JP6724650B2 - Light emitting device and method for manufacturing light emitting device - Google Patents

Description

The present invention relates to a light emitting device and a method for manufacturing a light emitting device.

There is known a small light emitting device in which the entire surface of the light emitting element is covered only with a sealing member without providing a housing for housing the light emitting element. A method is disclosed in which the entire surface of the light emitting element is covered by forming the sealing member separately. Then, in order to cover the entire surface of the light emitting element, it is disclosed that two kinds of sealing members are formed so as to partially overlap each other (for example, Patent Document 1).

JP 2012-60181 A

There is a possibility that the sealing member will peel off at the portion where the sealing member overlaps.

The embodiment of the present invention includes the following configurations.
A transparent substrate forming the first surface, a semiconductor layer forming a second surface opposite to the first surface, and a side surface of the transparent substrate and the semiconductor layer between the first surface and the second surface. A light emitting device including: a laminated structure having side surfaces including side surfaces; and an electrode provided on a second surface of the laminated structure; and a seal covering a surface of the laminated structure so that at least a part of the electrode is exposed. A light-emitting device comprising: a stop member, wherein the sealing member covers a first surface and a side surface of the translucent substrate, a second surface and a side surface of the semiconductor layer, and a translucent material. A second sealing member that covers the first sealing member that covers the side surface of the substrate, wherein the first sealing member and the second sealing member do not overlap on the side surface of the semiconductor layer.

As described above, it is possible to obtain a small-sized light emitting device in which the sealing member is hard to peel off.

FIG. 1 is a schematic sectional view of a light emitting device according to an embodiment. 2A to 2E are schematic cross-sectional views showing the method for manufacturing the light emitting device according to the embodiment. FIG. 3 is a schematic cross-sectional view of the light emitting device according to the embodiment. 4A to 4E are schematic diagrams showing a method for manufacturing the light emitting device according to the embodiment. FIG. 5A to FIG. 4F are schematic views showing the method for manufacturing the light emitting device according to the embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, a term indicating a specific direction or position (for example, “upper”, “lower”, “right”, “left” and another term including those terms) is used as necessary. .. The use of those terms is for facilitating the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of the terms. Further, the same reference numerals appearing in a plurality of drawings indicate the same parts or members.

The light emitting device according to the embodiment includes a light emitting element and a sealing member that covers the surface of the light emitting element. At least a part of the sealing member is translucent and functions as a light emitting surface of the light emitting device. Further, the sealing member constitutes the outer surface of the light emitting device and functions as a protective film for protecting the light emitting element from the outside.

The light emitting element includes a laminated structure and an electrode. The laminated structure includes a translucent substrate and a semiconductor layer. The semiconductor layer includes a light emitting layer. The laminated structure includes a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface. The first surface of the laminated structure is made of a transparent substrate, and the second surface is made of a semiconductor layer. The side surface of the laminated structure is composed of the side surface of the transparent substrate and the side surface of the semiconductor layer.

The sealing member covers the surface of the light emitting element. Specifically, the surface of the laminated structure is coated so that at least a part of the electrode is exposed. The sealing member includes a first sealing member that covers the first surface and the side surface of the translucent substrate. The sealing member includes a second surface and a side surface of the semiconductor layer and a second sealing member that covers the side surface of the translucent substrate. The first sealing member and the second sealing member do not overlap on the side surface of the semiconductor layer.

Light is emitted from the light emitting layer of the semiconductor layer by energization. At this time, heat is also generated from the light emitting layer. Therefore, the sealing member that covers the semiconductor layer including the light emitting layer is easily affected by heat. In the light emitting device according to the embodiment, two sealing members are used, and they overlap each other on the side surface of the transparent substrate. The overlapping portions of the sealing members are the edge portions of the two sealing members and the thinly formed portions. Therefore, it is easily peeled off as compared with other portions, that is, the sealing members that do not overlap. In the light emitting device according to the embodiment, the first sealing member and the second sealing member do not overlap on the side surface of the semiconductor layer. That is, the first sealing member and the second sealing member do not overlap with each other on the side surface of the semiconductor layer which is the most susceptible to heat. This can reduce peeling of the sealing member. If the sealing member is translucent, it is necessary to use a translucent member. Therefore, there is a restriction on the degree of freedom in selecting a material having a property of suppressing peeling of the sealing member such as adhesiveness or thermal deformation resistance. In the present embodiment, even if there are the above restrictions, it is possible to prevent the sealing member from peeling off by setting the position where the two sealing members overlap to a specific position.

