JP6723659B2 - プラズマ処理方法及びプラズマ処理装置 - Google Patents
プラズマ処理方法及びプラズマ処理装置 Download PDFInfo
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- JP6723659B2 JP6723659B2 JP2017003024A JP2017003024A JP6723659B2 JP 6723659 B2 JP6723659 B2 JP 6723659B2 JP 2017003024 A JP2017003024 A JP 2017003024A JP 2017003024 A JP2017003024 A JP 2017003024A JP 6723659 B2 JP6723659 B2 JP 6723659B2
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- 238000012545 processing Methods 0.000 title claims description 158
- 238000003672 processing method Methods 0.000 title claims description 25
- 239000007789 gas Substances 0.000 claims description 209
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 143
- 229910052799 carbon Inorganic materials 0.000 claims description 143
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 138
- 229910052710 silicon Inorganic materials 0.000 claims description 138
- 239000010703 silicon Substances 0.000 claims description 138
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 41
- 239000001301 oxygen Substances 0.000 claims description 40
- 229910052760 oxygen Inorganic materials 0.000 claims description 40
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 27
- 229910052731 fluorine Inorganic materials 0.000 claims description 27
- 239000011737 fluorine Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 17
- 239000007795 chemical reaction product Substances 0.000 claims description 16
- 238000009832 plasma treatment Methods 0.000 claims description 6
- 229910003910 SiCl4 Inorganic materials 0.000 claims description 5
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 claims description 5
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 claims description 3
- 229910004014 SiF4 Inorganic materials 0.000 claims description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 3
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 claims description 3
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 claims description 2
- 239000010408 film Substances 0.000 description 273
- 239000002245 particle Substances 0.000 description 22
- 230000001681 protective effect Effects 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
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- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
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- H—ELECTRICITY
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
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Description
(処理条件)
処理圧力:6.67Pa(50mTorr)
第1の高周波電源からの高周波電力:500W
第2の高周波電源からの高周波電力:300W
フッ素含有ガス:CF4=600sccm
(処理条件)
処理圧力:2.67Pa(20mTorr)
第1の高周波電源からの高周波電力:600W
第2の高周波電源からの高周波電力:200W
酸素含有ガス:O2=500sccm
以上、本実施形態に係るプラズマ処理方法及びプラズマ処理装置について説明したが、実施形態はこれに限定されるものではない。以下では、他の実施形態について説明する。
2 載置台
2a 基材
2b 冷媒流路
2c 冷媒入口配管
2d 冷媒出口配管
3 絶縁板
3a 内壁部材
4 支持台
5 フォーカスリング
6 静電チャック
6a 電極
6b 絶縁体
10a 第1の高周波電源
10b 第2の高周波電源
15 処理ガス供給源
16 シャワーヘッド
16a 本体部
16b 上部天板
52 可変直流電源
60 制御部
61 プロセスコントローラ
62 ユーザインターフェース
63 記憶部
71 排気口
72 排気管
73 排気装置
Claims (11)
- 炭素含有ガスのプラズマにより、チャンバの内部の部材の表面に対して炭素含有膜を成膜する第1の成膜工程と、
シリコン含有ガスにより、前記炭素含有膜の表面に対して、膜厚が前記炭素含有膜の膜厚に応じて決定されるシリコン含有膜を成膜する第2の成膜工程と、
前記シリコン含有膜が成膜された後に、前記チャンバの内部に搬入された被処理体を処理ガスのプラズマによりプラズマ処理するプラズマ処理工程と、
プラズマ処理された前記被処理体が前記チャンバの外部に搬出された後に、フッ素含有ガスのプラズマにより、前記炭素含有膜の表面から前記シリコン含有膜を除去する第1の除去工程と、
酸素含有ガスのプラズマにより、前記部材の表面から前記炭素含有膜を除去する第2の除去工程と
を含むことを特徴とするプラズマ処理方法。 - 前記第2の成膜工程によって成膜される前記シリコン含有膜の膜厚は、前記炭素含有膜の膜厚が100nmよりも大きい場合に、前記炭素含有膜の膜厚の50%以上であり、前記炭素含有膜の膜厚が100nm以下である場合に、前記炭素含有膜の膜厚の20%以上であることを特徴とする請求項1に記載のプラズマ処理方法。
- 前記第2の成膜工程は、前記シリコン含有ガスに対する酸素含有ガスの流量比が2〜10である前記酸素含有ガスを添加し、添加された前記酸素含有ガス及び前記シリコン含有ガスのプラズマにより、前記炭素含有膜の表面に対して前記シリコン含有膜を成膜することを特徴とする請求項1又は2に記載のプラズマ処理方法。
- 前記第1の除去工程は、前記シリコン含有膜から発生する反応生成物の発光強度の変化のタイミングに応じて、前記シリコン含有膜の除去を終了することを特徴とする請求項1〜3のいずれか一つに記載のプラズマ処理方法。
- 前記プラズマ処理工程は、前記シリコン含有膜が成膜された後に、複数の前記被処理体が前記チャンバの内部に順次搬入される場合に、各前記被処理体が搬入される度に、各前記被処理体を前記処理ガスのプラズマによりプラズマ処理し、
前記第1の除去工程は、複数の前記被処理体のうち最後にプラズマ処理された被処理体が前記チャンバの外部に搬出された後に、前記フッ素含有ガスのプラズマにより、前記炭素含有膜の表面から前記シリコン含有膜を除去することを特徴とする請求項1〜4のいずれか一つに記載のプラズマ処理方法。 - 前記炭素含有ガスは、CxHyFz[式中、x、y及びzは整数を表し、(z−y)/xは2以下]で表されるガスを含むことを特徴とする請求項1〜5のいずれか一つに記載のプラズマ処理方法。
- 前記炭素含有ガスは、CH4、C4F8、CHF3、CH3F及びC2H4のうち少なくともいずれか一つを含むことを特徴とする請求項6に記載のプラズマ処理方法。
- 前記シリコン含有ガスは、SiCl4及びSiF4のうち少なくともいずれか一つを含むことを特徴とする請求項1〜7のいずれか一つに記載のプラズマ処理方法。
- 前記第2の成膜工程は、前記シリコン含有ガスのプラズマにより、前記炭素含有膜の表面に対して前記シリコン含有膜を成膜することを特徴とする請求項1〜8のいずれか一つに記載のプラズマ処理方法。
- 前記フッ素含有ガスは、CF4を含むことを特徴とする請求項1〜9のいずれか一つに記載のプラズマ処理方法。
- 被処理体をプラズマ処理するためのチャンバと、
前記チャンバの内部を減圧するための排気部と、
前記チャンバの内部に処理ガスを供給するためのガス供給部と、
炭素含有ガスのプラズマにより、前記チャンバの内部の部材の表面に対して炭素含有膜を成膜する成膜工程と、シリコン含有ガスにより、前記炭素含有膜の表面に対して、膜厚が前記炭素含有膜の膜厚に応じて決定されるシリコン含有膜を成膜する第2の成膜工程と、前記シリコン含有膜が成膜された後に、前記チャンバの内部に搬入された被処理体を処理ガスのプラズマによりプラズマ処理するプラズマ処理工程と、プラズマ処理された前記被処理体が前記チャンバの外部に搬出された後に、フッ素含有ガスのプラズマにより、前記炭素含有膜の表面から前記シリコン含有膜を除去する第1の除去工程と、酸素含有ガスのプラズマにより、前記部材の表面から前記炭素含有膜を除去する第2の除去工程とを実行する制御部と
を有することを特徴とするプラズマ処理装置。
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