the insulating layer 463.

The drive circuit unit 493 has a plurality of transistors. FIG. 9C shows two transistors among the transistors included in the drive circuit unit 493.

The conductive layer 457 is electrically connected to an external input terminal that transmits a signal or potential from the outside to the drive circuit unit 493. Here, an example in which FPC495 is provided as an external input terminal is shown.
Further, here, an example in which the conductive layer 457 is manufactured by the same material and the same process as the conductive layer 435 is shown.

The insulating layer 463 has an effect of suppressing the diffusion of impurities into the semiconductor constituting the transistor. Further, for the insulating layer 465 and the insulating layer 467, it is preferable to select an insulating film having a flattening function in order to reduce surface irregularities caused by transistors and wiring.

<Structure Example 1-3>
9 (A) shows a plan view of the light emitting device, and FIG. 10 (A) shows the alternate long and short dash line X1-Y of FIG. 9 (A).
The cross-sectional view between 1 is shown. The light emitting device shown in FIG. 10A is a top emission type light emitting device using a color filter method.

The light emitting device shown in FIG. 10A includes a flexible substrate 420, an adhesive layer 422, an insulating layer 424, a transistor 455, an insulating layer 463, an insulating layer 465, an insulating layer 405, an insulating layer 496, and an organic EL.
Element 450 (lower electrode 401, EL layer 402, and upper electrode 403), adhesive layer 407, light-shielding layer 431, colored layer 432, overcoat 453, insulating layer 226, adhesive layer 426, flexible substrate 428, and conductive layer. It has 457. Flexible substrate 428, adhesive layer 426, insulating layer 2
26, the adhesive layer 407, and the upper electrode 403 transmit visible light.

In the light emitting unit 491 of the light emitting device shown in FIG. 10A, a transistor 455 and an organic EL element 450 are provided on a flexible substrate 420 via an adhesive layer 422 and an insulating layer 424.
The organic EL element 450 has a lower electrode 401 on the insulating layer 465, an EL layer 402 on the lower electrode 401, and an upper electrode 403 on the EL layer 402. The lower electrode 401 is electrically connected to the source electrode or drain electrode of the transistor 455. The end of the lower electrode 401 is covered with an insulating layer 405. An insulating layer 496 is provided on the insulating layer 405. Insulation layer 4
By providing 96, the distance between the flexible substrate 420 and the flexible substrate 428 can be adjusted. The lower electrode 401 preferably reflects visible light. The light emitting device is the adhesive layer 40.
It has a colored layer 432 that overlaps with the organic EL element 450 via the adhesive layer 407, and has a light-shielding layer 431 that overlaps with the insulating layer 405 via the adhesive layer 407.

The drive circuit unit 493 has a plurality of transistors. In FIG. 10A, the drive circuit unit 493
Shows one transistor among the transistors possessed by.

The conductive layer 457 is electrically connected to an external input terminal that transmits a signal or potential from the outside to the drive circuit unit 493. Here, an example in which FPC495 is provided as an external input terminal is shown.
Further, here, an example in which the conductive layer 457 is made of the same material as the source electrode and drain electrode of the transistor 455 and in the same process is shown. The connector 497 on the insulating layer 226 is connected to the conductive layer 457 via openings provided in the insulating layer 226, the overcoat 453, the adhesive layer 407, the insulating layer 465, and the insulating layer 463. Further, the connecting body 497 is connected to the FPC 495. The FPC 495 and the conductive layer 457 are electrically connected via the connecting body 497.

<Structure Example 1-4>
11 (A) shows a plan view of the light emitting device, and FIG. 11 (B) shows a cross-sectional view between the alternate long and short dash lines G1 to G2 in FIG. 11 (A). Further, as a modification, FIG. 10B shows a cross-sectional view of the light emitting device.

The light emitting device shown in FIGS. 10B and 11B has an element layer 1301, an adhesive layer 1305, and a flexible substrate 1303. The element layer 1301 includes a flexible substrate 1401, an adhesive layer 1403, an insulating layer 1405, a plurality of transistors, a conductive layer 1357, an insulating layer 1407, and an insulating layer 1409.
It has a plurality of light emitting elements, an insulating layer 1411, an adhesive layer 1413, an overcoat 1461, a light shielding layer 1457, and an insulating layer 1455.

FIG. 11B shows an example in which a colored layer 1459 is provided so as to be overlapped with each light emitting element. A colored layer 1459 is provided at a position overlapping with the light emitting element 1430, and a light shielding layer 1457 is provided at a position overlapping with the insulating layer 1411. The colored layer 1459 and the light shielding layer 1457 are covered with an overcoat 1461. Adhesive layer 1 between the light emitting element 1430 and the overcoat 1461
It is filled with 413. A colored layer may be provided on top of all the light emitting elements, or a colored layer may be provided on top of some of the light emitting elements as shown in FIG. 10 (B). For example, when one pixel is composed of four sub-pixels of red, blue, green, and white, the white sub-pixels do not need to be provided with a colored layer. As a result, the amount of light absorbed by the colored layer is reduced, so that the power consumption of the light emitting device can be reduced. Further, a light emitting element having a different light emitting color for each sub-pixel may be manufactured. When producing a light emitting element that exhibits a different color for each sub-pixel, it is not necessary to provide a colored layer.

The conductive layer 1357 is electrically connected to the FPC 1308 via the connecting body 1415. FIG. 11
As shown in (B), when the conductive layer 1357 is provided between the flexible substrate 1401 and the flexible substrate 1303, the connecting body 14 is provided in the opening provided in the flexible substrate 1303, the adhesive layer 1305, and the like.
15 may be arranged. As shown in FIG. 10B, the flexible substrate 1303 and the conductive layer 135
When the 7s do not overlap, the connecting body 1415 may be arranged in the opening provided in the insulating layer 1407 or the insulating layer 1409 on the flexible substrate 1401.

The light emitting element 1430 has a lower electrode 1431, an EL layer 1433, and an upper electrode 1435. The lower electrode 1431 is electrically connected to the source or drain electrode of the transistor 1440. The end of the lower electrode 1431 is covered with an insulating layer 1411. Light emitting element 14
30 is a top emission structure. The upper electrode 1435 is translucent and has an EL layer 143.
It transmits the light emitted by 3.

The light emitting device has a plurality of transistors in the light extraction unit 1304 and the drive circuit unit 1306. The transistor 1440 is provided on the insulating layer 1405. The insulating layer 1405 and the flexible substrate 1401 are bonded to each other by the adhesive layer 1403. In addition, the insulating layer 145
5 and the flexible substrate 1303 are bonded by an adhesive layer 1305. Insulation layer 1405
It is preferable to use an insulating film having a high gas barrier property for the insulating layer 1455, because impurities such as water and oxygen can be suppressed from entering the light emitting element 1430 and the transistor 1440, and the reliability of the light emitting device is improved.

In Configuration Examples 1-4, the insulating layer 1405 and the transistor 1440 are placed on a highly heat-resistant fabrication substrate.
The light emitting element 1430 is manufactured, the manufactured substrate is peeled off, and the flexible substrate 1 is used by using the adhesive layer 1403.
A light emitting device that can be manufactured by transposing an insulating layer 1405, a transistor 1440, and a light emitting element 1430 on 401 is shown. Further, in Configuration Example 1-4, an insulating layer 1455, a colored layer 1459 and a light-shielding layer 1457 are manufactured on a highly heat-resistant fabric, the fabric is peeled off, and the flexible substrate 1303 is used with the adhesive layer 1305. A light emitting device that can be manufactured by transposing an insulating layer 1455, a colored layer 1459, and a light shielding layer 1457 is shown above.