<Embodiment 1>
A light emitting device 1 according to the first embodiment is shown in FIG. The light emitting device 1 includes a light emitting element 10 and a sealing member 20. The light emitting element 10 includes a laminated structure 11 including a semiconductor layer and a pair of electrodes 17. The laminated structure 11 includes a transparent substrate 13 and a semiconductor layer 15. The laminated structure 11 includes a first surface 11a, a second surface 11b opposite to the first surface 11a, and a side surface 11c between the first surface 11a and the second surface 11b. The first surface 11a of the laminated structure 11 is composed of the first surface 13a of the translucent substrate 13, and the second surface 11b is composed of the second surface 15b of the semiconductor layer 15. The side surface 11c of the laminated structure 11 is composed of the side surface 13c of the transparent substrate 13 and the side surface 15c of the semiconductor layer 15.

The sealing member 20 covers the surface of the light emitting element 10. Specifically, the surface of the laminated structure 11 is covered so that at least a part of the electrode 17 is exposed. The sealing member 20 includes a first sealing member 21 that covers the first surface 13a and the side surface 13c of the transparent substrate 13. The sealing member 20 includes a second surface 15b and a side surface 15c of the semiconductor layer 15, and a second sealing member 22 that covers the side surface 13c of the translucent substrate 13.

The side surface 13c of the transparent substrate 13 is covered with both the first sealing member 21 and the second sealing member 22. The side surface 15c of the semiconductor layer 15 is covered only with the second sealing member 22. That is, the first sealing member 21 and the second sealing member 22 do not overlap on the side surface 15c of the semiconductor layer 15. In the first embodiment, the first sealing member 21 that is in contact with the side surface 13c of the translucent substrate 13 and the second sealing member 22 that covers the first sealing member 21 are provided.

The first sealing member 21 is covered with the second sealing member 22. Thereby, the surface of the light emitting element other than the electrodes can be covered with the sealing member.

The first sealing member 21 has different thicknesses on the side surface 13c of the transparent substrate 13. In detail, the first surface 11a side of the laminated structure is thicker and the thickness becomes thinner toward the second surface 11b side. This makes it possible to prevent the sealing member from easily becoming thicker than other portions in the portion overlapping the second sealing member. For example, when the first sealing member 21 and the second sealing member 22 are made of the same material, that is, when the wavelength conversion member containing the same phosphor at a substantially uniform concentration is used, the thick portion and the thin portion are thickened. When the light emitting element is formed, a difference in emission color occurs. Therefore, by making the thickness of the overlapping portion of the two sealing members substantially equal to the thickness of the non-overlapping portion, it is possible to cover the surface of the light emitting element with one sealing member. it can. Thereby, the emission color can be made substantially uniform.

Further, a portion of the sealing member having a large thickness tends to have a low heat dissipation property to the outside and has a temperature higher than that of a portion having a small thickness. Therefore, the amount of deformation due to heat tends to increase. By making the thickness of the overlapping portion of the two sealing members substantially equal to or thinner than the non-overlapping portion, the amount of deformation due to heat can be suppressed and peeling can be suppressed. Furthermore, deterioration due to heat can be suppressed. .. Further, since the first sealing member 21 is thin on the second surface side, the outer side surface is an inclined surface. Thereby, the area in contact with the second sealing member can be increased, and the adhesive force between the first sealing member and the second sealing member can be improved.

When the first sealing member 21 is a translucent member and the second sealing member 22 is a light reflecting member, the interface between the first sealing member 21 and the second sealing member 22 is an inclined surface. .. That is, the light-reflective second sealing member 22 serves as a reflecting surface that faces upward (first surface side). Thereby, the light from the light emitting layer can be reflected by the inclined surface which is the interface thereof, and the light can be easily emitted toward the transparent substrate side.

The first sealing member 21 is formed in a rounded shape at a corner between the first surface 13a and the side surface 13c of the translucent substrate 13. Thereby, when the sealing member is heat-cured, the stress generated by the curing shrinkage of the sealing member can be dispersed in the rounded portion without being concentrated in the corner portion. This makes it possible to suppress cracking or peeling of the sealing member at the corner due to stress concentration. Moreover, even when the jig of the device is brought into contact with the surface of the light emitting device, that is, the sealing member and the sealing member is pressed and deformed when the light emitting device is inspected or mounted on the wiring board, the first sealing As compared with the case where the stopper member is angular, the deformation stress can be dispersed in the rounded portion without being concentrated in the corner portion. This makes it possible to suppress cracking or peeling of the sealing member at the corner due to stress concentration.

