JP6243565B2 - Endoscope system - Google Patents

Description

  The present invention relates to an endoscope electronic scope and a method for assembling an endoscope electronic scope.

  As an endoscope system for observing the inside of a lumen such as a human esophagus or intestine, an electronic scope having an image sensor, an endoscope processor for processing an imaging signal transmitted from the electronic scope, and an endoscope processor An endoscope system including a monitor that displays an observation image based on the captured image signal is known. The electronic scope has an insertion tube having an imaging element mounted on the distal end side and a connector portion connected to the proximal end side of the insertion tube. The imaging device and the endoscope processor are connected via a cable (conductive wire) passed through the insertion tube and a circuit board in the connector portion (see, for example, Patent Document 1).

Japanese Patent No. 4960533

  By the way, when assembling the electronic scope, the operation of the image sensor is checked before passing the cable through the insertion tube. In confirming the operation of the image sensor, a plurality of cables drawn from the image sensor are connected to the circuit board. The plurality of cables are, for example, a cable for applying a driving voltage to the image sensor, a cable for transmitting a pixel signal output from the image sensor, and a ground wire. When the operation check of the image sensor is completed, the plurality of cables are once removed from the circuit board. The cable removed from the circuit board is passed through the insertion tube of the electronic scope from the distal end side, and is connected to the circuit board again.

  Thus, by checking the operation of the image sensor before passing the cable through the insertion tube, it is easy to disassemble the electronic scope even if the image sensor has an initial failure and needs to be replaced. In addition, the image sensor can be replaced.

  However, in such an assembly process, it is necessary to solder a plurality of cables to the circuit board before and after passing the cables through the insertion tube, and there is a problem that it takes time and labor. Each cable has a small diameter for passing through the insertion tube, and the circuit board is designed to be small in size for placement in the connector portion. When soldering a plurality of small-diameter cables to a circuit board designed to be small, a contact failure or a short circuit may occur, and the electronic scope may not operate normally.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic scope for an endoscope and a method for assembling the electronic scope for an endoscope, in which wiring of a conductive wire connected to an imaging device is easy. Is to provide.

  In order to achieve the above object, an endoscope electronic scope according to an embodiment of the present invention includes an imaging device that captures an image of a subject and generates an imaging signal, an insertion tube inserted into a body cavity, and an insertion tube. A formed conductor insertion path, a connector, a relay board that is long in a predetermined direction, one end connected to the relay board, and the other end connected to the image sensor, and substantially parallel to the predetermined direction from the relay board And a circuit board having a receptacle that is detachably connected to the connector. The relay board has a size that can be inserted into the conductor insertion path in a state where a predetermined direction is aligned with the axial direction of the conductor insertion path.

  According to such a configuration, a plurality of conductors connected to the relay board can be passed through the conductor insertion path by passing the relay board through the conductor insertion path of the insertion tube. Further, the image sensor and the circuit board are electrically connected by connecting the connector and the receptacle. Therefore, when assembling an electronic scope, a plurality of conductors can be easily wired.

In the endoscope electronic scope, when the cross-sectional area of the hollow portion of the insertion tube is defined as Sp and the cross-sectional area of the conducting wire insertion path is defined as Sh, the following conditional expression 0.2 ≦ Sh / Sp ≦ 0.5
May be satisfied.

  Further, a predetermined through hole may be formed in the relay substrate. In this case, the connection between the connector and the receptacle is reinforced by fixing the relay board and the circuit board with screws passed through the through holes.

  Further, the through hole may be formed at a position close to one end of the relay board in a predetermined direction of the relay board. In this case, the relay substrate is chamfered at the end close to the formation position of the through hole.

  Moreover, the some conducting wire may be pulled out in the direction away from a through-hole.

  In addition, the circuit board may include a gripping part that bundles and grips a plurality of wirings drawn from the relay board.

  The relay board may be a double-sided wiring board. In this case, a part of the plurality of wirings is connected to the first surface of the relay board and pulled out from the first surface, and the rest of the plurality of wirings is connected to the second surface opposite to the first surface and connected to the second surface. It is drawn from the surface.

  The relay substrate may have a plurality of pad electrodes connected to each of the plurality of wirings. In this case, each of the plurality of pad electrodes has an elongated shape in a predetermined direction.