When a material having high moisture permeability and low heat resistance (resin or the like) is used for the substrate, a high temperature cannot be applied to the substrate in the manufacturing process, so that the conditions for forming a transistor or an insulating film on the substrate are limited. In the method for manufacturing a light emitting device according to one aspect of the present invention, a transistor or the like can be manufactured on a manufactured substrate having high heat resistance, so that a highly reliable transistor or an insulating film having a sufficiently high gas barrier property can be formed. Then, by transposing them on a flexible substrate, a highly reliable light emitting device can be manufactured. Thereby, in one aspect of the present invention, it is possible to realize a light emitting device that is lightweight or thin and has high reliability. Details of the manufacturing method will be described later.

It is preferable to use a material having high toughness for the flexible substrate 1303 and the flexible substrate 1401, respectively. This makes it possible to realize a display device having excellent impact resistance and being hard to be damaged. For example, by using the flexible substrate 1303 as an organic resin substrate and the flexible substrate 1401 as a substrate using a thin metal material or alloy material, it is lighter than the case where a glass substrate is used as the substrate. It is possible to realize a light emitting device that is not easily damaged.

Metallic materials and alloy materials have high thermal conductivity and can easily conduct heat to the entire substrate, so that local temperature rise of the light emitting device can be suppressed, which is preferable. The thickness of the substrate using the metal material or alloy material is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less.

Further, if a material having a high thermal emissivity is used for the flexible substrate 1401, it is possible to suppress an increase in the surface temperature of the light emitting device, and it is possible to suppress destruction of the light emitting device and deterioration of reliability. For example, the flexible substrate 1401 may be a laminated structure of a metal substrate and a layer having a high thermal emissivity (for example, a metal oxide or a ceramic material can be used).

<Example of material>
Next, materials and the like that can be used for the light emitting device will be described. The configuration described above in the present embodiment will be omitted.

The element layer 1301 has at least a light emitting element. As the light emitting element, an element capable of self-luminous light can be used, and an element whose brightness is controlled by a current or a voltage is included in the category. For example, a light emitting diode (LED), an organic EL element, an inorganic EL element, or the like can be used.

The element layer 1301 may further include a transistor for driving a light emitting element, a touch sensor, and the like.

The structure of the transistor included in the light emitting device is not particularly limited. For example, it may be a stagger type transistor or an inverted stagger type transistor. Further, either a top gate type or bottom gate type transistor structure may be used. The semiconductor material used for the transistor is not particularly limited, and for example, silicon, germanium, an oxide semiconductor, or the like may be used.

The state of the semiconductor material used for the transistor is not particularly limited, and any of an amorphous semiconductor and a semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor having a partially crystalline region) can be used. You may use it. In particular, it is preferable to use a semiconductor having crystallinity because deterioration of transistor characteristics can be suppressed.

Here, it is preferable to use a polycrystalline semiconductor as the transistor. For example, it is preferable to use polycrystalline silicon or the like. Polycrystalline silicon can be formed at a lower temperature than single crystal silicon, and has higher field effect mobility and higher reliability than amorphous silicon. By applying such a polycrystalline semiconductor to a pixel, the aperture ratio of the pixel can be improved.
Further, even when the pixels are present in extremely high definition, the gate drive circuit and the source drive circuit can be formed on the same substrate as the pixels, and the number of parts constituting the electronic device can be reduced.

Alternatively, it is preferable to use an oxide semiconductor for the transistor. For example, it is preferable to use an oxide semiconductor having a bandgap larger than that of silicon. It is preferable to use a semiconductor material having a wider bandgap and a smaller carrier density than silicon because the current in the off state of the transistor can be reduced.

For example, the oxide semiconductor preferably contains at least indium (In) or zinc (Zn). More preferably, In—M—Zn-based oxides (M is Al, Ti, Ga,
Contains oxides represented by metals such as Ge, Y, Zr, Sn, La, Ce or Hf).

For example, as oxide semiconductors, indium oxide, tin oxide, zinc oxide, In—Zn oxide, Sn—Zn oxide, Al—Zn oxide, Zn—Mg oxide, Sn—Mg oxide , In-Mg-based oxide, In-Ga-based oxide, In-Ga-Zn-based oxide (also referred to as IGZO), In-Al-Zn-based oxide, In-Sn-Zn-based oxide, Sn- Ga-Z
n-based oxide, Al-Ga-Zn-based oxide, Sn-Al-Zn-based oxide, In-Hf-Zn
Oxides, In-Zr-Zn Oxides, In-Ti-Zn Oxides, In-Sc-Zn Oxides, In-Y-Zn Oxides, In-La-Zn Oxides, In -Ce-Zn-based oxide, In-Pr-Zn-based oxide, In-Nd-Zn-based oxide, In-Sm-Zn-based oxide, In-Eu-Zn-based oxide, In-Gd-Zn-based Oxides, In-Tb-Zn-based oxides,
In-Dy-Zn-based oxide, In-Ho-Zn-based oxide, In-Er-Zn-based oxide, I
n-Tm-Zn-based oxide, In-Yb-Zn-based oxide, In-Lu-Zn-based oxide, In
-Sn-Ga-Zn-based oxide, In-Hf-Ga-Zn-based oxide, In-Al-Ga-Z
n-based oxide, In-Sn-Al-Zn-based oxide, In-Sn-Hf-Zn-based oxide, In
-Hf-Al-Zn-based oxides can be used.

Here, the In-Ga-Zn-based oxide means an oxide containing In, Ga, and Zn as main components, and the ratio of In, Ga, and Zn does not matter. Further, a metal element other than In, Ga and Zn may be contained.

The oxide semiconductor film is divided into a single crystal oxide semiconductor film and other non-single crystal oxide semiconductor films. The non-single crystal oxide semiconductor film is CAAC-OS (C Axis Align).
d Crystalline Oxide Semiconductor) film, polycrystalline oxide semiconductor film, microcrystalline oxide semiconductor film, amorphous oxide semiconductor film, etc. CAA
The C-OS film is one of the oxide semiconductor films having a plurality of crystal portions oriented on the c-axis. note that,
CAAC-OS membrane is CANC (C-Axis Alingned nanocrysta)
It can also be called an oxide semiconductor film having ls).

In particular, the semiconductor layer has a plurality of crystal portions, and the c-axis of the crystal portion is the surface to be formed of the semiconductor layer.
Alternatively, it is preferable to use an oxide semiconductor film that is oriented perpendicular to the upper surface of the semiconductor layer and has no grain boundaries between adjacent crystal portions. Since such an oxide semiconductor does not have grain boundaries, cracks occur in the oxide semiconductor film due to the stress when the flexible device formed by applying one aspect of the present invention is curved. It is suppressed that it is stored. Therefore, such an oxide semiconductor can be suitably used for a device such as a display device which has flexibility and is used by bending it.

Further, by using such a material as the semiconductor layer, fluctuations in electrical characteristics are suppressed, and a highly reliable transistor can be realized.

In addition, the low off-current makes it possible to retain the charge accumulated in the capacitance via the transistor for a long period of time. By applying such a transistor to a pixel, it is possible to stop the drive circuit while maintaining the brightness of the image displayed in each display area. As a result, it is possible to realize an electronic device with extremely reduced power consumption.

The light emitting element included in the light emitting device has a pair of electrodes (lower electrode 1431 and upper electrode 1435) and an EL layer 1433 provided between the pair of electrodes. One of the pair of electrodes functions as an anode and the other functions as a cathode.

The light emitting element may have a top emission structure, a bottom emission structure, or a dual emission structure. A conductive film that transmits visible light is used for the electrode on the side that extracts light. Further, it is preferable to use a conductive film that reflects visible light for the electrode on the side that does not take out light.

