JP6724648B2 - Wiring board - Google Patents

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JP6724648B2
JP6724648B2 JP2016159487A JP2016159487A JP6724648B2 JP 6724648 B2 JP6724648 B2 JP 6724648B2 JP 2016159487 A JP2016159487 A JP 2016159487A JP 2016159487 A JP2016159487 A JP 2016159487A JP 6724648 B2 JP6724648 B2 JP 6724648B2
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layer
wiring
ground layer
opening
width
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茂夫 奈良
茂夫 奈良
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Fujifilm Business Innovation Corp
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Fuji Xerox Co Ltd
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Description

本発明は、配線基板に関する。 The present invention relates to a wiring board.

従来、高周波信号を伝送するパッド部及び線路部からなる配線において反射を抑制するようにした配線基板が提案されている（例えば、特許文献１参照）。 Conventionally, there has been proposed a wiring board that suppresses reflection in a wiring including a pad portion and a line portion that transmits a high-frequency signal (see, for example, Patent Document 1).

特許文献１に記載された配線基板は、パッド部及び線路部からなる複数の配線が第１層に形成され、パッド部の直下に開口部を有する第１のグランド層が第２層に形成され、開口部を有していない第２のグランド層が第３層に形成されたものである。 In the wiring board described in Patent Document 1, a plurality of wirings including a pad portion and a line portion are formed in a first layer, and a first ground layer having an opening immediately below the pad portion is formed in a second layer. The second ground layer having no opening is formed in the third layer.

特開平１−２１８０９４号公報JP-A 1-218094

本発明の目的は、開口部を有するグランド層よりも下層のグランド層が任意の形状の場合と比較して配線の特性インピーダンスのばらつきを抑制することができる配線基板を提供することにある。 An object of the present invention is to provide a wiring board capable of suppressing variations in the characteristic impedance of wirings as compared with the case where the ground layer below the ground layer having an opening has an arbitrary shape.

［１］基板の１つの層に形成され、パッド部とパッド部よりも幅の狭い配線部とを有する配線と、
前記１つの層に絶縁層を介して前記１つの層とは異なる他の層に形成され、平面視において前記パッド部に対応する領域に開口部を有する第１のグランド層と、
前記他の層に絶縁層を介して前記１つの層とは反対側の層に形成され、平面視において前記パッド部に対応する大きさを有する第２のグランド層と、
前記第１のグランド層と前記第２のグランド層とを接続する複数の接続導体と、
を備え、
前記第１のグランド層の前記開口部は、前記配線の前記配線部と反対側が開放され、
前記接続導体を６個とし、６個の接続導体は、前記開口部を挟んでそれぞれの側に３個を配置し、３個のうち中央の接続導体は、前記開口部の開放された側と反対側に寄せて設けられた、配線基板。
［２］前記配線は、一対の前記配線からなる差動配線である、前記［１］に記載の配線基板。
［３］前記第２のグランド層のサイズは、
前記第２のグランド層の幅をＷ３、配線方向の長さをＬ３、
前記開口部の幅をＷ２、前記配線方向の長さをＬ２、前記接続導体の直径をＤとするとき、（Ｗ２＋２Ｄ）＜Ｗ３＜（Ｗ２＋１０Ｄ）、及び（Ｌ２−２Ｄ）＜Ｌ３＜（Ｌ２＋５Ｄ）とする、
前記［１］又は［２］に記載の配線基板。 [1] Wiring formed on one layer of the substrate and having a pad portion and a wiring portion having a width narrower than the pad portion;
A first ground layer that is formed in another layer different from the one layer via an insulating layer in the one layer, and has an opening in a region corresponding to the pad section in plan view;
A second ground layer that is formed on a layer opposite to the one layer via an insulating layer in the other layer, and has a size corresponding to the pad portion in a plan view;
A plurality of connection conductors connecting the first ground layer and the second ground layer,
Equipped with
The opening of the first ground layer is opened on the opposite side of the wiring from the wiring section,
The number of the connection conductors is six, and three of the six connection conductors are arranged on each side of the opening, and the central connection conductor of the three is the same as the opening side of the opening. A wiring board placed close to the other side .
[2] The wiring board according to [1], wherein the wiring is a differential wiring including a pair of the wirings.
[ 3 ] The size of the second ground layer is
The width of the second ground layer is W 3 , the length in the wiring direction is L 3 ,
When the width of the opening is W 2 , the length in the wiring direction is L 2 , and the diameter of the connection conductor is D, (W 2 +2D)<W 3 <(W 2 +10D), and (L 2 − 2D)<L 3 <(L 2 +5D),
The wiring board according to [1] or [2] .