  An endoscope electronic scope assembly method according to an embodiment of the present invention is an endoscope electronic scope assembly method including a lead wire insertion path formed in an insertion tube to be inserted into a body cavity, and a predetermined wire A wire connecting step for connecting the jig to a relay board to which a plurality of conductors are connected, and a wire jig connected to the relay board is inserted into a conductor insertion path to pass through the relay board and the plurality of conductors. An insertion step for passing through the insertion path, a wire connection release step for releasing the connection between the relay board and the wire jig passed through the conductor insertion path, a connector included in the relay board passed through the conductor insertion path, and a circuit board And a circuit connection step of connecting the receptacle having the same.

  In the wire connection step, the wire jig and the relay board are connected by passing the flange provided at the end of the wire jig through the through hole provided in the relay board. The connection between the connector and the receptacle may be reinforced by screwing the through hole to fix the relay board and the circuit board.

  According to the endoscope electronic scope and the endoscope electronic scope assembling method of the present invention, when assembling the electronic scope, it is possible to easily wire the lead wire connected to the imaging device.

1 is a block diagram of an endoscope system according to an embodiment of the present invention. It is sectional drawing of the insertion tube concerning embodiment of this invention. It is sectional drawing of the conducting wire insertion path concerning embodiment of this invention. It is a side view of the circuit board and relay board concerning the embodiment of the present invention. It is the front view and back view of a relay substrate (single unit) concerning the embodiment of the present invention. It is the front view and back view of a relay board concerning an embodiment of the present invention. It is a figure for demonstrating the process of passing a conducting wire through the conducting wire insertion path concerning embodiment of this invention. It is sectional drawing of the insertion tube concerning embodiment of this invention. It is a front view of the relay board | substrate concerning the modification of embodiment of this invention. It is a side view of the circuit board and relay board concerning the modification of embodiment of this invention.

  Hereinafter, an endoscope system according to an embodiment of the present invention will be described.

[Configuration of Endoscope System 1]
FIG. 1 is a block diagram showing a configuration of an endoscope system 1 of the present embodiment. An endoscope system 1 illustrated in FIG. 1 is a medical imaging system, and includes an electronic scope 100, an endoscope processor 200, and a monitor 300.

  The electronic scope 100 has an insertion tube 100A and a connector portion 100B. An objective optical system 101, an imaging unit 102, and an illumination optical system 103 are provided in the insertion tube 100A. A circuit board 11 is provided in the connector portion 100B. The circuit board 11 includes an image sensor driver 104 and an AFE (Analog Front End) 105. A light guide 106 is disposed from the connector portion 100B to the distal end portion 100C of the insertion tube 100A. The imaging unit 102 and the circuit board 11 are connected by a plurality of conductive wires 14 and a relay board 13.

  FIG. 2 is a cross-sectional view of the insertion tube 100A in a direction orthogonal to its own axis. The insertion tube 100A has a cylindrical shape. A conductive wire insertion path (cable channel) 21, a stay coil 22 and a light guide 106 are provided in the insertion tube 100A along the axial direction. A plurality of conducting wires (not shown in FIG. 2; see FIG. 3 described later) are inserted and passed through the conducting wire insertion path 21. A bending wire (not shown) is passed through the stay coil 22. The bending wire is used for bending the insertion tube 100A.

  The insertion tube 100A is designed to have a small diameter so as to be inserted into a human body cavity. In an endoscope for observing the nasal cavity and pharynx, for example, the insertion tube 100A is designed to have an outer diameter of about 4 mm to 8 mm and an inner diameter (a diameter of the hollow portion) of about 4 mm to 6 mm. The conducting wire insertion path 21 is also designed to have a small diameter in accordance with the inner diameter of the insertion tube 100A.

  FIG. 3 is a cross-sectional view of the conductor insertion path 21 in a direction orthogonal to its own axis. As shown in FIG. 3, a plurality of conductors 14 (in FIG. 3, for convenience, only one conductor is attached with an instruction line) are inserted and passed through the conductor insertion path 21. The plurality of conductive wires 14 are, for example, cables (Vdd1, Vdd2) for applying a driving voltage to the imaging unit 102, cables (Sub, VL, RG) for transmitting a clock signal for controlling the operation of the imaging unit 102, A cable (V0 to V6, H1, H2) for transmitting a pixel signal output from the imaging unit 102, a ground wire (Gnd), or the like. The number of the conductive wires 14 is about 10 to 20 although it varies depending on the specification of the imaging unit 102. Each conductive wire 14 is covered with an insulating tube (not shown). The outer diameter of each conductive wire 14 including the tube is about 0.4 mm to 1.0 mm.

