JP6710461B2 - Transport tray and power supply device for transport tray - Google Patents
Transport tray and power supply device for transport tray Download PDFInfo
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- JP6710461B2 JP6710461B2 JP2016192873A JP2016192873A JP6710461B2 JP 6710461 B2 JP6710461 B2 JP 6710461B2 JP 2016192873 A JP2016192873 A JP 2016192873A JP 2016192873 A JP2016192873 A JP 2016192873A JP 6710461 B2 JP6710461 B2 JP 6710461B2
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Description
本発明は、デバイスチップ等の収容物を収容する搬送トレイ、及び該搬送トレイの給電装置に関する。 The present invention relates to a carrier tray that stores an object such as a device chip, and a power supply device for the carrier tray.
デバイスウェーハから切り出されて製造された個々のデバイスチップは、搬送のために搬送トレイに載せられる。例えば、特許文献１に開示されている搬送トレイには、個々のデバイスチップを収容する複数の凹部が形成されており、凹部のそれぞれにデバイスチップが収容される。 The individual device chips cut out from the device wafer and manufactured are placed on a transfer tray for transfer. For example, the carrying tray disclosed in Patent Document 1 is formed with a plurality of recesses for accommodating individual device chips, and the recesses each accommodate a device chip.
デバイスチップの搬送中に搬送トレイが振動等すると、デバイスチップが該凹部内で移動し、搬送トレイの凹部の側壁に衝突して、デバイスチップに欠け等の損傷が生じてしまう。そこで、例えば、搬送トレイのデバイスチップの支持部の上面近傍に粘着材を設ける。 If the transfer tray vibrates during the transfer of the device chip, the device chip moves in the recess and collides with the side wall of the recess of the transfer tray, resulting in damage such as chipping of the device chip. Therefore, for example, an adhesive material is provided near the upper surface of the support portion of the device chip of the transport tray.
そして、該粘着材の上にデバイスチップを載せて、粘着材の粘着力（タック力）によりデバイスチップを保持するようにする。すると、デバイスチップの移動が該粘着力により抑制される。特許文献２には、粘着力でデバイスチップを保持するトレイが開示されている。 Then, the device chip is placed on the adhesive material, and the device chip is held by the adhesive force (tack force) of the adhesive material. Then, the movement of the device chip is suppressed by the adhesive force. Patent Document 2 discloses a tray that holds a device chip with an adhesive force.
しかし、粘着材の粘着力が強いと、該デバイスチップを該粘着材から剥離して搬送トレイから取り出すときに、粘着材の一部がデバイスチップに付着したまま残留する恐れがある。 However, if the adhesive strength of the adhesive material is strong, when the device chip is peeled from the adhesive material and taken out from the transport tray, a part of the adhesive material may remain attached to the device chip.
デバイスチップに粘着材の一部が残留すると該付着物が汚染源となり、デバイスチップに問題を生じる場合がある。デバイスチップへの粘着材の付着及び残留を抑制するには粘着材の粘着力を弱めればよいが、これでは搬送中のデバイスチップの移動を十分に抑制できなくなる。 If a part of the adhesive material remains on the device chip, the attached matter may become a source of contamination, which may cause a problem on the device chip. The adhesion of the adhesive material to the device chip and the remaining thereof can be suppressed by weakening the adhesive force of the adhesive material, but this cannot sufficiently suppress the movement of the device chip during transportation.
本発明はかかる問題に鑑みてなされたものであり、その目的とするところは、保持したデバイスチップに汚染源を残留させることなく該デバイスチップを容易に取り出すことのできる搬送トレイを提供することである。また、この搬送トレイに用いられる給電装置を提供することである。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a carrier tray that can easily take out a device chip without leaving a contamination source on the held device chip. .. Moreover, it is providing the electric power feeder used for this conveyance tray.
本発明の一態様によれば、支持面となる上面を有するデバイスチップ支持部と、表面に複数の端子を有し該デバイスチップ支持部の外周を囲繞する枠部と、を備え、該デバイスチップ支持部は、ベースプレートと、該ベースプレートの上方に形成された複数の対の電極と、該ベースプレートと、該対の電極と、を上方から覆う絶縁層と、を有し、該デバイスチップ支持部は、所定の電位差を生じるように給電を受けた該対の電極から該デバイスチップ支持部の上方に生じる電界により、該支持面に載せられたデバイスチップに誘電分極を生じさせ、該デバイスチップを静電吸着する機能を有し、該デバイスチップ支持部は、該給電が停止されても該電界と、該誘電分極と、が消滅せず、該デバイスチップの静電吸着を継続できることを特徴とするデバイスチップの搬送トレイが提供される。 According to one aspect of the present invention, the device chip support portion has an upper surface serving as a support surface, and a frame portion having a plurality of terminals on the surface and surrounding the outer periphery of the device chip support portion, the device chip The support portion includes a base plate, a plurality of pairs of electrodes formed above the base plate, an insulating layer that covers the base plate and the pair of electrodes from above, and the device chip support portion includes , The electric field generated above the device chip supporting portion from the pair of electrodes supplied with power so as to generate a predetermined potential difference causes dielectric polarization in the device chip placed on the supporting surface, and the device chip is kept static. The device chip supporting portion has a function of electro-adsorption, and the electric field and the dielectric polarization do not disappear even when the power supply is stopped, and the device chip support can continue electrostatic adsorption of the device chip. A carrier tray for device chips is provided.
なお、本発明の一態様に係る搬送トレイにおいて、該複数の対の電極を構成する各電極は、それぞれ対応する端子に電気的に接続され、該複数の対の電極は、それぞれ対応する該端子を通してそれぞれ独立に給電または除電される機能を有してもよい。 Note that in the transport tray according to one embodiment of the present invention, each electrode forming the plurality of pairs of electrodes is electrically connected to a corresponding terminal, and the plurality of pairs of electrodes are respectively connected to the corresponding terminals. It may have a function of supplying or removing electricity independently through each.
