CN209376016U - Substrate mounting body and electronic endoscope system - Google Patents
Substrate mounting body and electronic endoscope system Download PDFInfo
- Publication number
- CN209376016U CN209376016U CN201790000662.6U CN201790000662U CN209376016U CN 209376016 U CN209376016 U CN 209376016U CN 201790000662 U CN201790000662 U CN 201790000662U CN 209376016 U CN209376016 U CN 209376016U
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- China
- Prior art keywords
- interposer
- board
- mother substrate
- substrate
- cable
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
Abstract
Substrate mounting body includes: the mother substrate for being provided with board to board connector；And cable is installed and is provided with the interposer of board to board connector.Board to board connector is fitted into each other and connects the mother substrate with the interposer.The cable is clamped between the mother substrate and the interposer.The mother substrate and the interposer are respectively provided with multiple layers of lit-par-lit structure.Total i.e. first total stacking number of the stacking number of the layer of the stacking number and mother substrate of the layer of the interposer in the installation section of the board to board connector is bigger than total i.e. second total stacking number of the stacking number of the layer of the mother substrate in the stacking number of the layer of the interposer in the installation section of the cable in the interposer and the corresponding part of the mother substrate corresponding with the installation section.
Description
Technical field
The present invention relates to the substrate mountings that the interposer for being equipped with cable is connected with mother substrate by board to board connector
Body and the electronic endoscope system for having the substrate mounting body.
Background technique
As for observing the endoscopic system in the official jargons such as mankind's esophagus or intestines, it is known to a kind of fujinon electronic video endoscope system
System, have: with capturing element electron mirror, for handle from electron mirror transmit shoot signal endoscope processor,
And the monitor of observation image is shown based on the shooting signal handled by endoscope processor.In this fujinon electronic video endoscope system
In system, the input/output of power supply and signal is carried out to the capturing element of electron mirror front end by cable.In general, electric
Connection of the cable from these capturing elements to endoscope processor is configured to temporarily be attached device connection via circuit substrate.And
And usually, on cable welding to foregoing circuit substrate.
From the viewpoint of the thinning of electron mirror, it is desirable to reduce the part for connecting cables to circuit substrate as much as possible
Overall thickness.Following patent document 1 discloses the composition of the overall thickness for reducing coupling part of the coaxial cable to substrate
Example.
Existing technical literature
Patent document
Patent document 1: Japanese Patent No. 5631618
But in the case where connecting cables to the composition of circuit substrate (mother substrate) by welding, due to carrying out
It needs to melt solder when the repairing of capturing element, adjustment and spends effort to remove cable, therefore, plate is connected using plate recently
Device is connect to carry out in cable side using small-sized interposer.That is, the cable from capturing element is via small-sized relaying base
Plate is connected using board to board connector to circuit substrate (mother substrate).
In the case where this composition, due to be mounted in board to board connector side small-sized interposer in electron mirror
Flezxible coupling in insert, therefore to the width of small-sized interposer generate restriction.Especially the case where the quantity of cable increases
Under, it, must not be without being overlapped in a thickness direction since cable must protrude in the width direction of small-sized interposer
The processing of cable.But when the thickness of cable handling becomes too big, since the height of board to board connector restricts, connecting
Device is mutual to be fitted into upper lead to the problem of.
Summary of the invention
The present invention has been proposed in view of the above situation, its purpose is to provide using board to board connector by the relaying of cable
Substrate is connected in the composition of mother substrate, even if can also solve in the increased situation of number of cables for being connected to interposer
The certainly electronic endoscope system for being fitted into undesirable substrate mounting body and having the substrate mounting body of board to board connector.
In in one aspect of the invention, substrate mounting body includes: the mother substrate for being provided with board to board connector；And installation
Have cable and be provided with the interposer of board to board connector, board to board connector is fitted into each other and by the mother substrate and institute
Interposer connection is stated, the cable is clamped between the mother substrate and the interposer.
The mother substrate and the interposer are respectively provided with multiple layers of lit-par-lit structure.
The substrate mounting body is configured to, the institute of the interposer in the installation section of the board to board connector
The total i.e. first total stacking number for stating the stacking number of the stacking number of layer and the layer of the mother substrate is configured to than in described
After the layer of the interposer in the installation section of the cable in substrate stacking number and with the installation section
Total i.e. second total stacking number of the stacking number of the layer of the mother substrate in the corresponding part of the corresponding mother substrate
Greatly.