  The endoscope processor 200 incorporates an endoscope image processing apparatus, and includes a system controller 201, a timing controller 202, a light source unit 203, an image processing unit 204, and a front panel 205. The light source unit 203 includes a light source driver 203A, a light source 203B, and a condenser lens 203C.

  The system controller 201 controls each element constituting the endoscope system 1. The timing controller 202 transmits a clock signal for adjusting the signal processing timing to each circuit in the endoscope system 1.

  The light source 203B is driven and controlled by the light source driver 203A and emits white light. As the light source 203B, a high-intensity lamp such as a xenon lamp, a halogen lamp, a mercury lamp, or a metal halide lamp is used. The illumination light emitted from the light source 203B is incident on the light guide 106 via the condenser lens 203C, and is guided in the light guide 106 toward the distal end portion 100C of the electronic scope 100. The light guide 106 is, for example, an LCB (Light Carrying Bundle) in which a plurality of optical fibers are bundled.

  The illumination light guided in the light guide 106 is emitted from the end face of the light guide 106 disposed in the distal end portion 100C. Illumination light emitted from the end face of the light guide 106 is emitted from the distal end portion 100C via the illumination optical system 103 and illuminates the subject. Illumination light (reflected light) reflected by the subject enters the imaging unit 102 via the objective optical system 101. The imaging unit 102 has an imaging element (not shown). The reflected light incident on the imaging unit 102 forms a subject image on the light receiving surface of each pixel included in the imaging device.

  The imaging device includes G, Cy, Mg, and Ye pixels having green (G), cyan (Cy), magenta (Mg), and yellow (Ye) color filters, respectively. Each pixel accumulates the formed subject image as a charge corresponding to the amount of light, and pixel signals corresponding to each color of G, Cy, Mg, Ye (G pixel signal, Cy pixel signal, Mg pixel signal, Ye pixel signal) ). The converted pixel signals are subjected to signal amplification processing and A / D conversion processing by the AFE 105, and are transmitted to the image processing unit 204 of the endoscope processor 200. For example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor is used as the imaging element.

  The pixel signal received by the image processing unit 204 is converted into a video signal by predetermined signal processing and transmitted to the monitor 300. The monitor 300 displays an observation image based on the video signal received from the image processing unit 204.

[Detailed configuration of circuit board and relay board]
Next, the configuration of the circuit board 11 and the relay board 13 will be described in detail.

  FIG. 4 is a side view of the circuit board 11 and the relay board 13. The relay board 13 is a double-sided mounting board, a part of the conductive wires 14 are connected to one surface by soldering, and the remaining conductive wires 14 are connected to the other surface by soldering. The vicinity of the connection portion between the plurality of conductive wires 14 including the soldered portion and the relay substrate 13 is entirely covered with an insulating tube 14A. The tube 14A is, for example, a heat shrinkable tube. The other end (the end portion not connected to the relay substrate 13) of each conductive wire 14 is connected to the imaging unit 102.

  The relay board 13 has a connector 13A, and the circuit board 11 has a receptacle 11A. Connector 13A is detachably connected to receptacle 11A. The circuit board 11 is electrically connected to the imaging unit 102 by connecting the connector 13A and the receptacle 11A. Further, the circuit board 11 is connected to the processor 200 by wiring (not shown). Below, for convenience of explanation, the direction in which the lead wire 14 is drawn out is defined as the front, and the opposite side is defined as the rear. Further, the side of the circuit board 11 that is connected to the relay board 13 is defined as the upper side, and the opposite side is defined as the lower side.

  The circuit board 11 has a clamp 11 </ b> C for gripping the plurality of conductive wires 14. Even if an external force is applied to the lead wire 14 by the clamp 11C bunching the plurality of lead wires 14 (or holding the lead wires 14 and the tube 14A together), the relay substrate 13 and the lead wire 14 Concentration of load on the connection point can be avoided. Further, since the external force is prevented from being transmitted to the relay substrate 13 via the lead wire 14, the connection between the connector 13A and the receptacle 11A is prevented from being released by the external force. The clamp 11C is, for example, a known binding band or a foldable metal plate.