A method for manufacturing the light emitting device 1 will be described with reference to FIGS.

First, as shown in FIG. 2A, the light emitting element 10 is placed on the sheet S1 having an adhesive layer (not shown). A plurality of light emitting elements 10 can be placed on the sheet S1, and here, an example in which two light emitting elements 10 are placed is shown. The light emitting element 10 is mounted such that the second surface 11b of the laminated structure 11, that is, the second surface 15b side of the semiconductor layer 15 faces the adhesive layer of the sheet S1.

It is preferable that the plurality of light emitting elements 10 be placed regularly with a constant distance from the adjacent light emitting elements 10. In that case, the width of the gap between the light-emitting element and the adjacent light-emitting element is larger than the film thickness of the first sealing member (the film thickness on the first surface of the laminated structure), which will be described later, between the adjacent elements. It is preferably large in order to prevent

As described below, the first sealing member is formed by spraying a translucent resin member. Therefore, by reducing the distance between the light emitting element 10 and the adjacent light emitting element 10, it is difficult to form the first sealing member below the side surface 11c of the stacked structure 11, that is, on the side surface 15c of the semiconductor layer 15. be able to. For example, the laminated structure 11 has a quadrangular shape when viewed from the top and has a length of 100 μm to 3000 μm×a width of 100 μm to 3000 μm. When the first sealing member having a film thickness of 50 μm to 200 μm is formed, the width of the gap between the light emitting element and the adjacent light emitting element can be 70 μm to 1000 μm.

Further, when the light emitting element 10 is placed on the sheet S1, the electrode 17 may be embedded in the adhesive layer of the sheet S1 as shown in FIG. 2A. Furthermore, the electrode 17 and the semiconductor layer 15 may be embedded in the adhesive layer. By embedding the side surface 15c of the semiconductor layer 15 in the adhesive layer, it is possible to more reliably prevent the first sealing member described below from covering the side surface of the semiconductor layer. When a part of the light emitting element 10 is embedded in the adhesive layer in this way, the width of the gap between the light emitting element and the adjacent light emitting element can be made larger than the width of the above-mentioned gap.

Next, as shown in FIG. 2B, the first sealing member 21 is formed. The first sealing member 21 is preferably formed by spray-coating a liquid resin member, and particularly preferably formed by a pulse spray method in which a spray is intermittently ejected. As the resin member, a resin material mixed with a wavelength conversion member, a diffusing material, or the like can be used.

The spray nozzle has a spray port disposed above the sheet S1 and the light emitting element, and a liquid resin member is sprayed from above the light emitting element. As shown in FIG. 2B, the first sealing member 21 formed by the spray method includes the first surface 11 a and the side surface 11 c of the laminated structure 11 of the light emitting element, specifically, the transparent substrate 13. It is formed on the first surface 13a and the side surface 13c. At the corner between the first surface 13a and the side surface 13c of the translucent substrate 13, the first sealing member 21 is formed in a rounded shape. Further, on the side surface 13c of the translucent substrate 13, the thickness of the first sealing member 21 becomes thinner toward the lower side. Further, the resin member is also sprayed between the light emitting elements, that is, the portion where the sheet S1 is exposed. The resin member on the sheet S1 and the resin member that covers the side surface of the light emitting element are continuous or discontinuous.

The first sealing member 21 is formed by curing the applied resin member by heating. The resin member on the sheet S1 is also cured because it is cured while being placed on the sheet S1. It should be noted that the second sealing member described below is also heated when being cured. Therefore, at this stage, the heating temperature of the first sealing member 21 can be made lower than the heating temperature at the time of curing the second sealing member 22. For example, the temperature and time for curing the first sealing member 21 at this stage can be maintained at 80° C. to 250° C. for 5 minutes to 30 minutes. Further, the first sealing member 21 may be cured in a semi-cured state (temporary cured state) that is softer and less elastic than the final cured state, or may be in a fully cured state in which it is cured to a desired hardness. .. Preferably, the first sealing member 21 is pre-cured at this stage.