請求項１に係る発明によれば、開口部を有するグランド層よりも下層のグランド層が任意の形状の場合と比較して配線の特性インピーダンスのばらつきを抑制することができる。
請求項２に係る発明によれば、単線で信号を伝送する場合と比較してノイズの少ない信号を伝送することができる。
請求項３に係る発明によれば、不要なクロストークの発生や放射ノイズを抑制することができる。 According to the invention of claim 1, it is possible to suppress the variation in the characteristic impedance of the wiring as compared with the case where the ground layer below the ground layer having the opening has an arbitrary shape.
According to the invention of claim 2, a signal with less noise can be transmitted as compared with the case of transmitting a signal by a single line .
According to the invention of 請 Motomeko 3, it is possible to suppress the generation and radiation noise unwanted crosstalk.

図１は、本発明の実施の形態に係る配線基板の導体の部分を示す斜視図である。FIG. 1 is a perspective view showing a conductor portion of a wiring board according to an embodiment of the present invention. 図２は、図１に対する平面図である。FIG. 2 is a plan view of FIG. 図３は、配線基板の平面図である。FIG. 3 is a plan view of the wiring board. 図４は、図３におけるＡ−Ａ線断面図である。FIG. 4 is a cross-sectional view taken along the line AA in FIG. 図５は、図３におけるＢ−Ｂ線断面図である。FIG. 5 is a sectional view taken along line BB in FIG. 図６は、図３におけるＣ−Ｃ線断面図である。FIG. 6 is a sectional view taken along the line CC in FIG. 図７は、ビアと磁界強度との関係を示す棒グラフである。FIG. 7 is a bar graph showing the relationship between vias and magnetic field strength. 図８（ａ）〜（ｎ）は、図７のビアの位置を示す図である。8A to 8N are diagrams showing the positions of the vias in FIG. 7.

以下、本発明の実施の形態について図面を参照して説明する。なお、各図中、実質的に同一の機能を有する構成要素については、同一の符号を付してその重複した説明を省略する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each of the drawings, constituent elements having substantially the same function are designated by the same reference numerals, and a duplicate description thereof will be omitted.

図１は、本発明の実施の形態に係る配線基板の導体の部分を示す斜視図である。図２は、図１に対する平面図である。図２において、Ｘは配線方向、Ｙは幅方向とする。 FIG. 1 is a perspective view showing a conductor portion of a wiring board according to an embodiment of the present invention. FIG. 2 is a plan view of FIG. In FIG. 2, X is the wiring direction and Y is the width direction.

この配線基板１は、第１層１００ａに形成された一対の配線１０と、第２層１００ｂに形成された第１のグランド層２０と、第３層１００ｃに形成された第２のグランド層３０と、第１のグランド層２０と第２のグランド層３０とを接続する複数（本実施の形態では４つ）のビア４０とを備える。一対の配線１０は、差動配線であり、高周波信号（例えば、１〜１０ＧＨｚ）が送信される。第１層１００ａは、１つの層の一例である。第２層１００ｂは、１つの層とは異なる他の層の一例である。第３層１００ｃは、１つの層とは反対側の層の一例である。ビア４０は、接続導体の一例である。 This wiring board 1 includes a pair of wirings 10 formed on a first layer 100a, a first ground layer 20 formed on a second layer 100b, and a second ground layer 30 formed on a third layer 100c. And a plurality of (four in the present embodiment) vias 40 that connect the first ground layer 20 and the second ground layer 30. The pair of wirings 10 are differential wirings, and a high frequency signal (for example, 1 to 10 GHz) is transmitted. The first layer 100a is an example of one layer. The second layer 100b is an example of another layer different from one layer. The third layer 100c is an example of a layer opposite to one layer. The via 40 is an example of a connection conductor.

配線１０は、端子等が接続されるパッド部１０ａと、パッド部１０ａよりも幅の狭い配線部１０ｂとを備える。 The wiring 10 includes a pad portion 10a to which terminals and the like are connected, and a wiring portion 10b having a width smaller than that of the pad portion 10a.

