JP2007311639A - Optical semiconductor mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve vibration-resistant electric connection and mechanical connection with a simple configuration without soldering a surface mount light-emitting diode. <P>SOLUTION: Conductive wiring patterns 131, 132 are formed at opposed positions for sandwiching a holding hole 12 of an insulating board 11. The LED 14 has a lead frame 15 of which one end is connected to an anode, and a lead frame 16 of which one end is connected to a cathode. The lead frames 15, 16 project from the LED 14 in an inverse direction and extend to a back 18. A portion that opposes the back 18 forms U-shaped elastic connection pieces 19, 20. The back 18 mounts one end of a mounting shaft 21, and the other end forms an engagement 22 having a tapered shape. The engagement 22 is inserted into the holding hole 12, and the holding hole 12 continues to be inserted along the tapered shape at the tip of the engagement 22, thus engaging the engagement 22 to the holding hole 12. Simply by forcing the engagement 22 of the LED 14 into the holding hole 12 without any bonding means, the LED 14 can be connected electrically and mounted mechanically. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical semiconductor mounting apparatus that electrically connects and mechanically mounts an optical semiconductor electronic component such as a light emitting diode without soldering.

A conventional socket for mounting an LED as a light emitting element without using an adhesive means such as soldering is provided with a connection terminal connected to the lead terminal of the LED, and the connection terminal is connected to an external conductive path. A connecting portion that can be connected by elastic press-fitting is provided. When the LED is mounted on the socket, the lead terminal is unitized with a connection terminal provided on the socket. By electrically press-fitting the connection portion of the connection terminal in the unit into an external conductive path, electrical and mechanical connection to the conductive path of the LED is performed. (For example, Patent Document 1)
JP 2005-209812 A

  When the LED lead terminal is connected to the connection terminal provided in the socket, the technique of the above-described Patent Document 1 needs to provide a connection terminal for connecting to the LED lead terminal in the socket and the socket. . For this reason, there existed problems, such as the increase in components, such as the necessity of the connection terminal component for connecting with the lead terminal of LED other than a socket, and the space accompanying this.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an optical semiconductor mounting device that realizes an electrical connection and a mechanical connection resistant to vibration with a simple configuration without using a bonding means such as soldering a surface-mount type light emitting diode. There is to do.

  In order to solve the above-described problems, an optical semiconductor mounting device according to the present invention includes an insulating substrate, a holding hole formed in the substrate, and a wiring pattern formed so as to face the holding hole. A surface-mount LED, first and second lead frames each having one end connected to the anode and cathode of the LED, and the first and second leads to positions opposite to the light-emitting surface of the LED. A first connecting piece formed by extending the first lead frame and the second lead frame facing the opposite surface, and a surface portion opposite to the light emitting surface of the LED And an attachment shaft having an engagement portion formed at the tip thereof, and by engaging the engagement portion with the holding hole, the first and second connection pieces are connected to the wiring pattern. Characterized by the connection That.

  According to the present invention, a surface-mounted light emitting diode can be electrically connected to a vibration with a simple configuration without using an adhesive means such as soldering, and can be mechanically attached.

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.
1 to FIG. 3 are exploded perspective views, FIG. 2 is a side view of the main part of FIG. 1, and FIG. 3 is assembled FIG. It is a sectional side view of a state.

  In FIG. 1, reference numeral 11 denotes an insulating substrate. A holding hole 12 is formed in the substrate 11, and conductive wiring patterns 131 and 132 are fixed to positions facing each other with the holding hole 12 interposed therebetween.

  Reference numeral 14 denotes a mounting method in which a frame is directly soldered to the surface of a substrate, that is, a so-called surface mount type LED (light emitting diode). The LED 14 has a wide conductive lead frame 15 having one end connected to the internal anode and a wide conductive lead frame 16 having one end connected to the cathode.

  As shown in FIG. 2, the lead frame 15 protrudes vertically from the main body of the LED 14, extends in the opposite direction from the display portion 17 of the LED 14, and further extends to the back surface portion 18 of the LED 14. Further, a connecting piece 19 which is elastic by forming in a U shape is formed in a portion facing the back surface portion 18.

  As shown in FIG. 2, the lead frame 16 protrudes vertically from the main body of the LED 14, extends in the opposite direction from the display portion 17 of the LED 14, and further extends to the back surface portion 18 of the LED 14. Further, a connecting piece 20 which is formed in a U shape and has elasticity is formed in a portion facing the back surface portion 18.

  One end of a mounting shaft 21 made of, for example, synthetic resin is attached to the back surface portion 18 of the LED 14, and an engaging portion 22 having a tapered tip is formed at the other end. As shown in FIG. 3, in the engaging portion 22, the relationship between the diameter a of the holding hole 12 formed in the substrate 11 and the maximum diameter b of the engaging portion 22 is a <b. The engaging portion 22 can be deformed to within the diameter a of the holding hole 12 by applying pressure.