The conductive film that transmits visible light is, for example, indium oxide or indium tin oxide (ITO: I).
It can be formed by using ndium Tin Oxide), indium zinc oxide, zinc oxide, zinc oxide added with gallium, or the like. Also, gold, silver, platinum, magnesium,
Metallic materials such as nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (for example, titanium nitride) also have translucency. It can be used by forming it as thin as it has.
Further, the laminated film of the above material can be used as the conductive layer. For example, it is preferable to use a laminated film of an alloy of silver and magnesium and ITO because the conductivity can be enhanced. Further, graphene or the like may be used.

As the conductive film that reflects visible light, for example, a metal material such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy containing these metal materials shall be used. Can be done. Further, lanthanum, neodymium, germanium or the like may be added to the above metal materials or alloys. Also, alloys containing aluminum (aluminum alloys) such as alloys of aluminum and titanium, alloys of aluminum and nickel, alloys of aluminum and neodym, alloys of silver and copper, alloys of silver and palladium and copper, alloys of silver and magnesium. It can be formed by using an alloy containing silver such as. Alloys containing silver and copper are preferred because of their high heat resistance. Further, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the material of the metal film and the metal oxide film include titanium and titanium oxide. Further, the conductive film that transmits the visible light and the film made of a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO can be used.

The electrodes may be formed by using a vapor deposition method or a sputtering method, respectively. In addition, it can be formed by using a ejection method such as an inkjet method, a printing method such as a screen printing method, or a plating method.

When a voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode and the upper electrode, holes are injected into the EL layer from the anode side and electrons are injected from the cathode side. The injected electrons and holes are EL
It recombines in the layer and the luminescent substance contained in the EL layer emits light.

The EL layer has at least a light emitting layer. The EL layer is a layer other than the light emitting layer, which is a substance having a high hole injecting property, a substance having a high hole transporting property, a hole blocking material, a substance having a high electron transporting property, a substance having a high electron injecting property, or a bipolar substance. It may further have a layer containing a substance (a substance having high electron transport property and hole transport property) and the like.

Either a low molecular weight compound or a high molecular weight compound can be used for the EL layer, and an inorganic compound may be contained. The layers constituting the EL layer 1433 can be formed by a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an inkjet method, a coating method, or the like, respectively.

The light emitting element is preferably provided between a pair of insulating films having a high gas barrier property. As a result, it is possible to suppress the intrusion of impurities such as water into the light emitting element, and it is possible to suppress the deterioration of the reliability of the light emitting device.

Examples of the insulating film having a high gas barrier property include a film containing nitrogen and silicon such as a silicon nitride film and a silicon nitride film, and a film containing nitrogen and aluminum such as an aluminum nitride film. Further, a silicon oxide film, a silicon nitride film, an aluminum oxide film and the like may be used.

For example, the amount of water vapor permeation of an insulating film having a high gas barrier property is 1 × ^10-5 [g / m ² · day.
] Or less, preferably 1 × 10 ⁻⁶ [g / m ² · day] or less, more preferably 1 × 10 ^−
7 [g / m ² · day] or less, more preferably 1 × 10 ^-8 [g / m ² · day] or less.

A flexible material is used for the flexible substrate. For example, an organic resin or glass having a thickness sufficient to have flexibility can be used. Further, a material that transmits visible light is used for the substrate on the side that extracts light emission in the light emitting device. If the flexible substrate does not need to transmit visible light, a metal substrate or the like can also be used.

Since the organic resin has a smaller specific gravity than that of glass, it is preferable to use the organic resin as the flexible substrate because the weight of the light emitting device can be reduced as compared with the case of using glass.

As a flexible and translucent material, for example, polyethylene terephthalate (PET)
), Polyester resin such as polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethylmethacrylate resin, polycarbonate (PC) resin, polyether sulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamide. Examples thereof include imide resin and polyvinyl chloride resin. In particular, it is preferable to use a material having a low coefficient of thermal expansion, and for example, a polyamide-imide resin, a polyimide resin, PET and the like can be preferably used. Further, a substrate in which a fiber body is impregnated with a resin (also referred to as a prepreg) or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can also be used.

When the fiber is contained in the flexible and translucent material, the fiber is a high-strength fiber of an organic compound or an inorganic compound. The high-strength fiber specifically refers to a fiber having a high tensile elasticity or young ratio, and typical examples thereof include polyvinyl alcohol-based fiber, polyester-based fiber, polyamide-based fiber, polyethylene-based fiber, and aramid-based fiber. Polyparaphenylene benzobisoxazole fiber, glass fiber, or carbon fiber can be mentioned. Examples of the glass fiber include glass fibers using E glass, S glass, D glass, Q glass and the like. These may be used in the state of a woven fabric or a non-woven fabric, and a structure obtained by impregnating the fiber body with a resin and curing the resin may be used as a flexible substrate. It is preferable to use a structure made of a fibrous body and a resin as the flexible substrate because the reliability against fracture due to bending or local pressing is improved.

In order to improve the efficiency of light extraction, it is preferable that the material having flexibility and translucency has a high refractive index. For example, by dispersing an inorganic filler having a high refractive index in an organic resin, a substrate having a higher refractive index than a substrate made of only the organic resin can be realized. In particular, it is preferable to use a small inorganic filler having a particle diameter of 40 nm or less because the optical transparency is not lost.

The thickness of the metal substrate is preferably 10 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less, in order to obtain flexibility and bendability. Since the metal substrate has high thermal conductivity,
The heat generated by the light emitted from the light emitting element can be effectively dissipated.

The material constituting the metal substrate is not particularly limited, but for example, aluminum, copper, nickel, an aluminum alloy, a metal alloy such as stainless steel, or the like can be preferably used.

As the flexible substrate, the layer using the above material is a hard coat layer (for example, a silicon nitride layer) that protects the surface of the device from scratches or the like, or a layer made of a material that can disperse the pressure (for example, an aramid resin). It may be configured by being laminated with a layer or the like). Further, in order to suppress a decrease in the life of a functional element (particularly an organic EL element or the like) due to moisture or the like, an insulating film having low water permeability, which will be described later, may be provided.

The flexible substrate can also be used by laminating a plurality of layers. In particular, when the structure has a glass layer, the barrier property against water and oxygen can be improved, and a highly reliable light emitting device can be obtained.

For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side close to the organic EL element can be used. The thickness of the glass layer is 20 μm or more and 200 μm or less.
It is preferably 25 μm or more and 100 μm or less. A glass layer having such a thickness can simultaneously realize high barrier property against water and oxygen and flexibility. The thickness of the organic resin layer is
It is 10 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By providing such an organic resin layer on the outer side of the glass layer, it is possible to suppress cracks and cracks in the glass layer and improve the mechanical strength. By applying such a composite material of a glass material and an organic resin to a substrate, a flexible light emitting device with extremely high reliability can be obtained.

As the adhesive layer, various curable adhesives such as a photocurable adhesive such as an ultraviolet curable type, a reaction curable adhesive, a thermosetting adhesive, and an anaerobic adhesive can be used. Examples of these adhesives include epoxy resin, acrylic resin, silicone resin, phenol resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EVA (
Ethylene vinyl acetate) resin and the like can be mentioned. In particular, a material having low moisture permeability such as an epoxy resin is preferable. Further, a two-component mixed type resin may be used. Further, an adhesive sheet or the like may be used.

Further, the resin may contain a desiccant. For example, a substance that adsorbs water by chemisorption, such as an oxide of an alkaline earth metal (calcium oxide, barium oxide, etc.), can be used. Alternatively, a substance that adsorbs water by physical adsorption, such as zeolite or silica gel, may be used. When a desiccant is contained, impurities such as moisture can be suppressed from entering the functional element, and the reliability of the light emitting device is improved, which is preferable.

