JP6736377B2 - Electronic endoscopic device - Google Patents

Description

The present invention relates to a mounting structure for an electronic endoscope device.

As an endoscope system for observing the inside of a lumen such as a human esophagus or intestine, an electronic scope having an image sensor, a processor for processing an image signal transmitted from the electronic scope, and an image signal processed by the processor There is known an endoscope system including a monitor that displays an observation image. The electronic scope has an insertion tube having an imaging element mounted on the distal end side, and a connecting portion connected to the proximal end side of the insertion tube. The image pickup device and the endoscope processor are connected via a cable passed through the insertion tube and a circuit board inside the connection portion (for example, refer to Patent Document 1).

International publication 2011/052408 pamphlet

In Patent Document 1, the cable is connected to a relay board and attached to a circuit board (parent board) in the electronic scope by a board-to-board connector. However, if the number of cables increases or the diameter of the cables increases as the resolution of the image pickup device increases, the thickness of the connection portion between the cables and the relay board increases. In addition, coating the cable with a conductive shield to prevent noise from being superimposed on the signal transmitted by the cable requires a cable to connect the shield to ground (eg, frame ground). In this case, the number of cables connected to the relay board is further increased. Further, the thickness of the connection portion between the cable and the relay board is further increased by the thickness of the shield that covers the cable. If the thickness of the connecting portion becomes large, the cable and the shield may interfere with the parent board, and a problem may occur in the fitting of the board-to-board connector. The relay board is passed through the flexible tube of the electronic scope when the electronic scope is assembled. Therefore, if the width of the relay board is increased in order to reduce the thickness of the connection portion, the relay board may not be able to pass through the flexible tube.

The present invention has been made in view of the above circumstances, and an object of the present invention is to attach an relay board to a parent board by using a board-to-board connector without increasing the size of the relay board and to reduce electromagnetic noise. It is an object of the present invention to provide a mounting structure capable of shielding the above problem and eliminating the fitting failure of the board-to-board connector.

A mounting structure according to an embodiment of the present invention is a mounting structure for an electronic endoscope apparatus having an electronic scope and a processor, wherein the sheath is inserted into a flexible tube of the electronic scope, and is inserted into the sheath. A plurality of cables each having one end connected to the image pickup device of the electronic scope, a relay board having the other ends of the cables pulled out from the end of the sheath attached, and a relay board and a connector detachably connected And a conductive shield case that covers at least a part of the main substrate. Further, the sheath has a conductive shield member capable of inserting a plurality of cables, and the shield member is electrically connected to the shield case at the end of the sheath.

With such a configuration, electromagnetic noise that is incident on the cable from the outside is shielded by the shield member and the shield case, and noise is prevented from being superimposed on the signal transmitted by the cable. Further, since the end portion of the cable pulled out from the sheath is connected to the relay board, the thickness of the connection portion between the cable and the relay board can be reduced without increasing the size of the relay board. Accordingly, when the relay board and the mother board are connected by the connector, the sheath does not interfere with the mother board, so that the fitting failure of the connector is prevented.

Further, in one embodiment of the present invention, the shield member is formed of, for example, a plurality of metal wires, and each of the plurality of metal wires is electrically connected to the shield case at the end of the sheath.

Further, in one embodiment of the present invention, the mounting structure further includes, for example, a metal holding member that holds the sheath. In this configuration, the holding member is attached to the shield case while holding the sheath, and the shield member is electrically connected to the shield case via the holding member.

In one embodiment of the present invention, for example, at the end of the sheath, the end of the shield member is arranged along the outer peripheral surface of the sheath, and the holding member has a holding surface that holds the outer peripheral surface of the sheath. The end portion of the shield member is electrically connected to the holding member by being sandwiched between the outer peripheral surface of the sheath and the holding surface.

Further, in one embodiment of the present invention, for example, at the end of the sheath, the plurality of metal wires are bundled and then electrically connected to the holding member.

Further, in one embodiment of the present invention, for example, the processor includes a metal frame, and the shield case is electrically connected to the frame.

Further, in one embodiment of the present invention, for example, the processor includes an RC circuit having a resistor and a capacitor, and the shield case is electrically connected to the frame via the RC circuit.

According to an embodiment of the present invention, in a configuration in which the relay board is attached to the parent board using the board-to-board connector, electromagnetic noise is shielded and the board-to-board connector is fitted without increasing the size of the relay board. Provided is a mounting structure capable of solving the problem.