  Here, a method for electrically and mechanically attaching the LED 14 to the substrate 11 will be described. First, the engaging portion 22 of the LED 14 is inserted into the holding hole 12 of the substrate 11 in the direction of the arrow in FIG. When the engaging portion 22 continues to be inserted into the holding hole 12 along the tapered shape at the tip, the diameter a of the holding hole 12 and the maximum diameter b of the engaging portion 22 are a <b, so that it corresponds to the portion of the maximum diameter b. . When further inserted, the maximum diameter b of the engaging portion 22 passes through the holding hole 12, and the maximum diameter b of the engaging portion 22 can be engaged with the holding hole 12 after passing.

  At this time, the connection pieces 19 and 20 are pressed against the wiring patterns 131 and 132 based on the elasticity of the connection pieces 19 and 20 themselves, and the wiring patterns 131 and 132 and the LEDs 14 are electrically connected. Since the connection pieces 19 and 20 have elasticity, problems such as contact failure due to vibration can be eliminated after connection.

  In this embodiment, the LED 14 can be attached by a simple operation of simply press-fitting the engaging portion 22 into the holding hole 12 without using an adhesive means such as soldering.

FIG. 4 is a cross-sectional view corresponding to the main part of FIG. 2 for describing a modification of the embodiment of the present invention, and the same components are denoted by the same reference numerals.
In this modification, a cut portion 41 is formed from the engaging portion 22 to the mounting shaft 21. Since the notch part 41 can approach the engaging part 22 with the notch part 41 as a boundary in the direction of the arrow in the figure, the maximum diameter b of the engaging part 22 is easily made smaller than the diameter a of the holding hole 12. Therefore, it is possible to improve the mounting workability of the LED 14.

FIGS. 5 and 6 are diagrams for explaining an example in which the above-described optical semiconductor mounting device of the present invention is electrically and mechanically mounted using, for example, a surface mount type LED for a tail lamp of an automobile. FIG. 5 is an exploded perspective view showing a state before the LED is attached, and FIG. 6 is a cross-sectional view of the assembled state of FIG.
In this example, four LEDs 14 are electrically and mechanically attached to wiring patterns 131 and 132 of a common flexible insulating substrate 11. In addition to the holding holes 12 for attaching the wiring patterns 131 and 132 and the LEDs 14 to the substrate 11, the power is supplied to the connector 53 and the wiring pattern 132 for supplying power to the wiring pattern 131 via the leads 52. A connector 55 is attached for supply. Reference numeral 56 denotes an attachment hole for attaching the substrate 11, and a plurality of attachment holes 56 are formed.

  Reference numeral 57 denotes a base made of an insulating synthetic resin. In the base 57, four stepped portions are formed, and a support hole 58 is formed at a position located in the holding hole 12 of the substrate 11. Further, a dowel 59 is integrally formed on the base 57 at a position located in the mounting hole 56 of the substrate 11.

  Next, attachment of the LED 14 will be described. First, the mounting hole 56 of the substrate 11 is inserted into the dowel 59 of the base 57. Next, the substrate 11 is supported on the base 57 by thermally welding the dowels 59. The engagement portion 22 of the LED 14 is passed through the holding hole 12 and the support hole 58 to engage the engagement portion 22 with the support hole 58. Accordingly, the LED 14 is mechanically supported on the base 57 and can be electrically connected to the connectors 53 and 55.

  The base 57 is attached to a protective cover 61 made of a synthetic resin such as translucent acrylic as shown in FIG.

  Thus, since the LED 14 is electrically and mechanically attached without using an adhesive means such as soldering, the replacement of the LED 14 is facilitated. Further, since the connection pieces 19 and 20 having elasticity are connected in a state where the wiring patterns 131 and 132 are always in pressure contact with each other, it is possible to prevent the occurrence of contact failure even when the connection pieces 19 and 20 are attached to a thing with a lot of vibration such as an automobile. There is an effect.

  Note that the attachment hole 56 and the dowel 59 are not necessarily required depending on the size of the substrate 11 because the engaging portion 22 and the holding hole 12 combine these functions.

The perspective view for demonstrating one Embodiment of this invention. Sectional drawing of the principal part of FIG. Sectional drawing of the state in which LED was attached in FIG. The side view of the principal part for demonstrating the modification of this invention. The disassembled perspective view for demonstrating the state before attachment of LED. Sectional drawing of the state which assembled FIG.

Explanation of symbols

11 Substrate 12 Holding holes 131, 132 Wiring pattern 14 LED
15 and 16 Lead frame 19 and 20 Connection piece 21 Mounting shaft 22 Engaging portion 41 Notch portion 56 Mounting hole 57 Base 58 Support hole 59 Dowel

Claims (1)

An insulating substrate;
Holding holes formed in the substrate;
A wiring pattern formed oppositely across the holding hole;
A surface-mounted LED,
First and second lead frames each having one end connected to the anode and cathode of the LED;
The first and second lead frames are extended to a position facing the surface opposite to the light emitting surface of the LED, and the first and second lead frames facing the opposite surface are made elastic. First and second connection pieces;
A mounting shaft provided on the surface opposite to the light emitting surface of the LED and having an engaging portion formed at the tip;
An optical semiconductor mounting apparatus, wherein the first and second connection pieces are connected to the wiring pattern by engaging the engaging portion with the holding hole.

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