According to this construction, even if increasing in the quantity for being connected to the cable of the interposer and cable is from the relaying
In the case where the face protrusion of substrate, since the installation section of the cable on the interposer will not interfere with the mother substrate,
Therefore it is bad being fitted into for board to board connector can be eliminated.Being fitted into bad includes the case where electrical connection between connector.
Preferably, in the mother substrate, partly overlapping has layer, so that in the installation section of the board to board connector
Described in layer stacking number part increase.
Preferably, in the mother substrate, a part of the layer is partially removed, so that in the corresponding part
It reduces the stacking number part of the mother substrate.
Preferably, in the interposer, partly overlapping has layer, so that in the mounting portion of the board to board connector
The stacking number part of layer described in point increases.
According to an example, it is preferred that when set top from the cable to the installation section of the interposer, apart from institute
The height for stating the chimeric side of interposer is A, the chimeric side of the mother substrate in the installation section and the relaying
The distance between chimeric side of substrate is B, full when the incrementss of the thickness due to caused by the partly overlapping layer are C
Sufficient A≤B+C.
According to another example, it is preferred that when set top from the cable to the installation section of the interposer, distance
The height of the chimeric side of the interposer is A, the chimeric side of the mother substrate in the installation section and it is described in
After the distance between chimeric side of substrate be B, due to the layer a part by the part removal caused by the mother
When the reduction amount of the thickness of substrate is C ', meet A≤B+C '.
According to another example, it is preferred that when top from the cable to the installation section of the interposer, apart from institute
The height for stating the chimeric side of interposer is A, the chimeric side of the mother substrate in the installation section and the relaying
The distance between chimeric side of substrate is B, the increase of thickness caused by the layer due to partially overlapping the interposer
When amount is C ", meet A≤B+C ".
In another way of the invention, substrate mounting body includes: the mother substrate for being provided with board to board connector；And peace
Equipped with cable and be provided with the interposer of board to board connector, board to board connector is fitted into each other and by the mother substrate and
The interposer connection, the cable are clamped between the mother substrate and the interposer.
The mother substrate and the interposer are respectively provided with multiple layers of lit-par-lit structure.
The substrate thickness of at least one of the mother substrate and the interposer is changed in part so that the cable to
The interposer in the installation section of the interposer and the interval between the opposite surface of the mother substrate, than the cable
To the installation section of the interposer top, the relaying base in installation section apart from the board to board connector
The height of the chimeric side of plate is big.
According to this construction, even if in the case where being connected to the increased situation of the quantity of cable of the interposer, by institute
The installation section for stating the cable on interposer will not interfere with the mother substrate, therefore can eliminate the plate to plate
Being fitted into for connector is bad.
Preferably, with the thickness at least one of the mother substrate and the interposer, described installation section
The increased mode in part is spent, at least one of the mother substrate and the interposer are constituted.
Preferably, in a manner of the caliper portion reduction with the part of the installation section opposite direction of the mother substrate,
Constitute the mother substrate.
In still yet another aspect of the present, substrate mounting body includes: the mother substrate for being provided with board to board connector, is equipped with
Cable and the interposer for being provided with board to board connector, board to board connector is fitted into each other and by the mother substrate and described
Interposer connection, the cable are clamped between the mother substrate and the interposer.
The face of the installation section of the board to board connector of at least one of the interposer and the mother substrate
It is configured to prominent relative to the face of peripheral part of the installation section.
In still yet another aspect of the present, substrate mounting body includes: the mother substrate for being provided with board to board connector；And peace
Equipped with cable and be provided with the interposer of board to board connector, board to board connector is fitted into each other and by the mother substrate and
The interposer connection, the cable are clamped between the mother substrate and the interposer.
The face of the corresponding part corresponding with the installation section of the cable to the interposer of the mother substrate is by structure
The direction away from the interposer as peripheral part relative to the corresponding part is recessed.
Another aspect of the present invention is electronic endoscope system.The electronic endoscope system includes: light supply apparatus, is projected
Light；Endoscope has capturing element, which shoots by the subject of the optical illumination；Processor, with the endoscope
Connector portion connection, handle the image of subject taken by the capturing element；It is described to show that treated for monitor
Image, the connector portion have the substrate mounting body, and the cable includes at least the signal extended from the capturing element
Transmission cable.