Further, by mixing the resin with a filler having a high refractive index or a light scattering member, the efficiency of light extraction from the light emitting element can be improved. For example, titanium oxide, barium oxide, zeolite, zirconium and the like can be used.

Inorganic insulating materials can be used for the insulating layer 424, the insulating layer 226, the insulating layer 1405, and the insulating layer 1455. In particular, it is preferable to use the above-mentioned insulating film having a high gas barrier property because a highly reliable light emitting device can be realized. Further, an insulating film having a high gas barrier property may be formed between the adhesive layer and the upper electrode.

The insulating layer 463 and the insulating layer 1407 have the effect of suppressing the diffusion of impurities into the semiconductors constituting the transistor. As the insulating layer 463 and the insulating layer 1407, an inorganic insulating film such as a silicon oxide film, a silicon nitride film, or an aluminum oxide film can be used.

As the insulating layer 465, the insulating layer 467, and the insulating layer 1409, it is preferable to select an insulating film having a flattening function in order to reduce surface irregularities caused by transistors. For example, an organic material such as polyimide, acrylic, or a benzocyclobutene resin can be used. In addition to the above organic materials, low dielectric constant materials (low-k materials) and the like can be used. A plurality of insulating films or inorganic insulating films formed of these materials may be laminated.

The insulating layer 405 and the insulating layer 1411 are provided so as to cover the end portions of the lower electrodes. Insulation layer 40
5. As the material of the insulating layer 496 and the insulating layer 1411, a resin or an inorganic insulating material can be used. As the resin, for example, a polyimide resin, a polyamide resin, an acrylic resin, a siloxane resin, an epoxy resin, a phenol resin, or the like can be used. In particular, since the insulating layer 405, the insulating layer 496, and the insulating layer 1411 can be easily manufactured, it is preferable to use a negative type photosensitive resin or a positive type photosensitive resin.

The method for forming the insulating layer 405, the insulating layer 496, and the insulating layer 1411 is not particularly limited, but is limited to a photolithography method, a sputtering method, a vapor deposition method, a droplet ejection method (inkjet method, etc.), and a printing method (inkjet method, etc.).
Screen printing, offset printing, etc.) may be used.

The conductive layer such as the electrode and wiring of the transistor is a single layer or using a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, or an alloy material containing these elements, respectively. It can be laminated and formed. Further, each of the conductive layers may be formed by using a conductive metal oxide. Conductive metal oxides include indium oxide (In ₂ O _3, etc.), tin oxide (SnO _2, etc.), and zinc oxide (Zn).
O), ITO, indium zinc oxide (In ₂ O _3- ZnO, etc.) or those metal oxide materials containing silicon oxide can be used.

As the connecting body, a paste-like or sheet-like material in which metal particles are mixed with a thermosetting resin can be used, and a material exhibiting anisotropic conductivity by thermocompression bonding can be used. As the metal particles, it is preferable to use particles in which two or more kinds of metals are layered, for example, nickel particles coated with gold.

The colored layer is a colored layer that transmits light in a specific wavelength band. For example, a red (R) color filter that transmits light in the red wavelength band, a green (G) color filter that transmits light in the green wavelength band, and a blue (B) color filter that transmits light in the blue wavelength band. A color filter or the like can be used. Each colored layer is formed at a desired position by a printing method, an inkjet method, an etching method using a photolithography method, or the like using various materials.

The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from adjacent organic EL elements and suppresses color mixing between adjacent organic EL elements. Here, by providing the end portion of the colored layer so as to overlap with the light-shielding layer, light leakage can be suppressed. As the light-shielding layer, a material that shields light emitted from the organic EL element can be used. For example, a black matrix may be formed by using a metal material or a resin material containing a pigment or a dye. It is preferable to provide the light-shielding layer in a region other than the light-emitting portion such as the drive circuit portion because it is possible to suppress unintended light leakage due to waveguide light or the like.

Further, an overcoat may be provided to cover the colored layer and the light-shielding layer. By providing the overcoat, it is possible to prevent the impurities contained in the colored layer from diffusing into the organic EL element.
The overcoat is made of a material that transmits light emitted from the organic EL element. For example, an inorganic insulating film such as a silicon nitride film or a silicon oxide film, or an organic insulating film such as an acrylic film or a polyimide film can be used, and the overcoat is organic. It may be a laminated structure of an insulating film and an inorganic insulating film.

Further, when the material of the adhesive layer is applied on the colored layer and the light-shielding layer, it is preferable to use a material having high wettability with respect to the material of the adhesive layer as the material of the overcoat. For example, as the overcoat 453 (FIG. 10A), it is preferable to use an oxide conductive film such as an ITO film or a metal film such as an Ag film thin enough to have translucency.

<Example of manufacturing method>
Next, a method for manufacturing the light emitting device will be illustrated with reference to FIGS. 12 and 13. Here, configuration example 1-
The light emitting device having the configuration of 4 (FIG. 11 (B)) will be described as an example.

First, the release layer 1503 is formed on the production substrate 1501, and the insulating layer 140 is formed on the release layer 1503.
Form 5. Next, a plurality of transistors, a conductive layer 1357, an insulating layer 1407, an insulating layer 1409, a plurality of light emitting elements, and an insulating layer 1411 are formed on the insulating layer 1405. The insulating layer 1409 and the insulating layer 1407 are opened so that the conductive layer 1357 is exposed (FIG. 1).
2 (A)).

Further, a release layer 1507 is formed on the production substrate 1505, and an insulating layer 145 is formed on the release layer 1507.
Form 5. Next, a light-shielding layer 1457, a colored layer 1459, and an overcoat 1461 are formed on the insulating layer 1455 (FIG. 12 (B)).

As the manufacturing substrate 1501 and the manufacturing substrate 1505, substrates such as a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, and a metal substrate can be used, respectively.

Further, as the glass substrate, for example, a glass material such as aluminosilicate glass, aluminoborosilicate glass, and barium borosilicate glass can be used. When the temperature of the subsequent heat treatment is high, it is preferable to use one having a strain point of 730 ° C. or higher. In addition, crystallized glass or the like can be used.

When a glass substrate is used as the manufacturing substrate, a silicon oxide film is formed between the manufacturing substrate and the release layer.
It is preferable to form an insulating film such as a silicon oxide film, a silicon nitride film, or a silicon nitride film because contamination from the glass substrate can be prevented.

The peeling layer 1503 and the peeling layer 1507 include elements selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, and silicon, respectively. It is a single layer or a laminated layer made of an alloy material containing the element or a compound material containing the element. The crystal structure of the layer containing silicon may be amorphous, microcrystal, or polycrystal.

The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like.
The coating method includes a spin coating method, a droplet ejection method, and a dispensing method.

When the release layer has a single layer structure, it is preferable to form a tungsten layer, a molybdenum layer, or a layer containing a mixture of tungsten and molybdenum. Further, a layer containing a tungsten oxide or an oxide nitride, a layer containing a molybdenum oxide or an oxide nitride, or a layer containing an oxide or an oxide of a mixture of tungsten and molybdenum may be formed. The mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

Further, when forming a laminated structure of a layer containing tungsten and a layer containing an oxide of tungsten as a release layer, a layer containing tungsten is formed, and an insulating film formed of an oxide is formed on the layer above the layer. It may be utilized that a layer containing a tungsten oxide is formed at the interface between the tungsten layer and the insulating film. Further, the surface of the layer containing tungsten, thermal oxidation treatment, oxygen plasma treatment, nitrous oxide (N 2 _O) plasma treatment, an oxide of tungsten processing or the like in the strong oxidizing solution such as ozone water A layer containing may be formed. Further, the plasma treatment and the heat treatment may be performed by oxygen, nitrogen, nitrous oxide alone, or in a mixed gas atmosphere of the gas and another gas. By changing the surface state of the peeling layer by the plasma treatment or the heat treatment, it is possible to control the adhesion between the peeling layer and the insulating film formed later.