さらに、本発明の他の一態様によると、該搬送トレイを給電または除電するための給電装置であって、該搬送トレイを支持する支持基台と、該支持基台に設けられ、該搬送トレイの該複数の端子のそれぞれと接触する機能を有する複数の給電部と、該複数の給電部に、給電用電源と、徐電用電源と、のいずれの電源を接続するかを選択する機能を有する電源選択部と、を有することを特徴とする給電装置が提供される。 Further, according to another aspect of the present invention, there is provided a power feeding device for feeding or discharging electricity to the carrying tray, the supporting base supporting the carrying tray, and the carrying tray provided on the supporting base. A plurality of power supply units having a function of making contact with each of the plurality of terminals, and a function of selecting which power supply to connect to the plurality of power supply units, a power supply power supply or a slow power supply. A power supply device having the power supply selecting unit is provided.
なお、本発明の他の一態様に係る給電装置は、該複数の対の電極のうち、いずれの対を給電または除電するか選択する機能を有する電極選択部をさらに有してもよい。 Note that a power supply device according to another aspect of the present invention may further include an electrode selection unit having a function of selecting which of the plurality of pairs of electrodes is to be fed or discharged.
本発明の一態様に係る搬送トレイは、対の電極を有する。該対の電極に所定の電位差を生じるように電源から給電すると、デバイスチップ支持部の上方に不平等電界が発生する。該不平等電界により、デバイスチップ支持部の支持面に載せられたデバイスチップの内部に誘電分極が誘起される。そして、該誘電分極と、該不平等電界と、の相互作用により、該デバイスチップと該対の電極との間に互いに引き合う力（グラジエント力）が生じて、デバイスチップ支持部はデバイスチップを静電吸着する。 A carrier tray according to one embodiment of the present invention has a pair of electrodes. When power is supplied from the power supply so that a predetermined potential difference is generated between the pair of electrodes, an unequal electric field is generated above the device chip support. The non-uniform electric field induces dielectric polarization inside the device chip placed on the supporting surface of the device chip supporting portion. Then, due to the interaction between the dielectric polarization and the unequal electric field, a force (gradient force) that attracts each other between the device chip and the pair of electrodes is generated, and the device chip supporting portion keeps the device chip stationary. Electro-adsorb.
なお、誘起された該誘電分極と、該対の電極と、の相互作用により電荷が保持されるため、該対の電極への給電が停止した後も、該グラジエント力は消滅せず、デバイスチップはデバイスチップ支持部の支持面上に静電吸着され続ける。 Since the electric charges are held by the interaction between the induced dielectric polarization and the electrodes of the pair, the gradient force does not disappear even after the power supply to the electrodes of the pair is stopped, and the device chip Continues to be electrostatically adsorbed on the support surface of the device chip support.
そして、搬送トレイがデバイスチップの搬送先に至り、搬送トレイからデバイスチップが取り出される際は、該対の電極を除電して電荷を取り除いて静電吸着を解除する。すると、汚染源を付着させることなくデバイスチップを容易に取り出すことができる。なお、該除電は、例えば、該対の電極を構成する各電極に対して、給電のときとは逆の極性の電荷を供給することで行われる。 Then, when the carrying tray reaches the carrying destination of the device chip and the device chip is taken out from the carrying tray, the pair of electrodes are destaticized to remove the electric charge and release the electrostatic adsorption. Then, the device chip can be easily taken out without attaching a contamination source. Note that the static elimination is performed, for example, by supplying each of the electrodes forming the pair of electrodes with a charge having a polarity opposite to that at the time of power feeding.
なお、該対の電極への給電または除電は、搬送トレイの枠部に設けられた複数の端子を通じて行われる。そして、該複数の端子と接触するように設けられた複数の給電部を有する給電装置を用いて、該給電装置に該搬送トレイを接続して給電または除電を行ってもよい。該給電装置を用いると、搬送トレイの対の電極への給電または除電を迅速かつ確実にすることができる。そして、このような給電装置もまた本発明の一態様である。 Note that power supply or charge removal to the pair of electrodes is performed through a plurality of terminals provided in the frame portion of the transport tray. Then, by using a power feeding device having a plurality of power feeding portions provided so as to be in contact with the plurality of terminals, the feeding tray may be connected to the power feeding device to perform power feeding or charge removal. By using the power supply device, it is possible to quickly and surely supply or remove electricity to the pair of electrodes of the carrying tray. Further, such a power feeding device is also one embodiment of the present invention.
本発明によると、保持したデバイスチップに汚染源を残留させることなく該デバイスチップを容易に取り出すことのできる搬送トレイが提供される。また、この搬送トレイに用いられる給電装置が提供される。 According to the present invention, there is provided a carrier tray which allows a device chip to be easily taken out without leaving a contamination source on the held device chip. Further, a power supply device used for this transport tray is provided.
本発明に係る実施形態について説明する。まず、本実施形態に係る搬送トレイについて図１（Ａ）及び図２を用いて説明する。図１（Ａ）は、本実施形態に係る搬送トレイを模式的に説明する斜視図である。図２は、該搬送トレイが給電装置（後述）に載置された状態を模式的に示す断面図である。 An embodiment according to the present invention will be described. First, the transport tray according to the present embodiment will be described with reference to FIGS. FIG. 1A is a perspective view schematically illustrating the transport tray according to this embodiment. FIG. 2 is a sectional view schematically showing a state in which the carrying tray is placed on a power supply device (described later).
図１（Ａ）及び図２に示すように、搬送トレイ１は、平板状のデバイスチップ支持部３と、凹状の枠部５と、を備える。デバイスチップ支持部３は、概ね平坦に形成された支持面３ａを有し、搬送トレイ１に収容される複数のデバイスチップ７をこの支持面３ａで支持する。枠部５は、デバイスチップ支持部３を囲むように収容し、デバイスチップ７の脱落、飛散当を防ぐ。また、枠部５の外表面（例えば、側面の一部及び下面の一部）には、端子９が設けられている。 As shown in FIGS. 1A and 2, the carrier tray 1 includes a flat device chip support portion 3 and a concave frame portion 5. The device chip support portion 3 has a support surface 3a that is formed to be substantially flat, and supports the plurality of device chips 7 accommodated in the transport tray 1 with this support surface 3a. The frame portion 5 is housed so as to surround the device chip support portion 3 and prevents the device chip 7 from falling off and scattering. Further, terminals 9 are provided on the outer surface of the frame portion 5 (for example, a part of the side surface and a part of the lower surface).