第１のグランド層２０は、平面視において一対のパッド部１０ａに対応する領域に開口部２１が形成されている。第１のグランド層２０に開口部２１を形成することにより、パッド部１０ａと第２のグランド層３０との間の絶縁層１０１ａ〜１０１ｃが誘電体として機能してパッド部１０ａの特性インピーダンスが大きくなり、パッド部１０ａと配線部１０ｂとの特性インピーダンスの差を抑制することができる。開口部２１の配線方向Ｘの一方の側は開放されている。なお、開口部２１の配線方向Ｘの一方の側が開放されていなくてもよい。 The first ground layer 20 has an opening 21 formed in a region corresponding to the pair of pad portions 10a in a plan view. By forming the opening portion 21 in the first ground layer 20, the insulating layers 101a to 101c between the pad portion 10a and the second ground layer 30 function as a dielectric to increase the characteristic impedance of the pad portion 10a. Therefore, the difference in the characteristic impedance between the pad portion 10a and the wiring portion 10b can be suppressed. One side of the opening 21 in the wiring direction X is open. Note that one side of the opening 21 in the wiring direction X does not have to be open.

本実施の形態では、開口部２１の幅Ｗ２は、一対のパッド部１０ａの幅Ｗ１よりも大きく形成されている。開口部２１の長さＬ２はパッド部１０ａの長さＬ１よりも大きく形成されている。なお、開口部２１のサイズは、一対のパッド部１０ａよりも大きい方が好ましいが、特性インピーダンスに影響しない範囲で小さくしてもよい。 In the present embodiment, the width W 2 of the opening 21 is formed larger than the width W 1 of the pair of pad portions 10a. The length L 2 of the opening 21 is formed larger than the length L 1 of the pad portion 10a. The size of the opening 21 is preferably larger than that of the pair of pads 10a, but may be smaller within a range that does not affect the characteristic impedance.

第１のグランド層２０の幅Ｗ４は、第２のグランド層３０の幅Ｗ３よりも大きくしているが、ビア４０の領域を確保できるのなら、第２のグランド層３０の幅Ｗ３と等しくしてもよい。 The width W 4 of the first ground layer 20 is larger than the width W 3 of the second ground layer 30, but if the area of the via 40 can be secured, the width W 3 of the second ground layer 30 can be secured. May be equal to.

第２のグランド層３０は、平面視において第１のグランド層２０の開口部２１に対応する大きさを有する。 The second ground layer 30 has a size corresponding to the opening 21 of the first ground layer 20 in plan view.

第２のグランド層３０のサイズは、ビア４０の領域を確保するため、開口部２１よりも大きくしているが、特性インピーダンスのばらつきを抑制するため、できるだけ小さいのが好ましい。すなわち、第２のグランド層３０は、開口部２１の幅Ｗ２よりも大きい幅Ｗ３を有する。第２のグランド層３０のサイズは、第２のグランド層３０の幅をＷ３、配線方向Ｘの長さをＬ３、開口部２１の幅をＷ２、配線方向Ｘの長さをＬ２、ビア４０の直径をＤとするとき、（Ｗ２＋２Ｄ）＜Ｗ３＜（Ｗ２＋１０Ｄ）、及び（Ｌ２−２Ｄ）＜Ｌ３＜（Ｌ２＋５Ｄ）が好ましい。 The size of the second ground layer 30 is larger than that of the opening 21 in order to secure the area of the via 40, but it is preferable that the size of the second ground layer 30 be as small as possible in order to suppress variations in characteristic impedance. That is, the second ground layer 30 has a width W 3 larger than the width W 2 of the opening 21. Regarding the size of the second ground layer 30, the width of the second ground layer 30 is W 3 , the length in the wiring direction X is L 3 , the width of the opening 21 is W 2 , and the length in the wiring direction X is L 2. , (W 2 +2D)<W 3 <(W 2 +10D), and (L 2 −2D)<L 3 <(L 2 +5D), where D is the diameter of the via 40.

図３は、配線基板１の平面図、図４は、図３におけるＡ−Ａ線断面図、図５は、図３におけるＢ−Ｂ線断面図、図６は、図３におけるＣ−Ｃ線断面図である。 3 is a plan view of the wiring board 1, FIG. 4 is a sectional view taken along the line AA in FIG. 3, FIG. 5 is a sectional view taken along the line BB in FIG. 3, and FIG. 6 is a line taken along the line CC in FIG. FIG.

配線基板１は、図４から図６に示すように、第１乃至第３層１００ａ〜１００ｃを有し、第１乃至第３層１００ａ〜１００ｃの層間は、それぞれ絶縁層１０１ａ、１０１ｂが設けられている。絶縁層１０１ａ、１０１ｂは、例えばガラスエポキシ樹脂等の絶縁性材料から形成される。 As shown in FIGS. 4 to 6, the wiring board 1 has first to third layers 100a to 100c, and insulating layers 101a and 101b are provided between the first to third layers 100a to 100c, respectively. ing. The insulating layers 101a and 101b are formed of an insulating material such as glass epoxy resin.