Each insulating layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. For example, the film formation temperature is 250 ° C. or higher and 400 ° C. by the plasma CVD method.
By forming as follows, it is possible to obtain a dense film having a very high gas barrier property.

After that, a material to be an adhesive layer 1413 is applied to the surface of the production substrate 1505 provided with the colored layer 1459 and the like or the surface of the production substrate 1501 provided with the light emitting element 1430 and the like, and the adhesive layer 1413 is applied.
The surfaces are bonded to each other via the above (FIG. 12 (C)).

Then, the manufactured substrate 1501 is peeled off, and the exposed insulating layer 1405 and the flexible substrate 1401 are separated.
It is bonded using the adhesive layer 1403. Further, the manufactured substrate 1505 is peeled off, and the exposed insulating layer 1455 and the flexible substrate 1303 are bonded together using the adhesive layer 1305. FIG. 13 (A
), The flexible substrate 1303 does not overlap with the conductive layer 1357, but the conductive layer 135
7 and the flexible substrate 1303 may overlap each other.

In one aspect of the present invention, various peeling methods can be applied to the manufactured substrate. For example, when a layer containing a metal oxide film is formed on the side in contact with the layer to be peeled as the peeling layer, the metal oxide film can be fragile by crystallization and the layer to be peeled can be peeled from the manufactured substrate. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the highly heat-resistant manufacturing substrate and the layer to be peeled off, the amorphous silicon film is removed by irradiation with laser light or etching. , The layer to be peeled off can be peeled off from the manufactured substrate. Further, as the peeling layer, a layer containing a metal oxide film is formed on the side in contact with the peeled layer, the metal oxide film is weakened by crystallization, and a part of the peeling layer is partially used as a solution, NF ₃ , BrF ₃ , or ClF. _{After being removed by etching with a fluoride gas of 3} or the like, it can be peeled off in a weakened metal oxide film. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) is used as the release layer, and the release layer is irradiated with laser light. A method may be used in which nitrogen, oxygen or hydrogen contained in the peeling layer is released as a gas to promote the peeling between the peeled layer and the substrate. Further, a method of mechanically removing the manufactured substrate on which the layer to be peeled is formed or _{etching with a solution or a fluoride gas such as NF 3} , BrF ₃ , ClF ₃ or the like can be used. In this case, it is not necessary to provide the release layer.

Further, the peeling step can be performed more easily by combining a plurality of the peeling methods.
In other words, after irradiating the peeling layer with laser light, etching the peeling layer with a gas or solution, and mechanically removing it with a sharp knife or scalpel, the peeling layer and the peeled layer can be easily peeled off.
Peeling can also be performed by physical force (by a machine or the like).

Further, the liquid to be peeled off may be peeled off from the manufactured substrate by infiltrating the liquid into the interface between the peeled layer and the layer to be peeled off. Further, when the peeling is performed, the peeling may be performed while sprinkling a liquid. It is possible to prevent the static electricity generated at the time of peeling from adversely affecting the functional element contained in the layer to be peeled (such as the semiconductor element being destroyed by static electricity). The liquid may be atomized or vaporized and sprayed. As the liquid, pure water, an organic solvent, or the like can be used, and a neutral, alkaline, or acidic aqueous solution, an aqueous solution in which a salt is dissolved, or the like may be used.

As another peeling method, when the peeling layer is formed of tungsten, it is preferable to perform peeling while etching the peeling layer with a mixed solution of aqueous ammonia and hydrogen peroxide.

If peeling is possible at the interface between the manufactured substrate and the layer to be peeled off, the peeling layer may not be provided.
For example, glass is used as a manufacturing substrate, and an organic resin such as polyimide, polyester, polyolefin, polyamide, polycarbonate, or acrylic is formed in contact with the glass. Next, laser irradiation and heat treatment are performed to improve the adhesion between the production substrate and the organic resin. Then, an insulating film, a transistor, or the like is formed on the organic resin. After that, by performing laser irradiation at a higher energy density than the previous laser irradiation or heat treatment at a temperature higher than the previous heat treatment, peeling can be performed at the interface between the manufactured substrate and the organic resin. Further, at the time of peeling, the liquid may be permeated into the interface between the production substrate and the organic resin to separate them.

In this method, since an insulating film, a transistor, or the like is formed on an organic resin having low heat resistance, it is not possible to apply a high temperature to the substrate in the manufacturing process. Here, a transistor using an oxide semiconductor can be suitably formed on an organic resin because a high-temperature manufacturing process is not essential.

The organic resin may be used as a substrate constituting the light emitting device, or the organic resin may be removed and another substrate may be attached to the exposed surface of the layer to be peeled off using an adhesive.

Alternatively, a metal layer may be provided between the production substrate and the organic resin, the metal layer may be heated by passing an electric current through the metal layer, and peeling may be performed at the interface between the metal layer and the organic resin.

Finally, the conductive layer 1357 is exposed by opening the insulating layer 1455 and the adhesive layer 1413 (FIG. 13 (B)). When the flexible substrate 1303 overlaps with the conductive layer 1357, the flexible substrate 1303 and the adhesive layer 1305 are also opened (FIG. 13 (C)). The means for opening is not particularly limited, and for example, a laser ablation method, an etching method, an ion beam sputtering method, or the like may be used. Further, the film on the conductive layer 1357 may be cut with a sharp blade or the like, and a part of the film may be peeled off by a physical force.

From the above, the light emitting device can be manufactured.

Further, in the present specification and the like, an active matrix method having an active element (active element, a non-linear element) in a pixel or a passive matrix method having no active element in a pixel can be used.

In the active matrix method, not only a transistor but also various active elements can be used as the active element. For example, MIM (Metal Insulator M)
It is also possible to use et al), TFD (Thin Film Diode), or the like. Since these elements have few manufacturing processes, it is possible to reduce the manufacturing cost or improve the yield. Further, since these elements have a small size, the aperture ratio can be improved, and low power consumption and high brightness can be achieved.

Since the passive matrix method does not use an active element, the number of manufacturing processes is small, and it is possible to reduce the manufacturing cost and improve the yield. Further, since the active element is not used, the aperture ratio can be improved, and the power consumption can be reduced or the brightness can be increased.

This embodiment can be appropriately combined with other embodiments.

(Embodiment 7)
In the present embodiment, the configuration of the foldable touch panel will be described with reference to FIGS. 14 to 17. For the material of each layer, the sixth embodiment can be referred to. In this embodiment, a touch panel using an organic EL element is exemplified, but the present invention is not limited to this. In one aspect of the present invention, for example, a touch panel using other elements exemplified in the sixth embodiment can be manufactured.

<Structure Example 2-1>
FIG. 14A is a top view of the touch panel. FIG. 14 (B) is the alternate long and short dash line A of FIG. 14 (A).
FIG. 5 is a cross-sectional view taken between −B and the alternate long and short dash line CD. FIG. 14 (C) is the alternate long and short dash line E of FIG. 14 (A).
It is sectional drawing between −F.

As shown in FIG. 14A, the touch panel 390 has a display unit 301.

The display unit 301 includes a plurality of pixels 302 and a plurality of image pickup pixels 308. The image pickup pixel 308 can detect a finger or the like touching the display unit 301. Thereby, the touch sensor can be configured by using the image pickup pixel 308.

The pixel 302 includes a plurality of sub-pixels (for example, sub-pixel 302R), and the sub-pixels include a light emitting element and a pixel circuit capable of supplying electric power for driving the light emitting element.

The pixel circuit is electrically connected to a wiring capable of supplying a selection signal and a wiring capable of supplying an image signal.