デバイスチップ支持部３は、図２に示す通り、ベースプレート１１と、該ベースプレート１１上の絶縁性層１３と、絶縁性層１３上の複数の電極１５と、絶縁性層１３及び複数の電極１５を覆う絶縁性層１７と、を備える。デバイスチップ支持部３の各構成要素を支えるベースプレート１１は、デバイスチップ７の支持に必要な剛性を持つ絶縁性材料でなり、例えば、ガラス、セラミックス、樹脂等からなる。ベースプレート１１の厚さは、例えば、２００μｍ〜５ｍｍである。 As shown in FIG. 2, the device chip support portion 3 includes a base plate 11, an insulating layer 13 on the base plate 11, a plurality of electrodes 15 on the insulating layer 13, an insulating layer 13 and a plurality of electrodes 15. And an insulating layer 17 for covering. The base plate 11 that supports each component of the device chip support portion 3 is made of an insulating material having a rigidity necessary to support the device chip 7, and is made of, for example, glass, ceramics, resin or the like. The thickness of the base plate 11 is, for example, 200 μm to 5 mm.
複数の電極１５を支える絶縁性層１３は、高電圧が印加される電極１５と電飾等の反応を生じず、電極１５と外部とを絶縁できる無機絶縁膜、樹脂等の絶縁性材料でなる。例えば、ベースプレート１１の上にＵＶ型クリアーインキを塗り、スキージを用いて広げるか、或いは、該インキをスピンコート法により塗布することで、絶縁性層１３を形成する。絶縁性層１３の厚さは、例えば、３０μｍ〜７０μｍである。なお、絶縁性層１３を省略し、ベースプレート１１に絶縁性層１３の機能を兼ねさせてもよい。 The insulating layer 13 that supports the plurality of electrodes 15 is made of an insulating material such as an inorganic insulating film or resin that does not react with the electrodes 15 to which a high voltage is applied, such as electrical decoration, and can insulate the electrodes 15 from the outside. .. For example, the insulating layer 13 is formed by applying a UV clear ink on the base plate 11 and spreading it with a squeegee, or by applying the ink by a spin coating method. The thickness of the insulating layer 13 is, for example, 30 μm to 70 μm. The insulating layer 13 may be omitted, and the base plate 11 may also function as the insulating layer 13.
複数の電極１５のうち、例えば、隣接する２つの電極１５（第１の電極及び第２の電極）によって対の電極が構成される。対の電極を構成する２つの電極１５は、それぞれ枠部５に設けられた配線１９等を介して端子９に接続されている。端子９及び配線１９を通して給電装置２（後述）から給電を受けると、該対の電極はデバイスチップ支持部３上に不平等電界を発生する。該不平等電界がデバイスチップ支持部３の上に載せられたデバイスチップ７に作用すると、デバイスチップ７に誘電分極を生じる。 Of the plurality of electrodes 15, for example, two adjacent electrodes 15 (first electrode and second electrode) form a pair of electrodes. The two electrodes 15 forming the pair of electrodes are connected to the terminal 9 via the wiring 19 and the like provided on the frame portion 5, respectively. When the power is supplied from the power supply device 2 (described later) through the terminal 9 and the wiring 19, the pair of electrodes generate an unequal electric field on the device chip supporting portion 3. When the non-uniform electric field acts on the device chip 7 placed on the device chip support 3, dielectric polarization occurs in the device chip 7.
そして、該誘電分極と、該不平等電界と、の相互作用により、該デバイスチップ７と該対の電極との間に互いに引き合う力（グラジエント力）が生じて、デバイスチップ支持部３はデバイスチップ７を静電吸着する。 Then, due to the interaction between the dielectric polarization and the unequal electric field, a force (gradient force) that attracts each other between the device chip 7 and the pair of electrodes is generated, and the device chip supporting portion 3 becomes the device chip. 7 is electrostatically adsorbed.
電極１５は、銅、銀、アルミニウム等の導電性材料でなる。金属ペーストの塗布や、蒸着等により絶縁性層１３の上面に該材料でなる導電膜を設けられた後、第１の電極と、第２の電極と、を有する対の電極を形成するように、フォトリソグラフィー法等により所定の形状にパターニングすることで、電極１５が形成される。なお、該パターニングは、レーザー加工装置を用いたアブレーション加工により実施されてもよい。電極１５の厚さは、例えば、８μｍ〜１２μｍである。 The electrode 15 is made of a conductive material such as copper, silver or aluminum. After a conductive film made of the material is provided on the upper surface of the insulating layer 13 by applying a metal paste or vapor deposition, a pair of electrodes including a first electrode and a second electrode is formed. The electrode 15 is formed by patterning into a predetermined shape by a photolithography method or the like. The patterning may be performed by ablation processing using a laser processing device. The thickness of the electrode 15 is, for example, 8 μm to 12 μm.
該対の電極は、搬送トレイ１が収容するデバイスチップ７の数だけ形成される。複数の対の電極は、それぞれ独立に給電または除電がされ、各対の電極毎にデバイスチップ７の静電吸着とその解除が制御される。ただし、形成される対の電極はデバイスチップ７の数よりも少なくてもよい。例えば、対の電極を一つにする場合には、デバイスチップ支持部３の支持面３ａ全体の静電吸着とその解除がまとめて制御される。 The electrodes of the pair are formed by the number of device chips 7 accommodated in the carrier tray 1. The electrodes of a plurality of pairs are independently supplied with electricity or discharged, and the electrostatic attraction of the device chip 7 and its release are controlled for each pair of electrodes. However, the number of pairs of electrodes formed may be smaller than the number of device chips 7. For example, when the pair of electrodes is one, electrostatic attraction and release of the entire supporting surface 3a of the device chip supporting portion 3 are collectively controlled.
