JP6747970B2 - タッチセンサ装置 - Google Patents

タッチセンサ装置 Download PDF

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Publication number
JP6747970B2
JP6747970B2 JP2016519861A JP2016519861A JP6747970B2 JP 6747970 B2 JP6747970 B2 JP 6747970B2 JP 2016519861 A JP2016519861 A JP 2016519861A JP 2016519861 A JP2016519861 A JP 2016519861A JP 6747970 B2 JP6747970 B2 JP 6747970B2
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JP
Japan
Prior art keywords
touch sensor
metal
sensor device
layer
touch
Prior art date
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Active
Application number
JP2016519861A
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English (en)
Japanese (ja)
Other versions
JP2016533562A5 (de
JP2016533562A (ja
Inventor
ケステンバウアー、ハラルト
ローレンツ、ドミニク
ツェン、ブルース
ヴィンクラー、ヨルク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plansee SE
Original Assignee
Plansee SE
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Publication of JP2016533562A publication Critical patent/JP2016533562A/ja
Publication of JP2016533562A5 publication Critical patent/JP2016533562A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
JP2016519861A 2013-10-04 2014-10-01 タッチセンサ装置 Active JP6747970B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM319/2013U AT13879U1 (de) 2013-10-04 2013-10-04 Berührungssensoranordnung
ATGM319/2013 2013-10-04
PCT/AT2014/000178 WO2015048828A1 (de) 2013-10-04 2014-10-01 Berührungssensoranordnung

Publications (3)

Publication Number Publication Date
JP2016533562A JP2016533562A (ja) 2016-10-27
JP2016533562A5 JP2016533562A5 (de) 2017-09-21
JP6747970B2 true JP6747970B2 (ja) 2020-08-26

Family

ID=51660823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016519861A Active JP6747970B2 (ja) 2013-10-04 2014-10-01 タッチセンサ装置

Country Status (6)

Country Link
JP (1) JP6747970B2 (de)
KR (1) KR102388979B1 (de)
CN (1) CN105593800B (de)
AT (1) AT13879U1 (de)
TW (1) TWI623871B (de)
WO (1) WO2015048828A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101844134B1 (ko) 2015-03-27 2018-03-30 주식회사 엘지화학 전도성 구조체, 이의 제조방법 및 전도성 구조체를 포함하는 전극
WO2017099476A1 (ko) * 2015-12-07 2017-06-15 주식회사 엘지화학 전도성 구조체, 이의 제조방법 및 전도성 구조체를 포함하는 전극
JP6575601B2 (ja) * 2016-04-01 2019-09-18 凸版印刷株式会社 印刷体、印刷体管理装置、情報出力システム、及び印刷体のページ識別方法、ブックカバー、印刷体の表紙
TWI581158B (zh) * 2016-06-01 2017-05-01 友達光電股份有限公司 觸控面板及其製作方法
KR102573333B1 (ko) * 2016-06-28 2023-08-31 삼성디스플레이 주식회사 표시 장치
US10151953B2 (en) * 2017-02-22 2018-12-11 A. U. Vista, Inc. In-plane switching display having protrusion electrodes with metal enhanced adhesion
CN108121098B (zh) 2017-12-19 2019-08-06 友达光电股份有限公司 金属结构及其制作方法与应用的显示面板
CN110872687B (zh) * 2018-09-03 2022-07-19 大同特殊钢株式会社 层叠体及靶材
TWI722860B (zh) * 2020-04-08 2021-03-21 新唐科技股份有限公司 氣體感測材料與氣體感測器
CN114510167B (zh) * 2020-11-17 2024-04-12 瀚宇彩晶股份有限公司 触控感测面板
CN112680967B (zh) * 2020-12-15 2022-02-18 武汉纺织大学 具有单向导湿作用的压阻传感织物及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4071849B2 (ja) * 1997-10-08 2008-04-02 アルバック成膜株式会社 ブランクス及びブラックマトリクス
US7378146B1 (en) * 1998-08-05 2008-05-27 International Business Machines Corporation Transparent hard coats for optical elements
JP3735814B2 (ja) * 2001-09-28 2006-01-18 Ｈｏｙａ株式会社 液晶表示パネル用対向基板、及び液晶表示パネル
US8259078B2 (en) 2006-06-09 2012-09-04 Apple Inc. Touch screen liquid crystal display
TWI450237B (zh) * 2010-01-14 2014-08-21 Wintek Corp 觸控顯示裝置
AT11941U1 (de) 2010-02-12 2011-07-15 Plansee Metall Gmbh Berührungssensoranordnung
CN102243553B (zh) * 2010-05-16 2015-06-10 宸鸿科技(厦门)有限公司 电容式触控面板及降低其金属导体可见度的方法
EP2402481A1 (de) * 2010-06-29 2012-01-04 Applied Materials, Inc. Verfahren und System zur Herstellung eines durchsichtigen Körpers zur Verwendung in einem Berührungsbildschirm
US8449817B2 (en) * 2010-06-30 2013-05-28 H.C. Stark, Inc. Molybdenum-containing targets comprising three metal elements
TWI432115B (zh) * 2010-10-19 2014-03-21 Lg Chemical Ltd 包含導電圖案之觸控面板及其製備方法
KR101367569B1 (ko) * 2010-12-29 2014-02-28 주식회사 엘지화학 터치 스크린 및 이의 제조방법
JP2012173799A (ja) * 2011-02-17 2012-09-10 Sumitomo Chemical Co Ltd 透明導電性基板、それを用いた電子デバイスおよびタッチパネル
CN103477398B (zh) * 2011-03-28 2016-12-07 Lg化学株式会社 导电基板和包含其的触摸屏
KR101380000B1 (ko) * 2011-03-28 2014-04-10 주식회사 엘지화학 전도성 구조체, 터치패널 및 이의 제조방법
JP2013020347A (ja) * 2011-07-08 2013-01-31 Toppan Printing Co Ltd タッチパネルおよびタッチパネルの製造方法
KR101415583B1 (ko) * 2011-12-16 2014-07-07 엘지이노텍 주식회사 터치 패널 및 그 제조 방법
TWM472245U (zh) * 2013-07-31 2014-02-11 Wintek Corp 觸控面板

Also Published As

Publication number Publication date
KR102388979B1 (ko) 2022-04-20
CN105593800A (zh) 2016-05-18
AT13879U1 (de) 2014-10-15
CN105593800B (zh) 2019-11-08
WO2015048828A1 (de) 2015-04-09
JP2016533562A (ja) 2016-10-27
TWI623871B (zh) 2018-05-11
TW201528096A (zh) 2015-07-16
KR20160067849A (ko) 2016-06-14

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