JP6704192B2 - lighting equipment - Google Patents

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JP6704192B2
JP6704192B2 JP2016088391A JP2016088391A JP6704192B2 JP 6704192 B2 JP6704192 B2 JP 6704192B2 JP 2016088391 A JP2016088391 A JP 2016088391A JP 2016088391 A JP2016088391 A JP 2016088391A JP 6704192 B2 JP6704192 B2 JP 6704192B2
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substrate
light emitting
conductive member
instrument body
emitting elements
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JP2017199511A (en
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幹生 二本松
幹生 二本松
洋司 立野
洋司 立野
淳允 石森
淳允 石森
嶺 久米
嶺 久米
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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本発明は、器具本体と、それぞれに複数の発光素子が配置された複数の基板とを備える照明器具に関する。 The present invention relates to a lighting fixture including a fixture main body and a plurality of substrates on which a plurality of light emitting elements are arranged.

従来、天井に配置される照明器具であるシーリングライトが知られている。例えば、特許文献１には、天井面等の器具取付面に設置された配線器具に対向する取付部を有する本体と、取付部の周囲に位置して、実装面が前面側に向けられるとともに、裏面側が本体に面接触して配設された基板とを備える照明器具が開示されている。また、この基板には複数の発光ダイオード（ＬＥＤ：Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）が実装されている。 2. Description of the Related Art Conventionally, ceiling lights, which are lighting devices arranged on a ceiling, are known. For example, in Patent Document 1, a main body having a mounting portion facing a wiring device installed on a device mounting surface such as a ceiling surface, and a mounting surface facing the front side, located around the mounting portion, Disclosed is a lighting fixture including a substrate whose rear surface is in surface contact with the main body. A plurality of light emitting diodes (LEDs) are mounted on this board.

特開２０１２−１４６４３９号公報JP2012-146439A

シーリングライト等の照明器具には、例えば高光束化が要求されており、この要求にこたえるためには、例えば、照明器具が光源として有する発光素子の数を増やす必要がある。この場合、例えば、放熱効率の向上、発光素子の機械実装のしやすさ、または、基板の作製効率等の観点から、必要な数の発光素子の全てを１枚の基板に配置するのではなく、複数の基板のそれぞれに分配して配置することが行われる。 Lighting fixtures such as ceiling lights are required to have a high luminous flux, for example, and in order to meet this demand, it is necessary to increase the number of light-emitting elements included in the lighting fixtures as light sources. In this case, for example, from the viewpoint of improving the heat dissipation efficiency, the ease of mechanical mounting of the light emitting element, or the manufacturing efficiency of the substrate, not all the necessary number of light emitting elements are arranged on one substrate. , The plurality of substrates are distributed and arranged.

このように、複数の基板のそれぞれに複数の発光素子が配置される場合、複数の基板に発光のための電力を供給するために、一般に、これら基板間を電気的に接続する必要がある。そのため、例えば、各基板に、他の基板と電気的に接続するためのコネクタが設けられる。この場合、例えば２枚の基板を器具本体に取り付けた後に、２枚の基板のうちの一方のコネクタに電線の一端が挿し込まれ、かつ、他方のコネクタに電線の他端が挿し込まれる。これにより、当該２枚の基板が電気的に接続される。 As described above, when a plurality of light emitting elements are arranged on each of a plurality of substrates, it is generally necessary to electrically connect the plurality of substrates to supply electric power for light emission to the plurality of substrates. Therefore, for example, each board is provided with a connector for electrically connecting to another board. In this case, for example, after attaching the two boards to the instrument body, one end of the electric wire is inserted into one connector of the two boards, and the other end of the electric wire is inserted into the other connector. As a result, the two substrates are electrically connected.

しかしながら、この場合、コネクタと電線との接続作業（結線作業）は、機械で行うことはコスト等の観点から現実的ではなく、一般に、作業員による手作業で行われる。このことは、例えば照明器具の製造効率の向上の妨げとなりうる。 However, in this case, it is not realistic to perform the connecting work (wiring work) between the connector and the electric wire with a machine from the viewpoint of cost and the like, and in general, it is manually carried out by a worker. This may hinder the improvement of the manufacturing efficiency of the luminaire, for example.

本発明は、上記従来の課題を考慮し、それぞれに複数の発光素子が配置された複数の基板を備える照明器具であって、効率よく製造することができる照明器具を提供することを目的とする。 In view of the above conventional problems, the present invention has an object of providing a lighting fixture including a plurality of substrates on which a plurality of light emitting elements are arranged, and which can be efficiently manufactured. ..

本発明の一態様に係る照明器具は、器具本体と、それぞれに複数の発光素子が配置された第一基板及び第二基板であって、前記器具本体の配置面に沿って並んで配置された第一基板及び第二基板と、前記第一基板及び前記第二基板を電気的に接続し、かつ、前記第一基板及び前記第二基板を厚み方向に押さえる導通部材とを備える。 A lighting fixture according to an aspect of the present invention is a fixture main body, and a first substrate and a second substrate on which a plurality of light emitting elements are arranged, respectively, and the lighting fixtures are arranged side by side along a placement surface of the fixture main body. A first substrate and a second substrate, and a conductive member that electrically connects the first substrate and the second substrate and presses the first substrate and the second substrate in the thickness direction.

本発明によれば、それぞれに複数の発光素子が配置された複数の基板を備える照明器具であって、効率よく製造することができる照明器具を提供することができる。 According to the present invention, it is possible to provide a lighting fixture including a plurality of substrates on which a plurality of light emitting elements are arranged, and which can be efficiently manufactured.

図１は、実施の形態１係る照明器具の分解斜視図である。FIG. 1 is an exploded perspective view of the lighting fixture according to the first embodiment. 図２は、実施の形態１係る発光装置の構成概要を示す平面図である。FIG. 2 is a plan view showing a schematic configuration of the light emitting device according to the first embodiment. 図３は、実施の形態１における第一基板と第二基板との境界付近の第１の断面図である。FIG. 3 is a first cross-sectional view near the boundary between the first substrate and the second substrate in the first embodiment. 図４は、実施の形態１における第一基板と第二基板との境界付近の第２の断面図である。FIG. 4 is a second cross-sectional view near the boundary between the first substrate and the second substrate in the first embodiment. 図５は、導通部材を付勢する弾性部材を有する光源カバーの一部を示す断面図である。FIG. 5 is a cross-sectional view showing a part of a light source cover having an elastic member that biases the conductive member. 図６は、実施の形態１の変形例１に係る導通部材の構成を示す第１の断面図である。FIG. 6 is a first cross-sectional view showing the configuration of the conducting member according to the first modification of the first embodiment. 図７は、実施の形態１の変形例１に係る導通部材の構成を示す第２の断面図である。FIG. 7 is a second cross-sectional view showing the configuration of the conducting member according to the first modification of the first embodiment. 図８は、実施の形態１の変形例２に係る導通部材の構成を示す第１の断面図である。FIG. 8 is a first cross-sectional view showing the structure of the conductive member according to the second modification of the first embodiment. 図９は、実施の形態１の変形例２に係る導通部材の構成を示す第２の断面図である。FIG. 9 is a second cross-sectional view showing the configuration of the conducting member according to the second modification of the first embodiment. 図１０は、実施の形態１の変形例２に係る導通部材と電源回路とが接続された構成を示す図である。FIG. 10 is a diagram showing a configuration in which the conducting member and the power supply circuit according to the second modification of the first embodiment are connected. 図１１は、実施の形態１の変形例３に係る導通部材の構成を示す断面図である。FIG. 11 is a cross-sectional view showing the configuration of the conducting member according to the third modification of the first embodiment. 図１２は、実施の形態２に係る照明器具の構成概要を示す分解図である。FIG. 12 is an exploded view showing a schematic configuration of the lighting fixture according to the second embodiment. 図１３は、導通部材を中心として４枚の基板が配置されることで構成された発光装置を示す平面図である。FIG. 13 is a plan view showing a light emitting device configured by arranging four substrates around a conductive member. 図１４は、導通部材を中心として２枚の基板が配置されることで構成された発光装置を示す平面図である。FIG. 14 is a plan view showing a light emitting device configured by arranging two substrates around a conductive member.

以下、実施の形態及について、図面を参照しながら説明する。なお、以下に説明する実施の形態は、本発明の一具体例を示すものである。したがって、以下の実施の形態で示される、数値、形状、材料、構成要素、構成要素の配置位置および接続形態などは、一例であって本発明を限定する主旨ではない。よって、以下の実施の形態における構成要素のうち、本発明の最上位概念を示す独立請求項に記載されていない構成要素については、任意の構成要素として説明される。 Hereinafter, embodiments and embodiments will be described with reference to the drawings. The embodiment described below shows one specific example of the present invention. Therefore, numerical values, shapes, materials, constituent elements, arrangement positions of constituent elements, connection forms, and the like shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, the constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as arbitrary constituent elements.

なお、各図は模式図であり、必ずしも厳密に図示されたものではない。また、各図において、実質的に同一の構成に対しては同一の符号を付しており、重複する説明は省略または簡略化される場合がある。 It should be noted that each drawing is a schematic diagram and is not necessarily strictly illustrated. Further, in each drawing, the same reference numerals are given to substantially the same configurations, and overlapping description may be omitted or simplified.

（実施の形態１）
以下、実施の形態１に係る照明器具１００について説明する。 (Embodiment 1)
Hereinafter, the lighting fixture 100 according to Embodiment 1 will be described.

［照明器具の全体構成］
まず、図１及び図２を参照しながら、実施の形態に係る照明器具１００の全体構成について説明する。図１は、実施の形態１に係る照明器具１００の分解斜視図である。図２は、実施の形態１に係る発光装置１０の構成概要を示す平面図である。なお、図１及び図２では、電源回路９０が有する部品、及び、複数の発光素子２０への電力供給のための配線等の、照明器具１００が備える一部の要素についての図示は省略されている。 [Overall structure of lighting equipment]
First, the overall configuration of the lighting fixture 100 according to the embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is an exploded perspective view of a lighting fixture 100 according to the first embodiment. FIG. 2 is a plan view showing a schematic configuration of the light emitting device 10 according to the first embodiment. Note that, in FIGS. 1 and 2, illustration of some components included in the lighting device 100, such as components included in the power supply circuit 90 and wirings for supplying power to the plurality of light emitting elements 20, is omitted. There is.

本実施の形態の照明器具１００は、例えば天井に取り付けられるシーリングライトであり、図１における上方（Ｚ軸のプラスの方向）が、天井に対向する床面の方向に相当する。つまり、図１における照明器具１００は、通常の使用時とは上下が逆の姿勢で図示されている。 The lighting fixture 100 of the present embodiment is, for example, a ceiling light that is attached to a ceiling, and the upper side (the positive direction of the Z axis) in FIG. 1 corresponds to the direction of the floor surface facing the ceiling. That is, the lighting fixture 100 in FIG. 1 is illustrated in an upside down posture from that in normal use.

本実施の形態に係る照明器具１００は、器具本体１１０と、器具本体１１０に取り付けられた発光装置１０とを備える。発光装置１０は、第一発光モジュール１０ａ及び第二発光モジュール１０ｂを有する。 The lighting fixture 100 according to the present embodiment includes a fixture main body 110 and the light emitting device 10 attached to the fixture main body 110. The light emitting device 10 includes a first light emitting module 10a and a second light emitting module 10b.

本実施の形態では、照明器具１００はさらに、光源カバー１６０、照明カバー１４０、電源回路９０、回路カバー１２０、及びアダプタ１０８を備えている。 In the present embodiment, the lighting fixture 100 further includes a light source cover 160, a lighting cover 140, a power supply circuit 90, a circuit cover 120, and an adapter 108.

［器具本体及び回路カバー］
図１に示すように、器具本体１１０は、円盤状に形成されており、例えばアルミニウム板又は鋼板等の板金を用いて作製された部材である。器具本体１１０の発光装置１０が配置される側の面には、複数のカバー取付部１１９が器具本体１１０の周方向に間隔を置いて配置されている。なお、器具本体１１０の発光装置１０が配置される側の面には、例えば、反射率が高い白色塗料が塗布又は反射性金属材料が蒸着されている。 [Apparatus body and circuit cover]
As shown in FIG. 1, the instrument main body 110 is formed in a disc shape, and is a member manufactured by using a metal plate such as an aluminum plate or a steel plate. A plurality of cover attachment parts 119 are arranged at intervals in the circumferential direction of the device body 110 on the surface of the device body 110 on the side where the light emitting device 10 is arranged. In addition, for example, a white paint having a high reflectance is applied or a reflective metal material is vapor-deposited on the surface of the instrument body 110 on the side where the light emitting device 10 is arranged.

器具本体１１０の、発光装置１０とは反対側には、電源回路９０を収容する回路カバー１２０が配置されている。回路カバー１２０は、例えば、図示しないネジ等によって器具本体１１０と結合される。 A circuit cover 120 that houses the power supply circuit 90 is disposed on the side of the instrument body 110 opposite to the light emitting device 10. The circuit cover 120 is coupled to the instrument body 110 with, for example, a screw (not shown) or the like.

また、図１に示すように、器具本体１１０の中央部には、円形状の開口部が形成されており、当該開口部には、回路カバー１２０に固定された略円筒状の支持部１２６が挿入される。回路カバー１２０に固定された支持部１２６は、例えば、天井面に設けられた照明取付具（例えば、「引掛けシーリング」と呼ばれる）に着脱自在なアダプタ１０８と嵌め合わせ可能な構造を有している。つまり、照明器具１００は、天井面に設けられた引掛けシーリングと、アダプタ１０８を介して電気的及び機械的に接続される。 Further, as shown in FIG. 1, a circular opening is formed in the central portion of the instrument body 110, and a substantially cylindrical support portion 126 fixed to the circuit cover 120 is formed in the opening. Is inserted. The support portion 126 fixed to the circuit cover 120 has a structure that can be fitted to a detachable adapter 108, for example, with a lighting fixture (for example, called a “hook ceiling”) provided on the ceiling surface. There is. That is, the lighting fixture 100 is electrically and mechanically connected to the hook ceiling provided on the ceiling surface via the adapter 108.