なお、対の電極によりグラジエント力を生じさせるとき、第１の電極と、第２の電極と、の電位差は１０００Ｖ〜２０００Ｖとされる。また、該対の電極を構成する第１の電極と、第２の電極と、はそれぞれ５０〜１０００μｍの幅で形成され、第１の電極と、第２の電極と、の間隔は５０〜１０００μｍとされる。パターニングされて形成される電極１５の形状の詳細については後述する。 Note that when a gradient force is generated by the pair of electrodes, the potential difference between the first electrode and the second electrode is 1000V to 2000V. Further, the first electrode and the second electrode forming the pair of electrodes are each formed with a width of 50 to 1000 μm, and the distance between the first electrode and the second electrode is 50 to 1000 μm. It is said that. Details of the shape of the electrode 15 formed by patterning will be described later.
電極１５と、絶縁性層１３と、ベースプレート１１と、を覆う絶縁性層１７は、その上面がデバイスチップ支持部３の支持面３ａとなり、支持面３ａ上にデバイスチップ７が載置される。絶縁性層１７は電極１５等を覆いデバイスチップ支持部３の各構成要素を保護する機能を有し、さらに、高電圧が印加される電極１５からの漏電を防止する機能を有する。 The upper surface of the insulating layer 17 covering the electrode 15, the insulating layer 13, and the base plate 11 serves as the supporting surface 3a of the device chip supporting portion 3, and the device chip 7 is mounted on the supporting surface 3a. The insulating layer 17 has a function of covering the electrodes 15 and the like and protecting each component of the device chip support portion 3, and further has a function of preventing electric leakage from the electrodes 15 to which a high voltage is applied.
絶縁性層１７は、電極１５による凹凸形状を隙間なく覆う一方で、支持面３ａが平坦となるように形成される。絶縁性層１７は、樹脂層、無機絶縁膜等でなり、例えば、ＵＶ型クリアーインキを用いて形成される。絶縁性層１７は、絶縁性層１３と同様の方法で形成される。または、電極１５と、絶縁性層１３と、ベースプレート１１と、の上にＣＶＤ法等により絶縁膜を成膜して、その上面を研磨等して平坦化して形成してもよい。なお、絶縁性層１７の厚さは、例えば、３０μｍ〜７０μｍである。 The insulating layer 17 is formed such that the uneven surface formed by the electrodes 15 is covered without any gap and the supporting surface 3a is flat. The insulating layer 17 is made of a resin layer, an inorganic insulating film, or the like, and is formed by using, for example, UV clear ink. The insulating layer 17 is formed by the same method as the insulating layer 13. Alternatively, an insulating film may be formed on the electrode 15, the insulating layer 13, and the base plate 11 by a CVD method or the like, and the upper surface thereof may be polished to be flattened. The insulating layer 17 has a thickness of, for example, 30 μm to 70 μm.
上述のように、枠部５は、例えば、凹部を有する形状に構成されており、デバイスチップ支持部３を囲み、デバイスチップ支持部３の各構成要素を該凹部に収納する。枠部５は、搬送トレイ１の外装となり、搬送トレイ１が給電装置２（後述）に載せられるとき給電装置２と接触する。そのため、例えば、摩擦に強い樹脂材料等で形成される。 As described above, the frame portion 5 is configured to have, for example, a concave portion, surrounds the device chip supporting portion 3, and houses each component of the device chip supporting portion 3 in the concave portion. The frame portion 5 serves as an exterior of the transport tray 1 and contacts the power feeding device 2 when the transport tray 1 is placed on the power feeding device 2 (described later). Therefore, for example, it is formed of a resin material that is resistant to friction.
枠部５の表面には、端子９を有する。端子９は、銅等の導電性材料でなり、搬送トレイ１が給電装置２（後述）に載せられると給電装置２の給電部６に接触する。端子９は、枠部５を貫く配線１９を通じて電極１５と電気的に接続される。配線１９は、導電性材料でなり、端子９と電極１５とを電気的に接続する経路となる。 The surface of the frame portion 5 has terminals 9. The terminal 9 is made of a conductive material such as copper, and comes into contact with the power feeding section 6 of the power feeding device 2 when the transport tray 1 is placed on the power feeding device 2 (described later). The terminal 9 is electrically connected to the electrode 15 through the wiring 19 that penetrates the frame portion 5. The wiring 19 is made of a conductive material and serves as a path for electrically connecting the terminal 9 and the electrode 15.
以上により、支持面３ａとなる上面を有するデバイスチップ支持部３と、表面に複数の端子９を有し、該デバイスチップ支持部３の外周を囲繞する枠部５と、を備える搬送トレイ１が構成される。 As described above, the carrier tray 1 including the device chip support portion 3 having the upper surface serving as the support surface 3a and the frame portion 5 having a plurality of terminals 9 on the surface and surrounding the outer periphery of the device chip support portion 3 is provided. Composed.
次に、本実施形態に係るに給電装置について図１（Ｂ）及び図２を用いて説明する。図１（Ｂ）は、本実施形態に係る給電装置２を説明するための模式的な斜視図である。図２は、該搬送トレイ１と、給電装置２と、を模式的に示す断面図である。 Next, the power supply device according to the present embodiment will be described with reference to FIGS. FIG. 1B is a schematic perspective view for explaining the power feeding device 2 according to the present embodiment. FIG. 2 is a cross-sectional view schematically showing the carrying tray 1 and the power feeding device 2.
図１（Ｂ）に示すように、給電装置２は、支持基台４と、給電部６と、突き当て部８と、スイッチ１０と、を備える。給電装置２の支持基台４は、外部の給電用電源１６と、除電用電源１８と、に接続されている。給電装置２は、突き当て部８により所定の位置に載置された搬送トレイ１に対して、給電部６を通して該給電用電源１６または除電用電源１８を接続する。すると、給電装置２は、搬送トレイ１を給電または除電できる。 As shown in FIG. 1B, the power feeding device 2 includes a support base 4, a power feeding unit 6, an abutting unit 8, and a switch 10. The support base 4 of the power supply device 2 is connected to an external power supply 16 for power supply and a power supply 18 for static elimination. The power feeding device 2 connects the feeding power source 16 or the static elimination power source 18 to the transport tray 1 placed at a predetermined position by the abutting portion 8 through the power feeding portion 6. Then, the power supply device 2 can supply or remove electricity to the transport tray 1.