  A through hole 13 </ b> B penetrating in the vertical direction is provided at the rear end of the relay substrate 13 (position approaching the rear side). In addition, a spacer 11B having a female screw (tapped) is provided at a position corresponding to the through hole 13B of the circuit board 11. The relay board 13 and the circuit board 11 are fixed by fastening a screw (male screw) 15 passed through the through hole 13B to the spacer 11B. Thereby, the connection between the connector 13A and the receptacle 11A is reinforced (prevented from being disconnected).

  FIG. 5A and FIG. 5B are a diagram (front view) of the relay substrate 13 alone viewed from above (a front view), and a diagram of the relay substrate 13 alone viewed from below (rear view). As shown in FIGS. 5A and 5B, the relay substrate 13 has a shape that is long in the front-rear direction. Further, the relay substrate 13 is set to have a relatively small dimension in a direction orthogonal to the front-rear direction. A plurality of pad electrodes 13 </ b> C for connecting the conductive wires 14 are provided on the upper surface and the lower surface of the relay substrate 13. Each pad electrode 13C has a shape elongated in the front-rear direction. Each pad electrode 13C is electrically connected to the connector 13A through a pattern printed on the relay board 13. An earth electrode 13D is provided around the through hole 13B. When the relay board 13 and the circuit board 11 are fastened by the screw 15, the ground electrode 13 </ b> D contacts the spacer 11 </ b> B of the circuit board 11. The spacer 11 </ b> B has conductivity and is connected to a ground electrode (not shown) of the circuit board 11. For this reason, the relay board 13 and the circuit board 11 share a common ground via the ground electrode 13D and the spacer 11B. Further, the end (corner) R on the side (rear side) where the through hole 13B of the relay substrate 13 is provided is chamfered.

  6 (a) and 6 (b) are views (front view) of the relay board 13 to which the plurality of conductors 14 are connected as viewed from above (front view), and the relay board 13 to which the plurality of conductors 14 are connected are respectively shown below. It is the figure (back view) seen from the side. As shown in FIG. 6A and FIG. 6B, the rear end of each conductive wire 14 is connected to the pad electrode 13C by soldering, and is drawn forward. Since each pad electrode 13C has an elongated shape in the front-rear direction, the pad electrode 13C and the lead wire 14 can be soldered relatively easily by arranging the axial direction of each conductor 14 substantially parallel to the front-rear direction. Can be attached.

[Assembly method of electronic scope 100]
Next, a method for assembling the electronic scope 100 will be described. The assembly process of the electronic scope 100 includes a step of confirming the operation of the imaging unit 102 (operation confirmation step of the imaging unit 102), and a step of passing a plurality of conductors 14 through the insertion tube 100A (inside the conductor insertion path 21) (conductor 14). Insertion step) and a step of wiring (connecting) the plurality of conductive wires 14 (wiring step of the conductive wires 14).

[Operation Confirmation Process of Imaging Unit 102]
In the operation confirmation process of the imaging unit 102, first, the lead wires 14 drawn from the imaging unit 102 are connected to each of the plurality of pad electrodes 13C provided on the relay substrate 13 by soldering. The vicinity of the connection portion between the pad electrode 13 </ b> C and the conductive wire 14 including the solder pile portion is entirely covered with the tube 14 </ b> A. Next, the connector 13A of the relay board 13 and the receptacle 11A of the circuit board 11 are connected. By connecting the connector 13A and the receptacle 11A, the imaging unit 102 and the circuit board 11 are electrically connected. By connecting the circuit board 102 to the processor 200, the operation of the imaging unit 102 using the processor 200 can be confirmed. By checking the operation, it is checked whether or not the imaging unit 102 has an initial failure. When it is determined that the imaging unit 102 has an initial failure, the imaging unit 102 is replaced, and the operation of the replaced imaging unit 102 is confirmed again. When it is determined by the operation check that the imaging unit 102 has no initial failure, the connection between the connector 13A and the receptacle 11A is once released.

[Step of inserting lead 14]
Next, the insertion process and the wiring process of the conducting wire 14 will be described. FIG. 7 is a diagram for explaining a process of inserting the conductive wire 14.