Invention effect
As described above, according to aforesaid substrate assembly, even if in the increased feelings of quantity for the cable for being connected to interposer
Under condition, it is bad can also to eliminate being fitted into for board to board connector.
Detailed description of the invention
Fig. 1 is the block diagram of an example for the electronic endoscope system that an embodiment is related to.
Fig. 2 is the figure for showing the composition of coupling part of interposer and circuit substrate.
Fig. 3 (a) and Fig. 3 (b) is to illustrate to generate in the case where the chimeric surface side of the connector of interposer also welding cable
The figure for being fitted into bad problem.
Fig. 4 (a) and Fig. 4 (b) are an examples for illustrating board to board connector mounting structure that an embodiment is related to
Figure.
Fig. 5 (a) and Fig. 5 (b) is the figure of an example for the board to board connector mounting structure for illustrating that an embodiment is related to.
Fig. 6 (a) and Fig. 6 (b) is the figure of an example for the board to board connector mounting structure for illustrating that an embodiment is related to.
Specific embodiment
Hereinafter, detailed description of embodiments of the present invention using attached drawing.
[composition of endoscopic system 1]
Fig. 1 is an example for showing the composition of electronic endoscope system 1 for the substrate mounting body for being applicable in present embodiment
Block diagram.Endoscopic system 1 shown in Fig. 1 is therapeutic medical camera system, have electron mirror 100, endoscope processor 200 with
And monitor 300.
Electron mirror 100 has insertion tube 100A and connector portion 100B.Object lens optical system is provided in insertion tube 100A
System 101, shooting unit 102 and lamp optical system 103.Circuit substrate 11 is provided in connector portion 100B.Circuit substrate
11 include capturing element driver 104 and AFE (Analog Front End, AFE(analog front end)) 105.In addition, from connector portion
The front end 100C of 100B to insertion tube 100A is provided with light guide section 106.Shooting unit 102 and circuit substrate 11 pass through multiple
Cable 14 and interposer 13 connect.It will be explained in the structure of the coupling part between interposer 13 and circuit substrate 11 later
At.
Endoscope processor 200 is assembled with the image processing apparatus of endoscope-use, and has system controller 201, moment
Controller 202, light source unit 203, image processing unit 204 and front panel 205.Light source unit 203 has light source drive
203A, light source 203B and collector lens 203C.
The control of system controller 201 constitutes each element of endoscopic system 1.Moment controller 202 will be used for adjustment signal
The clock signal at processing moment be sent to each circuit in endoscopic system 1.
Light source 203B radiates white light by light source drive 203A drive control.For light source 203B, using xenon lamp,
The high brightness lamps such as halogen lamp, mercury lamp, metal halide lamp.The illumination light emitted from light source 203B enters via collector lens 203C
It is mapped to light guide section 106, and is guided in light guide section 106 towards the front end 100C of electron mirror 100.Light guide section 106 is, for example,
Tie up the LCB of multiple optical fiber (Light Carrying Bundle carries light beam).
It projects the end face of light guide section 106 of the illumination light guided in light guide section 106 from configuration in the 100C of front end.
The illumination light projected from the end face of light guide section 106 projects from front end 100C via lamp optical system 103 and illuminates subject.
Shooting unit 102 is incident on via objective lens optical system 101 by the illumination light (reflected light) that subject reflects.Shooting unit 102
With capturing element (not shown).It is incident on the light for each pixel that the reflected light of shooting unit 102 has in capturing element
Subject image is formed on face.
Capturing element have be respectively provided with green (G), cyan (Cy), magenta (Mg), yellow (Ye) (or red (R),
Green (G), blue (B)) colored filter, the pixel of G, Cy, Mg, Ye (R, G, B).Each pixel is by the subject of imaging
Image is accumulated as the charge corresponding to light quantity and is transformed to picture element signal (the G pixel corresponding to G, Cy, Mg, Ye (R, G, B) colors
Signal, Cy picture element signal, Mg picture element signal, Ye picture element signal) (R picture element signal, G picture element signal, B picture element signal).It is transformed
Picture element signal signal enhanced processing, A/D conversion process are carried out by AFE105, and be sent to the image of endoscope processor 200
Processing unit 204.For example using CCD (Charge Coupled Device, charge-coupled device) image in capturing element
Sensor, CMOS (Complementary Metal Oxide Semiconductor, complementary metal oxide semiconductor) image
Sensor.