電源回路９０は、アダプタ１０８を介して引掛けシーリングから供給される交流電力を、複数の発光素子２０の発光に適した特性の直流電力に変換し、図示しない電線を介して発光装置１０に供給する。これにより、複数の発光素子２０は発光する。なお、当該電線は、器具本体１１０に設けられた電線孔１１４を貫通した状態で、電源回路９０と発光装置１０とを接続する。 The power supply circuit 90 converts the AC power supplied from the hook ceiling via the adapter 108 into DC power having characteristics suitable for light emission of the plurality of light emitting elements 20, and supplies the DC power to the light emitting device 10 via an electric wire (not shown). To do. As a result, the plurality of light emitting elements 20 emit light. The electric wire connects the power supply circuit 90 and the light emitting device 10 in a state of penetrating the electric wire hole 114 provided in the instrument body 110.

電源回路９０は、例えば、電解コンデンサもしくはセラミックコンデンサ等の容量素子、抵抗素子、コイル素子、チョークコイル（チョークトランス）、ノイズフィルタ、及び、ダイオードもしくは集積回路素子等の半導体素子等を有している。 The power supply circuit 90 has, for example, a capacitive element such as an electrolytic capacitor or a ceramic capacitor, a resistance element, a coil element, a choke coil (choke transformer), a noise filter, and a semiconductor element such as a diode or an integrated circuit element. ..

器具本体１１０には、図１に示すように、発光装置１０が配置される面である配置面１１２が形成されている。本実施の形態では、発光装置１０の形状に応じた環状の平面が配置面１１２として器具本体１１０に形成されている。 As shown in FIG. 1, the fixture body 110 is provided with a placement surface 112 on which the light emitting device 10 is placed. In the present embodiment, an annular flat surface corresponding to the shape of the light emitting device 10 is formed on the device body 110 as the placement surface 112.

なお、図１に示す器具本体１１０に回路カバー１２０が取り付けられたものが「器具本体」と呼ばれてもよい。つまり、回路カバー１２０は器具本体１１０の一部として扱われてもよい。 In addition, what attached the circuit cover 120 to the instrument main body 110 shown in FIG. 1 may be called "an instrument main body." That is, the circuit cover 120 may be treated as a part of the instrument body 110.

［発光装置］
図１及び図２に示すように、発光装置１０は、第一発光モジュール１０ａ及び第二発光モジュール１０ｂを有する。第一発光モジュール１０ａは、第一基板１１ａと、第一基板１１ａの主面１２ａに配置された複数の発光素子２０とを有する。第二発光モジュール１０ｂは、第二基板１１ｂと、第二基板１１ｂの主面１２ｂに配置された複数の発光素子２０とを有する。 [Light emitting device]
As shown in FIGS. 1 and 2, the light emitting device 10 includes a first light emitting module 10a and a second light emitting module 10b. The first light emitting module 10a includes a first substrate 11a and a plurality of light emitting elements 20 arranged on the main surface 12a of the first substrate 11a. The second light emitting module 10b has a second substrate 11b and a plurality of light emitting elements 20 arranged on the main surface 12b of the second substrate 11b.

上記構成を有する発光装置１０は、上述のように、器具本体１１０の配置面１１２に配置されている。つまり、本実施の形態に係る照明器具１００は、器具本体１１０と、器具本体１１０の配置面１１２に沿って並んで配置された第一基板１１ａ及び第二基板１１ｂとを備える。 The light emitting device 10 having the above configuration is arranged on the arrangement surface 112 of the instrument body 110 as described above. That is, the lighting fixture 100 according to the present embodiment includes the fixture body 110, and the first substrate 11a and the second substrate 11b arranged side by side along the placement surface 112 of the fixture body 110.

発光装置１０は、平面視（第一基板１１ａ及び第二基板１１ｂの厚み方向（本実施の形態ではＺ軸方向）から見た場合）における外形が円形（略円形も含む）であり、かつ、中央部に円形の開口部が形成されている。 The light emitting device 10 has a circular outer shape (including a substantially circular shape) in a plan view (when viewed from the thickness direction of the first substrate 11a and the second substrate 11b (Z-axis direction in this embodiment)), and A circular opening is formed in the center.

具体的には、それぞれが半環形状の第一基板１１ａ及び第二基板１１ｂを、配置面１１２に沿って並べることで、全体として円環状（ドーナツ状）の形状を有する発光装置１０が形成されている。なお、本実施の形態では、発光装置１０は、２枚の基板（１１ａ、１１ｂ）で構成されているが、発光装置１０は、それぞれに複数の発光素子２０が配置された３枚以上の基板を有してもよい。 Specifically, the first substrate 11a and the second substrate 11b, each having a semi-ring shape, are arranged along the arrangement surface 112 to form the light emitting device 10 having an annular shape (donut shape) as a whole. ing. In the present embodiment, the light emitting device 10 is composed of two substrates (11a, 11b), but the light emitting device 10 has three or more substrates each having a plurality of light emitting elements 20 arranged therein. May have.

第一基板１１ａ及び第二基板１１ｂのそれぞれは、金属配線がパターン形成された、いわゆるプリント基板であり、本実施の形態では、樹脂基板が採用されている。樹脂基板としては、ガラスコンポジット基板及びガラスエポキシ基板等が例示される。 Each of the first substrate 11a and the second substrate 11b is a so-called printed substrate on which metal wiring is patterned, and a resin substrate is used in the present embodiment. Examples of the resin substrate include a glass composite substrate and a glass epoxy substrate.

本実施の形態の複数の発光素子２０の各々は、例えばＬＥＤチップがパッケージ化されたＬＥＤ素子である。すなわち、発光装置１０は、ＬＥＤチップがパッケージ化されたＬＥＤ素子を基板上に実装したＳＭＤ（Ｓｕｒｆａｃｅ Ｍｏｕｎｔ Ｄｅｖｉｃｅ）構造を有している。 Each of the plurality of light emitting elements 20 of the present embodiment is, for example, an LED element in which an LED chip is packaged. That is, the light emitting device 10 has an SMD (Surface Mount Device) structure in which an LED element in which an LED chip is packaged is mounted on a substrate.

具体的には、第一基板１１ａの主面１２ａ及び第二基板１１ｂの主面１２ｂに設けられた導体パターン（金属配線、図示せず）のそれぞれに、複数の発光素子２０がはんだによって接続されている。つまり、発光装置１０が有する複数の発光素子２０それぞれは、第一基板１１ａの主面１２ａ、または、第二基板１１ｂの主面１２ｂに表面実装されている。 Specifically, a plurality of light emitting elements 20 are connected by solder to each of the conductor patterns (metal wiring, not shown) provided on the main surface 12a of the first substrate 11a and the main surface 12b of the second substrate 11b. ing. That is, each of the plurality of light emitting elements 20 included in the light emitting device 10 is surface-mounted on the main surface 12a of the first substrate 11a or the main surface 12b of the second substrate 11b.

また、第一基板１１ａ及び第二基板１１ｂのそれぞれには、第一基板１１ａと第二基板１１ｂとを電気的に接続するための電極が設けられている。具体的には、第一基板１１ａは電極１５ａ及び１６ａを有し、第二基板１１ｂは電極１５ｂ及び１６ｂを有する。 Further, each of the first substrate 11a and the second substrate 11b is provided with an electrode for electrically connecting the first substrate 11a and the second substrate 11b. Specifically, the first substrate 11a has electrodes 15a and 16a, and the second substrate 11b has electrodes 15b and 16b.

なお、図２では、各電極（１５ａ、１５ｂ、１６ａ、１６ｂ）を他の要素と識別しやすいように各電極（１５ａ、１５ｂ、１６ａ、１６ｂ）にドットを付して示している。このことは、後述する図１１〜図１４に示される平面図においても同じである。 In FIG. 2, each electrode (15a, 15b, 16a, 16b) is shown with a dot attached to it so that it can be easily distinguished from other elements. This also applies to plan views shown in FIGS. 11 to 14 described later.

第一基板１１ａにおいて、主面１２ａに配置された複数の発光素子２０は、例えば直列に接続されており、直列に接続された発光素子２０の列の一端に、金属配線を介して電極１５ａが接続されている。また、直列に接続された発光素子２０の列の他端に、金属配線を介して電極１６ａが接続されている。 In the first substrate 11a, the plurality of light emitting elements 20 arranged on the main surface 12a are connected in series, for example, and the electrode 15a is provided at one end of the row of the light emitting elements 20 connected in series via the metal wiring. It is connected. Further, the electrode 16a is connected to the other end of the series of the light emitting elements 20 connected in series via the metal wiring.

第二基板１１ｂにおいても同様に、主面１２ｂに配置された複数の発光素子２０は、例えば直列に接続されており、直列に接続された発光素子２０の列の一端に、金属配線を介して電極１５ｂが接続されている。また、直列に接続された発光素子２０の列の他端に、金属配線を介して電極１６ｂが接続されている。 Similarly, in the second substrate 11b, the plurality of light emitting elements 20 arranged on the main surface 12b are connected in series, for example, and are connected to one end of the row of the light emitting elements 20 connected in series via metal wiring. The electrode 15b is connected. Further, the electrode 16b is connected to the other end of the column of the light emitting elements 20 connected in series via a metal wiring.

上記構成を有する第一基板１１ａ及び第二基板１１ｂは、導通部材１７０によって電気的に接続されている。具体的には、第一基板１１ａの電極１５ａと、第二基板１１ｂの１６ｂとに金属製の導通部材１７０が接触することで第一基板１１ａ及び第二基板１１ｂが電気的に接続される。さらに、第一基板１１ａの電極１６ａと、第二基板１１ｂの１５ｂとに金属製の導通部材１７０が接触することで第一基板１１ａ及び第二基板１１ｂが電気的に接続される。 The first substrate 11a and the second substrate 11b having the above configuration are electrically connected by the conductive member 170. Specifically, the electrode 15a of the first substrate 11a and the conductive member 170 made of metal come into contact with the electrode 16b of the second substrate 11b to electrically connect the first substrate 11a and the second substrate 11b. Furthermore, the electrode 16a of the first substrate 11a and the conductive member 170 made of metal come into contact with the electrode 15b of the second substrate 11b to electrically connect the first substrate 11a and the second substrate 11b.

また、第一基板１１ａ及び第二基板１１ｂの一方に、電源回路９０から供給される直流電力を受け取るコネクタ（図示せず）が設けられている。例えば、第一基板１１ａにおいて金属配線を介して複数の発光素子２０と直列にコネクタが接続されている。これにより、２つの導通部材１７０により直列に接続された、第一基板１１ａ上及び第二基板１１ｂ上の複数の発光素子２０に、電源回路９０から供給される直流電力が与えられ、複数の発光素子２０は発光する。 Further, a connector (not shown) that receives DC power supplied from the power supply circuit 90 is provided on one of the first substrate 11a and the second substrate 11b. For example, a connector is connected in series with the plurality of light emitting elements 20 via metal wiring on the first substrate 11a. As a result, the direct-current power supplied from the power supply circuit 90 is applied to the plurality of light emitting elements 20 on the first substrate 11a and the second substrate 11b, which are connected in series by the two conducting members 170, and the plurality of light emitting elements 20 emit light. The element 20 emits light.

本実施の形態では、第一基板１１ａ及び第二基板１１ｂを電気的に接続する２つの導通部材１７０は光源カバー１６０に備えられており、発光装置１０に対して光源カバー１６０を配置することで、第一基板１１ａ及び第二基板１１ｂの間の導通のための配線が完了する。第一基板１１ａ及び第二基板１１ｂの間の導通の仕組みの詳細については、図３及び図４を用いて後述する。 In the present embodiment, the two conductive members 170 that electrically connect the first substrate 11a and the second substrate 11b are provided in the light source cover 160, and by disposing the light source cover 160 with respect to the light emitting device 10. The wiring for conduction between the first substrate 11a and the second substrate 11b is completed. Details of the mechanism of conduction between the first substrate 11a and the second substrate 11b will be described later with reference to FIGS. 3 and 4.

なお、発光装置１０が有する複数の発光素子２０の電気的な接続の態様に特に限定はない。例えば、直列接続されたｎ（ｎは２以上の整数）個の発光素子２０のグループ（発光素子２０群）を複数形成し、これら複数の発光素子２０群を並列に接続してもよい。例えば、２つの導通部材１７０の一方に、電源回路９０の高電位電極を接続し、２つの導通部材１７０の他方に電源回路９０の低電位電極を接続することで、第一基板１１ａの発光素子２０群と、第二基板１１ｂの発光素子２０群とを並列に接続してもよい。なお、導通部材を介して発光装置１０に電力を供給する構成の一例については、図１０等を用いて後述する。 There is no particular limitation on the mode of electrical connection of the plurality of light emitting elements 20 included in the light emitting device 10. For example, a plurality of groups (light emitting element 20 groups) of n (n is an integer of 2 or more) light emitting elements 20 connected in series may be formed, and the plurality of light emitting element 20 groups may be connected in parallel. For example, by connecting the high potential electrode of the power supply circuit 90 to one of the two conducting members 170 and connecting the low potential electrode of the power supply circuit 90 to the other of the two conducting members 170, the light emitting element of the first substrate 11a. The 20 groups and the light emitting elements 20 group of the second substrate 11b may be connected in parallel. Note that an example of a configuration for supplying power to the light emitting device 10 via the conductive member will be described later with reference to FIG.