It is a block diagram which shows the structure of the electronic endoscope apparatus which concerns on embodiment of this invention. It is a schematic diagram of a connecting portion of a relay board and a driver circuit board with which an electronic scope concerning an embodiment of the present invention was equipped. FIG. 6 is a diagram for explaining a problem of the board-to-board connector of the relay board and the driver circuit board according to the embodiment of the present invention. It is a schematic diagram of a connecting portion of an electronic scope and a processor concerning an embodiment of the present invention. It is a perspective view of the end part of the sheath concerning the embodiment of the present invention. It is a figure for demonstrating the connection method of the sheath and shield member and shield case which concern on embodiment of this invention. It is a perspective view of the end part of the sheath concerning the modification of the embodiment of the present invention. It is a figure for demonstrating the connection method of the sheath and shield member and shield case which concern on the modification of embodiment of this invention. It is a perspective view of the end part of a sheath and a holding member concerning a modification of an embodiment of the present invention. It is a figure for demonstrating the connection method of the sheath and shield member and shield case which concern on the modification of embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following, an electronic endoscope apparatus will be described as an example of an embodiment of the present invention.

FIG. 1 is a block diagram showing the configuration of an electronic endoscope apparatus 1 according to an embodiment of the present invention. As shown in FIG. 1, the electronic endoscope device 1 is a device specialized for medical use, and includes an electronic scope 100, a processor 200, and a monitor 300.

The processor 200 includes a primary circuit 210, a secondary circuit 220, an isolator 230, an operation panel 240, and a light source unit 250. The isolator 230 insulates the primary circuit 210 and the secondary circuit 220 from direct current. As the isolator 230, for example, a photocoupler, an isolator using a pulse transformer, a GMR (Giant Magneto Resistance) isolator, or the like is used.

The secondary circuit 220 includes a system controller 221, a timing controller 222, a memory 223, and a post-stage signal processing circuit 224. The system controller 221 executes various programs stored in the memory 223 and controls the entire electronic endoscope apparatus 1 in an integrated manner. The system controller 221 is also connected to the operation panel 240. The system controller 221 changes each operation of the electronic endoscope apparatus 1 and parameters for each operation according to an instruction from the operator input from the operation panel 240. The timing controller 222 outputs a clock pulse for adjusting the operation timing of each unit to each circuit in the electronic endoscope apparatus 1.

The light source unit 250 includes a lamp 251, a lamp power source igniter 252, and a condenser lens 253. The lamp 251 emits the irradiation light L after being started by the lamp power igniter 252. The lamp 251 is, for example, a high-intensity lamp such as a xenon lamp, a halogen lamp, a mercury lamp, and a metal halide lamp. The lamp 251 may be a semiconductor light emitting element such as an LD (Laser Diode) or an LED (Light Emitting Diode). The irradiation light L is light (or white light including at least the visible light region) having a spectrum that mainly spreads from the visible light region to the invisible infrared light region.

The irradiation light L emitted from the lamp 251 is condensed by the condenser lens 253 on the incident end face of the LCB (Light Carrying Bundle) 102 and is incident on the inside of the LCB 102.

The irradiation light L incident on the LCB 102 propagates inside the LCB 102. The irradiation light L propagating in the LCB 102 is emitted from the emission end surface of the LCB 102 arranged at the tip of the electronic scope 100, and is irradiated to the subject through the light distribution lens 104. The return light from the subject illuminated by the illumination light L forms an optical image on the light receiving surface of the solid-state image sensor 108 via the objective lens 106.

The solid-state image sensor 108 is a single-plate color CCD (Charge Coupled Device) image sensor having a complementary color checkered pixel arrangement. The solid-state imaging device 108 accumulates the optical image formed on each pixel on the light-receiving surface as electric charge according to the amount of light, and generates pixel signals of yellow Ye, cyan Cy, green G, and magenta Mg, which are generated. The pixel signals of two vertically adjacent pixels are added, mixed, and output. The solid-state image sensor 108 is not limited to the CCD image sensor, and may be replaced with a CMOS (Complementary Metal Oxide Semiconductor) image sensor or another type of image pickup device. The solid-state image sensor 108 may also have a primary color filter (Bayer array filter) mounted thereon.