The picture element signal received by image processing unit 204 is transformed to vision signal simultaneously by scheduled signal processing
It is sent to monitor 300.Monitor 300 is based on image from showing from the vision signal that image processing unit 204 receives.
In this way, electronic endoscope system has: light source unit 203 (light supply apparatus), emergent light；Electron mirror 100 is (in electronics
Sight glass), including shooting unit 102, the shooting unit 102 have the capturing element for shooting subject to be illuminated；At endoscope
It manages device 200 (processor), is connect with the connector portion 100B of electron mirror 100, handle the subject taken by capturing element
Image；Monitor 300, display treated image.The connector portion 100B of electron mirror 100 has using aftermentioned plate to plate
Interposer is connected to the substrate mounting body of mother substrate by connector.At this point, be installed to interposer cable include at least from
The signal transmission cable that capturing element extends.Since the signal transmission cable extended from capturing element passes through board to board connector
31,34 it is reliably electrically connected to circuit substrate 11, therefore picture signal can be supplied to endoscope processor 200.
[composition of the coupling part of circuit substrate and interposer]
Then, it will be described in the construction of the coupling part of circuit substrate (mother substrate) 11 and interposer 13.Fig. 2 is to show
The major part of the composition of substrate mounting body 10 out, the i.e. figure of the composition of the coupling part of interposer 13 and circuit substrate 11,
Specifically, it indicates in the state that interposer 13 is connected to circuit substrate 11 by board to board connector, from interposer
The state of 13 face (hereinafter also referred to as surface) the side observation opposite with connector chimeric surface.Circuit substrate 11, interposer 13
It is all the substrate with the lit-par-lit structure of multilayer.
As shown in phantom in Figure 2, in connector chimeric surface (hereinafter also referred to as the back side) side mounting plate pair of interposer 13
Connector for substrate (for example, connector plug) 31, the board to board connector 31 are mounted on circuit by chimeric be connected to of connector
The board to board connector (for example, connector body) 34 of 11 side of substrate (referring to Fig. 4 (b)).Multiple cables 14 pass through welding respectively
It is connected to multiple pads 33 of interposer 13.It includes in the composite cable 20 of shield member that multiple cables 14, which are banded in,.Separately
Outside, multiple cables 14 include the insulated electro for the various signals of input/output between circuit substrate 11 and shooting unit 102
Line and coaxial cable for transmitting signal.In addition, existing in Fig. 2 and subsequent attached drawing for the ease of illustration and in pad
33 and cable 14 on only to a part assign appended drawing reference the case where.
From the point of view of interposer 13 to be inserted to the necessity in insertion tube 101A, it is narrow that interposer 13 is configured to width
Shape (shape elongated along the axis direction of insertion tube 101A).Multiple cables 14 are connected respectively to the surface of interposer 13
The pad 33 of side and the pad (not shown) of back side.In addition, multiple cables 14 with the coupling part of pad 33 at protected
The covering of coating 35 (referring to Fig. 4 (a) and Fig. 4 (b)).In this way, multiple cables 14 are connected to the two of interposer 13 by being formed
The composition in face, even if there is also multiple cables 14 can be passed through interposer in the case where more than the quantity of multiple cables 14
13 the advantages of being relayed.
Here, increase to the quantity for imagining cable 14 and need for cable 14 to be also welded to the connector of interposer 13
The bad problem that is fitted into occurred in the case where chimeric surface (back side) side is illustrated.Fig. 3 (a) and Fig. 3 (b) is for illustrating to work as
The figure for being fitted into bad problem that the connector that cable 14 is also welded to interposer 13 may occur in the case where being fitted into surface side.
Specifically, Fig. 3 (a) is the cutting to the welding portion of interposer 13 of cable 14 from the length direction of interposer 13
Face figure, Fig. 3 (b) are the coupling parts of interposer 13 and circuit substrate 11 from the transverse direction perpendicular to above-mentioned length direction
Sectional view.In addition, for the ease of illustration, in Fig. 3 (a) and Fig. 3 (b), upper and lower relation is shown on the contrary (in figure below
Equally).