Further, the touch panel 390 includes a scanning line drive circuit 303g (1) capable of supplying a selection signal to the pixel 302, and an image signal line drive circuit 303s (1) capable of supplying an image signal to the pixel 302.

The image pickup pixel 308 includes a photoelectric conversion element and an image pickup pixel circuit for driving the photoelectric conversion element.

The image pickup pixel circuit is electrically connected to a wiring capable of supplying a control signal and a wiring capable of supplying a power supply potential.

As the control signal, for example, a signal capable of selecting an image pickup pixel circuit for reading the recorded image pickup signal, a signal capable of initializing the image pickup pixel circuit, and a time for the image pickup pixel circuit to detect light are determined. Can be mentioned as a signal that can be generated.

The touch panel 390 includes an image pickup pixel drive circuit 303 g (2) capable of supplying a control signal to the image pickup pixel 308, and an image pickup signal line drive circuit 303s (2) for reading the image pickup signal.

As shown in FIG. 14B, the touch panel 390 has a substrate 510 and a substrate 570 facing the substrate 510.

Flexible materials can be suitably used for the substrate 510 and the substrate 570.

Materials in which the permeation of impurities is suppressed can be suitably used for the substrate 510 and the substrate 570. For example, the transmittance of water vapor is ^10-5 g / m ² · day or less, preferably ^10-6 g / m.
^{2. A} material having a day or less can be preferably used.

Materials having approximately the same coefficient of linear expansion can be suitably used for the substrate 510 and the substrate 570.
For example, a material having a linear expansion coefficient of 1 × 10 ^-3 / K or less, preferably 5 × 10 ^-5 / K or less, and more preferably 1 × 10 ^-5 / K or less can be preferably used.

The substrate 510 includes a flexible substrate 510b, an insulating layer 510a that prevents impurities from diffusing into the light emitting element, and the like.
It is a laminated body in which an adhesive layer 510c for bonding a flexible substrate 510b and an insulating layer 510a is laminated.

The substrate 570 includes a flexible substrate 570b, an insulating layer 570a that prevents impurities from diffusing into the light emitting element, and the like.
And a laminated body of the adhesive layer 570c in which the flexible substrate 570b and the insulating layer 570a are bonded together.

For example, a material containing polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide, polycarbonate or acrylic, urethane, epoxy, or a resin having a siloxane bond can be used for the adhesive layer.

The sealing layer 560 has a substrate 570 and a substrate 510 bonded together. The sealing layer 560 has a refractive index higher than that of air. The pixel circuit and the light emitting element (for example, the first light emitting element 350R) are the substrate 5.
It is between 10 and the substrate 570.

The pixel 302 has a sub-pixel 302R, a sub-pixel 302G, and a sub-pixel 302B (FIG. 14 (Fig. 14).
C)). Further, the sub-pixel 302R includes a light emitting module 380R, the sub pixel 302G includes a light emitting module 380G, and the sub pixel 302B includes a light emitting module 380B.

For example, the sub-pixel 302R includes a pixel circuit including a transistor 302t capable of supplying electric power to the first light emitting element 350R and the first light emitting element 350R (FIG. 14B).
Further, the light emitting module 380R includes a first light emitting element 350R and an optical element (for example, a colored layer 3).
67R) is provided.

The light emitting element 350R has a first lower electrode 351R, an upper electrode 352, and an EL layer 353 between the lower electrode 351R and the upper electrode 352 (FIG. 14C).

The EL layer 353 includes a light emitting unit 353a, a light emitting unit 353b, and a light emitting unit 35.
An intermediate layer 354 is provided between 3a and the light emitting unit 353b.

The light emitting module 380R has a first colored layer 367R on the substrate 570. The colored layer may be any one that transmits light having a specific wavelength, and for example, a layer that selectively transmits light exhibiting red, green, blue, or the like can be used. Alternatively, a region may be provided that allows the light emitted by the light emitting element to pass through as it is. Further, the emission color may be different for each light emitting element. In that case, the colored layer may or may not be provided.

For example, the light emitting module 380R has a light emitting element 350R and a sealing layer 560 in contact with the colored layer 367R.

The colored layer 367R is located at a position overlapping with the light emitting element 350R. As a result, the light emitting element 350R
A part of the light emitted by the light is transmitted through the sealing layer 560 and the colored layer 367R and emitted to the outside of the light emitting module 380R as shown by the arrow in the figure.

The touch panel 390 has a light-shielding layer 367BM on the substrate 570. The light-shielding layer 367BM
It is provided so as to surround the colored layer (for example, the colored layer 367R).

The touch panel 390 is provided with an antireflection layer 367p at a position overlapping the display unit 301. As the antireflection layer 367p, for example, a circularly polarizing plate can be used.

The touch panel 390 includes an insulating layer 321. The insulating layer 321 covers the transistor 302t. The insulating layer 321 can be used as a layer for flattening the unevenness caused by the pixel circuit. Further, an insulating layer in which a layer capable of suppressing diffusion of impurities to a transistor 302t or the like is laminated can be applied to the insulating layer 321.

The touch panel 390 has a light emitting element (for example, a light emitting element 350R) on the insulating layer 321.

The touch panel 390 has a partition wall 328 on the insulating layer 321 that overlaps the end of the lower electrode 351R. Further, the spacer 329 that controls the distance between the substrate 510 and the substrate 570 is used as the partition wall 328.
Have on.

The image signal line drive circuit 303s (1) includes a transistor 303t and a capacitance 303c.
The drive circuit can be formed on the same substrate in the same process as the pixel circuit. FIG. 14 (
As shown in B), the transistor 303t may have a second gate 304 on the insulating layer 321. The second gate 304 may be electrically connected to the gate of the transistor 303t, or may be given different potentials to them. If necessary, the second gate 304 may be provided in the transistor 308t, the transistor 302t, or the like.

The image pickup pixel 308 includes an image pickup pixel circuit for detecting the light emitted to the photoelectric conversion element 308p and the photoelectric conversion element 308p. Further, the image pickup pixel circuit includes a transistor 308t.

For example, a pin type photodiode can be used for the photoelectric conversion element 308p.

The touch panel 390 includes a wiring 311 capable of supplying a signal, and a terminal 319 is provided in the wiring 311. An FPC 309 (1) capable of supplying signals such as an image signal and a synchronization signal is electrically connected to the terminal 319. In addition, FPC309 (1
A printed wiring board (PWB) may be attached to).

Transistors formed in the same process are combined into transistors 302t and transistors 303t.
, Transistor 308t and the like.

In addition to the gate, source and drain of the transistor, the materials that can be used for the various wiring and electrodes that make up the touch panel include aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or A metal such as tungsten or an alloy containing this as a main component is used as a single-layer structure or a laminated structure. For example, a single-layer structure of an aluminum film containing silicon, a two-layer structure in which an aluminum film is laminated on a titanium film, a two-layer structure in which an aluminum film is laminated on a tungsten film, and a copper film on a copper-magnesium-aluminum alloy film. Two-layer structure in which a copper film is laminated on a titanium film, a two-layer structure in which a copper film is laminated.
A two-layer structure in which a copper film is laminated on a tungsten film, a titanium film or a titanium nitride film, an aluminum film or a copper film laminated on the titanium film or the titanium nitride film, and a titanium film or titanium nitride on the aluminum film or a copper film. A three-layer structure that forms a film, a molybdenum film or molybdenum nitride film, an aluminum film or a copper film laminated on the molybdenum film or molybdenum nitride film, and a molybdenum film or molybdenum nitride film formed on the aluminum film or copper film. There is a layered structure and so on. A transparent conductive material containing indium oxide, tin oxide or zinc oxide may be used. Further, it is preferable to use copper containing manganese because the controllability of the shape by etching is improved.