上記構成を有する発光装置１０が器具本体１１０に取り付けられる場合、図１に示すように、配置面１１２に第一基板１１ａ及び第二基板１１ｂの裏面が接触した状態で取り付けられる。これにより、第一基板１１ａ及び第二基板１１ｂそれぞれにおいて複数の発光素子２０が発する熱が、器具本体１１０を介して効率よく外部に放出される。 When the light emitting device 10 having the above configuration is attached to the instrument body 110, as shown in FIG. 1, the light emitting device 10 is attached with the rear surfaces of the first substrate 11a and the second substrate 11b in contact with the arrangement surface 112. Thereby, the heat generated by the plurality of light emitting elements 20 in each of the first substrate 11a and the second substrate 11b is efficiently radiated to the outside via the instrument body 110.

また、本実施の形態では、３つのネジ６６によって、光源カバー１６０と発光装置１０（第一発光モジュール１０ａ及び第二発光モジュール１０ｂ）とが、器具本体１１０にとも締めされる。 Further, in the present embodiment, the light source cover 160 and the light emitting device 10 (the first light emitting module 10a and the second light emitting module 10b) are also fastened to the instrument body 110 by the three screws 66.

なお、発光装置１０の器具本体１１０への固定方法に特に限定はなく、例えば、器具本体１１０に設けられた複数の爪が、第一基板１１ａ及び第二基板１１ｂに引っ掛けられることで、発光装置１０が器具本体１１０に固定されてもよい。 The method of fixing the light emitting device 10 to the instrument body 110 is not particularly limited. For example, a plurality of claws provided on the instrument body 110 are hooked on the first substrate 11a and the second substrate 11b, so that the light emitting device is obtained. 10 may be fixed to the instrument body 110.

［光源カバー］
図１に示すように、光源カバー１６０は、発光装置１０の複数の発光素子２０を覆う部材であり、透光性を有する（例えば透明の）樹脂等で形成されている。光源カバー１６０は、ドーナツ状に形成されており、環状に配置された複数の発光素子２０を一括して覆う状態で配置されている。 [Light source cover]
As shown in FIG. 1, the light source cover 160 is a member that covers the plurality of light emitting elements 20 of the light emitting device 10, and is formed of a translucent (for example, transparent) resin or the like. The light source cover 160 is formed in a donut shape, and is arranged so as to collectively cover the plurality of light emitting elements 20 arranged in an annular shape.

本実施の形態では、上述のように、光源カバー１６０に２つの導通部材１７０が備えられており、２つの導通部材１７０のそれぞれは、第一基板１１ａ及び第二基板１１ｂの電気的な接続に用いられる。なお、光源カバー１６０は、器具本体１１０に固定された固定部材の一例である。 In the present embodiment, as described above, the light source cover 160 is provided with the two conductive members 170, and each of the two conductive members 170 serves to electrically connect the first substrate 11a and the second substrate 11b. Used. The light source cover 160 is an example of a fixing member fixed to the instrument body 110.

また、光源カバー１６０は、複数の発光素子２０それぞれから放出された光を拡散させる機能を有してもよく、また、主として複数の発光素子２０を保護するために配置されてもよい。 Further, the light source cover 160 may have a function of diffusing light emitted from each of the plurality of light emitting elements 20, and may be arranged mainly for protecting the plurality of light emitting elements 20.

また、光源カバー１６０は、上述のように、３つのネジ６６によって、発光装置１０とともに、器具本体１１０に取り付けられる。なお、光源カバー１６０の器具本体１１０への固定方法に特に限定はなく、例えば、器具本体１１０に設けられた複数の爪が、光源カバー１６０に引っ掛けられることで、発光装置１０が器具本体１１０に固定されてもよい。 The light source cover 160 is attached to the fixture body 110 together with the light emitting device 10 by the three screws 66 as described above. The method of fixing the light source cover 160 to the instrument body 110 is not particularly limited, and, for example, a plurality of claws provided on the instrument body 110 are hooked on the light source cover 160, so that the light emitting device 10 is attached to the instrument body 110. It may be fixed.

また、例えば、光源カバー１６０に設けられた複数の凸部が、第一基板１１ａ及び第二基板１１ｂに設けられた孔または切り欠きに挿入されることで、光源カバー１６０、並びに、第一基板１１ａ及び第二基板１１ｂの一方が、他方の位置決めのための部材として機能してもよい。 Further, for example, the plurality of convex portions provided on the light source cover 160 are inserted into the holes or the notches provided on the first substrate 11a and the second substrate 11b, so that the light source cover 160 and the first substrate are provided. One of 11a and the second substrate 11b may function as a member for positioning the other.

［照明カバー］
照明カバー１４０は、器具本体１１０の発光装置１０等が取り付けられた側を覆う部材であり、透光性を有する樹脂で形成されている。照明カバー１４０は、例えば乳白色の樹脂で形成されており、各発光素子２０からの光を拡散して外部に放出することができる。また、照明カバー１４０の開口部（図示せず）には、複数の突起（図示せず）が形成されている。これらの複数の突起をそれぞれ器具本体１１０に設けられた複数のカバー取付部１１９に引っ掛けることにより、照明カバー１４０が器具本体１１０に着脱自在に取り付けられる。 [Lighting cover]
The illumination cover 140 is a member that covers the side of the instrument body 110 to which the light emitting device 10 and the like are attached, and is formed of a translucent resin. The illumination cover 140 is formed of, for example, a milky white resin, and can diffuse the light from each light emitting element 20 and emit the light to the outside. Further, a plurality of protrusions (not shown) are formed in the opening (not shown) of the lighting cover 140. The lighting cover 140 is detachably attached to the instrument body 110 by hooking the plurality of protrusions on the plurality of cover attachment portions 119 provided on the instrument body 110, respectively.

［基板間の導通について］
次に、図３及び図４を参照し、本実施の形態に係る照明器具１００における、第一基板１１ａと第二基板１１ｂとの間の導通のための構造について説明する。 [About continuity between boards]
Next, with reference to FIGS. 3 and 4, a structure for electrical connection between the first substrate 11a and the second substrate 11b in the lighting fixture 100 according to the present embodiment will be described.

図３は、実施の形態１における第一基板１１ａと第二基板１１ｂとの境界付近の第１の断面図である。図４は、実施の形態１における第一基板１１ａと第二基板１１ｂとの境界付近の第２の断面図である。 FIG. 3 is a first cross-sectional view near the boundary between the first substrate 11a and the second substrate 11b in the first embodiment. FIG. 4 is a second cross-sectional view near the boundary between first substrate 11a and second substrate 11b in the first embodiment.

具体的には、図３及び図４では、照明器具１００の一部の断面であって、図２におけるＩＩＩ−ＩＩＩ線の位置における断面が図示されている。また、図３では、光源カバー１６０が器具本体１１０に取り付けられる前の状態が図示されており、図４では、光源カバー１６０が器具本体１１０に取り付けられた状態が図示されている。 Specifically, FIGS. 3 and 4 show a part of the cross section of the lighting fixture 100, which is taken along the line III-III in FIG. 2. Further, FIG. 3 illustrates a state before the light source cover 160 is attached to the instrument body 110, and FIG. 4 illustrates a state in which the light source cover 160 is attached to the instrument body 110.

本実施の形態に係る照明器具１００において、それぞれに複数の発光素子２０が配置された第一基板１１ａ及び第二基板１１ｂは、図１〜図４に示すように、器具本体１１０の配置面１１２に沿って並んで配置されている。このように配置された第一基板１１ａ及び第二基板１１ｂを備える照明器具１００はさらに、第一基板１１ａ及び第二基板１１ｂを電気的に接続し、かつ、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえる導通部材１７０を備えている。 In the lighting fixture 100 according to the present embodiment, the first substrate 11a and the second substrate 11b on which the plurality of light emitting elements 20 are arranged are arranged on the placement surface 112 of the fixture body 110 as shown in FIGS. Are arranged side by side. The lighting fixture 100 including the first substrate 11a and the second substrate 11b arranged in this manner further electrically connects the first substrate 11a and the second substrate 11b, and the first substrate 11a and the second substrate 11b. Is provided with a conductive member 170 for pressing in the thickness direction.

この構成によれば、例えば、比較的に多い数の発光素子２０を、２枚の基板に分散して配置することができるため、各基板のサイズを大きくすることなく、照明器具１００の全光束を増加させることができる。 According to this configuration, for example, a relatively large number of light emitting elements 20 can be dispersedly arranged on the two substrates, so that the total luminous flux of the lighting fixture 100 can be obtained without increasing the size of each substrate. Can be increased.

例えば、第一基板１１ａ及び第二基板１１ｂの組み合わせ（図２参照）に相当するサイズ及び形状の、１枚の円環状の基板を作製する場合、例えば矩形の材料から円環状の基板を切り出すため、無駄となる材料が比較的に多くなる。一方、本実施の形態では、それぞれが半環形状の第一基板１１ａ及び第二基板１１ｂを組み合わせることで、比較的に大きな円環状の基板が構成されるため、無駄となる材料の量が抑制される。また、例えば、基板が大型化することにより、発光素子２０の機械実装が困難になる等の問題も生じない。 For example, when a single annular substrate having a size and shape corresponding to the combination of the first substrate 11a and the second substrate 11b (see FIG. 2) is produced, for example, the annular substrate is cut out from a rectangular material. The amount of wasted material is relatively large. On the other hand, in the present embodiment, since the relatively large annular substrate is configured by combining the semi-annular first substrate 11a and the second substrate 11b, the amount of wasted material is suppressed. To be done. Further, for example, there is no problem that mechanical mounting of the light emitting element 20 becomes difficult due to an increase in the size of the substrate.

さらに、照明器具１００において、導通部材１７０は、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえるよう配置される。そのため、第一基板１１ａ及び第二基板１１ｂのそれぞれには、第一基板１１ａ及び第二基板１１ｂを電気的に接続するための電極があればよく、コネクタ等の部品は不要である。また、コネクタと電線とを接続する場合のような手作業ではなく、自動機械による導通部材１７０の配置を行うことができる。また、導通部材１７０の配置後には、導通部材１７０が、例えば、第一基板１１ａ及び第二基板１１ｂの一方に対する他方の位置決め部材としても機能する。 Further, in the lighting fixture 100, the conductive member 170 is arranged so as to press the first substrate 11a and the second substrate 11b in the thickness direction. Therefore, each of the first substrate 11a and the second substrate 11b need only have electrodes for electrically connecting the first substrate 11a and the second substrate 11b, and components such as a connector are not necessary. Further, the conducting member 170 can be arranged by an automatic machine instead of the manual work such as when connecting the connector and the electric wire. Further, after the conductive member 170 is arranged, the conductive member 170 also functions as, for example, a positioning member for the other of the first substrate 11a and the second substrate 11b.

以上のように、本実施の形態に係る照明器具１００は、それぞれに複数の発光素子２０が配置された複数の基板（第一基板１１ａ及び第二基板１１ｂ）を備える照明器具１００であって、効率よく製造することができる照明器具１００である。 As described above, the lighting fixture 100 according to the present embodiment is a lighting fixture 100 including a plurality of substrates (first substrate 11a and second substrate 11b) on which a plurality of light emitting elements 20 are arranged, respectively. The lighting device 100 can be manufactured efficiently.

また、導通部材１７０の高さ（主面１２ａ及び１２ｂからの高さ）を比較的に小さくすることが可能であるため、例えば、主面１２ａ及び１２ｂに基板間の導通のためのコネクタを設ける場合よりも、複数の発光素子２０からの光の遮光量を低減することができる。 Further, since the height of the conductive member 170 (height from the main surfaces 12a and 12b) can be made relatively small, for example, the main surfaces 12a and 12b are provided with connectors for conducting between the substrates. The amount of light shielded from the plurality of light emitting elements 20 can be reduced more than in the case.

また、照明器具１００はさらに、器具本体１１０に固定された固定部材を備え、導通部材１７０は、固定部材によって押さえられることで、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえる。 The lighting fixture 100 further includes a fixing member fixed to the fixture main body 110, and the conducting member 170 is pressed by the fixing member to press the first substrate 11a and the second substrate 11b in the thickness direction.

具体的には、本実施の形態では、導通部材１７０は、図４に示すように、固定部材としての光源カバー１６０によって押さえられる。これにより、導通部材１７０は、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえる。より詳細には、光源カバー１６０は、導通部材１７０を第一基板１１ａ及び第二基板１１ｂに押し当てるように、器具本体１１０にネジ留めされている。 Specifically, in the present embodiment, the conducting member 170 is pressed by the light source cover 160 as a fixing member, as shown in FIG. Thereby, the conduction member 170 presses the first substrate 11a and the second substrate 11b in the thickness direction. More specifically, the light source cover 160 is screwed to the instrument body 110 so that the conductive member 170 is pressed against the first substrate 11a and the second substrate 11b.

このように、器具本体１１０に固定される部材を利用して導通部材１７０を配置することで、例えば、導通部材１７０の配置のための部品を別途用いる必要がない。また、固定部材と器具本体１１０との間の固定力（本実施の形態では、光源カバー１６０をネジ留めすることによる螺合力）を利用して、導通部材１７０を第一基板１１ａ及び第二基板１１ｂに押し当てることができる。これにより、例えば、導通部材１７０による第一基板１１ａ及び第二基板１１ｂの間の電気的接続の信頼性が向上する。 As described above, by disposing the conducting member 170 by using the member fixed to the instrument body 110, it is not necessary to separately use a component for disposing the conducting member 170, for example. In addition, the conduction member 170 is fixed to the first substrate 11a and the second substrate by using the fixing force between the fixing member and the instrument main body 110 (in the present embodiment, the screwing force by screwing the light source cover 160). It can be pressed against 11b. Thereby, for example, the reliability of the electrical connection between the first substrate 11a and the second substrate 11b by the conductive member 170 is improved.