A driver signal processing circuit 110 is provided in the connection section 122 of the electronic scope 100. The pixel signal of the subject illuminated by the illumination light L is input to the driver signal processing circuit 110 from the solid-state image sensor 108 at a predetermined frame rate. In this embodiment, the frame rate is 1/30 second. The driver signal processing circuit 110 performs predetermined signal processing such as amplification processing on the pixel signal input from the solid-state image sensor 108 and outputs the signal to the primary circuit 210 of the processor 200.

Further, the driver signal processing circuit 110 accesses the memory 112 and reads the unique information of the electronic scope 100. The unique information of the electronic scope 100 recorded in the memory 112 includes, for example, the number of pixels and sensitivity of the solid-state imaging device 108, operable frame rate, model number, and the like. The driver signal processing circuit 110 outputs the unique information read from the memory 112 to the processor 200.

The unique information of the electronic scope 100 read from the memory 112 is input to the system controller 221. The system controller 221 performs various calculations based on the unique information of the electronic scope 100 to generate a control signal. The system controller 221 uses the generated control signal to control the operation and timing of various circuits in the processor 200 so that processing suitable for the electronic scope 100 connected to the processor 200 is performed.

The timing controller 222 supplies a clock pulse to the driver signal processing circuit 110 according to the timing control by the system controller 221. The driver signal processing circuit 110 drives and controls the solid-state imaging device 108 at a timing synchronized with the frame rate of the image processed on the processor 200 side in accordance with the clock pulse supplied from the timing controller 222. Further, the driver signal processing circuit 110 performs signal processing such as amplification processing on the pixel signal output from the solid-state image sensor 108, and outputs the pixel signal to the primary circuit 210 of the processor 200.

The primary circuit 210 includes a pre-stage signal processing circuit 211. The pre-stage signal processing circuit 211 performs predetermined signal processing such as demosaic processing, matrix calculation, and Y/C separation on the pixel signal input from the driver signal processing circuit 110 in one frame cycle to generate an image signal. The image signal is input to the post-stage signal processing circuit 224 of the secondary circuit 220 via the isolator 230.

The post-stage signal processing circuit 224 processes the image signal input from the primary circuit 210 to generate screen data for monitor display, and converts the generated screen data for monitor display into a video signal of a predetermined format. The converted video signal is output to the monitor 300. As a result, a color image of the subject is displayed on the display screen of the monitor 300.

Thus, in this embodiment, the primary circuit 210 and the secondary circuit 220 are connected by the isolator 230. As a result, the primary circuit 210 and the secondary circuit 220 are insulated from the direct current. Therefore, the secondary circuit 220 is prevented from electrically affecting the human body of the patient via the primary circuit 210 and the electronic scope 100.

Next, the structure of the connecting portion of the electronic scope 100 and the processor 200 in the electronic endoscope apparatus 1 will be described. FIG. 2 is a schematic diagram of a connecting portion of a relay board 131 provided in the electronic scope 100 and a parent board (driver circuit board) 140 to which the relay board 131 is connected.

The electronic scope 100 has a light guide tube 121 and a connecting portion 122 (see FIG. 1). The light guide tube 121 has flexibility, and the plurality of cables 130 and the LCB 102 (not shown in FIG. 2) are passed through the inside thereof. One end of each of the plurality of cables 130 is connected to the solid-state image sensor 108, and the other ends thereof are connected to the relay board 131. The plurality of cables 130 include a cable for applying a drive voltage to the solid-state image sensor 108, a cable for transmitting a clock signal for controlling the operation of the solid-state image sensor 108, and a pixel signal output from the solid-state image sensor 108. A cable for transmission, a ground wire (so-called signal ground), etc. are included. The end of the light guide tube 121 on the processor 200 side is attached to the connecting portion 122. The connection unit 122 is detachably connected to the processor 200.

A driver circuit board 140 having a driver signal processing circuit 110 is provided in the connection portion 122 of the electronic scope 100. The driver circuit board 140 is connected to the plurality of cables 130 via the relay board 131.

A board-to-board connector (for example, a connector plug) 132 is mounted on a connector fitting surface (hereinafter, also referred to as a back surface) side of the relay board 131, and the board-to-board connector 132 is mounted on the driver circuit board 140. The board-to-board connector (for example, a connector receptacle) 145 is detachably connected by connector fitting.

Since it is necessary to insert the relay board 131 into the light guide tube 121, the relay board 131 is configured in a narrow plate shape (a slender shape along the axial direction of the light guide tube 121). The plurality of cables 130 are connected to the front surface or the back surface of the relay board 131 by soldering. As described above, the configuration in which the plurality of cables 130 are connected to both surfaces of the relay board 131 has an advantage that even when the number of the cables 130 is large, the relay boards 131 can relay them.

