JP6740946B2 - 回路装置 - Google Patents

回路装置 Download PDF

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Publication number
JP6740946B2
JP6740946B2 JP2017068332A JP2017068332A JP6740946B2 JP 6740946 B2 JP6740946 B2 JP 6740946B2 JP 2017068332 A JP2017068332 A JP 2017068332A JP 2017068332 A JP2017068332 A JP 2017068332A JP 6740946 B2 JP6740946 B2 JP 6740946B2
Authority
JP
Japan
Prior art keywords
circuit board
conductor
radiator
circuit
extending portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017068332A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018170462A5 (https=
JP2018170462A (ja
Inventor
俊悟 平谷
俊悟 平谷
秀哲 田原
秀哲 田原
佑一 服部
佑一 服部
原口　章
章 原口
池田　潤
潤 池田
有延 中村
有延 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2017068332A priority Critical patent/JP6740946B2/ja
Priority to PCT/JP2018/010715 priority patent/WO2018180671A1/ja
Priority to DE112018001761.3T priority patent/DE112018001761T5/de
Priority to CN201880017126.6A priority patent/CN110495262B/zh
Priority to US16/495,428 priority patent/US10609811B2/en
Publication of JP2018170462A publication Critical patent/JP2018170462A/ja
Publication of JP2018170462A5 publication Critical patent/JP2018170462A5/ja
Application granted granted Critical
Publication of JP6740946B2 publication Critical patent/JP6740946B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Connection Or Junction Boxes (AREA)
JP2017068332A 2017-03-30 2017-03-30 回路装置 Active JP6740946B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017068332A JP6740946B2 (ja) 2017-03-30 2017-03-30 回路装置
PCT/JP2018/010715 WO2018180671A1 (ja) 2017-03-30 2018-03-19 回路装置
DE112018001761.3T DE112018001761T5 (de) 2017-03-30 2018-03-19 Schaltungseinrichtung
CN201880017126.6A CN110495262B (zh) 2017-03-30 2018-03-19 电路装置
US16/495,428 US10609811B2 (en) 2017-03-30 2018-03-19 Circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017068332A JP6740946B2 (ja) 2017-03-30 2017-03-30 回路装置

Publications (3)

Publication Number Publication Date
JP2018170462A JP2018170462A (ja) 2018-11-01
JP2018170462A5 JP2018170462A5 (https=) 2019-10-10
JP6740946B2 true JP6740946B2 (ja) 2020-08-19

Family

ID=63675606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017068332A Active JP6740946B2 (ja) 2017-03-30 2017-03-30 回路装置

Country Status (5)

Country Link
US (1) US10609811B2 (https=)
JP (1) JP6740946B2 (https=)
CN (1) CN110495262B (https=)
DE (1) DE112018001761T5 (https=)
WO (1) WO2018180671A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252573A (ja) * 1993-02-25 1994-09-09 Fujitsu Ten Ltd 回路基板の筐体取付構造、および回路基板
DE10254910B4 (de) 2001-11-26 2008-12-24 AutoNetworks Technologies, Ltd., Nagoya Schaltkreisbildende Einheit und Verfahren zu deren Herstellung
JP4681350B2 (ja) * 2005-05-20 2011-05-11 株式会社オートネットワーク技術研究所 電気接続箱
JP2010245174A (ja) 2009-04-02 2010-10-28 Denso Corp 電子制御ユニット及びその製造方法
JP5609680B2 (ja) * 2010-08-27 2014-10-22 ソニー株式会社 放熱構造及び電子機器
JP6252873B2 (ja) * 2015-03-27 2017-12-27 株式会社オートネットワーク技術研究所 車載配電基板、電気接続箱および充放電コントローラ

Also Published As

Publication number Publication date
WO2018180671A1 (ja) 2018-10-04
DE112018001761T5 (de) 2020-03-05
CN110495262A (zh) 2019-11-22
JP2018170462A (ja) 2018-11-01
US10609811B2 (en) 2020-03-31
CN110495262B (zh) 2020-09-25
US20200077509A1 (en) 2020-03-05

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