給電装置２は、搬送トレイ１にデバイスチップ７を収容する作業をする場所、及び搬送トレイ１からデバイスチップ７を搬出する作業をする場所に配置される。収容または搬出時には、搬送トレイ１は給電装置２の支持基台４上に載せ置かれ、給電装置２は搬送トレイ１に対して、給電または除電を実施する。 The power feeding device 2 is arranged in a place where the device chips 7 are stored in the carrying tray 1 and a place where the device chips 7 are carried out from the carrying tray 1. At the time of accommodation or unloading, the transport tray 1 is placed on the support base 4 of the power feeding device 2, and the power feeding device 2 performs power feeding or static elimination on the transport tray 1.
該給電または除電のために、搬送トレイ１は、搬送トレイ１の端子９が給電装置２の給電部６と接触するように支持基台４上に載せ置かれる。支持基台４上の突き当て部８は、該端子９と該給電部６とが正しく接触する所定の位置に搬送トレイ１が置かれるように配置される。該突き当て部８に搬送トレイ１を突き当てながら支持基台４上に載せ置くと、該所定の位置に搬送トレイ１を位置付けられる。 In order to supply or remove the electricity, the carrier tray 1 is placed on the support base 4 so that the terminals 9 of the carrier tray 1 come into contact with the power supply unit 6 of the power supply device 2. The abutting portion 8 on the support base 4 is arranged so that the transport tray 1 is placed at a predetermined position where the terminal 9 and the power feeding portion 6 are in proper contact with each other. When the carrying tray 1 is placed on the support base 4 while being abutted against the abutting portion 8, the carrying tray 1 can be positioned at the predetermined position.
給電部６は、例えば、銅等の導電材料でなり、支持基台４または突き当て部８の表面に設けられ、支持基台４の所定の位置に載せ置かれた搬送トレイ１の端子９と接触し、搬送トレイ１の給電及び除電を実施する機能を有する。給電部６は、給電装置２の内部の配線１４を通じて、給電用電源または除電用電源に接続されている。 The power supply unit 6 is made of a conductive material such as copper, is provided on the surface of the support base 4 or the abutting unit 8, and is connected to the terminals 9 of the transport tray 1 placed at a predetermined position of the support base 4. It has a function of contacting and carrying out power supply and charge removal of the transport tray 1. The power supply unit 6 is connected to a power supply power supply or a charge removal power supply through a wiring 14 inside the power supply device 2.
給電部６は複数設けられ、複数の給電部６の一つは、搬送トレイ１の対の電極の一方の電極に電気的に接続され、別の一つは、搬送トレイ１の対の電極の他方の電極に電気的に接続される。給電装置２は、搬送トレイ１の給電時には、給電用電源１６により該対の電極の一方の電極と、他方の電極と、の間に所定の電位差（例えば１０００Ｖ〜２０００Ｖ）を生じるように対の電極に給電を行う。すると、対の電極はデバイスチップ支持部３の上方に不平等電界を生じる。 A plurality of power supply units 6 are provided, one of the plurality of power supply units 6 is electrically connected to one electrode of the pair of electrodes of the transport tray 1, and the other one is one of the pair of electrodes of the transport tray 1. It is electrically connected to the other electrode. The power feeding device 2 is configured to generate a predetermined potential difference (for example, 1000 V to 2000 V) between one electrode and the other electrode of the pair of electrodes by the power source 16 for power feeding when feeding the transport tray 1. Power is supplied to the electrodes. Then, the pair of electrodes generate an unequal electric field above the device chip supporting portion 3.
該不平等電界を生じる対の電極の上方に載せ置かれたデバイスチップ７の内部には、該不平等電界により誘電分極が誘起され、グラジエント力によりデバイスチップ７はデバイスチップ支持部３に静電吸着される。給電装置２から搬送トレイ１が離間され、給電部６から給電されなくなった後、デバイスチップ７の誘電分極により該対の電極の両電極間の電位差は保持され、対の電極の電荷は維持される。該電荷は、給電装置２により除電されるまでの間は維持され続ける。 Inside the device chip 7 placed above the pair of electrodes that generate the non-uniform electric field, dielectric polarization is induced by the non-uniform electric field, and the device chip 7 is electrostatically attached to the device chip support portion 3 by the gradient force. Adsorbed. After the carrier tray 1 is separated from the power feeding device 2 and power is not fed from the power feeding unit 6, the potential difference between the electrodes of the pair of electrodes is held by the dielectric polarization of the device chip 7, and the charge of the pair of electrodes is maintained. It The charge continues to be maintained until it is removed by the power supply device 2.
そのため、デバイスチップ７は引き続きグラジエント力によりデバイスチップ支持部３に静電吸着されたままとなる。したがって、搬送の間に搬送トレイ１が振動等しても、デバイスチップ７は吸着保持され動かない。 Therefore, the device chip 7 continues to be electrostatically attracted to the device chip support portion 3 by the gradient force. Therefore, even if the transport tray 1 vibrates during transport, the device chip 7 is held by suction and does not move.
給電装置２は、搬送トレイ１の除電時には、除電用電源１８により該対の電極の一方の電極と、他方の電極と、の電荷を取り除くように除電を行う。なお、除電用電源１８は、給電のときとは逆の極性となるように該対の電極の２つの電極に対して電荷を供給しようとする電源である。すると、対の電極が生じさせていたデバイスチップ支持部３上方の不平等電界は消滅し、デバイスチップ７の分極は解消される。そのため、デバイスチップ７の静電吸着が解かれデバイスチップ７は容易に取り出されるようになる。 When the carrier tray 1 is neutralized, the power feeding device 2 performs neutralization by the neutralizing power source 18 so as to remove charges from one electrode of the pair of electrodes and the other electrode. The power source 18 for static elimination is a power source that supplies electric charges to the two electrodes of the pair of electrodes so as to have a polarity opposite to that at the time of power feeding. Then, the unequal electric field above the device chip supporting portion 3 generated by the pair of electrodes disappears, and the polarization of the device chip 7 is eliminated. Therefore, the electrostatic attraction of the device chip 7 is released and the device chip 7 can be easily taken out.