Here, a problem of fitting failure that is expected to occur when the number of cables 130 increases will be described. FIG. 3 is a diagram for explaining a problem of the board-to-board connectors 132 and 145 of the relay board 131 and the driver circuit board 140. Specifically, FIG. 3 is a side view of the connecting portion of the relay board 131 and the driver circuit board 140 as viewed from the lateral direction perpendicular to the longitudinal direction of the relay board 131. A plurality of cables 130 are soldered to the relay board 131. The relay board 131 and the driver circuit board 140 are connected by board-to-board connectors 132 and 145.

The plurality of cables 130 are bundled in the sheath 160. The sheath 160 has a conductive shield member 161 inside (see FIG. 4 ). The shield member 161 has a tubular shape and is made of a metal wire. By bundling the plurality of cables 130 in the shield member 161, electromagnetic noise that enters the cables 130 from the outside is shielded by the shield member 161.

However, if the resolution of the solid-state image sensor 108 is increased, it is necessary to increase the number of cables 130 for transmitting pixel signals or increase the thickness of the cables 130. For example, when the solid-state image sensor 108 is changed from a pixel having about 1 million pixels to one having a resolution of 4K2K (for example, 4096×2160 pixels), if the number of bits of each pixel value and the frame rate do not change, The data amount of the pixel signal output from the solid-state image sensor 108 is about 8 times. Therefore, it is necessary to increase the number of cables 130 for transmitting the pixel signals, increase the frequency of the pixel signals, or both in accordance with the increase in the data amount. When the frequency of the pixel signal is increased, the cable 130 needs to be thick in order to reduce the resistance value of the cable 130. As described above, when the number of cables 130 for transmitting pixel signals is increased or the cables 130 are made thicker in order to cope with the higher resolution of the solid-state imaging device 108, it is necessary to increase the diameter of the sheath 160 accordingly. ..

Further, in order to connect the shield member 161 to the ground (for example, the frame ground of the processor 200), it is necessary to connect the end portion 161A of the shield member 161 to the relay board 131. As a result, the shield member 161 is connected to the frame ground of the processor 200 via the relay board 131 and the driver circuit board 140. However, when the end portion 161A of the shield member 161 is connected to the relay board 131, the number of wirings (the cable 130 and the end portion 161A of the shield member 161) connected to the relay board 131 increases.

In this way, if the number of cables 130 for transmitting pixel signals is increased from, for example, one to two, or if the cables 130 are covered with the shield member 161, as shown in FIG. The 161A (or the cable 130) or the outer peripheral portion of the sheath 160 may interfere with the driver circuit board 140, which may prevent complete fitting of the board-to-board connectors 132 and 145. This fitting failure becomes more serious as the number of cables 130 for transmitting pixel signals increases. Further, in order to reduce the thickness of the connection portion between the relay board 131 and the cable 130 or the end portion 161A, it is conceivable to widen the width of the relay board 131 so that the cables 130 are not aligned in the thickness direction. However, if the width of the relay board 131 is wide, the relay board 131 cannot be inserted into the light guide tube 121, which makes assembly of the electronic scope 100 difficult. Furthermore, if the sheath 160 covering the cable 130 is removed, the cable 130 is exposed to electromagnetic noise from the outside, so that noise is superimposed on the pixel signal transmitted by the cable 130. Therefore, in the present embodiment, a mounting structure capable of preventing the fitting failure of the board-to-board connectors 132 and 145 and shielding the cable 130 from electromagnetic noise without widening the width of the relay board 131. Take

FIG. 4 is a schematic diagram of a connecting portion between the electronic scope 100 and the processor 200 in the present embodiment. A driver circuit board 140 and a scope-side connection circuit board 141 are provided in the connection portion 122 of the electronic scope 100. The driver circuit board 140 and the scope-side connection circuit board 141 are connected by a relay connector 142 having a plurality of terminals. The driver circuit board 140 is covered with a metal shield case 150. The shield case 150 is provided with an opening 151 through which the cable 130 passes and an opening 152 through which the relay connector 142 passes. The shield case 150 is connected to the scope-side connection circuit board 141 by a shield cable 143.