<Structure Example 2-2>
15 (A) and 15 (B) are perspective views of the touch panel 505. For clarification, typical components are shown. 16 (A) is a cross-sectional view between the alternate long and short dash lines G3-G4 shown in FIG. 15 (A).

The touch panel 505 includes a display unit 501 and a touch sensor 595 (FIG. 15B).
Further, the touch panel 505 has a substrate 510, a substrate 570, and a substrate 590. note that,
The substrate 510, the substrate 570 and the substrate 590 are all flexible.

The display unit 501 includes a plurality of pixels on the substrate 510 and the substrate 510, and a plurality of wirings 511 capable of supplying signals to the pixels. The plurality of wirings 511 are routed to the outer peripheral portion of the substrate 510, and a part thereof constitutes the terminal 519. Terminal 519 is FPC509 (1)
Electrically connect with.

The substrate 590 includes a touch sensor 595 and a plurality of wirings 598 that are electrically connected to the touch sensor 595. A plurality of wirings 598 are routed around the outer peripheral portion of the substrate 590, and a part thereof constitutes a terminal. Then, the terminal is electrically connected to the FPC 509 (2). note that,
In FIG. 15B, for the sake of clarity, the electrodes, wiring, and the like of the touch sensor 595 provided on the back surface side (the surface side facing the substrate 510) of the substrate 590 are shown by solid lines.

As the touch sensor 595, for example, a capacitive touch sensor can be applied. As the capacitance method, there are a surface type capacitance method, a projection type capacitance method and the like.

The projection type capacitance method includes a self-capacitance method and a mutual capacitance method mainly due to the difference in the drive method. It is preferable to use the mutual capacitance method because simultaneous multipoint detection is possible.

In the following, a case where a projection type capacitance type touch sensor is applied will be described with reference to FIG. 15 (B).

It should be noted that various sensors capable of detecting the proximity or contact of a detection target such as a finger can be applied.

The projection type capacitance type touch sensor 595 has a first electrode 591 and a second electrode 592. The first electrode 591 is electrically connected to any one of the plurality of wires 598, and the second electrode 5 is used.
92 is electrically connected to any other of the plurality of wires 598.

As shown in FIGS. 15A and 15B, the second electrode 592 has a shape in which a plurality of quadrilaterals repeatedly arranged in one direction are connected at a corner.

The first electrode 591 is a quadrilateral and is repeatedly arranged in a direction intersecting the extending direction of the second electrode 592.

The wiring 594 electrically connects two first electrodes 591 sandwiching one of the second electrodes 592. At this time, a shape in which the area of the intersection between the second electrode 592 and the wiring 594 is as small as possible is preferable. As a result, the area of the region where the electrodes are not provided can be reduced, and the unevenness of the transmittance can be reduced. As a result, it is possible to reduce the uneven brightness of the light transmitted through the touch sensor 595.

The shapes of the first electrode 591 and the second electrode 592 are not limited to this, and various shapes can be taken. For example, the plurality of strip-shaped first electrodes are arranged so as to have as few gaps as possible, and the plurality of strip-shaped second electrodes are arranged so as to intersect the first electrode via the insulating layer. At this time, the two adjacent second electrodes may be provided apart from each other. Further, it is preferable to provide a dummy electrode electrically isolated from the two adjacent second electrodes because the area of the region having different transmittance can be reduced.

The touch sensor 595 is a first electrode 59 arranged in a staggered pattern on the substrate 590 and the substrate 590.
It is provided with an insulating layer 593 that covers the first and second electrodes 592, the first electrode 591 and the second electrode 592, and a wiring 594 that electrically connects the adjacent first electrodes 591.

As shown in FIG. 15B, the adhesive layer 597 has a substrate 590 attached to the substrate 570 so that the touch sensor 595 overlaps the display unit 501.

The first electrode 591 and the second electrode 592 are formed by using a conductive material having translucency.
As the translucent conductive material, a conductive oxide such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide to which gallium is added can be used. A membrane containing graphene can also be used. The graphene-containing film can be formed, for example, by reducing a film containing graphene oxide formed in the form of a film. Examples of the method of reduction include a method of applying heat.

After a conductive material having translucency is formed on the substrate 590 by a sputtering method, unnecessary parts are removed by various patterning techniques such as a photolithography method, and the first electrode 591 and the second electrode are used. 592 can be formed.

Further, as the material used for the insulating layer 593, for example, a resin such as acrylic or epoxy, a resin having a siloxane bond, or an inorganic insulating material such as silicon oxide, silicon oxide nitride, or aluminum oxide can be used.

Further, an opening reaching the first electrode 591 is provided in the insulating layer 593, and the wiring 594 electrically connects the adjacent first electrode 591. Since the translucent conductive material can increase the aperture ratio of the touch panel, it can be suitably used for the wiring 594. Further, the first electrode 5
A material having higher conductivity than 91 and the second electrode 592 can reduce electrical resistance, so wiring 59
4 can be suitably used.

Each of the second electrodes 592 extends in one direction, and a plurality of second electrodes 592 are provided in a striped pattern.

The wiring 594 is provided so as to intersect with one of the second electrodes 592.

A pair of first electrodes 591 are provided so as to sandwich one of the second electrodes 592, and the wiring 594 electrically connects the pair of first electrodes 591.

The plurality of first electrodes 591 do not necessarily have to be arranged in a direction orthogonal to one of the second electrodes 592.

One wire 598 is electrically connected to the first electrode 591 or the second electrode 592. A part of the wiring 598 functions as a terminal. As the wiring 598, for example, a metal material such as aluminum, gold, platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy material containing the metal material can be used. can.

The touch sensor 595 can be protected by providing an insulating layer that covers the insulating layer 593 and the wiring 594.

Further, the connection layer 599 electrically connects the wiring 598 and the FPC 509 (2).

The connecting layer 599 includes various anisotropic conductive films (ACF: Anisotropic).
Conducive Film) and anisotropic conductive paste (ACP: Anisotro)
A pic Conductive Paste) or the like can be used.

The adhesive layer 597 has translucency. For example, a thermosetting resin or an ultraviolet curable resin can be used, and specifically, a resin such as acrylic, urethane, epoxy, or a resin having a siloxane bond can be used.

The display unit 501 includes a plurality of pixels arranged in a matrix. Pixels include a display element and a pixel circuit that drives the display element.

In the present embodiment, a case where an organic EL element that emits white light is applied to the display element will be described, but the display element is not limited to this.

For example, an organic EL element having a different emission color may be applied to each sub-pixel so that the color of the light emitted to each sub-pixel is different. In that case, the colored layer may not be provided.

The same configuration as that of the configuration example 2-1 can be applied to the substrate 510, the substrate 570, and the sealing layer 560.

The pixel includes a sub-pixel 502R, and the sub-pixel 502R includes a light emitting module 580R.

The sub-pixel 502R includes a pixel circuit including a transistor 502t capable of supplying power to the first light emitting element 550R and the first light emitting element 550R. In addition, the light emitting module 5
The 80R includes a first light emitting element 550R and an optical element (for example, a colored layer 567R).

The light emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode.

The light emitting module 580R has a first colored layer 567R in the direction of extracting light.

When the sealing layer 560 is provided on the side from which light is taken out, the sealing layer 560 is in contact with the first light emitting element 550R and the first colored layer 567R.

The first colored layer 567R is located at a position overlapping with the first light emitting element 550R. As a result, a part of the light emitted by the light emitting element 550R passes through the first colored layer 567R and is emitted to the outside of the light emitting module 580R in the direction of the arrow shown in the drawing.

The display unit 501 has a light-shielding layer 567BM in the direction of emitting light. The light-shielding layer 567BM
It is provided so as to surround the colored layer (for example, the first colored layer 567R).