In addition, "temporary curing" refers to a state in which the resin material is changed from a liquid state to a solid state, and refers to a state in which the resin contains unreacted (uncured) components. That is, it means a state in which the resin in a liquid state is hardened to the extent that it does not flow. The temporarily cured resin has poor elasticity and is fragile. Further, “main curing” refers to a state (completely cured state) in which the resin has been cured to a state in which no unreacted (uncured portion) is contained.

Next, as shown in FIG. 2C, the light emitting element including the first sealing member 21 is transferred from the sheet S1 to the sheet S2. Specifically, after the sheet S2 is attached to the first sealing member 21 formed on the first surface 11a side of the laminated structure of the light emitting element, the sheet S1 is peeled off.

When the resin member is continuously formed from the side surface of the laminated structure to the upper surface of the sheet S1, when the light emitting element is peeled from the sheet S1, the thickness is thin at a position close to the upper surface of the sheet S1. Tear off the resin part of the part. Thereby, the light emitting element can be transferred with the resin member left on the sheet S1. Further, before being torn off, for example, the part of the sheet S1 on which the light emitting elements are mounted can be preliminarily torn off by rubbing it with a spatula or the like from below. If the first sealing member is in a semi-cured state at the time of tearing, the tearability is improved because the elasticity is low.

A part of the first sealing member 21 may be embedded in the pressure-sensitive adhesive layer of the sheet S2, but it is preferably not embedded. This is because the first sealing member 21 is still fragile in the semi-cured state as described above, and may deform when subjected to an excessive binding force of the adhesive material. In order to perform transfer without excessively pressing the light emitting element, the adhesive layer of the sheet S2 preferably has higher adhesive strength than the sheet S1.

As shown in FIG. 2C, by transferring from the sheet S1 to the sheet S2, the electrode 17 of the light emitting element is exposed upward. Therefore, at this stage, it is possible to perform a light emission test in which the light emitting element is energized to emit light. For example, when the first sealing member 21 includes the wavelength conversion member, the chromaticity can be confirmed at this stage. When the wavelength conversion member is included in the second sealing member described later, the application amount of the second sealing member can be adjusted based on the chromaticity at this stage. When such a light emission test is performed, it is preferable to use a transparent sheet S2.

Next, as shown in FIG. 2D, the second sealing member 22 is formed. Like the first sealing member, the second sealing member 22 can be formed by spray-coating a liquid resin member, and in particular, can be formed by a pulse spray method in which a spray is intermittently ejected. preferable. As the resin member, a resin material mixed with a wavelength conversion member, a diffusing material, or the like can be used.

The spraying port of the spray nozzle is arranged above the sheet S2 and the light emitting element, and the liquid resin member is sprayed from above the light emitting element. As shown in FIG. 2D, the second sealing member 22 formed by the spray method is formed on the second surface 11b and the side surface 11c of the laminated structure 11 of the light emitting element. Specifically, the second sealing member 22 covers not only the second surface 15b and the side surface 15c of the semiconductor layer 15 but also the first sealing member 21 formed on the side surface 13c of the transparent substrate 13. Has been formed. The second sealing member 22 is also formed so as to cover the surface of the electrode 17. At the corner between the second surface 15b and the side surface 15c of the semiconductor layer 15, the second sealing member 22 is formed in a rounded shape.

On the side surface of the semiconductor layer 15, the film thickness of the second sealing member 22 is substantially uniform. Further, on the side surface 13c of the translucent substrate 13, as shown in FIG. 2D, the thickness of the second sealing member 22 becomes thinner toward the lower side. As shown in FIG. 2D, the first sealing member 21 becomes thicker as it approaches the lower side. Therefore, the total film thickness of the first sealing member 21 and the second sealing member 22 in the overlapping portion is substantially equal to the film thickness of the second sealing member 22 that covers the side surface 15c of the semiconductor layer. be able to. As a result, it is possible to reduce uneven light distribution of the light emitting device.

The side surface of the first sealing member 21 may be entirely covered with the second sealing member 22. Thereby, the adhesion area between the sealing members can be increased and the adhesion can be made stronger. Alternatively, a part of the side surface of the first sealing member 21 may be exposed. Thereby, the thickness of the sealing member on the side surface of the element can be reduced, and the heat dissipation of the sealing member can be improved.

