CN105593800B - 触控传感器装置 - Google Patents
触控传感器装置 Download PDFInfo
- Publication number
- CN105593800B CN105593800B CN201480054704.5A CN201480054704A CN105593800B CN 105593800 B CN105593800 B CN 105593800B CN 201480054704 A CN201480054704 A CN 201480054704A CN 105593800 B CN105593800 B CN 105593800B
- Authority
- CN
- China
- Prior art keywords
- touch sensing
- layer
- sensing device
- metal
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Position Input By Displaying (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATGM319/2013U AT13879U1 (de) | 2013-10-04 | 2013-10-04 | Berührungssensoranordnung |
ATGM319/2013 | 2013-10-04 | ||
PCT/AT2014/000178 WO2015048828A1 (de) | 2013-10-04 | 2014-10-01 | Berührungssensoranordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105593800A CN105593800A (zh) | 2016-05-18 |
CN105593800B true CN105593800B (zh) | 2019-11-08 |
Family
ID=51660823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480054704.5A Active CN105593800B (zh) | 2013-10-04 | 2014-10-01 | 触控传感器装置 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6747970B2 (de) |
KR (1) | KR102388979B1 (de) |
CN (1) | CN105593800B (de) |
AT (1) | AT13879U1 (de) |
TW (1) | TWI623871B (de) |
WO (1) | WO2015048828A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101844134B1 (ko) | 2015-03-27 | 2018-03-30 | 주식회사 엘지화학 | 전도성 구조체, 이의 제조방법 및 전도성 구조체를 포함하는 전극 |
WO2017099476A1 (ko) * | 2015-12-07 | 2017-06-15 | 주식회사 엘지화학 | 전도성 구조체, 이의 제조방법 및 전도성 구조체를 포함하는 전극 |
JP6575601B2 (ja) * | 2016-04-01 | 2019-09-18 | 凸版印刷株式会社 | 印刷体、印刷体管理装置、情報出力システム、及び印刷体のページ識別方法、ブックカバー、印刷体の表紙 |
TWI581158B (zh) * | 2016-06-01 | 2017-05-01 | 友達光電股份有限公司 | 觸控面板及其製作方法 |
KR102573333B1 (ko) * | 2016-06-28 | 2023-08-31 | 삼성디스플레이 주식회사 | 표시 장치 |
US10151953B2 (en) * | 2017-02-22 | 2018-12-11 | A. U. Vista, Inc. | In-plane switching display having protrusion electrodes with metal enhanced adhesion |
CN108121098B (zh) | 2017-12-19 | 2019-08-06 | 友达光电股份有限公司 | 金属结构及其制作方法与应用的显示面板 |
CN110872687B (zh) * | 2018-09-03 | 2022-07-19 | 大同特殊钢株式会社 | 层叠体及靶材 |
TWI722860B (zh) * | 2020-04-08 | 2021-03-21 | 新唐科技股份有限公司 | 氣體感測材料與氣體感測器 |
CN114510167B (zh) * | 2020-11-17 | 2024-04-12 | 瀚宇彩晶股份有限公司 | 触控感测面板 |
CN112680967B (zh) * | 2020-12-15 | 2022-02-18 | 武汉纺织大学 | 具有单向导湿作用的压阻传感织物及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11119676A (ja) * | 1997-10-08 | 1999-04-30 | Ulvac Seimaku Kk | ブランクス及びブラックマトリクス |
WO2012134174A2 (ko) * | 2011-03-28 | 2012-10-04 | 주식회사 엘지화학 | 전도성 구조체, 터치패널 및 이의 제조방법 |
CN103168285A (zh) * | 2010-10-19 | 2013-06-19 | Lg化学株式会社 | 包括导电图形的触摸面板及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7378146B1 (en) * | 1998-08-05 | 2008-05-27 | International Business Machines Corporation | Transparent hard coats for optical elements |
JP3735814B2 (ja) * | 2001-09-28 | 2006-01-18 | Hoya株式会社 | 液晶表示パネル用対向基板、及び液晶表示パネル |
US8259078B2 (en) | 2006-06-09 | 2012-09-04 | Apple Inc. | Touch screen liquid crystal display |
TWI450237B (zh) * | 2010-01-14 | 2014-08-21 | Wintek Corp | 觸控顯示裝置 |
AT11941U1 (de) | 2010-02-12 | 2011-07-15 | Plansee Metall Gmbh | Berührungssensoranordnung |
CN102243553B (zh) * | 2010-05-16 | 2015-06-10 | 宸鸿科技(厦门)有限公司 | 电容式触控面板及降低其金属导体可见度的方法 |
EP2402481A1 (de) * | 2010-06-29 | 2012-01-04 | Applied Materials, Inc. | Verfahren und System zur Herstellung eines durchsichtigen Körpers zur Verwendung in einem Berührungsbildschirm |
US8449817B2 (en) * | 2010-06-30 | 2013-05-28 | H.C. Stark, Inc. | Molybdenum-containing targets comprising three metal elements |
KR101367569B1 (ko) * | 2010-12-29 | 2014-02-28 | 주식회사 엘지화학 | 터치 스크린 및 이의 제조방법 |
JP2012173799A (ja) * | 2011-02-17 | 2012-09-10 | Sumitomo Chemical Co Ltd | 透明導電性基板、それを用いた電子デバイスおよびタッチパネル |
CN103477398B (zh) * | 2011-03-28 | 2016-12-07 | Lg化学株式会社 | 导电基板和包含其的触摸屏 |
JP2013020347A (ja) * | 2011-07-08 | 2013-01-31 | Toppan Printing Co Ltd | タッチパネルおよびタッチパネルの製造方法 |
KR101415583B1 (ko) * | 2011-12-16 | 2014-07-07 | 엘지이노텍 주식회사 | 터치 패널 및 그 제조 방법 |
TWM472245U (zh) * | 2013-07-31 | 2014-02-11 | Wintek Corp | 觸控面板 |
-
2013
- 2013-10-04 AT ATGM319/2013U patent/AT13879U1/de not_active IP Right Cessation
-
2014
- 2014-08-20 TW TW103128585A patent/TWI623871B/zh active
- 2014-10-01 CN CN201480054704.5A patent/CN105593800B/zh active Active
- 2014-10-01 WO PCT/AT2014/000178 patent/WO2015048828A1/de active Application Filing
- 2014-10-01 JP JP2016519861A patent/JP6747970B2/ja active Active
- 2014-10-01 KR KR1020167008753A patent/KR102388979B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11119676A (ja) * | 1997-10-08 | 1999-04-30 | Ulvac Seimaku Kk | ブランクス及びブラックマトリクス |
CN103168285A (zh) * | 2010-10-19 | 2013-06-19 | Lg化学株式会社 | 包括导电图形的触摸面板及其制备方法 |
WO2012134174A2 (ko) * | 2011-03-28 | 2012-10-04 | 주식회사 엘지화학 | 전도성 구조체, 터치패널 및 이의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR102388979B1 (ko) | 2022-04-20 |
CN105593800A (zh) | 2016-05-18 |
AT13879U1 (de) | 2014-10-15 |
WO2015048828A1 (de) | 2015-04-09 |
JP6747970B2 (ja) | 2020-08-26 |
JP2016533562A (ja) | 2016-10-27 |
TWI623871B (zh) | 2018-05-11 |
TW201528096A (zh) | 2015-07-16 |
KR20160067849A (ko) | 2016-06-14 |
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