As shown in Fig. 3 (a), (specifically, cable 14 is to the installation section of interposer 13 for the height of cable mounting portion
Top, chimeric side apart from interposer 13 height is fitted into side to the connection from the connector of interposer 13
Device is fitted into the treble height of the protective coating 35 in side) it is A, the connector between circuit substrate 11 and interposer 13 is embedding
Close height (the chimeric side of the circuit substrate 11 in the installation section of board to board connector 31,34 and being fitted into for interposer 13
The distance between side) it is B, as A > B, as shown in Fig. 3 (b), cable mounting portion (protective coating 35) and circuit substrate 11 are dry
It relates to, it may occur that interfere the case where being completely fitted of board to board connector.Therefore, in the present embodiment, using avoiding sending out
Life is this to be fitted into undesirable board to board connector mounting structure.Hereinafter, being fitted into undesirable substrate mounting body to can be avoided
10 three examples are illustrated.
In either one or two of Examples 1 to 3, the layer of the interposer 13 in the installation section of board to board connector 31,34
Stacking number and circuit substrate 10 (mother substrate) layer stacking number it is total i.e. first total stacking number, be configured to than relay base
The stacking number of the layer of interposer 13 in the installation section of cable 14 in plate 13 and corresponding with the installation section of cable 14
Total i.e. second total stacking number of the stacking number of the layer of circuit substrate 11 in the corresponding part of circuit substrate 11 is big.In the situation
Under, it is preferred that the thickness for constituting multiple layers of each layer of circuit substrate 11 is all identical.It is also preferable to constitute relaying
The thickness of multiple layers of each layer of substrate 13 is all identical.Moreover it is preferred that constituting the more of circuit substrate 11 and interposer 13
The thickness of a layer of each layer is all identical.
In addition, partly being changed in circuit substrate 11 and interposer 13 extremely in any one of Examples 1 to 3
Few one substrate thickness, so that interposer 13 and circuit substrate 11 of the cable 14 into the installation section of interposer 13
Interval between opposite surface than top from cable 14 to the installation section of interposer 13, it is apart from board to board connector 31,34
The height of the chimeric side of interposer 13 in installation section is big.In this case, with the base in board to board connector 31,34
Partly increased mode constitutes at least one of circuit substrate 11 and interposer 13 to plate thickness.Alternatively, with cable 14
The mode that partly reduces of substrate thickness of part of circuit substrate 11 of installation section opposite direction constitute circuit substrate 11.
In addition, in any one of embodiment 1,3, at least one of interposer 13 and circuit substrate 11
The face that the face of the installation section of board to board connector 41,43 is configured to peripheral part relative to the installation section is prominent.
In addition, in example 2, circuit substrate 11 it is corresponding corresponding with the installation section of cable 14 to interposer 11
The direction away from interposer 13 that partial face is configured to peripheral part relative to the corresponding part is recessed.
By such composition, though be connected to the cable of interposer 13 quantity increase and cable from relaying base
In the case where the face protrusion of plate 13, since the installation section of the cable on interposer 13 will not interfere with circuit substrate 11, because
It is bad that this can eliminate being fitted into for board to board connector 31,34.
[embodiment 1]
Embodiment 1 is to increase company and more than one layer to be added to the connector installation section of 11 side of circuit substrate
It connects the chimeric height of device and is fitted into undesirable configuration example to avoid connector.In this case, the thickness of the layer of circuit substrate 11 is constituted
It is mutually the same, it is preferred that the thickness degree of the more than one layer of addition is identical as the thickness of layer of circuit substrate 11 is constituted.Figure
4 (a) be applicable in substrate mounting body 10 (board to board connector mounting structure) that embodiment 1 is related to, from interposer 13
Length direction observe welding portion from cable 14 to interposer 13 sectional view, Fig. 4 (b) is from perpendicular to above-mentioned length side
To lateral observation Fig. 4 (a) in interposer 13 and circuit substrate 11 coupling part sectional view.
Specifically, if the thickness (increase of the thickness due to caused by the layer 11a being partly overlapped of adding layers 11a
Amount) be defined as C, then in embodiment 1, the size of adding layers 11a is set in a manner of meeting A≤B+C (that is, the layer of overlapping
Number).By this composition, avoids mounting portion (protective coating 35) the interference circuit substrate 11 of cable and generate connector and be fitted into
It is bad.In which case it is preferable that A > B.
The material for the circuit substrate 11 that layer is partly overlapped is not particularly limited, ceramics, organic plastics etc. can be used
The substrate of various materials, in terms of manufacturing, ceramics are considered preferred.In the case where ceramic material, by
It is overlapped substratum on big layer and is fired the composition to realize the present embodiment.In addition, the printing being partly overlapped for forming layer
Substrate is constituted, and various lamination techniques known in the art, processing technology also can be used.