The resin member is also sprayed between the light emitting elements and the light emitting elements, that is, the portion where the sheet S2 is exposed. The second sealing member 22 is formed by curing the applied resin member by heating. The resin member on the sheet S2 is also cured because the resin member is cured while being placed on the sheet S2. The heating temperature and time for curing the second sealing member may be, for example, 120° C. to 250° C. for 60 minutes to 360 minutes (main curing). By this heating, the first sealing member 21 as well as the second sealing member 22 are fully hardened, and the sealing member 20 is brought into a hardened state having a desired hardness.

Next, as shown in FIG. 2E, at least a part of the electrode 17 is exposed by removing a part of the second sealing member 22 by polishing or the like. Preferably, the entire upper surface of the electrode 17 is exposed. Finally, by removing the sheet S2, the light emitting device 1 shown in FIG. 1 can be obtained. Since the second sealing member 22 is removed by polishing, depending on the amount of polishing, the corners may not be rounded as shown in FIG. 2E and may have an angular shape.

<Embodiment 2>
A light emitting device 2 according to the second embodiment is shown in FIG. The light emitting device 2 is different from that of the first embodiment in how the first sealing member 212 and the second sealing member 222 that form the sealing member 220 overlap. That is, the light emitting device 2 includes the second sealing member 222 that contacts the side surface 13c of the transparent substrate 13 and the first sealing member 212 that covers the second sealing member 222.

Since the second sealing member 222 is covered with the first sealing member 212, the adhesion between the second sealing member 222 and the semiconductor layer 15 can be improved.

Since the second sealing member 222 has different thicknesses on the side surface 13c of the translucent substrate 13, the side surface of the second sealing member 222 becomes an inclined surface. As a result, the area in contact with the first sealing member 212 can be increased, and the adhesive force between the first sealing member 212 and the second sealing member 222 can be improved. Further, when the first sealing member 212 is a translucent member and the second sealing member 222 is a light reflecting member, it is an element having high front light distribution with little light emitted to the side of the light emitting element. You can When the second sealing member 222 is a light-reflecting member, it can be an element having a high light emission amount to the front, that is, a high front brightness.

(Manufacturing method 1)
A method 1 for manufacturing the light emitting device 2 will be described with reference to FIGS. 4(a) to 4(e). The light emitting device 2 can be obtained by first forming the second sealing member and then forming the first sealing member.

First, a light emitting element is prepared, and as shown in FIG. 4A, the light emitting element 10 is placed on a sheet S3 having an adhesive layer (not shown). A plurality of light emitting elements 10 can be placed on the sheet S3, and here, an example in which two light emitting elements 10 are placed is shown. The light emitting element 10 is placed with the first surface 11a of the laminated structure 11, that is, the first surface 13a side of the transparent substrate 13 facing the adhesive layer of the sheet S3.

It is preferable that the plurality of light emitting elements 10 be placed regularly with a constant distance from the adjacent light emitting elements 10. In that case, the distance between the light emitting element and the adjacent light emitting element is preferably larger than the film thickness of the second sealing member described later (the film thickness on the first surface of the laminated structure).

As will be described later, the second sealing member is formed by spraying a translucent resin member. Therefore, the second sealing member is formed below the side surface 11c of the laminated structure 11, that is, on the side surface 13c of the translucent substrate 13 by reducing the distance between the light emitting element 10 and the adjacent light emitting element 10. Can be hardened. For example, the laminated structure 11 has a quadrangular shape when viewed from the top and has a length of 100 μm to 3000 μm×a width of 100 μm to 3000 μm. When the first sealing member having a film thickness of 50 μm to 200 μm is formed, the width of the gap between the light emitting element and the adjacent light emitting element can be 70 μm to 1000 μm.

Next, the second sealing member 222 as shown in FIG. 4B is formed. The second sealing member 222 is preferably formed by spray-coating a liquid resin member, and particularly preferably formed by a pulse spray method in which spray is intermittently ejected. As the resin member, a resin material mixed with a wavelength conversion member, a diffusing material, a light reflecting member, or the like can be used.

The spray nozzle has a spray port disposed above the sheet S1 and the light emitting element, and a liquid resin member is sprayed from above the light emitting element. The second sealing member 222 formed by the spray method, as shown in FIG. 4B, the second surface 11b and the side surface 11c of the laminated structure 11 of the light emitting element, specifically, the second surface of the semiconductor layer 15. 15b and the side surface 15c, and the side surface 13c of the translucent substrate 13 are formed. Further, the second sealing member 222 is provided so as to cover the upper surface of the electrode 17.