（ビアと磁界強度との関係）
図７は、ビアと磁界強度との関係を示す棒グラフである。図７は、ビアの数及び位置を変えたときの磁界強度をシミュレーションした結果を示す。図８（ａ）〜（ｎ）は、図７のビアの数及び位置を示す図である。図７において、「１個中上」、「２個左」、「２個中」、「２個右」、「３個左上と右端」、「３個左端と右上」、「３個左上と中央」、「４個」、「４個左」、「４個右」、「６個」、「６個左半分」、「６個右中シフト」、「８個」は、それぞれ図８（ａ）〜（ｎ）に対応する。 (Relationship between via and magnetic field strength)
FIG. 7 is a bar graph showing the relationship between vias and magnetic field strength. FIG. 7 shows the result of simulating the magnetic field strength when the number and position of vias are changed. 8A to 8N are diagrams showing the number and positions of the vias in FIG. 7. In FIG. 7, "1 middle upper", "2 left", "2 middle", "2 right", "3 upper left and right edge", "3 left edge and upper right", "3 upper left""Center","4","4left","4right","6","6 left half", "6 right middle shift", "8" are respectively shown in FIG. It corresponds to a) to (n).

図７の磁界強度は、電流を配線１０に流したときに生じる第２のグラウンド層３０の磁界強度の最大値を示しており、磁界強度が小さい方が配線１０の配線方向Ｘにおける特性インピーダンスの変動が小さいことを意味している。 The magnetic field strength in FIG. 7 indicates the maximum value of the magnetic field strength of the second ground layer 30 generated when a current is passed through the wiring 10, and the smaller the magnetic field strength is, the more characteristic impedance of the wiring 10 in the wiring direction X is. It means that the fluctuation is small.

シミュレーションに使用したモデルは、以下のサイズとした。すなわち、配線１０については、一対のパッド部１０ａの幅Ｗ１を１．２ｍｍ、長さＬ１を２．０ｍｍ、配線部１０ｂの幅Ｗ０を０．１ｍｍ、一対の配線１０の間隔ｄを０．１ｍｍとした。第１のグランド層２０については、幅Ｗ４を２．０ｍｍ、開口部２１の幅Ｗ２を１．４ｍｍ、長さＬ２を２．１ｍｍとした。第２のグランド層３０については、幅Ｗ３を１．８ｍｍ、長さＬ３を２ｍｍとした。ビア直径Ｄを０．１ｍｍとした。配線１０と第１のグラウンド層２０との間の距離は、０．１１７ｍｍ、第１のグランド層２０と第２のグランド層３０との間の距離は、１．７ｍｍとした。 The model used for the simulation had the following sizes. That is, regarding the wiring 10, the width W 1 of the pair of pad portions 10 a is 1.2 mm, the length L 1 is 2.0 mm, the width W 0 of the wiring portion 10 b is 0.1 mm, and the distance d between the pair of wirings 10 is It was set to 0.1 mm. Regarding the first ground layer 20, the width W 4 was 2.0 mm, the width W 2 of the opening 21 was 1.4 mm, and the length L 2 was 2.1 mm. Regarding the second ground layer 30, the width W 3 was 1.8 mm and the length L 3 was 2 mm. The via diameter D was 0.1 mm. The distance between the wiring 10 and the first ground layer 20 was 0.117 mm, and the distance between the first ground layer 20 and the second ground layer 30 was 1.7 mm.

図７から分かるように、ビア４０が無かったものよりも「１個中上」以外は磁界強度が低下した。すなわち、２つ以上のビア４０で第１のグランド層２０と第２のグランド層３０とを接続することにより、磁界強度を低下させることができることが分かった。最も磁界強度が低いモデルは、図８（ｍ）に示す「６個右中シフト」であり、０．４４Ａ／ｍであった。すなわち、図８（ｍ）に示す場合は、開口部２１を挟んでそれぞれの側に３個のビア４０を配置し、３個のうち中央のビア４０は、開口部２１の開放された側と反対側に寄せて設けられている。なお、図８（ｎ）に示すビア４０を８個にしても６個よりも磁界強度は減らなかった。 As can be seen from FIG. 7, the magnetic field strength was reduced except for "one in the middle", compared with the case without the via 40. That is, it was found that the magnetic field strength can be reduced by connecting the first ground layer 20 and the second ground layer 30 with two or more vias 40. The model with the lowest magnetic field strength was "6 right middle shifts" shown in FIG. 8(m), which was 0.44 A/m. That is, in the case shown in FIG. 8M, three vias 40 are arranged on each side of the opening 21, and the central via 40 among the three vias is the same as the open side of the opening 21. It is located close to the other side. Even if eight vias 40 shown in FIG. 8(n) were used, the magnetic field strength was not reduced more than six.