The processor 200 has a processor-side connection circuit board 260. A detachable connector 261 having a plurality of terminals is attached to the processor-side connection circuit board 260. When the electronic scope 100 is attached to the processor 200, the detachable connector 261 connects the scope-side connection circuit board 141 and the processor-side connection circuit board 260.

The processor-side connection circuit board 260 is connected to the primary circuit 210. When the electronic scope 100 is mounted on the processor 200, the solid-state imaging device 108 is connected to the primary circuit 210 via the driver circuit board 140, the scope-side connection circuit board 141, and the processor-side connection circuit board 260. Further, the primary circuit 210 is connected to the secondary circuit 220 via the isolator 230.

The processor-side connection circuit board 260 is connected to the frame ground FG of the processor 200 via an RC circuit (parallel RC circuit) 262 having a resistor and a capacitor. The frame ground FG is a metal frame of the processor 200, and is, for example, a part of the housing 201 or the chassis of the processor 200. When the electronic scope 100 is attached to the processor 200, the shield case 150 is connected to the frame ground FG via the scope-side connection circuit board 141, the processor-side connection circuit board 260, and the RC circuit 262. The signal ground connected to the solid-state image sensor 108 is not connected to the frame ground FG.

The wiring that connects the solid-state imaging device 108 and the primary circuit 210 and the wiring that connects the shield case 150 and the frame ground FG all pass through the scope-side connection circuit board 141 and the processor-side connection circuit board 260. However, these wirings are arranged independently of each other. Therefore, the potential of the shield case 150 is maintained at the same potential as the frame ground FG regardless of the driving state of the driver signal processing circuit 110. As a result, the shield case 150 acts as a Faraday gauge on the driver circuit board 140.

Further, the sheath 160 into which the cable 130 is inserted is fixed to the shield case 150. As a result, even if the light guide tube 121 is bent and an external force is applied to the sheath 160, the external force disengages the board-to-board connector 132 of the relay board 131 and the board-to-board connector 145 of the driver circuit board 140. It is possible to prevent that.

The shield member 161 of the sheath 160 is electrically connected to the shield case 150. FIG. 5 is a perspective view of the end portion of the sheath 160, and FIG. 6 is a diagram for explaining a method of connecting the sheath 160, the shield member 161, and the shield case 150. 6A is a perspective view of the sheath 160 and the shield case 150, FIG. 6B is a cross-sectional view of the sheath 160, the shield case 150, and the driver circuit board 140, and FIG. 6C is a view of the shield case 150 of the sheath 160. It is a figure for demonstrating the fixing method of. Note that, in order to simplify the drawing, in FIG. 6B, a part of the cable 130 and the relay board 131 are not shown.

As shown in FIG. 5, the sheath 160 has a metallic shield member 161 and a resin coating 162. In the present embodiment, the shield member 161 is a plurality of metal wires extending in a direction parallel to the axis of the sheath 160. The shield member 161 may be, for example, a braided metal wire. The shield member 161 is arranged inside the coating 162. However, at the end of the sheath 160, a part of the coating 162 is removed, and the cable 130 inserted therein is pulled out from the end of the sheath 160. Further, the shield member 161 in the portion of the sheath 160 where the coating 162 is partially removed is folded back to the outside of the coating 162 and is arranged along the outer peripheral surface of the coating 162.

As shown in FIG. 6C, the sheath 160 from which a part of the coating 162 is removed is inserted into the opening 151 of the shield case 150. Metal holding members 153A and 153B for fixing the sheath 160 are attached to the side surface of the shield case 150. The holding members 153A and 153B respectively have holding surfaces 153A1 and 153B1 that come into contact with the shield member 161 that is folded back to the outside of the coating 162. The holding surface 153A1 and 153B1 tightens the screw 154 in a state where the portion of the sheath 160 where the shield member 161 is folded back is sandwiched, whereby the sheath 160 is fixed to the shield case 150. Further, the shield member 161 is electrically connected to the shield member 161 and the shield case 150 by being sandwiched between the holding surfaces 153A1 and 153B1 and the outer peripheral surface of the cover 162 (FIGS. 6A and 6B). reference).

When the electronic scope 100 is attached to the processor 200, the shield member 161 is connected to the frame ground FG via the shield case 150. As a result, electromagnetic noise entering the cable 130 from the outside is shielded by the shield member 161 and the shield case 150. Therefore, noise is prevented from being superimposed on the signal transmitted by the cable 130.