At the corner between the second surface 15b and the side surface 15c of the semiconductor layer 15, the second sealing member 222 is formed in a rounded shape. Further, on the side surface 13c of the transparent substrate 13, the thickness of the second sealing member 222 becomes thinner as it goes downward. Further, the resin member is also sprayed between the light emitting elements, that is, the portion where the sheet S3 is exposed. The resin member on the sheet S3 and the resin member that covers the side surface of the light emitting element are continuous or discontinuous.

The second sealing member 222 is formed by curing the applied resin member by heating. The resin member on the sheet S3 is also cured because it is cured while being placed on the sheet S3. The heating temperature and time for curing the second sealing member may be, for example, 120° C. to 250° C. for 60 minutes to 360 minutes. By this curing, the second sealing member is brought into a cured state having the desired hardness (main curing).

Next, as shown in FIG. 4C, at least a part of the electrode 17 is exposed by removing a part of the second sealing member 222 by polishing or the like. Preferably, the entire upper surface of the electrode 17 is exposed. In the manufacturing method 1, since the second sealing member is removed by polishing or the like before forming the first sealing member, the second sealing member 222 is cured at the heating temperature as described above. As a result, it is possible to prevent the sealing member from collapsing and being excessively polished during polishing. In addition, when the below-described first sealing member is cured, it is possible to prevent problems such as peeling of the second sealing member due to thermal contraction around the electrodes.

Next, as shown in FIG. 4D, the light emitting element including the second sealing member 222 is transferred from the sheet S3 to the sheet S4. Specifically, after the sheet S4 is attached to the second sealing member 222 formed on the second surface 11b side of the laminated structure of the light emitting element, the sheet S3 is peeled off. In the case where the resin member is continuously formed from the side surface of the laminated structure to the upper surface of the sheet S3, when the light emitting element is peeled from the sheet S3, the thickness is thin at a position close to the upper surface of the sheet S3. Tear off the resin member. Accordingly, the light emitting element can be transferred with the resin member left on the sheet S3. Further, before being torn off, for example, the part of the sheet S3 on which the light emitting elements are mounted is rubbed with a spatula or the like from below so that it can be easily torn off.

Next, as shown in FIG. 4E, the first sealing member 212 is formed. Like the second sealing member, the first sealing member 212 can be formed by spray coating a liquid resin member, and in particular, can be formed by a pulse spray method in which spray is intermittently ejected. preferable. As the resin member, a resin material mixed with a wavelength conversion member, a diffusing material, or the like can be used.

The spraying port of the spray nozzle is arranged above the sheet S4 and the light emitting element, and the liquid resin member is sprayed from above the light emitting element. As shown in FIG. 4E, the first sealing member 212 formed by the spray method is formed on the first surface 11a and the side surface 11c of the laminated structure 11 of the light emitting element. Specifically, the first sealing member 212 is formed on the first surface 13a and the side surface 13c of the translucent substrate 13. The second sealing member 222 that covers the side surface 15c of the semiconductor layer 15 is not covered by the first sealing member 212 and is exposed. In addition, at the corner between the first surface 13a and the side surface 13c of the translucent substrate 13, the first sealing member 21 is formed in a rounded shape.

On the side surface 13c of the translucent substrate 13, as shown in FIG. 4D, the thickness of the first sealing member 212 becomes thinner toward the lower side. As shown in FIG. 4E, the second sealing member 222 becomes thicker toward the lower side. Therefore, the total film thickness of the first sealing member 212 and the second sealing member 222 in the overlapping portion is substantially equal to the film thickness of the second sealing member 222 that covers the side surface 15c of the semiconductor layer. be able to. As a result, it is possible to reduce uneven light distribution of the light emitting device.

The resin member is also sprayed between the light emitting elements and the light emitting elements, that is, the portion where the sheet S4 is exposed. The first sealing member 212 is formed by curing the applied resin member by heating. The resin member on the sheet S4 is also cured because it is cured while being placed on the sheet S4.

Finally, by removing the sheet S4, the light emitting device 2 shown in FIG. 3 can be obtained.

In the manufacturing method 1, since the electrodes are exposed after the second sealing member is formed, the number of transfers can be reduced.