また、透光性を有する光源カバー１６０は、複数の発光素子２０（本実施の形態では、発光装置１０が備える全ての発光素子２０）を覆うように配置されており、導通部材１７０の一部は、光源カバー１６０に埋設されている。 Further, the light source cover 160 having translucency is arranged so as to cover the plurality of light emitting elements 20 (in the present embodiment, all the light emitting elements 20 included in the light emitting device 10), and a part of the conductive member 170. Are embedded in the light source cover 160.

つまり、第一基板１１ａ及び第二基板１１ｂの近くに配置される部材である光源カバー１６０に導通部材１７０が備えられる。これにより、例えば、光源カバー１６０の固定力を、導通部材１７０の第一基板１１ａ及び第二基板１１ｂへの押し当て力として効率よく利用することができる。 That is, the light source cover 160, which is a member arranged near the first substrate 11a and the second substrate 11b, is provided with the conducting member 170. Accordingly, for example, the fixing force of the light source cover 160 can be efficiently used as the pressing force of the conductive member 170 against the first substrate 11a and the second substrate 11b.

また、導通部材１７０の一部が、光源カバー１６０に埋設されることで、例えば、導通部材１７０の厚み（Ｚ軸方向の幅）が比較的に大きい場合であっても、その厚みの少なくとも一部を光源カバー１６０の肉厚内に吸収することができる。 Further, since a part of the conductive member 170 is embedded in the light source cover 160, for example, even when the conductive member 170 has a relatively large thickness (width in the Z-axis direction), at least one of the thicknesses of the conductive member 170 is large. The portion can be absorbed within the thickness of the light source cover 160.

本実施の形態では、導通部材１７０は光源カバー１６０と一体化されている。具体的には、金属製の導通部材１７０と樹脂製の光源カバー１６０とがインサート成型されている。これにより、導通部材１７０を備える光源カバー１６０を、単一の部品として扱うことができる。このことは、例えば、照明器具１００の組み立て効率の向上の観点から有利である。 In the present embodiment, the conductive member 170 is integrated with the light source cover 160. Specifically, the metal conductive member 170 and the resin light source cover 160 are insert-molded. Accordingly, the light source cover 160 including the conductive member 170 can be treated as a single component. This is advantageous, for example, from the viewpoint of improving the assembly efficiency of the lighting fixture 100.

ここで、本実施の形態に係る導通部材１７０は、図３及び図４に示すように、本体部１７１と、本体部１７１から配置面１１２の側に突出した第一接続部１７２ａ及び第二接続部１７２ｂとを有する。また、第一接続部１７２ａ及び第二接続部１７２ｂのそれぞれには、複数の突起が形成されている。これにより、図４に示すように、第一接続部１７２ａの突起が第一基板１１ａの電極１５ａに食い込み、その結果、導通部材１７０と電極１５ａとの接触面積の拡大及び接続の信頼性の向上等の効果が得られる。また、第二接続部１７２ｂも同様に突起が第二基板１１ｂの電極１６ｂに食い込み、その結果、導通部材１７０と電極１６ｂとの接触面積の拡大及び接続の信頼性の向上等の効果が得られる。 Here, as shown in FIGS. 3 and 4, the conducting member 170 according to the present embodiment includes a main body 171, a first connecting portion 172 a and a second connecting portion 172 a protruding from the main body 171 toward the placement surface 112. And a portion 172b. A plurality of protrusions are formed on each of the first connecting portion 172a and the second connecting portion 172b. As a result, as shown in FIG. 4, the protrusion of the first connecting portion 172a digs into the electrode 15a of the first substrate 11a, and as a result, the contact area between the conducting member 170 and the electrode 15a is increased and the reliability of connection is improved. And so on. Similarly, the projections of the second connection portion 172b also bite into the electrode 16b of the second substrate 11b, and as a result, the contact area between the conductive member 170 and the electrode 16b is increased, and the connection reliability is improved. ..

なお、上記構成を有する導通部材１７０は、例えば、銅、銅合金、アルミニウム、またはアルミニウム合金等の金属体を切削加工することで作製される。このことは、後述する導通部材１８０等の他の導通部材についても同じである。 The conductive member 170 having the above-described configuration is manufactured by cutting a metal body such as copper, copper alloy, aluminum, or aluminum alloy. This also applies to other conductive members such as the conductive member 180 described later.

また、導通部材１７０の形状は、図３及び図４に示す形状に限定されない。導通部材１７０は、例えば金属板を折り曲げることで形成されてもよく、この場合、導通部材１７０は、電極１５ａ及び電極１６ｂのそれぞれに面接触する部分を有してもよい。 Further, the shape of the conductive member 170 is not limited to the shape shown in FIGS. 3 and 4. The conducting member 170 may be formed by bending a metal plate, for example, and in this case, the conducting member 170 may have portions that make surface contact with each of the electrodes 15a and 16b.

また、導通部材１７０として、棒状または平板状などの単純な形状の金属体が採用されてもよい。導通部材１７０の下部の全体が光源カバー１６０から露出する場合、第一基板１１ａと第二基板１１ｂとの間に、導通部材１７０と器具本体１１０との導通を防ぐための絶縁部材が配置されてもよい。 Further, as the conducting member 170, a metal body having a simple shape such as a rod shape or a flat plate shape may be adopted. When the entire lower part of the conduction member 170 is exposed from the light source cover 160, an insulating member for preventing conduction between the conduction member 170 and the device body 110 is disposed between the first substrate 11a and the second substrate 11b. Good.

また、導通部材１７０が光源カバー１６０等の固定部材に備えられる場合、固定部材は、例えば、導通部材１７０を第一基板１１ａ及び第二基板１１ｂに向けて付勢する弾性部材を有してもよい。 When the conducting member 170 is provided on a fixing member such as the light source cover 160, the fixing member may include, for example, an elastic member that biases the conducting member 170 toward the first substrate 11a and the second substrate 11b. Good.

図５は、導通部材１７０を付勢する弾性部材１６８を有する光源カバー１６０の一部を示す断面図である。 FIG. 5 is a cross-sectional view showing a part of the light source cover 160 having the elastic member 168 that biases the conductive member 170.

例えば図５に示すように、光源カバー１６０に、導通部材１７０及び弾性部材１６８を収容する空間を形成する収容部１６１を設ける。収容部１６１には弾性部材１６８及び導通部材１７０が収容される。なお、導通部材１７０は、例えば、収容部１６１の前後方向（Ｙ軸方向）の内面に設けられた爪（図示せず）に引っ掛かることで、通常では、収容部１６１から取り外れない構造になっている。 For example, as shown in FIG. 5, the light source cover 160 is provided with an accommodating portion 161 that forms a space for accommodating the conductive member 170 and the elastic member 168. The elastic member 168 and the conducting member 170 are housed in the housing portion 161. The conducting member 170 has a structure in which it cannot be normally removed from the accommodating portion 161 by being hooked by a claw (not shown) provided on the inner surface of the accommodating portion 161 in the front-rear direction (Y-axis direction). ing.

また、弾性部材１６８は、例えば押しばねであり、この場合、弾性部材１６８は、光源カバー１６０が器具本体１１０に固定された場合に、導通部材１７０が弾性部材１６８の方向に押し上げられることで縮む。その結果、弾性部材１６８に復元力が生じ、この復元力によって導通部材１７０が第一基板１１ａ及び第二基板１１ｂに向けて付勢される。 Further, the elastic member 168 is, for example, a pressing spring, and in this case, when the light source cover 160 is fixed to the instrument body 110, the elastic member 168 contracts by the conductive member 170 being pushed up in the direction of the elastic member 168. .. As a result, a restoring force is generated in the elastic member 168, and this restoring force urges the conducting member 170 toward the first substrate 11a and the second substrate 11b.

このように、光源カバー１６０が、導通部材１７０を、第一基板１１ａ及び第二基板１１ｂに向けて付勢する弾性部材１６８を有することで、導通部材１７０の第一基板１１ａ及び第二基板１１ｂへの押圧状態の維持がより確実化される。 In this way, the light source cover 160 has the elastic member 168 that biases the conductive member 170 toward the first substrate 11a and the second substrate 11b, and thus the first substrate 11a and the second substrate 11b of the conductive member 170. It is possible to more reliably maintain the pressed state to the.

例えば、樹脂製である光源カバー１６０は、経年劣化等に起因して第一基板１１ａ及び第二基板１１ｂから離れる方向に変形する可能性もある。この場合、縮んでいた弾性部材１６８はわずかに伸びる。しかし、弾性部材１６８の長さが自然長まで戻らない限り、弾性部材１６８が、導通部材１７０を第一基板１１ａ及び第二基板１１ｂに向けて付勢する状態が維持される。つまり、導通部材１７０による、第一基板１１ａ及び第二基板１１ｂの電気的な接続の信頼性がより向上される。 For example, the light source cover 160 made of resin may be deformed in a direction away from the first substrate 11a and the second substrate 11b due to deterioration over time. In this case, the contracted elastic member 168 slightly expands. However, as long as the length of the elastic member 168 does not return to the natural length, the state in which the elastic member 168 biases the conductive member 170 toward the first substrate 11a and the second substrate 11b is maintained. That is, the reliability of electrical connection between the first substrate 11a and the second substrate 11b by the conductive member 170 is further improved.

なお、弾性部材１６８の種類に特に限定はなく、つるまきばねもしくは板ばね等の金属製のばね、または、エラストマーで形成された部材等が、弾性部材１６８として採用され得る。また、導通部材１７０の一部が、弾性部材１６８として機能してもよい。つまり、導通部材１７０と弾性部材１６８とが一体化されていてもよい。言い換えると、弾性部材１６８が導通部材１７０として機能してもよい。例えば、弾性部材１６８である１つの金属製のばねが、固定部材である光源カバー１６０に押されることで、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえてもよい。この場合、当該ばねを介して第一基板１１ａ及び第二基板１１ｂを電気的に接続することも可能である。 The type of the elastic member 168 is not particularly limited, and a metal spring such as a spiral spring or a leaf spring, a member formed of an elastomer, or the like can be adopted as the elastic member 168. Further, a part of the conductive member 170 may function as the elastic member 168. That is, the conductive member 170 and the elastic member 168 may be integrated. In other words, the elastic member 168 may function as the conducting member 170. For example, one metal spring, which is the elastic member 168, may be pressed by the light source cover 160, which is the fixing member, to press the first substrate 11a and the second substrate 11b in the thickness direction. In this case, it is also possible to electrically connect the first substrate 11a and the second substrate 11b via the spring.

ここで、第一基板１１ａ及び第二基板１１ｂを電気的に接続し、かつ、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえる導通部材は、図３及び図４に示される態様とは異なる態様で、照明器具１００に備えられてもよい。そこで、以下に、導通部材１７０に関する各種の変形例を、上記実施の形態１との差分を中心に説明する。 Here, the conductive member that electrically connects the first substrate 11a and the second substrate 11b and presses the first substrate 11a and the second substrate 11b in the thickness direction is different from the embodiment shown in FIGS. 3 and 4. The luminaire 100 may be provided in different modes. Therefore, various modifications of the conductive member 170 will be described below, focusing on the differences from the first embodiment.

（変形例１）
図６は、実施の形態１の変形例１に係る導通部材１８０の構成を示す第１の断面図であり、図７は、実施の形態１の変形例１に係る導通部材１８０の構成を示す第２の断面図である。なお、図６及び図７では、導通部材１８０およびその周辺の部材のみを図示し、その他の部材の図示は省略されている。このことは、後述する図８〜図１１にも適用される。 (Modification 1)
FIG. 6 is a first cross-sectional view showing the configuration of the conducting member 180 according to the first modification of the first embodiment, and FIG. 7 shows the configuration of the conducting member 180 according to the first modification of the first embodiment. It is a 2nd sectional view. 6 and 7, only the conducting member 180 and the members around it are shown, and the other members are omitted. This also applies to FIGS. 8 to 11 described later.

また、図６では、導通部材１８０がかしめられる前の状態が図示されており、図７では、導通部材１８０がかしめられた状態が図示されている。 Further, FIG. 6 illustrates a state before the conducting member 180 is crimped, and FIG. 7 illustrates a state in which the conducting member 180 is crimped.

本変形例に係る導通部材１８０は、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえる押さえ部１８１と、第一基板１１ａ及び第二基板１１ｂの間の位置において当該厚み方向にかしめられた状態で配置された軸部１８２とを有する。 The conductive member 180 according to the present modification is crimped in the thickness direction at a position between the pressing portion 181 that presses the first substrate 11a and the second substrate 11b in the thickness direction and the first substrate 11a and the second substrate 11b. And a shaft portion 182 arranged in a state.

本変形例に係る導通部材１８０は、押さえ部１８１と軸部１８２とを一体に備える部材である。軸部１８２の先端面と、器具本体１１０との間には例えば樹脂またはガラス繊維等を素材とする絶縁部材１８５が配置されており、これにより、導通部材１８０と器具本体１１０との間は電気的に絶縁される。また、器具本体１１０には、絶縁部材１８５を収容する凹部１１２ａが形成されている。 The conducting member 180 according to the present modification is a member that integrally includes the pressing portion 181 and the shaft portion 182. An insulating member 185 made of, for example, resin or glass fiber is disposed between the tip surface of the shaft portion 182 and the instrument body 110, whereby an electrical connection is provided between the conduction member 180 and the instrument body 110. Electrically isolated. In addition, the instrument body 110 is formed with a recess 112 a that accommodates the insulating member 185.