Further, in the present embodiment, the sheath 160 is removed in the vicinity of the connection point between the cable 130 and the relay board 131. The shield member 161 included in the sheath 160 is connected to the shield case 150 instead of the relay board 131. Therefore, in the present embodiment, the problem that the outer peripheral portion of the sheath 160 and the end portion 161A of the shield member 161 interfere with the relay board 131 (see FIG. 3) does not occur, so that the board-to-board connectors 132 and 145 can be fitted together. It is possible to prevent a defect from occurring.

Further, since the driver signal processing circuit 110 needs to process the pixel signal output from the solid-state image sensor 108 at high speed, it is easy to generate electromagnetic noise. This electromagnetic noise may adversely affect the operation of electronic devices around the electronic endoscope apparatus 1. However, by covering the driver circuit board 140 including the driver signal processing circuit 110 with the shield case 150 and setting the potential to be independent of the driver circuit board 140, the electromagnetic noise generated in the driver signal processing circuit 110 is shielded by the shield case 150. can do.

The above is a description of exemplary embodiments of the present invention. The embodiments of the present invention are not limited to those described above, and various modifications are possible within the scope of the technical idea of the present invention. For example, the contents of an embodiment or the like explicitly described in the specification or a combination of the obvious embodiments or the like are appropriately included in the embodiments of the present invention.

For example, in the above-described embodiment, as shown in FIG. 6, the holding members 153A and 153B are in direct contact with the shield member 161 that is folded back to the outside of the coating 162, but the present invention is not limited to this configuration. FIG. 7 is a perspective view of an end portion of the sheath 160 according to the modified example of the embodiment of the present invention. As shown in FIG. 7, the shield member 161 folded back to the outside of the coating 162 is protected by a conductive tape 163 (for example, copper foil). In this way, the shield member 161 is protected by the conductive tape 163, and then the sheath 160 is attached to the holding members 153A and 153B to prevent disconnection of the shield member 161 and to protect the shield member 161 and the holding members 153A and 153B. It is possible to prevent poor electrical contact with the.

Further, in the present invention, the attachment position of the sheath 160 to the shield case 150 is not limited to the position shown in FIG. FIG. 8 is a diagram for explaining a method of connecting the sheath 160, the shield member 161, and the shield case 150 in the modified example of the embodiment of the present invention. 8A is a perspective view of the sheath 160 and the shield case 150, FIG. 8B is a cross-sectional view of the sheath 160, the shield case 150, and the driver circuit board 140, and FIG. 8C is the shield case 150 of the sheath 160. It is a figure for demonstrating the fixing method of. Note that, in order to simplify the drawing, in FIG. 8B, a part of the cable 130 and the relay board 131 are not shown.

In the configuration shown in FIG. 8, the sheath 160 is attached to the upper surface of the shield case 150 by the holding member 153C. Further, the shield member 161 is sandwiched between the holding surface 153C1 of the holding member 153C and the outer peripheral surface of the cover 162, so that the shield member 161 and the shield case 150 are electrically connected.

As shown in FIG. 6, when the sheath 160 is attached to the side surface of the shield case 150, the cable 130 may interfere with the circuit components on the driver circuit board 140 in the shield case 150. On the other hand, in the configuration shown in FIG. 8, since the cable 130 is inserted from the upper side of the driver circuit board 140, it is possible to prevent the cable 130 and circuit components from interfering with each other.

Further, in the above-described embodiment, as shown in FIGS. 5 and 6, the shield member 161 is evenly folded back to the outer peripheral surface of the covering 162, and the sheath 160 is attached to the holding members 153A and 153B. The invention is not limited to this configuration. FIG. 9 is a perspective view of the end portion of the sheath 160 and the holding member 153D in the modified example of the embodiment of the present invention. 9A shows a state in which the sheath 160 is being attached to the metal holding member 153D, and FIG. 9B shows a state in which the sheath 160 is being attached to the holding member 153D.

In the configuration shown in FIG. 9, the shield member 161 is a plurality of metal wires extending in a direction parallel to the axis of the sheath 160. In this modification, the plurality of metal wires (shield member 161) in the portion where the coating 162 is removed are bundled into one and then folded back to the outside of the coating 162. Further, the sheath 160 is passed through the hole of the holding member 153D. A groove 153D2 parallel to the axis of the sheath 160 is formed on the outer peripheral portion of the holding member 153D. The shield member 161 is fitted into the groove 153D2 and then fixed by soldering or a conductive adhesive.