スイッチ１０は、給電部６と、給電用電源１６または除電用電源１８と、を電気的に接続する配線１４に設けられ、いずれの電源を給電部６に接続するかを選択する電源選択部として機能する。スイッチ１０は、搬送トレイ１の給電時には、給電用電源１６と給電部６とを接続し、搬送トレイ１の除電時には、除電用電源１８と給電部６とを接続する。すなわち、搬送トレイ１を用いてデバイスチップ７を搬送しようとする者は、スイッチ１０を操作してデバイスチップ７の静電吸着と、静電吸着の解消とを実施できる。 The switch 10 is provided on the wiring 14 that electrically connects the power supply unit 6 and the power supply power supply 16 or the static elimination power supply 18, and serves as a power supply selection unit that selects which power supply is connected to the power supply unit 6. Function. The switch 10 connects the power supply power supply 16 and the power supply unit 6 when the carrier tray 1 is powered, and connects the charge removal power supply 18 and the power supply unit 6 when the carrier tray 1 is discharged. That is, a person who intends to carry the device chip 7 using the carrying tray 1 can operate the switch 10 to perform electrostatic attraction of the device chip 7 and elimination of electrostatic attraction.
次に、搬送トレイ１の電極１５の形状について、図３を用いて説明する。電極１５は、第１の電極１５ａと、該第１の電極１５ａから分離された第２の電極１５ｂとを、構成するように金属膜がパターニングされて形成される。第１の電極１５ａと、第２の電極１５ｂと、は対の電極１５ｃを構成し、対の電極１５ｃが給電され両者の間に所定の電位差を生じると、デバイスチップ支持部３の上方に不平等電界を生じる。 Next, the shape of the electrode 15 of the transport tray 1 will be described with reference to FIG. The electrode 15 is formed by patterning a metal film so as to form the first electrode 15a and the second electrode 15b separated from the first electrode 15a. The first electrode 15a and the second electrode 15b form a pair of electrodes 15c. When the pair of electrodes 15c are supplied with electric power and a predetermined potential difference is generated between the electrodes, the electrodes 15c and 15c are not located above the device chip support portion 3. Produces an equal electric field.
図３（Ａ）は、電極１５の形状の一例を模式的に示す上面図である。本例では、図３（Ａ）に示す通り、第１の電極１５ａと、第２の電極１５ｂと、はそれぞれ櫛歯状に形成される。櫛歯状の第１の電極１５ａと、第２の電極１５ｂと、はそれぞれ、互いに平行に並ぶ複数の櫛歯（枝部）と、該複数の櫛歯（枝部）に接続され各櫛歯に電荷を供給する経路となる幹部と、を有する。なお、図３（Ａ）においては、説明の便宜上、第１の電極１５ａと第２の電極１５ｂとを異なる色で着色して表示している。 FIG. 3A is a top view schematically showing an example of the shape of the electrode 15. In this example, as shown in FIG. 3A, the first electrode 15a and the second electrode 15b are each formed in a comb shape. The comb-shaped first electrode 15a and the second electrode 15b are respectively provided with a plurality of comb teeth (branches) arranged in parallel with each other, and the comb teeth connected to the plurality of comb teeth (branches). And a trunk serving as a path for supplying electric charge to the. Note that in FIG. 3A, for convenience of description, the first electrode 15a and the second electrode 15b are displayed in different colors.
第１の電極１５ａの複数の櫛歯の一つは、第２の電極１５ｂの複数の櫛歯のうち隣接する２つの櫛歯の間に配置され、該２つ櫛歯との間に所定の電位差を生じると不平等電界を生じる。 One of the plurality of comb teeth of the first electrode 15a is arranged between two adjacent comb teeth of the plurality of comb teeth of the second electrode 15b, and a predetermined distance is provided between the two comb teeth. When a potential difference is produced, an unequal electric field is produced.
第１の電極１５ａの各櫛歯、及び第２の電極１５ｂの各櫛歯の幅は、それぞれ一定ではなく、各櫛刃は、太部と細部とが長手方向に交互に繰り返された形状を有する。そして、第１の電極１５ａの櫛歯の太部は、第２の電極１５ｂの隣接する２つの櫛歯の細部の間に配される。第２の電極１５ｂの櫛歯の太部は、同様に、第１の電極１５ａの隣接する２つの櫛歯の細部の間に配される。 The width of each comb tooth of the first electrode 15a and the comb tooth of the second electrode 15b is not constant, and each comb blade has a shape in which thick portions and details are alternately repeated in the longitudinal direction. Have. The thick part of the comb teeth of the first electrode 15a is arranged between the details of the two adjacent comb teeth of the second electrode 15b. The thick part of the comb teeth of the second electrode 15b is likewise arranged between the details of the two adjacent comb teeth of the first electrode 15a.
第１の電極１５ａ及び第２の電極１５ｂの櫛歯をそれぞれこのような形状で形成すると、櫛歯の幅が変化する部分に電界が集中して、不平等電界がより強くなるため、グラジエント力が増大し、支持面３ａと、デバイスチップ７と、の間の静電吸着がより強力となる。ただし、第１の電極１５ａ及び第２の電極１５ｂの輪郭に角を有するとスパークする可能性があるため、該輪郭は曲線形状であることが好ましい。 When the comb teeth of the first electrode 15a and the second electrode 15b are formed in such a shape, the electric field is concentrated on the portion where the width of the comb teeth changes, and the unequal electric field becomes stronger, so that the gradient force is increased. Is increased, and electrostatic attraction between the support surface 3a and the device chip 7 becomes stronger. However, it is preferable that the contours of the first electrode 15a and the second electrode 15b have a curved shape because sparks may occur when the contours have corners.