このような構成の導通部材１８０は、例えば、第一基板１１ａ及び第二基板１１ｂのそれぞれが、ネジ等によって器具本体１１０に固定された状態で、軸部１８２が、第一基板１１ａ及び第二基板１１ｂの間に挿入されてカシメ機によってかしめられる。その結果、図７に示すように、導通部材１８０は、押さえ部１８１が、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえる状態となる。具体的には、押さえ部１８１は、第一基板１１ａの電極１５ａ及び第二基板１１ｂの電極１６ｂに押し当てられる。 In the conductive member 180 having such a configuration, for example, the shaft portion 182 has the first substrate 11a and the second substrate 11b fixed to the instrument body 110 with screws or the like. It is inserted between the substrates 11b and caulked by a caulking machine. As a result, as shown in FIG. 7, the conductive member 180 is in a state in which the pressing portion 181 presses the first substrate 11a and the second substrate 11b in the thickness direction. Specifically, the pressing portion 181 is pressed against the electrode 15a of the first substrate 11a and the electrode 16b of the second substrate 11b.

また、軸部１８２は、かしめられて径方向に膨張することにより、第一基板１１ａ及び第二基板１１ｂに挟まれた状態となる。これにより、導通部材１８０は、第一基板１１ａ及び第二基板１１ｂの電気的な接続を維持した状態で固定される。 Further, the shaft portion 182 is crimped and expanded in the radial direction, so that the shaft portion 182 is sandwiched between the first substrate 11a and the second substrate 11b. As a result, the conductive member 180 is fixed while maintaining the electrical connection between the first substrate 11a and the second substrate 11b.

このように、本変形例に係る導通部材１８０は、第一基板１１ａ及び第二基板１１ｂに対し、カシメ機によって取り付けることができる。つまり、照明器具１００への導通部材１８０の組み込みの自動化が可能である。したがって、導通部材１８０を備える照明器具１００は、効率よく製造することができる。 In this way, the conducting member 180 according to the present modification can be attached to the first substrate 11a and the second substrate 11b by the caulking machine. That is, the assembly of the conducting member 180 into the lighting fixture 100 can be automated. Therefore, the lighting fixture 100 including the conductive member 180 can be efficiently manufactured.

また、導通部材１８０が図７に示すように固定された場合、例えば、第一基板１１ａ及び第二基板１１ｂの一方は他方の動きを規制することができる。このことは、第一基板１１ａ及び第二基板１１ｂの器具本体１１０への固定のための部材（ネジまたは爪等）の数の抑制に寄与する。 When the conductive member 180 is fixed as shown in FIG. 7, for example, one of the first substrate 11a and the second substrate 11b can regulate the movement of the other. This contributes to the suppression of the number of members (screws, claws, etc.) for fixing the first substrate 11a and the second substrate 11b to the instrument body 110.

また、導通部材１８０は、光源カバー１６０等の固定部材が存在していない位置であっても、第一基板１１ａ及び第二基板１１ｂを電気的に接続することができる。そのため、導通部材１８０が固定部材に備えられる場合と比較すると、例えば、導通部材１８０の配置位置についての自由度が高い。 Further, the conductive member 180 can electrically connect the first substrate 11a and the second substrate 11b even at a position where the fixing member such as the light source cover 160 does not exist. Therefore, as compared with the case where the conducting member 180 is provided in the fixing member, for example, the degree of freedom regarding the arrangement position of the conducting member 180 is high.

なお、押さえ部１８１の、電極１５ａ及び１６ｂに対向する部分のそれぞれに、例えば、実施の形態１に係る導通部材１７０の第一接続部１７２ａ及び第二接続部１７２ｂが有するような複数の突起（例えば図３参照）を設けてもよい。これにより、導通部材１８０と電極１５ａ及び１６ｂとの接触面積の拡大及び接続の信頼性の向上等の効果が得られる。 In addition, a plurality of protrusions (such as the first connecting portion 172a and the second connecting portion 172b of the conductive member 170 according to the first embodiment, for example, are provided on each of the portions of the holding portion 181 facing the electrodes 15a and 16b ( For example, see FIG. 3). As a result, the effect of increasing the contact area between the conductive member 180 and the electrodes 15a and 16b and improving the reliability of connection can be obtained.

（変形例２）
図８は、実施の形態１の変形例２に係る導通部材１９０の構成を示す第１の断面図であり、図９は、実施の形態１の変形例２に係る導通部材１９０の構成を示す第２の断面図である。なお、図８では、導通部材１９０が固定される前の状態が図示されており、図９では、導通部材１９０が固定された状態が図示されている。 (Modification 2)
FIG. 8 is a first cross-sectional view showing the configuration of the conducting member 190 according to the second modification of the first embodiment, and FIG. 9 shows the configuration of the conducting member 190 according to the second modification of the first embodiment. It is a 2nd sectional view. Note that FIG. 8 illustrates a state before the conducting member 190 is fixed, and FIG. 9 illustrates a state in which the conducting member 190 is fixed.

本変形例に係る器具本体１１０は、配置面１１２の、平面視における第一基板１１ａ及び第二基板１１ｂの間の位置に形成された開口部１１３と、開口部１１３に挿入された、固定穴１９６ａを有する雌部材１９６とを備える。また、導通部材１９０は、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえる押さえ部１９１と、雌部材１９６の固定穴１９６ａに挿入された状態で固定された軸部１９２とを有する。 The instrument main body 110 according to the present modification has an opening 113 formed at a position between the first substrate 11a and the second substrate 11b on the placement surface 112 in plan view, and a fixing hole inserted in the opening 113. Female member 196 having 196a. Further, the conduction member 190 has a pressing portion 191 that presses the first substrate 11a and the second substrate 11b in the thickness direction, and a shaft portion 192 that is fixed while being inserted into the fixing hole 196a of the female member 196.

本変形例に係る導通部材１９０は、押さえ部１９１と軸部１９２とを一体に備える部材である。また、雌部材１９６は、導通部材１９０と同じく銅または銅合金等の金属を素材とする部材であり、例えば樹脂またはガラス繊維等を素材とする絶縁部材１９５を介して開口部１１３に配置されている。具体的には、雌部材１９６は、絶縁部材１９５の挿入孔１９５ａに挿入された状態で、開口部１１３に配置される。 The conducting member 190 according to the present modification is a member that integrally includes the pressing portion 191 and the shaft portion 192. Further, the female member 196 is a member made of a metal such as copper or a copper alloy as the conductive member 190, and is disposed in the opening 113 via an insulating member 195 made of, for example, resin or glass fiber. There is. Specifically, the female member 196 is arranged in the opening 113 while being inserted into the insertion hole 195 a of the insulating member 195.

雌部材１９６が有する固定穴１９６ａの内径は、軸部１９２が挿入される前において、軸部１９２の最大外径以下の大きさである。つまり、導通部材１９０の軸部１９２は、例えば圧入機によって固定穴１９６ａに圧入され、これにより、導通部材１９０及び雌部材１９６が器具本体１１０に固定される。 The inner diameter of the fixing hole 196a included in the female member 196 is equal to or smaller than the maximum outer diameter of the shaft portion 192 before the shaft portion 192 is inserted. That is, the shaft portion 192 of the conducting member 190 is press-fitted into the fixing hole 196a by, for example, a press-fitting machine, and thereby the conducting member 190 and the female member 196 are fixed to the instrument body 110.

また、導通部材１９０の軸部１９２が固定穴１９６ａに圧入されることで、導通部材１９０の押さえ部１９１は、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえる状態となる。具体的には、押さえ部１９１は、第一基板１１ａの電極１５ａ及び第二基板１１ｂの電極１６ｂに押してられ、この状態で軸部１９２が固定される。これにより、導通部材１９０は、第一基板１１ａ及び第二基板１１ｂの電気的な接続を維持した状態で固定される。 In addition, the shaft portion 192 of the conductive member 190 is press-fitted into the fixing hole 196a, so that the pressing portion 191 of the conductive member 190 is in a state of pressing the first substrate 11a and the second substrate 11b in the thickness direction. Specifically, the pressing portion 191 is pressed by the electrode 15a of the first substrate 11a and the electrode 16b of the second substrate 11b, and the shaft portion 192 is fixed in this state. As a result, the conductive member 190 is fixed while maintaining the electrical connection between the first substrate 11a and the second substrate 11b.

このように、本変形例に係る導通部材１９０は、第一基板１１ａ及び第二基板１１ｂに対し、圧入機によって取り付けることができる。つまり、照明器具１００への導通部材１９０の組み込みの自動化が可能である。したがって、導通部材１９０を備える照明器具１００は、効率よく製造することができる。 In this way, the conductive member 190 according to this modification can be attached to the first substrate 11a and the second substrate 11b by a press-fitting machine. That is, it is possible to automate the incorporation of the conducting member 190 into the lighting fixture 100. Therefore, the lighting fixture 100 including the conductive member 190 can be efficiently manufactured.

また、導通部材１９０が図９に示すように固定された場合、導通部材１９０は、例えば、第一基板１１ａ及び第二基板１１ｂの両方を一括して器具本体１１０に固定する部材としても機能する。このことは、第一基板１１ａ及び第二基板１１ｂの器具本体１１０への固定のための部材（ネジまたは爪等）の数の抑制に寄与する。 In addition, when the conducting member 190 is fixed as shown in FIG. 9, the conducting member 190 also functions as a member that fixes both the first substrate 11a and the second substrate 11b to the instrument body 110 collectively. .. This contributes to the suppression of the number of members (screws, claws, etc.) for fixing the first substrate 11a and the second substrate 11b to the instrument body 110.

また、導通部材１９０は、光源カバー１６０等の固定部材が存在していない位置であっても、第一基板１１ａ及び第二基板１１ｂを電気的に接続することができる。そのため、導通部材１９０が固定部材に備えられる場合と比較すると、例えば、導通部材１９０の配置位置についての自由度が高い。 Further, the conductive member 190 can electrically connect the first substrate 11a and the second substrate 11b even at a position where the fixing member such as the light source cover 160 does not exist. Therefore, as compared with the case where the conducting member 190 is provided in the fixing member, for example, the degree of freedom regarding the arrangement position of the conducting member 190 is high.

なお、押さえ部１９１の、電極１５ａ及び１６ｂに対向する部分のそれぞれに、例えば、実施の形態１に係る導通部材１７０の第一接続部１７２ａ及び第二接続部１７２ｂが有するような複数の突起（例えば図３参照）を設けてもよい。これにより、導通部材１９０と電極１５ａ及び１６ｂとの接触面積の拡大及び接続の信頼性の向上等の効果が得られる。 A plurality of protrusions (such as the first connecting portion 172a and the second connecting portion 172b of the conductive member 170 according to the first embodiment, for example, are provided on each of the portions of the pressing portion 191 that face the electrodes 15a and 16b. For example, see FIG. 3). As a result, the effect of increasing the contact area between the conductive member 190 and the electrodes 15a and 16b and improving the reliability of connection can be obtained.

また、本変形例において、導通部材１９０の軸部１９２が圧入される固定穴１９６ａは無底の穴であるが、固定穴１９６ａは、下方が閉じられた有底の穴であってもよい。 Further, in the present modification, the fixing hole 196a into which the shaft portion 192 of the conducting member 190 is press-fitted is a bottomless hole, but the fixing hole 196a may be a bottomed hole whose lower part is closed.

ここで、固定穴１９６ａが無底の穴である場合、軸部１９２の先端部分を、器具本体１１０の裏側（電源回路９０が配置されている側）に突出させることも可能である。この場合、例えば、軸部１９２を利用して、電源回路９０からの電力を、第一基板１１ａ及び第二基板１１ｂに供給してもよい。 Here, when the fixing hole 196a is a bottomless hole, the tip portion of the shaft portion 192 can be projected to the back side of the instrument body 110 (the side where the power supply circuit 90 is arranged). In this case, for example, the shaft portion 192 may be used to supply the power from the power supply circuit 90 to the first substrate 11a and the second substrate 11b.

図１０は、実施の形態１の変形例２に係る導通部材１９０と電源回路９０とが接続された構成を示す図である。 FIG. 10 is a diagram showing a configuration in which the conducting member 190 and the power supply circuit 90 according to the second modification of the first embodiment are connected.

図１０に示す照明器具１００は、複数の発光素子２０に電力を供給するための電源回路９０を備え、導通部材１９０の軸部１９２は、電源回路９０と接続されている。 The lighting fixture 100 shown in FIG. 10 includes a power supply circuit 90 for supplying electric power to the plurality of light emitting elements 20, and the shaft portion 192 of the conducting member 190 is connected to the power supply circuit 90.

具体的には、導通部材１９０の軸部１９２は、器具本体１１０の裏側に突出した状態で固定されている。また、軸部１９２の先端部が挿し込まれる位置に、速結端子９５が配置されている。速結端子９５には、電源回路９０の高電位電極及び低電位電極の一方が接続されている。なお、この場合、第一基板１１ａ及び第二基板１１ｂの少なくとも一方には、図示しない電線により、電源回路９０の高電位電極及び低電位電極の他方が接続される。 Specifically, the shaft portion 192 of the conduction member 190 is fixed in a state of protruding to the back side of the instrument body 110. Further, the quick-connect terminal 95 is arranged at a position where the tip of the shaft 192 is inserted. One of the high potential electrode and the low potential electrode of the power supply circuit 90 is connected to the quick connection terminal 95. In this case, the other of the high potential electrode and the low potential electrode of the power supply circuit 90 is connected to at least one of the first substrate 11a and the second substrate 11b by an electric wire (not shown).