[embodiment 2]
Embodiment 2 is the part with cable mounting portion (protective coating 35) opposite direction by forming 11 side of circuit substrate
The composition that partly removes of layer and reduce substrate thickness and be fitted into undesirable configuration example to avoid connector.Here, circuit base is constituted
The thickness of the layer of plate 11 is mutually the same, it is preferred that the thickness of the layer of removal is identical as the thickness of layer of circuit substrate 11 is constituted.
Fig. 5 (a) be applicable in board to board connector mounting structure that embodiment 2 is related to, from the length direction of interposer 13
Welding portion from cable 14 to interposer 13 sectional view, Fig. 5 (b) is from figure from lateral perpendicular to above-mentioned length direction
The sectional view of the coupling part of interposer 13 and circuit substrate 11 in 5 (a).
Specifically, as shown in Fig. 5 (b), by the opposite direction with cable mounting portion (protective coating 35) in circuit substrate 11
Partial layer part removal forms lower digging layer portion 11b.As shown in Fig. 5 (a), if the lower depth for digging layer portion 11b is (due to layer
A part is partially removed the reduction amount of the thickness of caused above-mentioned mother substrate) be defined as C ', then in example 2,
The lower size (number of plies of removal) for digging layer portion C ' is set in a manner of meeting A≤B+C '.By this composition, cable is avoided
Mounting portion (protective coating 35) interference circuit substrate 11 and generate connector be fitted into it is bad.In which case it is preferable that A > B.
In addition, the number of plies to removal is not particularly limited, can also be formed will constitute all layers of removal of circuit substrate 11
Composition.By all layers of removal, the part of all layers of removal forms hole.Layer is partially removed and is formed
The material of circuit substrate 11 is not particularly limited, and the substrate of the various materials such as ceramics, organic plastics can be used.In addition, in order to
The printed base plate that forming layer is partially removed is constituted, and various lamination techniques known in the art and processing skill also can be used
Art.
[embodiment 3]
Embodiment 3 is to increase company and more than one layer to be added to the connector installation section of 13 side of interposer
It connects the chimeric height of device and is fitted into undesirable configuration example to avoid connector.Here, the thickness phase each other of the layer of interposer 13 is constituted
Together, it is preferred that the thickness degree of the more than one layer of addition is identical as the thickness of layer of interposer 13 is constituted.Fig. 6 (a) is
Be applicable in the board to board connector mounting structure that embodiment 3 is related to, from the length direction of interposer 13 cable 14 to
The sectional view of the welding portion of interposer 13, Fig. 6 (b) are from Fig. 6 (a) from lateral perpendicular to above-mentioned length direction
The sectional view of the coupling part of interposer 13 and circuit substrate 11.
Specifically, if make an addition to the adding layers 13a of the connector installation section of interposer 13 thickness (due to
Partly it is overlapped in the incrementss of thickness caused by the layer 13a of interposer 13) be defined as C ", then in embodiment 3,
The thickness (that is, number of plies of overlapping) of adding layers 13a is set in a manner of meeting A≤B+C ".By this composition, electricity is avoided
Cable installation section interference circuit substrate 11 and generate connector be fitted into it is bad.In which case it is preferable that A > B.
The material for the interposer 13 that layer is partly overlapped is not particularly limited, ceramics, organic plastics etc. can be used
The substrate of various materials, in terms of manufacturing, ceramics are considered preferred.In the case where ceramic material, by
It is overlapped substratum on big layer and is fired the composition to realize the present embodiment.In addition, the printing being partly overlapped for forming layer
Substrate is constituted, and various lamination techniques and processing technology known in the art also can be used.
Board to board connector mounting structure shown in above-described embodiment 1 to 3 is based on following technical concept.In other words,
The substrate mounting body that present embodiment provides can show as following construction: in the multilayer interposer and multilayer for being equipped with cable
Mother substrate is connected in the composition of device connection by board to board connector, the interposer in the installation section of board to board connector
Layer stacking number and mother substrate layer stacking number it is total i.e. first total stacking number, be configured to than the electricity in interposer
Mother in the corresponding part of the stacking number of the layer of interposer in the installation section of cable and mother substrate corresponding with installation section
Total i.e. second total stacking number of the stacking number of the layer of substrate is big.