ただし、本実施形態はこれに限定されず、第１の電極１５ａ及び第２の電極１５ｂの幅は一定でもよく、それぞれの電極の輪郭が直線状でもよい。 However, the present embodiment is not limited to this, and the widths of the first electrode 15a and the second electrode 15b may be constant, and the contours of the respective electrodes may be linear.
図３（Ｂ）は、電極１５の形状を模式的に示す上面図であり、複数の対の電極１５ｃの配置の例を示す。搬送トレイ１には、収容するデバイスチップ７の数と同数の対の電極１５ｃが備えられており、それぞれのデバイスチップ７に個別に不平等電界を作用させるように対の電極１５ｃが配される。 FIG. 3B is a top view schematically showing the shape of the electrode 15, and shows an example of the arrangement of a plurality of pairs of electrodes 15c. The carrier tray 1 is provided with the same number of pairs of electrodes 15c as the number of device chips 7 accommodated therein, and the pair of electrodes 15c is arranged so as to individually apply an unequal electric field to each device chip 7. ..
このように、搬送トレイ１に複数の対の電極１５ｃが配されると、静電吸着されるデバイスチップ７毎に給電及び除電が制御され、静電吸着と該静電吸着の解除とが切り替えられる。なお、各デバイスチップ７について静電吸着と該静電吸着の解除とを個別に切り替えるためには、それぞれの対の電極１５ｃは独立に給電及び除電が制御されなければならない。したがって、複数の対の電極１５ｃを構成するすべての電極のそれぞれが、異なる端子９に接続される。 In this way, when a plurality of pairs of electrodes 15c are arranged on the transport tray 1, power supply and charge removal are controlled for each device chip 7 that is electrostatically adsorbed, and electrostatic adsorption and release of the electrostatic adsorption are switched. Be done. In order to individually switch between electrostatic attraction and cancellation of electrostatic attraction for each device chip 7, the pair of electrodes 15c must be independently controlled for power supply and charge removal. Therefore, all of the electrodes forming the plurality of pairs of electrodes 15c are connected to different terminals 9.
図３（Ｃ）は、電極１５の形状の別の一例を示す正面図である。図３（Ｃ）に示す通り、複数のドット状の電極１５ｄがそれぞれ電気的に絶縁されて配置される。それぞれのドット状の電極１５ｄはそれぞれ異なる端子９に接続され、電荷の出入りが個別に制御される。そして、隣接する２つのドット状の電極１５ｄの間に所定の電位差を生じるように電荷を制御すると、該２つのドット状の電極１５ｄ間に不平等電界を発生させることができる。 FIG. 3C is a front view showing another example of the shape of the electrode 15. As shown in FIG. 3C, a plurality of dot-shaped electrodes 15d are arranged so as to be electrically insulated from each other. The respective dot-shaped electrodes 15d are connected to different terminals 9, respectively, and the entrance and exit of charges are individually controlled. Then, by controlling the charges so as to generate a predetermined potential difference between the two adjacent dot-shaped electrodes 15d, an unequal electric field can be generated between the two dot-shaped electrodes 15d.
すると、デバイスチップ支持部３の支持面３ａ上の任意の領域に不平等電界を形成できるため、搬送トレイ１は、支持面３ａの任意の位置に置かれたデバイスチップ７を静電吸着できる。 Then, an unequal electric field can be formed in an arbitrary region on the supporting surface 3a of the device chip supporting portion 3, so that the carrier tray 1 can electrostatically adsorb the device chip 7 placed at an arbitrary position on the supporting surface 3a.
図３（Ｂ）及び図３（Ｃ）に例示する通り、搬送トレイ１は、２を超える数の端子９を要し、給電装置２も、２を超える数の給電部６を要する場合がある。そのような場合の搬送トレイ１及び給電装置２の一例を図４に示す。 As illustrated in FIGS. 3B and 3C, the transport tray 1 may require more than two terminals 9, and the power feeding device 2 may also require more than two power feeding units 6. .. FIG. 4 shows an example of the transport tray 1 and the power feeding device 2 in such a case.
図４に示される通り、搬送トレイ１は、９個のデバイスチップ７を静電吸着できる搬送トレイ１であり、該９個のデバイスチップ７のそれぞれに対して個別に静電吸着とその解除とを切り替えられるように構成される。搬送トレイ１は、９個の対の電極（不図示）を有し、枠部５の外表面には、該９個の対の電極のそれぞれの電極に電気的に接続される総計１８個の端子を有する（搬送トレイ１裏側の９個の端子９は不図示）。９個の対の電極は、それぞれ対応する端子９を通してそれぞれ独立に給電または除電される。 As shown in FIG. 4, the carrier tray 1 is a carrier tray 1 capable of electrostatically attracting nine device chips 7, and electrostatic attraction and release of the device tray 7 are individually performed on each of the nine device chips 7. It is configured to be able to switch. The carrier tray 1 has nine pairs of electrodes (not shown), and the outer surface of the frame portion 5 has a total of 18 electrodes electrically connected to each of the nine pairs of electrodes. It has terminals (the nine terminals 9 on the back side of the carrying tray 1 are not shown). The 9 pairs of electrodes are independently fed or discharged through the corresponding terminals 9.
一方、給電装置２は、該１８個の端子９とそれぞれ接触する１８個の給電部６を有する。また、給電装置２は、搬送トレイ１の該９個の対の電極を個別に制御するためのスイッチ１２を有する。該スイッチ１２は、該９個の対の電極のうち、いずれの対を給電または除電するか選択する電極選択部として機能する。 On the other hand, the power supply device 2 has 18 power supply units 6 that are in contact with the 18 terminals 9. Further, the power feeding device 2 has a switch 12 for individually controlling the nine pairs of electrodes of the carrying tray 1. The switch 12 functions as an electrode selection unit that selects which of the nine pairs of electrodes is to be fed or discharged.