この構成によれば、導通部材１９０を介して、電源回路９０から第一基板１１ａ及び第二基板１１ｂ（発光装置１０）への電力供給が行われる。また、例えば、電源回路９０が収容される回路カバー１２０の、器具本体１１０の開口部１１３に対向する位置に、速結端子９５が固定される。この場合、例えば、導通部材１９０が取り付けられた器具本体１１０に回路カバー１２０が取り付けられることで、電源回路９０の高電位電極及び低電位電極の一方と、第一基板１１ａ及び第二基板１１ｂとの電気的な接続作業が完了する。 According to this configuration, power is supplied from the power supply circuit 90 to the first substrate 11a and the second substrate 11b (light emitting device 10) via the conduction member 190. Further, for example, the quick-connect terminal 95 is fixed to the circuit cover 120 in which the power supply circuit 90 is housed, at a position facing the opening 113 of the instrument body 110. In this case, for example, by attaching the circuit cover 120 to the instrument body 110 to which the conducting member 190 is attached, one of the high potential electrode and the low potential electrode of the power supply circuit 90, the first substrate 11a, and the second substrate 11b. The electrical connection work of is completed.

なお、照明器具１００は、例えば、導通部材１９０と速結端子９５との組を、もう一組備えてもよい。この場合、２つの導通部材１９０を介して、電源回路９０からの電力を第一基板１１ａ及び第二基板１１ｂに供給することができる。 The lighting fixture 100 may include another set of the conducting member 190 and the quick-connect terminal 95, for example. In this case, the power from the power supply circuit 90 can be supplied to the first substrate 11a and the second substrate 11b via the two conductive members 190.

つまり、２つの速結端子９５の一方に、電源回路９０の高電位電極を接続し、２つの速結端子９５の他方に、電源回路９０の低電位電極を接続する。また、図１０に示すように、第一基板１１ａの電極１５ａ及び第二基板１１ｂの電極１６ｂを接続する位置に導通部材１９０を配置する。さらに、第一基板１１ａの電極１６ａ及び第二基板１１ｂの電極１５ｂを接続する位置（例えば図２参照）にも、導通部材１９０を配置する。 That is, the high potential electrode of the power supply circuit 90 is connected to one of the two quick connection terminals 95, and the low potential electrode of the power supply circuit 90 is connected to the other of the two quick connection terminals 95. Further, as shown in FIG. 10, the conductive member 190 is arranged at a position where the electrode 15a of the first substrate 11a and the electrode 16b of the second substrate 11b are connected. Further, the conducting member 190 is also arranged at a position where the electrode 16a of the first substrate 11a and the electrode 15b of the second substrate 11b are connected (see, for example, FIG. 2).

また、２つの導通部材１９０に対向する位置に２つの速結端子９５が配置されるように、これら２つの速結端子９５を回路カバー１２０に固定する。これにより、器具本体１１０への回路カバー１２０の取付作業を行うことで、電源回路９０と、第一基板１１ａ及び第二基板１１ｂとの電気的な接続作業も完了する。つまり、電源回路９０と発光装置１０とを結線する作業を別途行う必要はない。なお、この場合、第一基板１１ａの発光素子２０群及び第二基板１１ｂの発光素子２０群は、例えば並列に接続され、電源回路９０からの供給電力によって発光する。 Further, the two quick-connect terminals 95 are fixed to the circuit cover 120 so that the two quick-connect terminals 95 are arranged at positions facing the two conducting members 190. Thus, the work of attaching the circuit cover 120 to the instrument body 110 is completed, and the work of electrically connecting the power supply circuit 90 to the first substrate 11a and the second substrate 11b is also completed. That is, it is not necessary to separately perform the work of connecting the power supply circuit 90 and the light emitting device 10. In this case, the group of light emitting elements 20 on the first substrate 11a and the group of light emitting elements 20 on the second substrate 11b are connected in parallel, for example, and emit light by the power supplied from the power supply circuit 90.

このように、図１０に示す照明器具１００は、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえ、かつ、一部が器具本体１１０を貫通して配置される導通部材１９０を備える。これにより、例えば、電源回路９０から第一基板１１ａ及び第二基板１１ｂへの電力供給のための配線（結線）作業を効率化することができる。 As described above, the lighting fixture 100 shown in FIG. 10 includes the conduction member 190 that presses the first substrate 11a and the second substrate 11b in the thickness direction and that is partially arranged to penetrate the fixture body 110. Thereby, for example, the work of wiring (wiring) for power supply from the power supply circuit 90 to the first substrate 11a and the second substrate 11b can be made efficient.

（変形例３）
図１１は、実施の形態１の変形例３に係る導通部材２００の構成を示す断面図である。 (Modification 3)
FIG. 11 is a cross-sectional view showing the configuration of the conducting member 200 according to the third modification of the first embodiment.

本変形例に係る照明器具１００が備える第一基板１１ｃ及び第二基板１１ｄは、上記実施の形態１に係る第一基板１１ａ及び第二基板１１ｂよりも薄い。具体的には、本変形例に係る第一基板１１ｃ及び第二基板１１ｄのそれぞれはフレキシブル基板である。フレキシブル基板は可撓性を有する樹脂シートにプリント配線を施したものであり、厚みが例えば数十μｍ〜１００μｍ程度の基板である。また、本変形例において、器具本体１１１は、ポリブチレンテレフタレート（ＰＢＴ）等の絶縁性樹脂により形成されている。 The first substrate 11c and the second substrate 11d included in the lighting fixture 100 according to the present modified example are thinner than the first substrate 11a and the second substrate 11b according to the first embodiment. Specifically, each of the first substrate 11c and the second substrate 11d according to this modification is a flexible substrate. The flexible substrate is a flexible resin sheet provided with printed wiring, and has a thickness of, for example, several tens of μm to 100 μm. Further, in this modification, the instrument body 111 is formed of an insulating resin such as polybutylene terephthalate (PBT).

このように比較的に薄い第一基板１１ｃ及び第二基板１１ｄに対し、導通部材２００が配置されることで、第一基板１１ｃ及び第二基板１１ｄの電気的な接続と器具本体１１１への固定とがなされている。 By disposing the conductive member 200 on the relatively thin first substrate 11c and second substrate 11d in this manner, electrical connection between the first substrate 11c and second substrate 11d and fixing to the instrument body 111 are performed. Has been done.

具体的には、本変形例に係る導通部材２００は、本体部２０１と、本体部２０１から配置面１１２の側に突出した第一接続部２０２ａ及び第二接続部２０２ｂを有する。第一接続部２０２ａは、第一基板１１ｃを貫通した状態で器具本体１１１に固定されており、第二接続部２０２ｂは、第二基板１１ｄを貫通した状態で器具本体１１１に固定されている。 Specifically, the conducting member 200 according to the present modification has a main body 201, and a first connecting portion 202a and a second connecting portion 202b that project from the main body 201 toward the placement surface 112. The first connecting portion 202a is fixed to the instrument body 111 while penetrating the first substrate 11c, and the second connecting portion 202b is fixed to the instrument body 111 while penetrating the second substrate 11d.

より詳細には、第一接続部２０２ａ及び第二接続部２０２ｂそれぞれの先端は、尖った形状を有しており、第一接続部２０２ａは、第一基板１１ｃの電極１５ａ及び基材（樹脂シート）を貫通して器具本体１１１に刺さっている。また、第二接続部２０２ｂは、第二基板１１ｄの電極１６ｂ及び基材（樹脂シート）を貫通して器具本体１１１に刺さっている。これにより、導通部材２００は、器具本体１１１に固定され、かつ、導通部材２００により第一基板１１ｃ及び第二基板１１ｄが電気的に接続される。また、本変形例では、主として本体部２０１によって、第一基板１１ｃ及び第二基板１１ｄが厚み方向に押さえられる。 More specifically, the tips of the first connecting portion 202a and the second connecting portion 202b each have a pointed shape, and the first connecting portion 202a includes the electrode 15a of the first substrate 11c and the base material (resin sheet). ) Is pierced and is stuck in the instrument main body 111. Further, the second connecting portion 202b penetrates the electrode 16b and the base material (resin sheet) of the second substrate 11d and pierces the instrument body 111. Thereby, the conducting member 200 is fixed to the instrument body 111, and the conducting member 200 electrically connects the first substrate 11c and the second substrate 11d. In addition, in this modification, the first substrate 11c and the second substrate 11d are mainly pressed by the main body portion 201 in the thickness direction.

上記構成の導通部材２００の器具本体１１１への取り付け作業は、導通部材２００を、器具本体１１１の方向に押圧する機械で行うことが可能である。つまり、照明器具１００への導通部材２００の組み込みの自動化が可能である。したがって、導通部材２００を備える照明器具１００は、効率よく製造することができる。 The work of attaching the conduction member 200 having the above-described configuration to the instrument body 111 can be performed by a machine that presses the conduction member 200 toward the instrument body 111. That is, it is possible to automate the assembly of the conducting member 200 into the lighting fixture 100. Therefore, the lighting fixture 100 including the conductive member 200 can be efficiently manufactured.

また、導通部材２００が図１１に示すように固定された場合、導通部材２００は、例えば、第一基板１１ｃ及び第二基板１１ｄの両方を一括して器具本体１１１に固定する部材としても機能する。このことは、第一基板１１ｃ及び第二基板１１ｄの器具本体１１１への固定のための部材（ネジまたは爪等）の数の抑制に寄与する。 When the conductive member 200 is fixed as shown in FIG. 11, the conductive member 200 also functions as a member that fixes both the first substrate 11c and the second substrate 11d together to the instrument body 111, for example. .. This contributes to the suppression of the number of members (screws, claws, etc.) for fixing the first substrate 11c and the second substrate 11d to the instrument body 111.

また、導通部材２００は、光源カバー１６０等の固定部材が存在していない位置であっても、第一基板１１ａ及び第二基板１１ｂを電気的に接続することができる。そのため、導通部材２００が固定部材に備えられる場合と比較すると、例えば、導通部材２００の配置位置についての自由度が高い。 Further, the conductive member 200 can electrically connect the first substrate 11a and the second substrate 11b even at a position where the fixing member such as the light source cover 160 does not exist. Therefore, as compared with the case where the conducting member 200 is provided in the fixing member, for example, the degree of freedom in the arrangement position of the conducting member 200 is high.

なお、導通部材２００と電極１５ａとの接触面積を増加させるために、例えば、第一接続部２０２ａの根元に環状の金属板を配置してもよい。同様に、導通部材２００と電極１６ｂとの接触面積を増加させるために、例えば、第二接続部２０２ｂの根元に、環状の金属板を配置してもよい。また、環状の金属板は、導通部材２００と一体化されていてもよく、別部品として、導通部材２００に嵌められてもよい。 In addition, in order to increase the contact area between the conductive member 200 and the electrode 15a, for example, an annular metal plate may be arranged at the base of the first connection portion 202a. Similarly, in order to increase the contact area between the conductive member 200 and the electrode 16b, for example, an annular metal plate may be arranged at the base of the second connection portion 202b. The annular metal plate may be integrated with the conducting member 200 or may be fitted to the conducting member 200 as a separate component.

（実施の形態２）
実施の形態２として、上記実施の形態１の変形例２に係る導通部材１９０が、発光装置の中央部に配置された照明器具１０１の構成について説明する。 (Embodiment 2)
As a second embodiment, a configuration of the lighting fixture 101 in which the conducting member 190 according to the second modification of the first embodiment is arranged in the central portion of the light emitting device will be described.

図１２は、実施の形態２に係る照明器具１０１の構成概要を示す分解図である。なお、図１２では、導通部材１９０の固定に用いられる雌部材１９６、及び、雌部材１９６と器具本体１１５とを絶縁する絶縁部材１９５の図示は省略されている。その他、回路カバー及び光源カバー等の部材の図示も省略されている。また、図１２では、発光装置３０は平面図で表されており、導通部材１９０は側面図で表されており、器具本体１１５は、開口部１１８を通る平面における断面図で表されている。 FIG. 12 is an exploded view showing a schematic configuration of the lighting fixture 101 according to the second embodiment. In FIG. 12, the female member 196 used to fix the conducting member 190 and the insulating member 195 that insulates the female member 196 from the instrument body 115 are not shown. In addition, illustration of members such as a circuit cover and a light source cover is omitted. Further, in FIG. 12, the light emitting device 30 is shown in a plan view, the conducting member 190 is shown in a side view, and the instrument body 115 is shown in a sectional view in a plane passing through the opening 118.

図１２に示すように、本実施の形態に係る照明器具１０１は、器具本体１１５と、発光装置３０と、導通部材１９０とを備える。発光装置３０は、それぞれに複数の発光素子２０が配置された第一基板１４ａ、第二基板１４ｂ、及び、第三基板１４ｃを有する。 As shown in FIG. 12, lighting fixture 101 according to the present exemplary embodiment includes fixture main body 115, light emitting device 30, and conducting member 190. The light emitting device 30 has a first substrate 14a, a second substrate 14b, and a third substrate 14c on which a plurality of light emitting elements 20 are arranged.

つまり、照明器具１０１は、複数の発光素子が配置された第三基板１４ｃであって、配置面１１６に沿って、第一基板１４ａ及び第二基板１４ｂの少なくとも一方と隣り合うように配置された第三基板１４ｃを備える。本実施の形態では、第三基板１４ｃは、第一基板１４ａ及び第二基板１４ｂのそれぞれと隣り合うように配置されている。 That is, the lighting fixture 101 is the third substrate 14c on which a plurality of light emitting elements are arranged, and is arranged along the arrangement surface 116 so as to be adjacent to at least one of the first substrate 14a and the second substrate 14b. The third substrate 14c is provided. In the present embodiment, the third substrate 14c is arranged so as to be adjacent to each of the first substrate 14a and the second substrate 14b.