なお、本発明の実施の形態は、上記実施の形態に限定されるものではなく、本発明の要旨を変更しない範囲内で種々に変形、実施が可能である。例えば、上記実施の形態では、３層構造の基板について説明したが、４層以上の基板について本発明は適用することができる。この場合、開口部２１を有する第１のグランド層２０を第３層以降にも形成し、第１のグランド層２０を形成した最下層の次に第２のグランド層３０を形成してもよい。このような構成においてもパッド部１０ａと配線部１０ｂとの特性インピーダンスの差を抑制することができる。 The embodiment of the present invention is not limited to the above embodiment, and various modifications and implementations can be made without departing from the spirit of the present invention. For example, although the substrate having a three-layer structure has been described in the above embodiment, the present invention can be applied to a substrate having four or more layers. In this case, the first ground layer 20 having the openings 21 may be formed in the third and subsequent layers, and the second ground layer 30 may be formed next to the lowermost layer in which the first ground layer 20 is formed. .. Even in such a configuration, the difference in characteristic impedance between the pad portion 10a and the wiring portion 10b can be suppressed.

１…配線基板、１０…配線、１０ａ…パッド部、１０ｂ…配線部、
２０…第１のグランド層、２１…開口部、３０…第２のグランド層、４０…ビア、
１００ａ…第１層、１００ｂ…第２層、１００ｃ…第３層、
１０１ａ、１０１ｂ…絶縁層 1... Wiring board, 10... Wiring, 10a... Pad part, 10b... Wiring part,
20... 1st ground layer, 21... Opening part, 30... 2nd ground layer, 40... Via,
100a... 1st layer, 100b... 2nd layer, 100c... 3rd layer,
101a, 101b... Insulating layer

Claims (3)

基板の１つの層に形成され、パッド部とパッド部よりも幅の狭い配線部とを有する配線と、
前記１つの層に絶縁層を介して前記１つの層とは異なる他の層に形成され、平面視において前記パッド部に対応する領域に開口部を有する第１のグランド層と、
前記他の層に絶縁層を介して前記１つの層とは反対側の層に形成され、平面視において前記パッド部に対応する大きさを有する第２のグランド層と、
前記第１のグランド層と前記第２のグランド層とを接続する複数の接続導体と、
を備え、
前記第１のグランド層の前記開口部は、前記配線の前記配線部と反対側が開放され、
前記接続導体を６個とし、６個の接続導体は、前記開口部を挟んでそれぞれの側に３個を配置し、３個のうち中央の接続導体は、前記開口部の開放された側と反対側に寄せて設けられた、
配線基板。 Wiring formed on one layer of the substrate and having a pad portion and a wiring portion having a width narrower than the pad portion;
A first ground layer that is formed in another layer different from the one layer via an insulating layer in the one layer, and has an opening in a region corresponding to the pad section in plan view;
A second ground layer that is formed on a layer opposite to the one layer via an insulating layer in the other layer, and has a size corresponding to the pad portion in a plan view;
A plurality of connection conductors connecting the first ground layer and the second ground layer,
Equipped with
The opening of the first ground layer is opened on the opposite side of the wiring from the wiring section,
The number of the connection conductors is six, and three of the six connection conductors are arranged on each side of the opening, and the central connection conductor of the three is the same as the opening side of the opening. It was placed close to the other side,
Wiring board. 前記配線は、一対の前記配線からなる差動配線である、
請求項１に記載の配線基板。 The wiring is a differential wiring composed of a pair of the wirings,
The wiring board according to claim 1. 前記第２のグランド層のサイズは、
前記第２のグランド層の幅をＷ３、配線方向の長さをＬ３、
前記開口部の幅をＷ２、前記配線方向の長さをＬ２、前記接続導体の直径をＤとするとき、（Ｗ２＋２Ｄ）＜Ｗ３＜（Ｗ２＋１０Ｄ）、及び（Ｌ２−２Ｄ）＜Ｌ３＜（Ｌ２＋５Ｄ）とする、
請求項１又は２に記載の配線基板。 The size of the second ground layer is
The width of the second ground layer is W 3 , the length in the wiring direction is L 3 ,
When the width of the opening is W 2 , the length in the wiring direction is L 2 , and the diameter of the connection conductor is D, (W 2 +2D)<W 3 <(W 2 +10D), and (L 2 − 2D)<L 3 <(L 2 +5D),
The circuit board according to claim 1 or 2.
JP2016159487A 2016-08-16 2016-08-16 Wiring board Expired - Fee Related JP6724648B2 (en)

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