  First, the wire jig 30 is inserted and passed through the conductor insertion path 21. For example, metal or resin is used as the material of the wire jig 30. The wire jig 30 has a hook shape at one end 30A. The wire jig 30 is inserted through the end 30A having a hook shape from the base end side (rear side) of the conductor insertion path 21 (FIG. 7A). When the end 30A of the wire jig 30 is passed until it protrudes from the distal end side (front side) of the conducting wire insertion path 21, the relay substrate 13 is connected to the end 30A (FIG. 7B). Specifically, the hook-shaped end portion 30 </ b> A is passed through the through-hole 13 </ b> B of the relay substrate 13 and hooked. When the end 30 </ b> A of the wire jig 30 and the relay substrate 13 are connected, the wire jig 30 is pulled toward the proximal end side of the conducting wire insertion path 21. The relay substrate 13 is pulled by the wire jig 30 with the end on the rear side (near the position where the through hole 13B is formed) leading and is passed through the conductor insertion path 21 (FIG. 7C). Therefore, the posture of the relay board 13 is maintained in the conductor insertion path 21 so that the long direction (front-rear direction) of the relay board 13 matches (follows) the axial direction of the conductor insertion path 21. . The relay substrate 13 is smaller in the width direction perpendicular to the front-rear direction than the inner diameter (diameter) of the conductor insertion path 21. Therefore, the relay board 13 can be passed through the conductor insertion path 21. Moreover, since the rear end R of the relay board 13 is chamfered, the relay board 13 can be smoothly passed through the conductor insertion path 21. By passing the relay board 13 through the conductor insertion path 21, the conductor 14 connected to the relay board 13 is also passed through the conductor insertion path 21. The conducting wire 14 is set to be longer than the conducting wire insertion path 21. Therefore, when the relay board 13 is pulled through the conductor insertion path 21 and protrudes from the rear side of the conductor insertion path 21, the leading end portion of the conductor 14 connected to the imaging unit 102 is disposed in front of the conductor insertion path 21. Has been. The imaging unit 102 is fixed to the distal end side of the insertion tube 100 </ b> A in another assembly process in a state where the imaging unit 102 is disposed in front of the conducting wire insertion path 21.

[Wiring process of conducting wire 14]
When the relay board 13 is pulled until it protrudes from the rear end side of the conductor insertion path 21, the connection between the through hole 13 </ b> B of the relay board 13 and the end 30 </ b> A of the wire jig 30 is released. Next, the connector 13A of the relay board 13 and the receptacle 11A of the circuit board 11 are connected. Thereby, the imaging unit 102 and the circuit board 11 are electrically connected. Further, the relay board 13 and the circuit board 11 are fixed to each other by the screws 15 being passed through the through holes 13B and fastened to the spacers 11B. Thereby, the connection between the connector 13A and the receptacle 11A is reinforced. Moreover, the some conducting wire 14 is hold | gripped by the clamp 11C.

Next, the dimension of the conducting wire insertion path 21 will be described. In the present embodiment, when the cross-sectional area of the hollow portion of the insertion tube 100A is defined as Sp and the cross-sectional area of the conductor insertion path 21 is defined as Sh, the following condition (1)
0.2 ≦ Sh / Sp ≦ 0.5 (1)
Is satisfied. The cross-sectional area Sp of the hollow portion indicates the cross-sectional area of the region surrounded by the inner wall 20A of the insertion tube 100A in FIG. Further, the cross-sectional area Sp of the hollow portion includes the area of the region where the conducting wire insertion path 21, the light guide 106, and the stay coil 22 are disposed. On the other hand, the cross-sectional area Sh of the conductor insertion path 21 indicates the area of the region surrounded by the outer wall 21 </ b> A of the conductor insertion path 21. In addition, the cross-sectional area Sh includes the area of the hollow portion where the plurality of conductive wires 14 are arranged. That is, the condition (1) defines the proportion of the conductor insertion path 21 in the hollow portion of the insertion tube 100A.

  If the upper limit value of the condition (1) is exceeded, the ratio of the conducting wire insertion path 21 in the hollow portion of the insertion tube 100A is too large, so that it is difficult to pass the light guide 106 and the stay coil 22 into the insertion tube 100A. If the upper limit value of the condition (1) is exceeded, the conductor insertion path 21 interferes with the light guide 106 and the stay coil 22 in the insertion tube 100A, and any of the conductor insertion path 21, the light guide 106, and the stay coil 22 is interfered. There is a risk that crab disconnection or deformation may occur.