FIG. 10 is a diagram for explaining a method of connecting the sheath 160 and the shield member 161 to the shield case 150 in the modification of the embodiment of the present invention. 10A is a perspective view of the sheath 160 and the shield case 150, FIG. 10B is a cross-sectional view of the sheath 160, the shield case 150, and the driver circuit board 140, and FIG. 10C is a view of the shield case 150 of the sheath 160. It is a figure for demonstrating the fixing method of. Note that, in order to simplify the drawing, in FIG. 10B, a part of the cable 130 and the relay board 131 are not shown.

The sheath 160 fixed to the holding member 153D is inserted into the opening 151 of the shield case 150. The side surface of the shield case 150 is provided with a screw hole for fixing the holding member 153D. By screwing the holding member 153D to the shield case 150, the sheath 160 is fixed to the shield case 150, and the shield member 161 and the shield case 150 are electrically connected. As described above, in this modified example, it is not necessary to evenly return the shield member 161 to the outer peripheral surface of the coating 162, so that the sheath 160 can be easily attached to the shield case 150.

Further, in the configuration shown in FIG. 10, the sheath 160 is inserted into the opening 151 provided on the side surface of the shield case 150 and then fixed by the holding member 153D, but the present invention is not limited to this configuration. For example, the sheath 160 may be fixed by the holding member 153D after being inserted into the opening provided on the upper surface of the shield case 150.

1 Electronic Endoscope Device 100 Electronic Scope 102 LCB
104 Light distribution lens 106 Objective lens 108 Solid-state image sensor 110 Driver signal processing circuit 112 Memory 121 Light guide tube 122 Connection part 130 Cable 131 Relay board 132 Board-to-board connector (connector plug)
140 driver circuit board 141 scope-side connection circuit board 142 relay connector 143 shielded cable 145 board-to-board connector (connector receptacle)
150 shield case 151 opening 152 opening 153A to 153D holding member 153A1 to 153C1 holding surface 153D2 groove 154 screw 160 sheath 161 shield member 162 coating 163 conductive tape 200 processor 201 housing 210 primary circuit 211 pre-stage signal processing circuit 220 secondary circuit 221 System controller 222 Timing controller 223 Memory 224 Post-stage signal processing circuit 230 Isolator 240 Operation panel 250 Light source unit 251 Lamp 252 Lamp light source igniter 253 Condenser lens 260 Processor side connection circuit board 261 Detachable connector 262 RC circuit 300 Monitor

Claims (6)

In the electronic endoscope apparatus having an electronic scope and a processor,
The electronic scope is
A flexible tube,
An image sensor,
A sheath passed through the flexible tube,
A plurality of cables inserted into the sheath and having one ends connected to the image pickup device,
A connection portion with the processor,
Equipped with
In the connection part,
A relay board to which the other ends of the plurality of cables pulled out from the end of the sheath are attached,
A parent board detachably connected to the relay board by a connector,
A conductive shield case covering at least a part of the parent board,
Have
The sheath has a conductive shield member capable of inserting the plurality of cables,
At the end of the sheath, the shield member is electrically connected to the shield case ,
The processor is
Metal frame that becomes the frame ground
Equipped with
When connected to the connection portion of the electronic scope, the shield case is Ru being electrically connected to said frame,
Electronic endoscope device. The shield member is formed by a plurality of metal wires,
At the end of the sheath, each of the plurality of metal wires is electrically connected to the shield case,
The electronic endoscope apparatus according to claim 1. Having a metal holding member for holding the sheath in the connection portion ,
The holding member is attached to the shield case while holding the sheath,
The shield member is electrically connected to the shield case via the holding member,
The electronic endoscope apparatus according to claim 1. In the end portion of the sheath, the end portion of the shield member is arranged along the outer peripheral surface of the sheath,
The holding member has a holding surface for holding the outer peripheral surface of the sheath,
The end portion of the shield member is electrically connected to the holding member by being sandwiched between the outer peripheral surface of the sheath and the holding surface,
The electronic endoscope apparatus according to claim 3. At the end of the sheath, the plurality of metal wires are bundled and electrically connected to the holding member,
The electronic endoscope apparatus according to claim 3, which cites claim 2. The processor comprises an RC circuit having a resistor and a capacitor,
The shield case is electrically connected to the frame via the RC circuit,
The electronic endoscope apparatus according to any one of claims 1 to 5 .

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