It is the explanation to embodiments of the present invention above.The present invention is not limited to above-mentioned compositions, in technology structure of the invention
Various modifications can be carried out in the range of think of.For example, by embodiment expressed exemplary in specification etc. or obviously
Content obtained from the progress such as embodiment is appropriately combined, is also contained in presently filed embodiment.
Above embodiment be will use board to board connector mounting structure suitable for the electron mirror of endoscope in
After the example of the connector connection part of substrate and the circuit substrate as its mother substrate point, still, plate of the present invention is to plate
Connector mounting construction is readily applicable to the connector connection part between the interposer and mother substrate in various electronic equipments
Point.
Above-described embodiment 1 is the connector mounting portion that more than one layer is added to 11 side of circuit substrate of circuit substrate
Point composition, embodiment 2 be by the composition of 11 side of circuit substrate partly removed with the layer of the part of cable mounting portion opposite direction,
Embodiment 3 is that more than one layer is added to the composition of the connector installation section of 13 side of interposer, be however, it can be
By at least two composition being composed in embodiment 1, embodiment 2, the composition of embodiment 3.
1, endoscopic system；10, substrate mounting body；11, circuit substrate；11a, adding layers；11b, lower digging layer portion；13, in
After substrate；13a, adding layers；14, cable；31, board to board connector (connector plug)；33, pad；34, board to board connector
(connector body)；100, electron mirror；100A, insertion tube；100B, connector portion；100C, front end；101, object lens optical system
System；102, shooting unit；103, objective lens optical system；104, capturing element driver； 105,AFE(Analog Front
End)；106, light guide section；200, endoscope processor；201, system controller；202, moment controller；203, light source unit；
203A, light source drive；203B, light source；203C, collector lens；204, graphics processing unit；205, front panel；300, it supervises
Visual organ.
Claims (13)
1. a kind of substrate mounting body, the substrate mounting body includes: the mother substrate for being provided with board to board connector；And it is equipped with
Cable and the interposer for being provided with board to board connector, board to board connector is fitted into each other and by the mother substrate and described
Interposer connection, the cable are clamped between the mother substrate and the interposer, which is characterized in that
The mother substrate and the interposer are respectively provided with multiple layers of lit-par-lit structure,
The stacking number of the layer of the interposer in the installation section of the board to board connector and the mother substrate
Total i.e. first total stacking number of the stacking number of the layer, is configured to the mounting portion than the cable in the interposer
The stacking number of the layer of the interposer in point and the corresponding part of the mother substrate corresponding with the installation section
In the mother substrate the layer stacking number it is total i.e. second total stacking number it is big.
2. substrate mounting body according to claim 1, which is characterized in that
In the mother substrate, partly overlapping has layer, so that the layer of the layer described in the installation section of the board to board connector
Folded number part increases.
3. substrate mounting body according to claim 1 or 2, which is characterized in that
In the mother substrate, a part of the layer is partially removed, so that the mother substrate in the corresponding part
It reduces stacking number part.
4. substrate mounting body according to claim 1 or 2, which is characterized in that
In the interposer, partly overlapping has layer, so that the layer described in the installation section of the board to board connector
Stacking number part increases.
5. substrate mounting body according to claim 2, which is characterized in that
When set top from the cable to the installation section of the interposer, chimeric side apart from the interposer
Height is A, between the chimeric side of the mother substrate and the chimeric side of the interposer in the installation section away from
From for B, when the incrementss of the thickness due to caused by the layer being partly overlapped are C, meet A≤B+C.
6. substrate mounting body according to claim 3, which is characterized in that
When set top from the cable to the installation section of the interposer, chimeric side apart from the interposer
Height is A, between the chimeric side of the mother substrate and the chimeric side of the interposer in the installation section away from
From for B, due to the layer a part by it is described partly remove caused by the reduction amount of thickness of the mother substrate be C '
When, meet A≤B+C '.
7. substrate mounting body according to claim 4, which is characterized in that
When set top from the cable to the installation section of the interposer, chimeric side apart from the interposer
Height is A, between the chimeric side of the mother substrate and the chimeric side of the interposer in the installation section away from
From for B, when the incrementss of thickness caused by the layer due to partially overlapping the interposer are C ", meet A≤B+C ".