  When the conducting wire insertion path 21 is deformed by interfering with the light guide 106 or the stay coil 22, the sectional shape of the conducting wire insertion path 21 becomes, for example, an elliptical shape or a gourd shape. When the cross-sectional shape of the conductor insertion path 21 is deformed into an elliptical shape or a gourd shape, the orientation of the relay board 13 that can be inserted into the conductor insertion path 21 (angle around the axis) is restricted, and the relay board 13 and the conductor 14 are connected to each other. It becomes difficult to pass through the insertion path 21.

  When the lower limit value of the condition (1) is not reached, since the proportion of the lead wire insertion path 21 in the hollow portion of the insertion tube 100A is small, the lead wire insertion path 21 may interfere with the light guide 106 and the stay coil 22 and deform. Lower. However, when the lower limit value of the condition (1) is not reached, the conductor insertion path 21 becomes thin, and it may be difficult to pass the relay substrate 13 and the conductor 14 into the conductor insertion path 21.

  In the present embodiment, since the condition (1) is satisfied, the conductor insertion path 21 is suppressed from being deformed by interference with the light guide 106 and the stay coil 22, and the relay board is included in the conductor insertion path 21. It is suppressed that it becomes difficult to let 13 and the conducting wire 14 pass.

  8A and 8B are cross-sectional views of the insertion tube 100A of the present embodiment, respectively. FIG. 8A is a cross-sectional view of the insertion tube 100A when Sh / Sp is 0.4. FIG. 8B is a cross-sectional view of the insertion tube 100A when Sh / Sp is 0.27.

  In FIG. 8A, Sh / Sp is set large enough that the conductor insertion path 21 does not deform due to interference with the light guide 106 and the stay coil 22. Accordingly, the insertion tube 100A can be made thin while ensuring the ease of inserting the relay substrate 13 and the conductor 14 into the conductor insertion path 21.

  In FIG. 8B, the diameter of the conducting wire insertion path 21 is set to be small within a range in which the relay substrate 13 and the conducting wire 14 can be inserted, and Sh / Sp is set to be small. Thereby, the space in the insertion tube 100A can be freed, and the lead wire insertion path 21, the light guide 106, and the stay coil 22 can be easily inserted into the insertion tube 100A.

  The above is the description of the embodiment of the present invention. The present invention is not limited to the above-described configuration, and various modifications can be made within the scope of the technical idea of the present invention. For example, the embodiment of the present application also includes an embodiment that is exemplarily specified in the specification or a combination of obvious embodiments and the like as appropriate.

  In the insertion process of the conducting wire 14 in the present embodiment, first, the wire jig 30 is passed through the conducting wire insertion path 21 as shown in FIGS. 7 (a) to 7 (c). Next, the end 30 </ b> A of the wire jig 30 and the relay board 13 are connected, and the relay board 13 and the conductor 14 are pulled inside the conductor insertion path 21 by the wire jig 30. However, in the insertion process of the conducting wire 14 in another embodiment, the end 30 </ b> A of the wire jig 30 and the relay substrate 13 may be connected before the wire jig 30 is inserted into the conducting wire insertion path 21. In this case, the end opposite to the end 30 </ b> A of the wire jig 30 is inserted and passed from the distal end side (front side) of the conducting wire insertion path 21. As a result, the relay board 13 is pulled by the wire jig 30 and passed through the conductor insertion path 21.

  Further, the end portion 30A of the wire jig 30 in the present embodiment is not limited to the hook shape. The end 30A may be provided with a clasp instead of having a hook shape. Thereby, it is possible to prevent the connection between the wire jig 30 and the relay substrate 13 from being released while the relay substrate 13 and the conductor 14 are being passed through the conductor insertion path 21. Further, the end 30A of the wire jig 30 may have high flexibility (flexibility) so as to be tied through the through hole 13B.