(Manufacturing method 2)
The light emitting device 2 shown in FIG. 3 can also be obtained by the manufacturing method 2 shown in FIGS. 5(a) to 5(f). In the manufacturing method 1, after forming the second sealing member and exposing the electrode, the first sealing member is formed. On the other hand, in the manufacturing method 2, after the second sealing member is formed and then the first sealing member is formed, the electrodes are exposed. Hereinafter, differences from the manufacturing method 1 will be mainly described.

FIG. 5A is a step similar to FIG. 4A, showing a step of preparing the light emitting element 10 and placing the light emitting element 10 on the sheet S3 having the adhesive layer. The light emitting element 10 is placed with the first surface 11a of the laminated structure 11, that is, the first surface 13a side of the transparent substrate 13 facing the adhesive layer of the sheet S3.

FIG. 5B is a step similar to FIG. 4B, showing a step of forming the second sealing member 222. The second sealing member 222 is provided so as to cover the upper surface of the electrode 17.

Next, as shown in FIG. 5C, the light emitting element including the second sealing member 222 in which the electrode 17 is embedded is transferred from the sheet S3 to the sheet S5.

Next, as shown in FIG. 5D, the first sealing member 212 is formed.

Next, as shown in FIG. 5E, the light emitting device including the first sealing member 212 and the second sealing member 222 is transferred from the sheet S5 to the sheet S6.

Next, as shown in FIG. 5F, at least a part of the electrode 17 is exposed by removing a part of the second sealing member 222 by polishing or the like. Finally, by removing the sheet S6, the light emitting device 2 shown in FIG. 3 can be obtained.

In the manufacturing method 2, after forming the two sealing members, polishing is performed to expose the electrodes. Therefore, the second sealing member and the first sealing member can be temporarily cured only after they are formed, and after both are formed, they can be collectively cured.

The constituent members used in each embodiment will be described below.

(Light emitting element)
As the light emitting element, for example, a semiconductor light emitting element such as a light emitting diode can be used, and a light emitting element capable of emitting visible light such as blue, green, and red can be used. The semiconductor light emitting device includes a laminated structure including a light emitting layer and an electrode. The laminated structure includes a surface on which an electrode is formed (electrode formation surface) and a surface on the opposite side to a light extraction surface.

The laminated structure includes a semiconductor layer including a light emitting layer. Furthermore, a transparent substrate such as sapphire may be provided. An example of the semiconductor stacked body includes three semiconductor layers of a first conductive type semiconductor layer (for example, an n type semiconductor layer), a light emitting layer (active layer), and a second conductive type semiconductor layer (for example, a p type semiconductor layer). You can The semiconductor layer capable of emitting ultraviolet light or visible light of blue light to green light can be formed of a semiconductor material such as a III-V compound semiconductor. _{Specifically,} it is possible to use _{In X Al Y Ga 1-X} -Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) nitride-based semiconductor material or the like. As the semiconductor laminate capable of emitting red light, GaAs, GaAlAs, GaP, InGaAs, InGaAsP or the like can be used.

The light emitting element includes a pair of electrodes, and is disposed on the same surface side (electrode formation surface) on the laminated structure. The pair of electrodes may have a single-layer structure or a laminated structure as long as they are ohmic-connected to the laminated structure such that the current-voltage characteristics are linear or substantially linear. Such an electrode can be formed to have an arbitrary thickness using materials and configurations known in the art. For example, the thickness of the electrode is preferably a dozen μm to 300 μm. In addition, a good electric conductor can be used as the electrode, and a metal such as Cu is suitable.

(Sealing member)
The sealing member includes a first sealing member and a second sealing member, and covers the surface of the laminated structure of the light emitting element. The sealing member constitutes the outer surface of the light emitting element. The first sealing member is a member that covers the first surface of the laminated structure and is translucent. The second sealing member is a member that covers the second surface of the laminated structure and is translucent or light reflective.

The sealing member includes a translucent material. A translucent resin can be used as the translucent material. As the translucent resin, a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin or a phenol resin, a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin or a polynorbornene resin can be used. In particular, a silicone resin having excellent light resistance and heat resistance is suitable.