8. a kind of substrate mounting body, the substrate mounting body includes: the mother substrate for being provided with board to board connector；And it is equipped with
Cable and the interposer for being provided with board to board connector, board to board connector is fitted into each other and by the mother substrate and described
Interposer connection, the cable are clamped between the mother substrate and the interposer, which is characterized in that
The mother substrate and the interposer are respectively provided with multiple layers of lit-par-lit structure,
The substrate thickness of at least one of the mother substrate and the interposer is changed in part, so that the cable is to described
The interposer in the installation section of interposer and the interval between the opposite surface of the mother substrate, than the cable to institute
State the interposer in the top of the installation section of interposer, installation section apart from the board to board connector
The height of chimeric side is big.
9. substrate mounting body according to claim 8, which is characterized in that
With the increased side of caliper portion at least one of the mother substrate and the interposer, described installation section
Formula constitutes at least one of the mother substrate and the interposer.
10. substrate mounting body according to claim 8 or claim 9, which is characterized in that
In a manner of the caliper portion reduction with the part of the installation section opposite direction of the mother substrate, female base is constituted
Plate.
11. a kind of substrate mounting body, the substrate mounting body includes: the mother substrate for being provided with board to board connector；And installation
Have cable and be provided with the interposer of board to board connector, board to board connector is fitted into each other and by the mother substrate and institute
Interposer connection is stated, the cable is clamped between the mother substrate and the interposer, which is characterized in that
The face of the installation section of the board to board connector of at least one of the interposer and the mother substrate is by structure
Face as peripheral part relative to the installation section is prominent.
12. a kind of substrate mounting body, the substrate mounting body includes: the mother substrate for being provided with board to board connector；And installation
Have cable and be provided with the interposer of board to board connector, board to board connector is fitted into each other and by the mother substrate and institute
Interposer connection is stated, the cable is clamped between the mother substrate and the interposer, which is characterized in that
The face of the corresponding part corresponding with the installation section of the cable to the interposer of the mother substrate is configured to
The direction away from the interposer of peripheral part relative to the corresponding part is recessed.
13. a kind of electronic endoscope system characterized by comprising
Light supply apparatus, emergent light；
Endoscope has capturing element, and the capturing element shooting is by the subject of the optical illumination；
Processor is connect with the connector portion of the endoscope, handles the image of the subject taken by the capturing element；
And
Monitor, display treated described image,
The connector portion has substrate mounting body described in any one of claims 1 to 12,
The cable includes at least the signal transmission cable extended from the capturing element.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016104515 | 2016-05-25 | ||
| JP2016-104515 | 2016-05-25 | ||
| PCT/JP2017/019351 WO2017204245A1 (en) | 2016-05-25 | 2017-05-24 | Board assembly and electronic endoscope system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209376016U true CN209376016U (en) | 2019-09-10 |
Family
ID=60412701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201790000662.6U Active CN209376016U (en) | 2016-05-25 | 2017-05-24 | Substrate mounting body and electronic endoscope system |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6646342B2 (en) |
| CN (1) | CN209376016U (en) |
| WO (1) | WO2017204245A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7185450B2 (en) * | 2018-09-06 | 2022-12-07 | 株式会社フジクラ | connector, board with connector |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS645390U (en) * | 1987-06-30 | 1989-01-12 | ||
| JP2013105794A (en) * | 2011-11-10 | 2013-05-30 | Sharp Corp | Board unit and electronic apparatus |
| JP5548324B1 (en) * | 2012-11-29 | 2014-07-16 | オリンパスメディカルシステムズ株式会社 | Board structure |
| JP5507026B1 (en) * | 2012-11-29 | 2014-05-28 | オリンパスメディカルシステムズ株式会社 | Board connection structure |
| JP5690455B1 (en) * | 2013-04-16 | 2015-03-25 | オリンパスメディカルシステムズ株式会社 | Board connection structure |
| CN104684455B (en) * | 2013-06-28 | 2017-05-10 | 奥林巴斯株式会社 | Imaging module and endoscope device |
-
2017
- 2017-05-24 CN CN201790000662.6U patent/CN209376016U/en active Active
- 2017-05-24 JP JP2018519580A patent/JP6646342B2/en active Active
- 2017-05-24 WO PCT/JP2017/019351 patent/WO2017204245A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP6646342B2 (en) | 2020-02-14 |
| WO2017204245A1 (en) | 2017-11-30 |
| JPWO2017204245A1 (en) | 2018-11-29 |
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