  Moreover, in this embodiment, although the some conducting wire 14 is connected to the pad electrode 13C of one relay board | substrate 13, this invention is not limited to this. For example, the plurality of electrodes 14 may be divided into two groups, and the conductive wires 14 of each group may be connected to different relay boards. FIG. 9 is a top view of the relay board 13 in a modification of the present embodiment. As shown in FIG. 9, in the modification of the present embodiment, the relay board 13 includes two relay boards 113A and 113B that are integrally formed. A V-cut 13V is inserted at the boundary between the relay board 113A and the relay board 113B, and the relay board 113A and the relay board 113B are separated by dividing the V-cut 13V portion. By dividing the relay board 13 into two relay boards 113A and 113B in this way, the number of conductive wires 14 connected to one relay board (the relay board 113A or the relay board 113B) can be reduced. Thereby, the dimension of the width direction orthogonal to the front-back direction of the relay board | substrate 13 can be made small, and it can make it easy to insert the relay board | substrate 13 in the conducting wire insertion path 21 of 100 A of insertion pipes designed in the thin diameter.

  In the insertion process of the conductor 14 in the modification of the present embodiment, the relay board 113A and the relay board 113B are inserted and passed through the conductor insertion path 21 together (without breaking the V-cut 13V portion). When the relay board 13 (relay boards 113A and 113B) is passed through the conductor insertion path 21, the V-cut 13V portion is broken and the relay board 113A and the relay board 113B are separated.

  FIG. 10 is a side view of the circuit board 11, the relay board 113A, and the relay board 113B in a modification of the present invention. The relay board 113A and the relay board 113B have a connector 113AA and a connector 113BA, respectively. The circuit board 11 has two receptacles 11A. A connector 113AA and a connector 113BA are detachably connected to the two receptacles 11A, respectively. Thereby, the imaging unit 102 and the circuit board 11 are electrically connected.

DESCRIPTION OF SYMBOLS 1 Endoscope system 11 Circuit board 11A Receptacle 11B Spacer 11C Clamp 13 Relay board 13A Connector 13B Through-hole 13C Pad electrode 13D Electrode 13V V cut 14 Conductor 14A Tube 21 Conductor insertion path 22 Stay coil 30 Wire jig 30A End part 100 Electron Scope 100A Insertion tube 100B Connector part 100C Tip part 101 Objective optical system 102 Imaging unit 103 Objective optical system 104 Imaging element driver 105 AFE (Analog Front End)
106 Light guide 113A, 113B Relay board 113AA, 113BA Connector 200 Endoscope processor 201 System controller 202 Timing controller 203 Light source unit 203A Light source driver 203B Light source 203C Condensing lens 204 Image processing unit 205 Front panel 300 Monitor

Claims (8)

An endoscope processor;
An electronic scope,
The electronic scope is
An image sensor that images a subject and generates an image signal;
An insertion tube inserted into the body cavity;
A conducting wire insertion path formed in the insertion tube;
A relay board that has a connector and is long in a predetermined direction;
One end is connected to the relay substrate and the other end is connected to the image sensor, and is drawn from the relay substrate in a direction substantially parallel to the predetermined direction, and is routed through the entire length of the conductor insertion path. A plurality of conducting wires,
A circuit board having a receptacle detachably connected to the connector,
The relay board has a size that can be inserted into the conductor insertion path in a state where the predetermined direction is aligned with the axial direction of the conductor insertion path.
Endoscope system. When the cross-sectional area of the hollow portion of the insertion tube is defined as Sp and the cross-sectional area of the conducting wire insertion path is defined as Sh, the following conditional expression 0.2 ≦ Sh / Sp ≦ 0.5
Meet,
The endoscope system according to claim 1. A predetermined through hole is formed in the relay substrate,
The connection between the connector and the receptacle is reinforced by fixing the relay board and the circuit board with screws passed through the through holes.
The endoscope system according to claim 1 or 2. The through hole is formed at a position close to one end of the relay substrate in the predetermined direction,
The relay substrate has a chamfered end near the formation position of the through hole,
The endoscope system according to claim 3. The plurality of conductive wires are:
Pulled out in a direction away from the through hole,
The endoscope system according to claim 3 or 4. The circuit board is
Having a gripping part that bundles and grips the plurality of wires drawn out from the relay board;
The endoscope system according to any one of claims 1 to 5. The relay board is a double-sided wiring board,
A part of the plurality of wirings is connected to the first surface of the relay board and pulled out from the first surface, and the rest of the plurality of wirings is connected to a second surface opposite to the first surface. Pulled from the second side,
The endoscope system according to any one of claims 1 to 6. The relay substrate has a plurality of pad electrodes connected to each of the plurality of wirings,
Each of the plurality of pad electrodes has an elongated shape in the predetermined direction.
The endoscope system according to any one of claims 1 to 7.

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