The sealing member may include a phosphor as a wavelength conversion member in addition to the above translucent material. A phosphor that can be excited by the light emitted from the light emitting element is used. For example, as a phosphor that can be excited by a blue light emitting element or an ultraviolet light emitting element, a cerium-activated yttrium-aluminum-garnet-based phosphor (YAG:Ce); a cerium-activated lutetium-aluminum-garnet-based phosphor (LAG: Ce); europium and / or activated nitrogen containing calcium aluminosilicate phosphor chromium _{(CaO-Al 2 O 3 -SiO} 2); europium-activated silicates based phosphor ((Sr, Ba) ₂ SiO ₄ ); β-sialon phosphor, nitride phosphor such as CASN phosphor, SCASN phosphor; KSF phosphor (K ₂ SiF ₆ :Mn); sulfide phosphor, quantum dot phosphor And so on. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, a light emitting device of various colors (for example, a white light emitting device) can be manufactured.
Further, the sealing member may contain various fillers for the purpose of adjusting viscosity and light scattering property.

The second sealing member may be light reflective. The light reflectivity means a resin material having a reflectance of 70% or more for light emitted from the light emitting element. As the light-reflecting sealing member, for example, a light-transmitting resin in which a light-reflecting substance is dispersed can be used. As the light-reflecting substance, for example, titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite and the like are suitable. The light-reflecting substance may be in the form of granules, fibers, thin plate pieces, or the like, and fibrous substances are particularly preferable because the effect of reducing the thermal expansion coefficient of the sealing member can be expected.

Although some embodiments according to the present invention have been exemplified above, it is needless to say that the present invention is not limited to the above-mentioned embodiments, and can be arbitrary without departing from the gist of the present invention. ..

1, 2... Light emitting device 10... Light emitting element 11... Laminated structure 11a... First surface of laminated structure 11b... Second surface of laminated structure 11c... Side surface of laminated structure 13... Translucent substrate 13a... Translucent First surface of transparent substrate 13c... Side surface of translucent substrate 15... Semiconductor layer 15b... Second surface of semiconductor layer 15c... Side surface of semiconductor layer 17... Electrode 20, 220... Sealing member 21, 221... First sealing Member 22, 222... Second sealing member

Claims (7)

A translucent substrate forming a first surface, a semiconductor layer forming a second surface opposite to the first surface, and a side surface of the translucent substrate between the first surface and the second surface. And a light-emitting element including a stacked structure including a side surface including a side surface of the semiconductor layer, and an electrode included in the second surface of the stacked structure,
A sealing member that covers the surface of the laminated structure so that at least a portion of the electrode is exposed,
A light emitting device comprising:
The sealing member covers a first surface and a side surface of the translucent substrate, a second surface and a side surface of the semiconductor layer, and a first sealing member that covers a side surface of the translucent substrate. A second sealing member that covers the first sealing member,
The light emitting device in which the first sealing member and the second sealing member do not overlap each other on a side surface of the semiconductor layer. The light emitting device according to claim 1, wherein the first sealing member has a film thickness that becomes thinner on a side surface of the laminated structure from the first surface side toward the second surface. The light emitting device according to claim 1, wherein the first sealing member has a rounded shape at a corner portion between the first surface and the side surface of the laminated structure. A translucent substrate forming a first surface, a semiconductor layer forming a second surface opposite to the first surface, and a side surface of the translucent substrate between the first surface and the second surface. And a step of preparing a light emitting device including a stacked structure including a side surface including a side surface of the semiconductor layer, and an electrode included in the second surface of the stacked structure,
Forming a first sealing member that covers the first surface and the side surface of the translucent substrate and does not cover the side surface of the semiconductor layer ;
Covering the second surface and the side surface of the semiconductor layer and the side surface of the transparent substrate with the first sealing member with a second sealing member;
A method for manufacturing a light-emitting device comprising: A translucent substrate forming a first surface, a semiconductor layer forming a second surface opposite to the first surface, and a side surface of the translucent substrate between the first surface and the second surface. And a step of preparing a light emitting device including: a stacked structure including a side surface including a side surface of the semiconductor layer; and an electrode included in the second surface of the stacked structure,
Covering the second surface and the side surface of the semiconductor layer and the side surface of the transparent substrate with a second sealing member;
The step of forming the first surface and the side surface of the translucent substrate, and the second to the sealing member covering the first sealing member does not cover the second sealing member covering the side surface of said semiconductor layer When,
A method for manufacturing a light emitting device comprising: The method for manufacturing a light emitting device according to claim 5, further comprising a step of exposing the electrode before the step of covering with the first sealing member. The method for manufacturing a light emitting device according to claim 5, further comprising a step of exposing the electrode after the step of covering with the first sealing member.

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