また、導通部材１９０は、第一基板１４ａ、第二基板１４ｂ、及び、第三基板１４ｃを電気的に接続し、かつ、第一基板１４ａ、第二基板１４ｂ、及び、第三基板１４ｃを厚み方向に押さえる。つまり、本実施の形態に係る導通部材１９０は、第三基板１４ｃを、第一基板１４ａ及び第二基板１４ｂと電気的に接続し、かつ、第三基板１４ｃを厚み方向に押さえる。 In addition, the conductive member 190 electrically connects the first substrate 14a, the second substrate 14b, and the third substrate 14c, and the first substrate 14a, the second substrate 14b, and the third substrate 14c have a thickness. Hold in the direction. That is, the conduction member 190 according to the present embodiment electrically connects the third substrate 14c to the first substrate 14a and the second substrate 14b, and holds the third substrate 14c in the thickness direction.

なお、上記の「厚み方向」は、発光装置３０が配置面１１６に配置された場合における第一基板１４ａ、第二基板１４ｂ、及び、第三基板１４ｃの板厚の方向であり、本変形例ではＺ軸方向である。 The above “thickness direction” is the direction of the plate thickness of the first substrate 14a, the second substrate 14b, and the third substrate 14c when the light emitting device 30 is arranged on the arrangement surface 116, and this modification example Is in the Z-axis direction.

本実施の形態に係る照明器具１０１は、複数の発光素子２０に電力を供給するための電源回路９０を備え、導通部材１９０の軸部１９２は、電源回路９０と電気的に接続される。また、導通部材１９０は、第一基板１４ａ、第二基板１４ｂ、及び、第三基板１４ｃを厚み方向に押さえる押さえ部１９１を有する。押さえ部１９１は、第一基板１４ａの電極１５ａ、第二基板１４ｂの電極１５ｂ、及び、第三基板１４ｃの電極１５ｃに押し当てられる。また、導通部材１９０は、軸部１９２を有し、軸部１９２は、雌部材１９６の固定穴１９６ａに挿入された状態で固定される（図１０参照）。また、軸部１９２は、器具本体１１５を貫通し、電源回路９０と接続される。 The lighting fixture 101 according to the present embodiment includes a power supply circuit 90 for supplying electric power to the plurality of light emitting elements 20, and the shaft portion 192 of the conducting member 190 is electrically connected to the power supply circuit 90. Further, the conductive member 190 has a pressing portion 191 that presses the first substrate 14a, the second substrate 14b, and the third substrate 14c in the thickness direction. The pressing portion 191 is pressed against the electrode 15a of the first substrate 14a, the electrode 15b of the second substrate 14b, and the electrode 15c of the third substrate 14c. Further, the conducting member 190 has a shaft portion 192, and the shaft portion 192 is fixed in a state of being inserted into the fixing hole 196a of the female member 196 (see FIG. 10). The shaft portion 192 penetrates the instrument body 115 and is connected to the power supply circuit 90.

具体的には、導通部材１９０の軸部１９２の先端部は速結端子９５に挿し込まれる。速結端子９５には、電源回路９０の高電位電極及び低電位電極の一方が接続されている。この場合、第一基板１４ａ、第二基板１４ｂ、及び、第三基板１４ｃのうちの少なくとも一つには、図示しない電線により、電源回路９０の高電位電極及び低電位電極の他方が接続される。 Specifically, the tip portion of the shaft portion 192 of the conductive member 190 is inserted into the quick-connect terminal 95. One of the high potential electrode and the low potential electrode of the power supply circuit 90 is connected to the quick connection terminal 95. In this case, the other of the high potential electrode and the low potential electrode of the power supply circuit 90 is connected to at least one of the first substrate 14a, the second substrate 14b, and the third substrate 14c by an electric wire (not shown). ..

この構成によれば、図１０を用いて説明したように、電源回路９０から複数の基板（本実施の形態では第一基板１４ａ、第二基板１４ｂ、及び、第三基板１４ｃ）への電力供給のための配線（結線）作業を効率化することができる。 According to this configuration, as described with reference to FIG. 10, the power supply from the power supply circuit 90 to the plurality of substrates (the first substrate 14a, the second substrate 14b, and the third substrate 14c in the present embodiment). Wiring (connection) work for can be made efficient.

また、本実施の形態では、扇形の３つの基板（１４ａ、１４ｂ、１４ｃ）により、平面視において、全体として円形の発光装置３０が形成されており、その円形の中央領域５０に、導通部材１９０の押さえ部１９１が配置される。つまり、導通部材１９０は、第一基板１４ａ、第二基板１４ｂ及び第三基板１４ｃを一括して器具本体１１５に固定する部材としても機能する。また、導通部材１９０は、発光装置３０の中央領域５０を器具本体１１５の配置面１１６に向けて押すため、第一基板１４ａ、第二基板１４ｂ及び第三基板１４ｃがバランスよく押さえられる。 Further, in the present embodiment, the circular fan-shaped substrate (14a, 14b, 14c) forms the light emitting device 30 having a circular shape as a whole in a plan view, and the conductive member 190 is provided in the circular central region 50. The pressing portion 191 of the is arranged. That is, the conductive member 190 also functions as a member that fixes the first substrate 14a, the second substrate 14b, and the third substrate 14c together to the instrument body 115. Further, since the conductive member 190 pushes the central region 50 of the light emitting device 30 toward the placement surface 116 of the instrument body 115, the first substrate 14a, the second substrate 14b, and the third substrate 14c are held in good balance.

なお、照明器具１０１は、中央領域５０以外の位置に、第一基板１４ａ、第二基板１４ｂ及び第三基板１４ｃのうちの２枚の基板を電気的に接続する導通部材１９０を備えてもよい。 It should be noted that the lighting fixture 101 may include a conducting member 190 at a position other than the central region 50 to electrically connect two substrates of the first substrate 14a, the second substrate 14b, and the third substrate 14c. ..

例えば、第一基板１４ａ及び第二基板１４ｂの間に、導通部材１９０の軸部１９２が挿入されるように導通部材１９０を配置することで、第一基板１４ａ及び第二基板１４ｂを電気的に接続し、かつ、厚み方向に押さえてもよい。この場合、例えば、第一基板１４ａ及び第二基板１４ｂの間の軸部１９２を介して電源回路９０から発光装置３０への電力供給が行われてもよい。 For example, by disposing the conducting member 190 so that the shaft portion 192 of the conducting member 190 is inserted between the first substrate 14a and the second substrate 14b, the first substrate 14a and the second substrate 14b are electrically connected. It may be connected and pressed in the thickness direction. In this case, for example, power may be supplied from the power supply circuit 90 to the light emitting device 30 via the shaft portion 192 between the first substrate 14a and the second substrate 14b.

また、導通部材１９０によって電気的に接続される基板の枚数は３枚には限定されず、２枚であってもよく、また、４枚以上であってもよい。 Further, the number of substrates electrically connected by the conductive member 190 is not limited to three, and may be two, or four or more.

図１３は、導通部材１９０を中心として４枚の基板が配置されることで構成された発光装置３１を示す平面図である。図１４は、導通部材１９０を中心として２枚の基板が配置されることで構成された発光装置３２を示す平面図である。 FIG. 13 is a plan view showing a light emitting device 31 configured by arranging four substrates around the conductive member 190. FIG. 14 is a plan view showing the light emitting device 32 configured by disposing two substrates around the conductive member 190.

図１３に示す発光装置３１は、それぞれに複数の発光素子２０が配置された、第一基板１７ａ、第二基板１７ｂ、第三基板１７ｃ、及び第四基板１７ｄを有する。これら４枚の基板（１７ａ、１７ｂ、１７ｃ、１７ｄ）のそれぞれは、略正方形であり、行列状に並べられることで全体として正方形の発光装置３１が構成される。 The light emitting device 31 shown in FIG. 13 includes a first substrate 17a, a second substrate 17b, a third substrate 17c, and a fourth substrate 17d, each of which is provided with a plurality of light emitting elements 20. Each of these four substrates (17a, 17b, 17c, 17d) has a substantially square shape, and by arranging them in a matrix, a square light emitting device 31 is configured as a whole.

また、発光装置３１の中央領域５１には、４枚の基板（１７ａ、１７ｂ、１７ｃ、１７ｄ）の電極１５ａ、１５ｂ、１５ｃ、及び１５ｄが配置され、かつ、導通部材１９０の押さえ部１９１（図１２参照）が押し当てられる。これにより、例えば、４枚の基板（１７ａ、１７ｂ、１７ｃ、１７ｄ）のそれぞれに、導通部材１９０を介して電力を供給することができる。 Further, in the central region 51 of the light emitting device 31, the electrodes 15a, 15b, 15c, and 15d of the four substrates (17a, 17b, 17c, 17d) are arranged, and the pressing portion 191 of the conductive member 190 (see FIG. 12) is pressed. Thereby, for example, electric power can be supplied to each of the four substrates (17a, 17b, 17c, 17d) via the conduction member 190.

なお、発光装置３１に対してさらに１以上の導通部材１９０を配置してもよい。例えば、第一基板１７ａと第二基板１７ｂとの間、及び、第三基板１７ｃと第四基板１７ｄとの間のそれぞれに、導通部材１９０を配置してもよい。これにより、Ｙ軸方向に並ぶ合計３つの導通部材１９０によって、発光装置３１を器具本体１１５（図１２参照）に固定することができる。また、この場合、４枚の基板（１７ａ、１７ｂ、１７ｃ、１７ｄ）それぞれが有する発光素子２０群（つまり、４つの発光素子２０群）を並列に接続して、これら発光素子２０群に、合計３つの導通部材１９０を介して電源回路９０からの電力を供給することが可能である。 Note that one or more conducting members 190 may be further arranged with respect to the light emitting device 31. For example, the conductive member 190 may be arranged between the first substrate 17a and the second substrate 17b and between the third substrate 17c and the fourth substrate 17d. Accordingly, the light emitting device 31 can be fixed to the instrument body 115 (see FIG. 12) by the total of three conducting members 190 arranged in the Y-axis direction. Further, in this case, the light emitting element 20 groups (that is, four light emitting element 20 groups) included in each of the four substrates (17a, 17b, 17c, 17d) are connected in parallel, and the total of these light emitting element 20 groups is provided. It is possible to supply electric power from the power supply circuit 90 via the three conducting members 190.

また、中央領域５１に配置される導通部材１９０には電源回路９０を接続せずに、Ｙ軸方向の両端の導通部材１９０の一方に電源回路９０の低電位電極を接続し、当該両端の導通部材１９０の他方に電源回路９０の高電位電極を接続してもよい。これにより、並列に接続された２枚の基板（１７ａ、１７ｂ）の発光素子２０群と、並列に接続された２枚の基板（１７ｃ、１７ｄ）の発光素子２０群とを直列に接続して、電源回路９０からの電力を供給することができる。 In addition, the power supply circuit 90 is not connected to the conductive member 190 arranged in the central region 51, but the low potential electrode of the power supply circuit 90 is connected to one of the conductive members 190 at both ends in the Y-axis direction so as to connect the both ends. The high potential electrode of the power supply circuit 90 may be connected to the other of the members 190. As a result, the group of 20 light emitting elements of two substrates (17a, 17b) connected in parallel and the group of 20 light emitting elements of two substrates (17c, 17d) connected in parallel are connected in series. The power from the power supply circuit 90 can be supplied.

図１４に示す発光装置３２は、それぞれに複数の発光素子２０が配置された、第一基板１８ａ及び第二基板１８ｂを有する。これら２枚の基板（１８ａ、１８ｂ）のそれぞれは、平面視における形状が長方形であり、かつ長手方向に並べられることで、平面視においてＸ軸方向に長尺状の発光装置３２が構成される。このような構成の発光装置３２は、例えば、直管形ＬＥＤランプの光源として採用される。 The light emitting device 32 shown in FIG. 14 has a first substrate 18a and a second substrate 18b on which a plurality of light emitting elements 20 are arranged. Each of these two substrates (18a, 18b) has a rectangular shape in a plan view and is arranged in the longitudinal direction, so that the light emitting device 32 elongated in the X-axis direction in a plan view is configured. . The light emitting device 32 having such a configuration is employed, for example, as a light source of a straight tube LED lamp.

また、発光装置３２の中央領域５２には、２枚の基板（１８ａ、１８ｂ）の電極１５ａ及び１５ｂが配置され、かつ、導通部材１９０の押さえ部１９１（図１２参照）が押し当てられる。これにより、２枚の基板（１８ａ、１８ｂ）のそれぞれに、導通部材１９０を介して電力を供給することができる。 Further, the electrodes 15a and 15b of the two substrates (18a, 18b) are arranged in the central region 52 of the light emitting device 32, and the pressing portion 191 (see FIG. 12) of the conductive member 190 is pressed. Thereby, electric power can be supplied to each of the two substrates (18a, 18b) via the conductive member 190.

なお、発光装置３２に対してさらに１以上の導通部材１９０を配置してもよい。例えば、第一基板１８ａの右端、及び、第二基板１８ｂの左端のそれぞれに導通部材１９０を配置してもよい。これにより、Ｘ軸方向に並ぶ合計３つの導通部材１９０によって、発光装置３２を長尺状の器具本体（図示せず）に固定することができる。また、この場合、２枚の基板（１８ａ、１８ｂ）それぞれが有する発光素子２０群（つまり、２つの発光素子２０群）を並列に接続して、これら発光素子２０群に、合計３つの導通部材１９０を介して電源回路９０からの電力を供給することが可能である。 Note that one or more conducting members 190 may be further arranged with respect to the light emitting device 32. For example, the conductive member 190 may be arranged at each of the right end of the first substrate 18a and the left end of the second substrate 18b. Accordingly, the light emitting device 32 can be fixed to the elongated instrument body (not shown) by the total of three conducting members 190 arranged in the X-axis direction. Further, in this case, the light emitting element 20 groups (that is, the two light emitting element 20 groups) included in each of the two substrates (18a, 18b) are connected in parallel, and a total of three conductive members are connected to these light emitting element 20 groups. It is possible to supply power from the power supply circuit 90 via 190.