The display unit 501 is provided with an antireflection layer 567p at a position overlapping the pixels. Anti-reflection layer 567p
For example, a circularly polarizing plate can be used.

The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 can be used as a layer for flattening the unevenness caused by the pixel circuit. Further, a laminated film including a layer capable of suppressing the diffusion of impurities can be applied to the insulating film 521. As a result, it is possible to suppress a decrease in reliability of the transistor 502t or the like due to diffusion of impurities.

The display unit 501 has a light emitting element (for example, the first light emitting element 550R) on the insulating film 521.

The display unit 501 has a partition wall 528 overlapping the end portion of the first lower electrode on the insulating film 521.
Further, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528.

The scanning line drive circuit 503g (1) includes a transistor 503t and a capacitance 503c. The drive circuit can be formed on the same substrate in the same process as the pixel circuit.

The display unit 501 includes a wiring 511 capable of supplying a signal, and the terminal 519 is a wiring 51.
It is provided in 1. An FP that can supply signals such as image signals and synchronization signals.
C509 (1) is electrically connected to the terminal 519.

A printed wiring board (PWB) may be attached to the FPC 509 (1).

The display unit 501 has wiring such as a scanning line, a signal line, and a power supply line. The various conductive films described above can be used for wiring.

Various transistors can be applied to the display unit 501. 16 (A) and 16 (B) show the configuration when the bottom gate type transistor is applied to the display unit 501.

For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 502t and the transistor 503t shown in FIG. 16 (A).

For example, a semiconductor layer containing polycrystalline silicon crystallized by a treatment such as laser annealing can be applied to the transistor 502t and the transistor 503t shown in FIG. 16B.

Further, FIG. 16 (FIG. 16) shows a configuration in which a top gate type transistor is applied to the display unit 501.
It is illustrated in C).

For example, the transistor 502t and the transistor 50 shown in FIG. 16C show a semiconductor layer including a single crystal silicon film transferred from a polycrystalline silicon or a single crystal silicon substrate or the like.
It can be applied to 3t.

<Structure Example 2-3>
FIG. 17 is a cross-sectional view of the touch panel 505B. The touch panel 505B described in the present embodiment is a display unit 5 that displays the supplied image information on the side where the transistor is provided.
It is different from the touch panel 505 of the configuration example 2-2 in that the 01 is provided and the touch sensor is provided on the substrate 510 side of the display unit. Here, different configurations will be described in detail, and the above description will be used for parts where similar configurations can be used.

The first colored layer 567R is located at a position overlapping with the first light emitting element 550R. In addition, FIG. 17 (A)
), The light emitting element 550R emits light to the side where the transistor 502t is provided. As a result, a part of the light emitted by the light emitting element 550R passes through the first colored layer 567R.
It is emitted to the outside of the light emitting module 580R in the direction of the arrow shown in the figure.

The display unit 501 has a light-shielding layer 567BM in the direction of emitting light. The light-shielding layer 567BM
It is provided so as to surround the colored layer (for example, the first colored layer 567R).

The touch sensor 595 is provided on the substrate 510 side of the display unit 501 (FIG. 17 (A)).
..

The adhesive layer 597 is located between the substrate 510 and the substrate 590, and is a display unit 501 and a touch sensor 59.
Paste 5 together.

Various transistors can be applied to the display unit 501. 17 (A) and 17 (B) show the configuration when the bottom gate type transistor is applied to the display unit 501.

For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like can be applied to the transistor 502t and the transistor 503t shown in FIG. 17 (A).

For example, the transistor 50 in which the semiconductor layer containing polycrystalline silicon or the like is shown in FIG. 17 (B).
It can be applied to 2t and transistor 503t.

Further, FIG. 17 (FIG. 17) shows a configuration in which a top gate type transistor is applied to the display unit 501.
It is illustrated in C).

For example, a semiconductor layer containing polycrystalline silicon, a transferred single crystal silicon film, or the like is shown in FIG. 17 (
It can be applied to the transistor 502t and the transistor 503t shown in C).

This embodiment can be appropriately combined with other embodiments.

10 Housing 11 Display device 11a Display area 11b Non-display area 11c First area 11d Second area 13 Protective layer 13a Protective layer 13b Protective layer 15 Support 15a Support 15b Support 16 Winding part 17 Translucency Area 18 Member 19 Fixed unit 20 Member 21 Operation button 31 Operation button 32 Image sensor 226 Insulation layer 301 Display unit 302 Pixel 302B Sub pixel 302G Sub pixel 302R Sub pixel 302t Transistor 303c Capacity 303g (1) Scanning line drive circuit 303g (2) ) Image pickup pixel drive circuit 303s (1) Image signal line drive circuit 303s (2) Image pickup signal line drive circuit 303t Transistor 304 Gate 308 Image pickup pixel 308p Photoelectric conversion element 308t Transistor 309 FPC
311 Wiring 319 Terminal 321 Insulation layer 328 Partition 329 Spacer 350R Light emitting element 351R Lower electrode 352 Upper electrode 353 EL layer 353a Light emitting unit 353b Light emitting unit 354 Intermediate layer 367BM Light shielding layer 367p Anti-reflection layer 367R Colored layer 380B Light emitting module 380G Module 390 Touch panel 401 Lower electrode 402 EL layer 403 Upper electrode 405 Insulation layer 407 Adhesive layer 420 Flexible substrate 422 Adhesive layer 424 Insulation layer 426 Adhesive layer 428 Flexible substrate 431 Light-shielding layer 432 Colored layer 435 Conductive layer 450 Organic EL element 453 Overcoat 454 Transistor 455 Transistor 457 Conductive layer 463 Insulation layer 465 Insulation layer 467 Insulation layer 491 Light emitting part 493 Drive circuit part 495 FPC
494 Insulation layer 497 Connection body 501 Display unit 502R Sub-pixel 502t Transistor 503c Capacity 503g Scanning line drive circuit 503t Transistor 505 Touch panel 505B Touch panel 509 FPC
510 Substrate 510a Insulation layer 510b Flexible substrate 510c Adhesive layer 511 Wiring 519 Terminal 521 Insulation film 528 Partition 550R Light emitting element 560 Sealing layer 567BM Light shielding layer 567p Anti-reflection layer 567R Colored layer 570 Substrate 570a Insulation layer 570b Flexible substrate 570c Adhesive layer 580R Light emitting module 590 Board 591 First electrode 592 Second electrode 593 Insulation layer 594 Wiring 595 Touch sensor 597 Adhesive layer 598 Wiring 599 Connection layer 1301 Element layer 1303 Flexible board 1304 Part 1305 Adhesive layer 1306 Drive circuit part 1308 FPC
1357 Conductive layer 1401 Flexible substrate 1403 Adhesive layer 1405 Insulation layer 1407 Insulation layer 1409 Insulation layer 1411 Insulation layer 1413 Adhesion layer 1415 Connection body 1430 Light emitting element 1431 Lower electrode 1433 EL layer 1435 Upper electrode 1440 Transistor 1455 Insulation layer 1457 Light shielding layer 1459 Colored layer 1461 Overcoat 1501 Fabrication substrate 1503 Release layer 1505 Fabrication substrate 1507 Release layer

Claims (1)

It has a flexible display and
The display unit includes a first flexible substrate, a light emitting element on the first flexible substrate, a sealing layer on the light emitting element, and a second flexibility on the sealing layer. An electronic device that has a substrate and
Has a photoelectric conversion element
The photoelectric conversion element is arranged below the upper electrode of the light emitting element, and has a function of detecting light incident on the second flexible substrate, the sealing layer, and the upper electrode of the light emitting element. Have and
An electronic device in which a partition wall arranged between an upper electrode and a lower electrode of the light emitting element is removed in a region overlapping the photoelectric conversion element.

Images