なお、対の電極、端子９、給電部６、及びスイッチ１２等の数量、配置等の条件は、収容されるデバイスチップ７の数、搬送トレイ１の用途等によって決まるものであり、本実施形態の記載に限定されない。 The conditions such as the number and arrangement of the pair of electrodes, the terminal 9, the power supply unit 6, the switch 12 and the like are determined by the number of device chips 7 to be accommodated, the usage of the carrier tray 1, and the like. It is not limited to the description.
以上説明した通り、本発明によると、デバイスチップ７を静電吸着により確実に保持する一方で、該静電吸着を解いて保持されたデバイスチップ７を容易に取り出せる搬送トレイ１が提供される。また、該搬送トレイ１を給電または除電する機能を有する給電装置２が提供される。 As described above, according to the present invention, there is provided the carrier tray 1 which can securely hold the device chip 7 by electrostatic attraction and easily take out the held device chip 7 by releasing the electrostatic attraction. Further, a power feeding device 2 having a function of feeding or discharging the transport tray 1 is provided.
搬送トレイ１には粘着材を使用せず、静電吸着によりデバイスチップ７が搬送トレイ１に保持されるため、搬送トレイ１から取り出されたデバイスチップ７には該粘着材が付着しない。 Since the adhesive material is not used for the carrying tray 1 and the device chip 7 is held on the carrying tray 1 by electrostatic attraction, the adhesive material does not adhere to the device chip 7 taken out from the carrying tray 1.
なお、本発明は、上記実施形態の記載に限定されず、種々変更して実施可能である。例えば、複数のデバイスチップ７それぞれの静電吸着に関与する対の電極を該複数のデバイスチップ７の数だけ設ける場合について説明した。しかし、対の電極は該数よりも少なくてもよく、例えば、該数よりも少ない複数の対の電極を搬送トレイに設け、複数のデバイスチップ７の静電吸着がまとめて制御されてもよい。 It should be noted that the present invention is not limited to the description of the above embodiment and can be implemented with various modifications. For example, the case has been described in which the pair of electrodes involved in electrostatic attraction of each of the plurality of device chips 7 is provided by the number of the plurality of device chips 7. However, the number of pairs of electrodes may be smaller than that number, for example, a plurality of pairs of electrodes smaller than the number may be provided in the transport tray, and electrostatic adsorption of the plurality of device chips 7 may be collectively controlled. ..
その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 In addition, the structures, methods, and the like according to the above-described embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.
１ 搬送トレイ
３ デバイスチップ支持部
３ａ 支持面
５ 枠部
７ デバイスチップ
９ 端子
１１ ベースプレート
１３ 絶縁性層
１５ 電極
１５ａ 第１の電極
１５ｂ 第２の電極
１５ｃ 対の電極
１５ｄ ドット状の電極
１７ 絶縁性層
１９ 配線
２ 給電装置
４ 支持基台
６ 給電部
８ 突き当て部
１０ スイッチ
１２ スイッチ
１４ 配線
１６ 給電用電源
１８ 除電用電源
1 Transport Tray 3 Device Chip Support 3a Support Surface 5 Frame 7 Device Chip 9 Terminal 11 Base Plate 13 Insulating Layer 15 Electrode 15a First Electrode 15b Second Electrode 15c Paired Electrode 15d Dot-shaped Electrode 17 Insulating Layer 19 wiring 2 power feeding device 4 support base 6 power feeding portion 8 abutting portion 10 switch 12 switch 14 wiring 16 power feeding power source 18 static elimination power source
Claims (4)
該デバイスチップ支持部は、
ベースプレートと、
該ベースプレートの上方に形成された複数の対の電極と、
該ベースプレートと、該対の電極と、を上方から覆う絶縁層と、を有し、
該デバイスチップ支持部は、所定の電位差を生じるように給電を受けた該対の電極から該デバイスチップ支持部の上方に生じる電界により、該支持面に載せられたデバイスチップに誘電分極を生じさせ、該デバイスチップを静電吸着する機能を有し、
該デバイスチップ支持部は、該給電が停止されても該電界と、該誘電分極と、が消滅せず該デバイスチップの静電吸着を継続できることを特徴とするデバイスチップの搬送トレイ。 A device chip supporting portion having an upper surface to be a supporting surface, and a frame portion having a plurality of terminals on the surface and surrounding the outer periphery of the device chip supporting portion,
The device chip support is
Base plate,
A plurality of pairs of electrodes formed above the base plate;
An insulating layer covering the base plate and the pair of electrodes from above,
The device chip support section causes dielectric polarization in the device chip placed on the support surface by an electric field generated above the device chip support section from the pair of electrodes supplied with power so as to generate a predetermined potential difference. , Having a function of electrostatically attracting the device chip,
The device chip carrier tray is characterized in that the device chip support portion can continue electrostatic adsorption of the device chip without disappearing the electric field and the dielectric polarization even when the power supply is stopped.
該複数の対の電極は、それぞれ対応する該端子を通してそれぞれ独立に給電または除電される機能を有することを特徴とする請求項１記載の搬送トレイ。 Each electrode constituting the plurality of pairs of electrodes is electrically connected to a corresponding terminal,
The carrier tray according to claim 1, wherein the plurality of pairs of electrodes have a function of supplying or removing electricity independently through the corresponding terminals.
該搬送トレイを支持する支持基台と、
該支持基台に設けられ、該搬送トレイの該複数の端子のそれぞれと接触する機能を有する複数の給電部と、
該複数の給電部に、給電用電源と、徐電用電源と、のいずれの電源を接続するかを選択する機能を有する電源選択部と、を有することを特徴とする給電装置。 A power feeding device for feeding or discharging electricity to the carrying tray according to claim 1 or 2.
A support base for supporting the transport tray,
A plurality of power supply units provided on the support base and having a function of contacting each of the plurality of terminals of the transport tray;
A power supply device comprising a plurality of power supply units, and a power supply selection unit having a function of selecting which of a power supply power supply and a slow power supply power supply to be connected.
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