また、中央領域５２に配置される導通部材１９０には電源回路９０を接続せずに、Ｘ軸方向の両端の導通部材１９０の一方に電源回路９０の低電位電極を接続し、当該両端の導通部材１９０の他方に電源回路９０の高電位電極を接続してもよい。これにより、第一基板１８ａの発光素子２０群と、第二基板１８ｂの発光素子２０群とを直列に接続して、電源回路９０からの電力を供給することができる。 In addition, the power supply circuit 90 is not connected to the conductive member 190 arranged in the central region 52, but the low potential electrode of the power supply circuit 90 is connected to one of the conductive members 190 at both ends in the X-axis direction to connect the conductive members at both ends. The high potential electrode of the power supply circuit 90 may be connected to the other of the members 190. Thereby, the light emitting element 20 group of the first substrate 18a and the light emitting element group 20 of the second substrate 18b can be connected in series and the power from the power supply circuit 90 can be supplied.

（他の実施の形態）
以上、本発明について実施の形態１及び２に基づいて説明したが、本発明は、上記実施の形態１及び２に限定されるものではない。例えば、上記実施の形態１または２に各種の変形を施してもよい。 (Other embodiments)
Although the present invention has been described above based on the first and second embodiments, the present invention is not limited to the first and second embodiments. For example, various modifications may be made to the first or second embodiment.

例えば、実施の形態１において、導通部材１７０は、固定部材である光源カバー１６０に押さえられることで、第一基板１１ａ及び第二基板１１ｂを厚み方向に押さえるとした。しかし、導通部材１７０を押さえる固定部材は、光源カバー以外であってもよい。例えば、電源回路９０が、第一基板１１ａ及び第二基板１１ｂの上方（主面１２ａ、１２ｂの側）に配置される場合、電源回路９０または電源回路９０を覆うカバーによって、導通部材１７０が押さえられてもよい。 For example, in the first embodiment, the conduction member 170 is pressed by the light source cover 160, which is a fixing member, to press the first substrate 11a and the second substrate 11b in the thickness direction. However, the fixing member that presses the conductive member 170 may be other than the light source cover. For example, when the power supply circuit 90 is arranged above the first substrate 11a and the second substrate 11b (on the side of the main surfaces 12a and 12b), the conduction member 170 is pressed by the power supply circuit 90 or a cover covering the power supply circuit 90. You may be asked.

その他、例えば、第一基板１１ａ及び第二基板１１ｂ端部のみを器具本体１１０に向けて押さえることで第一基板１１ａ及び第二基板１１ｂを器具本体１１０に固定する樹脂部材に、導通部材１７０が押さえられてもよい。 In addition, for example, the conductive member 170 is attached to the resin member that fixes the first substrate 11a and the second substrate 11b to the instrument body 110 by pressing only the ends of the first substrate 11a and the second substrate 11b toward the instrument body 110. You may be suppressed.

つまり、第一基板１１ａ及び第二基板１１ｂを器具本体１１０の方向に押さえ得る位置及び形状を有する部材を、導通部材１７０を押さえる部材として利用することで、導通部材１７０のための専用部品を作製する必要がない。 That is, by using a member having a position and a shape that can press the first substrate 11a and the second substrate 11b in the direction of the instrument body 110 as a member that presses the conductive member 170, a dedicated component for the conductive member 170 is manufactured. You don't have to.

また、光源カバー１６０等の固定部材に押さえられる導通部材１７０が、器具本体１１０を貫通する軸部を有してもよい。この場合、例えば図１０に示すように、速結端子９５を用いて導通部材１７０と電源回路９０とを電気的に接続することができる。これにより、例えば、電源回路９０から第一基板１１ａ及び第二基板１１ｂへの電力供給のための配線（結線）作業を効率化することができる。 Further, the conduction member 170 that is pressed by the fixing member such as the light source cover 160 may have a shaft portion that penetrates the instrument body 110. In this case, for example, as shown in FIG. 10, the quick connecting terminal 95 can be used to electrically connect the conducting member 170 and the power supply circuit 90. Thereby, for example, the work of wiring (wiring) for power supply from the power supply circuit 90 to the first substrate 11a and the second substrate 11b can be made efficient.

また、器具本体１１０は、アルミニウム板又は鋼板等の板金を用いて作製された部材であるとしたが、器具本体１１０は、ＰＢＴ等の絶縁性樹脂の成型品であってもよい。器具本体１１０の素材は、器具本体１１０耐熱性、強度、または製造コスト等に応じて、適宜決定されてもよい。 Further, the instrument main body 110 is a member manufactured by using a metal plate such as an aluminum plate or a steel plate, but the instrument main body 110 may be a molded product of an insulating resin such as PBT. The material of the instrument body 110 may be appropriately determined according to the heat resistance, strength, manufacturing cost, or the like of the instrument body 110.

また、例えば、固定部材に押さえられる導通部材１７０と、固定部材を必要としない導通部材１８０、１９０、または２００とを併用してもよい。例えば、隣り合う２基板の電気的接続のために導通部材１７０を用い、当該２基板への電力供給のために導通部材１９０を用いてもよい。 Further, for example, the conducting member 170 pressed by the fixing member and the conducting member 180, 190, or 200 that does not require the fixing member may be used together. For example, the conducting member 170 may be used to electrically connect two adjacent substrates, and the conducting member 190 may be used to supply power to the two substrates.

また、上記実施の形態及び変形例では、発光素子２０としてＬＥＤチップがパッケージ化されたＬＥＤ素子が例示された。しかしながら、発光素子２０は、ＬＥＤチップそのものであってもよい。つまり、発光装置３０等の発光装置は、基板にＬＥＤチップが直接実装されたＣＯＢ（Ｃｈｉｐ Ｏｎ Ｂｏａｒｄ）構造の発光装置であってもよい。 Further, in the above-described embodiment and modified examples, the LED element in which the LED chip is packaged as the light emitting element 20 is illustrated. However, the light emitting element 20 may be the LED chip itself. That is, the light emitting device such as the light emitting device 30 may be a light emitting device having a COB (Chip On Board) structure in which the LED chip is directly mounted on the substrate.

また、半導体レーザ等の半導体発光素子、または、有機ＥＬ（Ｅｌｅｃｔｒｏ Ｌｕｍｉｎｅｓｃｅｎｃｅ）もしくは無機ＥＬ等のＥＬ素子等の他の種類の固体発光素子が、発光素子２０として採用されてもよい。 Further, a semiconductor light emitting element such as a semiconductor laser, or another type of solid state light emitting element such as an EL element such as an organic EL (Electro Luminescence) or an inorganic EL may be adopted as the light emitting element 20.

その他、上記実施の形態に対して当業者が思い付く各種変形を施して得られる形態、及び、本発明の趣旨を逸脱しない範囲で各実施の形態における構成要素及び機能を任意に組み合わせることで実現される形態も本発明に含まれる。 In addition, it is realized by making various modifications to the above-described embodiment by those skilled in the art, and by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention. The present invention also includes such a form.

１１ａ、１１ｃ、１４ａ、１７ａ、１８ａ 第一基板
１１ｂ、１１ｄ、１４ｂ、１７ｂ、１８ｂ 第二基板
１４ｃ、１７ｃ 第三基板
２０ 発光素子
９０ 電源回路
１００、１０１ 照明器具
１１０、１１１、１１５ 器具本体
１１２、１１６ 配置面
１１３、１１８ 開口部
１６０ 光源カバー（固定部材）
１６８ 弾性部材
１７０、１８０、１９０、２００ 導通部材
１７１、２０１ 本体部
１７２ａ、２０２ａ 第一接続部
１７２ｂ、２０２ｂ 第二接続部
１８１、１９１ 押さえ部
１８２、１９２ 軸部
１９６ 雌部材
１９６ａ 固定穴 11a, 11c, 14a, 17a, 18a First substrate 11b, 11d, 14b, 17b, 18b Second substrate 14c, 17c Third substrate 20 Light emitting element 90 Power supply circuit 100, 101 Lighting fixture 110, 111, 115 Instrument main body 112, 116 Arrangement surface 113, 118 Opening 160 Light source cover (fixing member)
168 Elastic member 170, 180, 190, 200 Conducting member 171, 201 Body part 172a, 202a First connecting part 172b, 202b Second connecting part 181, 191 Pressing part 182, 192 Shaft part 196 Female member 196a Fixing hole

Claims (7)

器具本体と、
それぞれに複数の発光素子が配置された第一基板及び第二基板であって、前記器具本体の配置面に沿って並んで配置された第一基板及び第二基板と、
前記第一基板及び前記第二基板を電気的に接続し、かつ、前記第一基板及び前記第二基板を厚み方向に押さえる導通部材と、
前記器具本体に固定された固定部材とを備え、
前記導通部材は、前記固定部材によって押さえられることで、前記第一基板及び前記第二基板を厚み方向に押さえ、
前記固定部材は、前記複数の発光素子を覆うように配置された、透光性を有する光源カバーであり、
前記導通部材の一部は、前記光源カバーに埋設されている
照明器具。 The instrument body,
A first substrate and a second substrate on which a plurality of light emitting elements are arranged, respectively, a first substrate and a second substrate arranged side by side along the arrangement surface of the instrument body,
A conductive member that electrically connects the first substrate and the second substrate, and that presses the first substrate and the second substrate in the thickness direction ,
A fixing member fixed to the instrument body,
The conductive member is pressed by the fixing member to press the first substrate and the second substrate in the thickness direction,
The fixing member is a light source cover having a light-transmitting property, which is arranged so as to cover the plurality of light emitting elements,
Part of the conductive member is embedded in the light source cover.
lighting equipment. 前記固定部材は、前記導通部材を、前記第一基板及び前記第二基板に向けて付勢する弾性部材を有する
請求項１記載の照明器具。 The fixing member, the conductive member, an illumination device according to claim 1, further comprising a resilient member biasing toward the first substrate and the second substrate. 前記導通部材は、
前記第一基板及び前記第二基板を前記厚み方向に押さえる押さえ部と、
前記第一基板及び前記第二基板の間の位置において前記厚み方向にかしめられた状態で配置された軸部とを有する
請求項１記載の照明器具。 The conducting member is
A pressing portion that presses the first substrate and the second substrate in the thickness direction,
The lighting device according to claim 1, further comprising: a shaft portion that is crimped in the thickness direction at a position between the first substrate and the second substrate. 前記器具本体は、
前記配置面の、平面視における前記第一基板及び前記第二基板の間の位置に形成された開口部と、
前記開口部に挿入された、有底または無底の固定穴を有する雌部材とを有し、
前記導通部材は、
前記第一基板及び前記第二基板を前記厚み方向に押さえる押さえ部と、
前記雌部材の前記固定穴に挿入された状態で固定された軸部とを有する
請求項１記載の照明器具。 The device body is
An opening formed on the arrangement surface at a position between the first substrate and the second substrate in a plan view,
A female member having a bottomed or bottomless fixing hole inserted into the opening,
The conducting member is
A pressing portion that presses the first substrate and the second substrate in the thickness direction,
The lighting device according to claim 1, further comprising a shaft portion fixed in a state of being inserted into the fixing hole of the female member. さらに、前記複数の発光素子に電力を供給するための電源回路を備え、
前記軸部は、前記電源回路と電気的に接続されている
請求項４記載の照明器具。 Furthermore, a power supply circuit for supplying electric power to the plurality of light emitting elements is provided,
The lighting device according to claim 4 , wherein the shaft portion is electrically connected to the power supply circuit. 器具本体と、
それぞれに複数の発光素子が配置された第一基板及び第二基板であって、前記器具本体の配置面に沿って並んで配置された第一基板及び第二基板と、
前記第一基板及び前記第二基板を電気的に接続し、かつ、前記第一基板及び前記第二基板を厚み方向に押さえる導通部材とを備え、
前記導通部材は、本体部と、前記本体部から前記配置面の側に突出した第一接続部及び第二接続部とを有し、
前記第一接続部は、前記第一基板を貫通した状態で前記器具本体に固定されており、
前記第二接続部は、前記第二基板を貫通した状態で前記器具本体に固定されている
照明器具。 The instrument body,
A first substrate and a second substrate on each of which a plurality of light emitting elements are arranged, the first substrate and the second substrate arranged side by side along the arrangement surface of the instrument body,
Electrically connecting the first substrate and the second substrate, and comprising a conductive member for pressing the first substrate and the second substrate in the thickness direction,
The conducting member has a main body portion, a first connecting portion and a second connecting portion protruding from the main body portion to the arrangement surface side,
The first connecting portion is fixed to the instrument body in a state of penetrating the first substrate,
The second connecting portion is fixed to the instrument body while penetrating the second substrate.
lighting equipment. さらに、複数の発光素子が配置された第三基板であって、前記配置面に沿って、前記第一基板及び前記第二基板の少なくとも一方と隣り合うように配置された第三基板を備え、
前記導通部材はさらに、前記第三基板を、前記第一基板及び前記第二基板と電気的に接続し、かつ、前記第三基板を、前記厚み方向に押さえる
請求項１〜６のいずれか１項に記載の照明器具。 Furthermore, a third substrate on which a plurality of light emitting elements are arranged, along the arrangement surface, a third substrate arranged to be adjacent to at least one of the first substrate and the second substrate,
Said conductive member further said third substrate, said connecting first substrate and the said second substrate and electrically, and the third substrate, claim 1-6 suppressed to the thickness direction 1 The luminaire according to the item.
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